CN218242550U - Laser and light source component - Google Patents

Abstract

The application discloses laser instrument and light source subassembly belongs to the photoelectric technology field. The laser comprises a bottom plate, a frame body, at least three types of light-emitting chips and at least three pin structures; the frame body and the at least three types of light-emitting chips are positioned on the bottom plate, and the frame body surrounds the at least three types of light-emitting chips; each type of light-emitting chip in the at least three types of light-emitting chips is used for emitting laser with one color, and different types of light-emitting chips are used for emitting laser with different colors; the frame body is formed by encircling four side walls, at least three side walls in the four side walls are provided with notches, and the notches on the at least three side walls are respectively filled with the at least three pin structures; each pin structure comprises a plurality of electrode pins which are communicated with the inside and the outside of the surrounding area of the frame body and are mutually spaced; at least part of the light-emitting chips in each type of light-emitting chips are connected in series, two ends of the light-emitting chips are respectively and electrically connected with two electrode pins, and the different types of light-emitting chips are electrically connected with different electrode pins. The application solves the problem that the preparation process of the laser is complex. The application is used for light emission.

Description

Laser and light source component

Technical Field

The application relates to the field of photoelectric technology, in particular to a laser and a light source component.

Background

With the development of the optoelectronic technology, the laser is widely used, and the requirement for the laser is higher and higher.

In the related art, a laser includes: the light-emitting diode comprises a bottom plate and a frame body which surround a tube shell, three light-emitting chips which are arranged in two lines in the tube shell and four electrode pins which are respectively fixed on two opposite sides of the frame body. In order to transmit the current to the light emitting chips of the three colors through the four electrode pins, the laser further includes a plurality of switching stations for switching the wires, so that the light emitting chips of different colors share the electrode pins.

Therefore, the connection mode of the light emitting chip in the laser is complex, and the preparation of the laser is complex.

SUMMERY OF THE UTILITY MODEL

The application provides a laser and a light source component, which can solve the problem that the preparation of the laser is complex.

In one aspect, a laser is provided, the laser comprising: the LED lamp comprises a bottom plate, a frame body, at least three types of light-emitting chips and at least three pin structures;

the frame body and the at least three types of light-emitting chips are both positioned on the bottom plate, and the frame body surrounds the at least three types of light-emitting chips; each type of light-emitting chip in the at least three types of light-emitting chips is used for emitting laser with one color, and different types of light-emitting chips are used for emitting laser with different colors;

the frame body is formed by surrounding four side walls, at least three side walls in the four side walls are provided with notches, and the notches on the at least three side walls are filled with the at least three pin structures respectively; each pin structure comprises a plurality of electrode pins which are communicated with the inside and the outside of the surrounding area of the frame body and are spaced from each other; at least part of the light-emitting chips in each type of light-emitting chips are connected in series, two ends of the light-emitting chips are respectively and electrically connected with the two electrode pins, and the different types of light-emitting chips are electrically connected with the different electrode pins.

In another aspect, a light source assembly is provided, where the light source assembly includes the above laser and a light combining component located at the light emitting side of the laser; the light combination part is used for combining the laser lights with different colors emitted by the laser and emitting the combined laser lights.

The beneficial effect that technical scheme that this application provided brought includes at least:

in the laser that this application provided, different electrode pins can be connected to the luminous chip of heterogeneous electricity, so the luminous chip of establishing ties all can be connected with electrode pin nearby can, need not to set up too much switching platform among the laser and carry out the switching between luminous chip and the electrode pin, can simplify the connected mode of luminous chip and electrode pin among the laser, simplify the preparation process of laser.

In addition, a plurality of electrode pins in the laser provided by the application can belong to the same pin structure, and the pin structure is equivalent to an integrated structure of a plurality of electrode pins. Therefore, when the laser is prepared, the plurality of electrode pins can be fixed only by fixing one pin structure with the frame body, and the electrode pins do not need to be fixed independently, so that the preparation process of the laser can be further simplified.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a laser provided in an embodiment of the present application;

FIG. 2 is a schematic structural diagram of another laser provided in an embodiment of the present application;

fig. 3 is a schematic structural diagram of another laser provided in an embodiment of the present application;

FIG. 4 is a schematic structural diagram of another laser provided in the embodiments of the present application;

fig. 5 is a schematic structural diagram of a laser according to another embodiment of the present application;

fig. 6 is a schematic structural diagram of a frame provided in an embodiment of the present application;

fig. 7 is a schematic structural diagram of another frame provided in the embodiment of the present application;

fig. 8 is a schematic diagram of a pin structure according to an embodiment of the present application;

FIG. 9 is a schematic diagram of a solder structure provided by an embodiment of the present application;

FIG. 10 is a schematic view of another solder structure provided by embodiments of the present application;

FIG. 11 is a schematic diagram of another laser structure provided in another embodiment of the present application;

FIG. 12 is a schematic diagram of another embodiment of a laser;

fig. 13 is a schematic structural diagram of a light source module provided in an embodiment of the present disclosure.

Detailed Description

To make the objects, technical solutions and advantages of the present application more clear, embodiments of the present application will be described in further detail below with reference to the accompanying drawings.

With the development of the optoelectronic technology, the application of the laser is more and more extensive, for example, the laser can be used as a light source of a laser projection device or a laser television. The demand for miniaturization and ease of fabrication of lasers is also increasing today. In the related art, an electrode pin is inserted into a frame of a laser, and a light emitting chip in a region surrounded by the frame is connected to the electrode pin through a wire, so as to receive a current and realize light emission. In order to ensure the miniaturization of the laser and ensure that the laser comprises a plurality of types of light-emitting chips, the light-emitting chips of different types need to share the electrode pins, and the connection between the light-emitting chips and the electrode pins needs to be realized through more switching tables, the circuit connection mode of the light-emitting chips in the laser is complex, and the corresponding lead setting process is complex, so that the preparation process of the laser is complex. And the whole assembly error of the electrode pin is larger, which is not beneficial to the connection of the wires between the light-emitting chip and the electrode pin.

The embodiment of the application provides a laser, can carry out the integrated design with a plurality of electrode pins in the laser, and make all kinds of luminous chips all need not the common electrode pin to simplify the preparation process of laser, and improve the reliability of laser.

