CN216929162U

CN216929162U - Laser device

Info

Publication number: CN216929162U
Application number: CN202123444019.XU
Authority: CN
Inventors: 张昕; 薛兴鹤
Original assignee: Qingdao Hisense Laser Display Co Ltd
Current assignee: Qingdao Hisense Laser Display Co Ltd
Priority date: 2021-12-31
Filing date: 2021-12-31
Publication date: 2022-07-08
Anticipated expiration: 2031-12-31

Abstract

The application discloses laser belongs to the photoelectric technology field. The laser includes: the LED lamp comprises a bottom plate, an annular ceramic tube wall, a light-emitting chip, a printed circuit board and a metal connector; the ceramic tube wall and the light-emitting chip are both positioned on the bottom plate, and the ceramic tube wall surrounds the light-emitting chip; the inner wall of the ceramic tube wall is provided with a first step in a protruding mode, and the outer wall of the ceramic tube wall is provided with a second step in a protruding mode; the first step is provided with a first conducting layer, the second step is provided with a second conducting layer, and the first conducting layer is connected with the second conducting layer; the first conducting layer is used for being connected with the light-emitting chip through a wire; the second conductive layer is connected with the printed circuit board through a metal connector. The application solves the problem that the reliability of the laser is low. The application is used for light emission.

Description

Laser device

Technical Field

The application relates to the field of photoelectric technology, in particular to a laser.

Background

With the development of the optoelectronic technology, the laser is widely used, and the requirement for the reliability of the laser is higher and higher.

Fig. 1 is a schematic structural diagram of a laser provided in the related art. As shown in fig. 1, the laser 00 includes: a bottom plate 001, a ring-shaped sidewall 002, a plurality of conductive leads 003, a plurality of light emitting chips 004, and two Printed Circuit Boards (PCBs) 005. The side walls 002 and the light emitting chips 004 are fixed on the bottom plate 001, and the side walls 002 surround the plurality of light emitting chips 004. The plurality of conductive leads 003 are fixed to opposite sides of the side wall 002, and the conductive leads 003 on each side are directly soldered to the printed circuit board 005 on that side by solder.

Because can send higher temperature when welding conductive pin 003 and printed circuit board 005, this temperature can directly transmit to the accommodation space that bottom plate 001 and lateral wall 002 enclose through conductive pin 003 in, and then the luminous chip 004 in this accommodation space is damaged under the influence of this temperature more easily. Therefore, the reliability of the laser is low.

SUMMERY OF THE UTILITY MODEL

The application provides a laser, can solve the lower problem of reliability of laser. The laser includes: the LED lamp comprises a bottom plate, an annular ceramic tube wall, a light-emitting chip, a printed circuit board and a metal connector; the ceramic tube wall and the light-emitting chip are both positioned on the bottom plate, and the ceramic tube wall surrounds the light-emitting chip;

a first step is protruded on the inner wall of the ceramic tube wall, and a second step is protruded on the outer wall of the ceramic tube wall; the first step is provided with a first conducting layer, the second step is provided with a second conducting layer, and the first conducting layer is connected with the second conducting layer; the first conducting layer is used for being connected with the light-emitting chip through a wire; the second conducting layer is connected with the printed circuit board through the metal connector.

The beneficial effect that technical scheme that this application provided brought includes at least:

in the laser provided by the application, a first conducting layer and a second conducting layer are respectively arranged on a first step and a second step which are protruded at one end, close to a bottom plate, of a ceramic pipe wall, the first conducting layer is connected with the second conducting layer, and a light-emitting chip is connected with an external power supply through the first conducting layer and the second conducting layer. The connected set of first and second conductive layers may correspond to one electrode pin of the laser. The second conductive layer may be connected to the printed circuit board by a metal connector. Therefore, heat generated when the metal connector is fixed can be conducted to the outer side of the ceramic tube wall through the metal connector and can not be directly conducted to the accommodating space where the light-emitting chip is located. Therefore, the temperature of the light-emitting chip is lower, the risk that the light-emitting chip is damaged under the influence of the temperature can be reduced, and the reliability of the laser is improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a laser provided in the related art;

fig. 2 is a schematic structural diagram of a laser provided in an embodiment of the present application;

fig. 3 is a schematic partial structural diagram of a laser provided in an embodiment of the present application;

fig. 4 is a schematic partial structural diagram of another laser provided in an embodiment of the present application.

Detailed Description

To make the objects, technical solutions and advantages of the present application more clear, embodiments of the present application will be described in further detail below with reference to the accompanying drawings.

