JPH07230022A - Optical parallel link and its mount structure - Google Patents

Abstract

PURPOSE:To accelerate the downsizing of an electronic device, improve operation for maintenance and replacement, and facilitate operation for adjusting circuit characteristics as to the optical parallel link which transmits plural light signals in parallel and the structure for mounting the optical parallel link on a mother board. CONSTITUTION:This optical parallel link is equipped with an optical array module 10 constituted by hermetically putting an optical array unit and a module substrate in a package 16, an electronic circuit mount board 30 constituted by mounting an adjusment-unnecessary component 32 and an adjusted component 33, arraying and forming a pad 37 connected to a pad for external connection on the mount surface of one side edge, and arraying a lead 35 connected to the mother board 9 at the other side edge, and a heat radiation base 20 which has heat radiation fins 22 arrayed on the top surface of a base plate 21; and the optical array module 10 and electronic circuit mount substrate 30 are mounted in contact with the rear surface of the base plate 21 of the heat radiation base 20.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical parallel link for transmitting a plurality of optical signals in parallel and a structure for mounting the optical parallel link on a motherboard.

Optical fibers are used as interfaces between computer devices, networks between communication systems, and interfaces in broadband ISD devices. In recent years, parallelization of optical signals has been demanded as the transmission capacity between these devices increases.

[0003]

2. Description of the Related Art FIG. 10 is a diagram showing a conventional optical link, FIG.
1 is a sectional view of a conventional optical module.

In the figure, 2 is a photoelectric conversion element such as a semiconductor laser or a light receiving element, and 1 is a photoelectric conversion element 2.
It is an optical fiber that is optically coupled with. Reference numeral 3 is an optical module incorporated so that the photoelectric conversion element 2 and the optical fiber 1 are optically coupled.

Reference numeral 5 denotes a drive circuit (when the opto-electric conversion element 2 is a semiconductor laser) or an amplifier circuit (when the opto-electric conversion element 2 is a light receiving element) on which desired parts are mounted, and those circuits. Is a circuit board on which adjustment-free parts such as an LSI, a coil, and a capacitor attached to the device are mounted, and further, adjustment parts for adjusting circuit characteristics such as a variable resistor are mounted.

Reference numeral 4 is a shallow box-shaped case made of a metal material with an open upper part, in which the optical module 3 is mounted on its side wall, and the circuit board 5 is horizontally accommodated and held therein. 7 is
Radiating fins 7B are formed near the left and right edges of the surface of the base plate 7A.
Is a heat dissipation base arranged.

Incidentally, the base plate 7A is provided with three elongated holes 7C in a substantially U shape corresponding to the arrangement of the terminals 6 which will be described later, at a position avoiding the heat radiation fins 7B. The conventional optical link is composed of the above-mentioned optical module 3, the circuit board 5 housed in the case 4, and the heat dissipation base 7.

Reference numeral 9 is a mother board on which an optical link is mounted. The optical module 3 will be described in detail. As shown in FIG. 11, the optical module 3 is assembled so that the opto-electric conversion element assembly 3A, the lens assembly 3B, and the optical fiber assembly 3C are optically coupled, and integrally fixed. There is.

The photoelectric conversion element assembly 3A is made of Fe-Ni-
On the outer peripheral portion of the substantially disk-shaped stem 2a made of a metal material such as Co alloy, a stem member provided with a substantially rectangular plate-shaped flange portion is provided, and the carrier is fixed to the end surface of the stem 2a, and on this carrier. The photoelectric conversion element 2 is mounted by soldering.

The lens assembly 3B is composed of a bottomed cylindrical lens holder and a lens inserted into an axial center hole of the bottom end surface of the lens holder. Fiber Optic Assembly 3C
Is the optical fiber 1 in the small hole at the axis of the cylindrical ferrule.
Is inserted and the outer periphery of the optical fiber 1 is fixed to the inner wall of the pore with an adhesive.

The optical fiber assembly 3C protects the lead-out portion of the optical fiber 1 by covering a rubber bush 3d on the side opposite to the flange of the ferrule holder. The optical module 3 described above is integrated by fixing the lens assembly 3B to the photoelectric conversion element assembly 3A and then fixing the optical fiber assembly 3C to the lens assembly 3B.

