WO2021135847A1

WO2021135847A1 - Laser packaging structure

Info

Publication number: WO2021135847A1
Application number: PCT/CN2020/134398
Authority: WO
Inventors: 唐怀; 李玖
Original assignee: 深圳市中光工业技术研究院
Priority date: 2019-12-31
Filing date: 2020-12-08
Publication date: 2021-07-08
Also published as: CN113067248A

Abstract

A laser packaging structure (10), comprising a base (12), a tube shell (14), a light window (16) and a laser assembly (18). The tube shell (14) is provided on the base (12) and encloses an accommodating space (15). The tube shell (14) has a top wall (142) away from the base (12). The top wall (142) is provided with a first metal layer (1421). A part of the surface of the light window (16) facing the tube shell (14) is provided with a second metal layer (161). The first metal layer (1421) and the second metal layer (161) are welded by using solder, so that the light window (16) seals the accommodating space (15). The laser assembly (18) is accommodated in the accommodation space (15), and is used for emitting laser through the light window (16). The light window (16) and the tube shell (14) of the laser packaging structure (10) are welded by solder, and on the premise of ensuring welding quality, the cost of the laser packaging structure (10) is reduced.

Description

Laser package structure

Technical field

The present invention relates to the field of optical technology, in particular to a laser packaging structure.

Background technique

With the continuous improvement of the electro-optical conversion efficiency and output optical power of laser chips, and the continuous breakthrough of laser light source technology, laser chips have been more and more widely used in the field of laser lighting and display. In order to meet market demand, laser chip packaging technology is also constantly progressing and improving. Multi-chip packaging is one of the more widely used packaging methods. Currently, the ejection light solution is mainly used. In this solution, the laser chips are distributed on the bottom of the tube shell, and the laser is reflected at 90° by a mirror, and the laser is emitted vertically from the top. Therefore, sealing has become a very important part of determining product cost and quality. The quality of the existing laser chip in the welding package needs to be improved, and the welding cost is relatively high, which limits the further development of the laser chip packaging technology.

Summary of the invention

The purpose of the present invention is to provide a novel laser package structure to solve the above-mentioned problems.

The embodiments of the present invention achieve the above objectives through the following technical solutions.

The invention provides a novel laser packaging structure, which includes a base, a tube shell, a light window, a collimating lens and a laser component. Wherein, the tube shell is arranged on the base and encloses a containing space, the tube shell has a top wall away from the base, and the top wall is provided with a first metal layer. A part of the surface of the light window facing the tube case is provided with a second metal layer, and the first metal layer and the second metal layer are welded by solder so that the light window seals the containing space. The laser assembly is housed in the containing space and used to emit laser light through the light window.

In one embodiment, the laser packaging structure further includes a collimating lens, the collimating lens is installed on the side of the light window away from the tube case, and the collimating lens is used to transmit the light emitted by the laser assembly. Shaping into parallel light.

In one embodiment, the tube shell includes an outer peripheral wall and an inner peripheral wall opposite to the outer peripheral wall, the top wall is connected between the outer peripheral wall and the inner peripheral wall, and the inner peripheral wall surrounds the In the containing space, the inner edge of the first metal layer is flush with the inner peripheral wall.

In one embodiment, the inner edge of the second metal layer extends beyond the inner peripheral wall, and the laser assembly is disposed in an area enclosed by the projection of the inner edge of the second metal layer on the base.

In one embodiment, there is a first predetermined gap between the outer edge of the first metal layer and the outer edge of the top wall, and the outer edge of the second metal layer is different from the outer edge of the light window. There is a second preset gap therebetween, and the width range of the first preset gap and the second preset gap are both 0.1 mm to 1 mm.

In one embodiment, the outer edge of the top wall is provided with a boss, the light window abuts the boss, and the first metal layer is disposed on the top wall and located inside the boss.

In one embodiment, there is a third predetermined gap between the first metal layer and the boss.

In one embodiment, the height of the boss is equal to the thickness of the light window.

In one embodiment, the laser assembly includes a laser chip module and a reflector, both the laser chip module and the reflector are housed in the containing space, and the laser chip module is used to emit laser light, The reflector is used to reflect the laser light toward the light window.

