CN218040197U - Laser device - Google Patents

Abstract

The application discloses laser belongs to the technical field of photoelectricity. The laser includes: the light-emitting device comprises a bottom plate, a frame body, a plurality of light-emitting chips and a light-transmitting sealing layer; the first end part of the frame body in the axial direction is fixed with the bottom plate, and the frame body and the bottom plate enclose a groove; the plurality of light emitting chips are positioned in the groove; the light-transmitting sealing layer is fixed with the second end part in the frame body in the axial direction so as to seal the groove; the second end part and the light-transmitting sealing layer are both circular. The risk that the printing opacity sealing layer is damaged can be reduced to this application, has solved the lower problem of preparation yield of laser instrument. The application is used for light emission.

Description

Laser device

Technical Field

The application relates to the field of photoelectric technology, in particular to a laser.

Background

With the development of the photoelectric technology, the application of the laser is more and more extensive, and the requirement on the preparation yield of the laser is higher.

In the related art, a laser includes a base plate, a frame body, a plurality of light emitting chips, and a sealing glass. The frame body is fixed on the bottom plate, and encloses a groove with the bottom plate, and the light-emitting chip is located in the groove. One end of the frame body far away from the bottom plate is an opening of the groove. The frame body and the sealing glass are rectangular, and the sealing glass is fixed with one end of the frame body, which is far away from the bottom plate, so that the groove is sealed, and the luminous chip is prevented from being corroded by substances such as external water oxygen.

In the process of fixing the sealing glass on the frame body, the sealing glass is subjected to more heat and then expands to a certain extent, and the sealing glass is easy to break under the expansion. Therefore, the production yield of the laser is low.

SUMMERY OF THE UTILITY MODEL

The application provides a laser, can solve the lower problem of preparation yield of laser. The laser includes: the light-emitting device comprises a bottom plate, a frame body, a plurality of light-emitting chips and a light-transmitting sealing layer;

a first end part of the frame body in the axial direction is fixed with the bottom plate, and a groove is formed by the frame body and the bottom plate; the plurality of light emitting chips are positioned in the grooves; the light-transmitting sealing layer is fixed with a second end part in the frame body in the axial direction so as to seal the groove; the second end and the light-transmitting sealing layer are both circular.

Optionally, the first end is rectangular.

Optionally, the laser further comprises a plurality of electrode pins fixed with the first end portion;

each electrode pin comprises a first part and a second part, the first part is positioned in the surrounding area of the frame body, and the second part is positioned outside the surrounding area of the frame body; the first portion is used for being electrically connected with the light-emitting chip, and the second portion is used for being electrically connected with an external power supply.

Optionally, the electrode pin is a metal pin;

or, the electrode pin is a ceramic insulator, and the first part and the second part both comprise a ceramic main body and a conductive part located on the ceramic main body.

Optionally, the material of the frame includes ceramic, and the laser further includes: and the edge of the light-transmitting sealing layer is fixed with the second end part through the first annular solder.

Optionally, the laser further comprises a circular support frame and a second annular solder;

the outer edge of the circular support frame is fixed with the second end portion, the second annular welding flux is located between the inner edge of the circular support frame and the light-transmitting sealing layer, and the edge of the light-transmitting sealing layer is fixed with the inner edge of the circular support frame through the second annular welding flux.

Optionally, the frame body and the circular support frame are made of metal, and the outer edge of the circular support frame and the second end are fixed through an electric resistance welding process or a laser welding process.

Optionally, the frame body is formed by a powder metallurgy process;

and/or the material of the bottom plate comprises metal or ceramic.

Optionally, the laser further comprises: the light emitting chips are arranged on the bottom plate, and the light emitting chips are arranged on the bottom plate;

each light-emitting chip is positioned on the surface, far away from the bottom plate, of the corresponding heat sink, and each reflecting prism is positioned on the light-emitting side of the corresponding light-emitting chip; the light emitting chips are used for emitting laser to the corresponding reflecting prisms, and the reflecting prisms are used for reflecting the laser to the light-transmitting sealing layer.

Optionally, the laser further comprises: the collimating lens group is positioned on one side of the light-transmitting sealing layer, which is far away from the bottom plate;

the collimating lens group comprises a plurality of collimating lenses which are in one-to-one correspondence with the plurality of light-emitting chips, laser emitted by each light-emitting chip penetrates through the sealed light-transmitting layer and is emitted to the corresponding collimating lens, and the collimating lenses are used for collimating and emitting the received laser.

