JP2010062087A - Optoelectrical module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a structure of enhancing the efficiency of radiation from a light module while achieving a low height structure of an optoelectrical module and an optical waveguide path. <P>SOLUTION: A light element and an electrode 110 are arranged at the lower surface of a package constituting the light module, and between the package and a board, the optical waveguide in which a mechanism to curve a light signal upward and substantially orthogonally is arranged, and an electric connector are positioned. By means that the package is pressed onto the board by a pressing member, optical coupling of the light waveguide and the light element is formed, and electrical conduction between the package and the board is made. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an optoelectric module and an optical waveguide structure included in an information processing apparatus used by using an optical communication technique.

In recent years, a plurality of substrates on which electronic circuits and the like are mounted are mounted inside information processing apparatuses such as routers, servers, personal computers, and mobile phones. A signal input / output port is mounted on these boards, and this port plays a role of transmitting signals to other information processing apparatuses and another board even in the same apparatus.
In recent years, with the speeding up and downsizing of information processing apparatuses, the following requirements are also required for signal input / output ports mounted on a substrate.
(1) With the increase in speed, not only conventional electrical signals but also input / output of optical signals are required. That is, these ports are equipped with optical modules that convert electrical signals into optical signals and optical signals into electrical signals, and optical waveguides such as optical fibers are used as signal transmission media.
(2) Along with the downsizing of the device, it is necessary to reduce the height of the port, in particular. That is, the structure of the optical module and the optical fiber needs to be very low.
An example of an optical module and optical waveguide structure that satisfies the above requirements is disclosed in Patent Document 1 (Japanese Patent Laid-Open No. 2003-207694).
According to this known example, the optical fiber is fixed to an optical connector with a mirror, and a planar optical element array is mounted in the package. By fixing the optical connector to the package, the optical fiber and the optical element are optically coupled. On the other hand, the electrical connection between the package and the board is achieved by fixing the electrical terminals of the package to the board.

JP 2003-207694 A

  In recent optical modules, a pluggable electrical connector is used to facilitate replacement. That is, in the structure of this known example, the heights of the optical connector, the package, and the electrical connector are all added to the height of the structure, which is unsuitable for further reduction in height.

  Moreover, this known example is unsuitable from the viewpoint of heat dissipation. A heating element such as an optical element or an electronic element is mounted on the package. However, the material of the optical waveguide is generally fiber, polymer, etc., and plastic is generally used for the optical connector, and the thermal conductivity is remarkably worse than that of metal. That is, the structure of this known example in which the optical connector is mounted on the upper surface of the package has a problem in heat dissipation.

  In view of the above drawbacks, an object of the present invention is to provide an optoelectric module and an optical waveguide structure used in a high-speed and small information processing apparatus.

  An optical element and an electrode 110 are provided on a lower surface of a package constituting the optical module, and an optical waveguide provided with a mechanism for bending an optical signal upward at a substantially right angle between the package and the board, and an electrical connector are positioned. To do. When the package is pressed against the board by the pressing member, the optical waveguide and the optical element are optically coupled, and the package and the board are electrically connected.

  Since the optical waveguide and the electrical connector are located between the package and the board, the height can be reduced, and the heat dissipation efficiency from the upper surface of the package can be increased.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  An example of the embodiment of the present invention is shown in FIGS. FIG. 1 shows a cross-sectional view before assembling the opto-electric module package 101, optical waveguide 130, electrical connector 121, and board 117, and FIG. 2 is a cross-sectional view after assembling. FIG. 3 is a perspective view before assembly.

An optical element 105 is mounted on the lower surface of the package 101, and the IC 104 is a driver of a light emitting element, an amplifier of a light receiving element, or the like. Electrical signals from the optical element 105 and the IC 104 pass through the electrode 110 through the package internal wiring 102 and the package via 108.
On the other hand, the optical waveguide 130 is composed of an optical waveguide core layer 113 and an optical waveguide cladding layer 114. The end surface of the optical waveguide core layer 113 is a mirror surface 115, and the optical path of the optical signal is bent approximately at a right angle. ing.
The electrical connector 121 includes an electrode 119 and an electrode 122. Here, the electrode 119 has elasticity in at least the vertical direction and is inserted in the electrode fixing groove 120. The electrode 122 is fixed to the electrode 127 on the board 117 by a solder ball 125.

