CN108761668B

CN108761668B - Optical module

Info

Publication number: CN108761668B
Application number: CN201810455917.9A
Authority: CN
Inventors: 谢一帆; 傅钦豪; 唐永正
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2018-05-14
Filing date: 2018-05-14
Publication date: 2020-10-23
Anticipated expiration: 2038-05-14
Also published as: CN108761668A

Abstract

The invention provides an optical module, which comprises an upper shell and a lower shell, wherein a cavity formed by the upper shell and the lower shell is internally provided with a circuit board and an optical device box body. The circuit board stretches into the optical device box body through the box body gap, so that the distance between the circuit board and the optical device box body is greatly shortened, and the circuit board and the optical device box body are in close contact. The circuit board extending into the optical device box body is electrically connected to the laser in a routing mode, so that short-distance routing is realized between the circuit board and the optical device box body, and high-speed signal transmission is facilitated; and the structure between the circuit board and the optical device box body is simple, and the complexity of the optical module is reduced. Because the optical device box body is directly connected with the circuit board in a short-distance routing way, the optical device box body and the circuit board have good impedance matching performance, and the attenuation of photoelectric signals is reduced. The optical module provided by the invention can save the time and material cost for welding the flexible circuit board and reduce the production cost of the optical module.

Description

Optical module

Technical Field

The invention relates to the technical field of communication, in particular to an optical module.

Background

An Active Optical Cable (AOC) is a communication cable that realizes photoelectric conversion by means of an external energy source in a communication process. Generally, an AOC includes an optical fiber and optical modules respectively located at two ends of the optical fiber, and photoelectric conversion can be achieved through connection between the optical fiber and the optical modules.

The optical module is a component for realizing photoelectric conversion in the AOC, namely a transmitting end converts an electric signal into an optical signal and transmits the optical signal through an optical fiber; the receiving end converts the received optical signal into an electrical signal. Generally, an optical module is packaged by using an airtight packaging method, so as to meet the sealing requirement of the optical module in the actual use process. Fig. 1 shows a schematic structural diagram of a light module in the related art. As shown in fig. 1, the optical module includes an upper housing 01, a lower housing 02, an optical device case 03, and a circuit board 04, where the optical device case 03 encapsulates the optical device. The upper shell 01 and the lower shell 02 are buckled to form a closed cavity, and the optical device box body 03 and the circuit board 04 are located in the closed cavity. The end of the circuit board 04 is connected to the flexible circuit board 05, and the flexible circuit board 05 is provided with the ceramic 06 with metal wires, so that the circuit board 04 is connected to the optical device case 03 through the flexible circuit board 05, the ceramic 06 and the metal wires, and the connection between the optical device case 03 and the circuit board 04 is realized.

Since the circuit board 04 is connected to the optical device case 03 through the flexible circuit board 05, the ceramic 06, and the metal wire, there are various components between the optical device case 03 and the circuit board 04, resulting in a long distance between the optical device case 03 and the circuit board 04, a complex optical module structure, and a high cost. And since the photoelectric signal is easy to attenuate when transmitted among various components, the impedance continuity between the optical device case 03 and the circuit board 04 is poor, and the photoelectric conversion efficiency of the optical module is affected.

Disclosure of Invention

The invention provides an optical module, which aims to solve the problem that the existing optical module is complex in structure.

The invention provides an optical module, which comprises an upper shell and a lower shell, wherein a cavity formed by the upper shell and the lower shell is internally provided with a circuit board and an optical device box body; two opposite side walls of the optical device box body are respectively provided with an optical through hole and a box body gap; a lens and a laser are arranged in the optical device box body, and light emitted by the laser is emitted from the optical through hole after passing through the lens; the circuit board stretches into through the box body breach inside the optical device box body, stretch into the circuit board of optical device box body inside is connected to through the routing mode electricity laser instrument.