With the development of the optoelectronic technology, the application of the laser is more and more extensive, for example, the laser can be used as a light source of a laser projection device or a laser television. The demand for miniaturization and reliability of the laser is also increasing at present. In the related art, a substrate, a sidewall and a sealing assembly in a laser enclose a closed accommodating space, and a light emitting chip is located in the accommodating space. The light emitting chip has a nominal maximum temperature, such as 65 degrees. If the light emitting chip is in an environment higher than the temperature, the life of the light emitting chip may be affected and the light emitting chip may be directly damaged. In the related art, the printed circuit board is directly soldered to the conductive pins inserted into the side walls by soldering tin, and the soldering temperature of the soldering tin can reach 300 ℃. This heat can directly transmit the accommodation space at luminescence chip place through electrically conductive pin, and then can influence luminescence chip's performance for luminescence chip's life-span shortens, probably direct damage even. The reliability of the laser in the related art is low.

The following embodiment of this application provides a laser instrument, can reduce the temperature of transmitting to emitting chip when fixed printed circuit board, reduces the risk that emitting chip damaged under the influence of this temperature, and then improves the reliability of laser instrument.

Fig. 2 is a schematic structural diagram of a laser according to an embodiment of the present disclosure. As shown in fig. 2, the laser 10 includes: a base plate 101, a ring-shaped ceramic tube wall 102, a light emitting chip 103, a metal connector 111, and a printed circuit board 112.

The ceramic tube wall 102 and the light emitting chip 103 are both located on the bottom plate 101, and the ceramic tube wall 102 surrounds the light emitting chip 103. The structure formed by the base plate 101 and the ceramic tube wall 102 may be referred to as a package, and the package has a receiving space in which the light emitting chip 103 may be located. The inner wall of the ceramic tube wall 102 may be projected with a first step J1, and the outer wall of the ceramic tube wall 102 may be projected with a second step J2. The first conductive layer D1 is provided on the first step J1, and the second conductive layer D2 is provided on the second step J2. That is, the surface of the first step J1 away from the bottom plate 101 has the first conductive layer D1, and the surface of the second step J2 away from the bottom plate 101 has the second conductive layer D2.

The first conductive layer D1 is connected to the second conductive layer D2; the first conductive layer D1 is used to connect with the light emitting chip 103 through the wire 104. The second conductive layer D2 is connected to the printed circuit board 112 through the metal connector 111, and the second conductive layer D2 receives the current transmitted from the printed circuit board 112. For example, the ceramic tube wall 102 has a conductive portion (not shown) embedded therein, and the first conductive layer D1 can be electrically connected to the conductive portion to connect the second conductive layer D2 through the conductive portion. The current output from the printed circuit board 112 may be transmitted to the light emitting chip 103 through the metal connector 111, the second conductive layer D2, the first conductive layer D1, the conductive portion inside the ceramic tube wall 102, and the second conductive layer D2 in sequence. The light emitting chip 103 may emit laser light by the current.

To sum up, in the laser provided in the embodiment of the present application, the first conducting layer and the second conducting layer are respectively disposed on the first step and the second step protruding from the end of the ceramic tube wall close to the bottom plate, the first conducting layer is connected to the second conducting layer, and the light emitting chip is connected to the external power source through the first conducting layer and the second conducting layer. The connected set of first and second conductive layers may correspond to one electrode pin of the laser. The second conductive layer may be connected to the printed circuit board by a metal connector. Therefore, heat generated when the metal connector is fixed can be conducted to the outer side of the ceramic tube wall through the metal connector and can not be directly conducted to the accommodating space where the light-emitting chip is located. Therefore, the temperature of the light-emitting chip is lower, the risk that the light-emitting chip is damaged under the influence of the temperature can be reduced, and the reliability of the laser is improved.

In the embodiment of the present application, the orthographic projection of the ceramic tube wall 102 on the plane of the bottom plate 101 is located on the bottom plate 101, and all areas of the bottom surface of the ceramic tube wall 102 are in contact with the bottom plate 101.

Alternatively, with continued reference to fig. 2, the base plate 101 may have conductive traces (not shown) and a plurality of first pads H thereon. The first pad H may be located at an edge region of the base plate 101. The conductive line may connect each of the second conductive layers D2 to one of the first pads H. The printed circuit board 112 may have a plurality of second pads H2, and the plurality of first pads H1 corresponds to a plurality of second pads H2 one to one. Two ends of each metal connector 111 can be soldered to a first pad H1 and its corresponding second pad H2, respectively, so as to connect a second conductive layer D2 to the printed circuit board 112. Alternatively, both ends of the metal connector 111 may be soldered to the first pads H1 and the corresponding second pads H2, respectively, by solder.

Alternatively, the first pads H on the base plate 101 may be located in the edge regions of the two opposite sides of the base plate 101, for example, the two opposite sides may be two opposite sides in the x direction. Accordingly, the laser 10 may include two printed circuit boards 112 on the opposite sides, respectively. The first pads H1 on each side are connected to the second pads H2 on the printed circuit board 112 on that side through metal connectors 111.

Alternatively, the material of the bonding pad may include copper. Alternatively, the first land H1 of one of the opposite sides may be connected to the positive power supply electrode through the printed circuit board 112, and the first land H1 of the other side may be connected to the negative power supply electrode through the printed circuit board 112.

