CN218216096U - Laser device - Google Patents

Abstract

The application discloses laser belongs to the technical field of photoelectricity. The laser includes: the LED light source comprises a bottom plate, a frame body, a first type light-emitting chip, a second type light-emitting chip, a reflecting prism and a collimating lens; the bottom plate is fixed with one end of the frame body in the axial direction, the first type light-emitting chip, the second type light-emitting chip and the reflecting prism are all positioned on the bottom plate and surrounded by the frame body, and the collimating lens is positioned on one side of the frame body, which is far away from the bottom plate; the first type of light-emitting chip is used for emitting red laser along the direction far away from the bottom plate, the red laser irradiates the collimating lens, and the collimating lens is used for collimating and emitting the received laser; the second type of light-emitting chip is used for emitting other laser different from the red laser to the reflecting prism, and the reflecting prism is used for emitting the received laser in a direction far away from the bottom plate. The application solves the problem that the light emitting effect of the laser is poor. The application is used for light emission.

Description

Laser device

Technical Field

The application relates to the field of photoelectric technology, in particular to a laser.

Background

With the development of the photoelectric technology, lasers are widely used, and the light emitting effect of the lasers is higher and higher.

In the related art, a laser includes a base plate, a frame on the base plate, a plurality of light emitting chips and a plurality of reflective prisms on the base plate and surrounded by the frame, and a collimating lens group on a side of the frame away from the base plate. The plurality of light-emitting chips are in one-to-one correspondence with the plurality of reflecting prisms, the collimating lens group comprises a plurality of collimating lenses, and the plurality of light-emitting chips are in one-to-one correspondence with the plurality of collimating lenses. Each light emitting chip is used for emitting laser to the corresponding reflection prism, and the reflection prism is used for reflecting the received laser along the direction far away from the bottom plate so as to irradiate to the corresponding collimating lens of the light emitting chip, and then the laser is emitted after being collimated by the collimating lens.

The plurality of light emitting chips in the laser may include a red light emitting chip for emitting red laser light, a green light emitting chip for emitting green laser light, and a blue light emitting chip for emitting blue laser light. Because the divergence angle of the red laser is large, after the red laser is reflected to the collimating lens through the reflecting prism, part of the laser is emitted to the outside of the collimating lens, and further the red laser cannot be effectively utilized. Therefore, the laser in the related art has high light loss of the red laser, low utilization rate and poor light emitting effect.

SUMMERY OF THE UTILITY MODEL

The application provides a laser, can solve in the laser that red laser's light loss is higher, the utilization ratio is lower, the relatively poor problem of the luminous effect of laser. The laser includes: the LED lamp comprises a bottom plate, a frame body, a first type of light-emitting chip, a second type of light-emitting chip, a reflecting prism and a collimating lens;

the bottom plate and one end of the frame body in the axial direction are fixed, the first type light-emitting chip, the second type light-emitting chip and the reflecting prism are all positioned on the bottom plate and surrounded by the frame body, and the collimating lens is positioned on one side of the frame body, which is far away from the bottom plate;

the first type of light-emitting chip is used for emitting red laser in a direction far away from the bottom plate, the red laser is emitted to the collimating lens, and the collimating lens is used for collimating and emitting the received laser;

the second type of light-emitting chip is used for emitting other laser different from the red laser to the reflecting prism, and the reflecting prism is used for emitting the received laser in a direction far away from the bottom plate.

The beneficial effect that technical scheme that this application provided brought includes at least:

in the laser provided by the application, the first type of light emitting chip for emitting red laser can directly extend away from the direction of the bottom plate to emit light, that is, the first type of light emitting chip can be vertically arranged, and the red laser emitted by the first type of light emitting chip can directly shoot to the collimating lens and is emitted after being collimated by the collimating lens. Therefore, the transmission path of the red laser from the light emitting chip to the collimating lens is short, the divergence angle expansion amount is small, the red laser which is emitted to the outside of the collimating lens and cannot be utilized can be further reduced, the light loss of the red laser is reduced, the utilization rate of the red laser is improved, and the light emitting effect of the laser is correspondingly improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a laser provided in an embodiment of the present application;

FIG. 2 is a schematic structural diagram of another laser provided in an embodiment of the present application;

fig. 3 is a schematic structural diagram of another laser provided in an embodiment of the present application;

FIG. 4 is a schematic structural diagram of another laser provided in the embodiments of the present application;

FIG. 5 is a schematic diagram of another laser according to another embodiment of the present application;

FIG. 6 is a schematic diagram of another laser structure provided in another embodiment of the present application;

fig. 7 is a schematic diagram of a partial structure of a laser according to an embodiment of the present disclosure;

FIG. 8 is a schematic diagram of another laser according to another embodiment of the present application;

FIG. 9 is a schematic diagram of another laser according to another embodiment of the present application;

fig. 10 is a schematic structural diagram of a laser according to yet another embodiment of the present application.

