CN213517669U - Optical module structure - Google Patents
Optical module structure Download PDFInfo
- Publication number
- CN213517669U CN213517669U CN202022625220.7U CN202022625220U CN213517669U CN 213517669 U CN213517669 U CN 213517669U CN 202022625220 U CN202022625220 U CN 202022625220U CN 213517669 U CN213517669 U CN 213517669U
- Authority
- CN
- China
- Prior art keywords
- gold
- optical
- pcb
- ceramic substrate
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides an optical module structure, it makes optical module components and parts and supporting circuit have sufficient cloth board space, and it is good that the colleague has guaranteed that the optical chip heat dissipation to packaging structure is simple and easy reliable. First shell, arrange PCB in the cavity after the second shell combination is assembled, the last optical device that has arranged of PCB board, electric chip, PCB's both ends are provided with the light mouth respectively, electric mouth, optical device specifically includes the laser instrument, optical lens, optical isolator, optical fiber array, thermoelectric refrigerator, ceramic substrate, the metal is heat sink, the output of light mouth is provided with a plurality of optic fibres, optical fiber array is inserted to the output of optic fibre, optical fiber array, thermoelectric refrigerator, optical isolator, ceramic substrate all is fixed in the corresponding position on the metal is heat sink through the viscose structure, the corresponding surface that the laser paster adorned in thermoelectric refrigerator arranges, the corresponding connector portion of ceramic substrate is connected through the gold thread bonding to the corresponding output of laser instrument.
Description
Technical Field
The utility model relates to a technical field of optical module structure specifically is an optical module structure.
Background
The optical module speed is higher and higher, the required optical chips not only need to increase the speed per se, but also need to increase the number of the optical chips, and the current relatively high-end 800G optical module needs an 8-channel laser to ensure the transmission speed. The 8-channel laser has to ensure good heat dissipation performance and high-speed transmission reliability, and the packaging technology is a difficult problem in the industry.
The existing optical module is designed in a Chip On Board mode, an optical Chip is directly attached to a PCB or indirectly attached to a tungsten copper heat sink fixed with the PCB in advance, and then the optical Chip is bonded with the PCB through gold wires, so that the purpose of high-speed transmission is achieved. However, the current 800G optical module has a complicated supporting circuit and many kinds and number of electronic components, and if the optical chip adopts the COB scheme, the supporting circuit and the component space are inevitably insufficient.
The 800G optical module is large in transmission quantity, large in electrical interface quantity, limited in PCB space of the optical module, and the width dimension of a welding pad required by soldering tin cannot be lower than 0.2mm, so that if the PCB needs to meet the soldering tin requirement, the welding yield is extremely low, the welding quality cannot be guaranteed, and therefore an optical module structure suitable for 800G is urgently needed.
Disclosure of Invention
To the above problem, the utility model provides an optical module structure, it makes optical module components and parts and supporting circuit have sufficient cloth board space, and the colleague has guaranteed that the optical chip heat dissipation is good to packaging structure is simple and easy reliable.
An optical module structure, characterized in that: it includes first shell, second shell, optical device, PCB, arrange PCB in the cavity after first shell, second shell combination are assembled, arrange on the PCB board optical device, electric chip, PCB's both ends are provided with light mouth, electric mouth respectively, optical device specifically includes laser instrument, optical lens, optoisolator, fiber array, thermoelectric refrigerator, ceramic substrate, metal heat sink, the output of light mouth is provided with a plurality of optic fibre, the output of optic fibre inserts fiber array, thermoelectric refrigerator, optoisolator, ceramic substrate all are fixed in through the viscose structure the corresponding position of metal heat sink, the laser instrument paster adorn in thermoelectric refrigerator's corresponding surface is arranged, the corresponding output of laser instrument passes through gold thread bonding connection the corresponding connector portion of ceramic substrate, ceramic substrate expose in the orientation of the other end of metal heat sink the first gilt gold plating of terminal surface arrangement of PCB has The laser comprises a copper disk array, wherein a second gold-plated copper disk array is arranged at a position, corresponding to the first gold-plated copper disk array, of the PCB, the gold-plated positions of the first gold-plated copper disk array and the second gold-plated copper disk array are overlapped, covered and contacted, and then the ceramic substrate is fixedly pressed on the corresponding surface of the PCB to be arranged, an optical lens and an optical isolator are arranged between the laser and the optical fiber array, and the optical lens enables divergent light emitted by the laser to pass through the optical isolator to be focused in the optical fiber array, so that optical signal transmission is achieved.