A terminal 6 penetrating the vicinity (insulating penetration) is provided at the selected three side edges of the bottom plate of the case 4, and its upper end is connected to the pad of the circuit board 5 via a wire. On the other hand, in the optical module 3, the flange portion is brought into contact with the outer surface of the side wall of the case 4, and is fixed to the case 4 with a screw.

Each lead of the optical module 3 is soldered and connected to a corresponding pad provided on the surface of the circuit board 5. The case 4 has the opening closed with a lid after the optical module 3 and the circuit board 5 are assembled.

As described above, in the case 4 in which the optical module 3 and the circuit board 5 are incorporated, the terminal 6 is loosely inserted into the elongated hole 7C, and the bottom plate is placed on the central portion of the base plate 7A of the heat dissipation base 7. Then
It is fixed with a conductive adhesive or the like, and further fixed with screws.

Then, the optical links are mounted on the motherboard 9 by inserting and soldering the lower ends of the terminals 6 protruding from the lower surface of the base plate 7A of the heat dissipation base 7 into the corresponding through holes of the motherboard 9. .

Since the amplifier circuit amplifies a minute signal and connects it to an external terminal, as described above, by sealing the case 4 with a lid made of a metal plate, noise is prevented. I have to.

[0017]

Since the conventional optical link has the single-core optical fiber mounted in the case as described above, the area occupied by one optical fiber is large.
Therefore, when trying to connect electronic devices with a large number of optical transmission lines, a large number of optical links are required, which hinders downsizing of electronic devices.

On the other hand, in the conventional optical link, the terminal is inserted into the through hole of the mother board, soldered, and mounted on the mother board. Therefore, there is a problem that the work of mounting the optical link is troublesome and the workability of maintenance and replacement of the optical link is poor.

Further, since the adjusting component for adjusting the circuit characteristics is mounted on the circuit board, the circuit board is housed in the case, and the case is sealed with the lid, the operation of adjusting the circuit characteristics is not easy. There was a point.

The present invention has been made in view of the above points, and promotes miniaturization of electronic devices, facilitates maintenance / replacement work, and facilitates circuit characteristic adjustment work. It is an object of the present invention to provide an optical parallel link capable of connecting a plurality of optical transmission lines and a mounting structure thereof.

[0021]

In order to achieve the above-mentioned object, according to the present invention, an optical array unit and a module substrate are enclosed in a package 16 as shown in FIG. The optical fiber array 11 of the optical array unit is led out, the optical array module 10 in which the external connection pad 17 is led out from the other side wall, the adjustment unnecessary component 32 and the adjustment component 33 are mounted, and one side edge An electronic circuit mounting board in which pads 37 connected to the external connection pads 17 of the optical array module 10 are arrayed on the mounting surface, and leads 35 connected to the motherboard 9 are arrayed on the other side edge.
The optical parallel link 100 is provided with 30 and the heat dissipation base 20 in which the heat dissipation fins 22 are arranged on the surface of the base plate 21.

This optical array unit is one in which an optical fiber array 11 and an opto-electric conversion element array are optically coupled to each other. In the optical array module 10, the bottom surface of the package 16 is the base of the heat dissipation base 20. It is closely attached to the back surface of the plate 21 and fixedly mounted on the heat dissipation base 20.

The non-mounting surface of the electronic circuit mounting board 30 is closely attached to the back surface of the base plate 21 of the heat dissipation base 20, and is fixedly mounted on the heat dissipation base 20. As illustrated in FIG. 4, a frame 31 made of a metal material is provided on the mounting surface of the electronic circuit mounting board 30, the adjustment unnecessary component 32 is mounted in the frame 31, and the opening of the frame 31 is sealed with a frame lid. On the mounting surface of the circuit mounting board 30, adjust component 33
It is configured to be exposed and mounted.

As shown in FIG. 9, the main plate portion 51 inserted and engaged in the engaging recess 43 of the housing side wall 42 of the housing 41.
And a plurality of contacts 50 including an upper contact piece 52 formed by extending a part of the upper portion of the main plate portion 51 and a lower joining piece 53 formed by extending a part of the lower portion of the main plate portion 51. .

Such a contact 50 is an upper contact piece.
The socket 40 is arranged in the housing 41 so that the lower joint pieces 53 are arranged on the upper surface of the housing side wall 42 and the lower joint pieces 53 are parallel to the mounting surface of the motherboard 9.