Detailed Description

To make the objects, technical solutions and advantages of the present application more clear, embodiments of the present application will be described in further detail below with reference to the accompanying drawings.

With the development of the optoelectronic technology, the application of the laser is more and more extensive, and the application of the laser for emitting lasers with various colors is favored. For example, a multicolor laser can be applied to laser projection as a light source in a projection device, and a projection picture with good display effect can be formed based on laser emitted by the laser. At present, the requirements for miniaturization, reliability and luminous efficiency of lasers are higher and higher.

In the related art, laser light emitted by each light emitting chip in the laser needs to be emitted to a corresponding reflecting prism, is emitted to a collimating lens after being reflected by the reflecting prism, and is emitted after being collimated by the collimating lens. Due to the requirement on the structural size of the laser, the collimating lens needs to meet a certain distance requirement with the bottom plate, so that the transmission path of the laser from the light emitting chip to the collimating lens is longer. The divergence angle of the red laser emitted by the light emitting chip is large, and light spots formed by the red laser can be continuously expanded in the transmission process, so that part of the red laser can be emitted to the outside of the collimating lens when being emitted to the collimating lens, and further the red laser cannot be completely received by the collimating lens, and about 4% of light loss exists. And the red laser is P-polarized light, and there is also much loss when it is reflected on the reflecting prism, and there is about 3% light loss. Therefore, the light loss of the red laser light is severe in the related art laser.

In addition, laser light that cannot be collimated and emitted by the collimating lens in the laser device is accumulated inside the laser device, which causes heat inside the laser device to increase, and also affects the quality and the light emitting efficiency of the light emitting chip to a certain extent, which affects the service life of the light emitting chip.

The embodiment of the application provides a laser, can reduce red laser's light loss, improves red laser's utilization ratio, and then can guarantee that laser's luminous efficacy is higher, and uses the reliability higher.

Fig. 1 is a schematic structural diagram of a laser provided in an embodiment of the present application, fig. 2 is a schematic structural diagram of another laser provided in an embodiment of the present application, fig. 1 may be a schematic diagram of a section a-a' in fig. 2, and fig. 2 may be a top view of fig. 1 rotated by 90 degrees. As shown in fig. 1 and 2, the laser 10 includes: a base plate 101, a frame 102, a light emitting chip, a reflection prism 104, and a collimator lens 106.

The base plate 101 is generally a plate-like structure having two major surfaces that are opposed and generally parallel, and a plurality of minor sides connecting the two surfaces. In the present embodiment, the two larger surfaces are referred to as the faces of the base plate 101. The housing 102 has a frame-like structure having two annular end faces facing each other in the axial direction (the z direction in fig. 1), and an inner wall face and an outer wall face connecting the two end faces.

The base plate 101 and the frame 102 are fixed at one axial end, the base plate 101 and the frame 102 may enclose a groove, and the structure obtained by assembling the base plate 101 and the frame 102 may be referred to as a case. For example, as shown in fig. 1 and 2, the frame 102 may be located on the base plate 101, and one end surface of the frame 102 may be fixed to one plate surface of the base plate 101. Alternatively, in the laser 10, the side surface of the base plate 101 may be fixed to the inner wall surface of the frame 102, and the embodiment of the present application is not limited thereto.

The light emitting chip and the reflecting prism 104 in the laser 10 may be located in a groove enclosed by the base plate 101 and the frame 102. The light emitting chip and the reflection prism 104 may be positioned on the base plate 101 and surrounded by the frame 102. The collimating lens 106 may be located on a side of the frame 102 away from the base plate 101. The number of the light emitting chips, the reflecting prism 104, and the collimating lens 106 may be plural.

The laser 10 in the present embodiment is a multi-color laser. The light emitting chips in the laser 10 may include a first type of light emitting chip 103a and a second type of light emitting chip 103b. The first light emitting chip 103a and the second light emitting chip 103b are configured to emit laser light of different colors, the first light emitting chip 103a is configured to emit red laser light, and the second light emitting chip 103b is configured to emit other laser light different from the red laser light, for example, the other laser light may be blue laser light, green laser light, or yellow laser light.

In the embodiment of the present application, the number of the first type light emitting chips 103a and the number of the second type light emitting chips 103b are both multiple. The plurality of second type light emitting chips 103b may include a plurality of green light emitting chips for emitting green laser light and a plurality of blue light emitting chips for emitting blue laser light. As shown in fig. 1 and 2, the plurality of first type light emitting chips 103a and the plurality of second type light emitting chips 103b in the laser 10 are arranged in two rows, and each row includes five light emitting chips. One of the two rows of the second type light emitting chips 103b may be a green light emitting chip and the other may be a blue light emitting chip. Optionally, the first type of light emitting chips 103a and the second type of light emitting chips 103b in the laser 10 may also be arranged in a line, or may also be arranged in three lines, the number of the light emitting chips in each line may also be different from 5, and the number and the arrangement manner of the light emitting chips are not limited in this embodiment of the application.