Fig. 1 is a schematic structural diagram of a laser provided in an embodiment of the present application. As shown in fig. 1, the laser 10 may include a base 101, a frame 102, a plurality of light emitting chips 103, and a pin structure 104.

The base plate 101 has a plate-like structure. The plate-like structure has two opposite and larger plate faces and a plurality of smaller side faces connecting the two faces. The frame 102 has a frame-like structure. The two ends of the frame-shaped structure in the axial direction are respectively provided with two opposite annular end surfaces, and the frame-shaped structure is also provided with an inner wall and an outer wall which are connected with the two end surfaces. In the embodiment of the present application, the frame body 102 may be a rectangular frame, and the frame body 102 is surrounded by four sidewalls.

One end of the frame 102 may be fixed to the bottom plate 101, and the frame 102 and the bottom plate 101 enclose a groove, which is an accommodating space. The light emitting chips 103 in the laser 101 are all located in this recess. If the frame 102 and the light emitting chip 103 are both located on the base plate 101, one end surface of the frame 102 is fixed to the plate surface of the base plate 101, and the frame 102 surrounds the light emitting chip 103. The structure formed by the frame 102 and the bottom plate 101 may be referred to as a case or a base. The sidewall of the frame 102 may have a gap K, and the lead structure 104 is fixed to the frame 102 and fills the gap K.

The lead structure 104 may be an integrated structure of a plurality of electrode leads. The electrode lead 104 may include a plurality of electrode leads 1042 spaced apart from each other and communicating with the inside and outside of the enclosed region of the frame 102. The electrode pins 102 may be sequentially arranged along a target direction, and the extending direction of each electrode pin 1042 is perpendicular to the target direction. The electrode pins 1042 may extend from the inside of the surrounding region of the frame 102 to the outside of the surrounding region, for example, in the pin structure 104 arranged in the x direction (i.e., the pin structure 104 closer to the left and the pin structure closer to the right in fig. 1), the extending direction of the electrode pins 1042 may be the x direction in fig. 1. Each of the electrode pins 1042 includes a first pad D1 located inside the surrounding area and a second pad D2 located outside the surrounding area, and the first pad D1 is electrically connected to the second pad D2. In the embodiment of the present application, the extending direction of the electrode pin 1042 is also the arrangement direction of the first pad D1 and the second pad D2. The first pad D1 is used to electrically connect with the light emitting chip 103, and the second pad D2 is used to electrically connect with an external circuit, so that current of the external circuit can be transmitted to the light emitting chip 103 through the electrode pin 103, so that the light emitting chip 103 emits laser light under the action of the current. As shown in fig. 1, the first pad D1 and the light emitting chip 103 are electrically connected by a wire (not labeled).

In this embodiment, the laser 10 may include at least three lead structures 104, at least three sidewalls of the frame 102 have notches K, the at least three lead structures 104 may fill the notches K on the at least three sidewalls respectively, and each lead structure 104 fills the notch K on one sidewall. Fig. 1 illustrates that the laser 10 may include three lead structures 104, and the frame 102 has notches K on three sidewalls. Fig. 2 is a schematic structural diagram of another laser provided in an embodiment of the present application. As shown in fig. 2, the laser 10 may also include four lead structures 104, and the frame 102 may also have notches K on four sidewalls.

In the embodiment of the present application, the lead structure 104 may have a strip shape, and the length direction thereof may be a target direction, and the width direction thereof is an extending direction of the electrode lead 1042 therein. The length of the lead structure 104 may be less than the length of the sidewall on which it is located. The width of the lead structure 104 can be correlated to the wall thickness of the frame 102, with the thicker the frame 102, the wider the lead structure 104. Optionally, the thickness of the frame 102 is about 1 mm, and the width of the lead structure 104 may be about 2 mm, for example, the width of the lead structure 104 ranges from 1.5 mm to 3 mm. In the target direction, the length of the lead structure 104 is less than the length of the frame 102. The length of the frame 102 in the target direction refers to: the distance between two points farthest in the target direction in the frame 102.

The laser 10 of the present embodiment is a multi-color laser. The plurality of light emitting chips 103 in the laser 10 may include a plurality of types of light emitting chips, each type of light emitting chip for emitting laser light of one color, and different types of light emitting chips for emitting laser light of different colors. Alternatively, the laser 10 may include at least three types of light emitting chips. At least some of the light emitting chips of each type 103 may be connected in series. For example, the laser 10 includes three types of light emitting chips for emitting red laser light, green laser light, and blue laser light, respectively. Optionally, the number of the light emitting chips in the laser 10 may also be greater than 3, and the laser color emitted by the multiple types of light emitting chips may also be other colors besides red, green, and blue, which is not limited in this embodiment of the application.

At least some of the light emitting chips 103 in each type may be connected in series, and both ends of the light emitting chips are electrically connected to the two electrode pins 1042, specifically, the first pad D1 in the electrode pins 1042. The different types of light emitting chips 103 do not share the electrode pins 1042, and are electrically connected to the different electrode pins 1042. The light emitting chips 103 connected in series may be connected to the positive and negative electrodes of an external circuit through the two electrode pins 1042, respectively. The at least three types of light emitting chips may be arranged in at least three rows. For example, each row of light emitting chips includes a type of light emitting chip, each row of light emitting chips is connected in series and two ends of each row of light emitting chips are respectively connected to two electrode pins 1042, and the electrode pins 1042 connected to different rows of light emitting chips are different. The number of rows of light emitting chips 103 may be the same as the number of types of light emitting chips 103, and the light emitting chips in different rows are all different types of light emitting chips. Alternatively, the number of rows of the light emitting chips 103 in the laser 10 may be greater than the number of classes of the light emitting chips 103, for example, there may be two rows of light emitting chips being the same class of light emitting chips. Optionally, there are two types of light emitting chips located in the same row, and the two types of light emitting chips located in the same row are connected in series and have two ends respectively electrically connected to the two electrode pins 1042.