The socket 40 is mounted on the mother board 9 with the bottom surface of the housing 41 being in close contact with the mounting surface of the mother board 9. The lower joint piece 53 is soldered to the pad 9A of the mother board 9.

The upper contact piece 52 mounts the optical parallel link on the socket 40, and fixes the heat radiating base 20 of the optical parallel link to the mother board 9 with the bolt 19 to mount the electronic circuit of the optical parallel link. The lead 35 of the substrate 30 is pressed and joined.

Alternatively, the leads 35 arranged on the lower surface of the electronic circuit mounting board 30 have the extending portions 35A projecting to the outside of the electronic circuit mounting board 30, and the leads 35 are provided on the upper surface of the housing side wall 42 of the socket 40. The guide grooves 45 into which the extended portions 35A are fitted are arranged.

Further, a hollow 55 is provided in the central portion of the main plate portion 51 of each contact 50 to reduce the facing area between the main plate portions of the contacts 50 arranged in parallel.

[0030]

The optical parallel link of the present invention is provided with an optical array unit in which an optical fiber array and an opto-electric conversion element array are incorporated so as to optically couple with each other, and the optical array module is configured to be housed in a package. An electronic circuit mounting board with leads arranged on the side edges that connect to the motherboard,
A heat dissipation base having heat dissipation fins arranged on the surface of a base plate is provided, and the optical array module and the electronic circuit mounting board are fixed to the heat dissipation base.

Therefore, the heat of the optical array module and the electronic circuit mounting board is radiated to the outside from the heat dissipating fins of the heat dissipating base, so that the cooling performance of the optical array module and the electronic circuit mounting board is good.

In the optical array module, a plurality of optical fibers and a plurality of opto-electric conversion elements optically coupled are housed in one package, and a drive circuit or an amplifier circuit of the optical array module is one. The optical parallel link is small because it is mounted on two electronic circuit mounting boards.

Further, since the adjustment-unnecessary component is enclosed and housed in the frame and mounted on the electronic circuit mounting board, noise does not occur in the circuit of the adjustment-unnecessary component. Since the adjustment component is exposed and mounted on the electronic circuit mounting board, it is easy to adjust the circuit characteristics of the optical parallel link.

On the other hand, a socket is mounted on the mother board, an optical parallel link is placed on this socket, and the heat dissipation base is fixed to the mother board by using bolts, so that the leads of the optical link are inserted through the socket contacts. And connect it to the motherboard.

That is, the mounting structure of the optical parallel link of the present invention is as follows.
Easy maintenance and replacement of optical parallel links. Also,
The lead of the electronic circuit mounting board has an extending portion that horizontally protrudes outside the electronic circuit mounting board, and a guide groove into which the extending portion of each lead is fitted is provided on the upper surface of the housing side wall.

Therefore, by placing the optical parallel link in the socket so that the extended portion of the lead is inserted into the guide groove, the lead and the upper contact piece of the contact are aligned with each other. Therefore, the maintenance / replacement work of the optical parallel link becomes easier.

On the other hand, by providing a hollow in the central portion of the main plate portion of each contact to reduce the facing area between the main plate portions of the parallel contacts, crosstalk at the socket portion is reduced.

[0038]

The present invention will be described in detail with reference to the drawings. The same reference numerals denote the same objects throughout the drawings.

FIG. 1 is a block diagram of the present invention, (A) is a side sectional view, (B) is a plan view, FIG. 2 is a perspective view of an optical array module, and FIG. 3 is an optical array module. In the figure,
(A) is a side sectional view and (B) is a plan view.

FIG. 4 is an electronic circuit mounting board view of the present invention, (A) is a plan view of the front surface side, (B) is a plan view of the back surface side, and FIG. 5 is a heat radiation according to the present invention. In the figure of the base, (A) is a side view, (B) is a plan view of the front surface, and (C) is a plan view of the back surface.

FIG. 6 is a plan view of an embodiment of the optical parallel link of the present invention, and FIG. 7 shows the contact piece 52 on the motherboard.
By placing the optical parallel link on the socket 40 and fixing the heat radiating base 20 of the optical parallel link to the motherboard 9 using the bolts 19, the leads of the electronic circuit mounting board 30 of the optical parallel link can be obtained.
The structure is such that 35 is pressed and joined. It is a top view showing the state where it was mounted in.