The first type light emitting chips 103a may be vertically disposed on the base plate 101 to emit red laser light in a direction (e.g., z direction) away from the base plate 101, which is perpendicular to the plate surface of the base plate 101. The plurality of first-type light emitting chips 103a in the laser 10 may correspond to the plurality of collimating lenses 106 one by one, and the red laser light emitted by each first-type light emitting chip 103a is emitted to the corresponding collimating lens 106 along the z direction, and is further emitted after being collimated by the collimating lens 106. The laser is collimated, i.e., the divergence angle of the laser is narrowed, so that the laser is closer to parallel light.

In this way, the red laser light emitted by the first type light emitting chip 103a does not need to be reflected by the reflecting prism, the transmission path of the red laser light from the first type light emitting chip 103a to the collimating lens 106 is short, the divergence angle expansion amount during the transmission process is small, and the light spot formed by the red laser light on the collimating lens 106 can be small. Further, the red laser light that is emitted to the outside of the collimator lens 106 and cannot be collimated can be reduced, the light loss of the red laser light is small, the utilization rate is high, and the efficiency of the laser 10 emitting the red laser light is high. Moreover, since more red laser light is collimated by the collimating lens 106 and then emitted, the laser light that is accumulated inside the laser 10 and cannot be emitted is small, the risk of temperature rise inside the laser 10 due to accumulation of the laser light is reduced, the working reliability of the light emitting chip can be ensured, and the damage to the light emitting chip due to overhigh heat can be avoided.

In addition, since the light outlet of the first type of light emitting chip 103a is closer to the collimating lens 106, the collimating lens 106 can collimate the laser light emitted by the first type of light emitting chip 103a more accurately, and the collimating effect of the red laser light is improved. The first type light emitting chips 103a are vertically arranged on the bottom plate 101, and a corresponding reflecting prism does not need to be arranged, so that the loss of laser light emitted by the first type light emitting chips 103a on the reflecting prism can be avoided, and the light loss is further reduced. And the mounting area required for the first type light emitting chip 103a is small. In this way, the area of the base plate 101 can be small, which is advantageous for miniaturization of the laser 10.

The number of reflecting prisms 104 in the laser 10 may be the same as the number of second type light emitting chips 103b, one reflecting prism 104 for each second type light emitting chip 103b. The second type light emitting chip 103b may emit laser light to the corresponding reflection prism 104 along a direction (e.g., x direction) parallel to the plate surface of the base plate 101, and the reflection prism 104 may reflect the received laser light along a direction away from the base plate 101. Optionally, a surface of the reflection prism 104 close to the corresponding second-type light-emitting chip 103b is an inclined light-reflecting surface, and the reflection prism 104 reflects the laser light by using the light-reflecting surface. The second type light emitting chip 103b has high thermal power, and the laser light emitted from the second type light emitting chip 103b is transmitted by reflection by the reflection prism 104, which can further contribute to heat conduction of the second type light emitting chip 103b. The laser light emitted by the second type of light emitting chip 103b may be S-polarized light, and the reflectivity of the laser light on the reflecting prism 104 is usually greater than 99%, and the loss is small, and may not be modified with respect to the reflecting prism 104.

As shown in fig. 1, the light-reflecting surface of the reflecting prism 104 may be a plane. Each second-type light-emitting chip 103b may further correspond to a collimating lens 106, and the laser light emitted by the second-type light-emitting chip 103b may be emitted to the corresponding collimating lens 106 after being reflected by the corresponding reflecting prism 104, so as to be emitted after being collimated by the collimating lens 106. Optionally, fig. 3 is a schematic structural diagram of another laser provided in an embodiment of the present application. As shown in fig. 3, the light-reflecting surface of the reflecting prism 104 may also be a concave arc surface that is concave toward a side away from the corresponding second-type light-emitting chip 103b. The reflective surface may also collimate the received laser light. In this way, the laser light reflected by the reflection prism 104 does not need to be collimated by the collimator lens 106, and the laser 10 does not need to have the collimator lens 106 in the emission region of the laser light.

Optionally, with continuing reference to fig. 1 and fig. 3, the laser 10 in the embodiment of the present disclosure may include a collimating lens group (not shown), and each collimating lens 106 may be a partial structure of the collimating lens group, or each collimating lens 106 may be called as a collimating lens group integrally formed. The collimating lens group is substantially a plate-shaped structure and has a light incident surface and a light emergent surface opposite to each other, the light incident surface is a surface of the collimating lens group close to the bottom plate 101, and the light emergent surface is a surface of the collimating lens group far from the bottom plate 101. The light emitting surface may include a plurality of convex curved surfaces, and a portion of each convex curved surface is used as a collimating lens 106. Alternatively, the convex curved surface may be aspherical. Optionally, an orthographic projection of the convex arc surface on the plane may be a circle, or may also be another shape, such as a rectangle, and the embodiment of the present application is not limited. In fig. 3, the orthographic projection of the collimating mirror group on the base plate 101 can only cover the arrangement area of the first type of light emitting chip 103a.