The structure of the metal connector 111 is described below:

alternatively, the metal connector 111 may have at least one bent portion. As shown in fig. 2, the metal connector 111 may have a U-shape, and the metal connector 111 has two bending portions. Optionally, the metal connector 111 may also have three or even four bending portions, and the metal connector 111 may also be in a Z-shape or a square wave shape, which is not limited in the embodiment of the present application.

Optionally, the cross section of the metal connector 111 is U-shaped, and the U-shaped cross section may be perpendicular to the bottom plate 101 and the printed circuit board 112, that is, perpendicular to the surface of the bottom plate 101 and the surface of the printed circuit board 112. For example, the metal connector 111 may include a first strip connected to the first pad H1 on the bottom plate 101, a second strip connected to the second pad H2 on the printed circuit board 112, and a third strip connected to the first strip (e.g., z direction) perpendicular to the bottom plate 101 and the third strip (e.g., z direction) perpendicular to the printed circuit board 112. In a conventional manner, the metal connector 111 may stand up with respect to the base plate 101 and the printed circuit board 112. This arrangement of the metal connectors 111 facilitates observation of the bonding effect of the ends of the metal connectors 111 to the pads after the bonding is completed. When the welding effect is not ideal enough, the welding device can be conveniently remedied by preparation personnel.

It should be noted that the metal connector 111 has at least one bending portion, so as to increase the heat dissipation area of the metal connector. Heat generated from the metal connector 111 when being soldered to the first and second pads H1 and H2 may be more rapidly dissipated through the metal connector 111, reducing heat conducted to the region where the light emitting chip is located. And when this metal connector 111 is heated, its kink can carry out certain compression to release thermal stress, reduce the risk that leads to metal connector 111 to damage because of thermal stress, guaranteed the reliability of metal connector 111.

Alternatively, the material of the metal connector 111 may be an alloy containing silver. The material has good heat dissipation performance, can further improve the heat dissipation during welding and reduce the heat conducted to the light-emitting chip 103. Alternatively, the width of the metal connector 111 may range from 2 mm to 4 mm, such as 3 mm. The width direction of the metal connector 111 may be a direction perpendicular to the paper in fig. 2.

It should be noted that fig. 2 illustrates an example in which the laser 10 includes one ceramic tube wall 102, and only two light emitting chips 103 in the ceramic tube wall 102 are illustrated. Optionally, the laser 10 may also include a plurality of ceramic tube walls 102, and the second conductive layer D2 on each ceramic tube wall 102 may be connected to the first bonding pad H1 corresponding to the edge region of the base plate 101 through a conductive trace in the base plate 101. The number of the light emitting chips 103 in the ceramic tube wall 102 may also be adjusted based on specific situations, and the embodiment of the present application is not limited.

The base plate 101 and ceramic tube wall 102 of the laser 10 are described below:

alternatively, the material of the substrate 101 in the laser 10 may include metal. If the metal can be copper or other metal, the embodiments of the present application are not limited. Since the material of the ceramic tube wall 102 includes ceramic, which is an insulating material, the ceramic tube wall 102 can be used to insulate the bottom plate 101 from the first conductive layer D1, and insulate the bottom plate 101 from the second conductive layer D2. In this way, the bottom plate 101 does not affect the conductive effects of the first conductive layer D1 and the second conductive layer D2, and the first conductive layer D1 and the second conductive layer D2 can be closer to the bottom plate 101, that is, the heights of the first step J1 and the second step J2 can be lower.

In the embodiment of the present application, the first step J1 and the second step J2 protrude from one end of the ceramic tube wall 102 close to the bottom plate 101, and the bottom surfaces of the first step J1 and the second step J2 are the surfaces of the ceramic tube wall 102 close to the bottom plate 101. As shown in fig. 2, the longitudinal section of the ceramic tube wall 102 at the position of the first step J1 and the second step J2 may be an inverted T shape. Because the first step J1 and the second step J2 protrude from the end of the ceramic tube wall 102 close to the bottom plate 101, the area of the bottom surface of the ceramic tube wall 102 is larger. The larger bottom surface can be used for welding with the bottom plate 101, and the welding area is larger, so that the welding firmness between the bottom plate 101 and the ceramic tube wall 102 can be improved, and the reliability of the laser 10 can be improved.

Alternatively, the bottom plate 101 and the ceramic tube wall 102 may be welded by brazing. For example, the ceramic tube wall 102 may be placed on the surface of the base plate 101 with a ring of solder placed between the base plate 101 and the annular surface of the ceramic tube wall 102. Then, the base plate 101 and the ceramic tube wall 102 are placed in a high-temperature furnace, and the solder ring is melted to fill the gap between the base plate 101 and the bottom surface of the ceramic tube wall 102, so as to realize the welding of the base plate 101 and the ceramic tube wall 102.

