JP2011247951A - Optical module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To restrain an adhesive from protruding when bonding a holding member for holding an optical coupling element to a substrate.SOLUTION: A plurality of optical elements 32 and an IC 33 are mounted on a module substrate 34, and a joint surface 134A with which a lower surface portion 135B of a module cover 35 is joined is formed on the module substrate 34. On the lower surface portion 135B of the module cover 35, a groove portion 146 is continuously formed along a peripheral edge portion of the joint surface 134A. An adhesive 150 is applied on the inside of a groove portion 146 of the lower surface portion 135B of the module cover 35, and when joined with the joint surface 134A of the module substrate 34, the adhesive 150 gets into the groove portion 146, and a thick adhesive layer by the adhesive 150 at the groove portion 146. Therefore, the adhesive 150 is restrained from protruding to the outside between the lower surface portion 135B of the module cover 35 and the joint surface 134A of the module substrate 34, and stress applied on a part near the peripheral edge portion of the joint surface 134A is relaxed.

Description

  The present invention relates to an optical module that optically connects an optical transmission body and an optical element.

  Conventionally, an optical module in which an optical element and an optical fiber are optically coupled using an optical coupling element has been proposed.

  For example, in Patent Document 1 below, a transparent substrate is sealed and fixed to a package on which an optical element is mounted, a holding member is fixed on the transparent substrate with a resin, and a fitting pin fixed to the holding member is attached to a lens substrate. And a lens substrate fixed on a transparent substrate with a resin.

JP 2008-40318 A

  However, according to Patent Document 1, when the holding member and the lens substrate are fixed to the transparent substrate with a resin (such as an adhesive), the resin protrudes from the bonding surface of the holding member and the lens substrate, and interferes with other mounting parts. there's a possibility that. Further, a large stress is applied due to the expansion of the resin at the edge end portions of the holding member and the lens substrate, and the holding member, the lens substrate, and the transparent substrate are likely to be peeled off.

  In consideration of the above facts, the present invention suppresses the adhesive from protruding when the holding member holding the optical coupling element is bonded and fixed to the substrate, and as a result, the light capable of suppressing the adhesion peeling between the holding member and the substrate. The purpose is to obtain a module.

  To achieve the above object, an optical module according to claim 1 is capable of optically coupling an optical transmission body that transmits an optical signal, an optical element that transmits or receives an optical signal, and the optical transmission body. A holding member for holding the optical coupling element, a substrate on which the optical element is mounted, the holding member being bonded to a bonding surface with an adhesive, and the bonding surface on at least one of the holding member and the substrate And an adhesive inflow part into which the adhesive enters when the holding member and the substrate are joined.

  According to the present invention, the holding member is bonded to the bonding surface of the substrate on which the optical element is mounted with the adhesive, and the optical transmission body and the optical coupling element are held by the holding member. At least one of the holding member and the substrate is provided with an adhesive inflow portion along the peripheral edge portion of the bonding surface, and the adhesive enters the adhesive inflow portion when the holding member and the bonding surface of the substrate are bonded to each other. A thick adhesive layer is formed on the peripheral edge of the film. This suppresses the adhesive from protruding from between the bonding surface of the substrate and the holding member. In addition, since the adhesive enters the adhesive inflow portion, stress due to the expansion of the adhesive in the vicinity of the peripheral portion of the joint surface (particularly, the edge end portion of the joint surface) is relieved. For this reason, generation | occurrence | production of the adhesion peeling of a holding member and the joint surface of a board | substrate is suppressed.

  In order to achieve the above object, an optical module according to a second aspect of the present invention is the optical module according to the first aspect, wherein the adhesive inflow portion is continuously formed along a peripheral edge portion of the joint surface. It is what has been.