As shown in fig. 1 and 2, the laser 10 includes three types of light emitting chips arranged in three rows. In each row of light emitting chips 103, adjacent light emitting chips 103 are connected by a wire to realize the series connection of the row of light emitting chips 103; the light emitting chip 103 at the leftmost end is connected to the first pad D1 of one electrode pin 1042 in the pin structure 104 at the left side through a wire; the rightmost light emitting chip 103 is connected to the first pad D1 of one electrode pin 1042 in the right pin structure 104 by a wire.

In the embodiment of the present application, the electrode pins 1042 are not needed to be shared by all the light emitting chips, and the electrode pins 1042 connected to the light emitting chips are all the electrode pins 1042 close to the light emitting chips. Each type of light emitting chip can be connected to the electrode pin 1042 at a close distance, and it is not necessary to use more switching stages to switch the wires between the light emitting chip and the electrode pin 1042, thereby reducing the complexity of the circuit connection of the light emitting chip and correspondingly reducing the complexity of the preparation of the laser 10.

Alternatively, in the laser 10, the width direction of the frame 102 may be parallel to the row direction of the light emitting chips 103, and the length direction of the frame 102 may be parallel to the column direction of the light emitting chips 103. Therefore, it can be ensured that more rows of light-emitting chips can be arranged in the laser 10, and different types of light-emitting chips can be located in different rows, which is convenient for connection of lines. Optionally, in the embodiment of the present application, a distance between two adjacent rows of light emitting chips may range from 3.5 millimeters to 6.5 millimeters, for example, a distance between two adjacent rows of light emitting chips is 4 millimeters or 6 millimeters, and the distance is smaller. Therefore, compared with the laser with the same size in the related art, more light emitting chips can be arranged in the laser in the embodiment of the application, and the light emitting power of the laser can be improved.

Fig. 1 and 2 each illustrate an example in which the laser 10 includes 15 light-emitting chips arranged in three rows and five columns. Optionally, the light emitting chips 103 in the laser 10 may also be arranged in other manners, and the number of the light emitting chips 103 may also be other numbers, which is not limited in this embodiment. For example, the laser 10 may include 21 light emitting chips arranged in three rows and seven columns, or 20 light emitting chips arranged in four rows and five columns.

To sum up, in the laser provided by the embodiment of the application, different types of light-emitting chips can be electrically connected with different electrode pins, so that the light-emitting chips connected in series can be connected with the electrode pins nearby, and the laser does not need to be provided with too many adapter platforms for switching between the light-emitting chips and the electrode pins, so that the connection mode of the light-emitting chips and the electrode pins in the laser can be simplified, and the preparation process of the laser is simplified. In addition, the plurality of electrode pins in the laser may belong to the same pin structure, which is equivalent to an integrated structure of the plurality of electrode pins. Therefore, when the laser is prepared, the plurality of electrode pins can be fixed only by fixing one pin structure with the frame body, and the electrode pins do not need to be fixed independently, so that the preparation process of the laser can be further simplified.

In the embodiment of the present application, when the laser 10 includes three pin structures 104, two of the pin structures 104 may be located in a row direction of the light emitting chip 103, that is, fixed to two opposite sidewalls of the frame 102 in the row direction; the other lead structure 104 is located in the column direction of the light emitting chip 104, i.e., fixed to one of the two sidewalls arranged in the column direction. As shown in fig. 1, the row direction of the light emitting chip is the x direction, the column direction is the y direction, two lead structures 104 in the laser 10 are respectively fixed to two side walls of the frame 102 opposite to each other in the x direction, and the other lead structure 104 is fixed to one side wall between the two side walls, which is taken as an example in fig. 1 to illustrate that the side wall is located above.

The number of the electrode pins 1042 in the pin structure 104 in the row direction may be equal to the number of the rows of the light emitting chips 103, and the electrode pins 1042 near to the two ends of each row of the light emitting chips may be disposed at both ends of each row of the light emitting chips, so that the two ends of each row of the light emitting chips may be directly connected to the electrode pins 1042 in the pin structure 104 in the row direction in a nearby manner after being connected in series, which is convenient. In this manner, the two electrode pins connected to each row of light emitting chips respectively belong to two pin structures in the row direction, that is, the electrode pin 1042 connected to one end of each row of light emitting chips belongs to one pin structure 104, and the electrode pin 1042 connected to the other end of each row of light emitting chips belongs to the other pin structure 104 in the row direction.

Optionally, the electrode pin 1042 in one pin structure 104 of the two pin structures 104 in the row direction is used as a positive electrode pin, and the second pad D2 in the electrode pin 1042 is used for connecting a positive electrode of an external circuit; the electrode pin 1042 in the other lead structure 104 serves as a negative electrode pin, and the second pad D2 in the electrode pin 1042 is used for connecting to a negative electrode of an external circuit.

The number of electrode pins 1042 in the pin structure 104 in the column direction may be greater than or equal to 2. For example, a row of light emitting chips (e.g., a first row and a last row of light emitting chips) located at an edge in the column direction may be electrically connected to the electrode pin 1042 in the pin structure 104 in the column direction close to the row of light emitting chips, that is, two electrode pins electrically connected to the row of light emitting chips may belong to the pin structure 104 in the column direction. Optionally, the row of light emitting chips includes two types of light emitting chips, the two types of light emitting chips are respectively located at two ends of the row, and each type of light emitting chip is connected in series, so that the light emitting chip farthest from the other type of light emitting chip in each type of light emitting chip is connected to the electrode pin 1042 in the pin structure 104 in the row direction, and the light emitting chip closest to the other type of light emitting chip is connected to the electrode pin 1042 in the pin structure 104 in the column direction. The distance between the light emitting chip 103 located at the edge in the column direction and the pin structure 104 in the column direction may be further long, and in this embodiment of the application, an adapter may be further disposed between the light emitting chip 103 and the pin structure 104, so that the wire between the light emitting chip 103 and the pin structure 104 is switched through the adapter.

When a row of light emitting chips on the edge is electrically connected to the electrode pins 1042 in the pin structure 104 in the column direction, the number of the electrode pins 1042 in the pin structure 104 in the row direction can be correspondingly reduced, and the length of the pin structure 104 can be reduced. In this way, the lead structures 104 fixed on the side walls can be smaller, and since the reduction of the volume of the lead structures 104 can reduce the stress generated when the lead structures 104 are fixed with the frame body, the stress when the lead structures 104 are fixed with the frame body 102 can be smaller, and the risk of the lead structures 104 being broken due to the stress when being fixed can be reduced.

