JP5246534B2 - Optical module - Google Patents

Description

  The present invention relates to an optical module.

  In the field of optical communication using light as an information transmission medium, an optical module including an optical element that mutually converts an optical signal and an electrical signal is used to receive or transmit an optical signal transmitted through an optical fiber or the like. ing. A surface emitting element typified by a vertical cavity surface-emitting laser (VCSEL) is used for the conversion from an electrical signal to an optical signal, and a PIN is used for the conversion from an optical signal to an electrical signal. A surface light receiving element typified by a photodiode is used. These optical elements are electrically connected to the substrate, and optical fibers and the like are optically connected to the optical elements.

  Such an optical module has an optical transmission body such as an optical fiber from the viewpoint of workability when optical wiring such as an optical fiber is performed on a wiring board (printed wiring board or board), and ease of maintenance and replacement. It is desirable to be detachable via a connector.

  In addition, when an optical fiber or the like is attached to or detached from the optical element, a structure for attaching or detaching the optical fiber or the like around the component on which the optical element is mounted should be provided if it is configured to be attached to and detached from the wiring board in the horizontal direction. Since it cannot be obtained, there is a problem that other parts cannot be mounted in the space, and the mounting density cannot be increased. Therefore, it is desirable that attachment / detachment of an optical fiber or the like can be performed in a direction perpendicular to the wiring board.

  Conventionally, in order to meet such demands, an optical element is mounted so that its light emitting / receiving surface is horizontal with respect to the wiring board, and a reflection mirror is provided on the end face of an optical fiber or the like to vertically align the optical axis. There has been proposed an optical module that optically connects an optical fiber or the like and an optical element so as to be detachable in a vertical direction by using a connector converted into (see Patent Document 1).

  However, the optical element is mounted on the wiring board as a whole component such as a board or a package on which a driver integrated circuit device is mounted, for example, and such components are electrically connected to pads on the wiring board. As a general method, there is a connection by reflow of a solder ball such as BGA (Ball Grid Array). However, with such a solder connection method, light is transmitted on a wiring board on which many other components are mounted. When a part on which an element is mounted needs to be repaired and replaced, it is difficult to replace the part or the replacement work becomes complicated.

  Thus, from the viewpoints of workability for maintenance and replacement and securing of mounting density on the wiring board, not only optical connection but also electrical connection can be attached to and detached from the wiring board vertically, and a structure that can be easily attached and detached is desired. It was. Furthermore, further miniaturization of the optical module itself is desired from the viewpoint of improving the mounting density, and it is also desired to produce a product that satisfies these requirements at a low cost.

In order to solve such problems, the present inventors have disclosed an optical transmission body that forms a continuous optical transmission path in which the optical axis on the outside side and the optical axis on the optical element side are perpendicular to each other, and the optical transmission body An electronic component mounting in which an upper structure including a holding member that holds the optical element and an electronic component including an optical element are mounted on the upper surface and a pad that is electrically connected to an electrode of the electronic component through a through hole is provided on the lower surface By pressing and fixing the substrate and the anisotropic conductive sheet with a mounting body such as a clamp spring installed on the wiring substrate, the optical transmission path of the upper structure is made to the optical element of the electronic component mounting substrate. An optical module having a structure in which the pads on the lower surface of the electronic component mounting substrate and the pads on the upper surface of the wiring substrate are electrically connected via an anisotropic conductive sheet while being optically connected is proposed (see Patent Document 2). ).
JP 2006-65358 A Japanese Patent Application No. 2007-217574

  According to the above optical module, it is possible to greatly reduce the size, and it is possible to attach and detach both the optical connection and the electrical connection perpendicularly to the wiring board surface. There was room for further improvement.

  The present invention has been made in view of the circumstances as described above, and is greatly reduced in size, and both optical connection and electrical connection can be attached to and detached from the wiring board surface vertically, and is stable. It is an object of the present invention to provide an optical module that can be electrically connected.

  The present invention is characterized by the following in order to solve the above problems.

