CN115166915A - Packaging structure of photoelectric module and photoelectric module using same - Google Patents
Packaging structure of photoelectric module and photoelectric module using same Download PDFInfo
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- CN115166915A CN115166915A CN202210959952.0A CN202210959952A CN115166915A CN 115166915 A CN115166915 A CN 115166915A CN 202210959952 A CN202210959952 A CN 202210959952A CN 115166915 A CN115166915 A CN 115166915A
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- 230000005693 optoelectronics Effects 0.000 claims abstract description 21
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Images
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4287—Optical modules with tapping or launching means through the surface of the waveguide
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4206—Optical features
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4237—Welding
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
Abstract
A packaging structure of an optoelectronic module and an optoelectronic module using the packaging structure are provided, the packaging structure comprises a substrate with central symmetry, one surface of the substrate is provided with a plurality of light emitting/receiving devices and drivers, and the other surface is provided with a plurality of electrical contacts; the electric contact comprises a plurality of first contacts and a plurality of second contacts, each second contact is arranged on the periphery of the first contact, a space is arranged between the second contacts, and the surface area of the first contacts is larger than that of the second contacts. The photoelectric module can be suitable for different types of optical components. The invention directly adopts the base to install the light emitting/receiving device, and the assembly process is simple; the back surface of the substrate is provided with a plurality of electrical contacts, and the substrate is suitable for a reflow soldering surface mounting process; the optical assembly is protected by the protective cover, injection molding materials can be resisted to enter the inner cavity, the device is applicable to different modes, the structure is flexible, and the structure is simple.
Description
Technical Field
The invention relates to the field of optical communication, in particular to a packaging structure of a photoelectric module and the photoelectric module using the packaging structure, and the assembly process is simplified.
Background
As the density and integration of communications electronics increases, there is a need for optical transceiver modules with smaller size packages.
It is common practice in the industry to package the chips within a secondary PCBA, which is connected to a fiber optic connector and then assembled together on the main PCB. The secondary PCB has a certain versatility. Although the structure omits lens optical path conversion, the optical coupling between the secondary PCBA and the optical fiber connector is limited to be only in an active coupling mode, the coupling time is longer compared with a passive coupling mode, and the production efficiency is low. And the main PCBA and the auxiliary PCBA of the structure are fixed at 90 degrees. The circuit pads between the main PCBA and the secondary PCBA are also soldered at 90 degree corners. Is difficult to be applied to the reflow soldering surface mounting technology which is widely used at present, and has low production efficiency.
Or the optical transceiver device is welded on the printed circuit board and then assembled on the base together. The transceiver optical module can greatly reduce the packaging area of the module, and simultaneously improves the reliability and the replaceability of the module. However, in the transceiver module, the optical transceiver and the printed circuit board are mounted in the base, and the optical transceiver needs to provide a fixed position on the base, otherwise, the optical transceiver cannot be coupled and aligned with the optical fiber. The structure has more parts and complex assembly.
Therefore, how to overcome the defects of the prior art, simplify the structure and process of the optoelectronic module, and adapt to the reflow surface mounting technology becomes a technical problem to be solved in the prior art.
Disclosure of Invention
The invention aims to provide a packaging structure of a photoelectric module and the photoelectric module using the packaging structure, which can use a reflow soldering surface mounting process, simplify an assembly process, can resist high temperature and high pressure of injection molding and is suitable for the injection molding process.
In order to achieve the purpose, the invention adopts the following technical scheme:
a packaging structure of an optoelectronic module comprises a substrate with central symmetry, wherein one surface of the substrate is provided with a plurality of light emitting/receiving devices and drivers, and the other surface of the substrate is provided with a plurality of electrical contacts;
the light emitting/receiving device, the driver and the electrical contacts constitute a data channel for receiving or transmitting data;
the electric contacts comprise a plurality of first contacts and a plurality of second contacts, soldering tin is arranged on the first contacts, and the surface tension generated after the soldering tin is melted enables the first contacts to be kept at original positions;
each second contact is arranged on the periphery of the first contact, and the surface tension generated after the soldering tin melts is used for keeping the second contact at the original position;
a gap is arranged between the first contact and the second contact, so that the first contact and the second contact are insulated from each other after soldering tin on the first contact is melted;
the surface area of the first contact is greater than the surface area of the second contact.