The beneficial effect that technical scheme that this application provided brought includes at least:

in the laser that this application provided, the second tip of printing opacity sealing layer and fixed framework mutually all is circular. Therefore, even if the light-transmitting sealing layer expands to a certain extent under the action of heat received during fixing, the expansion amount of the circular light-transmitting sealing layer in each direction is consistent, so that the risk of breakage of the light-transmitting sealing layer due to different expansion amounts in different directions can be reduced, and the preparation yield of the laser is improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a laser provided in an embodiment of the present application;

FIG. 2 is a schematic structural diagram of another laser provided in an embodiment of the present application;

fig. 3 is a schematic structural diagram of another laser provided in an embodiment of the present application;

FIG. 4 is a schematic structural diagram of another laser provided in the embodiments of the present application;

fig. 5 is a schematic structural diagram of a laser according to another embodiment of the present application;

FIG. 6 is a schematic structural diagram of a lid assembly according to an embodiment of the present disclosure;

FIG. 7 is a schematic structural diagram of another exemplary lid assembly according to the present disclosure;

FIG. 8 is a schematic view of another exemplary lid assembly according to an embodiment of the present disclosure;

fig. 9 is a schematic structural diagram of another laser provided in another embodiment of the present application.

Detailed Description

To make the objects, technical solutions and advantages of the present application more clear, the following detailed description of the embodiments of the present application will be made with reference to the accompanying drawings.

With the development of the optoelectronic technology, the application of the laser is wider and wider, for example, the laser can be used as a light source in a laser projection device or a laser television, and the requirements on various aspects of the laser are higher and higher. The following embodiment of the application provides a laser, can reduce the cracked risk of printing opacity sealing layer among the laser, improves the preparation yield of laser, reduces holistic manufacturing cost.

Fig. 1 is a schematic structural diagram of a laser provided in an embodiment of the present application, and fig. 1 is an exploded view of the laser. As shown in fig. 1, the laser 10 includes a base plate 101, a frame 102, a plurality of light emitting chips 103, and a light-transmitting sealing layer 104.

The base plate 101 has a plate-like structure. The plate-like structure has two opposite and larger plate faces and a plurality of smaller side faces connecting the two faces. The frame 102 has a frame-like structure. The two ends of the frame-shaped structure in the axial direction are respectively provided with two opposite annular end surfaces, and the frame-shaped structure is also provided with an inner wall and an outer wall which are connected with the two end surfaces. The axial direction of the frame 102 in the laser 10 shown in fig. 1 is the z-direction. In the embodiment of the present application, the frame body 102 may be sequentially divided into a first end portion 1021 and a second end portion 1022 along the axial direction thereof, and the first end portion 1021 and the second end portion 1022 are of an integral structure. The first end 1021 and the second end 1022 are both frame-shaped structures.

The first end 1021 of the frame 102 can be fixed to the bottom plate 101, and the frame 102 and the bottom plate 101 enclose a groove, which is an accommodation space. In fig. 1, the frame 102 is positioned on the bottom plate 101, and one end surface of the frame 102 (i.e., the surface of the first end 1021 that is far from the second end 1022) is fixed to the plate surface of the bottom plate 101. Alternatively, the frame 102 may also be fixed to the bottom plate 101 by using an inner wall, for example, the frame 102 may surround the bottom plate 101, and the inner wall of the first end portion 1021 in the frame 102 is fixed to the side surface of the bottom plate 101, which is not illustrated in this embodiment of the application. The structure formed by the frame 102 and the bottom plate 101 may be referred to as a case or a base.

The light emitting chips 103 in the laser 101 are all located in this recess, e.g. the light emitting chips 103 may be located on the base plate 101. The light-transmitting sealing layer 104 is fixed to the second end 1022 of the frame 102 to seal the groove enclosed by the frame 102 and the bottom plate 101. The light-transmitting sealing layer 104, the frame body 102 and the bottom plate 101 can enclose a sealed cavity, and the light-emitting chip 103 is located in the sealed cavity, so that corrosion of substances such as external water, oxygen and the like can be avoided, and the damage risk of the light-emitting chip 103 is reduced. The light transmissive sealing layer 104 may also be referred to as a light window.

