CN213482513U

CN213482513U - 800G optical module mechanism

Info

Publication number: CN213482513U
Application number: CN202022622077.6U
Authority: CN
Inventors: 梁巍; 李量; 汪军; 杨建明; 王志勇; 陈奔; 朱宇
Original assignee: Hengtong Rockley Technology Co Ltd
Current assignee: Suzhou Zhuoyu Photon Technology Co ltd
Priority date: 2020-11-13
Filing date: 2020-11-13
Publication date: 2021-06-18
Anticipated expiration: 2030-11-13

Abstract

The utility model provides an 800G optical module mechanism, it has not only guaranteed the sufficient cloth board space of optical module components and parts and supporting circuit, has still guaranteed that the optical chip heat dissipation is good to packaging structure is simple and easy reliable, has very high volume production nature. It includes first shell, second shell, optical device, PCB, arrange PCB in the cavity after first shell, second shell combination are assembled, arrange on the PCB board the optical device, PCB's both ends are provided with light mouth, electric mouth respectively, the optical device specifically includes laser instrument, optical lens, optoisolator, fiber array, thermoelectric refrigerator, flexbile plate, metal heat sink, the output of light mouth is provided with a plurality of optic fibre, the output of optic fibre inserts fiber array, thermoelectric refrigerator, optoisolator, flexbile plate all are fixed in through the viscose structure the corresponding constant head tank of metal heat sink, the laser instrument paster dress in the corresponding surface arrangement of thermoelectric refrigerator.

Description

800G optical module mechanism

Technical Field

The utility model relates to a technical field of optical module structure specifically is an 800G optical module mechanism.

Background

At present, the optical communication industry enters a rapid development stage, and the optical module plays a central role in the optical communication industry, so that the continuous development of the optical module is inevitable. The current development of the optical module is mainly reflected in the rate, from 1.25G in sunday to later 10G, 25G and 100G, and then to the current 400G and 800G, the optical module is not developed rapidly from the low end to the high end.

As the speed of the optical module is higher and higher, the required optical chips not only need to increase the speed of the optical module itself, but also need to increase the number of the optical chips, and the current high-end 800G optical module needs an 8-channel laser to ensure the transmission speed. The 8-channel laser has to ensure good heat dissipation performance and high-speed transmission reliability, and the packaging technology is a difficult problem in the industry.

In order to simplify the design and meet the high-speed transmission performance, many optical modules are designed in a Chip On Board manner, as shown in fig. 1, that is, an optical Chip is directly attached to a PCB or indirectly attached to a tungsten-copper heat sink fixed with the PCB in advance, and then bonded with the PCB by gold wires, so as to achieve the purpose of high-speed transmission. However, the current 800G optical module has a complicated supporting circuit and many kinds and number of electronic components, and if the optical chip adopts the COB scheme, the supporting circuit and the component space are inevitably insufficient.

At present, an 800G optical module basically cannot adopt a COB packaging process, and a Box and flexible board packaging mechanism is partially adopted, but the flexible board is basically electrically connected with a PCB in a soldering tin mode. However, the 800G optical module has large transmission quantity, a large number of electrical interfaces, limited space of the optical module PCB, and the width dimension of the pad required by soldering tin cannot be less than 0.2mm, so if the PCB needs to meet the requirement of soldering tin, the welding yield is extremely low, and the welding quality cannot be guaranteed.

Disclosure of Invention

To the above problem, the utility model provides an 800G optical module mechanism, it has not only guaranteed the sufficient cloth board space of optical module components and parts and supporting circuit, has still guaranteed that the optical chip heat dissipation is good to packaging structure is simple and easy reliable, has very high volume production nature.

An 800G optical module mechanism is characterized in that: the optical device comprises a first shell, a second shell, an optical device and a PCB, wherein the PCB is arranged in a cavity formed by assembling and assembling the first shell and the second shell, the optical device is arranged on the PCB, an optical port and an electric port are respectively arranged at two ends of the PCB, the optical device specifically comprises a laser, an optical lens, an optical isolator, an optical fiber array, a thermoelectric refrigerator, a flexible plate and a metal heat sink, a plurality of optical fibers are arranged at the output end of the optical port, the output end of each optical fiber is connected into the optical fiber array, the thermoelectric refrigerator, the optical isolator and the flexible plate are all fixed on a corresponding positioning groove of the metal heat sink through a viscose structure, a laser patch is attached to a corresponding surface of the thermoelectric refrigerator and arranged, the corresponding output end of the laser is connected with a corresponding connector part of the flexible plate through gold wire bonding, the other end of the flexible plate exposed out of the metal heat sink is connected with a corresponding connecting contact of the, an optical lens and an optical isolator are arranged between the laser and the optical fiber array, and optical connection is achieved through a lens focusing mode.

