CN108761668A - A kind of optical module - Google Patents
A kind of optical module Download PDFInfo
- Publication number
- CN108761668A CN108761668A CN201810455917.9A CN201810455917A CN108761668A CN 108761668 A CN108761668 A CN 108761668A CN 201810455917 A CN201810455917 A CN 201810455917A CN 108761668 A CN108761668 A CN 108761668A
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- China
- Prior art keywords
- box body
- circuit board
- optical device
- device box
- notch
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4296—Coupling light guides with opto-electronic elements coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The present invention provides a kind of optical module, which includes upper shell and lower housing, and circuit board and optical device box body are equipped in the cavity that upper shell and lower housing are formed.Circuit board extend into optical device tray interior by box body notch, this greatly shortens the distance between circuit board and optical device box body so that circuit board and optical device box body realize close contact.The circuit board for extending into optical device tray interior is electrically connected to laser by routing mode, this not only to realize short distance routing between circuit board and optical device box body, is conducive to the transmission of high speed signal;Also so that the structure between circuit board and optical device box body is simple, the complexity of optical module is reduced.Due to direct short distance routing connection between optical device box body and circuit board, there is good impedance matching between optical device box body and circuit board, reduce the decaying of photosignal.Optical module provided by the invention can also save time and the Material Cost of flexible PCB welding, reduce the production cost of optical module.
Description
Technical field
The present invention relates to field of communication technology more particularly to a kind of optical modules.
Background technology
Active optical cable (Active Optical Cables, AOC) is to realize that photoelectricity turns by extra power in communication process
The communications cable changed.In general, AOC includes optical fiber and the optical module for being located at optical fiber both ends, pass through optical fiber and optical module
Connection can realize opto-electronic conversion.
Optical module is the component that opto-electronic conversion is realized in AOC, i.e., transmitting terminal converts electrical signals to optical signal, and passes through light
Fibre transmission;The optical signal received is converted to electric signal by receiving terminal.In general, optical module is sealed using air-tight packaging method
Dress, to reach the sealing demand of optical module in actual use.Attached drawing 1 shows existing optical module a kind of in the related technology
Structural schematic diagram.By attached drawing 1 it is found that optical module includes upper shell 01, lower housing 02, optical device box body 03 and circuit board
04, wherein 03 enclosed inside optical device of optical device box body.Upper shell 01 and lower housing 02 form closed cavity, light device after fastening
Part box body 03 and circuit board 04 are located in the closed cavity.The end of circuit board 04 connects flexible PCB 05, and flexible circuit
The ceramics 06 of metal wire are provided on plate 05, therefore, circuit board 04 is connected by flexible PCB 05, ceramics 06 and metal wire
It is connected to optical device box body 03, realizes the connection between optical device box body 03 and circuit board 04.
Since circuit board 04 is connected to optical device box body 03 by flexible PCB 05, ceramics 06 and metal wire, thus
There are a variety of components between optical device box body 03 and circuit board 04, cause between optical device box body 03 and circuit board 04 distance compared with
Far, optical module structure is complicated, and cost is higher.Again due to being easy to cause photosignal when photosignal transmits between a variety of components
Decaying, thus the impedance continuity between optical device box body 03 and circuit board 04 is poor, influences the photoelectric conversion efficiency of optical module.
Invention content
The present invention provides a kind of optical module, to solve the problems, such as that existing optical module structure is complicated.
The present invention provides a kind of optical module, including upper shell and lower housing, what the upper shell and the lower housing were formed
Circuit board and optical device box body are equipped in cavity;It is respectively equipped with light through-hole and box in the opposite two side walls of the optical device box body
Body notch;The optical device tray interior be equipped with lens and laser, the light that the laser is sent out after the lens by
The smooth through-hole projects;The circuit board extend into the optical device tray interior by the box body notch, extend into described
The circuit board of optical device tray interior is electrically connected to the laser by routing mode.
