CN218040201U - Surface emitting laser chip and optical device - Google Patents
Surface emitting laser chip and optical device Download PDFInfo
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- CN218040201U CN218040201U CN202220742811.9U CN202220742811U CN218040201U CN 218040201 U CN218040201 U CN 218040201U CN 202220742811 U CN202220742811 U CN 202220742811U CN 218040201 U CN218040201 U CN 218040201U
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Abstract
The utility model relates to a surface emitting laser chip and optical device, surface emitting laser chip includes base plate, a plurality of surface emitting laser, temperature measurement unit and tubular metal resonator cap, tubular metal resonator cap cover is established on surface emitting laser and temperature measurement unit and is connected with the base plate, the ground wire of base plate is inserted jointly to the connecting circuit of surface emitting laser and temperature measurement element's connecting circuit. The surface-emitting laser chip is characterized in that a plurality of surface-emitting lasers and temperature measuring units are attached to the same substrate to perform common heat dissipation, and are packaged by metal tube caps provided with glass, so that the temperature measuring units and the surface-emitting lasers can be located in the same sealed space at a short distance, the temperature consistency of the surface-emitting lasers and the temperature measuring units is ensured, and the temperature measuring precision of the surface-emitting lasers is improved; in addition, the surface emitting laser and the temperature measuring unit are grounded through the grounding circuit of the substrate, so that the grounding circuit of the surface emitting laser and the grounding circuit of the temperature measuring unit can be simplified, and the production cost is reduced.
Description
Technical Field
The utility model relates to a surface emitting laser chip temperature measurement technical field especially relates to a surface emitting laser chip and optical device.
Background
With the development of science and technology, the information transmission rate is higher and higher, and especially in the field of optical communication, the integration level of an optical device is higher and higher. For example, a common Vertical Cavity Surface Emitting Laser (VCSEL) has a higher and lower rate and a smaller size, has multiple specifications such as a single channel and a 4-channel array, has a higher and higher integration level, and has a stricter and stricter design requirement on heat dissipation, so that designers pay more attention to the actual temperature of the VCSEL.
Common methods for testing the temperature of the VCSEL include:
1. calculating a reference value through thermal simulation;
2. approximate reference by module housing temperature;
3. approximately referencing the temperature of the module driving chip;
4. the test VCSEL back surface temperature is approximately referenced.
However, in the above methods for testing the temperature of the VCSEL, the temperature measuring element measures the temperature of the component adjacent to the chip to obtain an approximate reference value, the temperature measuring element and the chip are not in the same space, and when the temperature of the chip is transmitted to the adjacent component, the temperature is partially lost, that is, the error range of the measurement of the chip by using the above method is large, and it is difficult to accurately detect the temperature of the VCSEL.
Accordingly, there is a need for improvements and developments in the art.
SUMMERY OF THE UTILITY MODEL
An object of the embodiment of the utility model is to provide a surface emitting laser chip and optical device to solve the technical problem that current surface emitting laser's temperature measurement precision is low.
The embodiment of the utility model provides a technical scheme as follows:
an embodiment of the utility model provides a surface emitting laser chip, include:
a substrate provided with a conductive layer forming a grounding circuit
The surface emitting lasers are attached to the substrate and electrically connected with the substrate;
the temperature measuring unit is attached to the substrate and electrically connected with the substrate;
the top of the metal pipe cap is provided with glass;
the plurality of surface emitting lasers and the temperature measuring units are sequentially arranged in rows, the metal pipe caps are arranged on the surface emitting lasers and the temperature measuring units and connected with the substrate, and the surface emitting lasers and the temperature measuring elements are grounded through the grounding circuit.
Further, in a preferable aspect of some embodiments, the surface emitting laser is provided in plurality, and the plurality of surface emitting lasers are arranged in a row; and along a plurality of surface emitting laser arrangement directions, the temperature measuring unit is arranged at one side of the plurality of surface emitting lasers.
Further, in a preferable scheme of some embodiments, a size of the temperature measuring unit is smaller than or equal to a size of the surface emitting laser.
Further, in a preferable scheme of some embodiments, the distance from the temperature measuring unit to the surface emitting laser is between 10um and 50 um.
Further, in a preferable mode of some embodiments, the size of the surface emitting laser is 220um × 200um × 220um, and the size of the temperature measuring unit is 200um × 200um × 220um.
