CN107703589B - A kind of Multi-path parallel optical component encapsulating structure and Multi-path parallel optical component - Google Patents
A kind of Multi-path parallel optical component encapsulating structure and Multi-path parallel optical component Download PDFInfo
- Publication number
- CN107703589B CN107703589B CN201710685656.5A CN201710685656A CN107703589B CN 107703589 B CN107703589 B CN 107703589B CN 201710685656 A CN201710685656 A CN 201710685656A CN 107703589 B CN107703589 B CN 107703589B
- Authority
- CN
- China
- Prior art keywords
- tail pipe
- optical component
- path parallel
- encapsulating structure
- parallel optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4251—Sealed packages
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention discloses provide a kind of Multi-path parallel optical component encapsulating structure and with the Multi-path parallel optical component of the encapsulating structure, encapsulating structure includes top plate, middle casing, bottom plate.Middle casing includes ring frame, tail pipe: ring frame is used to form air-tight chamber with top plate and bottom plate, and tail pipe and ring frame are integrally formed and are connected to air-tight chamber.Bottom plate includes substrate, metal plate: substrate is equipped with inscribed line terminals, chip loading hole and the external wiring terminal outside air-tight chamber being located inside air-tight chamber, and metal plate is welded in the bottom surface of substrate and encapsulating chip loading hole.Wherein, the light connector in multidiameter delay fibre ribbon one end passes through after tail pipe enters in ring frame, passes through solder sealing between tail pipe, multidiameter delay fibre ribbon.The present invention realizes effective encapsulation process to key components by air-tight chamber, and the mode of solder sealing tail pipe avoids the enlargement of product while ensuring optical signal reliable transmission, is conducive to meet the market demand.
Description
Technical field
The present invention relates to technical field of photo communication, it particularly relates to which a kind of Multi-path parallel optical component encapsulating structure changes
Into.
Background technique
With the popularization and deep application of optic communication, the demand of electrooptical device and day increase severely, and the market demand is also continuous
Develop towards required directions such as miniaturization, multichannel, high-air-tightness, high reliability, thereby producing will be in electrooptical device
Key components be sealed in the intracorporal market demand of shell.
For this purpose, optical signal pass through sealing shell mode there are mainly two types of: one, shell carry seal glass optical window, outside
The metal sleeve in portion is fixed by high-precision contraposition with case weld, and external fiber is inserted into metal sleeve can be the same as internal light
Signal is transmitted；Two, sealing ring is assembled on optical fiber, sealing ring passes through the tail pipe of shell, later by sealing ring on shell
Tail pipe be sealed.
Currently, two ways more adapts to the coaxial packaging scheme of simple optical fiber, it is (i.e. more for channel transmission optical module
Road parallel optical module), the shell of included glass optical window is limited to the difficult problem of the inside and outside optical path alignment of shell, cannot achieve light letter
Number effective transmission, and the assemble welding sealing ring on multidiameter delay fibre ribbon then needs significantly to expand the size of tail pipe,
It is unable to satisfy the miniature requirement of product.
Summary of the invention
The purpose of the present invention is to provide a kind of Multi-path parallel optical component encapsulating structures, in the premise for guaranteeing product miniaturization
Under, it realizes effective level Hermetic Package to key components in optical module, is conducive to a variety of by cooperating different peripheral circuits to be formed
Optical module.
In order to achieve the above objectives, the present invention is achieved by the following scheme:
A kind of Multi-path parallel optical component encapsulating structure, including top plate, middle casing, bottom plate.The middle casing includes ring
Shape frame, tail pipe: the ring frame is used to form air-tight chamber, the tail pipe and ring frame one with the top plate and bottom plate
It forms and is connected to the air-tight chamber.The bottom plate includes substrate, metal plate: the substrate, which is equipped with, is located at the air-tight chamber
Internal inscribed line terminals, chip loading hole and the external wiring terminal outside the air-tight chamber, the metal plate welding
In the substrate bottom surface and seal the chip loading hole.Wherein, the light connector in multidiameter delay fibre ribbon one end passes through institute
Tail pipe is stated into after in the ring frame, passes through solder sealing between the tail pipe, multidiameter delay fibre ribbon.