  According to the present invention, the adhesive inflow portion is continuously formed along the peripheral edge of the bonding surface of the substrate, and the adhesive enters the adhesive inflow portion when the holding member and the bonding surface of the substrate are bonded. Thus, it is possible to more reliably prevent the adhesive from protruding from between the bonding surface of the substrate and the holding member. In addition, a continuous thick adhesive layer is formed on the peripheral portion of the joint surface, and stress in the vicinity of the peripheral portion of the joint surface (especially the edge termination portion of the joint surface) is relieved, so that the joint surface between the holding member and the substrate The occurrence of adhesive peeling is more reliably suppressed.

  An optical module according to a third aspect of the present invention is the optical module according to the first or second aspect, wherein the adhesive inflow portion is a groove formed on a surface facing the joining surface of the holding member. It is.

  According to the present invention, the adhesive inflow portion is a groove portion formed on a surface facing the bonding surface of the holding member, and the adhesive easily enters the groove portion when the holding member and the bonding surface of the substrate are bonded.

  An optical module according to a fourth aspect of the present invention is the optical module according to the first or second aspect, wherein the adhesive inflow portion is a chamfered portion formed at an edge termination portion of the substrate.

  According to the present invention, the adhesive inflow portion is a chamfered portion formed at the edge end portion of the substrate, and the adhesive easily enters the chamfered portion when the holding member and the bonding surface of the substrate are bonded.

  An optical module according to a fifth aspect of the present invention is the optical module according to any one of the first to fourth aspects, wherein at least one of the holding member and the substrate reaches the bonding surface, It has an insertion part in which the peeling member which peels the said holding member from the said joint surface can be inserted.

  According to the present invention, at least one of the holding member and the substrate is provided with the insertion portion that reaches the bonding surface, and the separation member is inserted into the insertion portion in a state where the holding member and the bonding surface of the substrate are bonded. As a result, the holding member is peeled off from the bonding surface of the substrate by the lever principle. Thereby, for example, when the alignment fixing failure between the optical coupling element and the optical element occurs after the holding member is bonded to the bonding surface of the substrate, the holding member and the substrate can be separated without damaging the optical module. it can.

  An optical module according to a sixth aspect of the present invention is the optical module according to the fifth aspect, wherein the insertion portion is a concave groove formed in at least one of the holding member and the side portion of the substrate.

  According to the present invention, the insertion portion is a concave groove formed in at least one of the holding member and the side portion of the substrate, and the holding member is peeled off from the bonding surface of the substrate by inserting the peeling member into the concave groove. The member and the substrate can be easily separated.

  According to the present invention, it is possible to suppress the adhesive from protruding when the holding member that holds the optical coupling element is bonded and fixed to the substrate, and to suppress the adhesion peeling between the holding member and the substrate.

It is a disassembled perspective view which shows schematic structure of the parallel optical transmission apparatus with which the optical module which concerns on 1st Embodiment of this invention is applied. It is a perspective view which shows the state which mounted | wore the optical module with the optical connector. It is a perspective view which shows the assembly state of the parallel optical transmission apparatus with which an optical module is applied. It is a top view which shows the state which mounted | wore the optical module with the optical connector. It is a longitudinal cross-sectional view which shows the state which mounted | wore the optical module with the optical connector. It is the fragmentary sectional view which expanded and showed a part in FIG. It is a top view which shows the state which has arrange | positioned the spacer on the electric pluggable socket. FIG. 8 is a side view of FIG. 7. It is the disassembled perspective view which looked at the cover and module board which are used for an optical module from the lower part. It is a perspective view of the cover and module board which are used for an optical module. It is a top view which shows the cover used for an optical module. It is a longitudinal cross-sectional view which shows the cover and module board which are used for an optical module. It is a longitudinal cross-sectional view which shows the process in which a peeling member is inserted in the concave groove | channel of a cover, and a cover is peeled from a module board. It is a longitudinal cross-sectional view which shows the cover and module board which are used for the optical module which concerns on 2nd Embodiment of this invention. It is a longitudinal cross-sectional view which shows the cover and module board which are used for the optical module which concerns on 3rd Embodiment of this invention. It is a longitudinal cross-sectional view which shows the cover and module board which are used for the optical module which concerns on 4th Embodiment of this invention.