The technical scheme provided by the embodiment of the invention can have the following beneficial effects:

the invention provides an optical module, which comprises an upper shell, a lower shell, a circuit board and an optical device box body, wherein the circuit board and the optical device box body are positioned in a cavity formed by the upper shell and the lower shell. Two opposite side walls of the optical device box body are respectively provided with an optical through hole and a box body notch, and a lens and a laser are arranged inside the optical device box body. The light emitted by the laser is emitted from the light through hole after passing through the lens. The circuit board stretches into the optical device box body through the box body gap, so that the distance between the circuit board and the optical device box body is greatly shortened, and the circuit board and the optical device box body are in close contact. And the circuit board extending into the optical device box body is electrically connected to the laser in a routing mode, so that short-distance routing is realized between the circuit board and the optical device box body, transmission of high-speed signals is facilitated, the structure between the circuit board and the optical device box body is simple, and the complexity of the optical module is reduced. In addition, because the optical device box body is directly connected with the circuit board in a short-distance routing manner, the optical device box body and the circuit board have good impedance matching performance, and further the attenuation of photoelectric signals is reduced.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as claimed.

Drawings

In order to more clearly explain the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without any creative effort.

FIG. 1 is a schematic diagram of a related art optical module structure;

fig. 2 is an exploded schematic view of an optical module according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a first circuit board and an optical device case provided in an embodiment of the present invention when connected;

fig. 4 is a schematic structural diagram of a second circuit board and an optical device case provided in the embodiment of the present invention when connected;

FIG. 5 is a schematic structural diagram of the optical device case in FIG. 4 without an upper cover according to an embodiment of the present invention;

fig. 6 is a schematic structural diagram of a circuit board according to an embodiment of the present invention;

fig. 7 is an enlarged schematic structural diagram of a connection portion between a circuit board and an optical device case according to an embodiment of the present invention;

FIG. 8 is a schematic diagram of a wire bonding structure according to an embodiment of the present invention;

fig. 9 is a schematic structural diagram of an optical device case provided in an embodiment of the present invention.

Detailed Description

In the existing optical module structure, the end of the circuit board is connected to the flexible circuit board, and the flexible circuit board is provided with ceramic with metal wires, so that the circuit board is connected to the optical device box body through the flexible circuit board, the ceramic and the metal wires, and the connection between the optical device box body and the circuit board is realized. Because the optical device box body is connected with the circuit board through the flexible circuit board, the ceramic and the metal wire, more parts are arranged between the optical device box body and the circuit board, and the structure of the optical module is complex. And since the photoelectric signal is easy to attenuate when being transmitted among various materials, the photoelectric signal between the optical device box body and the circuit board is attenuated more, and the photoelectric conversion efficiency of the optical module is influenced.

In order to solve the above problems, the present application provides an optical module, which has the core idea that: the optical module comprises an upper shell, a lower shell, a circuit board and an optical device box body, wherein the circuit board and the optical device box body are positioned in a cavity formed after the upper shell and the lower shell are buckled. Two opposite side walls of the optical device box body are respectively provided with an optical through hole and a box body notch, and the optical device box body is internally provided with a lens and a laser. The light emitted by the laser is emitted from the light through hole after passing through the lens. The circuit board stretches into the optical device box body through the box body gap, and the circuit board stretching into the optical device box body is electrically connected to the laser in a routing mode. The circuit board stretches into the optical device box body through the box body gap, so that the distance between the circuit board and the optical device box body is greatly shortened, and the circuit board and the optical device box body are in close contact. And the circuit board extending into the optical device box body is electrically connected to the laser in a routing mode, so that short-distance routing is realized between the circuit board and the optical device box body, high-speed signal transmission is facilitated, the structure between the circuit board and the optical device box body is simple, and the complexity of the optical module is reduced. In addition, because the optical device box body is directly connected with the circuit board in a short-distance routing manner, the optical device box body and the circuit board have good impedance matching performance, and the attenuation of photoelectric signals is reduced.

The optical module provided in the present application is described in detail below with reference to specific embodiments and accompanying drawings.

