CN108615773A - One kind being used for surface-pasted photodetector encapsulating shell - Google Patents
One kind being used for surface-pasted photodetector encapsulating shell Download PDFInfo
- Publication number
- CN108615773A CN108615773A CN201810474090.6A CN201810474090A CN108615773A CN 108615773 A CN108615773 A CN 108615773A CN 201810474090 A CN201810474090 A CN 201810474090A CN 108615773 A CN108615773 A CN 108615773A
- Authority
- CN
- China
- Prior art keywords
- encapsulating shell
- electrode
- face
- substrate
- optical fiber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 239000013307 optical fiber Substances 0.000 claims abstract description 31
- 238000003466 welding Methods 0.000 claims abstract description 22
- 238000012360 testing method Methods 0.000 claims abstract description 14
- 239000000919 ceramic Substances 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims abstract description 6
- 230000008569 process Effects 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 6
- 239000007769 metal material Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 5
- 229910017083 AlN Inorganic materials 0.000 claims description 3
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052593 corundum Inorganic materials 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims description 3
- 229910000833 kovar Inorganic materials 0.000 claims description 3
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 239000000565 sealant Substances 0.000 claims description 3
- 238000004544 sputter deposition Methods 0.000 claims description 3
- 229910001845 yogo sapphire Inorganic materials 0.000 claims description 3
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims description 2
- 238000012856 packing Methods 0.000 claims description 2
- 230000005622 photoelectricity Effects 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000012811 non-conductive material Substances 0.000 claims 1
- 238000009434 installation Methods 0.000 abstract description 5
- 238000001465 metallisation Methods 0.000 abstract description 2
- 238000005538 encapsulation Methods 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000004891 communication Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
Abstract
The present invention provides a kind of for surface-pasted photodetector encapsulating shell, the encapsulating shell is using ceramic circuit board as encapsulating shell substrate, electrode in encapsulating shell is formed by ceramic metalizing process on encapsulating shell substrate, test electrode and welding electrode, wherein interior electrode and test electrode are in encapsulating shell substrate first end face, welding electrode is located at encapsulating shell substrate second end face, in encapsulating shell substrate first end face, one circle welding ring of metallization between interior electrode and test electrode, encapsulating shell frame is welded in welding ring, suitable position trepanning welding encapsulating shell tail pipe is for fixing photodetector tail optical fiber on encapsulating shell frame.The encapsulating shell is suitable for pasted on surface of circuit board, effectively reduces photodetector installation dimension.
Description
Technical field
The invention belongs to optoelectronic device packaging fields, are sealed for surface-pasted photodetector more particularly, to one kind
Fill shell.
Background technology
Photodetector converts optical signals to electric signal, is one of indispensable component in Fibre Optical Sensor, optical communication,
External optical signal is entered by photodetector tail optical fiber inside photodetector, and electric current letter is converted to by internal light sensor
Number, faint current signal is converted to voltage signal and exported by internal processing circuitry, the effect of photodetector encapsulating shell：Machinery branch
Support, provides supporting point, and internal circuit is protected not damaged by external mechanical for photodetector tail optical fiber；Seal protection, for encapsulation
Shell internal element provides metastable water vapour environment, and extraneous steam is avoided to have an impact circuit；Electric signal connects, for encapsulation
Shell peripheral circuits provide electrical connection；Heat dissipation：The heat transfer that encapsulating shell internal circuit generates is come out, product temperature is avoided
It is excessively high.
Photodetector mostly uses the electrical connection that metal ferrule realizes peripheral circuits at present, and tail optical fiber mostly uses metallization
Optical fiber component is fixed by soldering and encapsulating shell tail pipe.Since contact pin is there are product installation space is larger, and contact pin protrudes from
Photodetector encapsulating housing, production, test transit link are easy to be touched to lead to damaged products, destroy product hermeticity；
The presence of metallized optical fibre component, it is desirable that encapsulating shell tail pipe trepanning is larger, limits encapsulating shell height.With optical communication, light sensing
The arrival in small-sized high density epoch, pin type photodetector are increasingly difficult to adapt to this high-density installation demand.