In the embodiment, the first step J1 and the second step J2 are integrally formed with other parts of the ceramic tube wall 102. Alternatively, the ceramic material may be processed by an etching process or a grinding process to form the first step J1 and the second step J2 of the ceramic tube wall 102. The conductive portions inside the ceramic tube wall 102 are formed during the process of forming the ceramic tube wall 102. Next, a first conductive layer D1 and a second conductive layer D2 may be deposited, coated, or attached on the first step J1 and the second step J2, respectively. After the first conductive layer D1 and the second conductive layer D2 are disposed on the first step J1 and the second step J2, the conductive parts inside the ceramic tube wall 102 are directly connected, and further the first conductive layer D1 and the second conductive layer D2 are connected.

In the embodiment of the present application, the first conductive layer D1 on the ceramic tube wall 102 and the second conductive layer D2 connected thereto serve as electrode pins. Compared with the related art, the conductive pin is inserted into the opening on the side wall, and the gap between the conductive pin and the opening is filled by other materials so as to ensure the air tightness of the accommodating space of the tube shell; because the electrode pins are arranged without perforating the ceramic tube wall 102, the risk that the air tightness of the tube shell is insufficient due to the fact that unfilled gaps exist in the holes is avoided, and the air tightness of the accommodating space of the tube shell can be improved. In addition, in the process of manufacturing the laser, the steps of inserting the conductive pins into the holes and sealing the gaps between the conductive pins and the holes are not required to be executed, so that the manufacturing process of the laser can be simplified.

After the base plate 101 and the ceramic tube wall 102 are fixed, an accommodating space may be enclosed by the base plate 101 and the ceramic tube wall 102, and the light emitting chip 103 may be fixed in the accommodating space. Thereafter, wires 104 may be provided between the first conductive layer D1 and the light emitting chips 103 adjacent thereto, and the wires 104 may be provided between the light emitting chips 103 that need to be connected in series.

In the embodiment of the present application, the wires 104 may be fixed to the first conductive layer D1 and the light emitting chip 103 by using a ball bonding technique. When the ball bonding technology is adopted to weld the lead, a routing tool is adopted to melt one end of the lead, the melted end is pressed on the object to be connected, and ultrasonic waves are applied to the routing tool to complete the fixation of the lead and the object to be connected. Alternatively, the wire 104 may be a gold wire, and the process of fixing the wire and the conductive lead may also be referred to as a gold wire bonding process.

In the embodiment of the present application, the first step J1 where the first conductive layer D1 is located protrudes from one end of the ceramic tube wall 102 close to the bottom plate 101, so that the bottom surface of the step J1 can contact with the bottom plate 101 and is supported by the bottom plate 101 without being suspended. So, because bottom plate 101's supporting role, step J1's pressure bearing capacity is stronger when the routing, avoids first conducting layer D1 or step J1 to take place the damage under the effect of the pressure that this routing equipment was applyed, and the welding firmness of wire and first conducting layer D1 can be higher. Therefore, the success rate of routing and the fixing effect of the lead can be improved, and the preparation yield of the laser is improved.

Optionally, the number of wires 104 between any two components connected by the wires 104 in the laser 10 may be multiple to ensure the reliability of the connection between the components and to reduce the sheet resistance on the wires 104. For example, the first conductive layer D1 and the light emitting chips 103, and the adjacent light emitting chips 103 can be connected by a plurality of wires 104, and fig. 2 only illustrates one wire 104.

In the embodiment of the present application, the material of the bottom plate 101 is different from the material of the ceramic tube wall 102, and the expansion coefficient of the bottom plate 101 may be correspondingly different from the expansion coefficient of the ceramic tube wall 102. Optionally, the laser 10 may further include: a transition ring (not shown) having a coefficient of expansion that is between the coefficient of expansion of the base plate 101 and the coefficient of expansion of the ceramic tube wall 102. A transition ring may be positioned between the base plate 101 and the ceramic tube wall 102, and the shape of the transition ring may match the shape of the ceramic tube wall 102. Both the bottom plate 101 and the ceramic tube wall 102 are fixed to the transition ring. Optionally, the material of the transition ring may include molybdenum. When the base plate 101 and the ceramic pipe wall 102 are welded, a large stress is generated between the base plate 101 and the ceramic pipe wall 102 due to a difference in expansion coefficient between the base plate 101 and the ceramic pipe wall 102. In the embodiment of the present application, the transition ring is disposed, so that the stress can be buffered and released, and the bottom plate 101 and the ceramic pipe wall 102 are prevented from being damaged under the stress.

For example, when the base plate 101 and the ceramic tube wall 102 are fixed, a first solder ring, a transition ring, a second solder ring, and the ceramic tube wall 102 may be stacked on the base plate 101 in order in a direction away from the base plate 101. And then, the combined structure of the base plate 101, the solder rings, the transition rings and the ceramic tube wall 102 is placed in a high-temperature furnace, so that the first solder ring is melted to fill the gap between the base plate 101 and the transition rings, and the second solder ring is melted to fill the gap between the ceramic tube wall 102 and the transition rings, thereby realizing the welding of the base plate 101 and the ceramic tube wall 102 through the transition rings.