Next, an embodiment of the present invention will be described with reference to the drawings. In the description of each embodiment, similar parts are denoted by the same reference numerals, and redundant description is omitted.
1st Embodiment of the optical module of this invention is described based on FIGS. FIG. 1 is an exploded perspective view showing the overall configuration of a parallel optical transmission apparatus to which an optical module is applied. As shown in FIG. 1, the parallel optical transmission device 10 includes an electric substrate 5, an electric pluggable socket 1, an optical module 3, a pressing member 2, a heat sink 20, an optical connector 4, and an optical component 60. ing.

  The electric substrate 5 is a PCB (Printed Circuit Board), and a plurality of electric terminals 51 and electrode patterns (not shown) connected to the electric terminals 51 are formed on the front and back surfaces thereof. The plurality of electrical terminals 51 are, for example, LGA (Land Grid Array) terminals in which fine flat electrodes are arranged in a grid pattern. In addition, as shown in FIG. 1, the electric board 5 has four through holes 52 through which screws 61 for fastening the electric pluggable socket 1 to the electric board 5 are inserted, and the electric pluggable socket 1 is positioned on the electric board 5. A pair of positioning pin holes 53 are formed for this purpose.

  As shown in FIGS. 1, 4 and 5, the electric pluggable socket 1 includes a bottom wall portion 11 in which a plurality of connection terminal portions 13 that are electrically connected when a predetermined pressing force is received, And a peripheral wall portion 12 that forms a module housing recess 14 for housing the module 3, and is fixed on the electric substrate 5 with screws 61. The plurality of connection terminal portions 13 are arranged in a lattice pattern, and an upper contact pin 13a (see FIG. 1) protruding from the surface of the bottom wall portion 11 and a lower contact pin (not shown) protruding from the back surface thereof. Each has. Each of the connection terminal portions 13 is a spring-like structure configured such that when a predetermined pressing force is applied, a coiled spring portion (not shown) contracts and the upper contact pin 13a and the lower contact pin are electrically connected. Terminal. Further, as shown in FIG. 1, four screw holes 15 into which screws 61 are screwed and screws 62 for fastening the pressing member 2 to the electric pluggable socket 1 are screwed on the peripheral wall portion 12 of the electric pluggable socket 1. Four screw holes 17 are formed. Further, as shown in FIGS. 3 and 4, a cutout portion 12 a that accommodates a portion of the connector portion 42 (see FIG. 2) of the optical connector 4 is formed in a part of the peripheral wall portion 12.

  The optical module 3 has a function of converting an electrical signal into an optical signal, and is detachably mounted in the module housing recess 14 of the electrical pluggable socket 1 (see FIGS. 4 and 5). When the optical module 3 is mounted in the module housing recess 14, the optical module 3 is electrically connected to the electric substrate 5 via the plurality of connection terminal portions 13 of the electric pluggable socket 1. As shown in FIGS. 1 and 2, the optical module 3 is disposed in a module substrate (ESA (Electrical Sub Assembly) substrate) 34 as a substrate, and a recess 34a (see FIG. 6) of the module substrate 34, and has an electrode pattern. A plurality (12 in this example) of optical elements 32 mounted on (not shown), an IC (see FIG. 6) 33 mounted on the electrode pattern of the module substrate 34, a module cover 35 as a cover, Have The IC 33 is flip-chip mounted (FCB: Flip Chip Bonding) on one surface (front surface) of the module substrate 34 and is electrically connected to the plurality of optical elements 32 by wiring.

  The module substrate 34 is a ceramic substrate. On one surface (front surface) of the module substrate 34, one set of two differential signal terminals is provided, and a plurality of sets of differential signal terminals having the same number as the number of channels (12 channels in this example) and power are supplied to the IC. A plurality of power supply terminals for supplying control signals, a plurality of control signal supplying terminals for supplying control signals to the IC, and a ground pattern are formed. The other surface includes a plurality of terminals (differential signal terminals, electrically connected to a plurality of sets of differential signal terminals, a plurality of power supply terminals, and a plurality of control signal supply terminals on one surface. A power supply terminal and a control signal supply terminal) and a ground pattern electrically connected to the ground pattern on one surface.