As shown in fig. 1, the second end 1022 of the frame 102 and the light transmissive sealing layer 104 may be both circular. The second end 1022 is a frame-shaped structure, and the second end 1022 is circular, i.e., the second end 1022 is a circular frame-shaped structure. The orthographic projection of the second end 1022 on the base plate 101 may be a circular ring, and the surface of the second end 1022 away from the base plate 101 is circular ring-shaped.

In the related art, both the sealing glass and the frame body are rectangular. When fixed sealing glass and framework, the inflation volume of the length limit of sealing glass back of being heated exists the difference, leads to sealing glass to exist the difference in the stress that receives in the equidirectional, and then breaks more easily under the influence of this stress, and the existence of right angle also leads to this position to break the risk under the effect of stress higher in the rectangle sealing glass.

In the embodiment of the present application, the light-transmissive sealing layer 104 is circular, and the second end portion 1022 of the frame 102 for fixing with the light-transmissive sealing layer 104 is also circular. Because the circle does not have positions such as long and short sides and right angles, the expansion amount in each direction is consistent when the light-transmitting sealing layer 104 is heated, the expansion amount difference caused by the long and short sides or the right angles can be avoided, the cracking problem of the light-transmitting sealing layer 104 caused by stress change caused by the expansion amount difference in different directions is solved, the cracking risk of the light-transmitting sealing layer 104 is reduced, and the preparation yield of the laser 10 is further improved.

To sum up, among the laser instrument that this application provided, the second tip of printing opacity sealing layer and fixed framework mutually all is circular. In this way, even if the light-transmitting sealing layer expands to a certain extent under the action of heat received during fixing, the expansion amounts of the circular light-transmitting sealing layer in all directions are consistent, so that the risk of cracking of the light-transmitting sealing layer due to different expansion amounts in different directions can be reduced.

The second end portion of the frame body to which the light-transmitting sealing layer is fixed may also be rounded, and the amount of expansion of the second end portion in each direction may be uniform when the second end portion is heated. So can avoid because the expansion of second tip on equidirectional difference leads to with the fixed condition of misplacing of printing opacity sealing layer, can improve the fixed effect of framework and printing opacity sealing layer.

In the embodiment of the present application, the material of the bottom plate 101 may include metal or ceramic. For example, the material of the base plate 101 may be oxygen-free copper, tungsten copper, aluminum plate or other metal materials. The material of the frame 102 may include metal or ceramic. For example, the frame 102 may be made of stainless steel, kovar, or other metal materials. Alternatively, the material of the bottom plate 101 and the frame 102 may be the same. The material of the translucent sealing layer 104 may be a high-transmittance material such as glass of BK7 standard, glass of K9 standard, or sapphire, and BK7 is borosilicate crown glass.

In the embodiment of the present application, the fixing manner of the light-transmissive sealing layer 104 and the second end 1022 of the frame 102 can be various, and two alternative fixing manners are described below.

In a first alternative fixing manner, fig. 2 is a schematic structural diagram of another laser provided in an embodiment of the present application, and fig. 2 may be a schematic diagram of a target cross section of the laser 10 shown in fig. 1, where the target cross section may be parallel to the x direction in fig. 1. Referring to fig. 1 and fig. 2, the light-transmissive sealing layer 104 may be directly fixed to the second end 1022 of the frame 102.

The laser 10 may further comprise a first ring-shaped solder (not shown) between an edge of the light-transmissive sealing layer 104 and a surface of the second end 1022 remote from the base plate 101, by which the edge of the light-transmissive sealing layer 104 is fixed to the second end 1022. For example, the first annular solder and the light-transmitting sealing layer 104 may be sequentially placed on the side of the second end 1022 of the frame 102 away from the bottom plate 101, and the first annular solder is heated and melted, so that the light-transmitting sealing layer 104 and the second end 1022 of the frame 102 are fixed. Alternatively, the first ring-shaped solder may be provided at the edge of the light-transmitting sealant 104.