In the embodiment of the present application, all the collimator lenses 106 are integrally provided. Alternatively, the collimating lenses 106 corresponding to the light emitting chips in different rows or different columns may be integrally disposed, and the collimating lenses 106 corresponding to the light emitting chips in different rows or different columns may be independent.

In the embodiment of the present application, the divergence angle of the laser light emitted by the first type light emitting chip 103a is different from the divergence angle of the laser light emitted by the second type light emitting chip 103b, and the path of the laser light emitted to the collimating lens is also different, and the collimating lens 106 with different curvatures can be arranged in the collimating lens group for the first type light emitting chip 103a and the second type light emitting chip 103b, so as to realize accurate light collection and collimation of the laser light of different colors.

To sum up, in the laser provided in the embodiment of the present application, the first type of light emitting chip for emitting red laser light may directly extend away from the bottom plate to emit light, that is, the first type of light emitting chip may be vertically disposed, and the red laser light emitted by the first type of light emitting chip may directly irradiate the collimating lens and is emitted after being collimated by the collimating lens. Therefore, the transmission path of the red laser from the light emitting chip to the collimating lens is short, the divergence angle expansion amount is small, the red laser which is emitted to the outside of the collimating lens and cannot be utilized can be further reduced, the light loss of the red laser is reduced, the utilization rate of the red laser is improved, and the light emitting effect of the laser is correspondingly improved.

The package in the laser 10 may be a metal package or may be a ceramic package. The material of the base plate 101 may include metal or ceramic, and the material of the frame 102 may also include metal or ceramic. The material of the base plate 101 and the material of the housing 102 may be the same or different. Such as the metal may comprise oxygen free copper, molybdenum copper alloy, tungsten copper alloy or kovar alloy. The heat conductivity coefficient of the oxygen-free copper and the ceramic is high, and the bottom plate 101 is made of the oxygen-free copper and the ceramic, so that heat generated by the light-emitting chip can be dissipated quickly after being conducted in the bottom plate 101, and the light-emitting chip is prevented from being damaged by heat accumulation.

With continued reference to fig. 1-3, the laser 10 further includes a plurality of heat sinks 105, and each light emitting chip may correspond to one heat sink 105. The heat sink 105 is attached to the bottom plate 101 and surrounded by the frame 102, and each light emitting chip is fixed to the corresponding heat sink 105, so that the attachment of the light emitting chip to the bottom plate 101 is realized. The heat sink 105 may have a relatively high thermal conductivity to dissipate heat generated by the light emitting chip when emitting laser light, thereby preventing the light emitting chip from being damaged by the heat. Such as heat sink 105, may comprise a ceramic, such as aluminum nitride or silicon carbide.

The heat sink 105 corresponding to the second type of light emitting chip 103b may be horizontally attached to the bottom plate 101, and the second type of light emitting chip 103b may be attached to a surface of the heat sink 105 away from the bottom plate 101. The heat sink 105 is rectangular, and has two large and opposite surfaces and a plurality of side surfaces connecting the two surfaces, and the surface is a mounting surface of the light emitting chip. The heat sink 105 is horizontally attached to the base plate 101, that is, the attachment surface of the heat sink 105 is parallel to the surface of the base plate 101.

The heat sink 105 corresponding to the first type light emitting chip 103a may be vertically attached to the base plate 101, and the first type light emitting chip 103a may be attached to a surface of the heat sink 105 intersecting the base plate 101. In the case that the mounting surface of the light emitting chip in the heat sink 105 is perpendicular to the plate surface of the bottom plate 101, the thickness of the heat sink may be larger, that is, the distance between the mounting surface of the light emitting chip in the heat sink and the opposite surface thereof. For example, the thickness of the heat sink may range from 0.2 mm to 0.3 mm.

Fig. 4 is a schematic structural diagram of another laser provided in an embodiment of the present application, fig. 5 is a schematic structural diagram of a laser provided in another embodiment of the present application, fig. 4 may be a schematic diagram of a section a-a' in fig. 5, and fig. 5 may be a top view of fig. 4 rotated by 90 degrees. As shown in fig. 4 and 5, the laser 10 may further include a fixing strip 107 attached to the base plate 101 and surrounded by the frame 102. The first type light emitting chips 103a may be positioned on a surface of the fixing bar 107 intersecting the base plate 101. If the first type of light emitting chip 103a is located on the surface of the corresponding heat sink 105 perpendicular to the base plate 101, the side of the heat sink 105 opposite to the mounting surface of the light emitting chip is fixed to the surface of the fixing bar 107 intersecting the base plate 101. In the embodiment of the present application, the material of the fixing strip 107 may include a material with a high thermal conductivity, so that the fixing strip 107 may also assist the heat dissipation of the light emitting chip thereon. For example, the material of the fixing strip 107 may include copper, or may also include ceramic.