Referring to fig. 2, fig. 2 shows an exploded structural diagram of an optical module provided in the embodiment of the present application. As shown in fig. 2, the optical module provided in the embodiment of the present application includes an upper housing 01, a lower housing 02, a circuit board 1, and an optical device case 2, where the circuit board 1 and the optical device case 2 are located in a cavity formed by the upper housing 01 and the lower housing 02.

Specifically, the upper casing 01 and the lower casing 02 are both hollow casings with open sides in a normal case, and the open sides of the upper casing 01 and the lower casing 02 are arranged oppositely. When the open sides of the upper shell 01 and the lower shell 02 are buckled, a hollow space between the two forms a cavity which can contain components or devices. The circuit board 1 and the optical device box body 2 provided in the embodiment of the present application are located in the cavity formed after the upper casing 01 and the lower casing 02 are buckled, so that the purpose of protecting the circuit board 1 and the optical device box body 2 is achieved through the upper casing 01 and the lower casing 02.

The circuit board 1 generally comprises pads, vias, mounting holes, wires, components, connectors, and the like, and is a support for electronic components in the optical module, that is, a carrier for various circuit chips, signal lines, and the like. The pattern in the circuit board 1 has repeatability and consistency, thereby reducing errors in wiring and assembly and saving time for maintenance, debugging and inspection of the equipment. The circuit board 1 also has the characteristics of high wiring density, small volume and light weight, and is suitable for the miniaturization design of electronic equipment. In addition, the circuit board 1 has high reliability, designability, producibility, assemblability, and the like.

The optical device case 2 has a hollow case structure, typically a rectangular parallelepiped or a cube structure. Usually, be equipped with smooth through-hole 3 and box body breach 4 on two relative lateral walls of optical device box body 2 respectively, and smooth through-hole 3 and box body breach 4 all are linked together with optical device box body 2 is inside. The optical through hole 3 is used for arranging an optical fiber interface, an optical fiber bracket and the like. The box body gap 4 is used for connecting the circuit board 1. A lens (not shown in the figure) and a laser 5 are generally arranged in the optical device case 2, and light emitted by the laser 5 passes through the lens and then is emitted from the optical through hole. That is, the circuit board 1 and various optical devices arranged inside the optical device case 2 interact with each other to transmit and receive optical signals, that is, to realize photoelectric conversion of the optical module.

In the optical module provided in the embodiment of the present application, the circuit board 1 includes the wire bonding circuit board 11 and other circuit boards, wherein the other circuit boards are portions of the circuit board 1 except the wire bonding circuit board 11. When the circuit board 1 and the optical device box body 2 are connected, the circuit board 1 extends into the optical device box body 2 through the box body notch 4, namely, the routing circuit board 11 extends into the optical device box body 2 through the box body notch 4. The circuit board 1 extends into the optical device box body 2 through the box body notch 4, so that the distance between the circuit board 1 and the optical device box body 2 can be greatly reduced, the circuit board 1 is in direct contact with the optical device box body 2, and the size of the optical module is reduced. After the routing circuit board 11 extends into the optical device box body 2 through the box body notch 4, the routing circuit board 11 is electrically connected to the laser 5 inside the optical device box body 2 in a routing mode. The routing mode is a mode that the metal wire completes wiring connection inside a solid circuit in the microelectronic device by utilizing a hot pressing or ultrasonic energy source. Because the direct contact between circuit board 1 and the optical device box body 2, consequently, can realize the short distance routing between routing circuit board 11 and the optical device box body 2, realize the short distance routing between circuit board 1 and the optical device box body 2 promptly, and then be favorable to the transmission of high-speed signal. And because the routing circuit board 11 is directly routed and electrically connected with the laser 5 in the optical device box body 2, the circuit board 1 and the optical device box body 2 have good impedance matching performance, so that the attenuation of photoelectric signals is reduced, and the photoelectric conversion efficiency of the optical module is improved.