  In the present embodiment, the plurality of optical elements 32 are configured by a laser diode array having a plurality of surface-emitting type semiconductor laser elements aligned in a line. A surface emitting semiconductor laser element as an optical element is a VCSEL (Vertical Cavity Surface Emitting Laser) that emits light (optical signal) in a direction perpendicular to the substrate surface (upward in FIG. 5). The IC 33 is a driver IC that drives the plurality of optical elements 32.

  As shown in FIGS. 1 and 3, the holding member 2 holds the optical module 3 and the electric pluggable socket 1 from above so as to apply a predetermined pressing force to each connection terminal portion 13 of the electric pluggable socket 1. The pluggable socket 1 is detachably fixed to the peripheral wall portion 12. The pressing member 2 has four through holes 23 through which the screws 62 are inserted. The holding member 2 is fixed to the electric pluggable socket 1 by inserting screws 62 through the four through holes 23 and screwing the screws 62 into the four screw holes 17 of the electric pluggable socket 1. A heat sink 20 is integrally formed on the upper surface of the pressing member 2.

  The optical connector 4 transmits optical signals in parallel with the plurality of optical elements 32 of the optical module 3. As shown in FIGS. 1 and 2, the optical connector 4 includes a ribbon fiber 41 as an optical transmission body in which a plurality of optical fibers (12 in this example) are arranged in a line, and a plurality of optical fibers. Each end face of a plurality of optical fibers held by the connector portion 42 after bending the held connector portion 42 (ferrule) and light (optical signal) emitted from the plurality of optical elements 32 in a perpendicular direction by 90 degrees. And an optical component 60 (lens array) as an optical coupling element that optically couples to the optical component. The optical connector 4 includes a case where the optical fiber is simply sealed with resin.

  The connector part 42 is a multi-core ferrule connector (MT connector). The connector portion 42 is disposed in the window 21 of the pressing member 2 in a state where the pressing member 2 is fixed to the electric pluggable socket 1. The ribbon fiber 41 is connected to another optical connector 43 and transmits optical signals to and from the optical module 3 in parallel.

  The optical component 60 includes two sets of microlens arrays 64 and 65 each having a plurality of (in this example, twelve) microlenses arranged in a line, and a reflecting surface 66. The optical component 60 enters light emitted from each optical element 32 in a direction perpendicular to the optical element 32 via the microlens array 65 as shown by an alternate long and short dash line in FIG. The reflected light is collected by the microlens 64 and optically coupled to the end faces of the optical fibers of the connector section 42.

  The connector portion 42 and the optical component 60 of the optical connector 4 are configured such that, for example, two positioning pins 124 (see FIG. 11) protruding from the optical component 60 are fitted into two guide pin holes (not shown) of the connector portion 42. After that, it is fixed by bonding or the like. The connector part 42 and the optical component 60 fixed in this way are connected to the module cover 35 of the optical module 3 mounted in the module receiving recess 14 of the electric pluggable socket 1 as shown in FIGS. It is mounted in the opening 3a and is fixed to the module cover 35 with an adhesive.

  Further, as shown in FIG. 1, the parallel optical transmission device 10 includes a sheet-like heat conducting member 30 for efficiently transmitting heat generated by the IC 33 of the optical module 3 to the holding member 2 and the heat sink 20. It is arranged between the member 2. The heat conducting member 30 is made of a material having high heat conductivity, such as silicon grease or graphite sheet.

  Further, as shown in FIGS. 1, 7, and 8, the parallel optical transmission apparatus 10 is provided between the electric pluggable socket 1 and the pressing member 2 so that the upper surface of the peripheral wall portion 12 of the electric pluggable socket 1 and the optical module 3 are connected. A spacer 40 having a thickness that fills a step 50 (see FIG. 5) formed between the upper surface of the module cover 35 is provided.