Alternatively, the flatness of the surface of the fixing strip 107 near the base plate 101, that is, the surface where the fixing strip 107 is fixed in contact with the base plate 101, may be less than or equal to 0.02 mm. Therefore, the mounting effect of the fixing strip 107 on the bottom plate 101 can be better ensured, the accuracy of the setting position of the first type of light-emitting chips 103a on the fixing strip 107 is higher, and the laser emitted by each first type of light-emitting chip 103a can be emitted to the corresponding collimating lens 106 accurately. Alternatively, the attachment fixing strip 107 may be attached to the base plate 101 by using high thermal conductivity glue.

The fixing strip 107 is a strip structure, and a plurality of first type light emitting chips 103a can be attached to the fixing strip 107. Alternatively, the plurality of first type light emitting chips 103a may be sequentially arranged along the length direction of the fixing strip 107, and a row of the first type light emitting chips 103a may be attached to each fixing strip 107. The length direction of the fixing bar 107 is parallel to the row direction of the first type light emitting chips 103a. The number of fixing bars 107 in the laser 10 may be the same as the number of rows of first type light emitting chips 103a, each row of first type light emitting chips 103a being located on a surface of one fixing bar 107 intersecting the base plate 101. Alternatively, the number of the fixing bars 107 may also be the same as the number of the first type light emitting chips 103a, each of the first type light emitting chips 103a being located on a surface of one of the fixing bars 107 intersecting the base plate 101.

Alternatively, each row of the first light emitting chips 103a may be located on the same side of the corresponding fixing strip 107, as in fig. 4, the first light emitting chips 103a are located on the right side of the fixing strip. Alternatively, there may be different rows of the first type light emitting chips 103a on different sides of the corresponding fixing strip 107, and there may also be a row of the light emitting chips 103a on the left side of the corresponding fixing strip as shown in fig. 4.

The above description of the present application takes as an example that each light emitting chip is disposed on one heat sink 105, and the heat sinks 105 disposed on different light emitting chips are different. Alternatively, the laser 10 may also include a strip-shaped heat sink, and each row of light-emitting chips may be disposed on the same strip-shaped heat sink. For example, solder can be arranged on the strip-shaped heat sink at intervals, and each solder arrangement area is used for mounting one light-emitting chip. The method can ensure that the distance between the adjacent light-emitting chips is smaller, is beneficial to the miniaturization of the laser, does not need to be respectively attached with a plurality of heat sinks, and can simplify the preparation process of the laser.

With continued reference to fig. 1, 3, and 4, the laser 10 further includes a light transmissive encapsulant layer 108. The light-transmitting sealing layer 108 is located on a side of the frame body 102 away from the bottom plate 101, and a closed space can be enclosed by the light-transmitting sealing layer 108, the frame body 102 and the bottom plate 101. The light-emitting chip can be located in the closed space, so that the light-emitting chip is prevented from being corroded by substances such as external water, oxygen and the like, the working reliability of the light-emitting chip can be improved, and the service life of the light-emitting chip is prolonged. When the material of the frame 102 includes ceramic, the light-transmitting sealing layer 108 may be directly fixed to the frame 102. When the material of the frame 102 includes metal, as shown in fig. 1, 3 and 4, the laser 10 may further include a sealing frame (not shown). The outer edge region of the sealing frame is fixed to the surface of the frame body 102 away from the bottom plate 101, and the inner edge region of the sealing frame is fixed to the edge of the light-transmitting sealing layer 108.

With continued reference to fig. 2 and 5, the laser 10 may further include a conductive lead 109. The frame 102 may include openings that the conductive leads 109 may fill to extend through the frame 102. The portion of the conductive pin 109 outside the area surrounded by the frame 102 is used for connecting with an external power supply, and the portion of the conductive pin 109 surrounded by the frame 102 is used for connecting with an electrode of the light emitting chip, so as to transmit the current of the external power supply to the light emitting chip, and further excite the light emitting chip to emit laser. For example, the conductive pins may be connected to electrodes of the adjacent light emitting chips by wires, and the electrodes of the adjacent light emitting chips may be connected to each other by wires to transmit current to each light emitting chip. Alternatively, the conductive wire may be a gold wire, that is, the material of the conductive wire may be gold. Conductive leads 109 may be part of a package, and base 101, frame 102, and conductive leads 109 may collectively comprise the package.

Alternatively, the conductive pin 109 may be a conductive member fixed in the ceramic insulator, the conductive member having a first pad and a second pad exposed. The first bonding pad is located outside the surrounding area of the frame body 102 and used for being connected with an external power supply, and the second bonding pad is located inside the surrounding area of the frame body 102 and used for being connected with an electrode of the light-emitting chip so as to transmit current of the external power supply to the light-emitting chip and further excite the light-emitting chip to emit laser. Opposing sides of the frame 102 may have gaps that ceramic insulators may fill.

