CN108615773B - Photoelectric detector packaging shell for surface mounting - Google Patents
Photoelectric detector packaging shell for surface mounting Download PDFInfo
- Publication number
- CN108615773B CN108615773B CN201810474090.6A CN201810474090A CN108615773B CN 108615773 B CN108615773 B CN 108615773B CN 201810474090 A CN201810474090 A CN 201810474090A CN 108615773 B CN108615773 B CN 108615773B
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- substrate
- hole
- tail
- packaging shell
- package
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 49
- 239000000758 substrate Substances 0.000 claims abstract description 41
- 239000000835 fiber Substances 0.000 claims abstract description 26
- 238000012360 testing method Methods 0.000 claims abstract description 14
- 238000003466 welding Methods 0.000 claims abstract description 13
- 239000000919 ceramic Substances 0.000 claims abstract description 12
- 238000001465 metallisation Methods 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 7
- 239000013307 optical fiber Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 7
- 239000012811 non-conductive material Substances 0.000 claims description 6
- 239000007769 metal material Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 claims description 3
- 229910000833 kovar Inorganic materials 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 3
- 239000000565 sealant Substances 0.000 claims description 3
- 238000004544 sputter deposition Methods 0.000 claims description 3
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 3
- 238000005476 soldering Methods 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 5
- 238000011161 development Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000005553 drilling Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Light Receiving Elements (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention provides a photoelectric detector packaging shell for surface mounting, which takes a ceramic circuit substrate as a packaging shell substrate, wherein a packaging shell inner electrode, a testing electrode and a welding electrode are formed on the packaging shell substrate through a ceramic metallization process, the inner electrode and the testing electrode are arranged on a first end surface of the packaging shell substrate, the welding electrode is arranged on a second end surface of the packaging shell substrate, a circle of welding rings are metalized among the first end surface of the packaging shell substrate, the inner electrode and the testing electrode, a packaging shell frame is welded on the welding rings, and a packaging shell tail pipe is welded at a proper position on the packaging shell frame and used for fixing a photoelectric detector tail fiber. The packaging shell is suitable for surface mounting of a circuit board, and the mounting size of the photoelectric detector is effectively reduced.
Description
Technical Field
The invention belongs to the field of packaging of optoelectronic devices, and particularly relates to a photoelectric detector packaging shell for surface mounting.
Background
Photoelectric detector converts light signal into the signal of telecommunication, is one of the indispensable subassembly in optical fiber sensing, the optical communication, and outside light signal passes through inside the photoelectric detector tail optical fiber gets into photoelectric detector, is converted into current signal by inside photosensitive element, and inside processing circuit converts weak current signal into voltage signal output, and the photoelectric detector encapsulates the shell effect: the mechanical support is used for providing a support point for the tail fiber of the photoelectric detector and protecting the internal circuit from being damaged by external machinery; the sealing protection is realized, a relatively stable water vapor environment is provided for the internal elements of the packaging shell, and the influence of external water vapor on the circuit is avoided; the electric signal connection is used for providing electric connection for the external circuit inside the packaging shell; heat dissipation: the heat generated by the circuit in the packaging shell is transferred out, and the overhigh temperature of the product is avoided.
At present, the photoelectric detector mostly adopts metal pins to realize the electrical connection of an internal circuit and an external circuit, and the tail fiber is mostly fixed with a tail tube of a packaging shell by adopting a metalized optical fiber assembly through tin soldering. Because the contact pin has a large product installation space and protrudes out of the photoelectric detector packaging shell, the production, test and transportation links are easy to be touched to cause product damage and damage to the product sealing property; the existence of the metalized optical fiber assembly requires that the opening of the tail pipe of the packaging shell is large, and the height of the packaging shell is limited. With the advent of the miniaturized and high-density era of optical communication and optical sensing, the pin-type photodetector is more and more difficult to adapt to the high-density installation requirement.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: aiming at the defects of the prior art, the photoelectric detector packaging shell for surface mounting is provided, the ceramic metallization process is adopted, the upper electrode and the lower electrode are formed on the non-conductive ceramic substrate, the upper electrode and the lower electrode are communicated by adopting the laser drilling process, the packaging shell metal frame is welded on the ceramic substrate, the surface mounting of the photoelectric detector is finally realized, the mounting space of the photoelectric detector is effectively reduced, and the photoelectric detector packaging shell is suitable for the miniaturization high-density development trend in the fields of optical sensing and optical communication.