Invention content
The technical problem to be solved by the present invention is to：In view of the deficiencies of the prior art, it provides a kind of for surface-pasted light
Electric explorer encapsulating shell forms upper/lower electrode, and use laser using ceramic metalizing process on non-conductive ceramic substrate
Drilling technology realizes upper/lower electrode connection, and encapsulating shell metal frame is welded on ceramic substrate, finally realizes photodetector surfaces
Attachment effectively reduces photodetector installation space, adapts to light sensing, optical communication field small-sized high density development trend.
The technical solution that the present invention uses includes：
One kind being used for surface-pasted photodetector encapsulating shell, including：Substrate (2) and tail pipe (1)；
The first end face and second end face of substrate (2) are evenly equipped with electrode, electrode welding the external circuit board of first end face, and
Biend electrode connection optical fiber source chip or photodetector chip, tail pipe (1) place optical fiber source tail optical fiber or
The tail optical fiber of photodetector；
The substrate (2) is provided with first through hole (203), and first through hole (203) is so that substrate (2) first end face and second end
The electrode in face is connected.
The edge also cloth of substrate (2) second end face is useful for the electrode (202) of test, the electrode for test
(202) it is provided with the second through-hole (201), second through-hole (201) is so that the electrode (202) for test and substrate (2) the
The electrode of end face is connected.
The encapsulating shell substrate (2) uses non-conducting material, the electrode of substrate (2) to be formed using ceramic metalizing process.
The encapsulating shell further includes：Frame (3) and cover board (4)；
Frame (3) side is provided with third through-hole (301), and tail pipe (1), frame are fixed on the third through-hole (301) of frame (3)
(3) cover board (4) is fixed in the other end of an end face fixed substrate (2), frame (3).
The first through hole (203) and the second through-hole (201) are all made of vacuum sputtering and the mode of plating is filled, described to fill out
It is that copper or other resistivity are less than 1.0x10 to fill material-6The metal of Ω m.
The non-conducting material is alundum (Al2O3) or aluminium nitride or zirconium oxide.
Tail pipe (1) diameter is less than 0.18mm, and tail pipe (1) is adhesively fixed the intermediate optical fiber source placed using fluid sealant
Tail optical fiber or photodetector tail optical fiber.
The cover board (4) and the material of frame (3) are metal material.
The metal material is kovar alloy.
The advantages of the present invention over the prior art are that：
(1) encapsulating shell of the invention is joined two lateral electrode of encapsulating shell substrate using ceramic metalizing process and laser boring
It is logical, it realizes encapsulating shell surface mount, saves installation space.
(2) encapsulating shell tail pipe of the invention uses capillary metal tube or ceramic tube, and photodetector tail optical fiber is made to be not necessarily to metal
Change can be directly fixed in tail pipe, effectively reduce encapsulating shell height.
(3) encapsulating shell of the invention makes the encapsulating shell development cycle shorten using ceramics and metal mixed encapsulation, and reduction is opened
Hair, development cost.
Description of the drawings
Fig. 1 is the encapsulating shell structural schematic diagram of the present invention；
Fig. 2 is the encapsulating shell tail pipe schematic diagram of the present invention；
Fig. 3 is the encapsulating shell substrate first end face schematic diagram of the present invention；
Fig. 4 is the encapsulating shell substrate second end face schematic diagram of the present invention；
Fig. 5 is the encapsulating shell block schematic illustration of the present invention；
Fig. 6 is the encapsulating shell cover plate schematic diagram of the present invention.
Specific implementation mode
Below in conjunction with the drawings and specific embodiments to being used for surface-pasted photodetector encapsulating shell according to the present invention
It is further described in detail.
The present invention operation principle be：The linear motion that detector is removed from socket is converted into moving block along its curved surface
Rotation, convenient for manually controlling, while ensureing each pin uniform force when detector takes out.
As shown in Figure 1, one kind of the present invention includes 1 encapsulating shell tail pipe for surface-pasted photodetector encapsulating shell
1,1 encapsulating shell frame 3,1 of encapsulating shell substrate 2,1 encapsulates housing-plate 4.
Encapsulating shell tail pipe 1 is fixed in the through-hole 301 of encapsulating shell frame 3, and 3 second end face 303 of encapsulating shell frame is welded on
In the welding ring 206 of encapsulating shell 2, after the completion of the assembly of photodetector internal circuit, by the welding surface 401 of encapsulation cover plate 4 and envelope
3 first end face 304 of dress shell frame welds together.