Further, the metal plate is equipped with the boss that inserting is adapted to the chip loading hole.
Further, the external wiring terminal is located at the top surface of the substrate.
Further, the top surface of the substrate is equipped with the endless metal belt with the bottom surface welding of the ring frame.
Further, the endless metal belt is in rectangle comprising in four welding surfaces of relative positional relationship.
Further, four welding surfaces be respectively the first welding surface, the second welding surface, third welding surface and with institute
State the 4th adjacent welding surface of the nozzle of tail pipe, first welding surface, the second welding surface are equipped on the outside of third welding surface
The external wiring terminal, the 4th welding surface extend to the end face of the substrate.
Further, the solder is brazing metal or glass solder.
Further, the chip loading hole has multiple, is reserved with and sets between the chip loading hole and the tail pipe
Fixed components and parts assembling area.
Based on above-mentioned Multi-path parallel optical component encapsulating structure, the present invention additionally provides a kind of multidiameter delay on the other hand
Optical assembly comprising multidiameter delay fibre ribbon and above-mentioned Multi-path parallel optical component encapsulating structure, the multidiameter delay optical fiber
The optical fiber of band is metallized optical fibre, for realizing the solder sealing between the tail pipe, multidiameter delay fibre ribbon.
Compared with prior art, the invention has the advantages and beneficial effects that:
Multi-path parallel optical component encapsulating structure of the present invention is met by the air-tight chamber that top plate, middle casing, bottom plate are formed
High-air-tightness, high reliability the market demand, it can be achieved that level Hermetic Package to key components in optical module, thus resistance to steam
And the ability of adverse circumstances is stronger.It is set in air-tight chamber the light connector of multidiameter delay fibre ribbon one end is passed through tail pipe
Afterwards, will be by way of solder (brazing metal, glass solder etc. can be selected according to tail pipe material) sealing tail pipe and multichannel simultaneously
The inside and outside optical signal transmission of air-tight chamber can be both effectively ensured, moreover it is possible to ensure air-tight cavity in gap sealing between row fibre ribbon
The high-air-tightness of room, high reliability so that package dimension is small, that is, ensure that product simultaneously as avoiding the use of sealing ring
The design requirement of miniaturization.In addition, the present invention is by being located at the inscribed line terminals inside air-tight chamber and being located at airtight on substrate
The external wiring terminal of exterior thereto then effectively realizes the inside and outside electric signal transmission of air-tight chamber.
After the detailed description of embodiment of the present invention is read in conjunction with the figure, the other features and advantages of the invention will become more
Add clear.
Detailed description of the invention
Fig. 1 is the decomposition diagram of one embodiment of the invention Multi-path parallel optical component encapsulating structure；
Fig. 2 is that middle casing in Fig. 1, bottom plate are equipped with the structural schematic diagram of multidiameter delay fibre ribbon；
Fig. 3 is the cross-sectional view in Fig. 2 at A-A；
Fig. 4 is the cross-sectional view in Fig. 2 at B-B；
Fig. 5 is the structural schematic diagram in the top surface direction of substrate in Fig. 1；
Fig. 6 is the structural schematic diagram in the bottom surface direction of substrate in Fig. 1；
Fig. 7 is the structural schematic diagram in the bottom surface direction of middle casing in Fig. 1；
Fig. 8 is the decomposition diagram of another embodiment of the present invention Multi-path parallel optical component encapsulating structure；
Fig. 9 is the structural schematic diagram in the bottom surface direction of substrate in Fig. 8.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described.
In the description of the present invention, it is to be understood that, term " first ", " second ", " third ", " the 4th " are only used for retouching
Purpose is stated, relative importance is not understood to indicate or imply, in addition, the orientation or position of the instructions such as term "top", "bottom"
Relationship is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description of the present invention and simplification of the description, without referring to
Show or imply that signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore cannot manage
Solution is limitation of the present invention.