The surface of the second end 1022 of the frame 102 for fixing to the light-transmissive sealing layer 104 is a ring surface. In this fixing manner, the diameter of the light-transmitting sealing layer 104 is larger than the diameter of the inner ring of the annular surface and smaller than or equal to the diameter of the outer ring of the annular surface. For example, the diameter of the light-transmitting sealing layer 104 may be equal to the diameter of the outer ring of the annular surface, or slightly smaller than the diameter of the outer ring of the annular surface, so as to ensure that the contact area between the light-transmitting sealing layer 104 and the second end 1022 is large. The loop width of the first loop solder may be equal to the loop width of the loop surface or slightly smaller than the loop width of the loop surface.

Alternatively, in this fixing method, the material of the frame 102 may be ceramic, and the material of the first annular solder may be gold-tin solder.

In a second alternative fixing manner, fig. 3 is a schematic structural diagram of another laser provided in the embodiment of the present application, fig. 4 is a schematic structural diagram of another laser provided in the embodiment of the present application, and fig. 5 is a schematic structural diagram of a laser provided in another embodiment of the present application. Fig. 3 is an exploded view of the laser 10, fig. 4 may be a schematic view of a target cross-section of the laser 10 shown in fig. 3, the target cross-section being a cross-section parallel to the x-direction in fig. 3, and fig. 5 is a top view of the laser shown in fig. 4.

As shown in fig. 3 to 5, the laser 10 further includes: the light transmissive sealing layer 104 can be fixed to the second end 1022 of the frame 102 by the circular supporting frame 107 through the circular supporting frame 107. For example, the light-transmissive sealing layer 104 may be fixed to the circular supporting frame 107, and the circular supporting frame 107 is further fixed to the second end portion 1022. The circular support frame 107 may also be referred to as an upper cover. The circular support frame 107 is ring-shaped, the edge of the light-transmitting sealing layer 104 can be fixed to the inner edge of the circular support frame 107, and the outer edge of the circular support frame 107 is fixed to the second end 1022. The inner edge and the outer edge are two regions obtained by dividing the circular support frame 107 in the radial direction. The structure formed by fixing the circular support frame 107 and the light-transmissive sealing layer 104 may also be referred to as a top cover assembly.

An inner edge of the circular support frame 107 may be recessed toward the bottom plate 101 with respect to an outer edge, and an edge of the light transmissive sealing layer 104 may be fixed to a side of the inner edge away from the bottom plate 101. Thus, the circular support frame 107 can bear the light-transmitting sealing layer 104, and the falling risk of the light-transmitting sealing layer 104 is reduced. And the inner edge can play a role in limiting the light-transmitting sealing layer 104, so that the accuracy of the fixing position of the light-transmitting sealing layer 104 is ensured. The light-transmitting sealing layer 104 can be surrounded by the second end 1022 of the frame 102, and the second end 1022 can protect the light-transmitting sealing layer 104, so as to prevent the light-transmitting sealing layer 104 from being damaged by colliding with a structure outside the frame 102. Optionally, the inner edge of the circular supporting frame 107 may not be recessed, and the light-transmitting sealing layer 104 may also be fixed to a side of the inner edge close to the bottom plate 101, which is not limited in the embodiment of the present application.

Fig. 6 is a schematic structural diagram of an upper cover assembly according to an embodiment of the present application, fig. 7 is a schematic structural diagram of another upper cover assembly according to an embodiment of the present application, and fig. 8 is a schematic structural diagram of another upper cover assembly according to an embodiment of the present application. Fig. 6 may be an exploded view of the upper cover assembly of fig. 3 to 5, fig. 7 may be a top view of the upper cover assembly, and fig. 8 is a schematic view of a cross-section of the upper cover assembly. As shown in fig. 3 to 8, the cover assembly may further include a second annular solder H, the second annular solder is located between the inner edge of the circular support frame 107 and the light-transmissive sealing layer 104, and the edge of the light-transmissive sealing layer 104 may be fixed to the inner edge of the circular support frame 107 by the second annular solder H. Fig. 3 to 5 do not illustrate the second annular solder H.

