CN107703589A - A kind of Multi-path parallel optical component encapsulating structure and Multi-path parallel optical component - Google Patents
A kind of Multi-path parallel optical component encapsulating structure and Multi-path parallel optical component Download PDFInfo
- Publication number
- CN107703589A CN107703589A CN201710685656.5A CN201710685656A CN107703589A CN 107703589 A CN107703589 A CN 107703589A CN 201710685656 A CN201710685656 A CN 201710685656A CN 107703589 A CN107703589 A CN 107703589A
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- China
- Prior art keywords
- optical component
- path parallel
- parallel optical
- encapsulating structure
- tail pipe
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4251—Sealed packages
Abstract
The invention discloses providing a kind of Multi-path parallel optical component encapsulating structure and having the Multi-path parallel optical component of the encapsulating structure, encapsulating structure includes top plate, middle casing, bottom plate.Middle casing includes ring frame, tail pipe：Ring frame is used to form air-tight chamber with top plate and bottom plate, and tail pipe is integrally formed with ring frame and is communicated in air-tight chamber.Bottom plate includes substrate, metallic plate：Substrate is provided with inscribed line terminals, chip loading hole and the external wiring terminal outside air-tight chamber inside air-tight chamber, and metallic plate is welded in the bottom surface of substrate and encapsulating chip loading hole.Wherein, after the light joint of multidiameter delay fibre ribbon one end enters in ring frame through tail pipe, sealed between tail pipe, multidiameter delay fibre ribbon by solder.The present invention realizes effective encapsulation process to key componentses by air-tight chamber, and the mode of solder sealing tail pipe avoids the maximization of product while optical signal transmitting is ensured, is advantageous to meet the market demand.
Description
Technical field
The present invention relates to technical field of photo communication, it particularly relates to which a kind of Multi-path parallel optical component encapsulating structure changes
Enter.
Background technology
Popularization and deep application with optic communication, demand and the day of electrooptical device increase severely, and the market demand is also continuous
Develop towards required directions such as miniaturization, multichannel, high-air-tightness, high reliability, thereby produce in electrooptical device
Key componentses be sealed in the market demand in housing.
Therefore, the mode of optical signal through the housing of sealing mainly has two kinds：First, housing carries seal glass optical window, outside
The metal sleeve in portion is fixed by high-precision contraposition with case weld, and external fiber insertion metal sleeve can be the same as internal light
Signal is transmitted；2nd, sealing ring is assembled on optical fiber, sealing ring passes through the tail pipe of housing, afterwards by sealing ring with housing
Tail pipe sealed.
At present, two ways more adapts to the coaxial packaging scheme of simple optical fiber, for channel transmission optical module（It is i.e. more
Road parallel optical module）, the housing for carrying glass optical window is limited to the problem of alignment of housing inside and outside light path is difficult, can not realize that light is believed
Number effective transmission, and the assemble welding sealing ring on multidiameter delay fibre ribbon then needs significantly to expand the size of tail pipe,
The miniature requirement of product can not be met.
The content of the invention
It is an object of the invention to provide a kind of Multi-path parallel optical component encapsulating structure, is ensureing the premise of product miniaturization
Under, effective level Hermetic Package to key componentses in optical module is realized, is advantageous to a variety of by coordinating different peripheral circuits to be formed
Optical module.
To reach above-mentioned purpose, the present invention is achieved using following technical scheme：
A kind of Multi-path parallel optical component encapsulating structure, including top plate, middle casing, bottom plate.The middle casing include ring frame,
Tail pipe：The ring frame is used to form air-tight chamber with the top plate and bottom plate, and the tail pipe is integrally formed with the ring frame
And it is communicated in the air-tight chamber.The bottom plate includes substrate, metallic plate：The substrate is provided with inside the air-tight chamber
Inscribed line terminals, chip loading hole and the external wiring terminal outside the air-tight chamber, the metallic plate is welded in institute
State the bottom surface of substrate and seal the chip loading hole.Wherein, the light joint in multidiameter delay fibre ribbon one end passes through the tail
After pipe enters in the ring frame, sealed between the tail pipe, multidiameter delay fibre ribbon by solder.
Further, the metallic plate is provided with the boss that inserting is adapted to the chip loading hole.
Further, the external wiring terminal is located at the top surface of the substrate.
Further, the top surface of the substrate is provided with the endless metal belt with the bottom surface welding of the ring frame.
Further, the endless metal belt is rectangular, and it includes four solders side in relative position relation.