It is further characterized in that:
the exposed surface of the metal heat sink, on which no optical device is mounted, is attached to the corresponding main heat dissipation surface of the first shell, and the other surface of the metal heat sink is attached to the corresponding surface of the PCB, so that reliable and sufficient heat dissipation is ensured;
the laser bonding pad is closely aligned with the corresponding bonding pad of the ceramic substrate, so that the length of a gold wire is ensured to be as short as possible, and the high-speed signal transmission performance is ensured;
the PCB is provided with corresponding nuts, the nuts are fixed on the PCB in an SMT mode, the ceramic substrate of the packaged optical device is arranged at the positions of the nuts in an aligned mode, the ceramic substrate is pressed by the bolts and fixedly arranged on the nuts on the PCB, guide grooves are formed in the two sides of the ceramic substrate in an inward concave mode, the whole fixed connection only occupies a small part of the space on the surface of the PCB, the PCB does not need to be dug through to influence wiring, and the board distribution space is greatly saved;
the gold plating position of the first gold-plated copper disk array is provided with a solder ball array, and the gold plating positions of the solder ball array and the second gold-plated copper disk array are welded and connected in a reflow soldering mode to realize electric signal connection;
an elastic sheet connector is arranged between the first gold-plated copper disk array and the second gold-plated copper disk array and is used for ensuring full contact with a gold-plated position between the first gold-plated copper disk array and the second gold-plated copper disk array and ensuring stable and reliable connection;
the main radiating surface of the thermoelectric refrigerator facing the first shell is arranged, so that good radiating performance is ensured;
the metal heat sink is made of a metal material with high heat conductivity coefficient and low thermal expansion coefficient, in particular a tungsten copper material;
the ceramic substrate is fixed on the first surface of the metal heat sink through a glue structure, the thermoelectric refrigerator is fixed in a corresponding mounting groove of the metal heat sink through a patch and adhesive structure, and the surface of the thermoelectric refrigerator, which is attached to the metal heat sink, is coated with heat-conducting glue, so that good heat conduction between the heat dissipation surface of the thermoelectric refrigerator and the tungsten-copper heat sink is ensured.
After the utility model is adopted, the laser and the ceramic substrate are integrated on the metal heat sink together, thereby ensuring the reliability of the surface mounting and routing processes and improving the space of the PCB element and the circuit board arrangement; the other end of the ceramic substrate is in direct or indirect contact connection with the PCB by adopting the gold-plating position of the gold-plating copper disc, and the ceramic substrate is fixedly connected with the PCB, so that the occupied area of the PCB is small, the space required by welding is saved, the connection reliability of the connector is higher, and the signal transmission quality is better; in conclusion, the optical module component and the matched circuit have enough board distribution space, the optical chip is ensured to have good heat dissipation, and the packaging structure is simple and reliable.
Drawings
Fig. 1 is an exploded view of the optical module mechanism of the present invention;
FIG. 2 is a schematic diagram of a perspective view of an optical device according to the present invention
FIG. 3 is an exploded view of the specific connection of the ceramic substrate and the PCB according to the present invention;
the names corresponding to the sequence numbers in the figure are as follows:
the optical device comprises a first shell 1, a second shell 2, an optical device 3, a PCB4, an electric chip 5, an optical port 6, an electric port 7, a laser 8, an optical lens 9, an optical isolator 10, an optical fiber array 11, a thermoelectric refrigerator 12, a ceramic substrate 13, a metal heat sink 14, an optical fiber 15, a gold wire 16, a first gold-plated copper disk array 17, a second gold-plated copper disk array 18, a main radiating surface 19, a nut 20, a bolt 21, a guide groove 22 and a spring sheet connector 23.