Wherein, encapsulating shell tail pipe 1, the tail optical fiber for placing optical fiber source or photodetector are fixed on encapsulating shell frame 3
In through-hole 301 on third end face 302, it is provided with tail optical fiber among encapsulating shell tail pipe 1 and places through-hole 103, tail optical fiber putting hole 103 is straight
Diameter is determined according to tail optical fiber diameter, generally 3~5 microns bigger than tail optical fiber diameter；It is provided with through-hole on 1 rear end face 101 of encapsulating shell tail pipe
Chamfering 102, chamfer dimesion are generally the 1/2~2/3 of encapsulating shell tail pipe outer diameter, and setting chamfering is operated for the ease of encapsulating, such as
Shown in Fig. 2.The material of tail pipe 1 is metal material or nonmetallic materials, and 1 diameter of tail pipe is less than 0.18mm, and tail pipe 1 uses fluid sealant
Be adhesively fixed the intermediate optical fiber source tail optical fiber placed or photodetector tail optical fiber.
Encapsulating shell substrate 2 is as shown in Figure 3 and Figure 4, is the carrier of photodetector internal circuit, circuit in photodetector
And element is placed in 2 first end face 205 of encapsulating shell substrate, be provided in first end face 205 test electrode 202, through-hole 201,
Internal electrode 204, through-hole 203 and welding ring 206, as shown in Figure 3.Welding electricity is provided in 2 second end face 207 of encapsulating shell substrate
Pole 208, encapsulating shell are welded on by welding electrode 208 on the external circuit board, and through-hole 201 is connected to the test electricity of first end face 205
The welding electrode 208 of pole 202 and second end face 207, through-hole 203 are connected to the internal electrode 204 and second end face of first end face 205
207 welding electrode 208, as shown in Figure 4.Photo-detector circuit and element pass through internal electricity on lead and encapsulating shell substrate 2
Electrical connection is realized in pole 204, and the photo-detector circuit and element include the chip of optical fiber source or the core of photodetector
Piece, through-hole 203 are connected to internal electrode 204 and welding electrode 208, and welding electrode 208 welds on the external circuit board, realizes photoelectricity
The electrical connection of detector circuit and external circuit；The connection of through-hole 201 test electrode 202 and welding electrode 208, work as photodetection
After device is welded on the external circuit board, welding quality hidden danger can be checked for by testing electrode 202.The through-hole 203
The mode that vacuum sputtering and plating are all made of with through-hole 201 is filled, and the packing material is that copper or other resistivity are less than
1.0x10-6The metal of Ω m.Encapsulating shell substrate 2 uses non-conducting material, the electrode of substrate 2 to be formed using ceramic metalizing process
Electrode.
Encapsulating shell frame 3 forms the cavity of encapsulating shell, light as shown in figure 5, between encapsulating shell substrate 2 and encapsulation cover plate 4
Electric explorer circuit is located in the cavity 305 of encapsulating shell frame 3；Encapsulating shell frame 3 is that encapsulating shell tail pipe 1 provides support, is sealed
Dress shell frame is provided with through-hole 301 on 3 third end face 302, for fixing encapsulating shell tail pipe 1；3 second end face 303 of encapsulating shell is welded
It is connected in 2 welding ring 206 of package substrate, 3 first end face 304 of encapsulating shell frame is for welding encapsulation housing-plate 4.
Housing-plate 4 is encapsulated as shown in fig. 6, positioned at the top of encapsulating shell, encapsulating shell the size of the cover plate is slightly less than outside packaging frame
Shape size, 4 one side of encapsulation cover plate is smooth, and another side is provided with convex 402, and convex periphery is 4 welding section 401 of encapsulation cover plate, when
After the assembly in place of photodetector internal element, encapsulation cover plate 4 is placed in above encapsulating shell frame 3, by 4 convex of encapsulation cover plate
402 are placed in 3 cavity 305 of encapsulating shell frame, and welding section 401 is aligned with 3 first end face 304 of encapsulating shell frame, is welded and fixed.
Non-conducting material is alundum (Al2O3) or aluminium nitride or zirconium oxide.The metal material is kovar alloy.
Herein, it should be noted that the content not being described in detail in this specification is that those skilled in the art pass through this theory
What description and the prior art in bright book can be realized, therefore, do not repeat.