Further, in a preferred scheme of some embodiments, a first pin and a second pin are arranged on the substrate, and the surface-emitting laser is fixedly connected with the substrate in a bonding manner and electrically connected with the first pin; the temperature measuring unit is fixedly connected with the substrate in a bonding mode and is electrically connected with the second pin.
Further, in a preferable scheme of some embodiments, the temperature measuring unit is a patch type thermistor.
Further, in a preferred version of some embodiments, the substrate is an aluminum nitride backplane.
The embodiment of the utility model provides an optical device is still provided, including PCB circuit board and above surface emitting laser chip, surface emitting laser chip is fixed to be set up on PCB circuit board and be connected with PCB circuit board electricity.
Further, in a preferred scheme of some embodiments, or the optical device includes a conductive adhesive layer and a glue dripping encapsulation layer, the surface reflection laser chip is fixedly connected to the PCB through the conductive adhesive layer, and the glue dripping encapsulation layer covers the surface emission laser chip and is fixedly connected to the PCB.
Compared with the prior art, the embodiment of the utility model provides a surface emitting laser chip and optical device mainly have following beneficial effect:
the surface-emitting laser chip is characterized in that a plurality of surface-emitting lasers and temperature measuring units are attached to the same substrate for common heat dissipation, and are packaged by metal tube caps provided with glass, so that the temperature measuring units and the surface-emitting lasers can be located in the same sealed space at a short distance, the temperature consistency of the surface-emitting lasers and the temperature measuring units is ensured, and the temperature measuring precision of the surface-emitting lasers is improved; in addition, the surface emitting laser and the temperature measuring unit are grounded through the grounding circuit of the substrate, so that the grounding circuit of the surface emitting laser and the grounding circuit of the temperature measuring unit can be simplified, and the production cost is reduced.
Drawings
In order to illustrate the solution of the present invention more clearly, the drawings needed for describing the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts. Wherein:
fig. 1 is a schematic structural diagram of a surface-emitting laser chip according to an embodiment of the present invention (a metal cap is omitted);
fig. 2 is a schematic structural diagram of an optical device according to an embodiment of the present invention.
The reference numbers in the drawings are as follows:
100. a surface-emitting laser chip; 200. a PCB circuit board;
1. a substrate; 2. a surface-emitting laser; 3. a temperature measuring unit; 4. a metal pipe cap;
41. a metal tube; 42. and (3) glass.
Detailed Description
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs; the terms used herein in the specification are for the purpose of describing particular embodiments only and are not intended to limit the present invention, for example, the terms "length," "width," "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or position based on the orientation or position shown in the drawings, for convenience of description only, and should not be construed as limiting the present disclosure.
The terms "including" and "having," and any variations thereof, in the description and claims of this invention and the description of the above figures are intended to cover non-exclusive inclusions; the terms "first," "second," and the like in the description and in the claims, or in the drawings, are used for distinguishing between different objects and not necessarily for describing a particular sequential or chronological order. The meaning of "plurality" is two or more unless specifically limited otherwise.
In the description and claims of the present invention and in the above description of the drawings, when an element is referred to as being "fixed" or "mounted" or "disposed" or "connected" to another element, it can be directly or indirectly located on the other element. For example, when an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element.
Furthermore, reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
An embodiment of the present invention provides a surface-emitting laser chip 100, please refer to fig. 1 and 2, including a substrate 1, at least one surface-emitting laser 2, a temperature measuring unit 3 and a metal tube cap 4, wherein the surface-emitting laser 2 is disposed on the substrate 1 and electrically connected to the substrate 1; the temperature measuring unit 3 is arranged on the substrate 1 and is electrically connected with the substrate 1; the metal pipe cap 4 covers the surface emitting laser 2 and the temperature measuring unit 3 and is connected with the substrate 1. The substrate is provided with a conductive layer which forms a grounding circuit, and the surface emitting laser 2 and the temperature measuring element 3 are grounded through the grounding circuit.
It should be noted that a conducting layer is arranged on the substrate 1 to form a connecting circuit, and the surface emitting laser 2 and the temperature measuring unit 3 are electrically connected with the conducting layer on the substrate 1; the temperature measuring unit 3 is connected with an external measuring circuit through a connecting circuit of the conducting layer. In this embodiment, the metal cap 4 includes a metal tube 41 and a glass 42, and the glass 42 is disposed on the top of the metal tube, so that light emitted by the surface-emitting laser 2 can be output normally, and normal use of the surface-emitting laser chip 100 is ensured.