1stly, the optical module of this invention optically connects the optical transmission path which transmits an optical signal, and the optical element which converts an optical signal into an electrical signal, or converts an electrical signal into an optical signal. Because
An upper structure including an optical transmission body and a holding member for holding the optical transmission body;
A wiring board provided with pads on the upper surface, an anisotropic conductive sheet,
An electronic component mounting substrate on which an electronic component including an optical element is mounted on the upper surface and a pad electrically connected to an electrode of the electronic component is provided on the lower surface;
The upper structure, the electronic component mounting board, and the anisotropic conductive sheet are pressed and fixed on the wiring board in the vertical direction to optically transmit the optical transmission path of the upper structure to the optical element of the electronic component mounting board. Are connected to each other and electrically connected to the pads on the lower surface of the electronic component mounting board and the pads on the upper surface of the wiring board via an anisotropic conductive sheet, and are fixed on the wiring board made of a fitting member. Equipped with a body,
The mounting body made of a fitting member has an opening at a fixed end on the wiring board , presses the upper structure fitted in the opening downward, and further mounts an electronic component fitted below the upper structure. It is a form that presses the substrate and then presses the anisotropic conductive sheet fitted below it to ensure vertical conduction.
The anisotropic conductive sheet is characterized in that protrusions are provided on both sides of the anisotropic conductive sheet so as to contact the pads on the lower surface of the electronic component mounting substrate and the pads on the upper surface of the wiring substrate.
Second, in the first optical module, the mounting body made of the fitting member has a pair of protrusions on the upper edge thereof, and the upper surface of the holding member of the upper structure to be fitted and mounted. In this case, a pair of shoulder portions which form a tapered surface are brought into contact with peripheral edge portions on both sides parallel to the optical transmission line.

Thirdly, in the second optical module, the mounting body made of the fitting member described above includes a quadrilateral opening at the fixed end on the wiring board that can surround and accommodate the electronic component mounting board and the upper structure, and an opening. A pair of side plates that are vertically bent from the left and right sides of two sides parallel to the optical transmission body of the portion and extend upward, and project over the entire length of each upper edge of each of the two sides. It is equipped with a ridge of
The protrusions are applied to the pair of shoulder portions that form a tapered surface over the entire length of the peripheral edge portions on both sides parallel to the optical transmission body on the upper surface of the holding member of the upper structure to be fitted and mounted. It is characterized by touching.
Fourthly, in the first to third optical modules, the anisotropic conductive sheet includes a sheet-like insulating base material having elasticity and a conductive material embedded in the insulating base material. The protrusion is formed of a conductive material partially exposed from the surface of the insulating base material.

Fifth , in the fourth optical module, the conductive material is a conductive wire having both ends exposed from the surface of the insulating base material.

Sixth , in the fourth optical module, the conductive material is conductive particles that are arranged in the thickness direction of the insulating base material to form a conductive path by pressurization, and is provided at both ends in the thickness direction of the insulating base material. The arranged conductive particles are partially exposed from the surface of the insulating substrate.

  According to the first to fourth inventions, both the optical connection and the electrical connection can be attached / detached perpendicularly to the wiring board surface, and can be disconnected both optically and electrically at the time of maintenance / replacement and the like. Since it is possible, maintenance and replacement are easy, and it is not necessary to provide a work space for attachment / detachment around the electronic component mounting board, and the mounting density on the wiring board can be increased. In addition, while the components are mounted at a high density, it is possible to improve the selectivity and expandability of the place where the user places the optical module on the wiring board. And by setting it as said structure, an optical module can be significantly reduced as a whole and an optical module can be manufactured at low cost.

  Furthermore, since both sides of the anisotropic conductive sheet are provided with protrusions that make contact with the pads on the lower surface of the electronic component mounting board and the pads on the upper surface of the wiring board, these pads are sufficient for the anisotropic conductive sheet. It is possible to prevent contact failure due to warpage of the substrate. That is, since the height variation in the substrate surface direction can be sufficiently absorbed, more stable electrical connection can be achieved during the operation of the optical module.

  In this specification, the “optical transmission body” includes an optical fiber made of glass or resin, an optical waveguide made of resin, or the like. In the following embodiment, an example using an optical fiber will be described. However, the optical transmission body applied in the present invention is not limited to this, and various types of optical transmission lines such as an optical waveguide can be configured. Things can be applied.

  In the present specification, the “optical element” includes not only one having a single light receiving / emitting surface but also one having a plurality of light receiving / emitting surfaces arranged in an array or the like. Specific examples of the optical element include a surface light emitting element such as a VCSEL and a surface light receiving element such as a PIN photodiode. The surface light emitting elements and / or the light receiving and emitting surfaces of the surface light receiving elements are arranged in an array. It may be integral.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 and 2 are perspective views showing an optical module according to an embodiment of the present invention. FIG. 1 shows a state in which the optical connection and the electrical connection are disconnected, and FIG. 2 shows a state in which the optical connection and the electrical connection are made. Yes.