Optionally, the first step J1 of the ceramic tube wall 102 in the laser 10 away from the bottom plate 101 may be flush with the second step J2 away from the bottom plate 101, which may facilitate the connection between the first conductive layer D1 and the second conductive layer D2. Alternatively, the surface of the first step J1 away from the bottom plate 101 and the surface of the second step J2 away from the bottom plate 101 may have a height difference, and the embodiment of the present application is not limited thereto.

Optionally, in the embodiment of the present application, the first step J1 and the second step J2 are both rectangular parallelepiped. Optionally, the first step J1 and the second step J2 may also be steps with other shapes, for example, the top view of the first step J1 and the second step J2 may be trapezoidal, pentagonal, hexagonal, semicircular or other shapes, which is not limited in this embodiment of the application.

Fig. 3 is a schematic partial structural diagram of a laser according to an embodiment of the present disclosure. As shown in fig. 3, in the embodiment of the present application, the ceramic tube wall 102 may include a plurality of sub-walls connected end to end in sequence. If the ceramic pipe wall 102 is in a square ring shape, the ceramic pipe wall 102 includes four sub-walls (not shown) connected end to end in sequence to form a closed ring shape. The inner walls of two opposite sub-walls of the plurality of sub-walls protrude a first step J1, and the outer walls of the two sub-walls protrude a second step J2. The two sub-walls as in fig. 2 are two sub-walls in the x-direction, respectively. The inner wall and the outer wall of the other two sub-walls can be not protruded with steps. Each of the sub-walls from which the steps are protruded may have a T-shaped section perpendicular to the wall surface of each of the sub-walls. As shown in fig. 3, the wall surface of the sub-wall on which the step is projected is parallel to the y direction, and the T-shaped cross section of the sub-wall is perpendicular to the y direction and parallel to the x direction.

For each sub-wall that is projected with a step, the first conductive layer D1 on the projected first step J1 therein is connected with the second conductive layer D2 on the projected second step J2 in the sub-wall through a conductive portion inside the sub-wall. Optionally, as shown in fig. 3, there may be a plurality of first conductive layers D1 on the first step J1 protruding from each sub-wall, and a plurality of second conductive layers D2 on the second step J2 protruding from each sub-wall, where the plurality of first conductive layers D1 correspond to the plurality of second conductive layers D2 one to one; each first conductive layer D1 is connected to the corresponding second conductive layer D2, and is insulated from the other first conductive layers D1 and the other second conductive layers D2.

Optionally, since the ceramic tube wall 102 is insulated, the first conductive layers D1 on the first step J1 can be spaced apart, and the second conductive layers D2 on the second step J2 can be spaced apart, so that the first conductive layers D1 can be insulated, and the second conductive layers D2 can be insulated. Optionally, an insulating material may also be disposed between adjacent first conductive layers D1 and between adjacent second conductive layers D2, so as to further ensure the insulation of each first conductive layer D1 and the insulation of each second conductive layer D2.

Optionally, in the two opposite sub-walls, the conductive layer on one sub-wall may serve as a positive pin to be connected to a positive electrode of an external power source, and the conductive layer on the other sub-wall may serve as a negative pin to be connected to a negative electrode of the external power source.

It should be noted that the number of the conductive layers on the steps protruding from the sub-walls may be related to the arrangement of the light emitting chips 103 in the laser and the circuit connection manner. For example, each type of light emitting chip 103 in the laser 10 is used for emitting laser light of a corresponding color, and different types of light emitting chips are used for emitting laser light of different colors. Each type of light emitting chip 103 is connected in series and does not share a conductive layer. The number of the first conductive layers D1 and the number of the second conductive layers D2 may be twice as many as the number of the light emitting chips. Alternatively, the different types of light emitting chips 103 may share the conductive layer, and the number of each conductive layer may be less than twice the number of types of light emitting chips. The plurality of light-emitting chips in each type of light-emitting chip are connected in series, so that the on-off of the plurality of light-emitting chips can be controlled by only one switch. And the currents at all positions in the series circuit of the plurality of light-emitting chips are equal, so that the requirement on the input current is lower, the threshold current of each light-emitting chip is easily reached, and the light-emitting chips are convenient to emit light.

For example, the laser 10 in the embodiment of the present application may be a monochromatic laser, that is, each light emitting chip 103 in the laser 10 is used for emitting laser light of the same color. At this time, only two sets of conductive layers may be disposed on the protruding step J on the ceramic tube wall 102 of the laser 10, where each set of conductive layers includes a first conductive layer D1 and a second conductive layer D2 connected together. One group of conducting layers is used as a positive electrode pin, and the other group of conducting layers is used as a negative electrode pin.

