CN219843830U

CN219843830U - Microwave photon device packaging structure

Info

Publication number: CN219843830U
Application number: CN202321027338.7U
Authority: CN
Inventors: 肖楠; 刘浪; 刘均
Original assignee: Chongqing Niyang Technology Co ltd
Current assignee: Chongqing Niyang Technology Co ltd
Priority date: 2023-04-28
Filing date: 2023-04-28
Publication date: 2023-10-17
Anticipated expiration: 2033-04-28

Abstract

The utility model relates to the technical field of packaging, in particular to a microwave photon device packaging structure, which comprises: a housing and a mounting base; a radio frequency head is connected to one side of the shell; the bottom surface of the shell is provided with a first inverted convex groove; the bottom of the first groove is provided with a first limiting piece; a mount, comprising: a mounting plate and a mounting post; one end of the mounting column is connected with the mounting plate, a second limiting piece is arranged on the end face of the other end, a reverse convex second groove is arranged on the peripheral side face of the mounting column, and a first spring is arranged in the second groove; one end of the first spring is fixedly connected with the bottom of the second groove, and the other end of the first spring is connected with a clamping block; under the action of no external force, the first spring supporting clamping block pays out the second groove; the mounting column is inserted into the first groove, the clamping block is clamped with the first groove, the first limiting piece and the second limiting piece are connected for limiting, and the shell is mounted above the mounting plate; the mounting plate disburses and is provided with the installation through-hole on the casing part. This scheme can promote the flexibility of installation, is applicable to more installation demands.

Description

Microwave photon device packaging structure

Technical Field

The utility model relates to the technical field of packaging, in particular to a microwave photonic device packaging structure.

Background

The microwave photon technology is developed vigorously, so that microwave signal light transmission becomes a main signal transmission technology in radar and electronic warfare system links, and the method has the characteristics of large bandwidth utilization rate, long transmission distance, electronic interference resistance and the like.

The existing microwave photon device packaging structure is characterized in that the supporting lugs are arranged on the shell of the existing microwave photon device packaging structure, the installation through holes are formed in the supporting lugs, the microwave photon device packaging structure is fixedly installed at the preset position, the supporting lugs and the shell are fixed, even in an integrated mode, the radio frequency head is arranged on one side of the shell, accordingly, if the microwave photon device is required to be fixedly installed through the installation through holes, the orientation of the radio frequency head is determined, the installation flexibility is low, the installation requirements of the radio frequency heads with different orientations cannot be met, the installation requirements of the radio frequency heads with the orientations are required to be met, corresponding setting is required to be carried out when the shell is produced, the production line is changed, and the cost is high.

Disclosure of Invention

The utility model aims to provide a microwave photon device packaging structure which can improve the flexibility of installation, is suitable for more installation requirements and reduces the cost.

The utility model provides the following basic scheme: a microwave photonic device package structure, comprising: a housing and a mounting base;

the inside of the shell is used for accommodating the ceramic substrate and the power supply substrate; a radio frequency head is connected to one side surface of the shell, and a tail fiber is connected to the opposite side surface of the side surface;

the bottom surface of the shell is provided with a first inverted convex groove; the bottom of the first groove is provided with a first limiting piece;

the mount pad includes: a mounting plate and a mounting post; one end of the mounting column is connected with the mounting plate, a second limiting piece is arranged on the end face of the other end, a reverse convex second groove is arranged on the peripheral side face of the mounting column, and a first spring is arranged in the second groove; one end of the first spring is fixedly connected with the bottom of the second groove, and the other end of the first spring is connected with a clamping block; under the action of no external force, the first spring supporting clamping block pays out the second groove;

the mounting column is inserted into the first groove, the clamping block is clamped with the first groove, the first limiting piece and the second limiting piece are connected for limiting, and the shell is mounted above the mounting plate;

the mounting plate disbursement housing portion is provided with a mounting through hole.