  The spacer 40 is made of, for example, a soft resin such as Teflon (registered trademark) or an elastic material such as rubber. The spacer 40 has a thickness larger than the step 50. However, this thickness is set to a thickness that does not hinder electrical contact during pressing. Further, as shown in FIGS. 7 and 8, the spacer 40 is a sheet-like elastic body disposed on the entire upper surface of the peripheral wall portion 12 of the electric pluggable socket 1.

  As shown in FIGS. 9 to 12, the module cover 35 is a plate-like member made of metal (for example, copper, aluminum alloy, etc.). On one surface (front surface) of the module substrate 34, a bonding surface 134A that comes into contact with the lower surface portion 135B of the module cover 35 is formed, and the lower surface portion 135B of the module cover 35 and the bonding surface 134A of the module substrate 34 are bonded to the adhesive 150. (See FIG. 12). With the optical component 60 attached to the opening 3a of the module cover 35, the optical component 60 is disposed at a position facing the plurality of optical elements 32 on the module substrate 34 (see FIG. 12).

  A groove portion 146 as an adhesive inflow portion is continuously formed on the lower surface portion 135B of the module cover 35 along the peripheral edge portion of the joining surface 134A (see FIG. 4) of the module substrate 34 to which the module cover 35 is bonded. Yes. The groove portion 146 is formed in a rectangular shape on the lower surface portion 135B of the module cover 35, and is interrupted at the position where the opening 3a of the module cover 35 is formed. The adhesive 150 is applied to the lower surface portion 135B of the module cover 35 inside the groove portion 146 and outside the hole portion 135C and the opening 3a, and the lower surface portion 135B of the module cover 35 is applied to the bonding surface 134A of the module substrate 34. Be joined. When the lower surface portion 135 </ b> B of the module cover 35 and the bonding surface 134 </ b> A of the module substrate 34 are bonded, the adhesive 150 enters the groove 146, and a thick adhesive layer is formed by the adhesive 150 at the groove 146. This prevents the adhesive 150 from protruding from between the lower surface portion 135B of the module cover 35 and the joint surface 134A of the module substrate 34. Further, the adhesive 150 enters the groove 146 and a thick adhesive layer is formed, so that the stress due to the expansion of the adhesive 150 near the peripheral edge of the bonding surface 134A of the module substrate 34 is relieved. .

  In the present embodiment, a thermosetting adhesive is used as the adhesive 150, and the lower surface portion 135 </ b> B of the module cover 35 is bonded to the bonding surface 134 </ b> A of the module substrate 34 and then cured by heating.

  As shown in FIG. 10, the groove portion 146 is preferably provided on the inner side of the edge termination portion 134 </ b> B of the bonding surface 134 </ b> A of the module substrate 34. Further, the groove portion may be provided at a position straddling the edge termination portion 134B of the bonding surface 134A of the module substrate 34. That is, when the adhesive 150 enters the groove 146, it is preferable that there is no thin portion of the adhesive layer outside the thick adhesive layer in the groove 146.

  As shown in FIGS. 7 to 10, a concave groove 148 as an insertion portion is formed at a corner portion between the lower surface portion 135 </ b> B of the module cover 35 and the side wall surface. The concave groove 148 is formed in a substantially U shape inward from the edge of the lower surface portion 135 </ b> B of the module cover 35, and the tip of the concave groove 148 extends inward from the groove portion 146. When the lower surface portion 135B of the module cover 35 and the joining surface 134A of the module substrate 34 are joined by the adhesive 150, the concave groove 148 reaches the joining surface 134A. By inserting a wedge 152 (see FIG. 13) as a peeling member into the concave groove 148, the module cover 35 can be peeled from the joining surface 134A of the module substrate 34 by the lever principle.

  Next, operations and effects of the optical module 3 of the present embodiment will be described.