It is further characterized in that:

the exposed surface of the metal heat sink, on which no optical device is mounted, is attached to the corresponding main heat dissipation surface of the first shell, and the other surface of the metal heat sink is attached to the corresponding surface of the PCB, so that reliable and sufficient heat dissipation is ensured;

the bonding pad of the laser is closely aligned with the corresponding bonding pad of the flexible board, the bonding pads are arranged on the same plane and aligned to form a bonding groove, and a gold wire is bonded with the corresponding bonding groove to form an integral structure;

the PCB is provided with a corresponding rectangular concave clamping groove corresponding to the connecting contact of the flexible board in an arrangement mode, the rectangular concave clamping groove is internally used for being connected with the other end of a corresponding gold wire in a bonding mode, one end of the gold wire is connected to the welding point position of a corresponding bonding pad of the flexible board in a bonding mode, and the rectangular concave clamping groove enables the flexible board and the PCB to be aligned in a bonding mode, guarantees the gold wire to be short enough and has superior high-speed transmission performance;

the metal heat sink is made of a metal material with high heat conductivity coefficient and low thermal expansion coefficient;

the flexible plate is fixed on the first surface of the metal heat sink in a structural adhesive mode, the thermoelectric refrigerator is fixed in the corresponding mounting groove of the metal heat sink through a patch and adhesive structure, and the surface of the thermoelectric refrigerator, which is attached to the metal heat sink, is coated with heat-conducting adhesive, so that good heat conduction between the heat dissipation surface of the thermoelectric refrigerator and the tungsten-copper heat sink is ensured.

After the utility model is adopted, the laser and the flexible board are integrated on the metal heat sink together, thereby ensuring the reliability of the surface mounting and routing process and improving the space of the PCB element and the circuit board arrangement; the other end of the flexible board is positioned with the PCB by adopting the notch, the occupied area of the PCB is small, and the flexible board is connected with the PCB in a gold wire bonding mode, so that the space required by welding is saved, the gold wire bonding reliability is higher, and the signal transmission quality is better; the packaging structure not only ensures the sufficient board distribution space of the optical module component and the matched circuit, but also ensures that the optical chip has good heat dissipation, is simple and reliable in packaging structure, and has high mass production.

Drawings

FIG. 1 is a schematic diagram of a conventional optical module chip assembly;

fig. 2 is an exploded view of the optical module mechanism according to the present invention;

FIG. 3 is a schematic diagram of a perspective view of an optical device according to the present invention

FIG. 4 is a schematic diagram of a partially enlarged structure of the flexible board and the PCB bonded by gold wires according to the present invention;

FIG. 5 is a schematic structural diagram of a PCB of the present invention corresponding to a positioning groove of a flexible board and a rectangular recessed slot;

the names corresponding to the sequence numbers in the figure are as follows:

the optical fiber module comprises a first shell 1, a second shell 2, an optical device 3, a PCB4, an optical port 5, an electrical port 6, a laser 7, an optical lens 8, an optical isolator 9, an optical fiber array 10, a thermoelectric refrigerator 11, a flexible board 12, a metal heat sink 13, an upper heat sink 131, a lower heat sink 132, an optical fiber 14, a bonding groove 15, a rectangular concave clamping groove 16, a main radiating surface 17, a first gold wire 18, a second gold wire 19 and a concave positioning groove 20.

Detailed Description

An 800G optical module mechanism, see fig. 2-5: the optical device comprises a first shell 1, a second shell 2, an optical device 3 and a PCB4, wherein the first shell 1 and the second shell 2 are assembled in a cavity in which the PCB4 is arranged, the optical device 3 is arranged on the PCB4, two ends of the PCB4 are respectively provided with an optical port 5 and an electrical port 6, the optical device 3 specifically comprises a laser 7, an optical lens 8, an optical isolator 9, an optical fiber array 10, a thermoelectric refrigerator 11, a flexible board 12 and a metal heat sink 13, the output end of the optical 5 port is provided with a plurality of optical fibers 14, the output end of each optical fiber 14 is connected into the corresponding optical fiber array 10, optical fiber array gold threads 10, the thermoelectric 11, the optical isolator 9 and the flexible board 12 are fixed on corresponding positioning grooves of the metal heat sink 13 through adhesive structures, the laser 7 is attached to corresponding surfaces of the thermoelectric refrigerator 11, the corresponding output end of the laser 7 is connected with a corresponding connector portion of the flexible board 12 through a first gold thread 18 in a bonding manner, and the other end of the metal heat sink 13 of the flexible board An optical lens 8 and an optical isolator 9 are arranged between the laser 7 and the optical fiber array 10, and optical connection is realized by a lens focusing mode.