Specifically, referring to fig. 3, fig. 3 is a schematic structural diagram illustrating a first circuit board and an optical device case when they are connected. As shown in fig. 3, the width or end width of the circuit board 1 is smaller than or equal to the width between the two inner sidewalls of the optical device case 2, and at this time, the routing circuit board 11 is the end of the circuit board 1. When the routing circuit board 11 extends into the optical device box body 2 through the box body notch 4, the whole end part of the circuit board 1 enters into the optical device box body 2, and close-distance contact between the circuit board 1 and the optical device box body 2 is realized. The structure of the first circuit board 1 and the optical device case 2 provided in the embodiment of the present application when connected is suitable for the case where the volume of the circuit board 1 or the volume of the end portion is smaller than the width of the optical device case 2.

Referring to fig. 4 and 5, fig. 4 is a schematic structural diagram illustrating a second circuit board and an optical device case when they are connected; fig. 5 is a schematic structural view of the optical device case of fig. 4 without an upper cover. As shown in fig. 4 and 5, the width of the circuit board 1 is greater than the width of the optical device case 2, and at this time, the circuit board 1 cannot enter the optical device case 2. For the case that the width of the circuit board 1 is greater than the width of the optical device case 2, in the embodiment of the present application, a circuit board notch 6 is provided at the end of the circuit board 1. At this time, the circuit board located at the circuit board gap 6 and extending into the optical device case 2 is the routing circuit board 11, as shown in fig. 6. When the end of the circuit board 1 is provided with the circuit board gap 6, the optical device box body 2 can be arranged at the circuit board gap 6, and the routing circuit board 11 extends into the optical device box body 2 through the box body gap 6.

The first structure when being connected with circuit board 1 and optical device box body 2 that this application embodiment provided is the same, is located circuit board breach 6 department when optical device box body 2, and routing circuit board 11 stretches into the inside back of optical device box body 2 through box body breach 6, and various electronic components that set up on the circuit board 1 can shorten with the distance between the various optical devices of optical device box body 2 inside. The structure of the second circuit board 1 and the optical device case 2 provided in the embodiment of the present application when connected is suitable for the case where the volume of the circuit board 1 or the volume of the end portion is larger than the width of the optical device case 2.

The connection mode between two kinds of circuit boards 1 and the optical device box body 2 that above-mentioned embodiment provided all can realize that circuit board 1 stretches into the inside of optical device box body 2 through box body breach 4, and then makes the distance between circuit board 1 and the optical device box body 2 inside shorten greatly for circuit board 1 and optical device box body 2 realize closely contacting. However, the connection mode between the circuit board 1 and the optical device case 2 provided in the embodiment of the present application is not limited to the two specific embodiments, as long as the circuit board 1 can extend into the optical device case 2 through the case notch 4, for example, the optical device case 2 is placed in the center of the circuit board 1.

For the optical module in the related art shown in fig. 1, since the circuit board 04 is connected to the optical device case 03 through the flexible circuit board 05, the ceramic 06, and the metal wire, the distance between the circuit board 04 and the optical device case 03 is long, and there are many components between the two. Meanwhile, the optical module is usually located outdoors, in places with more dust or higher humidity in the using process, if pollutants such as dust or water vapor enter between the circuit board 04 and the optical device box body 03, the pollutants such as dust or water vapor easily enter into the optical device box body 03 to pollute each optical device in the optical device box body 03, so that the electric signal transmitted between the circuit board 04 and the optical device box body 03 is greatly attenuated, and data transmission is influenced. Therefore, in the existing optical module, the circuit board 04, the flexible circuit board 05, the ceramic 06, the metal wires, and the optical device case 03 are packaged by using an airtight packaging technology, so as to prevent contaminants such as dust or water vapor from entering between the circuit board 04 and the optical device case 03 from any connection position of the circuit board 04, the flexible circuit board 05, the ceramic 06, the metal wires, and the optical device case 03.