  As shown in FIGS. 9 to 12, an adhesive 150 is applied to the lower surface 135 </ b> B of the module cover 35 inside the groove 146 and outside the hole 135 </ b> C and the opening 3 a. The portion 135B is bonded to the bonding surface 134A of the module substrate 34. At this time, a groove 146 is continuously formed in the lower surface portion 135B of the module cover 35 along the peripheral edge portion of the joining surface 134A of the module substrate 34. As shown in FIG. 12, the lower surface portion of the module cover 35 is formed. When bonding 135B and the bonding surface 134A of the module substrate 34, the adhesive 150 enters the groove 146, and a thick adhesive layer is formed by the adhesive 150 in the groove 146. As a result, the adhesive 150 can be prevented from protruding from between the lower surface portion 135B of the module cover 35 and the joint surface 134A of the module substrate 34, and interference with other mounting parts can be prevented. . In the present embodiment, a thermosetting adhesive is used as the adhesive 150, and the adhesive 150 is cured by heating, whereby the lower surface portion 135 </ b> B of the module cover 35 and the bonding surface 134 </ b> A of the module substrate 34 are formed. Be joined.

  In general, when the groove portion 146 is not provided in the lower surface portion 135B of the module cover 35, when the module cover 35 and the module substrate 34 are joined with an adhesive, the adhesive 150 expands due to a change in ambient temperature or the like, and the module substrate 34 The stress applied to the vicinity of the edge terminal portion 134B of the joining surface 134A increases, and the adhesive peeling between the module substrate 34 and the module cover 35 easily occurs. In particular, when the linear expansion coefficients of the module cover 35 and the module substrate 34 are different, the adhesion peeling is likely to occur.

  In the optical module 3, when the lower surface portion 135 </ b> B of the module cover 35 and the bonding surface 134 </ b> A of the module substrate 34 are bonded, the adhesive 150 enters the groove portion 146 and a thick adhesive layer is formed. Stress due to the expansion of the adhesive 150 in the vicinity of the peripheral edge of the bonding surface 134A is relieved. For this reason, it is possible to suppress the occurrence of adhesion peeling between the lower surface portion 135B of the module cover 35 and the bonding surface 134A of the module substrate 34. Therefore, even when the linear expansion coefficients of the module cover 35 and the module substrate 34 are different, the adhesion and peeling between the module cover 35 and the module substrate 34 can be suppressed to ensure reliability.

  Further, the groove 146 is formed continuously along the peripheral edge of the bonding surface 134A of the module substrate 34, and an adhesive is provided between the lower surface portion 135B of the module cover 35 and the bonding surface 134A of the module substrate 34 to the outside. It can suppress more reliably that 150 protrudes. Further, the adhesive 150 enters the groove 146 continuously formed along the peripheral edge of the joint surface 134A of the module substrate 34, so that the stress near the peripheral edge of the joint surface 134A is relieved, and the module cover 35 And the module substrate 34 can be more reliably suppressed.

  In the optical module 3, for example, when the module cover 35 is bonded to the bonding surface 134 </ b> A of the module substrate 34 with the adhesive 150, and the alignment fixing failure between the optical component 60 and the optical element 32 occurs, the module cover 35. In some cases, the module substrate 34 may be peeled once and re-adhered (reworked). At this time, as shown in FIG. 13, the wedge 152 is inserted into the concave groove 148 formed in the lower surface portion 135B of the module cover 35, and the lower surface portion 135B of the module cover 35 and the joining surface 134A of the module substrate 34 are pulled apart. By tilting the wedge 152 in the direction, the lower surface portion 135B of the module cover 35 can be peeled off from the bonding surface 134A of the module substrate 34 by the lever principle. For this reason, the module cover 35 and the module substrate 34 can be separated without damaging the optical module 3.