The technical solution that the embodiment of the present invention provides can include the following benefits:
The present invention provides a kind of optical module, which includes upper shell, lower housing and be located at upper shell and lower housing
Form the circuit board and optical device box body in cavity.It is respectively equipped with light through-hole and box body in the opposite two side walls of optical device box body
Notch, optical device tray interior are equipped with lens and laser.The light that laser is sent out is projected after lens by light through-hole.Circuit
Plate extend into optical device tray interior by box body notch, this greatly shortens the distance between circuit board and optical device box body, makes
It obtains circuit board and optical device box body realizes close contact.Pass through routing due to extending into the circuit board of optical device tray interior again
Mode is electrically connected to laser, and therefore, this not only to realize short distance routing between circuit board and optical device box body, is conducive to
The transmission of high speed signal reduces the complicated journey of optical module so that the structure between circuit board and optical device box body is simple
Degree.In addition, due to direct short distance routing connection between optical device box body and circuit board, optical device box body and circuit board
Between have good impedance matching, and then reduce photosignal decaying.
It should be understood that above general description and following detailed description is only exemplary and explanatory, not
It can the limitation present invention.
Description of the drawings
In order to illustrate more clearly of the technical solution of the application, letter will be made to attached drawing needed in the embodiment below
Singly introduce, it should be apparent that, for those of ordinary skills, without having to pay creative labor,
Other drawings may also be obtained based on these drawings.
Fig. 1 is the optical module structure schematic diagram of related art;
Fig. 2 is the configuration schematic diagram of optical module provided in an embodiment of the present invention;
Fig. 3 is structural schematic diagram when the first circuit board provided in an embodiment of the present invention is connected with optical device box body;
Fig. 4 is structural schematic diagram when second of circuit board provided in an embodiment of the present invention is connected with optical device box body;
Fig. 5 is structural schematic diagram when optical device box body is without upper cover in Fig. 4 provided in an embodiment of the present invention;
Fig. 6 is the structural schematic diagram of circuit board provided in an embodiment of the present invention;
Fig. 7 is the enlarged structure schematic diagram of circuit board provided in an embodiment of the present invention and optical device box connection;
Fig. 8 is structural schematic diagram when routing provided in an embodiment of the present invention connects;
Fig. 9 is the structural schematic diagram of optical device box body provided in an embodiment of the present invention.
Specific implementation mode
In existing optical module structure, the end of circuit board connects flexible PCB, and gold is provided on flexible PCB
Belong to the ceramics of line, therefore, circuit board is connected to optical device box body by flexible PCB, ceramics and metal wire, realizes light device
Connection between part box body and circuit board.Due to passing through flexible PCB, ceramics and gold between optical device box body and circuit board
Belong to line and realizes connection, thus the component between optical device box body and circuit board is more, causes optical module structure complicated.Again due to light
Electric signal is easy to cause photosignal decaying, thus the light between optical device box body and circuit board when being transmitted between multiple material
Electric signal decaying is more, influences the photoelectric conversion efficiency of optical module.
In view of the above-mentioned problems, the application provides a kind of optical module, the core concept of the optical module is:Optical module includes upper casing
Body, lower housing and the circuit board in formed cavity after upper shell and lower housing fastening and optical device box body.Optical device
Light through-hole and box body notch are respectively equipped in the opposite two side walls of box body, and optical device tray interior is equipped with lens and laser
Device.The light that laser is sent out is projected after lens by light through-hole.Circuit board is extend by box body notch in optical device box body
Portion, and the circuit board for extending into optical device tray interior is electrically connected to laser by routing mode.Circuit board is lacked by box body
Mouth extend into optical device tray interior, this greatly shortens the distance between circuit board and optical device box body so that circuit board and light
Device box body realizes close contact.It is electrically connected to again by routing mode due to extending into the circuit board of optical device tray interior
Laser, therefore, this not only to realize short distance routing between circuit board and optical device box body, and then is conducive to high speed signal
Transmission reduce the complexity of optical module so that the structure between circuit board and optical device box body is simple.In addition,
Since direct short distance routing connects between optical device box body and circuit board, have between optical device box body and circuit board
Good impedance matching reduces the decaying of photosignal.
Optical module provided by the present application is described in detail in a manner of specific embodiment combination attached drawing below.
Attached drawing 2 is please referred to, attached drawing 2 shows the configuration schematic diagram of optical module provided by the embodiments of the present application.By attached
Fig. 2 it is found that optical module provided by the embodiments of the present application includes upper shell 01, lower housing 02, circuit board 1 and optical device box body 2, and
Circuit board 1 and optical device box body 2 are located at upper shell 01 and lower housing 02 is formed by cavity.