  As shown in FIG. 1, the optical module 1 of this embodiment includes an upper structure 5 in which an optical fiber 7 is held by a holding member 6, an electronic component mounting board 30 on which an optical element 40 is mounted, and anisotropic conductivity. A sheet 60, a wiring board 70 (printed wiring board or board), and a fitting member 50 fixed on the wiring board 70 are provided.

  In this optical module 1, an anisotropic conductive sheet 60 is disposed in an opening 51 in a fitting member 50 on a wiring substrate 70, an electronic component mounting substrate 30 is disposed thereon, and an upper structure is formed thereon. 2 is fitted vertically as shown in FIG. 2, and the optical fiber 7 of the upper structure 5 and the optical element 40 of the electronic component mounting substrate 30 are optically connected, and the electronic component mounting substrate 30 and the wiring are connected. The substrate 70 is electrically connected via the anisotropic conductive sheet 60. The mounted optical module 1 shown in FIG. 2 constitutes a compact module having a width of 10 mm × 10 mm and a thickness of 6.4 mm, for example.

  As shown in FIGS. 3A and 3B, the upper structure 5 includes a plurality of (in this embodiment, 12) optical fibers 7 arranged in parallel from the back surface of the resin holding member 6. The tape fiber 8 enters the holding member 6 horizontally, the optical fiber 7 is bent in an arc shape in the holding member 6, and the end face 7 a of the optical fiber 7 is vertically exposed from the lower surface of the holding member 6. Yes.

  As shown in FIG. 1, a pair of shoulder portions 12 that form a tapered surface along the peripheral edge portion are provided on both peripheral edge portions parallel to the optical fiber 7 on the upper surface of the holding member 6. When the fitting member 50 is fitted and attached, the pair of protrusions 52 provided on the upper part of the fitting member 50 abuts against the shoulder 12 of the holding member 6 and presses downward.

  Further, as shown in FIG. 1, the holding member 6 is provided with two positioning holes 11, which are erected on the electronic component mounting substrate 30 when fitted into the fitting member 50 of FIG. The positioning pins 42 thus inserted are inserted into the positioning holes 11 of the holding member 6 so that the upper structure 5 and the electronic component mounting board 30 are positioned in the horizontal direction.

  The holding member 6 includes an upper member 10 and a lower member 20 as shown in FIGS. 3A and 3B, and the optical fiber 7 is sandwiched between the upper member 10 and the lower member 20. It comes to hold. On the lower surface side of the upper member 10, guide grooves having a V-shaped cross section, for example, are provided in parallel on a curved surface corresponding to the arc shape of the optical fiber 7, and the optical fiber 7 is 1 in each of these guide grooves. Each book is arranged and guided. On the other hand, an optical fiber holding surface having a curved surface corresponding to the arc shape of the optical fiber 7 is provided on the upper surface side of the lower member 20, and by sandwiching the optical fiber 7 between the upper member 10 and the lower member 20, The optical fiber 7 is held in a state bent in an arc shape between the guide groove of the upper member 10 and the optical fiber holding surface of the lower member 20.

  The radius of curvature R of the arc portion between the outer optical axis 65a and the optical element side optical axis 65b of the optical fiber 7 is preferably 5 mm or less, more preferably 1 to 3 mm. Thus, the radius of curvature of the arc portion is very small, the vertical direction of the upper structure 5 is reduced, and the horizontal direction is also reduced in size. As the optical fiber 7, for example, a glass fiber having a diameter of 80 μm can be used.

  FIG. 4 is a top perspective view of the electronic component mounting board, and FIG. 5 is a cross-sectional view showing a state where the upper structure and the electronic component mounting board are optically connected. As shown in FIG. 4, the electronic component mounting substrate 30 includes a box-shaped ceramic substrate 31 in which a wall portion 32 is erected along the outer peripheral portion, and a light is placed at a front position on the ceramic substrate 31. An optical element 40 in which the same number of light receiving and emitting surfaces as the fiber 7 are arranged is mounted.

  The electronic component mounting board 30 mounts electronic components such as the optical element 40 and the driver integrated circuit device 41 in a cavity surrounded by the wall portion 32.

  The optical element 40 includes a VCSEL as a surface light emitting element and a PIN photodiode as a surface light receiving element. The upper surface 32a of the wall portion 32 constitutes an optical reference surface, and comes into contact with the lower surface of the upper structure 5 so that the end surface 7a of the optical fiber 7 and the optical element 40 are vertically aligned as shown in FIG. Positioned.