FIG. 8 is a sectional view of an embodiment of the present invention, and FIG.
[FIG. 3] is a view showing a joint portion of an embodiment of the present invention, (A) is a sectional view, and (B) is a plan view. In the figure, 10 indicates that an optical array unit and a module substrate are enclosed in a package 16, an optical fiber array 11 of the optical array unit is led out from one side wall of the package 16, and an external connection pad 17 is led out from the other side wall. This is an optical array module.

The adjustment unnecessary component 32 and the adjustment component 33 are mounted on the device 30, and the optical array module 10 is mounted on the mounting surface of one side edge.
Is an electronic circuit mounting board in which pads 37 connected to the external connection pads 17 are arranged and formed, and leads 35 connected to the mother board 9 are arranged on the other three side edges.

Reference numeral 20 denotes a heat dissipation base in which heat dissipation fins 22 are arranged on the surface of the base plate 21. Optical parallel link 100 of the present invention
Is the optical array module 10 and the electronic circuit mounting board 30 described above.
Are mounted on the heat dissipation base 20, and the external connection pads 17 of the optical array module 10 and the corresponding pads 37 of the electronic circuit mounting substrate 30 are connected via bonding wires.

Reference numeral 9 is a mother board on which a plurality of optical parallel links are mounted. Reference numeral 40 denotes a socket mounted on the mother board 9 for connecting the lead 35 of the optical parallel link to the pad 9A of the mother board 9 through the contact.

Referring to FIG. 2, the optical fiber array 11
A detailed description will be given of an optical array unit in which the photoelectric conversion element array and the photoelectric conversion element array are optically coupled. Reference numeral 12 denotes an opto-electric conversion element array in which a number of opto-electric conversion elements 2 equal to the number of channels to be transmitted are formed in a horizontal row on a slender wafer at an equal pitch. The photoelectric conversion element 2 in the figure is a light emitting element, but the light receiving element also has a configuration according to FIG.

Electrodes are provided on the entire bottom surface of the wafer, and individual electrodes are provided on the upper surface side of each photoelectric conversion element 2. Reference numeral 14 denotes a module substrate mounted in the package 16, in which a number of patterns equal to the number of photoelectric conversion elements 2 are formed in parallel. The module substrate 14 includes a drive circuit (when the photoelectric conversion element 2 is a semiconductor laser) or an amplifier circuit (when the photoelectric conversion element 2 is a light receiving element).
A semiconductor component 15 such as an LSI having a main circuit is mounted.

Reference numeral 13 is a lens array in which a number of lenses 13A equal in number to the photoelectric conversion elements 2 are arranged in a horizontal row at a pitch equal to the arrangement pitch of the photoelectric conversion elements 2. Reference numeral 11 denotes an elongated rectangular parallelepiped-shaped fiber holder in which the incident side end portions (or the output side end portions) of the optical fibers 1 whose number is equal to the number of lenses in the lens array 13 are arranged at a pitch equal to the arrangement pitch of the lenses 13A. Is a fiber array fixed to.

The back surface of the module substrate 14 is closely adhered to the surface of the plate-shaped carrier adhered to the bottom surface of the package 16. Further, the photoelectric conversion element array 12 is placed along the front side edge of the module substrate 14, and the bottom surface thereof is fixed to the carrier by using a gold / tin filter or the like.

The individual electrodes of each photoelectric conversion element 2 and the corresponding pattern 5 of the module substrate 14 are connected via bonding wires. On the other hand, the lens array 13 is held by the lens holder so as to penetrate the square hole of the lens holder.

In the lens array 13, the lens holder is positioned on the bottom plate of the package 16 so as to face the emitting surface (or the light receiving surface) of the opto-electric conversion element array 12, and the optical axis of the lens 13A opposes. The position is adjusted so as to coincide with the optical axis of the electric conversion element 2, and then the lens holder and the carrier are fixed by laser welding or the like.

Further, the package on the front surface of the lens array 13
Mount the support on the bottom plate of 16, mount the lower surface of the fiber holder on the upper surface of this support, and adjust the optical axis of the optical fiber 12 so that it is aligned with the optical axis of the lens 6-1. After that, the fiber holder and the support base are fixed by laser welding or the like.