The technical solution adopted by the invention comprises the following steps:
a photodetector package for surface mounting, comprising: a substrate (2) and a tail pipe (1);
electrodes are uniformly distributed on the first end face and the second end face of the substrate (2), an external circuit board is welded on the electrodes on the first end face, the electrodes on the second end face are connected with a chip of an optical fiber light source or a chip of a photoelectric detector, and a tail tube (1) is used for placing a tail fiber of the optical fiber light source or a tail fiber of the photoelectric detector;
the substrate (2) is provided with a first through hole (203), and the first through hole (203) enables the electrodes on the first end face and the second end face of the substrate (2) to be communicated.
Electrodes (202) used for testing are distributed on the edge of the second end face of the substrate (2), second through holes (201) are formed in the electrodes (202) used for testing, and the electrodes (202) used for testing are communicated with the electrodes on the first end face of the substrate (2) through the second through holes (201).
The packaging shell substrate (2) is made of non-conductive materials, and electrodes of the substrate (2) are formed by adopting a ceramic metallization process.
The package further includes: a frame (3) and a cover plate (4);
a third through hole (301) is formed in the side face of the frame (3), a tail pipe (1) is fixed to the third through hole (301) of the frame (3), a base plate (2) is fixed to one end face of the frame (3), and a cover plate (4) is fixed to the other end face of the frame (3).
The first through hole (203) and the second through hole (201) are filled in a vacuum sputtering and electroplating mode, and the filling material is copper or other materials with resistivity lower than 1.0x10-6Omega m of metal.
The non-conductive material is aluminum oxide or aluminum nitride or zirconium oxide.
The diameter of the tail pipe (1) is smaller than 0.18mm, and the tail pipe (1) is adhered and fixed with the fiber light source tail fiber or the photoelectric detector tail fiber which is arranged in the middle by adopting sealant.
The cover plate (4) and the frame (3) are made of metal materials.
The metal material is a kovar alloy.
Compared with the prior art, the invention has the advantages that:
(1) the packaging shell of the invention adopts ceramic metallization process and laser drilling to communicate the electrodes on the two sides of the packaging shell substrate, thus realizing surface mounting of the packaging shell and saving installation space.
(2) The tail tube of the packaging shell adopts the capillary metal tube or the ceramic tube, so that the tail fiber of the photoelectric detector can be directly fixed in the tail tube without metallization, and the height of the packaging shell is effectively reduced.
(3) The packaging shell of the invention adopts mixed packaging of ceramics and metal, thus shortening the development period of the packaging shell and reducing the development and development costs.
Drawings
FIG. 1 is a schematic view of the package structure of the present invention;
FIG. 2 is a schematic view of a package tail tube of the present invention;
FIG. 3 is a schematic view of a first end surface of a package substrate according to the present invention;
FIG. 4 is a schematic view of a second end face of a package substrate of the present invention;
FIG. 5 is a schematic view of a package frame of the present invention;
fig. 6 is a schematic diagram of a package cover plate according to the present invention.
Detailed Description
The following describes a package of a photodetector for surface mounting according to the present invention in further detail with reference to the accompanying drawings and specific embodiments.
The working principle of the invention is as follows: the linear motion of the detector taken out of the socket is converted into the rotation of the rotating block along the curved surface of the rotating block, so that the manual control is facilitated, and the uniform stress of each pin is ensured when the detector is taken out.
As shown in fig. 1, a package for a surface mount photodetector of the present invention includes 1 package tail tube 1, 1 package substrate 2, 1 package frame 3, and 1 package cover plate 4.
The package tail tube 1 is fixed in the through hole 301 of the package frame 3, the second end face 303 of the package frame 3 is welded on the welding ring 206 of the package 2, and after the assembly of the internal circuit of the photoelectric detector is completed, the welding face 401 of the package cover plate 4 is welded with the first end face 304 of the package frame 3.
The tail tube 1 of the packaging shell is used for placing a tail fiber of an optical fiber light source or a photoelectric detector and is fixed in a through hole 301 on the third end face 302 of the frame 3 of the packaging shell, a tail fiber placing through hole 103 is arranged in the middle of the tail tube 1 of the packaging shell, and the diameter of the tail fiber placing through hole 103 is determined according to the diameter of the tail fiber and is generally 3-5 micrometers larger than that of the tail fiber; the rear end face 101 of the tail tube 1 of the packaging shell is provided with a through hole chamfer 102, the size of the chamfer is generally 1/2-2/3 of the outer diameter of the tail tube of the packaging shell, and the chamfer is arranged for facilitating glue filling operation, as shown in figure 2. The tail tube 1 is made of metal or nonmetal materials, the diameter of the tail tube 1 is smaller than 0.18mm, and the tail tube 1 is adhered and fixed with the fiber optic source tail fiber or the photoelectric detector tail fiber which is arranged in the middle by adopting sealant.