Detailed Description
A light module structure, see fig. 1-3: the optical device comprises a first shell 1, a second shell 2, an optical device 3 and a PCB4, wherein a PCB4 is arranged in a cavity formed by combining and assembling the first shell 1 and the second shell 2, the optical device 3 and an electric chip 5 are arranged on a PCB4, an optical port 6 and an electric port 7 are respectively arranged at two ends of the PCB4, the optical device 3 specifically comprises a laser 8, an optical lens 9, an optical isolator 10, an optical fiber array 11, a thermoelectric refrigerator 12, a ceramic substrate 13 and a metal heat sink 14, a plurality of optical fibers 15 are arranged at the output end of the optical port 6, the output end of each optical fiber 15 is connected into the optical fiber array 11, the thermoelectric refrigerator 12, the optical isolator 10 and the ceramic substrate 13 are fixed at corresponding positions of the metal heat sink 14 through viscose structures, patches of the laser 8 are attached to corresponding surfaces of the thermoelectric refrigerator 12, corresponding output ends of the thermoelectric laser 8 are connected with corresponding joint parts of the ceramic, a first gold-plated copper disk array 17 is arranged on the end face, facing the PCB4, of the other end of the ceramic substrate 13 exposed out of the metal heat sink 14, a second gold-plated copper disk array 18 is arranged on the end face, facing the PCB4, of the ceramic substrate 13, a second gold-plated copper disk array 18 is arranged on the PCB4 corresponding to the first gold-plated copper disk array 17, after the gold-plated positions of the first gold-plated copper disk array 17 and the second gold-plated copper disk array 18 are overlapped and covered, the ceramic substrate 13 is fixedly pressed on the corresponding surface of the PCB4 to be arranged, an optical lens 9 and an optical isolator 10 are arranged between the laser 8 and the optical fiber array 11, and divergent light emitted by the laser 8 is focused in the optical fiber array 11.
The exposed surface of the metal heat sink 14, on which no optical device is mounted, is attached to the corresponding main heat dissipation surface 19 of the first shell 1, and the other surface of the metal heat sink 14 is attached to the corresponding surface of the PCB4, so that reliable and sufficient heat dissipation is ensured;
the bonding pads of the laser 8 are closely aligned with the corresponding bonding pads of the ceramic substrate 13 to ensure that the length of the gold wires 16 is as short as possible and ensure high-speed signal transmission performance.
Fig. 3 shows a first embodiment: the corresponding nut 20 is arranged on the PCB4, the nut 20 is fixed on the PCB4 in an SMT mode, the ceramic substrate 13 of the packaged optical device 3 is arranged at the position of the nut 20 in a contraposition mode, the bolt 21 presses and attaches the ceramic substrate 13 and fixedly installs the ceramic substrate 13 on the nut 20 on the PCB4, guide grooves 22 are formed in two sides of the ceramic substrate 13 in an inwards concave mode, the whole fixed connection only occupies a small part of the surface space of the PCB4 through the guide grooves, wiring is not affected due to the fact that the PCB4 is not required to be dug through, and the space for arranging boards is greatly saved;
an elastic sheet connector 23 is arranged between the first gold-plated copper disk array 17 and the second gold-plated copper disk array 18, and the elastic sheet connector 23 is used for ensuring full contact with a gold-plated position between the upper part and the lower part, so that stable and reliable connection is ensured.
The second embodiment is as follows: the gold plating position of the first gold-plated copper disk array 17 is implanted with a solder ball array, and the solder ball array and the second gold-plated copper disk array 18 are soldered in a reflow soldering manner to realize electrical signal connection.