Further exemplary, the laser 10 may be a multi-color laser, i.e., the laser 10 includes at least two types of light emitting chips, with different types of light emitting chips being used to emit laser light of different colors. Each type of light emitting chip 103 is connected in series, and both ends are respectively connected with the two first conductive layers D1, and the first conductive layers D1 connected with different types of light emitting chips 103 are different. The two ends of each type of light emitting chip 103 refer to two connection ends of the plurality of light emitting chips 103 connected in series. For example, the laser 10 includes three types of light emitting chips for emitting red laser light, green laser light, and blue laser light, respectively. At this time, only six sets of conductive layers may be disposed on the protruding step J on the ceramic tube wall 102 of the laser 10, three sets of conductive layers all serve as positive pins, and the other three sets of conductive layers all serve as negative pins. Each type of light emitting chip 103 is connected to one positive pin and one negative pin.

Optionally, with continuing reference to fig. 3, in the embodiment of the present application, at least two types of light emitting chips 103 in the laser 10 are arranged in two rows and multiple columns. One row of the light emitting chips 103 comprises a first type of light emitting chip 103a, and the other row of the light emitting chips 103 comprises a second type of light emitting chip 103b and a third type of light emitting chip 103 b; the second type of light emitting chips 103b and the third type of light emitting chips 103c are respectively located in two regions on the bottom plate 101, and the two regions are sequentially arranged along a row direction (e.g., x direction) of the light emitting chips 103. Illustratively, the first type of light emitting chip 103a, the second type of light emitting chip 103b and the third type of light emitting chip 103c emit laser light with successively decreasing wavelengths. The first type of light emitting chip 103a is used for emitting red laser light, the second type of light emitting chip 103b is used for emitting green laser light, and the third type of light emitting chip 103c is used for emitting blue laser light.

The laser 10 may further include: a plurality of relay stations 107 located between the two rows of light emitting chips 103. The number of the plurality of transfer stations 107 is less than a number threshold. As shown in fig. 3, the plurality of transfer stations 107 are arranged in a row, and the number of the plurality of transfer stations 107 is 3 in the embodiment of the present application. Optionally, the number of the transfer stations 107 may also be 4 or other values, and the number of the transfer stations 107 may be designed correspondingly according to the distance of the component to be transferred, which is not limited in the embodiment of the present application. The interposer 107 located in the middle may be connected to two interposers 107 located on both sides thereof, respectively, and the two interposers 107 located on both sides may be connected to the first conductive layer D1, respectively.

For example, the adapting table 107 may have a cylindrical shape, and a surface of the adapting table 107 away from the base plate 101 is electrically conductive for adapting a wire. Optionally, the transfer station 107 may include: an adapter body and a conductive layer on a side of the adapter body away from the base plate 101. The adapter table main body can be made of an insulating material, such as ceramic, or can also be made of aluminum nitride or aluminum oxide; the material of the conductive layer can be gold or other metals. Alternatively, the docking station 107 may have a square shape, a cylindrical shape, an elliptical cylindrical shape, a prismatic shape, or other cylindrical shapes. The size of the surface of the adapter 107 away from the base plate may be designed accordingly based on the setting requirement of the wires, and the embodiment of the present application is not limited.

The second type light emitting chip 103b and the third type light emitting chip 103c have one end connected to a first conductive layer D1 and the other end connected to the interposer 107, so as to be connected to another first conductive layer D1 through the interposer 107. Optionally, the intermediate transfer stage 107 may be located between the second type of light emitting chip 103b and the third type of light emitting chip 103c, so that the second type of light emitting chip 103b and the third type of light emitting chip 103c are both connected to the transfer stage. Alternatively, the upper surface of the interposer 107 located in the middle may have two insulated conductive areas for connecting the second type light emitting chip 103b and the third type light emitting chip 103c, respectively, so as to ensure normal current transmission to the second type light emitting chip 103b and the third type light emitting chip 103 c.

Optionally, of the two sub-walls on the two opposite sides of the ceramic tube wall 102, the conductive layer on one sub-wall is used as a positive pin, and the conductive layers on the other sub-wall are both used as negative pins; furthermore, two first conductive layers D1 connected to each type of light emitting chip are respectively located on two opposite sides of the ceramic tube wall 102. Illustratively, the left end of the second type of light emitting chip 103b is connected to the first conductive layer D1 on the left sub-wall, and the right end is connected to the first conductive layer D1 on the right sub-wall through two vias 107. The right end of the third type of light emitting chip 103c is connected to the first conductive layer D1 on the right sub-wall, and the left end is connected to the first conductive layer D1 on the left sub-wall through two vias 107.