In an alternative implementation, the pin structures 104 in the row direction may be identical to the pin structures 104 in the column direction, e.g., the length is the same, and the number of electrode pins 1042 included is the same. Thus, only one lead structure 104 is needed to be provided when the laser 10 is manufactured, and when the lead structure 104 and the frame 102 are fixed, the lead structure 104 used does not need to be distinguished according to different fixed positions in the frame, which can facilitate the manufacture of the laser 10. In addition, in the case obtained after the assembly of the base plate 101, the frame 102 and the pin structure 104 is completed, the arrangement of the light-emitting chips 103 can be flexible, and the universality and compatibility of the case can be improved.

In another alternative implementation, since the lead structure 104 in the column direction only needs to include two electrode pins 1042 to meet the requirement, the length of the lead structure 104 may be smaller, and the number of the electrode pins 1042 in the lead structure 104 may also be smaller than the number of the electrode pins 1042 in the lead structure 104 in the row direction. When the lead structure 104 is made of ceramic and the frame 102 is made of metal, a certain stress is generated when the lead structure 104 and the frame 102 are fixed, in this embodiment, the length of the lead structure 104 is made smaller, so that the stress can be reduced to a certain extent, and the fixing reliability is ensured.

Fig. 1 and 2 each exemplify that the respective lead structures 104 in the laser 10 are identical, and each lead structure 104 includes three electrode leads 1042. Each row of the light emitting chips 103 is connected in series, and both ends of the light emitting chips 103 are connected to the electrode pin 1042 in the pin structure 104 in the row direction of the light emitting chips 103, specifically, electrically connected to the first pad D1 in the electrode pin 1042. Alternatively, the pin structure 104 positioned in the column direction of the light emitting chips 103 may also include only two electrode pins 1042.

Fig. 3 is a schematic structural diagram of another laser provided in an embodiment of the present application. As shown in fig. 3, the laser 10 further includes a transfer stage J, and the first row of light emitting chips in the laser 10 from top to bottom are connected in series, and both ends of the first row of light emitting chips can be connected to the two electrode pins 1042 in the pin structure 104 (i.e., the pin structure 104 located at the upper portion in fig. 10) in the column direction through the transfer stage J. Fig. 4 is a schematic structural diagram of another laser provided in the embodiment of the present application. As shown in fig. 4, the last row of light emitting chips from top to bottom in the laser 10 are connected in series, and both ends of the last row of light emitting chips may also be connected to the two electrode pins 1042 in the lower pin structure 104 through the switching stage J. As shown in fig. 3 and 4, both ends of any one row of light emitting chips (e.g., the second row of light emitting chips) located in the middle in the column direction are connected to the electrode pins 1042 in the two pin structures 104 in the row direction (i.e., the pin structures 104 on the left and right in the figure).

Fig. 5 is a schematic structural diagram of a laser according to another embodiment of the present application. The first row of light emitting chips may comprise two types of light emitting chips, such as where the first two light emitting chips 103 belong to the same type of light emitting chip and the last three light emitting chips 103 belong to the same type of light emitting chip. The first two light emitting chips 103 in the row of light emitting chips are connected in series, and the first light emitting chip 103 is connected with the electrode pin 1042 in the pin structure 104 on the left side, and the second light emitting chip 103 is connected with the electrode pin 1042 in the pin structure 104 on the upper side; the third light emitting chip 103 is connected to the electrode pin 1042 in the upper side pin structure 104, and the fifth light emitting chip 103 is connected to the electrode pin 1042 in the right side pin structure 104.

Fig. 3 to 5 each illustrate a case where the lead structure 104 located in the column direction of the light emitting chip 103 includes only two electrode leads 1042.

With continued reference to fig. 1-5, the laser 10 may also include a plurality of heat sinks 106 and a plurality of reflective prisms 107. The plurality of reflection prisms 107 and the plurality of heat sinks 106 may each correspond one-to-one to the plurality of light emitting chips 103. Each light emitting chip 103 is positioned on a corresponding heat sink 106, and the heat sink 106 is used to assist the heat dissipation of the corresponding light emitting chip 103. The material of the heat sink 106 may comprise a ceramic. Each of the reflecting prisms 107 is located on the light exit side of the corresponding light emitting chip 103. The light emitting chips 103 may emit laser light to the corresponding reflection prisms 107, and the reflection prisms 107 may reflect the laser light in a direction away from the base plate 101.

Optionally, in this embodiment, the material of the bottom plate 101 may include metal or ceramic, and the material of the frame 102 may also include metal or ceramic. For example, the metal may be oxygen-free copper, kovar, or other metals. The composition of the ceramic may be aluminum nitride, aluminum oxide, or other compositions.

In the preparation of the laser 10, the lead structure 104 may be fixed to the frame 102 at the notch K by soldering. For example, the middle region of each pin structure 104 may be aligned and snapped into the corresponding notch K, and solder may be disposed between the pin structure 104 and the corresponding notch K. Then, the frame 102 with the pin structure 104 clamped at the notch K is placed at a proper position on the bottom plate 101, and solder is arranged between the frame 102 and the bottom plate 101. Then, the structure composed of the bottom plate 101, the frame 102, the lead structure 104 and the solder is placed in a high temperature furnace for sintering, so that the solder is melted to fix the lead structure 104 at the corresponding notch K, and the lead structure 104 and the frame 102 are both fixed with the bottom plate 101, and the sealing of the connection of the bottom plate 101, the frame 102 and the lead structure 104 is ensured.

The bottom plate 101, the frame 102 and the lead structure 104 may enclose an accommodating space, and after the bottom plate 101, the frame 102 and the lead structure 104 are fixed, the light emitting chip 103 may be fixed in the accommodating space. Then, a wire may be disposed between the first pad D1 of the electrode pin 1042 in the pin structure 104 and the light emitting chip 103 near the first pad D1, and a wire may be disposed between the light emitting chips 103 that need to be electrically connected.