The basic scheme has the beneficial effects that: according to the scheme, the mounting plate is fixedly mounted at a preset position through the mounting through hole, then the first groove at the bottom of the shell is aligned to the mounting column to be inserted according to the direction requirement of the radio frequency head, in the inserting process, the clamping block is extruded by the inner wall of the first groove, the first spring is extruded, the clamping block is pushed into the second groove, after the clamping block is thoroughly inserted, the clamping block is pushed out of the second groove by the first spring to be clamped with the first groove, the mounting column cannot draw out the first groove, the first limiting piece is connected with the second limiting piece to limit, the shell is prevented from moving, and the shell is mounted above the mounting plate; or according to the requirements of the relative positions of the radio frequency head and the mounting through hole, firstly, inserting a first groove at the bottom of the shell in alignment with the mounting column, clamping a clamping block with the first groove, connecting a first limiting piece with a second limiting piece for limiting, thereby mounting the shell above the mounting plate, and then fixedly mounting the mounting plate at a preset position through the mounting through hole;

the mounting mode can flexibly set the relative positions between the radio frequency head and the mounting through hole, so that the microwave photonic device packaging structure with different relative position requirements does not need to be specially produced.

Further, the top surface of the clamping block is a cambered surface.

The beneficial effects are that: the mounting column is convenient to insert, and the clamping block is pushed into the second groove by the inner wall of the first groove.

Further, if the first limiting piece is a grain protrusion, the second limiting piece is a grain groove matched with the grain protrusion;

if the first limiting piece is a grain groove, the second limiting piece is a grain protrusion matched with the grain groove.

The beneficial effects are that: the line is protruding and line recess cooperation, plays spacing effect, prevents relative movement between casing and the mount pad, increases installation stability.

Further, the line bulges are straight-line bulges with a plurality of intersected midpoints and uniformly spaced vertexes;

the line grooves are straight line grooves with a plurality of middle points intersected and the top points evenly spaced.

The beneficial effects are that: the line is protruding for a plurality of midpoints are crossing, and the straight line of summit even interval is protruding, corresponds the line recess and is a plurality of midpoints are crossing, and the straight line recess of summit even interval to the line is protruding inserts the line recess, and carries out the matching of multi-angle, satisfies different relative position demands.

Further, a plurality of horizontal through holes are formed in the clamping block of the mounting column, which is correspondingly inserted into the side surface of the first groove;

a pressing rod is arranged in the horizontal through hole; the pressing rod is sleeved with a second spring; the two ends of the horizontal through hole are provided with first limiting ring pieces, the side face of the first limiting ring piece close to the first groove is contacted with one end of a second spring, the other end of the second spring is contacted with the side face of the second limiting ring piece arranged on the outer peripheral surface of the pressing rod, and the other side face of the second limiting ring piece is contacted with the side face of the first limiting ring piece far away from the first groove; the pressing rod passes through the first limiting ring piece;

under no external force, one end of the pressing rod, which is close to the first groove, is positioned in the horizontal through hole, and the other end of the pressing rod is positioned outside the horizontal through hole.

The beneficial effects are that: through the structure, the clamping block is pushed into the second groove by pressing the pressing rod, so that the mounting column is pulled out, and the mounting seat and the shell are detached.

Further, the top surface of the shell is a transparent top surface, and a temperature display card and a humidity display card are arranged in the shell and are respectively used for measuring the temperature and the humidity in the shell.

The beneficial effects are that: the top surface of the shell is a transparent top surface, and a temperature display card and a humidity display card for measuring the temperature and the humidity in the shell are arranged in the shell, so that a user can observe whether the shell is wetted or overhigh in temperature from the outside, and the shell is prevented from being damaged by processing, and the fault reason can be determined during maintenance conveniently.

Drawings

FIG. 1 is a schematic diagram of a microwave photonic device package according to an embodiment of the present utility model;

FIG. 2 is a schematic top plan view of an exploded view of a microwave photonic device package according to an embodiment of the present utility model;

FIG. 3 is an exploded view of a first embodiment of a microwave photonic device package structure according to the present utility model;

FIG. 4 is a cross-sectional view of a lower cover plate and mounting base in a second embodiment of a microwave photonic device package structure in accordance with the present utility model;

fig. 5 is a schematic structural diagram of a microwave photonic device package structure according to a third embodiment of the present utility model.