Optionally, each of the first contacts is symmetrically disposed with respect to a center of the substrate, and each of the second contacts is symmetrically disposed with respect to the center of the substrate.
Optionally, the second contacts are arranged in four rows, symmetrically arranged on the substrate, and the second contacts in two adjacent rows are staggered.
Optionally, the surface area of the first contact is at least two times greater than the surface area of the second contact.
Optionally, the second contact includes a power end, a ground end and a signal end, and the power end, the ground end and the signal end are arranged in a staggered manner.
Optionally, the second contacts are arranged in four rows, and symmetrically arranged on four peripheries of the substrate.
The invention further discloses an optoelectronic module which is used for being coupled with the optical fiber, and the packaging structure of the optoelectronic module also comprises an optical component, wherein the light emitting/receiving device is coupled with the optical fiber through the optical component.
Optionally, the optical assembly includes a first lens, a second lens and a reflector, the optical assembly has an accommodating cavity, the first lens is aligned with the optical window of the light emitting/receiving device and attached to the substrate, and the second lens is aligned with the notch of the optical fiber.
Optionally, the optical lens further includes a first protective cover, and the first protective cover is disposed outside the first lens, the second lens, and the reflector.
Optionally, the optical component is an optical fiber guide hole, the light emitting/receiving device is mounted on a bracket, and the bracket is mounted on a substrate to convert an optical path of the light emitting/receiving device.
Optionally, the support further comprises a second protection cover, and the second protection cover covers the driver and the outer side of the support.
The invention has the following advantages:
1. the packaging structure of the photoelectric module directly adopts the base to mount the light emitting/receiving device, does not need a base, only comprises the light receiving/transmitting device and the printed circuit board, and has simple assembly process.
2. The back surface of the substrate is provided with a plurality of electric contacts for connecting signals, a power supply and the ground, and the substrate can be connected with the bottom plate through SMT welding and is suitable for reflow soldering surface mounting technology.
3. The containing space is formed by the protective cover and the substrate, the protective cover is made of metal or ceramic materials, the optical assembly is manufactured by adopting an integrated forming process, no gap exists on the surface of the optical assembly, and the protective cover and the substrate are sealed by adopting high-temperature-resistant glue, so that the whole module forms a whole, injection molding materials can be resisted to enter an inner cavity, and damage to a light receiving/emitting device and a driver during injection molding is avoided.
4. The protective cover and the substrate form an accommodating space, the light emitting/receiving device and the optical path coupling of the optical fiber are realized through different modes such as an optical component or an optical fiber guide hole, and the optical fiber coupling device is flexible in structure and simple in structure.
5. Can constitute small-size photovoltaic module, can realize the aging test of light emitting device in the company's board stage. Bad devices can be found earlier, and cost is saved. Meanwhile, the efficiency of the aging test is improved. The burn-in test interface can be realized by a golden finger, a connector or a test probe.
Drawings
FIG. 1 is a schematic view of a substrate in an optoelectronic module package structure according to an embodiment of the present invention;
FIG. 2 is a schematic view of another side of a substrate in a package structure of an optoelectronic module according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a substrate in a package structure of an optoelectronic module according to another embodiment of the present invention;
FIG. 4 is a schematic diagram of the operation of an optical assembly according to a specific embodiment of the present invention;
FIG. 5 is an assembled schematic view of an optical assembly according to an embodiment of the present invention;
fig. 6 is a schematic diagram of an optical assembly according to another embodiment of the present invention.
The reference numerals in the drawings respectively refer to the technical features:
1. a substrate; 2. a first protective cover; 3. an optical component; 4. a support; 5. a side frame; 6. a fiber guide hole; 7. an optical fiber; 8. a second protective cover; 11. a first contact; 12. a second contact; 31. a driver; 32. a light emitting/receiving device; 33. a first lens; 34. a reflective device; 35. a second lens.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
The invention mainly comprises the following steps: the base is not needed, the substrate is directly adopted to form the packaging structure of the photoelectric module, one surface of the substrate is provided with a plurality of light emitting/receiving devices and a driver, the other surface of the substrate is provided with a plurality of electric contacts for connecting signals, a power supply and the ground, the substrate can be connected with a bottom plate through SMT welding, the first contact and the second contact have different surface areas, specifically, the first contact is larger than the second contact and is provided with an interval, and the first contact and the second contact are kept at original positions and are insulated from each other through surface tension. Therefore, the method can be suitable for the reflow soldering surface mounting process and simplifies the assembly process.