The second annular solder H may be located between an edge of the light-transmitting sealant 104 near the surface of the bottom plate 101 and an inner edge of the circular support frame 107 to fix the edge of the light-transmitting sealant 104 near the surface of the bottom plate 101 and the inner edge of the circular support frame 107. Alternatively, the second annular solder H may surround the light-transmissive sealing layer 104 to fix the side surface of the light-transmissive sealing layer 104 to the inner edge of the circular support frame 107. For example, when assembling the cover assembly, the second annular solder H and the light transmissive sealing layer 104 may be placed on the inner edge of the circular support frame 107, and the second annular solder H surrounds the light transmissive sealing layer 104. Then, the second annular solder H is heated to be melted, and then cooled to realize the sealing of the inner edge of the circular support frame 107 and the light-transmitting sealing layer 104.

Optionally, the material of the circular supporting frame 107 may be kovar alloy or other metals. The circular support frame 107 may be formed by a Computer Numerical Control (CNC) machining process or a stamping process. The material of the second annular solder H may be silicate, borate, epoxy resin, or the like. Optionally, the material of the frame body 102 in this fixing manner may include metal, and the outer edge of the circular supporting frame 107 and the second end 1022 of the frame body 102 may be fixed by an electric resistance welding process or a laser welding process. The resistance welding process may include a parallel seal welding process.

In the related art, the sealing glass may be fixed to the frame body by the support frame, and in the related art, the sealing glass may be fixed to the support frame by the low-temperature glass. Because the sealing glass and the supporting frame in the related art are rectangular, the fluidity of the low-temperature glass between all areas on the supporting frame after melting is poor, the uniformity of the solder at different positions is low, and the fixing effect of the sealing glass and the supporting frame is poor.

In the embodiment of the present application, the light-transmitting sealing layer 104 and the supporting frame are both circular, and the fluidity of the solder in the inner edge region of the circular supporting frame 107 is good when the solder is melted, so that the solder at each position can be ensured to be distributed uniformly, the fixing effect of the light-transmitting sealing layer 107 and the circular supporting frame 107 is further improved, and the sealing performance of the final sealing cavity is ensured to be good.

With continued reference to fig. 1, 3, or 5, the first end 1021 of the frame 102 may be rectangular. The first end 1021 is also a frame-shaped structure, and the first end 1021 is rectangular, that is, the first end 1021 is a rectangular frame-shaped structure. The orthographic projection of the first end 1021 on the bottom plate 101 may be a rectangular ring, and the surface of the second end 1022 far from the bottom plate 101 is a rectangular ring. This configuration of the frame 102 may be referred to as a square circle configuration. Alternatively, the first end 1021 may be square, and the annular face of the first end 1021 may include a square outer ring and a square inner ring. The diameter of the outer ring of the annular surface of the second end 1022 may be equal to the length of the side of the square outer ring of the annular surface of the first end 1021, and the diameter of the inner ring of the annular surface of the second end 1022 may be equal to the length of the side of the square inner ring of the annular surface of the first end 1021. Optionally, the first end 1021 may also be circular, and the embodiment of the present application is not limited. The frame body 102 in the embodiment of the present application is a special-shaped structure, and the shape is irregular, and the frame body 102 can be formed by a powder metallurgy process.

With continued reference to fig. 1 and fig. 3, the laser 10 may further include a plurality of heat sinks 105 and a plurality of reflection prisms 106, where the plurality of heat sinks 105 and the plurality of reflection prisms 106 are located in the grooves defined by the base plate 101 and the frame 102, and are attached to the base plate 101.

The plurality of heat sinks 105 correspond to the plurality of light emitting chips 103 in the laser 10 one to one, and the plurality of reflection prisms 106 also correspond to the plurality of light emitting chips 103 one to one. Each light emitting chip 103 is located on a surface of the corresponding heat sink 105 remote from the base plate 101, and the heat sink 105 may be used to assist the corresponding light emitting chip 103 in dissipating heat. The material of the heat sink 105 may comprise a ceramic. Each of the reflecting prisms 106 is located at the light exit side of the corresponding light emitting chip 103. The surface of the reflection prism 106 near the light emitting chip 103 may be a light reflection surface. The light emitting chips 103 may emit laser light to the corresponding reflecting prisms 106, and the light reflecting surfaces of the reflecting prisms 106 may reflect the laser light in a direction away from the base plate 101, so that the laser light may be emitted from the light transmissive sealing member 104. For example, the reflecting surface can reflect the laser by coating reflecting materials (such as silver, aluminum and the like) or attaching a reflecting film.