Detailed Description

The following is a further detailed description of the embodiments:

reference numerals in the drawings of the specification include: the device comprises a shell 1, a mounting seat 2, a ceramic substrate 3, a power supply substrate 4, a radio frequency head 5, a tail fiber 6, a partition 101, an upper cavity 102, a lower cavity 103, a communication hole 104, an upper cover plate 105, a lower cover plate 106, a radio frequency interface 107, a radio frequency insulator 108, a radio frequency head positioning hole 109, an optical fiber interface 1010, a power supply lead 1011, a first groove 1012, a first limiting member 1013, a mounting plate 201, a mounting column 202, a second limiting member 203, a second groove 204, a first spring 205, a clamping block 206, a mounting through hole 207, a horizontal through hole 1014, a pressing rod 1015, a second spring 1016, a first limiting ring 1017, a second limiting ring 1018, a temperature display card 7 and a humidity display card 8.

Example 1

This embodiment is substantially as shown in fig. 1, 2 and 3: a microwave photonic device package structure, comprising: a housing 1 and a mounting base 2;

the inside of the shell 1 is used for accommodating a ceramic substrate 3 and a power supply substrate 4; a side face of the shell 1 is connected with a radio frequency head 5, and the opposite side face of the side face is connected with a tail fiber 6;

specifically, the casing 1 includes four sides and a partition board 101 vertically connected to the middle of the four sides, the partition board 101 divides the casing 1 into an upper cavity 102 for accommodating the ceramic substrate 3 and a lower cavity 103 for accommodating the power supply substrate 4, and a communication hole 104 is further provided on the partition board 101; the upper cover plate 105 is connected with the upper end of the shell 1 to seal the upper cavity 102, the lower cover plate 106 is connected with the lower end of the shell 1 to seal the lower cavity 103, the connection is fixed, the ceramic substrate 3 is bonded with the partition plate 101 through conductive adhesive to realize reliable fixation, the flatness of the partition plate 101 is better than 50 μm, and the depth of the upper cavity 102 of the shell is mainly determined by the height of components on the ceramic substrate 3. The power supply substrate 4 is arranged in the lower cavity 103 of the shell, the communication holes 104 on the partition board 101 correspond to the hole sites on the power supply substrate 4, and the power supply substrate 4 is fixed by conductive adhesive. The depth of the lower cavity 103 is determined according to the element height of the power supply substrate 4;

one side surface of the shell 1 is connected with a radio frequency head 5, and the side surface opposite to the side surface is connected with a tail fiber 6; the side surface of the shell 1 connected with the radio frequency head 5 is provided with a radio frequency interface 107 and a radio frequency insulator 108, and both sides of the radio frequency interface 107 are provided with radio frequency head positioning holes 109; the radio frequency head 5 is connected with the radio frequency head positioning hole 109 through a screw and is fixed on the side surface; the radio frequency insulator 108 Jin Xihuan is welded on the side surface of the shell 1; the side face of the tail fiber 6 is provided with an optical fiber interface 1010, the tail fiber 6 penetrates out of the optical fiber interface 1010 and is welded on the shell 1 by solder;

the optical fiber interface 1010 is in the same linear direction as the radio frequency interface 107; a power lead 1011 is also arranged on the other side surface of the shell 1, and the power lead 1011 is soldered on the shell 1 at high temperature; wherein the shell 1, the upper cover plate 105 (i.e. the top surface) and the lower cover plate 106 (i.e. the bottom surface) are formed by adopting kovar material to machine, the outer surface is plated with gold, and the upper cover plate 105 and the lower cover plate 106 are welded on the shell 1 in parallel in a seam mode. The shell 1 is made of high mechanical strength material kovar material, the surface of the shell is plated with gold, so that parallel seam welding and welding flux welding are facilitated, and the air tightness of the shell is ensured; structurally, key components such as a photoelectric hybrid integrated substrate, a driving plate and the like are completely and physically isolated through an integrated upper cavity and lower cavity structural design; through the design of the inner wall perforation, the electric connection is realized, the problems of functional partition, compact and reliable installation, size control and the like are effectively solved, the shell has the characteristic of smart integration, and the requirements of various application environments on adaptability and high reliability can be met.