Therefore, the outgoing light of each photoelectric conversion element 2 of the photoelectric conversion element array 12 (when the photoelectric conversion element 2 is a light emitting element) is the optical fiber of the corresponding optical fiber array 11 by the lens 13A. The light is converged on the incident end face of the laser beam 1 and is incident on the optical fiber 1.

When the photoelectric conversion element 2 is a light receiving element, the light emitted from each optical fiber 1 is the lens 13A.
The light-to-electricity conversion element 2 collects and enters the light-receiving surface of the corresponding light-to-electricity conversion element 2 and is converted into an electric signal by the light-to-electricity conversion element 2.

As shown in FIG. 3, the above-mentioned optical array unit and the module substrate 14 are housed in a box-shaped package 16 having an upper opening, and the optical fiber array 11 (FIG. 2) is provided from one side wall of the package 16. Shows the case where the number of the optical fibers 1 is 5, and the other figures show the case where the number of the optical fibers 1 is 4.).

Further, a large number of external connection pads 17 are provided on the upper surface side.
The insulating plates 17A formed in parallel with each other are provided so as to penetrate the other side wall of the package 16, and the external connection pads 17 and the corresponding patterns of the module substrate 14 are connected via bonding wires. There is.

Then, the opening of the package 16 is closed with a lid made of a metal plate, and the photoelectric conversion element array 12 and the semiconductor component 15 are sealed to form the optical array module 10. It should be noted that the optical array module 10 is fixed to the heat radiating base 20 by forming a hole into which the shaft of the machine screw 16A is fitted in a fixing seat provided by extending the bottom plate of the package 16 to the outside.

Hereinafter, the electronic circuit mounting board 30 will be described in detail with reference to FIG. The electronic circuit mounting board 30 is a multilayer board made of ceramics, and pads 37 for connecting to the external connection pads 17 of the optical array module 10 via bonding wires are arrayed on the mounting surface at one side edge. There is. The leads 35 connected to the mother board 9 are arranged on the other three side edges by brazing (gold / tin brazing).

Each lead 35 is an electronic circuit mounting board.
It is an elongated member having a stretched portion 35A stretched outside 30. A rectangular frame 31 made of metal (for example, Kovar) having a coefficient of thermal expansion substantially equal to the coefficient of thermal expansion of the electronic circuit mounting board 30 is brazed and fixed to a region near the pad 37 of the electronic circuit mounting board 30. An adjustment unnecessary component 32 is mounted in the frame 31, and the frame 31 is sealed by a frame lid (frame lid 31A shown in FIG. 6).

Further, the adjustment component 33 is mounted on another area of the mounting surface of the electronic circuit mounting board 30. In the case of the present invention, the adjustment-free component 32 is a drive circuit or amplifier circuit of the optical array module, and an LS attached to those circuits.
I refers to electronic components such as coils, capacitors, etc. Adjustment parts
33 is an electronic component such as a variable resistor that adjusts circuit characteristics.

On the other hand, a component 34 having a large mounting height is mounted on the rear surface side of the electronic circuit mounting substrate 30 corresponding to the adjustment component 33. Furthermore, in the four corners on the back side, the electronic circuit mounting board
A fixing seat made of a metal plate having a hole 36 into which the shaft portion of the small screw 39 is fitted is attached by brazing in order to fix the 30 to the heat dissipation base 20 using the small screw 39.

As shown in detail in FIG. 5, the heat dissipation base 20 has a rear surface 21B of the base plate 21 having an upper flat surface portion 21B-1 (a right side flat surface in FIG. 5) and a lower flat surface portion 21B-2 (FIG. 5). (A left-side plane) and a step is provided.

The surface 21A of the upper plane portion 21B-1 and the lower plane portion 21
Radiating fins 22 are provided in parallel at the position on the surface of B-2. The upper flat surface portion 21B-1 is a region where two optical array modules 10 are fixed in parallel, and a small screw 16A (one optical array module 10
Threaded holes 24 into which the machine screws 16A are secured)
Are installed.