It is unreasonable for key components sealing means in existing multidiameter delay transmission optical module, and lead to optical signal transmission
The problems such as effect is undesirable or product size is excessive, referring to figs. 1 to shown in Fig. 7, present embodiment illustrates a kind of multidiameter delays
Optical assembly encapsulating structure includes top plate 10, middle casing 20, bottom plate, wherein middle casing 20 includes ring frame 21, ring
Shape frame is used to form air-tight chamber with top plate 10, bottom plate, and the setting of air-tight chamber is for the chip in Multi-path parallel optical component
(attached drawing is not shown), the light connector 51 of 50 one end of multidiameter delay fibre ribbon and other key components carry out effectively hermetic seal
Dress, as shown in Figure 2.In order to reach reliably air-tightness, in the present invention, there are many optinal plans, for example, top plate 10 and ring frame
21 are integrally formed, and select bonding or welded seal to form air-tight chamber according to the material of ring frame 21, bottom plate；Or bottom plate with
Ring frame 21 is integrally formed, and selects bonding or welded seal to form air-tight chamber according to the material of ring frame 21, top plate 10, and
In the present embodiment, the installation in order to facilitate assembly crewman to component in air-tight chamber, especially using metal material (such as
The alloy of aluminium, copper, iron, nickel, cobalt etc. or several metals) top plate 10, bottom plate is made, and design top plate 10, ring frame 21, bottom plate three
Above-mentioned air-tight chamber is formed by welding between person.
In order to realize component and the communication outside air-tight chamber in air-tight chamber, bottom plate includes substrate 30, be can be used
Common PCB substrate can also specifically be used with high heat conductance, chemical stability is good, heat-resisting, pressure-resistant as substrate of the invention
Ceramic substrate, substrate 30 be equipped be located at air-tight chamber inside chip loading area, in order to realize the reliable transmission of electric signal,
The inscribed line terminals 31 of chip are additionally provided with inside air-tight chamber, connected in substrate 30 and outside air-tight chamber
External wiring terminal 32.Multi-path parallel optical component encapsulating structure of the present invention is after component effectively encapsulates in by air-tight chamber, then matches
With different peripheral circuits, the Multipath parallel optical module of different structure and function can be developed, in order to apply to reliable
Property require, in the higher environment of air-tightness requirement.
In order to realize the relieved package of the light connector 51 to 50 one end of multidiameter delay fibre ribbon, middle casing 20 further includes having
The tail pipe 22 of air-tight chamber is integrally formed and is connected to ring frame 21, and the light connector 51 in 50 one end of multidiameter delay fibre ribbon is worn
After crossing in the entrance ring frame of tail pipe 22, the gap between tail pipe 22, multidiameter delay fibre ribbon 50 is blocked by solder to be sealed, with true
High-air-tightness, the high reliability for protecting the air-tight chamber formed after top plate 10, ring frame 21, bottom plate three welding, such as Fig. 3, Fig. 4
It is shown, it can specifically be sealed according to the material of tail pipe using brazing metal or glass solder seals, specifically used in the present embodiment
The solder of lower melting-point scolding tin 60 as gap between sealing tail pipe 22 and multidiameter delay fibre ribbon 50, certainly, this scheme
The optical fiber of lower multidiameter delay fibre ribbon 50 need to have metal outer, this is no longer described in detail for the prior art.Because without in multidiameter delay light
The outside weldings sealing ring of fibre ribbons 50, therefore the present embodiment also reduces certain manufacturing procedure compared with prior art, reduces
Manufacturing cost, and also avoid that tail pipe 22 is oversized and the larger-size problem of bring encapsulating structure.And for the ease of
In air-tight cavity indoor location component required in addition to chip, the present embodiment is reserved between chip loading area and tail pipe 22 and sets
Fixed components and parts assembling area.
Notice in other embodiments of the invention using substrate 90 itself directly as bottom plate, to simplify substrate knot
Structure, chip loading area can be the reserved plane concordant with internal wiring terminal, and for the ease of connecing between inscribed line terminals
Line, chip loading area can also be in groove structure, as shown in Figure 8, Figure 9, since groove structure is not penetrated substrate, top plate 70, in
Between shell 80 with substrate 90 weld after can equally form air-tight chamber.