For the optical module provided by the embodiment of the application, the routing circuit board 11 extends into the optical device box body 2 through the box body notch 4 on the optical device box body 2, so that the circuit board 1 is in direct contact with the optical device box body 2. And because the circuit board 1 and the optical device box body 2 are directly connected by short-distance wire bonding, and no other part exists between the circuit board 1 and the optical device box body 2, the circuit board 1 and the optical device box body 2 can be packaged in a non-airtight packaging mode. In the embodiment of the application, the non-airtight sealing of the optical device box body 2 is realized by coating the sealing glue at the joint of the circuit board 1 and the box body notch 4.

Because the sealant for non-airtight packaging is mostly resin material, under some circumstances, a small amount of gas-liquid such as water vapor may enter between the circuit board 1 and the optical device case 2 from the sealant, and then enter inside the optical device case 2, so as to contaminate each optical device inside the optical device case 2, and further affect the electrical signal transmission between the circuit board 1 and the optical device case 2. Therefore, in order to prevent the gas-liquid such as water vapor from entering the optical device case 2 and then contaminating the optical devices therein, a drying agent (not shown in the drawings) is further disposed inside the optical device case 2 for absorbing the gas-liquid such as water vapor entering the optical device case 2.

Further, in order to better absorb gas and liquid such as water vapor entering the interior of the optical device case 2, a desiccant is usually disposed at the case notch 4 and the optical through hole 3. If desired, a desiccant may also be provided at the inner sidewalls of the optics box 2 to prevent the desiccant from affecting the light transmission between the optics inside the optics box 2.

To in the second kind of circuit board and optical device box body connected mode that this application embodiment provided, when circuit board breach 6 departments are arranged in to optical device box body 2, stretch into optical device box body 2 inside through box body breach 4 for being convenient for with routing circuit board 11, circuit board 1 sets up circuit board breach 6 departments and still is equipped with two draw-in grooves 8, and two draw-in grooves 8 all run through circuit board 1. The circuit board between the two card slots 8 is the routing circuit board 11, as shown in fig. 6. The arrangement of the two clamping grooves 8 enables the routing circuit board 11 to protrude out of the circuit board notch 6, so that the routing circuit board 11 can conveniently stretch into the optical device box body 2 through the box body notch 4, and close-distance contact between the circuit board 1 and the optical device box body 2 is achieved.

In the embodiment of the present application, the shape of the routing circuit board 11 is set according to the opening shape of the box body notch 4, so that the circuit board 1 can smoothly extend into the optical device box body 2 through the box body notch 4. The shape of the box body notch 4 is not limited in the embodiment of the present application.

Referring to fig. 7, fig. 7 is a detailed structural diagram showing the connection between the circuit board 1 and the optical device case 2. As can be seen from fig. 6, the routing circuit board 11 extends into the optical device case 2 through the case notch 4. The interior of the optics box 2 is provided with a plurality of lasers 5 arranged in a row. Each laser 5 includes a ceramic base 51 and a laser chip 52 disposed on the upper surface of the ceramic base 51, please refer to fig. 8.

The routing circuit board 11 is provided with a positive electrode pad 101 and a negative electrode pad 102. The upper surface of the laser chip 52 is a positive electrode, and the lower surface is a negative electrode. The ceramic base 51 is coated with a metal conductive layer on the upper surface. Meanwhile, two grooves 53 are further formed on the upper surface of the ceramic base 51, and the two grooves 53 are perpendicular to the laser chip 52. Since the two grooves 53 are located on the upper surface of the ceramic base 51, the metal conductive layer is divided into two metal conductive regions, i.e., the region between the two grooves 53 is the first metal conductive region 54, and the other region on the upper surface of the ceramic base 51 is the second metal conductive region 55.