The lower plane portion 21B-2 is a region to which the electronic circuit mounting board 30 is fixed, and a screw hole 26 into which a small screw for fixing the electronic circuit mounting board 30 is screwed is provided. Further, holes 4 for inserting the shaft portions of the bolts 19 for fixing the heat dissipation base 20 to the mother board 9 are provided at the four corners of the lower flat surface portion 21B-2.

On the other hand, a rectangular window 23 is provided in the lower flat surface portion 21B-2 of the base plate 21, and an edge frame 23A protruding upward is provided on the surface 21A side of the window 23. The window 23 is a window 23 corresponding to the mounting area of the component 34 having a large mounting height to be mounted on the back surface side of the electronic circuit mounting substrate 30 as shown in FIG. 1, and finally closed by the lid 29. The part 34 is peeled off and the part 34 is protected.

As shown in FIGS. 1 and 6, the bottom plate of the package 16 of the optical array module 10 is brought into close contact with the upper flat surface portion 21B-1 of the heat dissipation base 20 and the package is mounted by using the small screw 16A.
By fixing 16 to the heat dissipation base 20, the optical array module
Two 10s are attached in parallel to the heat dissipation base 20.

Two optical array modules 10 arranged in parallel
In one, each photoelectric conversion element is a light emitting element, and in the other optical array module 10, each photoelectric conversion element is a light receiving element.

On the other hand, the back surface of the electronic circuit mounting board 30 is brought into close contact with the lower flat surface portion 21B-2 of the heat dissipation base 20, and the electronic circuit mounting board 30 is fixed to the heat dissipation base 20 using a conductive adhesive. Using the machine screws 39, the electronic circuit board 30 is radiated
It is attached to 20.

At this time, since the heat dissipation base 20 is provided with a step, the surface of the insulating plate 17A of the optical array module 10 on the external connection pad 17 side and the mounting surface of the electronic circuit mounting board 30 (that is, the pad 37 is The formed surface) is the same surface.

Then, each optical array module 10
The external connection pad 17 and the corresponding pad 37 of the electronic circuit mounting substrate 30 are connected via a bonding wire. As shown in FIG. 7, a large number of the optical parallel links 100 described above are closely mounted in parallel on the mother board 9.

An optical connector 18 is attached to the tip of each optical fiber array 11, and the optical connector 18 is fixed to the side edge portion of the mother board 9. Since the optical parallel link 100 of the present invention is configured as described above, the heat of the optical array module 10 and the electronic circuit mounting board 30 is transferred to the heat radiation base 20, and the heat radiation fins 22 having a large heat radiation area are used to externally Is released to.

Therefore, the adjustment-unnecessary components 32 and the adjustment components mounted on the optical array module 10 and the electronic circuit mounting board 30 are adjusted.
The cooling performance of 33 etc. is good. In the optical array module 10, a plurality of optical fibers 1 and a plurality of optical-electrical conversion elements 2 optically coupled are housed in one package 16, and a drive circuit or an amplifier of the optical array module 10 is included. Since the circuits and the like are mounted on one electronic circuit mounting board 30, the optical parallel link 100 of the present invention is small.

Further, since the adjustment-unnecessary component 32 is enclosed and housed in the frame 31 and mounted on the electronic circuit mounting board 30, no noise is generated in the circuit of the adjustment-unnecessary component. Further, since the adjustment component 33 is mounted on the electronic circuit mounting board 30 in a bare state, it is easy to adjust the circuit characteristics of the optical parallel link 100.

The mounting structure of the optical parallel link will be described below with reference to FIGS. In the figure, reference numeral 41 denotes a molded housing in which a housing side wall 42 is provided in a substantially U-shape on a peripheral portion of a rectangular bottom plate which is similar to the electronic circuit mounting board 30 and is larger than the electronic circuit mounting board 30.

The housing side wall 42 includes an electronic circuit mounting board.
Corresponding to each lead 35 of the 30, deep strip-shaped engaging recesses 43 are formed on the inner side of which the outer side is open. Further, on the upper surface of the housing side wall 42, guide grooves 45 into which the extending portions 35A of the leads 35 are fitted are provided in parallel. The groove width of this guide groove 45 is larger than the width of the lead 35.
It is slightly larger and its depth is approximately equal to the thickness of the lead 35.