  As shown in FIG. 4, a pair of positioning pins 42 having a protruding height of 2 mm and a protruding portion diameter of 0.7 mm are erected at positions on both sides of the optical element 40 on the ceramic substrate 31. By inserting the positioning pins 42 into the positioning holes 11 of the upper structure 5, the electronic component mounting substrate 30 and the upper structure 5 are positioned in the horizontal direction.

  A driver integrated circuit device 41 of the optical element 40 is mounted behind the optical element 40 on the ceramic substrate 31, and the optical element 40 and the driver integrated circuit device 41 are connected by a bonding wire. In addition, other electronic components are mounted on the ceramic substrate 31, and the electrodes of the electronic components on the ceramic substrate 31 penetrate the ceramic substrate 31 directly below the electronic components or via the printed wiring 33 or the like. 7 is electrically connected to the pad 34 of FIG. 7 provided on the lower surface of the ceramic substrate 31. For example, the pads 34 have a diameter of 300 to 350 μm and are arranged on the lower surface of the ceramic substrate 31 with a pitch of about 500 μm.

  FIG. 6 is a perspective view of the anisotropic conductive sheet, and FIGS. 7 and 8 are cross-sectional views showing states before and after electrical connection between the electronic component mounting board, the anisotropic conductive sheet, and the wiring board. FIG. 8 shows a state after electrical connection before electrical connection. As shown in the figure, the electronic component mounting board 30 is electrically connected to the wiring board 70 via an anisotropic conductive sheet 60.

  An anisotropic conductive sheet 60 shown in FIG. 6 is one in which conduction in the vertical direction is ensured by pressurization. In this embodiment, a sheet-like insulating base 63 having elasticity such as silicone rubber is attached to a rod-like shape. Or what embed | buried the fibrous conductive wire 61 is used.

  As shown in FIGS. 6 and 7, protrusions 60 a are formed on both surfaces of the anisotropic conductive sheet 60 by the conductive wire 61 partially exposed from the surface of the insulating base 63. The protrusion height h in the thickness direction of the protrusion 60a is preferably 5 μm or more, more preferably 5 to 80 μm, and still more preferably 20 to 50 μm. If the protruding height h is too small, a connection failure may occur between the pad 34 on the lower surface of the electronic component mounting board 30 and the pad 71 on the upper surface of the wiring board 70. If the protruding height h is too large, the protruding portion 60a is bent. In some cases, connection failure may occur. Moreover, the thickness of the anisotropic conductive sheet 60 is 0.1-1 mm, for example.

  When assembling the optical module 1 having the above configuration from the state in which the optical connection and the electrical connection are disconnected as shown in FIG. 1 to the state in which the optical connection and the electrical connection are made as shown in FIG. An anisotropic conductive sheet 60 is disposed in the opening 51 of the fitting member 50 fixed on the wiring board 70. Next, the electronic component mounting board 30 is disposed thereon, and the upper structure 5 is vertically fitted into the fitting member 50 from above.

  At this time, the positioning pins 42 of the electronic component mounting board 30 are inserted into the positioning holes 11 of the upper structure 5, and the upper structure 5 is horizontally aligned with respect to the electronic component mounting board 30 with a predetermined accuracy, for example, 3 to 5 μm. In addition, the side surface of the holding member 6 is regulated by the side plate portion 53 of the fitting member 50, and the electronic component mounting substrate 30 is indirectly positioned in the horizontal direction with respect to the wiring substrate 70. As a result, as shown in FIG. 8, the pads 34 on the lower surface of the electronic component mounting board 30 are aligned with the pads 71 on the upper surface of the wiring board.

  Then, the upper structure 5 is pressed downward by the elasticity of the fitting member 50, whereby the anisotropic conductive sheet 60 is pressed to change from the state of FIG. 7 to the state of FIG. The pad 34 and the pad 71 of the wiring board are sufficiently brought into contact with the protrusions 60a on both surfaces of the anisotropic conductive sheet 60 and become conductive. Thereby, the pads 34 of the electronic component mounting board 30 and the pads 71 of the wiring board 70 are electrically connected via the anisotropic conductive sheet 60.