The foregoing is merely the preferred embodiment of the present invention, are not used for limiting the scope of the invention.For ability
For the technical staff in domain, without creative efforts, several modification and replacement can be made to the present invention,
All such modifications and replacement should be covered by the protection scope of the present invention.
Claims (9)
1. one kind being used for surface-pasted photodetector encapsulating shell, it is characterised in that：Including substrate (2) and tail pipe (1)；
The first end face and second end face of substrate (2) are evenly equipped with electrode, electrode welding the external circuit board of first end face, second end
The chip of the electrode connection optical fiber source in face or the chip of photodetector, tail pipe (1) place the tail optical fiber or photoelectricity of optical fiber source
The tail optical fiber of detector；
The substrate (2) is provided with first through hole (203), and first through hole (203) is so that substrate (2) first end face and second end face
Electrode is connected.
2. encapsulating shell according to claim 1, it is characterised in that：The edge also cloth of substrate (2) second end face is useful
In the electrode (202) of test, the electrode (202) for test is provided with the second through-hole (201), which makes
The electrode (202) for test is obtained with the electrode of substrate (2) first end face to be connected.
3. encapsulating shell according to claim 1 or 2, it is characterised in that：The encapsulating shell substrate (2) uses non-conductive material
Material, the electrode of substrate (2) are formed using ceramic metalizing process.
4. encapsulating shell according to claim 2, which is characterized in that the encapsulating shell further includes：Frame (3) and cover board (4)；
Frame (3) side is provided with third through-hole (301), and tail pipe (1), frame (3) are fixed on the third through-hole (301) of frame (3)
An end face fixed substrate (2), cover board (4) is fixed in the other end of frame (3).
5. encapsulating shell according to claim 2, it is characterised in that：The first through hole (203) and the second through-hole (201) are equal
It is filled by the way of vacuum sputtering and plating, the packing material is that copper or other resistivity are less than 1.0x10-6The gold of Ω m
Belong to.
6. encapsulating shell according to claim 3, it is characterised in that：The non-conducting material is alundum (Al2O3) or aluminium nitride
Or zirconium oxide.
7. encapsulating shell according to claim 1 or 4, it is characterised in that：Tail pipe (1) diameter is less than 0.18mm, tail pipe
(1) fluid sealant is used to be adhesively fixed the intermediate optical fiber source tail optical fiber placed or photodetector tail optical fiber.
8. encapsulating shell according to claim 4, it is characterised in that：The cover board (4) and the material of frame (3) are metal
Material.
9. encapsulating shell according to claim 8, it is characterised in that：The metal material is kovar alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810474090.6A CN108615773B (en) | 2018-05-17 | 2018-05-17 | Photoelectric detector packaging shell for surface mounting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810474090.6A CN108615773B (en) | 2018-05-17 | 2018-05-17 | Photoelectric detector packaging shell for surface mounting |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108615773A true CN108615773A (en) | 2018-10-02 |
| CN108615773B CN108615773B (en) | 2020-07-14 |
Family
ID=63663856
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810474090.6A Active CN108615773B (en) | 2018-05-17 | 2018-05-17 | Photoelectric detector packaging shell for surface mounting |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108615773B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109346534A (en) * | 2018-11-23 | 2019-02-15 | 中国电子科技集团公司第四十四研究所 | A kind of ceramic cartridge structure and its encapsulating structure |
| CN110416321A (en) * | 2019-07-03 | 2019-11-05 | 北京航天时代光电科技有限公司 | A kind of photodetector that small size total null voltage is stable |
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| CN107703589A (en) * | 2017-08-11 | 2018-02-16 | 中航海信光电技术有限公司 | A kind of Multi-path parallel optical component encapsulating structure and Multi-path parallel optical component |
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| CN201039459Y (en) * | 2007-03-28 | 2008-03-19 | 梅嘉欣 | Encapsulation structure for computer electricity-sound sensor |
| CN102044535A (en) * | 2009-10-26 | 2011-05-04 | 佛山市国星光电股份有限公司 | Surface mounted device (SMD) light emitting diode (LED) device and display module thereof for outdoor display screen |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110416321A (en) * | 2019-07-03 | 2019-11-05 | 北京航天时代光电科技有限公司 | A kind of photodetector that small size total null voltage is stable |
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| Publication number | Publication date |
|---|---|
| CN108615773B (en) | 2020-07-14 |
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