Specifically, upper shell 01 and lower housing 02 are the hollow housing of a lateral opening in general, and on
The side that shell 01 and lower housing 02 are open is oppositely arranged.When the side that upper shell 01 and lower housing 02 are open fastens, the two
Between middle vacancy formed can be with containing component or the cavity of device.The circuit board 1 and optical device provided in the embodiment of the present application
Box body 2 is formed by after being just located at upper shell 01 and the fastening of lower housing 02 in cavity, in order to pass through upper shell 01 and lower housing
02 achievees the purpose that protection circuit plates 1 and optical device box body 2.
Circuit board 1 is usually made of pad, via, mounting hole, conducting wire, component and connector etc., is in optical module
The carrier of the supporter of electronic component, as various circuit chips and signal wire etc..Figure in circuit board 1 has repeatability
And consistency, it is thus possible to reduce mistake when wiring and assembly, save the repair, debugging and review time of equipment.Circuit board 1
Also have the characteristics that wiring density is high, small, light-weight, is suitable for the Miniaturization Design of electronic equipment.In addition, circuit board 1
Also have the characteristics that high reliability, designability, productibility and composability.
Optical device box body 2 is hollow box construction, usually cuboid or cube structure.In general, 2 phase of optical device box body
To two side walls on be respectively equipped with light through-hole 3 and box body notch 4, and light through-hole 3 and box body notch 4 with optical device box body 2
Inside is connected.Light through-hole 3 is for being arranged optical fiber interface and structure of fiber_optic etc..Box body notch 4 is for connecting circuit board 1.In light
Lens (not shown) and laser 5 are usually provided with inside device box body 2, the light that laser 5 is sent out is after lens
It is projected by light through-hole.Pass through the interaction energy between the various optical devices of 2 inside setting of circuit board 1 and optical device box body
It enough realizes the transmitting and reception of optical signal, that is, realizes the opto-electronic conversion of optical module.
In the optical module provided in the embodiment of the present application, circuit board 1 includes routing circuit board 11 and other circuit boards,
In, other circuit boards are the part in addition to routing circuit board 11 in circuit board 1.Circuit board 1 and optical device box body 2 are connecting
When, circuit board 1 extend into the inside of optical device box body 2 by box body notch 4, i.e. routing circuit board 11 is stretched by box body notch 4
Enter to the inside of optical device box body 2.Circuit board 1 extend into the inside of optical device box body 2 by box body notch 4, can subtract significantly
The distance between small circuit board 1 and optical device box body 2 realize being in direct contact between circuit board 1 and optical device box body 2, reduce
The volume of optical module.After routing circuit board 11 extend into the inside of optical device box body 2 by box body notch 4, routing circuit board 11
It is electrically connected on the laser 5 inside optical device box body 2 by routing mode.Wherein, routing mode is that wire utilizes hot pressing
Or the ultrasonic energy completes the mode of the wiring connection in microelectronic component inside solid-state circuit.Due to circuit board 1 and optical device box
Therefore being in direct contact between body 2 can realize short distance routing, i.e. circuit between routing circuit board 11 and optical device box body 2
Short distance routing is realized between plate 1 and optical device box body 2, and then is conducive to the transmission of high speed signal.Again due to routing circuit board
Laser 5 inside 11 direct routing electrical connection optical device box bodys 2, therefore, circuit board 1 and optical device box body have between 2 inside
There is good impedance matching, and then reduce the decaying of photosignal, improves the photoelectric conversion efficiency of optical module.
Specifically, attached drawing 3 is please referred to, attached drawing 3 shows that structure when the first circuit board is connected with optical device box body is shown
It is intended to.As shown in Fig. 3, the width of circuit board 1 or end portion width are less than or equal in optical device box body 2 between two madial walls
Width, at this point, routing circuit board 11 be circuit board 1 end.When routing circuit board 11 extend into light device by box body notch 4
When the inside of part box body 2, the entire end of circuit board 1 enters the inside of optical device box body 2, realizes circuit board 1 and optical device
Close contact between box body 2.Knot when the first circuit board 1 and optical device box body 2 connection provided in the embodiment of the present application
Structure is suitable for the case where 1 volume of circuit board or end volume are less than optical device 2 width of box body.