Specifically, referring to fig. 1 and fig. 2, schematic diagrams of two surfaces of a package structure of a small-sized optoelectronic module according to an embodiment of the present invention are shown.
Comprising a substrate 1 with central symmetry provided with a plurality of light emitting/receiving devices 32 and a driver 31 on one side and a plurality of electrical contacts on the other side.
The light emitting/receiving device 32, the driver 31 and the electrical contacts constitute a data channel for receiving or transmitting data.
The electrical contact comprises a plurality of first contacts 11 and a plurality of second contacts 12, wherein the first contacts 11 are provided with soldering tin, and the surface tension generated after the soldering tin is melted enables the first contacts to be kept at original positions.
Each second contact 12 is arranged on the periphery of the first contact, and solder is arranged on the second contact, and the second contact is kept at an original position by surface tension generated after the solder is melted;
a space is arranged between the first contact 11 and the second contact 12, so that the first contact 11 and the second contact 12 are insulated from each other after the soldering tin on the first contact 11 is melted;
the surface area of the first contact 11 is larger than the surface area of the second contact 12.
In an exemplary embodiment, the substrate 1 may be a printed circuit board.
Therefore, the invention omits a base, simplifies the assembly process, and only the light emitting/receiving device and the printed circuit board form a small-sized photoelectric module.
Furthermore, the substrate can be connected with the bottom plate through SMT welding and is suitable for a reflow soldering surface mounting process.
Each of the first contacts 11 is symmetrically disposed with respect to the center of the substrate 1, for example, arranged in a manner such as an array, and each of the second contacts 12 is symmetrically disposed with respect to the center of the substrate 1.
The surface area of first contact 11 is greater than the surface area of second contact 12, and middle big pad area is big, and tin on the pad melts the back and can provide great surface tension, guarantees when SMT welds, and the back module can not the off tracking when tin melts, and surface tension can pull back the module the position of big pad. The peripheral second contacts 12 are disposed on the outer periphery of the first contacts 11, and preferably, are disposed symmetrically with respect to the center of the substrate 1, and the surface tension of the molten tin on the pad is equal in the vertical and horizontal directions but opposite in the direction, so that the surface tension can be cancelled.
The first contact 11 is connected with the same electric network to avoid short circuit, and the first contact 11 and the second contact 12 are provided with intervals, so that after soldering tin on the first contact is melted, the first contact and the second contact are insulated from each other to avoid short circuit.
In a specific embodiment, referring to fig. 1, the second contacts 12 are arranged in four rows, symmetrically arranged on the substrate 1, and the second contacts 12 in two adjacent rows are staggered.
The second contact 12 includes a power end, a ground end and a signal end, and the power end, the ground end and the signal end are arranged in a staggered manner, so that the power integrity of the high-speed signal can be ensured. Meanwhile, the signal ends are distributed in two rows in a staggered mode, so that the fan-out of signals in the inner rows is facilitated, and the complexity of a bottom plate butted with the modules is reduced.
Each light emitting/receiving device 32 on the front side of the substrate 1 is connected to a corresponding channel of the driver 31, which channel is in turn connected to an electrical contact on the back side of the substrate 1. The channels and electrical contacts of the light emitting/receiving device 32 with the driver 31 constitute a transmit/receive data channel for receiving or transmitting data. The multiple transmit/receive channels can be freely combined, and can be used for transmitting different data protocols, such as USB3.0, display Port, HDMI, DVI, PCIE and the like.
In another specific embodiment, referring to fig. 3, the second contacts 12 are arranged in four rows symmetrically arranged on four peripheries of the substrate 1.
In a further preferred embodiment of the invention, the surface area of said first contact 11 is at least two times larger than the surface area of said second contact 12.
The first contact 11 may be a ground terminal.
The invention further discloses an optoelectronic module for coupling with an optical fiber, the optoelectronic module comprises the above-described packaging structure of the optoelectronic module, and further comprises an optical component 3, and the light emitting/receiving device 32 is coupled with the optical fiber 9 through the optical component 3.
Example 1:
referring to fig. 4, 5, an embodiment of an optical assembly according to the present invention is shown.