In one embodiment, the inner peripheral wall of the tube case is provided with a raised step, the base abuts the boss, the laser packaging structure further includes a circuit layer, the circuit layer is arranged in the tube case And electrically connected with the laser assembly.

Compared with the prior art, the light window and the tube shell of the laser package structure provided by the present invention are welded by solder, and the cost of the laser package structure is reduced on the premise of ensuring the welding quality. In addition, a collimating lens is installed on the light window so that the laser can be collimated and emitted.

These and other aspects of the present invention will be more concise and understandable in the description of the following embodiments.

Description of the drawings

In order to more clearly describe the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings that need to be used in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

Fig. 1 is a schematic structural diagram of a laser package structure provided in a first embodiment of the present invention in a state.

2 is a schematic structural diagram of the laser package structure provided by the first embodiment of the present invention in another state.

FIG. 3 is a schematic structural diagram of the base of the laser package structure provided by the first embodiment of the present invention.

FIG. 4 is a schematic diagram of the disassembled structure of the laser package structure provided by the second embodiment of the present invention.

Fig. 5 is a schematic structural diagram of a light window of a laser package structure provided by a second embodiment of the present invention.

FIG. 6 is a schematic diagram of the disassembled structure of the laser package structure provided by the third embodiment of the present invention.

FIG. 7 is a schematic diagram of the disassembled structure of the laser package structure provided by the fourth embodiment of the present invention.

FIG. 8 is a schematic diagram of the disassembled structure of the laser package structure provided by the fifth embodiment of the present invention.

Detailed ways

In order to facilitate the understanding of the embodiments of the present invention, the embodiments of the present invention will be described below in a more comprehensive manner with reference to the relevant drawings. The preferred embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field of the present invention. The terms used in the embodiments of the present invention herein are only for the purpose of describing specific implementation manners, and are not intended to limit the present invention.

The present invention provides a laser packaging structure, which is characterized in that it comprises:

Base

A tube case, the tube case being disposed on the base and enclosing a receiving space, the tube case having a top wall away from the base, and the top wall is provided with a first metal layer;

A light window, a part of the light window facing the tube case is provided with a second metal layer, and the first metal layer and the second metal layer are soldered to make the light window seal the housing space;

as well as

The laser assembly, the laser assembly is accommodated in the accommodating space and used to emit laser light through the light window.

The technical solution of the present invention will be described below through specific embodiments.

The first embodiment

Please refer to FIG. 1 and FIG. 2 together. The present invention provides a laser packaging structure 10, which includes a base 12, a tube case 14, a light window 16, a collimating lens 17 and a laser assembly 18. The tube shell 14 is disposed on the base 12 and encloses a receiving space 15. The tube shell 14 has a top wall 142 away from the base 12, and the top wall 142 is provided with a first metal layer 1421. The light window 16 faces the tube shell 14 and is provided with a second metal layer 161 on the surface of the region corresponding to the tube shell 14. The first metal layer 1421 and the second metal layer 161 are welded by solder, so that the light window 16 seals the receiving space 15. The collimating lens 17 is installed on the side of the light window 16 away from the tube shell 14, and the collimating lens is used to shape the light emitted by the laser assembly into parallel light. The laser assembly 18 is located in the accommodating space 15, and the laser light emitted by the laser assembly 18 is finally emitted from the light window 16.

Please refer to FIG. 2. Specifically, the base 12 is generally a plate-like structure, and may be a regular shape, such as a rectangle, a circle, an ellipse, or a hexagon, or other irregular shapes. The base 12 can be used to install the tube shell 14. In this embodiment, the material of the base 12 may be ceramic, for example, aluminum oxide or aluminum nitride. In other embodiments, the material of the base 12 can also be metal, and the installation of the tube shell 14 is sufficient.

Please refer to Figure 1, Figure 2 and Figure 3 together. In this embodiment, the tube shell 14 is roughly a hollow rectangular parallelepiped structure, that is, the cross section of the tube shell 14 is roughly a rectangular ring, and the tube shell 14 is connected end to end. It is composed of two side walls, which can be integrally formed or welded by several metal plates. It should be noted that the hollow cuboid structure of the tube shell in this embodiment means that the four corners of the tube shell are provided with chamfers. , Rather than a rectangular parallelepiped structure with regular edges and corners. The tube shell 14 can be used to house the laser assembly 18. The material of the shell 14 can be the same as that of the base 12, for example, aluminum oxide or aluminum nitride.