Further, four solders side be respectively the first solder side, the second solder side, the 3rd solder side and with institute
State the 4th adjacent solder side of the mouth of pipe of tail pipe, first solder side, the second solder side, be equipped with the outside of the 3rd solder side
The external wiring terminal, the 4th solder side extend to the end face of the substrate.
Further, the solder is brazing metal or glass solder.
Further, the chip loading hole has multiple, is reserved with and sets between the chip loading hole and the tail pipe
Fixed components and parts assembling area.
Based on above-mentioned Multi-path parallel optical component encapsulating structure, the present invention additionally provides a kind of multidiameter delay on the other hand
Optical assembly, it includes multidiameter delay fibre ribbon and above-mentioned Multi-path parallel optical component encapsulating structure, the multidiameter delay optical fiber
The optical fiber of band is metallized optical fibre, for realizing that the solder between the tail pipe, multidiameter delay fibre ribbon seals.
Compared with prior art, advantages of the present invention and beneficial effect are：
Multi-path parallel optical component encapsulating structure of the present invention, the air-tight chamber formed by top plate, middle casing, bottom plate meet height
Air-tightness, the market demand of high reliability, can be achieved to the level Hermetic Packages of key componentses in optical module, so as to resistance to steam and
The ability of adverse circumstances is stronger.After the light joint of multidiameter delay fibre ribbon one end is located in air-tight chamber through tail pipe, lead to
The mode for crossing solder (can select brazing metal, glass solder etc. according to tail pipe material) sealing will be tail pipe and multidiameter delay optical fiber
Gap sealing between band, can both be effectively ensured the inside and outside optical signal transmission of air-tight chamber, moreover it is possible to ensure the height of air-tight chamber
Air-tightness, high reliability, simultaneously as avoiding the use of sealing ring so that package dimension is small, that is, ensure that product minimizes
Design requirement.In addition, the present invention is by the inscribed line terminals on substrate inside air-tight chamber and outside air-tight chamber
The external wiring terminal in portion then effectively realizes the inside and outside electric signal transmission of air-tight chamber.
After the detailed description of embodiment of the present invention is read in conjunction with the figure, the other features and advantages of the invention will become more
Add clear.
Brief description of the drawings
Fig. 1 is the decomposing schematic representation of one embodiment of the invention Multi-path parallel optical component encapsulating structure；
Fig. 2 is that middle casing in Fig. 1, bottom plate are equipped with the structural representation of multidiameter delay fibre ribbon；
Fig. 3 is the sectional view at A-A in Fig. 2；
Fig. 4 is the sectional view at B-B in Fig. 2；
Fig. 5 is the structural representation in the top surface direction of substrate in Fig. 1；
Fig. 6 is the structural representation in the bottom surface direction of substrate in Fig. 1；
Fig. 7 is the structural representation in the bottom surface direction of middle casing in Fig. 1；
Fig. 8 is the decomposing schematic representation of another embodiment of the present invention Multi-path parallel optical component encapsulating structure；
Fig. 9 is the structural representation in the bottom surface direction of substrate in Fig. 8.
Embodiment
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention
In accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described.
In the description of the invention, it is to be understood that term " first ", " second ", " the 3rd ", " the 4th " are only used for retouching
Purpose is stated, and it is not intended that relative importance is indicated or imply, in addition, the orientation or position of the instruction such as term " top ", " bottom "
Relation is based on orientation shown in the drawings or position relationship, is for only for ease of the description present invention and simplifies description, without referring to
Show or imply that the device of meaning or element there must be specific orientation, with specific azimuth configuration and operation, therefore can not manage
Solve as limitation of the present invention.
It is unreasonable for key componentses sealing means in existing multidiameter delay transmission optical module, and cause optical signal transmission
Effect is undesirable or the problems such as product size is excessive, and referring to figs. 1 to shown in Fig. 7, present embodiment illustrates a kind of multidiameter delay
Optical assembly encapsulating structure, include top plate 10, middle casing 20, bottom plate, wherein, middle casing 20 includes ring frame 21, ring
Shape frame is used for forming air-tight chamber with top plate 10, bottom plate, and air-tight chamber is provided for the chip in Multi-path parallel optical component
（Accompanying drawing is not shown）, the one end of multidiameter delay fibre ribbon 50 light joint 51 and other key componentses carry out effectively hermetic seal
Dress, as shown in Figure 2.In order to reach reliably air-tightness, there is plurality of optional scheme in the present invention, for example, top plate 10 and ring frame
21 are integrally formed, and select bonding or welded seal to form air-tight chamber according to the material of ring frame 21, bottom plate；Or bottom plate with
Ring frame 21 is integrally formed, and selects bonding or welded seal to form air-tight chamber according to the material of ring frame 21, top plate 10, and
In the present embodiment, in order to facilitate installation of the assembly crewman to component in air-tight chamber, especially using metal material（Such as
The alloy of aluminium, copper, iron, nickel, cobalt etc. or several metals）Top plate 10, bottom plate is made, and designs top plate 10, ring frame 21, bottom plate three
Above-mentioned air-tight chamber is formed by welding between person.