In summary, compared with the prior art, in the surface-emitting laser chip 100, the plurality of surface-emitting lasers 2 and the temperature measuring units 3 are attached to the same substrate 1 and are packaged by the metal tube caps 4 provided with the glass 42, so that the plurality of temperature measuring units 3 and the plurality of surface-emitting lasers 2 can be located in the same sealed space, the temperature consistency between the surface-emitting lasers and the temperature measuring units is ensured, and the temperature measurement accuracy of the surface-emitting lasers is improved; in addition, the surface emitting laser 2 and the temperature measuring unit 3 are grounded through the grounding circuit of the substrate, so that the grounding circuit of the surface emitting laser and the grounding circuit of the temperature measuring unit can be simplified, and the production cost is reduced.
Further, referring to fig. 1 and 2, a plurality of surface-emitting lasers 2 are provided, and the plurality of surface-emitting lasers 2 and the temperature measuring unit 3 are sequentially arranged in a row. Through setting up a plurality of surface emitting laser 2, temperature cell 3 in rows in proper order, can make surface emitting laser chip 100's whole appearance comparatively regular, convenient storage, transportation and use can make things convenient for a plurality of surface emitting laser 2 and temperature cell 3 to walk the line simultaneously, reduce the complexity of connecting circuit on the base plate 1, improve the production efficiency of base plate 1.
In another embodiment, the temperature measuring unit 3 may be disposed on one side of the surface emitting laser 2 along a direction perpendicular to the arrangement direction of the plurality of surface emitting lasers 2, and may also implement the temperature measuring function.
Embodiment one of the surface emitting laser chip 100 of the present invention
In order to make those skilled in the art better understand the solution of the present invention, the technical solution of the first embodiment of the present invention will be clearly and completely described below with reference to fig. 1 and fig. 2.
Further, referring to fig. 1 and 2, the size of the temperature measuring unit 3 is smaller than or equal to the size of the surface emitting laser 2. In actual production, the substrate 1 is used for carrying and fixing the surface emitting laser 2 and the temperature measuring unit 3, and therefore, the size of the surface emitting laser chip 100 is generally determined by the size of the substrate 1; meanwhile, in order to ensure that the surface emitting laser chip 100 can be stored and carried conveniently, the whole appearance is regular square, when the size of the temperature measuring unit 3 is larger than that of the surface emitting laser 2, the area of the part bearing the temperature measuring unit 3 needs to be increased on the substrate 1, and meanwhile, the size of the part bearing the plurality of surface emitting lasers 2 on the substrate 1 needs to be adjusted, so that the area of the substrate 1 is too large. The size of the temperature measuring unit 3 is limited to be smaller than or equal to the size of the surface emitting laser 2, the area of the part bearing the temperature measuring unit 3 is increased on the substrate 1, the size area of the part bearing the plurality of surface emitting lasers 2 is not required to be increased, the size of the surface emitting laser chip 100 can be effectively limited, and the using effect is guaranteed.
Further, the distance from the temperature measuring unit 3 to the surface emitting laser 2 is between 10um and 50 um. In this embodiment, surface emitting laser 2 and temperature unit 3 are mainly fixed on base plate 1 through the mode of nation fixed, through injecing temperature unit 3 to surface emitting laser 2's distance is 10um to 50um, can make the structure of surface emitting laser chip compacter, and whole size is littleer, and the distance is more advanced, and measurement accuracy is higher, prevents simultaneously that surface emitting laser 2 and temperature unit 3 from influencing each other when nation fixed, guarantees the efficiency of processing.
In this embodiment, the size of the surface emitting laser 2 is 220um × 200um × 220um, and the size of the temperature measurement unit 3 is 200um × 200um × 220um. Wherein, the quantity of surface emitting laser 2 is 4, the minimum size of surface emitting laser chip can reach 1200um 220um 225um. In this embodiment, by limiting the sizes of the surface emitting laser 2 and the temperature measuring unit 3, it can be ensured that the size of the surface emitting laser chip can be minimized to ensure the use effect on the premise that the surface emitting laser chip has higher temperature measuring accuracy.