In some other embodiments, the tube shell 14 may also be roughly a hollow cylindrical structure, that is, the cross-section of the tube shell 14 is roughly a circular ring. It can be understood that the tube shell 14 can also be in the shape of a hollow hexagonal prism, etc., to satisfy the accommodating function of the laser assembly 18.

The tube shell 14 is arranged on the base 12 and encloses a receiving space. In this embodiment, the tube shell 14 is bonded with the base by co-sintering. Specifically, the base 12 ceramic green body and tube with embedded circuit layers are prepared. Shell 14 ceramic green body, and then set the ceramic green body of the tube shell 14 in the predetermined area of the ceramic green body of the base 12, and place the semi-finished product in a high-temperature furnace for sintering. The bonding of the base 12, in addition, because the circuit layer of this embodiment is pre-embedded in the base green, and is not located at the junction area of the tube shell 14 and the base 12, so that in the further sintering and curing, the tube shell 14 and the base are added. 12's sealing effect. In other embodiments, the arrangement may also be that the base 12 or the side of the tube shell 14 close to the base 12 is coated with a glue layer, and the tube shell 14 is mounted on the base 12 by bonding.

The tube shell 14 includes a top wall 142, an outer peripheral wall 144, and an inner peripheral wall 146 opposite to the outer peripheral wall 144. The top wall 142 is away from the base 12 and is connected between the outer peripheral wall 144 and the inner peripheral wall 146. In this embodiment, the top wall 142 has a substantially rectangular ring-shaped planar structure, and the inner peripheral wall 146 encloses a receiving space. The outer peripheral wall 144 is the outer surface of the laser package structure 10. It should be noted that the substantially rectangular ring-shaped planar structure of the top wall 142 means that the four corners of the package are chamfered instead of a rectangular shape with regular corners.

In this embodiment, the first metal layer 1421 is disposed on the top wall of the tube shell, and the first metal layer 1421 is substantially in a rectangular ring shape. The outer edge of the first metal layer 1421 is flush with the outer edge of the top wall 142, where the outer edge refers to the circumference of the first metal layer 1421 close to the outer peripheral wall 144. The inner edge of the first metal layer 1421 may be flush with the inner peripheral wall 146 or there may be a gap with the inner peripheral wall 146, so as to prevent the melted solder from flowing to the inner peripheral wall 146 of the tube shell 14, thereby causing damage to the laser assembly 18. Influencing the emission of laser light, where the inner edge is opposite to the outer edge, refers to the circumference of the first metal layer 1421 close to the inner peripheral wall 146. The first metal layer 1421 may be provided on the top wall 142 by coating, such as vacuum evaporation or sputter coating.

Please continue to refer to FIG. 1 and FIG. 2, the light window 16 is roughly in a rectangular ring shape, and the material of the light window 16 may be optical glass or sapphire. The light window 16 may be a light-transmitting material, so as to protect the laser assembly 18 in the receiving space without affecting the emission of the light beam, prevent dust from falling into the laser assembly 18, and reduce the influence of water vapor on the laser assembly 18. In this embodiment, the light window 16 is composed of a transparent material, and the light window 16 is a fully transparent area; in other embodiments, the light window 16 may also be provided with a partially transparent area, that is, the area corresponding to the light exit of the laser chip is provided with a light-transmitting area , Other areas are provided with non-transmissive areas. The advantage of this design is to realize spot shaping simultaneously.

The light window 16 is provided with a second metal layer 161 on a part of the surface facing the tube case 14. The outer edge of the second metal layer 161 can be flush with the outer edge of the light window 16, and the inner edge of the second metal layer 161 can be flush with the light window 16. The inner edges are flush to increase the welding area between the second metal layer 161 and the first metal layer 1421, thereby increasing the connection strength between the light window 16 and the tube shell 14. The second metal layer 161 may be soldered to the first metal layer 1421 so that the light window 16 can seal the receiving space. The second metal layer 161 may be provided on the light window 16 by coating.

In this embodiment, the outer edge of the light window 16 can be flush with the outer peripheral wall 144 of the tube shell 14, so as to ensure that the light window 16 has a larger installation area, thereby improving the stability of the package, and also avoiding light The window 16 extends beyond the tube shell 14 to easily cause damage to the light window 16 and can also make the assembly consistency of the laser package structure 10 better.