In order to realize, component includes substrate 30, can used with the communication outside air-tight chamber, bottom plate in air-tight chamber
Substrate of the conventional PCB substrate as the present invention, also can specifically it use with high heat conductance, chemical stability is good, heat-resisting, pressure-resistant
Ceramic substrate, be provided with the chip loading area inside the air-tight chamber in substrate 30, in order to realize the transmitting of electric signal,
The inscribed line terminals 31 of chip are additionally provided with inside air-tight chamber, connect in substrate 30 and outside air-tight chamber
External wiring terminal 32.After the effective encapsulation of Multi-path parallel optical component encapsulating structure of the present invention component in by air-tight chamber, then match somebody with somebody
With different peripheral circuits, different structure and the Multipath parallel optical module of function can be developed, in order to apply to reliable
Property require, air-tightness is required in higher environment.
In order to realize the relieved package of the light joint 51 to the one end of multidiameter delay fibre ribbon 50, middle casing 20 also includes
It is integrally formed with ring frame 21 and is communicated in the tail pipe 22 of air-tight chamber, the light joint 51 in the one end of multidiameter delay fibre ribbon 50 is worn
After crossing in the entrance ring frame of tail pipe 22, the gap between tail pipe 22, multidiameter delay fibre ribbon 50 is blocked by solder to be sealed, with true
The high-air-tightness for the air-tight chamber that guarantor's top plate 10, ring frame 21, bottom plate three welding are formed afterwards, high reliability, such as Fig. 3, Fig. 4
It is shown, it can specifically be sealed according to the material of tail pipe using brazing metal or glass solder seals, specifically used in the present embodiment
The solder of fusing point relatively low scolding tin 60 as gap between sealing tail pipe 22 and multidiameter delay fibre ribbon 50, certainly, this scheme
The optical fiber of lower multidiameter delay fibre ribbon 50 need to have metal outer, and this is that prior art is no longer described in detail.Because without in multidiameter delay light
The outside weldings sealing ring of fibre ribbons 50, therefore the present embodiment also reduces certain manufacturing procedure, reduced compared with prior art
Manufacturing cost, and also avoid the larger-size problem of encapsulating structure that is oversized and bringing of tail pipe 22.And for the ease of
In air-tight cavity indoor location component required in addition to chip, the present embodiment is reserved between chip loading area and tail pipe 22 and set
Fixed components and parts assembling area.
Notice in other embodiments of the present invention using substrate 90 itself directly as bottom plate, for simplification substrate knot
Structure, chip loading area can be the reserved planes concordant with internal wiring terminal, and for the ease of connecing between inscribed line terminals
Line, chip loading area can also be in groove structure, as shown in Figure 8, Figure 9, due to the non-through substrate of groove structure, top plate 70, in
Between housing 80 with substrate 90 weld after can equally form air-tight chamber.
And because chip in the course of work is also easy to produce heat, when heat reaches the normal fortune that certain limit will influence chip
OK, therefore, in order to improve the radiating efficiency of encapsulating structure, extend its service life, the present embodiment bottom plate also includes helping to lead
Heat, the metallic plate 40 of heat transmission, in order to reach preferable radiating effect, it is above-mentioned that the present embodiment has opened up formation on substrate 30
The chip loading hole 33 of chip loading area, design metallic plate 40 are welded in the bottom surface of substrate 30, and encapsulating chip loading hole simultaneously
33 to ensure the air-tightness of air-tight chamber.Obviously, welded to realize between metallic plate 40 and the bottom surface of substrate 30, in substrate 30
Bottom surface need to be provided with corresponding metal solderable layer.When being provided with chip in chip loading hole 33, chip is directly seated in gold
Belong on plate 40, so as to so that the heat that chip is sent more effectively is transmitted on metallic plate 40, then be dispersed into through metallic plate 40
In foreign medium.Due to generally requiring to set various chips in Multipath parallel optical module, for example, driving chip, light transceiving chip
Deng, therefore the present embodiment chip loading hole 33 has multiple, installs different chip with adaptation, as shown in Figure 5, Figure 6.
For the ease of the patching operations between chip and inscribed line terminals 31, the present embodiment also on metallic plate 40 be provided with
Chip, in chip, to avoid chip from shifting, directly can be pasted onto convex by the boss 41 of the adaptation inserting of chip loading hole 33
On platform 41, the height of boss 41 is determined according to corresponding chip height, in order to which patching operations are advisable.