On the board 117, an electrode 126 electrically connected to the in-board wiring 118 and the in-board via 128 is provided. A clamp 116 is attached on the board 117.
By fitting a part of the clamp 116 into the clamp groove 103, not only the package 101 and the board 117 are fixed, but also both the optical waveguide 130 and the electrical connector 121 located between the package 101 and the board 117 are connected. It will be fixed. That is, the height of the package 101 and the optical waveguide 130 mounted on the board 117 is approximately the sum of both heights, and a reduction in height is realized. In addition, since the optical waveguide 130 is not positioned on the upper surface of the package 101, it is possible to press the heat radiating fins and the heat radiating housing, and the heat radiating efficiency can be improved.

  Returning to FIGS. 1 and 2, a guide hole 107 is provided in the package 101, and a guide hole 112 is provided in the optical waveguide 130, which are fitted by the guide pins 111. As a result, the left and right positions of the package 101 and the optical waveguide 130 are accurately aligned, and the optical coupling is stabilized.

  Returning to FIGS. 1, 2, and 3, the electrode 119 fixed to the electrical connector 121 is an elastic body, and is in electrical continuity by contacting the electrode 110. For example, even if there are variations in the thickness of the optical waveguide 130, variations in the thickness of the electrical connector 121, variations in the height of the solder balls 125, etc., it is possible to prevent the electrodes 119 and 110 from being separated. . In order to absorb the above variation error, the electrode 119 only needs to have a movable range of several hundred microns to several millimeters.

  Returning to FIGS. 1 and 2, an electrical connector guide mechanism 109 is attached to the package 101. This has an advantage that the displacement of the electrical connector 121 can be suppressed within a certain range because the electrode 119 and the electrode 110 are not fixed only by contact.

  1 and 2, a pedestal 106 higher than the optical element 105 is attached to the package 101. This not only eliminates the possibility that the optical waveguide 130 directly touches the optical element 105 and causes the optical element 105 to break down, but also keeps the height of the optical element 105 and the optical waveguide 130 constant to achieve optical coupling. Has the effect of stabilizing.

  Returning to FIGS. 1, 2, and 3, the package 101 is provided with a clamp groove 103 for stopping the clamp 116. This can prevent the clamp 116 from being displaced from the package 101.

  Returning to FIGS. 1, 2, and 3, the electronic device 123 is mounted on the board 117. These electronic elements 123 may be used as control circuits, power supply, signal generation circuits, and signal processing circuits for the electronic elements 104 and optical elements 105. Thus, the optical module package 101 and the optical waveguide 130 function as signal input / output ports of the board 117.

  4 and 5 show an example of the embodiment of the present invention. 4 is a perspective view showing the optical waveguide 130 fixed to the optical connector 202, and FIG. 5 is a cross-sectional view.

  Although the optical waveguide 130 is provided with a mirror surface 115, the optical waveguide core layer 113 and the cladding layer 114 are cut at about 45 degrees. Since the optical waveguide 130 is made of polymer, glass, or the like, there is a drawback that it is easily bent. Therefore, the optical waveguide 130 is fixed to the optical connector 202. The optical connector 202 is provided with a guide hole 201. The guide hole 201 is preferably provided in the optical connector 202 in order to stably hold the guide pin 201.

  FIG. 6 shows an example of the embodiment of the present invention. FIG. 6 is a cross-sectional view showing the optical waveguide 130 fixed to the optical connector 202. A mirror surface 301 is formed on the optical connector 202, but a metal typified by gold or the like may be coated to increase the light reflectivity.

  FIG. 7 is a sectional view showing an example of the embodiment of the present invention. The optical connector 401 is provided with a mechanism for bending and holding the optical waveguide 130 approximately at a right angle. In this case, there is no need to make a mirror or the like in the optical waveguide 130. The bending radius of the optical waveguide 130 is about several hundred microns to several millimeters.

  FIG. 8 is a sectional view showing an example of the embodiment of the present invention. The package 101 is provided with a guide hole 107, the optical connector 202 is provided with a guide hole 201, and the board 117 is provided with a guide hole 503. These guide holes are fitted by the same guide pin 111. As a result, the guide pins 111 can not only align the package 101 and the optical connector 202 but also can align the relative positions of the electrode 110 and the electrode 127. However, if the size of the electrode 110 and the electrode 127 is about 500 microns, it is sufficient that the relative alignment accuracy between the electrode 110 and the electrode 127 is at most 200 microns, so the diameter of the guide hole 503 is sufficient. The diameter of the guide hole 107 or the guide hole 201 may be as large as about 400 microns.