In this embodiment, the optical assembly 3 includes a first lens 33, a second lens 35 and a reflection device 34, the optical assembly 3 has an inner cavity, the first lens is aligned with the optical window of the light emitting/receiving device 32 and is attached to the substrate, the reflection device 34 is used for coupling the optical path of the first lens 33 with the optical path of the second lens 35, and the second lens 35 is installed in alignment with the cut of the optical fiber 8.
Specifically, the first lens 33 may be a horizontal lens, the reflective device 34 may be a 45-degree oblique reflective surface, the second lens 35 may be a vertical lens, the horizontal lens is used for aligning the optical window of the light emitting/receiving device 32 and attached to the substrate 1, and the reflective surface 34 couples the optical path in the vertical direction with the optical path in the horizontal direction.
The optical module further includes a first protective cover 2, and the first protective cover 2 covers the first lens 33, the second lens 35 and the reflective device 34.
The optical assembly is made of similar plastic materials and cannot tolerate the temperature of SMT, so that the protective cover is arranged on the optical assembly and made of ceramic materials. The side of the protective cover 2 may be drooping to provide thermal insulation protection for the top and side of the optical module 3, the lower side of the optical module 3 is a substrate, and the light emitting/receiving device 32 and the driver 31 may be located in the cavity of the optical module, so as to provide all-directional protection for the optical module and other components, and the optical module will not be damaged due to overheating during SMT.
The optical component is manufactured by adopting an integral forming process, no gap exists on the surface of the optical component, injection molding materials can be resisted to enter the inner cavity, and damage to the light receiving/emitting device and the driver during injection molding is avoided. The cavity accommodates the light receiving device and the driver, and thus the upper top thereof is thin and not strong enough. When the injection molding is carried out, the injection molding pressure can cause the upward and downward bending deformation and touch the gold wires connected with the driver, the light emitting/receiving device and the bottom plate, so that the gold wires are short-circuited, and finally the module fails. The top of optical assembly can be consolidated to the safety cover, reduces the deformation volume of top when moulding plastics on the optical assembly, lets optical assembly can not lead to the module to damage because of the gold thread is run into to the pressurized deformation when moulding plastics.
Example 2:
referring to fig. 6, which shows another optical module according to the present invention, the optical path coupling of the light emitting/receiving device and the optical fiber may be realized by means of a fiber guide hole.
The optical component is an optical fiber guide hole 6, the light emitting/receiving device 32 is mounted on the bracket 4, the bracket 4 is mounted on the substrate 1, and the optical fiber guide hole 6 is aligned with the center of the optical window of the light emitting/receiving device 31, so that the optical path coupling of the optical fiber and the light emitting/receiving device is realized.
In this embodiment, the front and side surfaces of the bracket 4 may have conductive traces, the bracket 4 is rotated by 90 degrees and then mounted on the substrate 1, the fiber guide hole 6 is mounted on the side frame 5, and the fiber guide hole 6 is aligned with the center of the optical window of the light emitting/receiving device 31, so that optical path coupling between the optical fiber and the light emitting/receiving device can be achieved when the optical fiber is inserted into the fiber guide hole.
Further, the device further comprises a second protection cover 8, and the second protection cover 8 covers the driver and the outer side of the support.
The second protective cover 8 and the substrate 1 can be sealed by high-temperature-resistant glue, so that the whole photoelectric module forms a whole. The injection molding material can be resisted from entering the inner cavity, the damage of the light receiving/emitting device and the driver during injection molding is avoided, and the deformation quantity of the light receiving/emitting device and the driver cannot damage the internal devices under the injection molding pressure.
In summary, the invention has the following advantages:
1. the packaging structure of the photoelectric module directly adopts the base to mount the light emitting/receiving device, does not need a base, only comprises the light receiving/transmitting device and the printed circuit board, and has simple assembly process.
2. The back surface of the substrate is provided with a plurality of electric contacts for connecting signals, a power supply and the ground, and the substrate can be connected with the bottom plate through SMT welding and is suitable for reflow soldering surface mounting technology.
3. The containing space is formed by the protective cover and the substrate, the protective cover is made of metal or ceramic materials, the optical assembly is manufactured by adopting an integrated forming process, no gap exists on the surface of the optical assembly, and the protective cover and the substrate are sealed by adopting high-temperature-resistant glue, so that the whole module forms a whole, injection molding materials can be resisted to enter an inner cavity, and damage to a light receiving/emitting device and a driver during injection molding is avoided.