In the embodiment of the present application, each type of light emitting chip 103 may include a plurality of light emitting chips 103, that is, the number of each type of light emitting chip 103 is greater than or equal to 2. Optionally, there may be a certain type of light emitting chip including only one light emitting chip, and this embodiment of the present application is not limited. For example, the number of the first type light emitting chips 103a may be equal to the sum of the number of the second type light emitting chips 103b and the number of the third type light emitting chips 103c, and the number of the second type light emitting chips 103b may be greater than the number of the third type light emitting chips 103 c. As in fig. 3, the number of the first type light emitting chips 103a is 7, the number of the second type light emitting chips 103b is 4, and the number of the third type light emitting chips 103c is 3. Alternatively, the number of the second type of light emitting chips 103b may also be equal to the number of the third type of light emitting chips 103c, and the number of the first type of light emitting chips 103a may also not be equal to the sum of the numbers of the second type of light emitting chips 103b and the third type of light emitting chips 103 c. The number of the various light-emitting chips in the laser can be determined according to the required proportion of various colors in the laser, and the number relation of the various light-emitting chips are not limited in the embodiment of the application.

It should be noted that, in the embodiment of the present application, the plurality of light emitting chips 103 in the laser 10 includes 14 light emitting chips 103 arranged in two rows and seven columns. Optionally, the light emitting chips 103 in the laser 10 may also be arranged in other manners, and the number of the light emitting chips 103 may also be other numbers, which is not limited in this embodiment. For example, the laser 10 may include 20 light emitting chips arranged in four rows and five columns, or 10 light emitting chips arranged in two rows and five columns. Optionally, the number of the light emitting chips in the laser 10 may not be three, and the laser color emitted by the multiple types of light emitting chips may also be other colors besides red, green, and blue, which is not limited in this embodiment of the present application.

Fig. 4 is a schematic partial structural diagram of another laser provided in an embodiment of the present application. As shown in fig. 4, the laser 10 may include a plurality of ceramic tube walls 102, each ceramic tube wall 102 may surround a type of light emitting chip 103. Fig. 4 illustrates that the laser 10 includes three ceramic tube walls 102, and the three ceramic tube walls 102 respectively surround the first type light emitting chip 103a, the second type light emitting chip 103b, and the third type light emitting chip 103 c.

Alternatively, the plurality of tube walls 102 may be time-shared with the base plate 101. One tube wall 102 may be welded to the base plate 101 and after the tube wall 102 and the base plate 101 have cooled, another tube wall 102 may be welded to the base plate 101. In this way, since the light emitting chips 103 in the laser 10 are respectively packaged by the plurality of tube walls 102, the number of light emitting chips 103 disposed in the region surrounded by each tube wall 102 is small, the volume of each tube wall 102 is small, and the contact area between each tube wall 102 and the base plate 101 is small. Since the thermal stress generated by welding the two objects is directly correlated with the contact area of the two objects, when the pipe walls 102 are welded on the bottom plate 101 in a time-sharing manner, the thermal stress generated by each welding is small, and the risk that the pipe walls 102 and the bottom plate 101 are damaged due to the thermal stress during welding can be further reduced.

With continued reference to fig. 2, the bottom plate 101 may include a first region and a second region, the first region may surround the second region, and the second region is raised relative to the first region. The first area and the second area are not identified in the figure. The ceramic tube wall 102 may be fixed to the first region and the plurality of light emitting chips 103 in the laser 10 may all be located in the second region. This second area may also be referred to as a patch area of the board 101. Alternatively, the height difference between the first region and the second region may be close to the height of the first step J1 protruding from the inner wall of the ceramic tube wall 102, or may be slightly higher than the height of the first step J1. In this way, the linear distance between the light emitting chip 103 disposed on the second region and the first conductive layer D1 disposed on the first step J1 can be further shortened, so as to ensure that the wire connecting the light emitting chip 103 and the first conductive layer D1 is short, and ensure that the strength of the wire is high.

With continued reference to fig. 2 to 4, the laser 10 may further include a plurality of heat sinks 105, a plurality of reflection prisms 106, a light transmissive sealing layer 108, and a collimating mirror group 109.

The plurality of reflection prisms 106 and the plurality of heat sinks 105 may each correspond one-to-one to the plurality of light emitting chips 103. Each light emitting chip 103 is positioned on a corresponding heat sink 105, and the heat sink 105 is used to assist the corresponding light emitting chip 103 in dissipating heat. The material of the heat sink 105 may comprise a ceramic. Each of the reflecting prisms 106 is located on the light exit side of the corresponding light emitting chip 103. The light emitting chips 103 may emit laser light to the corresponding reflection prisms 106, and the reflection prisms 106 may reflect the laser light in a direction (e.g., z direction) away from the base plate 101.

The light-transmitting sealing layer 108 is located on a side of the ceramic tube wall 102 away from the bottom plate 101, and is used for sealing an accommodating space enclosed by the ceramic tube wall 102 and the bottom plate 101. Alternatively, the edge region of the light-transmissive sealing layer 108 may be directly fixed to the surface of the ceramic tube wall 102 remote from the bottom plate 101. Illustratively, the edge region of the light transmissive sealing layer 108 may be pre-set with a metal solder. The light-transmissive sealing layer 108 may be placed on the side of the ceramic tube wall 102 remote from the base plate 101 and the metal solder is brought into contact with the surface of the tube wall 102 remote from the base plate 101. The ceramic tube wall 102 and the light-transmissive sealing layer 108 are then placed together in a high-temperature furnace to melt the metal solder and thereby weld the ceramic tube wall 102 and the light-transmissive sealing layer 108 together.