  There is another advantage of opening the guide hole 503. Manufacture is easier when the length of the guide pin 111 is 1 mm or more. However, the thickness of the package 101 and the optical connector 202 may be reduced to about several hundred microns. In this case, the guide hole 111 has a longer length than that of the package 101 or the optical connector 202. There is an advantage that it can be made longer than the sum of lengths.

  Returning to FIG. 8, the electrode 501 is held in the electrode fixing groove 502 of the electrical connector 121. The electrode 501 has elasticity and is configured to be in contact with the electrode 110 and the electrode 127 to be conductive. In this case, if the movable range of the electrode 501 is about 1 mm, there is an advantage that conduction can be achieved even when the optical connector 202 or the like has a manufacturing deviation of about 1 mm. The electrical connector guide mechanism 109 is mounted on the board 117.

  FIG. 9 is a sectional view showing an embodiment of the present invention. The electrical connector A 601 is mounted on the package 101 and the electrical connector B 604 is mounted on the board 117. The electrical connection between the package 101 and the board 117 is achieved by inserting the electrode pin 602 into the electrode guide 603. This has the advantage that electrical coupling can be easily performed even if the electrode pins 602 are not sufficiently inserted. For example, if the depth of the electrode guide 603 is about 1 mm, the electrode pin 602 can be electrically coupled if it is inserted into the electrode guide 603 about 500 microns. This is because even if the thickness accuracy of the optical waveguide 130 and the height accuracy of the solder ball 125 are varied, the electrical coupling between the package 101 and the board 117 is achieved without damaging the optical coupling between the optical waveguide 113 and the optical element 105. There is an advantage that you can.

  Returning to FIG. 9, the optical element 105 is located in a region surrounded by the package 101 and the translucent substrate 607. In such a case, the optical element 105 can be sealed so as not to be exposed to the outside air. The light-transmitting substrate 607 is made of glass or ceramic, and may transmit a desired optical signal. Generally, 50% or more of signal light is transmitted. The translucent substrate 607 may directly abut against the optical waveguide 130. In this case, the optical element 105 and the optical waveguide 130 are easily positioned in the height direction, and the optical coupling is stable.

  Returning to FIG. 9, the clamp 605 is inserted into the clamp hole 606 provided in the board 117 from the back side of the board. In this case, there is an advantage that the mounting strength of the clamp 605 is improved.

  FIG. 10 is a sectional view showing an embodiment of the present invention. An electrode fixing groove 702 is attached to the optical connector 703, and an electrode 701 is attached to the electrode fixing groove 702. Therefore, the optical coupling between the optical element 105 and the optical waveguide 130 and the electrical coupling between the package 101 and the board 117 are achieved simultaneously by simply fitting the guide hole 107, the guide hole 201, and the guide hole 503 with the guide pin 111. Has the advantage of.

  FIG. 11 is a perspective view showing an embodiment of the present invention. The optical fiber 803 is fixed to the optical connector 703, and the optical signal is coupled to the optical element by the mirror 301. The optical connector 703 is provided with an electrode fixing groove 702 to hold the electrode 701. The electrode 701 is responsible for electrical coupling between the package 101 and the board 117.

  By the way, the screw 807 is inserted into the hole 805 and the hole 802 of the package holder 804, and fixes the package 101, the optical connector 703, and the board 117 together with the nut 801 and the package holder 804. Since the package holder 804 is made of a metal having high thermal conductivity, the heat dissipation efficiency from the package 101 can be improved.

  By being mounted on a substrate in a high-speed and small information processing apparatus, it is used for the purpose of outputting signals from the substrate at high speed and inputting signals to the substrate at high speed.

It is sectional drawing which shows the 1st Embodiment of this invention. It is sectional drawing which shows the 1st Embodiment of this invention. 1 is a perspective view showing a first embodiment of the present invention. It is a perspective view which shows the 2nd Embodiment of this invention. It is sectional drawing which shows the 2nd Embodiment of this invention. It is sectional drawing which shows the 3rd Embodiment of this invention. It is sectional drawing which shows the 4th Embodiment of this invention. It is sectional drawing which shows the 5th Embodiment of this invention. It is sectional drawing which shows the 6th Embodiment of this invention. It is sectional drawing which shows the 7th Embodiment of this invention. It is a perspective view which shows the 8th Embodiment of this invention.