  Also, the positioning pins 42 of the electronic component mounting board 30 of FIG. 1 are inserted into the positioning holes 11 of the upper structure 5, whereby the end face 7 a of the optical fiber 7 and the optical element 40 as shown in the cross-sectional view of FIG. 5. And the lower surface 6a of the holding member 6 and the upper surface 32a of the wall portion 32 of the optical element mounting substrate 30 are in contact with each other, so that the end surface 7a of the optical fiber 7 and the optical element 40 are in contact with each other. They are positioned vertically and connected optically.

The pressing force in the vertical direction by the fitting member 50 on the anisotropic conductive sheet 60 sandwiched between the electronic component mounting board 30 and the wiring board 70 is sufficient contact between the anisotropic conductive sheet 60 and the pads 34a and 71a. From the point of securing the electrical connection, it is preferably 0.5 kgf / cm ² or more, more preferably 1 kgf / cm ² or more.

  As described above, the optical module 1 is electrically and optically connected in the vertical direction in the state shown in FIG. 2 and is capable of transmitting and receiving optical signals transmitted to the outside through the optical fiber 7. The

  For example, during maintenance replacement, the optical connection can be easily disconnected by pulling out the upper structure 5 vertically from the fitting member 50, and then the optical element mounting substrate 30 is removed from the anisotropic conductive sheet 60. Electrical connection can be easily disconnected by taking out vertically.

  9 to 11 are diagrams showing another embodiment of the present invention, FIG. 9 is a perspective view of an anisotropic conductive sheet, and FIGS. 10 and 11 are an electronic component mounting substrate, an anisotropic conductive sheet, and FIG. It is sectional drawing which shows the state before and behind the electrical connection with a wiring board, FIG. 10 shows the state before electrical connection and FIG. 11 shows the state after electrical connection. The optical module in this embodiment is the same as that in the above-described embodiment except for the structure shown in FIG.

  In the present embodiment, as the anisotropic conductive sheet 60, a sheet-like insulating base material 63 in which conductive particles 62 that are arranged in the thickness direction and form a conductive path by pressurization is embedded is used.

  As shown in FIGS. 9 and 10, conductive particles 62 disposed on both ends of the insulating base 63 in the thickness direction are partially formed on both surfaces of the anisotropic conductive sheet 60 from the surface of the insulating base 63. A protruding portion 60a exposed to the surface is formed.

  When assembling the optical module 1 of the present embodiment in a state of optical connection and electrical connection, as in the case of FIGS. 1 and 2, the inside of the opening 51 of the fitting member 50 fixed on the wiring board 70 The anisotropic conductive sheet 60 is disposed on the electronic component mounting board 30, and the upper structure 5 is vertically fitted into the fitting member 50 from above.

  Accordingly, the upper structure 5 is pressed downward by the elasticity of the fitting member 50 and the anisotropic conductive sheet 60 is pressed to change from the state of FIG. 10 to the state of FIG. The pad 34 and the pad 71 of the wiring board are sufficiently brought into contact with the protrusions 60a on both surfaces of the anisotropic conductive sheet 60 and become conductive. Thereby, the pads 34 of the electronic component mounting board 30 and the pads 71 of the wiring board 70 are electrically connected via the anisotropic conductive sheet 60.

  The present invention has been described above based on the embodiments. However, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention.

  For example, in the above embodiment, the upper structure 5 is detachably mounted in the vertical direction using the fitting member 50 as the mounting body, and the light of the upper structure 5 is attached to the optical element 40 of the electronic component mounting substrate 30. Although the transmission line is optically connected, various types of mounting structures such as a clamp spring, a screwing structure, a leaf spring structure, a latch structure, and an open / close clamp spring can be used. it can.

  As the optical element 40, a surface light emitting element other than a VCSEL such as a laser diode may be used, or a surface light receiving element other than a PIN photodiode may be used.

  The optical element 40 and the driver integrated circuit device 41 may be flip-chip connected to the electronic component mounting board 30.