Alternatively, a wire may be fixed to the first pad D1 and the light emitting chip 103 using a ball bonding technique. When the ball bonding technology is adopted to weld the lead, a routing tool is adopted to melt one end of the lead, the melted end is pressed on the object to be connected, and ultrasonic waves are applied to the routing tool to complete the fixation of the lead and the object to be connected. Alternatively, the wire may be a gold wire, and the fixing process of the wire may also be referred to as a gold wire bonding process. Optionally, the number of wires between any two components connected by wires in the laser 10 may be multiple to ensure the reliability of the connection between the components and to reduce the sheet resistance on the wires. Such as the first pad D1 and the light emitting chip 103, and the adjacent light emitting chips 103 may be connected by a plurality of wires.

In the embodiment of the present application, the fixing of the plurality of electrode pins can be realized only by fixing the pin structure 104, and it is not necessary to fix each electrode pin separately, so that the fixing process of the electrode pins can be simplified. Moreover, the contact area between the lead structure 104 and the frame 102 may be larger than the contact area between a single electrode lead and the frame in the related art, which may improve the reliability of fixing the electrode lead and the reliability of the laser. In addition, because certain assembly errors can be generated in the assembly process of each part, each electrode pin does not need to be fixed respectively in the embodiment of the application, the assembly errors generated when each electrode pin is fixed respectively can be avoided, and the accuracy of the fixing position of the electrode pin is ensured to be higher. The fixed position precision of the electrode pin is higher, the routing precision and the routing quality on the electrode pin are higher, and therefore the connection reliability of a lead in the laser can be improved, and the routing difficulty is reduced.

The frame 102 is described below with reference to the drawings:

in an alternative implementation of the frame body 102, fig. 6 is a schematic structural diagram of a frame body provided in an embodiment of the present application. As shown in fig. 6, the notch K in the frame 102 may be located at one end of the frame 102 close to the bottom plate 101, and there is no other structure between the notch K and the bottom plate 101. In such a housing 102, the lead structure 104 needs to be fixed to the base plate 101 as well as to the housing 102. The surface of the lead structure 104 near the bottom plate 101 may be flush with the end surface of the frame 102 near the bottom plate 101.

In another alternative implementation of the frame body 102, the notch K may also be located in a middle area of the frame body 102, and the frame body 102 may further include a portion located between the notch K and the bottom plate 101 and a portion located on a side of the notch K away from the bottom plate 101. Fig. 7 is a schematic structural diagram of another frame provided in an embodiment of the present application. As shown in fig. 7, the frame 102 includes a transition ring 1021, a wall 1022, and a sealing ring 1023 stacked in this order in a direction away from the bottom plate 101, and the gap K is located in the wall 1022. Alternatively, the gap K may be located at an end of the wall 1022 far from the bottom plate 101. With such a frame 102, the lead structure 104 is only fixed to the frame 102.

Alternatively, the bottom plate 101, the transition ring 1021, the wall 1022, and the sealing ring 1023 can be made of metal, and the insulator in the pin structure 104 can be made of ceramic. For example, base 101 may be made of oxygen-free copper, transition ring 1021 may be made of 10 gauge steel, and wall 1022 and sealing ring 1023 may be made of a kovar alloy, such as 4J29 alloy. Because the expansion coefficient difference between the oxygen-free copper and the ceramic is large, if the stress generated by direct welding is large, and the expansion coefficients of No. 10 steel and kovar alloy are located between the oxygen-free copper and the ceramic, the transition ring 1021 is arranged between the bottom plate 101 and the pin structure 104, and the wall body 1022 is made of kovar alloy, so that the transition ring can be used for buffering the stress, the ceramic crack generated by direct fixation of the bottom plate 101 and the pin structure 104 is avoided, and the preparation reliability of the laser can be improved.

It should be noted that fig. 6 and fig. 7 are only used to describe components of the frame body, and only four side walls are illustrated as examples having the notches K, alternatively, a wall 1022 having one side wall may also have no notches K, and the embodiment of the present application is not illustrated again.

The pin structure 104 is described below with reference to the accompanying drawings:

fig. 8 is a schematic diagram of a pin structure according to an embodiment of the present application. Referring to fig. 1 to 5 and 8, the lead structure 104 includes: an insulator 1041, and a plurality of electrode pins 1042, the plurality of electrode pins 1042 being fixed to the insulator 1041. It should be noted that fig. 8 only describes the lead structure 104 by taking the lead structure 104 including two electrode leads 1042 as an example, the number of the electrode leads 1042 in the lead structure 104 may also be three or more, which is not separately illustrated in the embodiments of the present application.

The insulator 1041 can support the electrode pin 1042 and can isolate the electrode pin 1042 from other components, thereby avoiding the influence of other components on the conductive effect of the electrode pin 1042. For example, the insulator 1041 may be used to isolate the electrode pin 1042 from the base plate 101, isolate the electrode pin 1042 from the frame 102, and isolate each electrode pin 102. Optionally, the material of the insulator 1041 includes ceramic.

The insulator 1041 includes: the first portion B1 located inside the surrounding area of the frame 102, the second portion B2 located outside the surrounding area, and the third portion B3 located between the first portion B1 and the second portion B2, the first portion B1, the third portion B3, and the second portion B2 may be arranged along the extending direction of the electrode pin 1042. With the frame body 102 shown in fig. 6, the surface of the third portion B3 close to the bottom plate 101 is flush with the end surface of the frame body 102 close to the bottom plate 101. The third portion B3 is covered with the frame 102, and the width of the third portion B3 is the same as the thickness of the frame 102.

The plurality of electrode pins 1042 are spaced apart from each other and communicate with the inside and outside of the surrounding area of the frame 102. Each of the electrode pins 1042 includes a first pad D1 located inside the surrounding area and a second pad D2 located outside the surrounding area. Alternatively, the length of the first pad D1 may be greater than the length of the second pad D2 in a target direction, which may be a direction perpendicular to the extending direction of the electrode pin 1042.

The first pad D1 of the electrode pin 1042 is fixed to the first portion B1 of the insulator 1041, and the second pad D2 of the electrode pin 1042 is fixed to the second portion B2 of the insulator 1041. The first and second pads D1 and D2 are both exposed. For example, the first pad D1 of the electrode pin 1042 is located on a side of the first portion B1 away from the bottom plate 101, and the second pad D2 is located on a side of the second portion B2 away from the bottom plate 101. It is thus possible to facilitate the provision of wires on the first and second pads D1 and D2.