4. The protective cover and the substrate form an accommodating space, the light emitting/receiving device and the optical path coupling of the optical fiber are realized through different modes such as an optical component or an optical fiber guide hole, and the optical fiber coupling device is flexible in structure and simple in structure.
5. Can constitute small-size photovoltaic module, can realize the aging testing of light emission device in the company's board stage. Bad devices can be found earlier, and cost is saved. Meanwhile, the efficiency of the aging test is improved. The burn-in test interface can be realized by a golden finger, a connector or a test probe.
While the invention has been described in further detail with reference to specific preferred embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (11)
1. A package structure of an optoelectronic module is characterized in that,
the device comprises a substrate with central symmetry, wherein one surface of the substrate is provided with a plurality of light emitting/receiving devices and a driver, and the other surface of the substrate is provided with a plurality of electric contacts;
the light emitting/receiving device, the driver and the electrical contacts constitute a data channel for receiving or transmitting data;
the electric contacts comprise a plurality of first contacts and a plurality of second contacts, soldering tin is arranged on the first contacts, and the surface tension generated after the soldering tin is melted enables the first contacts to be kept at original positions;
each second contact is arranged on the periphery of the first contact, and the surface tension generated after the soldering tin melts is used for keeping the second contact at the original position;
a gap is arranged between the first contact and the second contact, so that the first contact and the second contact are insulated from each other after soldering tin on the first contact is melted;
the surface area of the first contact is greater than the surface area of the second contact.
2. The package structure of an optoelectronic module according to claim 1, wherein:
each of the first contacts is disposed symmetrically with respect to the center of the substrate, and each of the second contacts is disposed symmetrically with respect to the center of the substrate.
3. The package structure of an optoelectronic module according to claim 2, wherein:
the second contacts are arranged in four rows, symmetrically arranged on the substrate, and the second contacts in two adjacent rows are arranged in a staggered manner.
4. The package structure of an optoelectronic module according to claim 1, wherein:
the surface area of the first contact is at least two times greater than the surface area of the second contact.
5. The package structure of an optoelectronic module according to any one of claims 1 to 4, wherein:
the second contact comprises a power supply end, a grounding end and a signal end, and the power supply end, the grounding end and the signal end are arranged in a staggered mode.
6. The package structure of an optoelectronic module according to claim 2, wherein:
the second contacts are arranged in four rows and symmetrically arranged on four peripheries of the substrate.
7. The utility model provides an optoelectronic module for carry out coupling with optic fibre, its characterized in that:
an encapsulation structure comprising the optoelectronic module of any one of claims 1 to 6, further comprising an optical component through which the light emitting/receiving device is coupled with the optical fiber.
8. The optical module of claim 7 wherein:
the optical assembly comprises a first lens, a second lens and a reflecting device, the optical assembly is provided with an accommodating inner cavity, the first lens is aligned with an optical window of the light emitting/receiving device and is attached to the substrate, and the second lens is aligned with a notch of the optical fiber.
9. The optical module of claim 8 wherein:
the lens further comprises a first protective cover, and the first protective cover covers the first lens, the second lens and the outer side of the reflector.
10. The optical module of claim 7 wherein:
the optical component is an optical fiber guide hole, the light emitting/receiving device is mounted on a bracket, and the bracket is mounted on a substrate to convert an optical path of the light emitting/receiving device.
11. The optical module of claim 10 wherein:
still include the second safety cover, the second safety cover is located the driver the outside of support.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210959952.0A CN115166915A (en) | 2022-05-23 | 2022-05-23 | Packaging structure of photoelectric module and photoelectric module using same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210959952.0A CN115166915A (en) | 2022-05-23 | 2022-05-23 | Packaging structure of photoelectric module and photoelectric module using same |
| CN202210561026.8A CN114660742B (en) | 2022-05-23 | 2022-05-23 | Packaging structure of photoelectric module and photoelectric module using same |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210561026.8A Division CN114660742B (en) | 2022-05-23 | 2022-05-23 | Packaging structure of photoelectric module and photoelectric module using same |
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| CN115166915A true CN115166915A (en) | 2022-10-11 |
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| CN202210959952.0A Pending CN115166915A (en) | 2022-05-23 | 2022-05-23 | Packaging structure of photoelectric module and photoelectric module using same |
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