In this embodiment, the solder can be a rectangular ring-shaped integral solder tab, and the material can be Sn96.5Ag3.0Cu0.5, or a SnAgCu solder tab of other proportions close to this ratio, or other components with a melting point lower than 260°C. Solder tabs (such as SnAgInBi).

In some other embodiments, the solder may also include multiple segments of solder lugs, with gaps between the segments, and the multiple segments of solder lugs can be assembled into a rectangular ring structure.

In other embodiments, the shape of the solder can also be other irregular shapes, and the specific shape can be selected according to actual conditions, so that the light window 16 can seal the tube shell 14 after the solder is melted.

The collimating lens 17 may be composed of two collimating lenses. In this embodiment, each collimating lens corresponds to a laser assembly 18 to collimate the laser light emitted by the laser assembly 18, thereby improving the imaging quality of the laser. The collimating lens 17 can be bonded to the light window, which can be through UV glue, or other thermosetting glue or other glue that has good adhesion to glass materials and has low stress; it is understandable that In other embodiments, the collimating lens can also be integrally formed with the light window, that is, the surface area of the light window corresponding to the light exit of the laser chip is raised to realize the laser collimation. The advantage of this method is that the laser package structure has less collimation. The assembly steps and assembly of the straight lens are simple, but the manufacturing process with the light window is more difficult.

The laser assembly 18 is housed in the containing space and used to emit laser light through the light window 16. In this embodiment, the laser assembly 18 is arranged in the area enclosed by the projection of the inner wall of the tube shell on the base 12. The laser assembly 18 includes a laser chip module 182 and a reflector 184. The laser chip module 182 and the reflector 184 are both contained in the containing space. The laser chip module 182 is used to emit laser light. In this embodiment, the laser chip module 182 It includes a heat sink carrier and a laser chip, wherein the laser chip is arranged on the surface of the heat sink carrier, and the heat sink carrier is used to dissipate the laser chip. In other embodiments, the laser chip module includes a heat sink carrier and a plurality of The laser chip, that is, a plurality of laser chips are arranged on the surface of the heat sink carrier, and share a heat sink carrier to dissipate heat. The reflector 184 is used to reflect the laser light toward the light-transmitting area of the light window 16. In this embodiment, the reflector 184 includes a reflective surface opposite to the light exit of the laser chip module, and the reflective surface is at a 45° angle to the plane where the base is located. Angle.

In this embodiment, the laser package structure includes two sets of laser components, and each set of laser components includes a laser chip module 182 and a reflector 184, wherein the two reflectors 184 are located between the two laser chip modules 182 and are arranged opposite to each other. , The reflective surfaces of the reflector 184 all face the direction of the light exit of the laser chip. The angle between the reflective surface and the plane where the base 12 is located can be 45°, and the laser light emitted by the laser chip module 182 can be emitted to the reflective surface in a direction parallel to the plane where the base 12 is located, so that the laser light can pass through the reflector 184. The reflection of the reflecting surface finally exits in a direction perpendicular to the plane where the light window 16 is located, that is, exits from the top of the laser packaging structure 10 in a direction perpendicular to the incident direction, that is, ejection light. Under this condition, the light output is the largest.

In other embodiments, the angle between the reflective surface and the plane where the base 12 is located may be other angles, such as 30° or 60°. In other embodiments, the laser light emitted by the laser chip module 182 may also be emitted to the reflective surface along a direction at a certain angle to the plane where the base 12 is located. As an example, the angle may be 30°.

In other embodiments, the laser components can also be in multiple groups, that is, the number of laser chip modules 182 and reflectors 184 can also be three, four or more groups, and there are multiple groups of laser chip modules 182 and reflectors. The 184 may be arranged on the base 12 in an array, or may be arranged on the base 12 irregularly.

In this embodiment, the laser package structure 10 further includes a circuit layer 19, which is arranged in the base 12, that is, the circuit layer 19 is buried in the base, and the circuit layer 19 can be used to connect to a power source to mold the laser chip. The group 182 supplies power so that the laser chip module 182 can emit laser light.