At the time of circuit connection, since the laser chip 52 is located on the upper surface of the ceramic submount 51, the direct contact of the laser chip 52 and the ceramic submount 51 enables the electrical connection of the cathode of the laser chip 52 and the second metal conduction region 55. The positive electrode of the laser chip 52 is electrically connected to the first metal conductive area 54 through a metal wire, and the first metal conductive area 54 is electrically connected to the negative electrode pad 102 of the wire bonding circuit board 11 through wire bonding. In addition, the second metal conductive area 55 is electrically connected to the positive electrode pad 101 of the wire bonding circuit board 11 by wire bonding. Because ceramic base 51 and laser instrument chip 52 electricity are connected, and ceramic base 51 and circuit board 1 pass through metal wire 9 routing connection, from this, can realize the routing connection between routing circuit board 11 and the laser instrument 5, and then realize the direct routing connection between circuit board 1 and the laser instrument 5.

Further, in the embodiment of the present application, the metal line 9 is a high-speed signal line, so that the transmission of a high-speed signal between the circuit board 1 and the laser 5 is realized through the high-speed signal line. The high-speed signal line has higher photoelectric signal transmission efficiency. The optical module provided by the embodiment of the application can transmit signals with higher requirements on time sequence and frequency through the arrangement of the high-speed signal line, and the practicability of the optical module is enhanced. In addition, since the routing circuit board 11 in the embodiment of the present application extends into the optical device case 2, the length of the required high-speed signal line is short. The shorter the transmission distance, the higher the transmission efficiency. Therefore, in the embodiment of the present application, the routing circuit board 11 extends into the optical device case 2, and the routing circuit board 11 is electrically connected to the laser 5 through the high-speed signal line, so that the transmission efficiency of the optical module is higher, and the optical module can be more suitable for the transmission of signals with higher requirements on timing and frequency.

In addition, since the circuit board 11 is electrically connected to the laser 5 by wire bonding through the metal wire 9, the electro-optical transmission between the circuit board 11 and the laser 5 is prone to generate electromagnetic signals. The generated electromagnetic signals easily affect the normal operation of each component on the circuit board 1 and the optical transmission between each optical device inside the optical device box body 2, so the electromagnetic signals generated between the routing circuit board 11 and the laser 5 need to be shielded.

In view of the above problem, in the embodiment of the present application, the surface of the circuit board 1 is provided with the metal layer 10, as shown in fig. 6. The metal layer 10 is in contact with the optical device case 2, and the metal layer 10 is grounded, at this time, the optical device case 2 is grounded through the metal layer 10. When an electromagnetic signal is generated between the routing circuit board 11 and the laser 5, the generated electromagnetic signal is guided to the ground through the metal layer 10, so that the electromagnetic signal is prevented from influencing the normal work of all components on the circuit board 1 and inside the optical device box body 2. To facilitate the contacting of the metal layer 10 with the optics box 2, the metal layer 10 is preferably arranged on the circuit board 1 laterally to the circuit board gap 6.

For the second structure when circuit board 1 and the optical device box body 2 that provide in the embodiment of this application are connected, when the width of circuit board breach 6 equals the width of optical device box body 2, can be with the joint of optical device box body 2 in circuit board breach 6 department to realize the fixed connection between circuit board 1 and the optical device box body 2.

Because the circuit board gap 6 is equal to the width of the optical device case 2, when the circuit board 1 and the optical device case 2 are assembled, if the positions of the circuit board 1 and the optical device case 2 are not corresponding, the situations of slow assembly and unsmooth clamping are easy to occur. Therefore, in order to solve the above problem, in the optical module provided in the embodiment of the present application, the two opposite outer sidewalls of the optical device case 2 are respectively provided with the sliding channel 7, and the sliding channel 7 and the case notch 4 are located on different sidewalls of the optical device case 2, as shown in fig. 9. When the two opposite outer side walls of the optical device case 2 are respectively provided with the sliding channels 7, the circuit board 1 clamps the optical device case 2 at the circuit board notch 6 through the two sliding channels 7.