The bottom surface of the shell 1 is provided with a first inverted convex groove 1012; the bottom of the first groove 1012 is provided with a first limiting member 1013;

mount 2, including: a mounting plate 201 and a mounting post 202; one end of the mounting column 202 is connected with the mounting plate 201, in this embodiment, the mounting column 202 and the mounting plate 201 are integrally formed, a second limiting piece 203 is arranged on the end surface of the other end of the mounting column 202, an inverted convex second groove 204 is arranged on the peripheral side surface of the second limiting piece, and a first spring 205 is arranged in the second groove 204; one end of the first spring 205 is fixedly connected with the bottom of the second groove 204 by welding in the embodiment, the other end of the first spring is connected with a clamping block 206, the clamping block 206 is a plastic clamping block 206, the first spring is connected with the spring by gluing or through a fixing screw, the first spring is glued, and the top surface of the clamping block 206 is an arc surface; under the action of no external force, the first spring 205 supports the clamping block 206 to pay out of the second groove 204, and the length of the part of the clamping block 206 which pays out of the second groove 204 is longer than the distance between the mounting column 202 inserted into the first groove 1012 and the first groove 1012, so that the clamping block can be clamped into the large groove part of the first groove 1012; four second grooves 204 are provided in this embodiment;

the mounting column 202 is inserted into the first groove 1012, the clamping block 206 is clamped with the first groove 1012, the first limiting piece 1013 and the second limiting piece 203 are connected for limiting, and the shell 1 is mounted above the mounting plate 201;

specifically, if the first limiting member 1013 is a textured protrusion, the second limiting member 203 is a textured groove matching the textured protrusion;

if the first limiting member 1013 is a textured groove, the second limiting member 203 is a textured protrusion matching with the textured groove; in this embodiment, the first limiting member 1013 is a textured protrusion, the second limiting member 203 is a textured groove, both the textured protrusion and the textured groove can be cross, m-shaped, etc., and a plurality of straight protrusions or straight grooves with intersecting midpoints and uniformly spaced vertices; the line protrusion of this embodiment is a cross protrusion, and the line recess is a cross recess.

The mounting plate 201 is provided with a mounting through hole 207 in a portion of the outgoing housing 1.

The specific implementation process is as follows: firstly, the mounting plate 201 is fixedly mounted at a preset position through the mounting through hole 207, then the first groove 1012 at the bottom of the shell 1 is aligned with the mounting post 202 to be inserted according to the direction requirement of the radio frequency head 5, in the inserting process, the clamping block 206 is extruded by the inner wall of the first groove 1012, the first spring 205 is extruded, the clamping block 206 is pushed into the second groove 204, after the clamping block 206 is thoroughly inserted, the clamping block 206 is pushed out of the second groove 204 by the first spring 205 to be clamped with the first groove 1012, the mounting post 202 cannot be pulled out of the first groove 1012, the first limiting piece 1013 is clamped into the second limiting piece 203 to be limited, the shell 1 is prevented from moving, and therefore the shell 1 is mounted above the mounting plate 201; or according to the requirement of the relative positions of the radio frequency head 5 and the mounting through hole 207, firstly, the first groove 1012 at the bottom of the shell 1 is aligned with the mounting column 202 and is inserted, the clamping block 206 is clamped with the first groove 1012, the first limiting piece 1013 is clamped into the second limiting piece 203 to limit, so that the shell 1 is mounted above the mounting plate 201, and then the mounting plate 201 is fixedly mounted at a preset position through the mounting through hole 207;

the above installation mode can flexibly set the relative positions between the radio frequency head 5 and the installation through hole 207, so that the microwave photonic device packaging structure with different relative position requirements does not need to be specially produced.