The following are the operating steps of the sealing and welding of the light window 16 of the present invention:

1. Put the completed laser assembly 18, tube shell 14, solder, light window 16, and fixtures into a closed container filled with nitrogen.

2. Place the tube shell 14 with the laser assembly 18 and various components on the clamp in a closed container.

3. Place the solder on the top wall 142 of the tube shell 14.

4. Place the light window 16 on the soldering sheet, and align the outer edge of the light window 16 with the outer peripheral wall 144 of the tube shell 14.

5. The light window 16 and the tube shell 14 are tightly pressed and fixed together on the clamp, and the specific number of clamps can be determined according to requirements.

6. Put the fixed product fixture into the vacuum baking equipment, first vacuum, then fill with nitrogen, and then heat according to the preset program for reflow soldering; vacuum and fill with nitrogen can increase the number of cycles, and the specific cycle number is based on It depends on the need.

7. The reflow soldering is completed. Take out the fixture from the baking equipment and remove the product from the fixture. At this point, the sealing and welding operation of the light window 16 is completed.

In summary, the light window 16 and the shell 14 of the laser package structure 10 provided by the present invention are welded by solder, and the cost of the laser package structure 10 is reduced on the premise of ensuring the welding quality. The collimating lens 17 is installed on the light window 16 so that the laser light can be collimated and emitted.

Second embodiment

4 and 5, this embodiment provides a laser packaging structure 20. The difference from the first embodiment is that there is a first preset between the outer edge of the first metal layer 2421 and the outer edge of the top wall 242 Gap G1.

In this embodiment, the first preset gap G1 has a width ranging from 0.1 mm to 1 mm. As an example, the first preset gap G1 has a width ranging from 0.15 mm to 1 mm. By setting the first preset gap G1, the liquid formed after the solder is melted can flow to the first preset gap G1, so as to prevent the melted solder from overflowing on the outer peripheral wall 244 of the tube shell 24 and causing damage to the tube shell 24.

There is a second predetermined gap G2 between the outer edge of the second metal layer 261 and the outer edge of the light window 26, and the width of the second predetermined gap G2 ranges from 0.1 mm to 1 mm. By setting the second preset gap G2, the liquid formed after the solder is melted can flow to the second preset gap G2, so as to prevent the melted solder from overflowing on the outer wall of the tube shell 24 and causing damage to the tube shell 24.

The third embodiment

Referring to FIG. 6, this embodiment provides a laser package structure 30. The difference from the first embodiment is that the inner edge of the second metal layer 361 provided in this embodiment extends beyond the inner peripheral wall 346, that is, the second metal layer 361 The projection on the base 32 is located in the accommodating space, so that after the solder is melted, the excess solder can adhere to the part of the light window 36 extending inwardly of the second metal layer 361 beyond the inner peripheral wall 346, thereby preventing the solder from running along the pipe The inner peripheral wall 346 of the wall of the shell 34 flows downward to avoid damage to the laser assembly 38.

The outer edge of the second metal layer 361 may be flush with the outer peripheral wall 344 or have a gap with the outer peripheral wall 344, so as to prevent the molten solder from overflowing on the outer peripheral wall 344 of the tube shell 34 and causing damage to the tube shell 34.

Fourth embodiment

Referring to FIG. 7, this embodiment provides a laser packaging structure 40. The difference from the first embodiment is that the outer edge of the top wall 442 provided in this embodiment is provided with a boss 4422, and the boss 4422 faces from the top wall 442. The direction away from the base 42 protrudes, by providing the boss 4422, the molten solder can be prevented from overflowing to the outer peripheral wall 444 of the tube shell 44. In this embodiment, the light window 46 can be opposed to the boss 4422, and the first metal layer 4421 can be disposed on the top wall 442 and located inside the boss 4422.

The height of the boss 4422 may be equal to the thickness of the light window 46. This arrangement enables the surface of the light window 46 to be flush with the surface of the boss 4422 after welding, so that the assembly consistency of the laser package structure 40 is better and the appearance is more beautiful. As an example, the height of the boss 4422 may be greater than 0.2 mm.

In this embodiment, there may be a third preset gap G3 between the first metal layer 4421 and the boss 4422, so that the third preset gap G3 can be filled after the solder is melted, thereby preventing the melted solder from passing through the light window. The gap between 46 and the boss 4422 overflows, causing damage to the light window 46. The width of the third preset gap G3 may also range from 0.1 mm to 1 mm.