In the specific implementation process, the main radiating surface of the thermoelectric refrigerator 12 facing the first shell 2 is arranged to ensure good radiating performance; the metal heat sink 14 is made of a metal material with a high thermal conductivity coefficient and a low thermal expansion coefficient, specifically a tungsten-copper material; the ceramic substrate 13 is fixed on the first surface of the metal heat sink 14 through a glue structure, the thermoelectric refrigerator 12 is fixed in the corresponding mounting groove of the metal heat sink 14 through a patch and adhesive structure, and the surface of the thermoelectric refrigerator 12 attached to the metal heat sink 14 is coated with heat-conducting glue, so that good heat conduction between the heat dissipation surface of the thermoelectric refrigerator and the tungsten-copper heat sink is ensured.
The working principle is as follows: the laser and the ceramic substrate are integrated on the metal heat sink together, so that the reliability of the surface mounting and routing process is ensured, and the space of a PCB element and a circuit board is increased; the other end of the ceramic substrate is in direct or indirect contact connection with the PCB by adopting the gold-plating position of the gold-plating copper disc, and the ceramic substrate is fixedly connected with the PCB, so that the occupied area of the PCB is small, the space required by welding is saved, the connection reliability of the connector is higher, and the signal transmission quality is better; in conclusion, the optical module component and the matched circuit have enough board distribution space, the optical chip is ensured to have good heat dissipation, and the packaging structure is simple and reliable.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (9)
1. An optical module structure, characterized in that: it includes first shell, second shell, optical device, PCB, arrange PCB in the cavity after first shell, second shell combination are assembled, arrange on the PCB board optical device, electric chip, PCB's both ends are provided with light mouth, electric mouth respectively, optical device specifically includes laser instrument, optical lens, optoisolator, fiber array, thermoelectric refrigerator, ceramic substrate, metal heat sink, the output of light mouth is provided with a plurality of optic fibre, the output of optic fibre inserts fiber array, thermoelectric refrigerator, optoisolator, ceramic substrate all are fixed in through the viscose structure the corresponding position of metal heat sink, the laser instrument paster adorn in thermoelectric refrigerator's corresponding surface is arranged, the corresponding output of laser instrument passes through gold thread bonding connection the corresponding connector portion of ceramic substrate, ceramic substrate expose in the orientation of the other end of metal heat sink the first gilt gold plating of terminal surface arrangement of PCB has The laser comprises a copper disk array, wherein a second gold-plated copper disk array is arranged at a position, corresponding to the first gold-plated copper disk array, of the PCB, the gold-plated positions of the first gold-plated copper disk array and the second gold-plated copper disk array are overlapped, covered and contacted, and then the ceramic substrate is fixedly pressed on the corresponding surface of the PCB to be arranged, an optical lens and an optical isolator are arranged between the laser and the optical fiber array, and the optical lens enables divergent light emitted by the laser to pass through the optical isolator to be focused in the optical fiber array, so that optical signal transmission is achieved.
2. A light module arrangement as claimed in claim 1, characterized in that: the exposed surface of the metal heat sink, on which no optical device is mounted, is attached to the corresponding main heat dissipation surface of the first shell, and the other surface of the metal heat sink is attached to the corresponding surface of the PCB.
3. A light module arrangement as claimed in claim 2, characterized in that: the laser bonding pads are in proximate alignment with corresponding bonding pads of the ceramic substrate.
4. A light module arrangement as claimed in claim 1, characterized in that: the PCB is provided with corresponding nuts, the nuts are fixed on the PCB in an SMT mode, the ceramic substrate of the packaged optical device is arranged at the positions of the nuts in an aligning mode, the ceramic substrate is pressed by the bolts and fixedly arranged on the nuts on the PCB, and two sides of the ceramic substrate are recessed inwards to form guide grooves.