The laser 10 provided in the embodiment of the present application may be a monochromatic laser, for example, each light emitting chip 103 in the laser 10 is used for emitting laser light of the same color. Alternatively, the laser 10 may be a multi-color laser. The plurality of light-emitting chips 103 as in the laser 10 includes a plurality of types of light-emitting chips each for emitting laser light of one color, the colors of the laser light emitted from the different types of light-emitting chips being different. For example, the plurality of light emitting chips 103 may include a red light emitting chip for emitting red laser light, a green light emitting chip for emitting green laser light, and a blue light emitting chip for emitting blue laser light.

In the embodiment of the present application, the plurality of light emitting chips 103 are arranged in an array, and the plurality of light emitting chips 103 include 14 light emitting chips arranged in two rows and seven columns as an example. Optionally, the plurality of light emitting chips 103 may also include 21 light emitting chips arranged in three rows and seven columns, or the plurality of light emitting chips 103 may also be arranged in other manners and may also be in other numbers, which is not limited in this embodiment of the application.

With continued reference to fig. 1 to 5, the laser 10 further includes a plurality of electrode pins 108, and the electrode pins 108 may be fixed to the first end 1021 of the frame 102. Each electrode pin 108 may include a first portion and a second portion (not shown), the first portion being located in the enclosed region of the frame 102, and the second portion being located outside the enclosed region of the frame 102. Only a second portion of the electrode pin 108 is shown in fig. 5. The first portion of the electrode pin 108 is in communication with a second portion, the first portion being for electrical connection with the light emitting chip 103, and the second portion being for electrical connection with an external power source. In this way, each light emitting chip 103 in the laser 10 can receive current through the electrode pin 108, and then emit laser light under the action of the current. Illustratively, the laser 10 may further include a wire (not shown in the figure), and the light emitting chip 103 may be connected to the first portion of the electrode pin 108 through the wire. For example, the electrode pin 108 further includes a third portion between the first portion and the second portion, the third portion being used for communicating the first portion and the second portion and for fixing with the frame 102.

The electrode pin 10 shown in fig. 1 to 5 is a ceramic insulator. The first and second portions of the electrode pin 108 may each include a ceramic body and a conductive portion on the ceramic body, the conductive portion being exposed. The conductive portions in the first and second portions may communicate through the conductive portion in the third portion. The conductive portion on the second portion may be connected to an external power source, and the light emitting chip 103 may be connected to the wire portion on the first portion through a wire. The third portion may also include a ceramic body and a conductive portion, which may be embedded in and wrapped by the ceramic body. The ceramic body in the third section may be used to insulate the conductive portion from the frame 102. For example, the surface of the first end 1021 of the frame 102 near the bottom plate 101 may have a gap, and the third portion fills the gap to fix the first end 1021.

Optionally, fig. 9 is a schematic structural diagram of another laser provided in another embodiment of the present application. As shown in fig. 9, the electrode pin 108 in the laser 10 may be a metal pin, which is a cylindrical metal structure, and all positions of the metal pin are conductive. The wall of the first end 1021 of the frame 102 may have a plurality of openings, and each electrode pin 108 may be secured through one of the openings. Alternatively, a ring-shaped insulating member may be sleeved on a portion of the electrode lead 108 located in the opening, and the ring-shaped insulating member serves as a solder to fix the electrode lead 108 and the frame 102 and to insulate the electrode lead 108 and the frame 102.

The plurality of electrode pins 108 in the laser 10 may include a plurality of positive electrode pins and a plurality of negative electrode pins, which may be respectively located at opposite sides of the first end 1021 in the row direction of the light emitting chips 103. Optionally, each row of the light emitting chips 103 is configured to emit laser light of the same color, and each row of the light emitting chips 103 may be connected in series through a wire, and two ends of each row are respectively connected to one positive electrode pin and one negative electrode pin.

It should be noted that, in the embodiment of the present application, the first end portion 1021 in the frame body 102 is rectangular, so that the fixing area of the first end portion 1021 and the electrode pin 108 is large, which can improve the fixing reliability of the first end portion 1021 and the electrode pin 108, and ensure the air tightness of the connection between the frame body 102 and the electrode pin 108.