Example two

This embodiment is substantially the same as the above embodiment except that: as shown in fig. 4, the clamping block 206 of the mounting post 202 inserted correspondingly at the side of the first groove 1012 is provided with a plurality of horizontal through holes 1014; specifically, the number of horizontal through holes 1014 corresponds to the number of the clamping blocks 206;

a pressing rod 1015 is disposed in the horizontal through hole 1014; a second spring 1016 is sleeved on the pressing rod 1015; the two ends of the horizontal through hole 1014 are provided with first limiting ring pieces 1017, the side surface of the first limiting ring piece 1017 close to the first groove 1012 is contacted with one end of a second spring 1016, the other end of the second spring 1016 is contacted with the side surface of a second limiting ring piece 1018 arranged on the outer peripheral surface of the pressing rod 1015, and the other side surface of the second limiting ring piece 1018 is contacted with the side surface of the first limiting ring piece 1017 far from the first groove 1012; the pressing lever 1015 passes through the first stop collar 1017;

under the action of no external force, one end of the pressing rod 1015, which is close to the first groove 1012, is positioned in the horizontal through hole 1014, the other end of the pressing rod 1015 is positioned outside the horizontal through hole 1014, and the pressing rod 1015 pushes the clamping block 206 into the second groove 204, so that the mounting column 202 is pulled out, and the mounting seat 2 and the shell 1 are detached.

Example III

This embodiment is substantially the same as embodiment one, except that: as shown in fig. 5, the top surface of the casing 1 is a transparent top surface, in this embodiment, an acrylic upper cover plate 105 is adopted, the upper cover plate 105 is glued to the casing 1, a temperature display card 7 and a humidity display card 8 are disposed in the casing 1, and are respectively used for measuring the temperature and the humidity in the casing 1, for example: HC-30-40-50 and COBALT FREE HALOGENFREE, thereby facilitating the user's observation from the outside of whether the inside of the casing 1 is wet or at an excessively high temperature, and handling to prevent damage, and also facilitating the determination of the cause of failure at the time of maintenance.

The foregoing is merely an embodiment of the present utility model, and a specific structure and characteristics of common knowledge in the art, which are well known in the scheme, are not described herein, so that a person of ordinary skill in the art knows all the prior art in the application date or before the priority date, can know all the prior art in the field, and has the capability of applying the conventional experimental means before the date, and a person of ordinary skill in the art can complete and implement the present embodiment in combination with his own capability in the light of the present utility model, and some typical known structures or known methods should not be an obstacle for a person of ordinary skill in the art to implement the present utility model. It should be noted that modifications and improvements can be made by those skilled in the art without departing from the structure of the present utility model, and these should also be considered as the scope of the present utility model, which does not affect the effect of the implementation of the present utility model and the utility of the patent. The protection scope of the present utility model is subject to the content of the claims, and the description of the specific embodiments and the like in the specification can be used for explaining the content of the claims.

Claims

1. A microwave photonic device package structure, comprising: a housing and a mounting base;

2. The microwave photonic device packaging structure of claim 1, wherein the top surface of the fixture block is a cambered surface.

3. The microwave photonic device package structure of claim 1, wherein if the first limiting member is a textured protrusion, the second limiting member is a textured groove mated with the textured protrusion;

4. The microwave photonic device package structure of claim 3, wherein the textured bumps are linear bumps having a plurality of points intersecting at equal intervals;

5. The microwave photonic device packaging structure according to claim 1, wherein a plurality of horizontal through holes are formed in the side surface of the first groove corresponding to the clamping block of the inserted mounting column;

6. The microwave photonic device packaging structure according to claim 1, wherein the top surface of the housing is a transparent top surface, and a temperature display card and a humidity display card are arranged in the housing and are respectively used for measuring the temperature and the humidity in the housing.