Specifically, the sliding channels 7 are used to realize the components of the circuit board 1 for clamping the optical device case 2, that is, the circuit board 1 clamps the optical device case 2 at the circuit board notch 6 through the two sliding channels 7. Usually, the circuit board 1 is a plate-type structural member, and therefore, in order to facilitate smooth sliding of the circuit board 1 into the slide channels 7, both of the slide channels 7 are straight channels. Meanwhile, the circuit board 1 is generally a flat plate-type structural component, and therefore, the two sliding channels 7 are arranged in parallel and located on the same plane, so that the circuit board 1 clamps the optical device case 2 at the circuit board gap 6 through the two sliding channels 7.

When the circuit board 1 clamps the optical device case 2 at the circuit board notch 6 through the two sliding channels 7, in order to facilitate the circuit board 1 to slide into the sliding channels 7, the width of the sliding channels 7 in the vertical direction should be greater than or equal to the thickness of the circuit board 1. Further, for the convenience of the arrangement of the sliding channels 7, the two sliding channels 7 are both concave in the outer side wall of the optical device box body 2.

Furthermore, in order to facilitate the circuit board 1 to clamp the optical device case 2 at the circuit board gap 6 through the two sliding channels 7, and the routing circuit board 11 extends into the optical device case 2 through the case gap 4, in the embodiment of the present application, the case gap 4 and the two sliding channels 7 are located on the same horizontal plane, and the case gap 4 is respectively communicated with the two sliding channels 7, as shown in fig. 9. The arrangement mode can facilitate the processing of the optical device box body 2 and the extension of the routing circuit board 11 into the optical device box body 2.

When the circuit board 1 clamps the optical device box body 2 at the circuit board gap 6 through the two sliding channels 7, the routing circuit board 11 extends into the optical device box body 2 through the box body gap 4, and after the routing circuit board 11 is electrically connected to the laser 5 in a routing mode, the joint of the circuit board 1 and the box body gap 4 is coated with sealant so as to realize non-air-tight sealing on the optical device box body 2.

Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.

It is to be understood that relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. The invention is not limited to the precise arrangements described above and shown in the drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the invention is limited only by the appended claims.

Claims

1. An optical module is characterized by comprising an upper shell and a lower shell, wherein a cavity formed by the upper shell and the lower shell is internally provided with a circuit board and an optical device box body; two opposite side walls of the optical device box body are respectively provided with an optical through hole and a box body gap; a lens and a laser are arranged in the optical device box body, and light emitted by the laser is emitted from the optical through hole after passing through the lens;

a circuit board notch is formed in the end part of the circuit board, and clamping grooves penetrating through the circuit board are formed in two corners of the circuit board notch respectively;

the optical device box body is arranged at the notch of the circuit board, the circuit board between the two clamping grooves extends into the optical device box body through the notch of the box body, and the circuit board inside the optical device box body is electrically connected to the laser in a routing mode.

2. The optical module as claimed in claim 1, wherein a sealant is applied to a junction of the case gap and the circuit board to seal the optical device case.

3. The optical module according to claim 1, wherein two opposite side walls of the optical device case are respectively provided with a sliding channel, and the sliding channel and the case gap are located on different side walls of the optical device case; the circuit board clamps the optical device box body through the sliding channel.

4. The optical module according to claim 1, wherein a metal layer is provided on the circuit board on a side of the circuit board gap, the metal layer being in contact with the optical device case, the metal layer being provided to be grounded.

5. A light module as claimed in claim 1 or 2, characterized in that a desiccant is provided inside the light module housing.

6. The optical module of claim 1, wherein the electrical connection wires formed by wire bonding are used for transmitting high-speed signals.

7. The light module of claim 3, wherein the sliding channel is recessed within an outer sidewall of the light module case.

8. The optical module of claim 3, wherein a width of the sliding channel in a vertical direction is greater than or equal to a thickness of the circuit board.

9. The optical module according to claim 3, wherein the box gap is located on the same horizontal plane as the two sliding channels, and the box gap is respectively communicated with the two sliding channels.