The reference numeral 50 designates a main plate portion 51 inserted into and engaged with the engaging recess 43 of the housing side wall 42 of the housing 41, and a spring-like upper contact piece 52 formed by extending a part of the upper portion of the main plate portion 51. And a contact made of a metal plate (for example, a copper alloy) having good conductivity, which is composed of a lower joining piece 53 formed by extending a part of the lower portion of the main plate portion 51.

Incidentally, it is preferable to plate the upper surface of the upper contact piece 52 with gold or the like because the contact resistance becomes small. In such a contact 50, the main plate portion 51 is fitted in each of the engaging recesses 43 of the housing side wall 42 so that the upper contact piece 52 projects from the upper surface of the housing side wall 42 and the lower joint piece 53 is parallel to the mounting surface of the motherboard 9. The socket 40 is configured by being inserted and fixed.

The contact 50 is incorporated in the housing 41 so that the upper contact piece 52 is located at a position corresponding to the back surface of the lead 35 of the electronic circuit mounting board 30. The socket 40 described above is placed on the mounting surface of the motherboard 9, and the bottom surface of the housing 41 is adhesively bonded to the motherboard 9.
The lower joint piece 53 is soldered and connected to the pad 9A of the mother board 9, and the socket 40 is mounted on the mother board 9.

To mount the optical parallel link 100 on the mother board 9, while looking at the extending portion 35A of the lead 35 from above,
The extending portion 35A is fitted into the guide groove 45 of the housing side wall 42, and the electronic circuit mounting board 30 portion is aligned and placed on the socket 40.

Then, the bolts 19 are inserted into the holes 25 of the heat radiating base 20, the holes vertically penetrating the housing side wall 42, and the holes of the motherboard 9, and a square plate member 60 (metal Plate or synthetic insulating plate).

As a result, the optical parallel link 100 is fixed to the mother board 9 via the socket 40. As described above, the heat dissipation base 20 is pressed and fixed to the socket 40 by using the bolt 19, so that the upper contact piece 52 of the contact 50 corresponding to the lower surface of the lead 35 is pressed and joined.

Therefore, each lead 35 of the optical parallel link 100 is connected to the corresponding pad 9A of the motherboard 9 via the contact 50 of the socket 40. Bolt again
It goes without saying that the optical parallel link 100 can be removed from the socket 40 by loosening 19.

That is, the mounting structure of the optical parallel link of the present invention has an effect that maintenance and replacement work of the optical parallel link is easy. In addition, a hollow 55 is provided in the central portion of the main plate portion 51 of each contact 50 to arrange the contacts in parallel.
If the area where the main plate portions 50 face each other is reduced, the crosstalk at the socket portion is reduced.

On the other hand, it is not essential to provide the extending portion 35A on the lead 35 and the guide groove 45 on the socket 40 side. However, it is preferable to provide the lead 35 with the extension portion 35A and the housing 41 with the guide groove 45 because it is easy to align the lead 35 of the optical parallel link 100 with the contact 50 of the socket 40.

[0085]

The present invention has the following excellent effects. The optical parallel link is an optical array module configured by installing an optical array unit in which an optical fiber array and an opto-electric conversion element array are optically coupled and housed in a package, and a motherboard on a selected side edge. An electronic circuit mounting board on which leads to be connected are arranged and a heat dissipation base on which heat dissipation fins are arranged on the surface of a base plate, and the optical array module and the electronic circuit mounting board are fixed to the heat dissipation base. Therefore, the cooling performance of the optical array module and the electronic circuit mounting board is good.

In the optical array module, a plurality of optical fibers and a plurality of opto-electric conversion elements optically coupled are housed in one package, and the drive circuit or amplifier circuit of the optical array module is one. The optical parallel link is small because it is mounted on two electronic circuit mounting boards.

Since the adjustment-unnecessary component is enclosed and housed in the frame and mounted on the electronic circuit mounting board, noise does not occur in the circuit of the adjustment-unnecessary component. Moreover, since the adjustment component is exposed and mounted on the electronic circuit mounting board, it is easy to adjust the circuit characteristics of the optical parallel link.

On the other hand, a socket is mounted on the mother board, an optical parallel link is mounted on the socket, and the heat dissipation base is fixed to the mother board by using bolts, so that the leads of the optical link are inserted through the socket contacts. The optical parallel link is easy to maintain and replace because it is connected to the motherboard.