Fifth embodiment

Referring to FIG. 8, this embodiment provides a laser packaging structure 50. The difference from the first embodiment is that the outer edge of the tube shell 54 provided in this embodiment extends beyond the base 52, that is, the base 52 does not extend beyond the tube shell 54. The outer peripheral wall 544 and the inner peripheral wall of the tube shell 52 are provided with a boss. The boss is used to support and limit the base, that is, in the laser package structure after installation, the base and the boss are fixed against each other; the bottom of the boss is between the bottom of the tube and the bottom of the tube. The distance between the two is equal to the thickness of the base 52, so that after the tube shell and the base are assembled, the bottom surface of the tube shell is flush with the bottom surface of the base, which improves the consistency of the transfer.

The base 52 is installed in the tube shell 54, and the circuit layer 59 is arranged in the tube shell 54 and electrically connected to the laser assembly 58. The connection method can be through a wire harness made of pure copper or tungsten copper to provide the laser chip module of the laser assembly 58. 582 power supply.

The outer edge of the package 54 extends beyond the base 52, which can reduce the size of the laser packaging structure 50. The material of the base 52 can be copper to improve the heat dissipation performance of the laser package structure 50, and the material of the shell 54 can be alumina ceramic to reduce the production cost. It can be understood that the base 52 and the tube shell 54 may also be made of other materials, as long as the installation relationship between the base 52 and the tube shell 54 is satisfied. In this embodiment, by selecting the shell and the base of different materials, the cost of the laser can be greatly reduced while ensuring the heat dissipation of the laser assembly.

The above-mentioned embodiments only express several implementation modes of the present invention, and their description is relatively specific and detailed, but they should not be understood as a limitation on the patent scope of the present invention. It should be pointed out that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can be made, and these all fall within the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention should be subject to the appended claims.

Claims

A laser packaging structure, characterized in that it comprises:

Base

A tube case, the tube case being disposed on the base and enclosing a receiving space, the tube case having a top wall away from the base, and the top wall is provided with a first metal layer;

A light window, where a part of the surface of the light window facing the tube case is provided with a second metal layer, and the first metal layer and the second metal layer are soldered to make the light window seal the housing space;

as well as

The laser assembly, the laser assembly is accommodated in the accommodating space and used to emit laser light through the light window.
The laser package structure according to claim 1, further comprising a collimating lens, the collimating lens is installed on the side of the light window away from the tube case, and the collimating lens is used for laser The light emitted by the component is shaped into parallel light.
The laser package structure of claim 1, wherein the package includes an outer peripheral wall and an inner peripheral wall opposite to the outer peripheral wall, and the top wall is connected to one of the outer peripheral wall and the inner peripheral wall. In between, the inner peripheral wall encloses the containing space, and the inner edge of the first metal layer is flush with the inner peripheral wall.
The laser package structure of claim 3, wherein the inner edge of the second metal layer extends beyond the inner peripheral wall, and the laser assembly is disposed on the inner edge of the second metal layer on the base. Within the area enclosed by the projection on the top.
The laser package structure according to claim 1, wherein there is a first preset gap between the outer edge of the first metal layer and the outer edge of the top wall, and the outer edge of the second metal layer There is a second preset gap with the outer edge of the light window, and the first preset gap and the second preset gap have a width ranging from 0.1 mm to 1 mm.
The laser package structure according to claim 1, wherein the outer edge of the top wall is provided with a boss, the light window abuts the boss, and the first metal layer is disposed on the top wall And is located on the inner side of the boss.
7. The laser packaging structure of claim 6, wherein a third predetermined gap is formed between the first metal layer and the boss.
7. The laser package structure of claim 6, wherein the height of the boss is equal to the thickness of the light window.
The laser packaging structure according to claim 1, wherein the laser assembly comprises a laser chip module and a reflector, and both the laser chip module and the reflector are accommodated in the accommodating space, and the The laser chip module is used to emit laser light, and the reflector is used to reflect the laser light toward the light window.
The laser package structure according to claim 1, wherein the inner peripheral wall of the package is provided with a raised step, the base is opposed to the boss, the laser package structure further comprises a circuit layer, the The circuit layer is arranged in the tube shell and electrically connected with the laser assembly.