The electrode pins 1042 are spaced from each other, the first pads D1 of the electrode pins 1042 are spaced from each other, and the second pads D2 of the electrode pins 1042 are also spaced from each other, so as to avoid mutual interference of currents transmitted by different electrode pins 1042. Each of the first pads D1 in the lead structure 104 may be sequentially arranged along a target direction, and each of the second pads D2 may also be sequentially arranged along the target direction. The insulator 1042 has a recess therein between adjacent first pads D1 to achieve a spacing of different first pads D1 by the recess. Alternatively, a portion of the insulator 1042 may be located between adjacent first pads D1 to realize the interval of different first pads D1 by an insulating material. In this embodiment of the application, the spacing manner of the second pads D2 may be the same as the spacing manner of the first pads D1, as shown in fig. 8, a groove is also provided between adjacent second pads D2 in the insulator 1042, so as to realize the spacing of the second pads D2 through the groove; or the spacing of the second pads D2 may be achieved by an insulating material.

In each of the electrode pins 1042, the height of the first pad D1 may be the same as or different from the height of the second pad D2. The height of the pad refers to the distance of the pad from the bottom plate. Fig. 2 illustrates that the second pad D2 is higher than the first pad D1; alternatively, the second pad D2 may be flush with the first pad D1, or the second pad D2 may be lower than the first pad D1.

The electrode pins 1042 may further include a conductive portion (not shown) between the first pad D1 and the second pad D2, and in each of the electrode pins 1042, the first pad D1 and the second pad D2 are electrically connected through the conductive portion. The conductive part between the electrode pins 1042 can be embedded inside the third part B3 to ensure that the conductive part can be isolated from the frame 102 by the third part B3. In the case of the housing 102 shown in fig. 6, the third portion B3 can isolate the lead portion from the housing 102 and the bottom plate 101. Alternatively, if the material of the frame 102 is an insulating material, such as ceramic, the conductive portion may be located on the side of the third portion B3 away from the bottom plate 101. If the material of the bottom plate 101 is an insulating material, the conductive portion may be located on the side of the third portion B3 close to the bottom plate 101.

With continued reference to fig. 8, the third portion B3 of the insulator 1041 is raised relative to the first portion B1 and the second portion B2. The insulator 1041 may have a T-shaped configuration. The first cross section of the lead structure 104 may be T-shaped, and the first cross section may be parallel to the arrangement direction of the first portion B1 and the second portion B2. A portion of the third portion B3 that is convex with respect to the first portion B1 and the second portion B2 may have a rectangular parallelepiped shape. Optionally, the convex portion in the third portion B3 may have other shapes, such as a pyramid shape, a truncated pyramid shape, or other shapes, and the surface of the third portion B3 away from the bottom plate 101 may also be flush with the surfaces of the first portion B1 and the second portion B2 away from the bottom plate 101.

In the embodiment of the present application, the lead structure 104 can be fixed to the frame body 102 by using at least the third portion B3. For the frame shown in fig. 6, the lead structure 104 may also be fixed to the bottom plate 101 by at least the third portion B3, for example, the side of the third portion B3 away from the bottom plate 101 is fixed to the frame 102, and the side close to the bottom plate 101 is fixed to the bottom plate 101. In the embodiment of the present application, the insulator 1041 may be fixed to the base plate 101 and the frame 102 by solder, and any one of the parts of the insulator 1041 is fixed to any one of the structures of the base plate 101 and the frame 102, which means that solder is provided between the any one of the parts and the any one of the structures.

For example, the surfaces of the first, second and third portions B1, B2 and B3 adjacent to the bottom plate 101 may be flush. With the frame 102 shown in fig. 7, only the third portion B3 of the lead structure 104 is fixed in contact with the frame 102. With the frame 102 shown in fig. 6, the first portion B1, the second portion B2, and the third portion B3 of the lead structure 104 are fixed in contact with the bottom plate 101, so that each position of the lead structure 104 can be supported by the bottom plate 101. So, because the supporting role of bottom plate 101 when routing to first pad D1 and second pad D2, pin structure 104's pressure bearing capacity is stronger, avoids pin structure 104 to take place the damage under the effect of the pressure that this routing equipment was applyed, and the welding firmness of wire and pad can be higher. Therefore, the success rate of routing and the fixing effect of the lead can be improved, and the preparation yield of the laser is improved.

Alternatively, only one side of the third portion B3 of the insulator 1041 near the base plate 101 may be fixed to the base plate 101. The sides of the first part B1 and the second part B2 close to the bottom plate 101 may be still flush with the side of the third part B3 close to the bottom plate 101 and contact the bottom plate 101; or the sides of the first portion B1 and the second portion B2 close to the bottom plate 101 may not be flush with the side of the third portion B3 close to the bottom plate 101, and a certain distance exists between the first portion and the bottom plate 101, which is not limited in the embodiment of the present application.

In the embodiment of the present application, the laser 10 may further include a solder structure located between the lead structure 104 and the frame 102. For the frame 102 shown in fig. 6, the solder structure is also located between the lead structure 104 and the base plate 101. The lead structure 104 and the frame 102, and the lead structure 104 and the bottom plate 101 are fixed by a solder structure. The solder structure may be a pre-fabricated fixed-shape structure that can be placed over the lead structure 104 to cover a portion of the surface of the lead structure 104, such as the entire surface of the third portion B3. Then, the lead structure 104 sleeved with the solder structure is clamped in the notch K of the frame 102, and further the subsequent fixing step is performed.

Fig. 9 is a schematic view of a solder structure provided in an embodiment of the present application, and fig. 10 is a schematic view of another solder structure provided in an embodiment of the present application. The solder structure that fits into the frame 102 shown in fig. 6 may be as shown in fig. 9, and the solder structure that fits into the frame 102 shown in fig. 7 may be as shown in fig. 10. The solder structure shown in fig. 9 may cover a surface of the third portion B3 in the lead structure 104 that is away from the base plate 101, a side surface of the third portion B3 in the target direction, and a surface of the lead structure 104 that is close to the base plate 101. The solder structure shown in fig. 10 may cover a surface of the third portion B3 in the lead structure 104 that is away from the base plate 101, a side surface of the third portion B3 in the target direction, and a surface of the third portion B3 that is close to the base plate 101. The surface of the third portion B3 remote from the base plate 101 and the surface of the third portion B3 close to the base plate 101 may be the same in shape and area.