Please refer to attached drawing 4,5, wherein attached drawing 4 shows that structure when second of circuit board is connected with optical device box body is shown
It is intended to;Attached drawing 5 shows structural schematic diagram when optical device box body is without upper cover in attached drawing 4.As shown in attached drawing 4,5, circuit board 1
Width is more than the width of optical device box body 2, at this point, circuit board 1 cannot be introduced into inside optical device box body 2.For the width of circuit board 1
The case where being more than optical device 2 width of box body is spent, in the embodiment of the present application, circuit board notch 6 is equipped in the end of circuit board 1.This
When, at circuit board notch 6 and the partial circuit plate that extend into inside optical device box body 2 is routing circuit board 11, such as attached drawing 6
It is shown.When the end of circuit board 1 is equipped with circuit board notch 6, optical device box body 2 can be arranged at circuit board notch 6, and will
Routing circuit board 11 is extend by box body notch 6 inside optical device box body 2.
The first structure when being connected with optical device box body 2 with circuit board 1 provided by the embodiments of the present application is identical, works as light
Device box body 2 is located at circuit board notch 6, and routing circuit board 11 is extend by box body notch 6 inside optical device box body 2
Afterwards, the various electronic components being arranged on circuit board 1 can contract with the distance between the various optical devices inside optical device box body 2
It is short.Structure when second of circuit board 1 and optical device box body 2 connection provided in the embodiment of the present application is suitable for 1 body of circuit board
The case where product or end volume are more than optical device 2 width of box body.
Connection type between two kinds of circuit boards 1 and optical device box body 2 that above-described embodiment provides can realize circuit
Plate 1 extend into the inside of optical device box body 2 by box body notch 4, so that between 2 inside of circuit board 1 and optical device box body
Distance greatly shorten so that circuit board 1 and optical device box body 2 realize close contact.But electricity provided by the embodiments of the present application
Connection type between road plate 1 and optical device box body 2 is not limited to above two specific implementation mode, as long as electricity can be realized
Road plate 1 extend into the inside of optical device box body 2 by box body notch 4, and such as optical device box body 2 is placed in circuit board 1
Heart position.
For attached existing optical module in the related technology shown in FIG. 1, since circuit board 04 passes through flexible PCB 05, pottery
Porcelain 06 and metal wire are connected to optical device box body 03, therefore, the distance between circuit board 04 and optical device box body 03 farther out, and
Component between the two is more.Meanwhile optical module will be normally at that outdoor, dust is more or humidity is larger in use
In place, if entering the pollutants such as dust or steam, the pollutions such as dust or steam between circuit board 04 and optical device box body 03
Object easily enters inside optical device box body 03, and each optical device inside pollution optical device box body 03 leads to circuit board 04 and optical device
The electric signal transmitted between box body 03 will be greatly attenuated, and influence data transmission.Therefore, circuit board 04, soft in existing optical module
Property circuit board 05, ceramics 06, be packaged using air-tight packaging technology between metal wire and optical device box body 03, to completely cut off powder
Arbitrary connection of the pollutants such as dirt or steam from circuit board 04, flexible PCB 05, ceramics 06, metal wire and optical device box body 03
Place enters between circuit board 04 and optical device box body 03.
And for optical module provided by the embodiments of the present application, since routing circuit board 11 passes through the box on optical device box body 2
Body notch 4 extend into the inside of optical device box body 2, and therefore, circuit board 1 and optical device box body 2 are in direct contact.Again due to circuit board
1 connects with 2 direct short distance routing of optical device box body, and other component is not present between circuit board 1 and optical device box body 2, because
This, the encapsulation between circuit board 1 and optical device box body 2 just can be realized by non-airtight packaged type.Implement in the application
In example, by applying fluid sealant in the junction of circuit board 1 and box body notch 4, to realize the non-airtight of sun adjuster part box body 2
Sealing.
Since the fluid sealant of non-airtight encapsulation is mostly resinous matter, in some cases, the gas such as a small amount of steam
Liquid may enter between circuit board 1 and optical device box body 2 from fluid sealant, and then enter the inside of optical device box body 2,
Each optical device inside optical device box body 2 is polluted, and then influences the electric signal transmission between circuit board 1 and optical device box body 2.Cause
This, pollutes internal each optical device, inside optical device box body 2 to prevent the gas-liquids such as steam from entering behind 2 inside of optical device box body
It is additionally provided with drier (not shown), for being absorbed into the gas-liquids such as the steam inside optical device box body 2.
Further, it is generally arranged to be preferably absorbed into gas-liquids, the drier such as the steam inside optical device box body 2
At box body notch 4 and light through-hole 3.If necessary, drier can also be arranged at the madial wall of optical device box body 2, to prevent
Only drier influences the optical transport between the 2 each optical device in inside of optical device box body.