In the embodiment of the present application, when assembling the laser, the annular solder structure may be placed in the opening of the frame, and then the conductive pin may pass through the solder structure and the opening where the solder structure is located. Then, the frame body is placed on the periphery of the bottom plate, the annular welding flux is placed between the bottom plate and the frame body, and then the structure of the bottom plate, the frame body and the conductive pins is placed in a high-temperature furnace for sealing and sintering. And then the light emitting chips can be attached to the corresponding heat sinks by using a high-precision eutectic bonding machine. And the heat sink with the first type of light emitting chips is attached to the fixing strip. Then, wire bonding can be performed between the first type light emitting chips on each fixing strip through a wire bonder (such as a broadband automatic wire bonder), so that the plurality of first type light emitting chips on each fixing strip are connected in series. And then the heat sink with the second type of light-emitting chips is attached to the bottom plate by means of sintering gold paste or sintering silver paste and the like in the environment of 250-280 ℃, and the fixing strip with the first type of light-emitting chips is attached to the bottom plate by adopting high-heat-conductivity glue. The structure of the base plate, frame, conductive pins, mounting strip, heat sink, and light emitting chip may then be cleaned, such as with argon. Then, wires between the conductive pins and the electrodes of the light emitting chips and wires between the electrodes of the second type of light emitting chips can be formed by a wire bonder. Afterwards, the light-transmitting sealing layer can be pasted in the middle area of the upper cover, and then the edge area of the upper cover is welded on one side, far away from the bottom plate, of the frame body by using the parallel sealing and welding technology. Then, the position of the collimating lens group can be controlled and adjusted through the aligning process, so that the collimating lens corresponds to the corresponding light-emitting chip. After the position is determined, the collimating lens group is fixed on one side of the frame body far away from the bottom plate by adopting ultraviolet glue. The laser assembly is completed.

The above description of the present application takes as an example that the laser 10 includes only a base plate 101 and a frame 102, and the light emitting chip and the reflecting prism are located in the same package surrounded by the base plate 101 and the frame 102. Alternatively, the laser 10 may include a plurality of packages, each of which includes a base 101 and a frame 102 fixed to each other, and the light emitting chips for emitting laser light of different colors may be located in different packages.

Fig. 6 is a schematic structural diagram of another laser provided in another embodiment of the present application, fig. 7 is a schematic structural diagram of a part of a laser provided in an embodiment of the present application, fig. 6 may be a schematic structural diagram of a section b-b' in the laser shown in fig. 7, and fig. 7 only illustrates a tube shell in the laser. As shown in fig. 6 and 7, the laser 10 includes two substrates 101 and two frames 102, each substrate 101 is fixed to one frame 102, and the laser 10 may include two packages. The specific fixing manner can refer to the related description of the fixing manner of the bottom plate 101 and the frame 102 in fig. 1. For example, the first type light emitting chip 103a and the second type light emitting chip 103b may be respectively located on the two bottom plates 101 and respectively surrounded by the two frame bodies 102, that is, the first type light emitting chip 103a and the second type light emitting chip 103b may be respectively located in two packages. Fig. 6 is a schematic diagram illustrating an example in which a row of light-emitting chips is provided in each package.

As shown in fig. 6 and 7, the laser 10 may further include a locking member 110, and the locking member 110 may be located between the two packages to lock the two packages. For example, the locking member 110 can be used to lock the bottom plate of two housings to lock the two housings. Alternatively, the edges of the two bottom plates 101 close to each other may have fixing holes (not shown), and the locking member 110 may be inserted through the fixing holes to lock the two bottom plates 101.

With continued reference to fig. 6, for a laser 10 comprising a plurality of packages, the laser 10 further comprises a light transmissive encapsulant 108 and a collimating lens group (including the collimating lens 106) corresponding to each package. The side of the frame 102 away from the bottom plate 101 in each tube is provided with a corresponding light-transmitting sealing layer 108 and a corresponding collimating lens group. Fig. 7 does not illustrate the light-transmissive sealing layer 108 and the collimating mirror group. In the laser 10, the collimating lens groups corresponding to different tube shells can be coupled respectively. For example, a collimating lens group corresponding to one tube shell can be coupled with only the first type of light emitting chip 103a, so as to ensure that the red laser light emitted by the first type of light emitting chip 103a is received and collimated. The collimating lens group corresponding to the other tube shell can be coupled with only the second type of light-emitting chip 103b, so that the laser light emitted by the second type of light-emitting chip 103b can be received and collimated. Therefore, the influence of the mounting errors of different types of light-emitting chips on the coupling effect of the collimating lenses corresponding to other types of light-emitting chips can be avoided.

The heat conduction path of the laser 10 can be increased after the first light emitting chip 103a is vertically disposed, and in the embodiment of the present application, a heat dissipation structure can be further disposed to assist in better dissipating heat of the first light emitting chip 103a.