Fig. 11 is a schematic structural diagram of another laser according to another embodiment of the present application. Fig. 11 may be a schematic diagram of a cross section of any of the above lasers, which may be parallel to the row direction of the light emitting chips 103 (x direction in the above figures) and perpendicular to the axial direction of the frame 102. As shown in fig. 11, the laser 10 may also include a light transmissive encapsulant layer 108. The light-transmitting sealing layer 108 is located on a side of the frame 102 away from the bottom plate 101, and is used for sealing an accommodating space enclosed by the frame 102 and the bottom plate 101. The edge region of the light-transmitting sealing layer 108 may be directly fixed to the surface of the frame 102 away from the bottom plate 101. Illustratively, the edge region of the light transmissive encapsulant layer 108 may be pre-positioned with solder. The light-transmitting sealing layer 108 may be placed on a side of the frame body 102 away from the bottom plate 101, and the solder may be brought into contact with a surface of the frame body 102 away from the bottom plate 101. Then, the frame 102 and the light-transmitting sealing layer 108 are placed in a high-temperature furnace together, so that the solder is melted to weld the frame 102 and the light-transmitting sealing layer 108.

Optionally, fig. 12 is a schematic structural diagram of another laser provided in another embodiment of the present application. As shown in fig. 12, the laser 10 may also include a sealing frame 110. The outer edge region of the sealing frame 110 is fixed to the surface of the frame 102 away from the bottom plate 101, and the inner edge region of the sealing frame 110 is fixed to the edge of the light-transmitting sealing layer 108. The light-transmitting sealing layer 108 is fixed to the frame body 102 by the sealing frame 110. Alternatively, the inner edge region of the sealing frame 110 may be recessed toward the bottom plate 101 with respect to the outer edge region. Alternatively, the thickness of each position of the sealing frame 110 may be substantially the same, and the sealing frame 110 may be a sheet metal part. Such as by stamping an annular plate to provide the sealing frame 110 with a recessed inner edge region.

Alternatively, the material of the frame 102 in the laser 10 includes metal, the material of the sealing frame 110 includes metal, and the sealing frame 110 and the frame 102 may be welded by a parallel sealing technique. The contact area of the objects to be welded in parallel sealing welding locally generates heat, and the generated heat is less; therefore, the heat conducted to the light emitting chip 103 when the light-transmitting sealing layer 108 and the frame body 102 are fixed is small, the influence of the heat on the light emitting chip 103 is small, and the risk of damage to the light emitting chip 103 can be reduced.

Alternatively, the sealing frame 110 and the light-transmissive sealing layer 108 may be soldered using low-temperature glass solder. For example, the light-transmissive sealing layer 108 may be disposed at an inner edge region of the sealing frame 110, and a low temperature glass solder ring may be disposed at the inner edge region of the sealing frame 110 such that the low temperature glass solder ring surrounds the light-transmissive sealing layer 108. The low temperature glass solder ring may then be heated to melt the low temperature glass solder ring and fill the gap between the inner edge region of the sealing frame 110 and the edge region of the light transmissive sealing layer 108. And then the sealing frame 110 and the light-transmitting sealing layer 108 are fixed after the low-temperature glass solder is cooled and solidified. In the embodiment of the application, the low-temperature glass solder surrounds the light-transmitting sealing layer 108 during welding, and can also limit the light-transmitting sealing layer 108, so that the light-transmitting sealing layer 108 is prevented from shifting during welding with the sealing frame 110, and the welding precision of the light-transmitting sealing layer 108 is ensured.

With continued reference to fig. 11 and 12, the laser 10 may further include a collimating lens set 109, and the collimating lens set 109 may be located on a side of the frame 102 away from the bottom plate 101, such as a side of the light-transmissive sealing layer 108 away from the bottom plate 101. As shown in fig. 11, the edge of the collimating mirror group 109 can be fixed to the edge of the light-transmissive sealing layer 108 by an adhesive. As shown in fig. 12, the edge of the collimating lens group 109 can be fixed to the edge of the sealing frame 110 by an adhesive. If the adhesive is epoxy glue.

The collimating lens group 109 may include a plurality of collimating lenses corresponding to the plurality of light emitting chips 103 one to one, and the collimating lenses are configured to collimate the incident laser light. Such as the plurality of collimating lenses may be integrally formed. The side of the collimating lens group 109 away from the base plate 101 may have a plurality of convex curved surfaces, and each convex curved surface may be a collimating lens. It should be noted that, collimating the light, that is, adjusting the divergence angle of the light, makes the light adjusted to be as close to parallel light as possible. The laser emitted by the light emitting chip 103 can be reflected by the corresponding reflection prism 107 to the light-transmitting sealing layer 108, and then the light-transmitting sealing layer 108 can transmit the laser to the collimating lens corresponding to the light emitting chip 103 in the collimating lens group 109, so as to be collimated by the collimating lens and then emitted, thereby realizing the light emission of the laser 10.

In summary, in the laser provided in the embodiments of the present application, the laser may include a pin structure, where the pin structure includes an insulator and a plurality of electrode pins fixed to the insulator, and is equivalent to the pin structure being an integrated structure of the plurality of electrode pins. Therefore, when the laser is prepared, the plurality of electrode pins can be fixed only by fixing one pin structure and the frame body, and the electrode pins do not need to be fixed independently, so that the preparation process of the laser can be simplified.

Fig. 13 is a schematic structural diagram of a light source module provided in an embodiment of the present disclosure. The light source module includes any of the lasers 10 described above. Illustratively, the laser 10 may be a multi-color laser. The light source assembly further includes a light combining component 20 located at the light emitting side of the laser 10, and the light combining component 20 is configured to combine the laser light with different colors emitted by the laser 10 and emit the combined light. Optionally, the laser 10 may also be a monochromatic laser, and the light combining component 20 may mix laser light emitted by light emitting chips at different positions in the laser 10 to reduce the size of a formed light spot, so as to facilitate subsequent use.