And since chip in the course of work is also easy to produce heat, when heat reaches the normal fortune that certain limit will will affect chip
Row, therefore, in order to improve the radiating efficiency of encapsulating structure, extend its service life, the present embodiment bottom plate further includes helping to lead
The metal plate 40 of heat, heat transmission, in order to reach preferable heat dissipation effect, it is above-mentioned that the present embodiment has opened up formation on substrate 30
The chip loading hole 33 of chip loading area, design metal plate 40 are welded in the bottom surface of substrate 30, and encapsulating chip loading hole simultaneously
33 to ensure the air-tightness of air-tight chamber.Obviously, it is welded between metal plate 40 and the bottom surface of substrate 30 to realize, in substrate 30
Bottom surface need to be equipped with corresponding metal solderable layer.When being equipped with chip in chip loading hole 33, chip is directly located at gold
Belong on plate 40, so as to then be dispersed into through metal plate 40 so that the heat that chip issues more effectively is transmitted on metal plate 40
In foreign medium.Due to generally requiring setting various chips in Multipath parallel optical module, for example, driving chip, light transceiving chip
Deng, therefore the present embodiment chip loading hole 33 has multiple, installs different chip to be adapted to, as shown in Figure 5, Figure 6.
For the ease of the patching operations between chip and inscribed line terminals 31, the present embodiment also on metal plate 40 be equipped with
Chip, to avoid chip from shifting, can be directly pasted onto convex by the boss 41 of the adaptation inserting of chip loading hole 33 in chip
On platform 41, the height of boss 41 is determined according to corresponding chip height, in order to which patching operations are advisable.
External wiring terminal can both be located at the end face of substrate in some embodiments of the invention, can also be located at substrate
Bottom surface, and external wiring terminal 32 is then specifically set to the top surface of substrate 30 in the present embodiment, being not only convenient for assembly crewman in this way will
It connect the reliable transmission to realize electric signal with peripheral circuit, also can avoid external wiring terminal 32 and interferes with or influence substrate
Welding between 30 and metal plate 40.
In order to ensure the welding between ring frame 21 and substrate 30 reaches reliably sealing effect, the present embodiment is in substrate 30
Top surface be equipped with endless metal belt with the bottom surface welding of ring frame 21.Endless metal belt is specifically in rectangle comprising is in phase
To four welding surfaces of positional relationship: the first welding surface 34, the second welding surface 35, third welding surface 36 and the 4th welding surface
37, as shown in figure 5, endless metal belt is not limited in rectangle in other embodiments of the invention, as long as being closed annular
, welding mask body can be process by techniques such as solder melting welding in the present embodiment.In order to reduce the size of ring frame 21,
The present embodiment ring frame 21 is specially rectangle frame compatible with endless metal belt, as shown in fig. 7, certainly, in its of the invention
Ring frame 21 can also be for circular frame or oval frame etc., as long as the surface area of its bottom surface is enough and endless metal belt in his embodiment
Form continuous welding surface.For four welding surfaces, the 4th welding surface 37 of setting is adjacent with the nozzle of tail pipe 22, in order to fill
Point ground using other three welding surfaces in addition to the 4th welding surface 37, the present embodiment the first welding surface 34, the second welding surface 35,
The outside of third welding surface 36 is equipped with external wiring terminal 32, since the outside of the 4th welding surface 37 is adjacent with tail pipe 22, in order to
Convenient for welding, the present embodiment designs the end face that the 4th welding surface 37 extends to substrate 30.
Based on above-mentioned Multi-path parallel optical component encapsulating structure, the present embodiment additionally provides a kind of multichannel simultaneously on the other hand
Row optical assembly, including Multi-path parallel optical component encapsulating structure provided by multidiameter delay fibre ribbon 50 and the present embodiment, in order to
It is realized in such a way that solder seals and blocks sealing between tail pipe 22, multidiameter delay fibre ribbon 50, in multidiameter delay fibre ribbon 50
It is metallized optical fibre that optical fiber, which is in the part in tail pipe, and tail pipe 22 and multidiameter delay light are sealed in a manner of it will pass through above-mentioned soldering
Gap between fibre ribbons 50.