The collimating lens group 109 may be located on a side of the ceramic tube wall 102 away from the base plate 101, such as on a side of the light-transmissive sealing layer 108 away from the base plate 101. The collimating lens group 109 may include a plurality of collimating lenses corresponding to the plurality of light emitting chips 103 one to one, and the collimating lenses are configured to collimate the incident laser light. Such as the plurality of collimating lenses may be integrally formed. The side of the collimating lens group 109 away from the base plate 101 may have a plurality of convex curved surfaces, and each convex curved surface may be a collimating lens. It should be noted that, collimating the light, that is, adjusting the divergence angle of the light, makes the light adjusted to be as close to parallel light as possible. The laser emitted by the light emitting chip 103 can be reflected by the corresponding reflection prism 106 toward the light-transmitting sealing layer 108, and then the light-transmitting sealing layer 108 can transmit the laser to the collimating lens corresponding to the light emitting chip 103 in the collimating lens group 109, so as to be collimated by the collimating lens and then emitted, thereby realizing the light emission of the laser 10.

It should be noted that, after the height of the ceramic tube wall 102 is reduced, the size of at least one dimension of the collimating lenses in the collimating lens group 109 can be reduced, and the shape of the collimating lenses can no longer be too flat and long. Since the area of the collimating lens can be smaller, the arrangement density of the collimating lenses can be increased, and the size of the collimating lens group 109 can be smaller. And, the distance between the light emitting chip 103 and the corresponding reflection prism 106 can be reduced accordingly, and the volume of the laser can be further reduced.

It is noted that the terms "comprises" and "comprising," as well as any variations thereof, are intended to cover but not to be exhaustive in this application. In the embodiments of the present application, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. The term "at least one" refers to one or more. The term "plurality" means two or more unless expressly limited otherwise. "substantially" and "approximately" mean within an acceptable error range that a person skilled in the art can solve the technical problem to be solved and achieve the technical effect to be achieved basically. In the drawings, the size of layers and regions may be exaggerated for clarity of illustration. Also, it will be understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element or layer or intervening layers may also be present. Like reference numerals refer to like elements throughout.

The above description is only exemplary of the present application and should not be taken as limiting, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A laser, characterized in that the laser comprises: the LED lamp comprises a bottom plate, an annular ceramic tube wall, a light-emitting chip, a printed circuit board and a metal connector; the ceramic tube wall and the light-emitting chip are both positioned on the bottom plate, and the ceramic tube wall surrounds the light-emitting chip;

2. The laser of claim 1, wherein the metal connector has at least one bend.

3. The laser of claim 2, wherein the metal connector is U-shaped.

4. The laser of claim 3, wherein the metal connector has a U-shaped cross-section perpendicular to the base plate and the printed circuit board.

5. The laser of claim 1, wherein the metal connector has a width in a range of 2 mm to 4 mm.

6. The laser of claim 1, wherein the substrate has a conductive trace thereon, and a first pad connected to the conductive trace, the pad being located at an edge region of the substrate;

the second conducting layer is connected with the conducting circuit, and two ends of the metal connector are respectively welded with the first bonding pad and the printed circuit board.

7. The laser of claim 6, wherein the first pads on the substrate are distributed at edge regions of two opposite sides of the substrate, the laser comprising two printed circuit boards respectively located at the two opposite sides;

the first bonding pad of each of the two opposite sides is connected to the printed circuit board of each side through the metal connector.

8. The laser according to any one of claims 1 to 7, wherein the first step has a plurality of first conductive layers spaced from each other, the second step has a plurality of second conductive layers spaced from each other, and the first conductive layers are connected to the second conductive layers in a one-to-one correspondence;

one ends of the metal connectors are used for being connected with the second conducting layers in a one-to-one correspondence mode; the printed circuit board is provided with a plurality of second bonding pads, and the other ends of the metal connectors are connected with the second bonding pads in a one-to-one correspondence mode.

9. The laser of any one of claims 1 to 7, wherein the orthographic projections of the ceramic tube walls on the plane of the base plate are all located on the base plate.

10. The laser according to any one of claims 1 to 7, wherein the light emitting chips in the laser include multiple types of light emitting chips, the multiple types of light emitting chips correspond to multiple colors one by one, and each type of light emitting chip is used for emitting laser light of a corresponding color;

the laser comprises a plurality of ceramic tube walls, the ceramic tube walls correspond to the multiple types of light-emitting chips one by one, and each tube wall surrounds the corresponding type of light-emitting chip.