External wiring terminal can both be located at the end face of substrate in some embodiments of the invention, can also be located at substrate
Bottom surface, and external wiring terminal 32 is then specifically located to the top surface of substrate 30 in the present embodiment, being so not only convenient for assembly crewman will
It is connected with peripheral circuit to realize the transmitting of electric signal, also external wiring terminal 32 can be avoided to interfere with or have influence on substrate
Welding between 30 and metallic plate 40.
In order to ensure the welding between ring frame 21 and substrate 30 reaches reliably sealing effectiveness, the present embodiment is in substrate 30
Top surface be provided with endless metal belt with the bottom surface welding of ring frame 21.Endless metal belt is specifically rectangular, and it includes being in phase
To four solders side of position relationship：First solder side 34, the second solder side 35, the 3rd solder side 36 and the 4th solder side
37, as shown in figure 5, endless metal belt is not limited in rectangle in other embodiments of the invention, as long as the annular for closing
, welding mask body can be process by techniques such as solder melting welding in the present embodiment.In order to reduce the size of ring frame 21,
The present embodiment ring frame 21 is specially the rectangle frame being adapted with endless metal belt, as shown in fig. 7, certainly, in its of the present invention
Ring frame 21 can also be circular frame or oval frame etc. in his embodiment, as long as the surface area of its bottom surface is enough and endless metal belt
Form continuous solder side.For four solders side, the 4th solder side 37 of setting is adjacent with the mouth of pipe of tail pipe 22, in order to fill
Point ground using other three solders side in addition to the 4th solder side 37, the present embodiment the first solder side 34, the second solder side 35,
The outside of 3rd solder side 36 is equipped with external wiring terminal 32, because the outside of the 4th solder side 37 is adjacent with tail pipe 22, in order to
It is easy to weld, the present embodiment designs the end face that the 4th solder side 37 extends to substrate 30.
Based on above-mentioned Multi-path parallel optical component encapsulating structure, the present embodiment additionally provides a kind of multichannel simultaneously on the other hand
Row optical assembly, including the Multi-path parallel optical component encapsulating structure that multidiameter delay fibre ribbon 50 and the present embodiment are provided, in order to
Realized by way of solder sealing and sealing is blocked between tail pipe 22, multidiameter delay fibre ribbon 50, in multidiameter delay fibre ribbon 50
The part that optical fiber is in tail pipe is metallized optical fibre, and tail pipe 22 and multidiameter delay light are sealed in a manner of it will pass through above-mentioned soldering
Gap between fibre ribbons 50.
The above described is only a preferred embodiment of the present invention, being not the limitation for making other forms to the present invention, appoint
What those skilled in the art changed or be modified as possibly also with the technology contents of the disclosure above equivalent variations etc.
Imitate embodiment.But it is every without departing from technical solution of the present invention content, the technical spirit according to the present invention is to above example institute
Any simple modification, equivalent variations and the remodeling made, still fall within the protection domain of technical solution of the present invention.
Claims (9)
- A kind of 1. Multi-path parallel optical component encapsulating structure, it is characterised in that including：Top plate；Middle casing, including：Ring frame, for forming air-tight chamber with the top plate and bottom plate,Tail pipe, it is integrally formed with the ring frame and is communicated in the air-tight chamber；The bottom plate, including：Substrate, it is provided with the inscribed line terminals being located inside the air-tight chamber, chip loading hole and positioned at the air-tight chamber Outside external wiring terminal,Metallic plate, the metallic plate are welded in the bottom surface of the substrate and seal the chip loading hole；Wherein, after the light joint of multidiameter delay fibre ribbon one end enters in the ring frame through the tail pipe, the tail pipe, Sealed between multidiameter delay fibre ribbon by solder.
- 2. Multi-path parallel optical component encapsulating structure according to claim 1, it is characterised in that the metallic plate is provided with and institute State the boss of chip loading hole adaptation inserting.
- 3. Multi-path parallel optical component encapsulating structure according to claim 1, it is characterised in that the external wiring terminal is located at The top surface of the substrate.
- 4. Multi-path parallel optical component encapsulating structure according to any one of claim 1 to 3, it is characterised in that the base The top surface of plate is provided with the endless metal belt with the bottom surface welding of the ring frame.
- 5. Multi-path parallel optical component encapsulating structure according to claim 4, it is characterised in that the endless metal belt is in square Shape, it includes four solders side in relative position relation.