Explanation of symbols

101 ... Package,
102 ... Package internal wiring,
103… Clamp groove,
104 ... electronic elements,
105 ... Optical element,
106 ... pedestal,
107… Guide hole,
108… Via in the package,
109… Electric connector guide mechanism,
110 ... electrodes,
111… Guide pins,
112 ... Guide hole,
113 ... Optical waveguide core layer,
114: optical waveguide cladding layer,
115 ... mirror surface,
116… Clamp,
117 ... Board,
118 ... In-board wiring,
119 ... electrode,
120 ... Electrode fixing groove,
121… Electric connector,
122 ... electrodes
123… Electronic element,
124 ... Electrodes,
125 ... solder balls,
126… Electrodes,
127 ... electrode,
128 ... via on board,
129 ... Wire,
130: Optical waveguide,
201 ... Guide hole,
202 ... Optical connector,
301 ... mirror surface,
401 ... Optical connector,
501 ... Electrode,
502 ... Electrode fixing groove,
503 ... Guide hole,
601 ... Electrical connector A,
602 ... electrode pins,
603 ... Electrode guide,
604 ... Electric connector B,
605 ... Clamp,
606 ... Clamping hole,
607 ... translucent substrate,
701 ... Electrode,
702 ... Electrode fixing groove,
703 ... Optical connector,
801 ... nuts,
802 ... hole,
803 ... Optical fiber,
804 ... Hold down the package,
805 ... hole,
806 ... Spring,
807 ... Screw.

Claims (14)

A board; an optoelectric package mounted in electrical connection with the board; and a core layer optically coupled to the optoelectric package and provided to surround the core layer. An optical waveguide structure constituted by a plurality of optical waveguides,
An optical element is mounted on the main surface facing the board of the photoelectric package and a first electrode is provided,
The optical waveguide structure is provided with means for bending an optical signal generally perpendicular to the direction of the photoelectric package,
An electrical connector for electrical connection between the first electrode and a second electrode pad provided on the board is provided between the opto-electric package and the board;
The photoelectric package and the board are fixed by a pressing member so that the first electrode and the second electrode are conductively fixed, and the optical waveguide structure and the optical element on the photoelectric package are provided. An optical and electrical module characterized by being optically coupled and fixed.   2. The photoelectric module according to claim 1, wherein an end surface of the core layer of the optical waveguide structure is cut at approximately 45 degrees and reflects light at a substantially right angle.   2. The photoelectric module according to claim 1, wherein a part of the optical waveguide structure is fixed by an optical connector.   4. The photoelectric module according to claim 3, wherein a part of the optical connector is provided with a mirror surface that bends an optical axis of an optical signal passing through the optical waveguide substantially at a right angle.   2. The optoelectric module according to claim 1, wherein the optical connector is provided with means for bending the optical waveguide at a substantially right angle with a constant bending radius.   The photoelectric package is provided with a first guide hole, the optical waveguide or the optical connector is provided with a second guide hole, and the first guide hole and the first guide hole are provided by the same guide pin. The photoelectric module according to claim 1, wherein two guide holes are fitted.   The board is provided with a third guide hole, and the first guide hole, the second guide hole, and the third guide hole are fitted by the same guide pin. 1. The structure according to 1.   2. The photoelectric module according to claim 1, wherein a diameter of the third guide hole is larger than a diameter of the first guide hole and the second guide hole.   The electrical connector is provided with a third electrode and a fourth electrode, and the first electrode and the third electrode or the second electrode and the fourth electrode are in contact with each other to be conducted. The optoelectric module according to claim 1.   2. The photoelectric module according to claim 1, wherein the photoelectric package or the board is provided with means for aligning the electrical connector.   2. The photoelectric module according to claim 1, wherein the electrical connector is electrically connected by being inserted and removed in a direction of the photoelectric package or the board. 3.   The photoelectric module according to claim 1, wherein a conductor is held in the optical waveguide or the optical connector, and the conductor is electrically coupled to the photoelectric module or the board.   A pedestal that is at least thicker than the thickness of the optical element is attached to the main surface of the optoelectric package that faces the board, and the pedestal and the optical waveguide are in contact with each other, or the pedestal and the optical connector are in contact with each other. The optoelectric module according to claim 1, wherein a distance between the optical element and the optical waveguide is positioned.   14. The photoelectric module according to claim 13, wherein the pedestal is a light-transmitting member in a gap between the optical element and the optical waveguide.

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