Further, a first pin (not shown in the figure) and a second pin (not shown in the figure) are arranged on the substrate 1, and the surface emitting laser 2 is fixedly connected with the substrate 1 in a bonding manner and is electrically connected with the first pin; the temperature measuring unit 3 is fixedly connected with the substrate 1 in a bonding mode and is electrically connected with the second pin. In this embodiment, surface emitting laser 2, temperature measuring unit 3 are fixed through the electrode welded on independent bonding line and the base plate 1 respectively to conducting layer through on the base plate 1 respectively with first pin and second pin electric connection, promptly surface emitting laser 2's control circuit is relative independent setting with temperature measuring unit 3's test circuit, can reduce the mutual interference of circuit between surface emitting laser 2, the temperature measuring unit 3, guarantees the normal realization of respective function. Wherein, connect first pin through external circuit, can realize the control to a plurality of surface emitting laser 2, connect temperature measurement unit 3 through measuring circuit, can carry out the measurement of surface emitting laser 2 temperature.
Further, referring to fig. 1 and 2, the temperature measuring unit 3 is a chip thermistor. The patch type thermistor has the advantages of small size, high measurement accuracy and the like. In this embodiment, the chip thermistor is a negative temperature coefficient thermistor (NTC). Specifically, the measuring circuit is a voltmeter, and the purpose of the measuring circuit is to calculate and measure the resistance value of the patch thermistor, and then obtain the temperature of the temperature measuring unit 3 according to the corresponding thermistor (NTC) temperature characteristic curve, so as to obtain the temperature of the surface-emitting laser 2 in the same environment. In other embodiments, a positive temperature coefficient thermistor may also be used for temperature measurement.
Further, the substrate 1 is an aluminum nitride base plate. Wherein, the advantages of using the aluminum nitride bottom part comprise: 1. the heat conductivity is high, which is beneficial to the heat dissipation of the surface emitting laser chip; 2. the expansion coefficient is small, and good combination with the surface emitting laser 2 can be realized; 3. the insulating property is good, the energy gap width is 6.2eV, the insulating treatment is not needed, and the process is simplified; 4. the material has higher hardness and strength and good mechanical property; 5. has better chemical stability and high temperature resistance.
In this embodiment, the specific production process of the surface-emitting laser chip 100 is as follows:
1) Substrate 1: sintering an aluminum nitride substrate at 600-650 ℃ in an oxidizing atmosphere, metallizing the aluminum nitride substrate with low-temperature silver paste, and filling the through holes communicated with an internal circuit and an external circuit with the paste;
2) Glass 42: selecting flat k9 glass with the wavelength of 400-1200 nm and the transmittance of 92.7%, cutting and processing the glass into wafers, printing low-temperature glass slurry on the periphery of the wafers, and drying the wafers for later use;
3) The metal pipe 41: punching a metal pipe cap with an optical window by using a kovar alloy thin plate for later use;
4) Glass-lined metal tube (metal tube cap 4): placing glass on the top of the metal tube, sealing by fusing a low-temperature glass solder hyg750, and sealing by fusing: a preheating zone rt-100 ℃ for 10min, an warming zone 100-350 ℃ for 10min, a sintering zone 350-580 ℃ for 15min, a cooling zone 580-350 ℃ for 15min, and a cooling zone 350-100 ℃ for 10min;
5) Carrying out nickel plating and gold plating on the aluminum nitride substrate and the metal tube cap for later use;
6) Packaging the surface emitting laser 2 and the temperature measuring unit 3: eutectic crystals of the surface emitting laser and the temperature measuring unit are fixed on the substrate 1, the surface emitting laser 2 and the temperature measuring unit 3 are connected to electrodes of electrode pads on the substrate 1 through a bonding process to complete packaging, the metal tube 42 with the glass 41 is placed and covered on the surface emitting laser 2 and the temperature measuring unit 3, and the metal tube with the glass is sealed and fixed on the substrate 1 through a soldering process to complete packaging.
Based on the above surface emitting laser chip 100, please refer to fig. 1 and fig. 2, an embodiment of the present invention further provides an optical device, wherein the optical device includes a PCB circuit board 200, such as the surface emitting laser chip 100 described above, and the surface emitting laser chip is fixedly disposed on the PCB circuit board and electrically connected to the PCB circuit board.