5. A light module arrangement as claimed in claim 1, characterized in that: and the gold plating position of the first gold-plated copper disk array is provided with a solder ball array, and the solder ball array is connected with the gold plating position of the second gold-plated copper disk array in a soldering manner in a reflow soldering manner.
6. A light module arrangement as claimed in claim 1, characterized in that: and an elastic sheet connector is arranged between the first gold-plated copper disk array and the second gold-plated copper disk array and is used for ensuring full contact with a gold-plated position between the first gold-plated copper disk array and the second gold-plated copper disk array.
7. A light module arrangement as claimed in claim 1, characterized in that: the main heat dissipation surface of the thermoelectric refrigerator is arranged facing the first shell.
8. A light module arrangement as claimed in claim 1, characterized in that: the metal heat sink is made of a metal material with high heat conductivity coefficient and low thermal expansion coefficient, in particular a tungsten copper material.
9. A light module arrangement as claimed in claim 1, characterized in that: the ceramic substrate is fixed on the first surface of the metal heat sink through a glue structure, the thermoelectric refrigerator is fixed in a corresponding mounting groove of the metal heat sink through a patch and adhesive structure, and the surface of the thermoelectric refrigerator, which is attached to the metal heat sink, is coated with heat-conducting glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022625220.7U CN213517669U (en) | 2020-11-13 | 2020-11-13 | Optical module structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022625220.7U CN213517669U (en) | 2020-11-13 | 2020-11-13 | Optical module structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213517669U true CN213517669U (en) | 2021-06-22 |
Family
ID=76424030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022625220.7U Active CN213517669U (en) | 2020-11-13 | 2020-11-13 | Optical module structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213517669U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112198598A (en) * | 2020-11-13 | 2021-01-08 | 亨通洛克利科技有限公司 | Optical module structure |
-
2020
- 2020-11-13 CN CN202022625220.7U patent/CN213517669U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112198598A (en) * | 2020-11-13 | 2021-01-08 | 亨通洛克利科技有限公司 | Optical module structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112198598A (en) | Optical module structure | |
| US6425695B1 (en) | Optical module and method of manufacturing the same | |
| US6958907B2 (en) | Optical data link | |
| US6974263B2 (en) | Optical data link | |
| JP4015440B2 (en) | Optical communication module | |
| US20050156151A1 (en) | Light-receiving assembly | |
| CN112180523A (en) | 800G optical module mechanism | |
| CN216083183U (en) | 800G optical module | |
| CN213517669U (en) | Optical module structure | |
| US5027995A (en) | Process for bonding semiconductor chips to substrates | |
| CN213482513U (en) | 800G optical module mechanism | |
| US7181099B2 (en) | Fiber optic module packaging architecture for integrated circuit and optical subassembly integration | |
| US7061025B2 (en) | Optoelectronic device packaging assemblies and methods of making the same | |
| CN116577885A (en) | Optical module packaging structure | |
| CN111580227A (en) | Optical module | |
| JPH07230022A (en) | Optical parallel link and its mount structure | |
| JPWO2019097790A1 (en) | Semiconductor module and its manufacturing method | |
| JP3371954B2 (en) | Optical / Electric hybrid module | |
| CN111416269B (en) | Light emitting device | |
| JP2008224941A (en) | Optical module | |
| JP4798863B2 (en) | Opto-electric wiring board | |
| JP5195476B2 (en) | Optical transmission module | |
| JP7531666B2 (en) | Optical module and manufacturing method thereof | |
| CN214540146U (en) | 800G optical module | |
| JP2011221386A (en) | Optical transmission module and optical communication apparatus using the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: No. 168 Jiaotong North Road, Wujiang Economic and Technological Development Zone, Suzhou City, Jiangsu Province Patentee after: Suzhou Zhuoyu Photon Technology Co.,Ltd. Address before: 215200 Hengdao 88, Wujiang Economic and Technological Development Zone, Suzhou City, Jiangsu Province Patentee before: HENGTONG ROCKLEY TECHNOLOGY Co.,Ltd. |