To sum up, among the laser instrument that this application provided, the second tip of printing opacity sealing layer and fixed framework mutually all is circular. In this way, even if the light-transmitting sealing layer expands to a certain extent under the action of heat received during fixing, the expansion amounts of the circular light-transmitting sealing layer in all directions are consistent, so that the risk of cracking of the light-transmitting sealing layer due to different expansion amounts in different directions can be reduced.

The term "at least one of a and B" and "a and/or B" in the present application is only one kind of association relationship describing the associated object, and means that there may be three kinds of relationships, that is, there are a alone, a and B at the same time, and B alone. The term "A, B and at least one of C" means that there may be seven relationships that may mean: there are seven cases of A alone, B alone, C alone, both A and B, both A and C, both C and B, and both A, B and C. In the embodiments of the present application, the terms "first", "second", and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. The term "at least one" means one or more, and the term "plurality" means two or more, unless expressly defined otherwise.

In the following description and in the claims, the terms "include" and "comprise" are used in an open-ended fashion, and thus should be interpreted to mean "include, but not limited to. "substantially" and "substantially" mean that within an acceptable error range, a person skilled in the art can solve corresponding technical problems within a certain error range and basically achieve corresponding technical effects. Where certain terms are used throughout the description and claims to refer to particular components, those skilled in the art will appreciate that a manufacturer may refer to a component by different names. This specification and claims do not intend to distinguish between components that differ in name but not function.

The above description is intended only to illustrate the alternative embodiments of the present application, and should not be construed as limiting the present application, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims (10)

1. A laser, characterized in that the laser comprises: the light-emitting device comprises a bottom plate, a frame body, a plurality of light-emitting chips and a light-transmitting sealing layer;

a first end part of the frame body in the axial direction is fixed with the bottom plate, and a groove is formed by the frame body and the bottom plate; the plurality of light emitting chips are positioned in the grooves; the light-transmitting sealing layer is fixed with a second end part in the frame body in the axial direction so as to seal the groove;

the second end and the light-transmitting sealing layer are both circular.

2. The laser of claim 1, wherein the first end is rectangular.

3. The laser of claim 2, further comprising a plurality of electrode pins fixed with the first end;

each electrode pin comprises a first part and a second part, the first part is positioned in the surrounding area of the frame body, and the second part is positioned outside the surrounding area of the frame body; the first portion is used for being electrically connected with the light emitting chip, and the second portion is used for being electrically connected with an external power supply.

4. The laser of claim 3, wherein the electrode pin is a metal pin;

or, the electrode pin is a ceramic insulator, and the first part and the second part both comprise a ceramic main body and a conductive part located on the ceramic main body.

5. The laser of claim 1, wherein the frame comprises a ceramic material, and further comprising: and the edge of the light-transmitting sealing layer is fixed with the second end part through the first annular solder.

6. The laser of claim 1, further comprising a circular support frame and a second annular solder;

the outer edge of the circular support frame is fixed with the second end portion, the second annular welding flux is located between the inner edge of the circular support frame and the light-transmitting sealing layer, and the edge of the light-transmitting sealing layer is fixed with the inner edge of the circular support frame through the second annular welding flux.

7. The laser of claim 6, wherein the frame body and the circular support frame are made of metal, and the outer edge of the circular support frame and the second end are fixed by an electric resistance welding process or a laser welding process.

8. The laser of any one of claims 1 to 7, wherein the frame is formed using a powder metallurgy process;

and/or the material of the bottom plate comprises metal or ceramic.

9. The laser of any one of claims 1 to 7, further comprising: the light emitting chips are arranged on the bottom plate, and the light emitting chips are arranged on the bottom plate;

each light-emitting chip is positioned on the surface, far away from the bottom plate, of the corresponding heat sink, and each reflection prism is positioned on the light-emitting side of the corresponding light-emitting chip; the light emitting chips are used for emitting laser to the corresponding reflecting prisms, and the reflecting prisms are used for reflecting the laser to the light-transmitting sealing layer.

10. The laser of any one of claims 1 to 7, further comprising: the collimating lens group is positioned on one side of the light-transmitting sealing layer, which is far away from the bottom plate;

the collimating lens group comprises a plurality of collimating lenses which are in one-to-one correspondence with the plurality of light-emitting chips, laser emitted by each light-emitting chip penetrates through the sealed light-transmitting layer and is emitted to the corresponding collimating lens, and the collimating lenses are used for collimating and emitting the received laser.

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