The exposed surface of the metal heat sink 13 without the optical device is arranged by being attached to the corresponding main heat dissipation surface 17 of the first shell 1, and the other surface of the metal heat sink 13 is arranged by being attached to the corresponding surface of the PCB4, so that reliable and sufficient heat dissipation is ensured;

the bonding pad of the laser 7 is closely aligned with the corresponding bonding pad of the flexible board 12, the bonding pads are arranged on the same plane and aligned to form a bonding groove 15, and the first gold wire 14 is bonded and connected with the corresponding bonding groove 15 to form an integral structure;

a corresponding rectangular concave slot 16 is arranged at a position of the PCB4 corresponding to the connection contact of the flexible board 12, the rectangular concave slot 16 is used for bonding and connecting the other end of the corresponding second gold wire 19, one end of the second gold wire 19 is bonded and connected to a welding point position of the corresponding bonding pad of the flexible board 12, and the rectangular concave slot 16 enables the flexible board 12 and the PCB4 to be bonded and aligned, ensures that the second gold wire 19 is short enough and has superior high-speed transmission performance;

the end part of the PCB 12 corresponding to the flexible board is provided with an inner concave positioning groove 20, and the inner concave positioning groove 20 is used for accurately positioning the installation position of the flexible board 12;

the metal heat sink 13 is made of metal material with high heat conductivity coefficient and low thermal expansion coefficient, and comprises an upper heat sink 131 and a lower heat sink 132, wherein a cavity formed by the upper heat sink 131 and the lower heat sink 132 is positioned, attached and provided with the optical fiber array 10, the thermoelectric refrigerator 11, the optical isolator 9 and the flexible board 12;

the flexible plate 12 is fixed on the first surface of the metal heat sink in a structural adhesive manner;

the thermoelectric refrigerator 11 is fixed in the corresponding mounting groove of the metal heat sink 13 through a structure of a patch and an adhesive, and the surface of the thermoelectric refrigerator 11 attached to the metal heat sink 13 is coated with a heat-conducting adhesive, so that good heat conduction between the heat dissipation surface of the thermoelectric refrigerator 11 and the metal heat sink 13 is ensured.

In specific implementation, the first shell 1 is an upper shell, the second shell 2 is a lower shell, the upper shell is provided with a main radiating surface 17, and the metal heat sink 13 is specifically a tungsten-copper heat sink.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. An 800G optical module mechanism is characterized in that: the optical device comprises a first shell, a second shell, an optical device and a PCB, wherein the PCB is arranged in a cavity formed by assembling and assembling the first shell and the second shell, the optical device is arranged on the PCB, an optical port and an electric port are respectively arranged at two ends of the PCB, the optical device specifically comprises a laser, an optical lens, an optical isolator, an optical fiber array, a thermoelectric refrigerator, a flexible plate and a metal heat sink, a plurality of optical fibers are arranged at the output end of the optical port, the output end of each optical fiber is connected into the optical fiber array, the thermoelectric refrigerator, the optical isolator and the flexible plate are all fixed on a corresponding positioning groove of the metal heat sink through a viscose structure, a laser patch is attached to a corresponding surface of the thermoelectric refrigerator and arranged, the corresponding output end of the laser is connected with a corresponding connector part of the flexible plate through gold wire bonding, the other end of the flexible plate exposed out of the metal heat sink is connected with a corresponding connecting contact of the, an optical lens and an optical isolator are arranged between the laser and the optical fiber array, and optical connection is achieved through a lens focusing mode.

2. An 800G optical module mechanism as claimed in claim 1, wherein: the exposed surface of the metal heat sink, on which no optical device is mounted, is attached to the corresponding main heat dissipation surface of the first shell, and the other surface of the metal heat sink is attached to the corresponding surface of the PCB.

3. An 800G optical module mechanism as claimed in claim 2, wherein: the bonding pad of the laser and the corresponding bonding pad of the flexible board are closely aligned, are arranged on the same plane and are aligned to form a bonding groove, and the gold wire is bonded and connected with the corresponding bonding groove to form an integral structure.

4. An 800G optical module mechanism as claimed in claim 1, wherein: the PCB is provided with corresponding rectangular concave clamping grooves corresponding to the positions of the connecting contacts of the flexible board in an arrangement mode, the rectangular concave clamping grooves are used for being connected with the other ends of the corresponding gold threads in a bonding mode, and one ends of the gold threads are connected with the welding spot positions of the corresponding bonding pads of the flexible board in a bonding mode.

5. An 800G optical module mechanism as claimed in claim 1, wherein: the metal heat sink is made of a metal material with high heat conductivity coefficient and low thermal expansion coefficient.

6. An 800G optical module mechanism as claimed in claim 1, wherein: the flexible plate is fixed on the first surface of the metal heat sink in a structural adhesive mode, the thermoelectric refrigerator is fixed in the corresponding mounting groove of the metal heat sink through a patch and adhesive structure, and the surface of the thermoelectric refrigerator, which is attached to the metal heat sink, is coated with heat-conducting adhesive.