Compared with the prior art, the light device at least has the following beneficial effects: the optical device adopts the surface-emitting laser chip 100, wherein the surface-emitting laser chip 100 can lead the temperature measuring unit 3 and the surface-emitting laser 2 to be positioned in the same sealed space by arranging the surface-emitting laser 2 and the temperature measuring unit 3 on the same substrate 1 and packaging the same through the metal tube cap 4 provided with the glass 42, thereby effectively improving the measuring precision; in addition, the connecting circuit of the surface emitting laser 2 and the connecting circuit of the temperature measuring unit 3 are connected to the ground wire of the substrate 1, the surface emitting laser 2 and the temperature measuring unit 3 can perform heat dissipation together through the ground loop of the substrate, so that the temperature of the temperature measuring unit 3 is closer to the temperature of the surface emitting laser 2, and the temperature measuring precision of the surface emitting laser 2 is improved.
Further, the optical device further includes a conductive adhesive layer (not shown in the figure) and a glue dripping encapsulation layer (not shown in the figure), the surface reflection laser chip 100 is fixedly connected with the PCB circuit board through the conductive adhesive layer, and the glue dripping encapsulation layer covers the surface emission laser chip 100 and is fixedly connected with the PCB circuit board. Specifically, the conductive adhesive layer is a silver-containing epoxy resin adhesive, and the adhesive dropping packaging layer is an epoxy resin adhesive or a silane resin.
Of course, in another embodiment, the surface-emitting laser chip 100 may be directly fixed on the PCB circuit board 200 by bonding and electrically connected to the PCB circuit board 200.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (9)
1. A surface-emitting laser chip characterized by comprising:
a substrate provided with a conductive layer forming a grounding circuit
The surface emitting lasers are attached to the substrate and electrically connected with the substrate;
the temperature measuring unit is attached to the substrate and electrically connected with the substrate;
the top of the metal pipe cap is provided with glass;
the plurality of surface emitting lasers and the temperature measuring units are sequentially arranged in rows, the metal pipe caps are arranged on the surface emitting lasers and the temperature measuring units and connected with the substrate, and the surface emitting lasers and the temperature measuring elements are grounded through the grounding circuit.
2. The surface-emitting laser chip according to claim 1, wherein the size of the temperature measuring unit is equal to or smaller than the size of the surface-emitting laser.
3. The surface-emitting laser chip of claim 2, wherein the distance from the temperature measuring unit to the surface-emitting laser is between 10um and 50 um.
4. The surface-emitting laser chip of claim 3, wherein the surface-emitting laser has a size of 220um x 200um x 220um, and the temperature measuring unit has a size of 200um x 220um.
5. The surface-emitting laser chip according to any one of claims 1 to 4, wherein the substrate is provided with a first pin and a second pin, and the surface-emitting laser chip is fixedly connected with the substrate in a bonding manner and electrically connected with the first pin; the temperature measuring unit is fixedly connected with the substrate in a bonding mode and is electrically connected with the second pin.
6. The surface-emitting laser chip according to claim 5, wherein the temperature measuring unit is a chip thermistor.
7. The surface-emitting laser chip according to claim 6, wherein the substrate is an aluminum nitride backplane.
8. An optical device comprising a PCB circuit board and the surface-emitting laser chip according to any one of claims 1 to 7, wherein the surface-emitting laser chip is fixedly disposed on and electrically connected to the PCB circuit board.
9. The optical device according to claim 8, wherein the surface-emitting laser chip is fixed on the PCB by bonding;
or the optical device comprises a conductive adhesive layer and a glue dripping packaging layer, the surface-emitting laser chip is fixedly connected with the PCB through the conductive adhesive layer, and the glue dripping packaging layer covers the surface-emitting laser chip and is fixedly connected with the PCB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220742811.9U CN218040201U (en) | 2022-03-31 | 2022-03-31 | Surface emitting laser chip and optical device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220742811.9U CN218040201U (en) | 2022-03-31 | 2022-03-31 | Surface emitting laser chip and optical device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218040201U true CN218040201U (en) | 2022-12-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220742811.9U Active CN218040201U (en) | 2022-03-31 | 2022-03-31 | Surface emitting laser chip and optical device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218040201U (en) |
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2022
- 2022-03-31 CN CN202220742811.9U patent/CN218040201U/en active Active
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Address after: 518000 No. 35, Cuijing Road, Pingshan New District, Shenzhen, Guangdong Patentee after: Ona Technology (Shenzhen) Group Co.,Ltd. Address before: 518000 No. 35, Cuijing Road, Pingshan New District, Shenzhen, Guangdong Patentee before: O-NET COMMUNICATIONS (SHENZHEN) Ltd. |