Fig. 8 is a schematic structural diagram of another laser provided in another embodiment of the present application, fig. 9 is a schematic structural diagram of another laser provided in another embodiment of the present application, fig. 8 may be a schematic diagram of a section a-a' in fig. 9, and fig. 9 may be a top view of fig. 8 rotated by 90 degrees. As shown in fig. 8 and 9, the laser 10 may further include a conduit 111, a cooling fluid (not shown), and a heat exchanger 112. The conduit 111, the cooling fluid and the heat exchanger 112 may collectively constitute the heat dissipation structure described above. The dashed lines enclosed in a closed loop, shown in figure 9 in the region of the base plate 101, represent the conduit 111.

The duct 111 may be located within the bottom plate 101 and at least in the area where the first type of light emitting chip 103a is located, i.e. the orthographic projection of the duct 111 on the bottom plate 101 is located at least in the area where the first type of light emitting chip 103a is located on the bottom plate 101. The cooling fluid is located within the conduit 111. The conduit 111 has a liquid inlet K1 and a liquid outlet K2 located outside the bottom plate 101, and both the liquid inlet K1 and the liquid outlet K2 are communicated with the heat exchanger 112. The liquid inlet K1 and the liquid outlet K2 may be located at the side of the bottom plate 101, for example, may extend out of the bottom plate 101 from the side of the bottom plate 101.

The heat exchanger 112 may impart a cooling fluid pressure such that the cooling fluid enters the conduit 111 from the fluid inlet K1 of the conduit 111 and flows in the conduit 111. During the flowing process, the cooling liquid can absorb the heat generated by the first type light emitting chip 103a, and the heat enters the heat exchanger 112 from the liquid outlet K2 along with the cooling liquid. The heat exchanger 112 may cool the cooling fluid, thus achieving dissipation of heat generated by the first type of light emitting chip 103a.

The heat exchanger 112 may also have a temperature adjusting function, which may increase the heat exchange strength when the temperature inside the laser 10 is high, and decrease the heat exchange strength when the temperature inside the laser 10 is low. Therefore, the light-emitting chip can be continuously kept with a good heat dissipation effect, the inside of the laser 10 is ensured to be in a relatively stable temperature environment, and the working reliability of the light-emitting chip is improved.

With reference to fig. 9, the conduit 111 may include a first portion B1, a second portion B2 and a third portion B2 connected in sequence, the first portion B1 is further connected to the liquid inlet K1, the third portion B2 is further connected to the liquid outlet K2, and the first portion B1 and the third portion B3 are both strip-shaped and parallel to each other. The first portion B1 and the third portion B3 may be uniformly distributed in the arrangement region of the first type light emitting chip 103a. Illustratively, the laser 10 includes two rows of the first type of light emitting chips 103a. On the base plate 101, the orthographic projection of one of the two rows of the first type light emitting chips 103a is located within the orthographic projection of the first portion B1, and the orthographic projection of the other row of the first type light emitting chips 103a is located within the orthographic projection of the third portion B3. Therefore, the first light emitting chip 103a can be closer to the conduit 111, which is beneficial to the heat generated by the first light emitting chip 103a to be quickly conducted out of the laser 10 along with the cooling liquid in the conduit 111, and the heat dissipation effect is better.

Optionally, the conduit 111 may also be distributed in the arrangement area of the second type light emitting chip 103b to better dissipate the heat generated by the second type light emitting chip 103b. Optionally, the conduit 111 may also be arranged in an s-shape, or may also be arranged in a spiral shape, and the embodiment of the present application is not limited.

Fig. 10 is a schematic structural diagram of a laser according to yet another embodiment of the present application. Fig. 10 illustrates a manner in which the laser 10 further includes the above-described heat dissipation structure in a case where the laser 10 includes a plurality of packages that are spliced, and the first type light-emitting chip 103a and the second type light-emitting chip 103b are respectively located on different packages. Fig. 10 shows only the liquid inlet K1 and the liquid outlet K2 of the conduit 111 in the heat dissipation structure. In this case, the conduits 111 may be distributed only in the bottom plate 101 where the first type light emitting chips 103a are located, and the conduits 111 may be uniformly distributed in the bottom plate 101. If only one row of the first type light emitting chips 103a is disposed in the package, the first portion and the third portion of the guide tube 111 may be located at both sides of the row of the light emitting chips, respectively. Or the first part or the third part is positioned right below the row of the light-emitting chips, and the orthographic projection of the row of the light-emitting chips on the bottom plate is positioned in the orthographic projection of the first part or the third part on the bottom plate.

To sum up, in the laser provided in the embodiment of the present application, the first type of light emitting chip for emitting red laser light may directly extend away from the bottom plate to emit light, that is, the first type of light emitting chip may be vertically disposed, and the red laser light emitted by the first type of light emitting chip may directly irradiate the collimating lens and be emitted after being collimated by the collimating lens. Therefore, the transmission path of the red laser from the light emitting chip to the collimating lens is short, the expansion amount of the divergence angle is small, the red laser which cannot be utilized and is emitted to the outside of the collimating lens can be reduced, the light loss of the red laser is reduced, the utilization rate of the red laser is improved, and the light emitting effect of the laser is correspondingly improved.