FIG. 1 is a perspective view showing an optical module according to an embodiment of the present invention, and shows a state where an optical connection and an electrical connection are disconnected. FIG. 2 is a perspective view showing a state where optical connection and electrical connection are made in the optical module of FIG. 3A and 3B are views showing the arrangement of the upper member, the optical fiber, and the lower member of the upper structure, in which FIG. 3A is a perspective view and FIG. 3B is a cross-sectional view. FIG. 4 is a top perspective view of the electronic component mounting board. FIG. 5 is a cross-sectional view showing a state in which the upper structure and the electronic component mounting substrate are optically connected. FIG. 6 is a perspective view of an anisotropic conductive sheet in one embodiment of the present invention. FIG. 7 is a cross-sectional view showing a state before electrical connection of the electronic component mounting board, the anisotropic conductive sheet, and the wiring board. FIG. 8 is a cross-sectional view showing a state in which the electronic component mounting substrate, the anisotropic conductive sheet, and the wiring substrate are electrically connected. FIG. 9 is a perspective view of an anisotropic conductive sheet according to another embodiment of the present invention. FIG. 10 is a cross-sectional view showing a state before electrical connection of the electronic component mounting board, the anisotropic conductive sheet, and the wiring board. FIG. 11 is a cross-sectional view showing a state in which the electronic component mounting board, the anisotropic conductive sheet, and the wiring board are electrically connected.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Optical module 5 Upper structure 6 Holding member 6a Lower surface 7 Optical fiber 7a End surface 8 Tape fiber 10 Upper member 11 Positioning hole 12 Shoulder part 20 Lower member 30 Electronic component mounting substrate 31 Ceramic substrate 32 Wall part 32a Upper surface 33 Printed wiring 34 Pad 35 Through hole 40 Optical element 41 Driver integrated circuit device 42 Positioning pin 50 Fitting member 51 Opening 52 Projection 53 Side plate 60 Anisotropic conductive sheet 60a Projection 61 Conductive wire 62 Conductive particle 63 Insulating base Material 65a External side optical axis 65b Optical element side optical axis 70 Wiring board 71 Pad

Claims (6)

An optical module that optically connects an optical transmission path that transmits an optical signal and an optical element that converts the optical signal into an electrical signal or converts the electrical signal into an optical signal,
An upper structure including an optical transmission body and a holding member for holding the optical transmission body;
A wiring board provided with pads on the upper surface, an anisotropic conductive sheet,
An electronic component mounting substrate on which an electronic component including an optical element is mounted on the upper surface and a pad electrically connected to an electrode of the electronic component is provided on the lower surface;
The upper structure, the electronic component mounting board, and the anisotropic conductive sheet are pressed and fixed on the wiring board in the vertical direction to optically transmit the optical transmission path of the upper structure to the optical element of the electronic component mounting board. Are connected to each other and electrically connected to the pads on the lower surface of the electronic component mounting board and the pads on the upper surface of the wiring board via an anisotropic conductive sheet, and are fixed on the wiring board made of a fitting member. Equipped with a body,
The mounting body made of the fitting member has an opening at a fixed end on the wiring board , presses the upper structure fitted in the opening downward, and further fits in the electronic component below It is a form that presses the mounting substrate and then presses the anisotropic conductive sheet fitted below it to ensure vertical conduction,
An optical module, wherein the anisotropic conductive sheet is provided on both sides thereof with protrusions that contact the pads on the lower surface of the electronic component mounting board and the pads on the upper surface of the wiring board. The mounting body made of the fitting member described above has a pair of protrusions on the upper edge thereof, and both peripheral edge portions parallel to the optical transmission path on the upper surface of the holding member of the upper structure to be fitted and mounted. The optical module according to claim 1, wherein the optical module is in contact with a pair of shoulder portions that form a tapered surface along the optical axis. The mounting body composed of the above-described fitting member includes a quadrilateral opening at the fixed end on the wiring board that can enclose and accommodate the electronic component mounting board and the upper structure, and two right and left sides parallel to the optical transmission body at the opening. A pair of side plate portions that are bent vertically and extend upward from each of the two sides, and a pair of ridge portions protruding over the entire length of each upper edge of the side plate portion,
The protrusions are applied to the pair of shoulder portions that form a tapered surface over the entire length of the peripheral edge portions on both sides parallel to the optical transmission body on the upper surface of the holding member of the upper structure to be fitted and mounted. The optical module according to claim 2, wherein the optical module is in contact with the optical module.   The anisotropic conductive sheet has a sheet-like insulating base material having elasticity and a conductive material embedded in the insulating base material, and the conductive material partially exposed from the surface of the insulating base material. The optical module according to any one of claims 1 to 3, wherein a protruding portion is formed of a material.   The optical module according to claim 4, wherein the conductive material is a conductive wire whose both ends are exposed from the surface of the insulating base material.   The conductive material is conductive particles that are arranged in the thickness direction of the insulating base material to form a conductive path by pressurization, and the conductive particles arranged on both ends in the thickness direction of the insulating base material are the insulating base material. The optical module according to claim 4, wherein the optical module is partially exposed from the surface.

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