The above described is only a preferred embodiment of the present invention, being not that the invention has other forms of limitations, appoint
What those skilled in the art changed or be modified as possibly also with the technology contents of the disclosure above equivalent variations etc.
Imitate embodiment.But without departing from the technical solutions of the present invention, according to the technical essence of the invention to above embodiments institute
Any simple modification, equivalent variations and the remodeling made, still fall within the protection scope of technical solution of the present invention.
Claims (8)
1. a kind of Multi-path parallel optical component encapsulating structure characterized by comprising
Top plate；
Middle casing, comprising:
Ring frame, for forming air-tight chamber with the top plate and bottom plate,
Tail pipe is integrally formed with the ring frame and is connected to the air-tight chamber；
The bottom plate, comprising:
Substrate is equipped with the inscribed line terminals being located inside the air-tight chamber, chip loading hole and is located at the air-tight chamber
External external wiring terminal, the external wiring terminal are located at the top surface of the substrate,
Metal plate, the metal plate are welded in the bottom surface of the substrate and seal the chip loading hole；
Wherein, multidiameter delay fibre ribbon one end light connector pass through the tail pipe enter the ring frame in after, multidiameter delay
It is metallized optical fibre that optical fiber, which is in the part in tail pipe, in fibre ribbon, passes through solder between the tail pipe, multidiameter delay fibre ribbon
Sealing.
2. Multi-path parallel optical component encapsulating structure according to claim 1, which is characterized in that the metal plate is equipped with and institute
State the boss of chip loading hole adaptation inserting.
3. Multi-path parallel optical component encapsulating structure according to any one of claim 1 to 2, which is characterized in that the base
The top surface of plate is equipped with the endless metal belt with the bottom surface welding of the ring frame.
4. Multi-path parallel optical component encapsulating structure according to claim 3, which is characterized in that the endless metal belt is in square
Shape comprising in four welding surfaces of relative positional relationship.
5. Multi-path parallel optical component encapsulating structure according to claim 4, which is characterized in that four welding surface difference
For the first welding surface, the second welding surface, third welding surface and fourth welding surface adjacent with the nozzle of the tail pipe,
First welding surface, the second welding surface are equipped with the external wiring terminal on the outside of third welding surface,
4th welding surface extends to the end face of the substrate.
6. Multi-path parallel optical component encapsulating structure according to any one of claim 1 to 2, which is characterized in that the weldering
Material is brazing metal or glass solder.
7. Multi-path parallel optical component encapsulating structure according to any one of claim 1 to 2, which is characterized in that the core
Piece loading hole have it is multiple, the components and parts assembling area of setting is reserved between the chip loading hole and the tail pipe.
8. a kind of Multi-path parallel optical component, including multidiameter delay fibre ribbon, which is characterized in that further include appointing in claim 1 to 7
Multi-path parallel optical component encapsulating structure described in one, the optical fiber of the multidiameter delay fibre ribbon is metallized optical fibre, for real
Solder sealing between the existing tail pipe, multidiameter delay fibre ribbon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710685656.5A CN107703589B (en) | 2017-08-11 | 2017-08-11 | A kind of Multi-path parallel optical component encapsulating structure and Multi-path parallel optical component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710685656.5A CN107703589B (en) | 2017-08-11 | 2017-08-11 | A kind of Multi-path parallel optical component encapsulating structure and Multi-path parallel optical component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107703589A CN107703589A (en) | 2018-02-16 |
| CN107703589B true CN107703589B (en) | 2019-08-16 |
Family