For in second of circuit board provided by the embodiments of the present application and optical device box body connection type, when optical device box body
2 when being placed at circuit board notch 6, for ease of routing circuit board 11 is extend by box body notch 4 inside optical device box body 2,
Circuit board 1, which is arranged at circuit board notch 6, is additionally provided with two card slots 8, and two card slots 8 run through circuit board 1.Two card slots 8 it
Between circuit board be routing circuit board 11, as shown in Fig. 6.The setting of two card slots 8 makes routing circuit board 11 protrude from
Circuit board notch 6, and then convenient for routing circuit board 11 to be extend by box body notch 4 inside optical device box body 2, realize circuit
Close contact between plate 1 and optical device box body 2.
In the embodiment of the present application, the shape of routing circuit board 11 is arranged according to the opening shape of box body notch 4, in order to
Circuit board 1 can pass through box body notch 4 and extend into inside optical device box body 2.The embodiment of the present application is not to box body notch 4
Shape is defined.
Attached drawing 7 is please referred to, attached drawing 7 shows the detail structure diagram that circuit board 1 is connect with optical device box body 2.It can by attached drawing 6
Know, routing circuit board 11 extend into the inside of optical device box body 2 by box body notch 4.The row of being internally provided with of optical device box body 2
For multiple lasers 5 of a row.Each laser 5 respectively including base of ceramic 51 and is set to 51 upper surface of base of ceramic
Chip of laser 52, please refer to attached drawing 8.
Routing circuit board 11 is equipped with anode electrode pad 101 and negative electrode pad 102.The upper table of chip of laser 52
Face is anode, and lower surface is cathode.Base of ceramic is coated with metal conducting layer on 51 upper surface.Meanwhile 51 upper surface of base of ceramic
On be additionally provided with two grooves 53, two grooves 53 are perpendicular to chip of laser 52.Since two grooves 53 are located at base of ceramic 51
On upper surface, therefore, metal conducting layer is divided into Liang Ge metallic conductions area, i.e. region between two grooves 53 is that the first metal is led
Other regions in electric area 54,51 upper surface of base of ceramic are the second metallic conduction area 55.
When circuit connects, since chip of laser 52 is located on 51 upper surface of base of ceramic, thus chip of laser 52
Being electrically connected for 52 cathode of chip of laser and the second metallic conduction area 55 can be realized with being in direct contact for base of ceramic 51.Laser
The anode of device chip 52 is electrically connected to the first metallic conduction area 54 by metal wire, and the first metallic conduction area 54 passes through routing side
Formula is electrically connected to the negative electrode pad 102 of routing circuit board 11.In addition, the second metallic conduction area 55 also passes through routing mode electricity
It is connected to the anode electrode pad 101 of routing circuit board 11.Since base of ceramic 51 and chip of laser 52 are electrically connected, and ceramics
Pedestal 51 is connect with circuit board 1 by 9 routing of metal wire, and thereby, it is possible to realize beating between routing circuit board 11 and laser 5
Line connects, and then realizes the direct routing connection between circuit board 1 and laser 5.
Further, in the embodiment of the present application, metal wire 9 is HW High Way, in order to be realized by HW High Way
The transmission of high speed signal between circuit board 1 and laser 5.HW High Way has higher photosignal efficiency of transmission.Pass through
The setting of HW High Way enables to optical module transmission provided by the embodiments of the present application to sequential and the higher letter of frequency requirement
Number, enhance the practicability of optical module.In addition, due in the embodiment of the present application routing circuit board 11 extend into optical device box body 2
Inside, therefore, the length of required HW High Way are shorter.Since transmission range is shorter, efficiency of transmission is higher.Therefore, originally
Routing circuit board 11 extend into the inside of optical device box body 2 in application embodiment, and routing circuit board 11 passes through HW High Way
The mode that routing is electrically connected to laser 5 enables to the efficiency of transmission higher of optical module, is suitable for wanting sequential and frequency
Ask the transmission of higher signal.
In addition, since routing circuit board 11 by 9 routing of metal wire is electrically connected to laser 5, routing circuit board 11
Photoelectricity transmission between laser 5 easy tos produce electromagnetic signal.The electromagnetic signal of generation is easy to influence each first device on circuit board 1
Optical transport between the 2 each optical device in inside of the normal work of part and optical device box body, therefore, it is necessary to by routing circuit board 11 with
The electromagnetic signal generated between laser 5 is shielded.