Next, an optical module according to a second embodiment of the present invention will be described. In addition, the same code | symbol is attached | subjected to the member same as 1st Embodiment, and the overlapping description is abbreviate | omitted.
As shown in FIG. 14, the joint surface 134 </ b> A of the module substrate 34 of the optical module 200 is provided with a projecting surface 202 that projects toward the module cover 35. The protruding surface 202 is formed in a substantially rectangular shape on the bonding surface 134A of the module substrate 34, and the height of the protruding surface 202 is formed lower than the depth of the groove portion 146 formed in the lower surface portion 135B of the module cover 35. ing. The edge 202A of the protruding surface 202 is provided at a position facing the groove 146 of the module cover 35 when the module substrate 34 and the module cover 35 are joined.

  In such an optical module 200, when the lower surface portion 135B of the module cover 35 and the bonding surface 134A (projecting surface 202) of the module substrate 34 are bonded, the adhesive 150 enters the groove portion 146 and the lower side of the groove portion 146. Then, the adhesive 150 enters the outside (adhesive inflow portion) of the edge 202A of the protruding surface 202 of the module substrate 34. As a result, it is possible to prevent the adhesive 150 from protruding from between the lower surface portion 135B of the module cover 35 and the joint surface 134A of the module substrate 34 to the outside (such as a side wall portion of the module substrate 34). Can be prevented. In addition, the adhesive 150 enters the groove 146 and the adhesive 150 enters the outside of the edge 202A of the projecting surface 202, so that the stress due to the expansion of the adhesive 150 in the vicinity of the peripheral portion of the bonding surface 134A of the module substrate 34 is obtained. Is alleviated. For this reason, it is possible to suppress the occurrence of adhesion peeling between the lower surface portion 135B of the module cover 35 and the bonding surface 134A of the module substrate 34.

Next, an optical module according to a third embodiment of the present invention will be described. In addition, the same code | symbol is attached | subjected to the member same as 1st and 2nd embodiment, and the overlapping description is abbreviate | omitted.
As shown in FIG. 15, the joint surface 134 </ b> A of the module substrate 34 of the optical module 210 is provided with a projecting surface 202 that projects toward the module cover 35. The protruding surface 202 is formed in a substantially rectangular shape on the bonding surface 134 </ b> A of the module substrate 34. An end edge 202 </ b> A of the protruding surface 202 is provided on an inner side than an end edge of the module substrate 34. In the present embodiment, the groove portion as in the second embodiment is not provided in the lower surface portion 135B of the module cover 35.

  In such an optical module 210, when the lower surface portion 135B of the module cover 35 and the joining surface 134A (projecting surface 202) of the module substrate 34 are joined, the adhesive 150 is applied to the edge 202A of the projecting surface 202 of the module substrate 34. Enters the outside (adhesive inflow part). As a result, it is possible to prevent the adhesive 150 from protruding from between the lower surface portion 135B of the module cover 35 and the joint surface 134A of the module substrate 34 to the outside (such as a side wall portion of the module substrate 34). Can be prevented. Further, since the adhesive 150 enters the outside of the edge 202A of the protruding surface 202, the stress due to the expansion of the adhesive 150 in the vicinity of the peripheral portion of the bonding surface 134A of the module substrate 34 is relieved. For this reason, it is possible to suppress the occurrence of adhesion peeling between the lower surface portion 135B of the module cover 35 and the bonding surface 134A of the module substrate 34.

Next, an optical module according to a fourth embodiment of the present invention will be described. In addition, the same code | symbol is attached | subjected to the member same as 1st-3rd embodiment, and the overlapping description is abbreviate | omitted.
As shown in FIG. 16, a plurality of projecting surfaces 222 and 224 projecting toward the module cover 35 are provided on the joint surface 134 </ b> A of the module substrate 34 of the optical module 220. The heights of the protruding surfaces 222 and 224 are substantially the same as the protruding surfaces 202 of the second and third embodiments. The projecting surfaces 222 and 224 are provided at positions where the projecting surfaces 222 and 224 come into contact with the planar lower surface portion 135 </ b> B of the module cover 35. End edges 222A and 224A of the projecting surfaces 222 and 224 are provided inside the end edge of the module substrate 34 and inside the end edge of the planar lower surface portion 135B of the module cover 35. In the present embodiment, the groove portion as in the second embodiment is not provided in the lower surface portion 135B of the module cover 35.