- 6. Multi-path parallel optical component encapsulating structure according to claim 5, it is characterised in that four solder side difference For the first solder side, the second solder side, the 3rd solder side and fourth solder side adjacent with the mouth of pipe of the tail pipe,First solder side, the second solder side, the external wiring terminal is equipped with the outside of the 3rd solder side,4th solder side extends to the end face of the substrate.
- 7. Multi-path parallel optical component encapsulating structure according to any one of claim 1 to 3, it is characterised in that the weldering Expect for brazing metal or glass solder.
- 8. Multi-path parallel optical component encapsulating structure according to any one of claim 1 to 3, it is characterised in that the core Piece loading hole has multiple, and the components and parts assembling area of setting is reserved between the chip loading hole and the tail pipe.
- 9. a kind of Multi-path parallel optical component, including multidiameter delay fibre ribbon, it is characterised in that also including appointing in claim 1 to 8 Multi-path parallel optical component encapsulating structure described in one, the optical fiber of the multidiameter delay fibre ribbon is metallized optical fibre, for reality Existing solder sealing between the tail pipe, multidiameter delay fibre ribbon.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710685656.5A CN107703589B (en) | 2017-08-11 | 2017-08-11 | A kind of Multi-path parallel optical component encapsulating structure and Multi-path parallel optical component |
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|---|---|---|---|
| CN201710685656.5A CN107703589B (en) | 2017-08-11 | 2017-08-11 | A kind of Multi-path parallel optical component encapsulating structure and Multi-path parallel optical component |
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| CN107703589A true CN107703589A (en) | 2018-02-16 |
| CN107703589B CN107703589B (en) | 2019-08-16 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108615773A (en) * | 2018-05-17 | 2018-10-02 | 北京航天时代光电科技有限公司 | One kind being used for surface-pasted photodetector encapsulating shell |
| CN109491027A (en) * | 2019-01-08 | 2019-03-19 | 中航海信光电技术有限公司 | A kind of parallel optical module |
| CN115077588A (en) * | 2022-07-23 | 2022-09-20 | 北京浦丹光电股份有限公司 | Sealing plug for optical fiber sensing, tube shell, integrated photoelectric device and assembling method |
| JP7484230B2 (en) | 2020-03-04 | 2024-05-16 | 富士通オプティカルコンポーネンツ株式会社 | Optical Modules |
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| US5050953A (en) * | 1990-09-14 | 1991-09-24 | Northern Telecom Limited | Multi-path optical fiber and electro-optic transducer connector |
| CN201237656Y (en) * | 2008-08-13 | 2009-05-13 | 青岛海信宽带多媒体技术股份有限公司 | Multipath parallel optical module |
| CN203799069U (en) * | 2014-04-29 | 2014-08-27 | 福州高意通讯有限公司 | Packaging shell of multipath optical transmitting and receiving module |
| CN104503043A (en) * | 2014-12-31 | 2015-04-08 | 中航海信光电技术有限公司 | Multi-path parallel optical assembly |
| CN205941991U (en) * | 2016-08-31 | 2017-02-08 | 中航海信光电技术有限公司 | Parallel optical module |
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2017
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5050953A (en) * | 1990-09-14 | 1991-09-24 | Northern Telecom Limited | Multi-path optical fiber and electro-optic transducer connector |
| CN201237656Y (en) * | 2008-08-13 | 2009-05-13 | 青岛海信宽带多媒体技术股份有限公司 | Multipath parallel optical module |
| CN203799069U (en) * | 2014-04-29 | 2014-08-27 | 福州高意通讯有限公司 | Packaging shell of multipath optical transmitting and receiving module |
| CN104503043A (en) * | 2014-12-31 | 2015-04-08 | 中航海信光电技术有限公司 | Multi-path parallel optical assembly |
| CN205941991U (en) * | 2016-08-31 | 2017-02-08 | 中航海信光电技术有限公司 | Parallel optical module |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108615773A (en) * | 2018-05-17 | 2018-10-02 | 北京航天时代光电科技有限公司 | One kind being used for surface-pasted photodetector encapsulating shell |
| CN109491027A (en) * | 2019-01-08 | 2019-03-19 | 中航海信光电技术有限公司 | A kind of parallel optical module |
| JP7484230B2 (en) | 2020-03-04 | 2024-05-16 | 富士通オプティカルコンポーネンツ株式会社 | Optical Modules |
| CN115077588A (en) * | 2022-07-23 | 2022-09-20 | 北京浦丹光电股份有限公司 | Sealing plug for optical fiber sensing, tube shell, integrated photoelectric device and assembling method |
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| Publication number | Publication date |
|---|---|
| CN107703589B (en) | 2019-08-16 |
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