In view of the above-mentioned problems, in the embodiment of the present application, the surface of circuit board 1 is equipped with metal layer 10, as shown in Fig. 6.
Metal layer 10 is in contact with optical device box body 2, and the ground connection setting of metal layer 10, at this point, optical device box body 2 is real by metal layer 10
Now ground connection setting.When generating electromagnetic signal between routing circuit board 11 and laser 5, generated electromagnetic signal passes through metal
Layer 10 is oriented to ground, to avoid electromagnetic signal from influencing on circuit board 1 and the normal work of the 2 each component in inside of optical device box body
Make.It is in contact with optical device box body 2 for ease of metal layer 10, metal layer 10 is preferably provided at the circuit of 6 side of circuit board notch
On plate 1.
Second of structure when the circuit board 1 provided in the embodiment of the present application and the connection of optical device box body 2 is provided, electricity is worked as
When the width of road plate notch 6 is equal to the width of optical device box body 2, optical device box body 2 can be connected at circuit board notch 6,
In order to realize being fixedly connected between circuit board 1 and optical device box body 2.
Since circuit board notch 6 is equal to the width of optical device box body 2, in populated circuit board 1 and optical device box body 2
When, it is not corresponded to if circuit board 1 and 2 position of optical device box body are placed, is susceptible to and assembles slow, interim card situation.Therefore, needle
To the above problem, in optical module provided by the embodiments of the present application, it is respectively equipped on two opposite lateral walls of optical device box body 2
Sliding channel 7, and sliding channel 7 and box body notch 4 are located on the side wall that optical device box body 2 is different, as shown in Fig. 9.Work as light
When being respectively equipped with sliding channel 7 on two opposite lateral walls of device box body 2, circuit board 1 is by two sliding channels 7 by light device
Part box body 2 is clamped at circuit board notch 6.
Specifically, the component of optical device box body 2 is clamped for realizing circuit board 1 for sliding channel 7, i.e. circuit board 1 passes through two
Optical device box body 2 is clamped at circuit board notch 6 by a sliding channel 7.In general, circuit board 1 is plank frame component, therefore,
It is smoothly slid into sliding channel 7 for ease of circuit board 1, two sliding channels 7 are straight channel.Meanwhile circuit board 1 is logical
Often it is smooth plank frame component, therefore, two sliding channels 7 are arranged in parallel, and in the same plane, in order to circuit
Optical device box body 2 is clamped at circuit board notch 6 by plate 1 by two sliding channels 7.
When optical device box body 2 is clamped at circuit board notch 6 by circuit board 1 by two sliding channels 7, for ease of electricity
Road plate 1 can slide into sliding channel 7, the width of sliding channel 7 in the vertical direction should be greater than or equal to circuit board 1 thickness
Degree.Further, for ease of the setting of sliding channel 7, two 7 equal indents of sliding channel are in the lateral wall of optical device box body 2.
Further, optical device box body 2 is clamped in circuit board notch 6 by two sliding channels 7 for ease of circuit board 1
Place, and routing circuit board 11 is extend by box body notch 4 inside optical device box body 2, in the embodiment of the present application, box body notch
4 and two sliding channels 7 be located in same level, and box body notch 4 is connected with two sliding channels 7 respectively, such as attached drawing 9
It is shown.Above-mentioned set-up mode can be convenient for the processing of optical device box body 2 and routing circuit board 11 to extend into optical device box body 2
Portion.
When optical device box body 2 is clamped at circuit board notch 6 by circuit board 1 by two sliding channels 7, routing circuit board
After 11 are extend by box body notch 4 inside optical device box body 2, and 11 routing of routing circuit board is electrically connected to laser 5, pass through
Fluid sealant is applied in the junction of circuit board 1 and box body notch 4, to realize that the non-airtight of sun adjuster part box body 2 seals.
Those skilled in the art will readily occur to its of the present invention after considering specification and putting into practice the disclosure invented here
Its embodiment.This application is intended to cover the present invention any variations, uses, or adaptations, these modifications, purposes or
Person's adaptive change follows the general principle of the present invention and includes undocumented common knowledge in the art of the invention
Or conventional techniques.The description and examples are only to be considered as illustrative, and true scope and spirit of the invention are by following
Claim is pointed out.