ID=61171015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710685656.5A Active CN107703589B (en) | 2017-08-11 | 2017-08-11 | A kind of Multi-path parallel optical component encapsulating structure and Multi-path parallel optical component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107703589B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108615773B (en) * | 2018-05-17 | 2020-07-14 | 北京航天时代光电科技有限公司 | Photoelectric detector packaging shell for surface mounting |
| CN109116553A (en) * | 2018-10-10 | 2019-01-01 | 昂纳信息技术（深圳）有限公司 | A kind of protective cover and protection structure |
| CN109491027A (en) * | 2019-01-08 | 2019-03-19 | 中航海信光电技术有限公司 | A kind of parallel optical module |
| JP7484230B2 (en) * | 2020-03-04 | 2024-05-16 | 富士通オプティカルコンポーネンツ株式会社 | Optical Modules |
| CN115077588B (en) * | 2022-07-23 | 2023-01-03 | 北京浦丹光电股份有限公司 | Sealing plug for optical fiber sensing, tube shell, integrated photoelectric device and assembling method |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5050953A (en) * | 1990-09-14 | 1991-09-24 | Northern Telecom Limited | Multi-path optical fiber and electro-optic transducer connector |
| CN201237656Y (en) * | 2008-08-13 | 2009-05-13 | 青岛海信宽带多媒体技术股份有限公司 | Multipath parallel optical module |
| CN203799069U (en) * | 2014-04-29 | 2014-08-27 | 福州高意通讯有限公司 | Packaging shell of multipath optical transmitting and receiving module |
| CN104503043B (en) * | 2014-12-31 | 2016-04-20 | 中航海信光电技术有限公司 | Multi-path parallel optical assembly |
| CN205941991U (en) * | 2016-08-31 | 2017-02-08 | 中航海信光电技术有限公司 | Parallel optical module |
-
2017
- 2017-08-11 CN CN201710685656.5A patent/CN107703589B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN107703589A (en) | 2018-02-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107703589B (en) | A kind of Multi-path parallel optical component encapsulating structure and Multi-path parallel optical component | |
| CN101983424B (en) | Semiconductor package and method for manufacturing the same | |
| KR100294968B1 (en) | Multilayer Solder Sealing Band for Semiconductor Substrate and Manufacturing Method Thereof | |
| CN103828076A (en) | Semiconductor device and fabrication method for same | |
| US9029968B2 (en) | Optical sensor device | |
| CN102473813A (en) | Light emitting device and method for manufacturing same | |
| CN105403963B (en) | A kind of air-tightness parallel transmission optical device | |
| CN102347319A (en) | Package-on-package structures with reduced bump bridging | |
| CN103003965B (en) | For semiconductor chip the bogey with the solder flux stop part of the compacted stream of anti-solder flux, there is the electronic device of bogey and there is the opto-electronic device of bogey | |
| CN113903720A (en) | Ceramic and metal integrated airtight package for high-speed optical module | |
| CN204314507U (en) | High speed butterfly encapsulation light-emitter assembly | |
| JP4807987B2 (en) | Hermetically sealed package and optical submodule | |
| CN100388513C (en) | Light emitting device, package structure thereof and manufacturing method thereof | |
| JP4818536B2 (en) | Mounting method of infrared data communication module | |
| CN210837715U (en) | Surface-mounted dual in-line ceramic shell and power device | |
| CN109461705B (en) | Ceramic package shell | |
| JPWO2012063704A1 (en) | LIGHT EMITTING DEVICE AND CIRCUIT BOARD MANUFACTURING METHOD | |
| CN219246707U (en) | All-inorganic LED packaging structure | |
| CN103346129B (en) | A kind of ceramic package shell and preparation method thereof, chip packaging method | |
| CN105304726B (en) | Photoelectric packaging structural body and manufacture method of flexible printed circuit board | |
| CN109509825A (en) | LED component and lamp group array | |
| KR101927426B1 (en) | Sealed package of Flexible Printed Circuit Board and Metal Case | |
| CN209133528U (en) | LED component and lamp group array | |
| CN206196140U (en) | Photoelectricity model substrate with multistage fusing point soldering tin | |
| CN221407345U (en) | Packaging structure and electronic device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 266100 Songling Road, Laoshan District, Qingdao, Shandong Province, No. 399 Patentee after: Qingdao Xinghang Photoelectric Technology Co.,Ltd. Address before: 266104 Beizhai sub district office, beizhaike community, Laoshan District, Qingdao City, Shandong Province Patentee before: HISENSE & JONHON OPTICAL-ELECTRICAL TECHNOLOGIES Co.,Ltd. |