As shown in fig. 13, the light combining component 20 may include a plurality of light combining lenses, and each light combining lens may correspond to a row of light emitting chips in the laser, and is configured to reflect laser light emitted by the row of light emitting chips. The light combining lens at the back of the light combining lenses in the light path can be a dichroic mirror, and the laser reflected by the light combining lens at the front can irradiate the light combining lens at the back and emit through the light combining lens, so that the light combining of the laser emitted by each row of light emitting chips is realized.

In the embodiment of the present application, the distance between the light emitting chips in each row in the laser 10 is small, and accordingly, the distance between the light combining lenses in the light combining component 20 may also be small.

As shown in fig. 13, the light source assembly may further include a condensing lens 30 and a light unifying part 40. The laser light emitted from the light combining member 20 may be emitted to the condenser lens 30, condensed, and then emitted to the light uniformizing member 40. The light uniformizing unit 40 may homogenize the incident laser light and emit the homogenized laser light for subsequent use. Such as the light unifying member 40, may be a light pipe.

The embodiment of the present application further provides a projection apparatus, which may include the light source assembly described above, and may further include a light valve and a lens. The laser emitted by the light source component can be emitted to the light valve and then emitted to the lens after being modulated by the light valve, and then the lens can project the received laser to form a projection picture.

It should be noted that the terms "at least one of a and B" and "a and/or B" in this application are only an association relationship describing the associated object, and indicate that there may be three relationships, namely, a alone, a and B at the same time, and B alone. The term "at least one of a, B and C" means that there may be seven relationships that may represent: there are seven cases of A alone, B alone, C alone, A and B together, A and C together, C and B together, and A, B and C together.

The terms "including" and "having," and any variations thereof, in this application are intended to cover a non-exclusive inclusion. In the embodiments of the present application, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. The term "at least one" refers to one or more. The term "plurality" means two or more unless explicitly defined otherwise. "substantially" and "approximately" mean within an acceptable error range that a person skilled in the art can solve the technical problem to be solved and achieve the technical effect to be achieved basically. In the drawings, the size of layers and regions may be exaggerated for clarity of illustration. Also, it will be understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element or layer or intervening layers may also be present. Like reference numerals refer to like elements throughout.

The above description is only exemplary of the present application and should not be taken as limiting, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims (10)

1. A laser, characterized in that the laser comprises: the LED lamp comprises a bottom plate, a frame body, at least three types of light-emitting chips and at least three pin structures;

the frame body and the at least three types of light-emitting chips are positioned on the bottom plate, and the frame body surrounds the at least three types of light-emitting chips; each type of light-emitting chip in the at least three types of light-emitting chips is used for emitting laser with one color, and different types of light-emitting chips are used for emitting laser with different colors;

the frame body is formed by surrounding four side walls, at least three side walls in the four side walls are provided with notches, and the notches on the at least three side walls are filled with the at least three pin structures respectively; each pin structure comprises a plurality of electrode pins which are communicated with the inside and the outside of the surrounding area of the frame body and are mutually spaced; at least part of the light-emitting chips in each type of light-emitting chips are connected in series, two ends of the light-emitting chips are respectively and electrically connected with the two electrode pins, and the different types of light-emitting chips are electrically connected with the different electrode pins.

2. The laser device according to claim 1, wherein the at least three types of light emitting chips are arranged in at least three rows, each row of light emitting chips comprises one type of light emitting chip, and each row of light emitting chips is connected in series and has two ends electrically connected to the two electrode pins respectively.

3. The laser of claim 2, wherein two of the at least three lead structures are located in a row direction of the light emitting chip, and a number of electrode leads in any one of the two lead structures is equal to the number of rows of the light emitting chip;

in any pin structure in the at least three pin structures in the column direction of the light emitting chip, the number of the electrode pins is greater than or equal to 2.

4. The laser according to claim 3, wherein two electrode pins electrically connected to a row of light emitting chips located at an edge in the column direction belong to a pin structure to which the row of light emitting chips is close in the column direction, or belong to the two pin structures, respectively;

and the two electrode pins electrically connected with any row of light-emitting chips positioned in the middle in the column direction respectively belong to the two pin structures.

5. The laser device according to claim 4, wherein the two electrode pins electrically connected to the row of light-emitting chips belong to a pin structure to which the row of light-emitting chips is close in the column direction;

the laser also comprises a switching table, and the row of light-emitting chips are electrically connected with the electrode pins through the switching table.

6. The laser according to any one of claims 2 to 5, wherein a width direction of the frame is parallel to a row direction of the light emitting chips, and a length direction of the frame is parallel to a column direction of the light emitting chips.

7. The laser according to any one of claims 1 to 5, wherein for any one of the lead structures, the length of the lead structure is smaller than the length of the sidewall where the lead structure is located, and both the length direction of the lead structure and the length direction of the sidewall are perpendicular to the extending direction of the electrode lead in the lead structure.

8. The laser of any one of claims 1 to 5, wherein each of said pin structures further comprises an insulator, said plurality of electrode pins each being fixed to said insulator;

the insulator includes: the first part is positioned in the surrounding area of the frame body, the second part is positioned outside the surrounding area, and the third part is positioned between the first part and the second part, the third part is protruded towards one side far away from the bottom plate relative to the first part and the second part, and the third part is used for being fixed with the frame body;

the electrode pin includes: the first bonding pad is located in the surrounding area, the second bonding pad is located outside the surrounding area, the first bonding pad is located on one side, away from the bottom plate, of the first portion, and the second bonding pad is located on one side, away from the bottom plate, of the second portion.

9. The laser device as claimed in any one of claims 1 to 5, wherein the frame body comprises a transition ring, a wall body and a sealing ring which are sequentially stacked along a direction away from the bottom plate, and the gap is located in the wall body.

10. A light source assembly, characterized in that it comprises: the laser of any one of claims 1 to 9, and a light combining component located on a light exit side of the laser; the light combining component is used for combining the laser light with different colors emitted by the laser and then emitting the combined light.

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