It should be understood that the relational terms of such as " first " and " second " or the like be used merely to an entity or
Operation is distinguished with another entity or operation, and without necessarily requiring or implying between these entities or operation, there are any
This actual relationship or sequence.The invention is not limited in the precision architecture for being described above and being shown in the accompanying drawings,
And various modifications and changes may be made without departing from the scope thereof.The scope of the present invention is only limited by the attached claims
System.
Claims (10)
1. a kind of optical module, which is characterized in that including upper shell and lower housing, the sky of the upper shell and lower housing formation
Intracavitary is equipped with circuit board and optical device box body;It is respectively equipped with light through-hole and box body in the opposite two side walls of the optical device box body
Notch;The optical device tray interior is equipped with lens and laser, and the light that the laser is sent out is after the lens by institute
State the injection of light through-hole;The circuit board extend into the optical device tray interior by the box body notch, extend into the light
The circuit board of device tray interior is electrically connected to the laser by routing mode.
2. optical module according to claim 1, which is characterized in that in the junction of the box body notch and the circuit board
Fluid sealant is applied, to realize the sealing to the optical device box body.
3. optical module according to claim 1 or 2, which is characterized in that the end of the circuit board is equipped with circuit board notch,
In the circuit board indentation, there, the circuit board for being located at the circuit board indentation, there passes through the box body for the optical device box body setting
Notch extend into the optical device tray interior.
4. optical module according to claim 3, which is characterized in that in the opposite two side walls of the optical device box body respectively
Equipped with sliding channel, the sliding channel and the box body notch are located on the different side wall of the optical device box body;The electricity
The optical device box body is clamped by the sliding channel in road plate.
5. optical module according to claim 3, which is characterized in that the circuit board of circuit board notch side is equipped with gold
Belong to layer, the metal layer is in contact with the optical device box body, the metal layer ground connection setting.
6. optical module according to claim 1 or 2, which is characterized in that the optical device tray interior is equipped with drier.
7. optical module according to claim 1, which is characterized in that the electric connection line that the routing mode is formed is used for transmission
High speed signal.
8. optical module according to claim 4, which is characterized in that the sliding channel indent is in the optical device box body
Lateral wall.
9. optical module according to claim 4, which is characterized in that the width of the sliding channel in the vertical direction is more than
Or the thickness equal to the circuit board.
10. optical module according to claim 4, which is characterized in that the box body notch and two sliding channels exist
In same level, the box body notch is connected with two sliding channels respectively.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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US16/431,166 US20190346640A1 (en) | 2018-05-14 | 2019-06-04 | Optical module |
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WO2019218978A1 (en) * | 2018-05-14 | 2019-11-21 | 青岛海信宽带多媒体技术有限公司 | Optical module |
WO2020156476A1 (en) * | 2019-02-01 | 2020-08-06 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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WO2021232661A1 (en) * | 2020-05-22 | 2021-11-25 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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WO2019218978A1 (en) * | 2018-05-14 | 2019-11-21 | 青岛海信宽带多媒体技术有限公司 | Optical module |
WO2020156476A1 (en) * | 2019-02-01 | 2020-08-06 | 青岛海信宽带多媒体技术有限公司 | Optical module |
CN111522102A (en) * | 2019-02-01 | 2020-08-11 | 青岛海信宽带多媒体技术有限公司 | Optical module |
CN113009649B (en) * | 2019-12-20 | 2022-10-14 | 青岛海信宽带多媒体技术有限公司 | Optical module |
CN113009649A (en) * | 2019-12-20 | 2021-06-22 | 青岛海信宽带多媒体技术有限公司 | Optical module |
US11927818B2 (en) | 2019-12-20 | 2024-03-12 | Hisense Broadband Multimedia Technologies Co., Ltd. | Optical module |
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CN115032749A (en) * | 2021-03-04 | 2022-09-09 | 青岛海信宽带多媒体技术有限公司 | Optical module |
CN115032749B (en) * | 2021-03-04 | 2023-11-14 | 青岛海信宽带多媒体技术有限公司 | Optical module |
WO2022237140A1 (en) * | 2021-05-08 | 2022-11-17 | 苏州旭创科技有限公司 | Optical module |
WO2023050748A1 (en) * | 2021-09-30 | 2023-04-06 | 青岛海信宽带多媒体技术有限公司 | Optical module |
WO2023083244A1 (en) * | 2021-11-11 | 2023-05-19 | 成都旭创科技有限公司 | Airtight optical module |
WO2024093070A1 (en) * | 2022-11-02 | 2024-05-10 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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