The term "at least one of a and B" and "a and/or B" in this application is only one kind of association relationship describing the associated object, and means that there may be three kinds of relationships, namely, there are three cases of a alone, a and B simultaneously, and B alone. The term "at least one of a, B and C" means that there may be seven relationships that may represent: there are seven cases of A alone, B alone, C alone, A and B together, A and C together, C and B together, and A, B and C together. In the embodiments of the present application, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. The term "at least one" means one or more, and the term "plurality" means two or more, unless expressly defined otherwise.

In the following description and in the claims, the terms "include" and "comprise" are used in an open-ended fashion, and thus should be interpreted to mean "include, but not limited to. "substantially" means within an acceptable error range, that a person skilled in the art will be able to solve the technical problem within a certain error range, substantially to achieve the technical result. Where certain terms are used throughout the description and claims to refer to particular components, those skilled in the art will appreciate that a manufacturer may refer to a component by different names. This specification and claims do not intend to distinguish between components that differ in name but not function.

The above description is intended only to illustrate the alternative embodiments of the present application, and should not be construed as limiting the present application, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims (10)

1. A laser, characterized in that the laser comprises: the LED light source comprises a bottom plate, a frame body, a first type light-emitting chip, a second type light-emitting chip, a reflecting prism and a collimating lens;

the bottom plate and one end of the frame body in the axial direction are fixed, the first type light-emitting chip, the second type light-emitting chip and the reflecting prism are all positioned on the bottom plate and surrounded by the frame body, and the collimating lens is positioned on one side of the frame body, which is far away from the bottom plate;

the first type of light-emitting chip is used for emitting red laser in a direction far away from the bottom plate, the red laser irradiates the collimating lens, and the collimating lens is used for collimating and emitting the received laser;

the second type of light-emitting chip is used for emitting other laser different from the red laser to the reflecting prism, and the reflecting prism is used for emitting the received laser in a direction far away from the bottom plate.

2. The laser of claim 1, further comprising a heat sink surrounded by the frame;

the first type light-emitting chips and the second type light-emitting chips are located on different heat sinks, the first type light-emitting chips are located on the surface, intersected with the bottom plate, in the heat sink, and the second type light-emitting chips are located on the surface, far away from the bottom plate, in the heat sink.

3. The laser of claim 1 or 2, further comprising a fixing strip attached to the base plate and surrounded by the frame;

the first type light emitting chips are located on the surface of the fixing strip, which intersects with the bottom plate.

4. The laser of claim 3, wherein the laser comprises at least one row of the first type of light emitting chips and at least one fixing strip, wherein the length direction of the fixing strip is parallel to the row direction of the first type of light emitting chips, and each row of the first type of light emitting chips is located on a surface of one of the fixing strips intersecting the base plate.

5. The laser of claim 3, wherein the surface of the fixing strip near the base plate has a flatness of 0.02 mm or less, and/or wherein the fixing strip comprises copper.

6. The laser device according to claim 1, wherein a surface of the reflecting prism close to the second type light emitting chip is a reflecting surface, and the reflecting prism reflects the received laser light by using the reflecting surface;

the light reflecting surface is a concave arc surface and is also used for collimating the received other laser; or the reflecting surface is a plane, and the other laser beams emitted from the reflecting prism are emitted to the collimating lens, collimated by the collimating lens and then emitted.

7. The laser device of claim 1, wherein the laser device comprises two base plates and two frame bodies, each base plate is fixed to one frame body, and the first type light-emitting chips and the second type light-emitting chips are respectively located on the two base plates and are respectively surrounded by the two frame bodies;

the laser also comprises a locking component which is used for locking the two bottom plates.

8. The laser of any one of claims 1, 2, 4 to 7, further comprising a conduit, a cooling fluid, and a heat exchanger;

the guide pipe is positioned in the bottom plate and at least positioned in the arrangement area of the first type of light-emitting chips; the cooling liquid is positioned in the conduit; the guide pipe is provided with a liquid inlet and a liquid outlet which are positioned outside the bottom plate, and the liquid inlet and the liquid outlet are communicated with the heat exchanger.

9. The laser of claim 8, wherein the liquid inlet and the liquid outlet are located at sides of the base plate.

10. The laser device as claimed in claim 8, wherein the conduit comprises a first portion, a second portion and a third portion connected in sequence, the first portion is further connected to the liquid inlet, the third portion is further connected to the liquid outlet, and the first portion and the third portion are both strip-shaped and parallel to each other;

the laser comprises two rows of first-type light emitting chips; on the bottom plate, the orthographic projection of one row of first-type light-emitting chips in the two rows of first-type light-emitting chips is positioned in the orthographic projection of the first part, and the orthographic projection of the other row of first-type light-emitting chips is positioned in the orthographic projection of the third part.

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