As shown in fig. 3 and 4, the package substrate 2 is a carrier of an internal circuit of the photodetector, the internal circuit and components of the photodetector are disposed on a first end surface 205 of the package substrate 2, and a test electrode 202, a through hole 201, an internal electrode 204, a through hole 203, and a solder ring 206 are disposed on the first end surface 205, as shown in fig. 3. The package substrate 2 is provided with a soldering electrode 208 on the second end surface 207, the package is soldered to an external circuit board by the soldering electrode 208, the through hole 201 communicates the test electrode 202 of the first end surface 205 with the soldering electrode 208 of the second end surface 207, and the through hole 203 communicates the internal electrode 204 of the first end surface 205 with the soldering electrode 208 of the second end surface 207, as shown in fig. 4. The photoelectric detector circuit and elements are electrically connected with the inner electrode 204 on the packaging shell substrate 2 through leads, the photoelectric detector circuit and elements comprise a chip of an optical fiber light source or a chip of a photoelectric detector, and the through hole 203 is communicated with the inner electrode 204 and weldedThe electrode 208 is welded on an external circuit board, so that the electrical connection between the photoelectric detector circuit and the external circuit is realized; the through hole 201 is communicated with the test electrode 202 and the welding electrode 208, and after the photoelectric detector is welded on an external circuit board, whether welding quality hidden danger exists or not can be checked through the test electrode 202. The through hole 203 and the through hole 201 are filled in a vacuum sputtering and electroplating mode, and the filling material is copper or other materials with the resistivity lower than 1.0x10-6Omega m of metal. The packaging shell substrate 2 is made of non-conductive materials, and electrodes of the substrate 2 are formed by adopting a ceramic metallization process.
As shown in fig. 5, the package frame 3 is located between the package substrate 2 and the package cover plate 4 to form a cavity of the package, and the photodetector circuit is located in the cavity 305 of the package frame 3; the packaging shell frame 3 provides support for the packaging shell tail pipe 1, and a through hole 301 is formed in the third end face 302 of the packaging shell frame 3 and used for fixing the packaging shell tail pipe 1; the second end 303 of the package 3 is soldered to the solder ring 206 of the package substrate 2, and the first end 304 of the package frame 3 is used for soldering the package cover plate 4.
As shown in fig. 6, the package cover plate 4 is located at the top of the package, the size of the package cover plate is slightly smaller than the external size of the package frame, one side of the package cover plate 4 is flat, the other side of the package cover plate 4 is provided with a boss 402, the periphery of the boss is a package cover plate 4 welding area 401, when the internal components of the photodetector are assembled in place, the package cover plate 4 is placed on the package frame 3, the boss 402 of the package cover plate 4 is placed in the cavity 305 of the package frame 3, and the welding area 401 is aligned with the first end face 304 of the package frame 3 and is welded and.
The non-conductive material is aluminum oxide or aluminum nitride or zirconium oxide. The metal material is a kovar alloy.
It should be noted that, the contents that are not described in detail in this specification can be realized by those skilled in the art through the description in this specification and the prior art, and therefore, the details are not described herein.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. For a person skilled in the art, without inventive step, several modifications and alterations of the present invention are possible, all of which are intended to be covered by the scope of the present invention.