  In such an optical module 220, when the planar lower surface portion 135 </ b> B of the module cover 35 and the projecting surfaces 222 and 224 of the module substrate 34 are joined, the adhesive 150 is applied to the ends of the projecting surfaces 222 and 224 of the module substrate 34. It enters the outside (adhesive inflow portion) of the edges 222A and 224A. As a result, it is possible to prevent the adhesive 150 from protruding from between the lower surface portion 135B of the module cover 35 and the joint surface 134A of the module substrate 34 to the outside (such as a side wall portion of the module substrate 34). Can be prevented. Further, the adhesive 150 enters the outside of the end edges 222A and 224A of the projecting surfaces 222 and 224 of the module substrate 34, so that stress due to the expansion of the adhesive 150 in the vicinity of the peripheral portion of the bonding surface 134A of the module substrate 34 is relieved. Is done. For this reason, it is possible to suppress the occurrence of adhesion peeling between the lower surface portion 135B of the module cover 35 and the bonding surface 134A of the module substrate 34.

  As a modification of the second to fourth embodiments, a groove may be formed on the joint surface 134A of the module substrate 34 along the peripheral edge of the joint surface 134A. Further, when a chamfered portion is formed at the edge termination portion 134B of the joining surface 134A of the module substrate 34 and the lower surface portion 135B of the module cover 35 and the joining surface 134A of the module substrate 34 are joined, the chamfered portion of the module substrate 34 is formed. The adhesive 150 may enter.

  In the first embodiment, the concave groove 148 is formed in the module cover 35. However, the present invention is not limited to this, and the concave groove 148 may be formed in the module substrate 34. Also, the module substrate 34 and the module cover 35 may be formed. A concave groove may be formed so as to straddle. Furthermore, as long as it is possible to insert a wedge as a peeling member and peel the module cover 35 from the module substrate 34, the shape is not limited to the concave groove 148, and other shapes may be used.

  In the first to fourth embodiments, the transmission-side optical module 3 has been described. However, the present invention can be applied to a reception-side optical module.

3 Optical Module 4 Optical Connector 10 Parallel Optical Transmission Device 34 Module Board (Board)
35 Module cover (cover)
41 Ribbon fiber (optical transmission body)
60 Optical components (optical coupling elements)
134A Joint surface 134B Edge termination portion 135B Lower surface portion 146 Groove portion (adhesive inflow portion)
148 Concave groove (insertion part)
150 Adhesive 152 Wedge (peeling member)
200 Optical Module 202 Protruding Surface 202A Outside Edge (Adhesive Inflow Portion)
210 Optical Module 220 Optical Module 222, 224 Projecting Surface 222A, 224A Outside Edge (Adhesive Inflow Portion)

Claims (6)

A holding member that holds an optical transmission body that transmits an optical signal, an optical element that transmits or receives an optical signal, and an optical coupling element that enables optical coupling of the optical transmission body;
A substrate on which the optical element is mounted and the holding member is bonded to a bonding surface with an adhesive;
An adhesive inflow portion that is provided along a peripheral edge of the bonding surface on at least one of the holding member and the substrate, and into which the adhesive enters when the holding member and the substrate are bonded;
An optical module.   The optical module according to claim 1, wherein the adhesive inflow portion is continuously formed along a peripheral edge portion of the joint surface.   3. The optical module according to claim 1, wherein the adhesive inflow portion is a groove formed in a surface of the holding member that faces the joint surface.   The optical module according to claim 1, wherein the adhesive inflow portion is a chamfered portion formed at an edge termination portion of the substrate.   The at least one of the holding member and the substrate has an insertion portion into which a peeling member that reaches the bonding surface and allows the holding member to peel from the bonding surface can be inserted. The optical module according to item.   The optical module according to claim 5, wherein the insertion portion is a concave groove formed in at least one of the holding member and a side portion of the substrate.

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