Claims (7)
1. A photoelectric detector packaging shell for surface mounting is characterized in that: comprises a frame (3), a substrate (2) and a tail pipe (1);
electrodes are uniformly distributed on the first end face (205) and the second end face (207) of the substrate (2), an external circuit board is welded on the electrodes of the second end face (207), the electrodes of the first end face (205) are connected with a chip of an optical fiber light source or a chip of a photoelectric detector, and a tail pipe (1) is used for placing a tail fiber of the optical fiber light source or a tail fiber of the photoelectric detector;
the substrate (2) is provided with a first through hole (203), and the first through hole (203) enables electrodes of the first end surface (205) and the second end surface (207) of the substrate (2) to be communicated;
the edge of the first end face (205) of the substrate (2) is also distributed with electrodes (202) for testing, a second through hole (201) is formed corresponding to the electrodes (202) for testing, and the second through hole (201) enables the electrodes (202) for testing to be communicated with the electrodes on the second end face (207) of the substrate (2);
the first through hole (203) and the second through hole (201) of the substrate (2) are filled in a vacuum sputtering and electroplating mode;
the electrode arranged on the second end face (207) of the substrate (2) is a welding electrode (208), and the packaging shell is welded on an external circuit board through the welding electrode (208);
the electrode arranged on the first end surface (205) is an internal electrode (204);
the substrate (2) welding electrode (208) is positioned on the surface of the substrate (2);
the substrate (2) is made of a non-conductive material, and an electrode of the substrate (2) is formed by adopting a ceramic metallization process; the tail tube (1) adopts a capillary metal tube or a ceramic tube, so that the tail fiber of the photoelectric detector can be directly fixed in the tail tube without metallization;
a tail fiber placing through hole (103) is formed in the middle of the tail pipe (1), and the diameter of the tail fiber placing through hole (103) is determined according to the diameter of the tail fiber; a through hole chamfer (102) is arranged on the rear end surface (101) of the tail pipe (1) of the packaging shell;
the tail tube (1) is adhered and fixed with a fiber light source tail fiber or a photoelectric detector tail fiber which is arranged in the middle by adopting sealant;
the package further includes: a frame (3) and a cover plate (4);
the tail pipe (1) is fixed in a through hole (301) on the third end face (302) of the packaging shell frame (3) and is not integrally formed.
2. The package according to claim 1, wherein the frame (3) has a third through hole (301) formed in a side surface thereof, the tail tube (1) is fixed to the third through hole (301) of the frame (3), the substrate (2) is fixed to one end surface of the frame (3), and the cover plate (4) is fixed to the other end surface of the frame (3).
3. The package of claim 1, wherein: the filling material of the first through hole (203) and the second through hole (201) is copper or other filling materials with resistivity lower than 1.0x10-6An ohmic metal.
4. The package of claim 1, wherein: the non-conductive material is aluminum oxide or aluminum nitride or zirconium oxide.
5. A package according to claim 1 or 2, wherein: the diameter of the tail pipe (1) is less than 0.18 mm.
6. The package of claim 2, wherein: the cover plate (4) and the frame (3) are made of metal materials.
7. The package of claim 6, wherein: the metal material is a kovar alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810474090.6A CN108615773B (en) | 2018-05-17 | 2018-05-17 | Photoelectric detector packaging shell for surface mounting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810474090.6A CN108615773B (en) | 2018-05-17 | 2018-05-17 | Photoelectric detector packaging shell for surface mounting |
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| Publication Number | Publication Date |
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| CN108615773A CN108615773A (en) | 2018-10-02 |
| CN108615773B true CN108615773B (en) | 2020-07-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810474090.6A Active CN108615773B (en) | 2018-05-17 | 2018-05-17 | Photoelectric detector packaging shell for surface mounting |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109346534B (en) * | 2018-11-23 | 2024-05-07 | 中国电子科技集团公司第四十四研究所 | Ceramic tube shell structure and packaging structure thereof |
| CN110416321B (en) * | 2019-07-03 | 2021-04-13 | 北京航天时代光电科技有限公司 | Small-size photoelectric detector with stable zero voltage |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201984189U (en) * | 2011-03-16 | 2011-09-21 | 成都天润光电有限责任公司 | Photoelectric detector |
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| CN201039459Y (en) * | 2007-03-28 | 2008-03-19 | 梅嘉欣 | Encapsulation structure for computer electricity-sound sensor |
| CN102044535B (en) * | 2009-10-26 | 2012-08-08 | 佛山市国星光电股份有限公司 | Surface mounted device (SMD) light emitting diode (LED) device and display module thereof for outdoor display screen |
| CN201616452U (en) * | 2010-03-05 | 2010-10-27 | 河北中瓷电子科技有限公司 | High-power LED packaging shell |
| CN203553096U (en) * | 2013-11-26 | 2014-04-16 | 无锡日联科技有限公司 | Cathode electron gun used for micro-focus X-ray tube |
| CN105281197A (en) * | 2015-11-11 | 2016-01-27 | 中国电子科技集团公司第四十四研究所 | Semiconductor light source packaging structure with high shock-resistant performance |
| CN107703589B (en) * | 2017-08-11 | 2019-08-16 | 中航海信光电技术有限公司 | A kind of Multi-path parallel optical component encapsulating structure and Multi-path parallel optical component |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN201984189U (en) * | 2011-03-16 | 2011-09-21 | 成都天润光电有限责任公司 | Photoelectric detector |
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