By inserting the extension part of the lead of the optical parallel link into the guide groove provided in the socket, the maintenance and replacement work of the optical parallel link becomes easier. Also,
By providing a hollow in the center of the main plate portion of each contact to reduce the facing area between the main plate portions of the parallel contacts, crosstalk at the socket portion is reduced.

[Brief description of drawings]

FIG. 1 is a configuration diagram of the present invention, (A) is a side sectional view, and (B) is a plan view.

FIG. 2 is a perspective view of an optical array module.

FIG. 3 is a view of an optical array module, (A) is a side sectional view,
(B) is a plan view.

FIG. 4 is an electronic circuit mounting board view of the present invention, (A) is a plan view of the front surface side, and (B) is a plan view of the back surface side.

5A and 5B are views of a heat dissipation base according to the present invention, where FIG. 5A is a side view, FIG. 5B is a plan view of a front surface, and FIG.

FIG. 6 is a plan view of an embodiment of the optical parallel link of the present invention.

FIG. 7 is a plan view showing a state of being mounted on a motherboard.

FIG. 8 is a sectional view of an embodiment of the present invention.

9A and 9B are views showing a joint portion of an embodiment of the present invention, in which FIG. 9A is a sectional view and FIG. 9B is a plan view.

FIG. 10 is a view of a conventional optical link, (A) is a side sectional view, and (B) is a side sectional view.
Is a plan view before mounting the heat dissipation base, and (C) is a plan view of the heat dissipation base.

FIG. 11 is a cross-sectional view of a conventional optical module.

[Explanation of symbols]

1 optical fiber 2 optical-electrical conversion element 9 motherboard 9A pad 10 optical array module 11 optical fiber array 12 optical-electrical conversion element array 13 lens array 14 module substrate 15 semiconductor component 16 package 17 pad for external connection 19 bolt 20 heat dissipation base 21 Base plate 22 Radiating fins 30 Electronic circuit mounting board 31 Frame 32 Unnecessary parts 33 Adjustment parts 34 Parts 35 Lead 35A Extension 37 Pad 40 Socket 41 Housing 42 Housing side wall 43 Engagement recess 45 Guide groove 50 Contact 51 Main plate 52 Top Contact piece 53 Lower splicing piece 55 Hollowed out 100 Optical parallel link

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor ▲ Kiyo Kuwahara 1015 Kamiodanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture, Fujitsu Limited (72) Koichi Hara, 1015 Kamedotachu, Nakahara-ku, Kawasaki City, Kanagawa Prefecture Fujitsu Stock In the company

Claims (5)

[Claims] 1. An optical array unit and a module substrate are enclosed in a package (16), an optical fiber array (11) of the optical array unit is led out from one side wall of the package (16), and the other side wall is led out. An optical array module (10) derived from an external connection pad (17), an adjustment-unnecessary component (32) and an adjustment component (33) are mounted, and the external connection pad is mounted on one side edge of the mounting surface. An electronic circuit mounting board (30) in which pads (37) connected to the pads (17) are formed in an array, and leads (35) connected to the mother board (9) are arrayed on the mounting surface of the other side edge, and a base. The plate (21) is provided with a heat dissipation base (20) in which heat dissipation fins (22) are arranged, and the optical array unit optically couples the optical fiber array (11) and the photoelectric conversion element array. In the optical array module (10), the bottom surface of the package (16) dissipates the heat radiation. The electronic circuit mounting board (30) is mounted on the heat dissipation base (20) in close contact with the back surface of the base plate (21) of the base (20). (20)
An optical parallel link characterized in that the optical parallel link is closely attached to the back surface of the base plate (21) and fixedly mounted on the heat dissipation base (20). 2. A frame (31) made of a metal material is provided on the mounting surface of the electronic circuit mounting board (30) according to claim 1, and an adjustment-unnecessary component (32) is mounted in the frame (31). An optical parallel link characterized in that the opening of the frame (31) is sealed with a frame lid, and the adjustment component (33) is barely mounted on the mounting surface of the electronic circuit mounting substrate (30). 3. A main plate portion (51) inserted into and engaged with an engaging recess (43) of a housing side wall (42) of the housing (41), and the main plate portion (5).
The upper contact piece (5) formed by stretching a part of the upper part of (1)
2) and a contact (50) consisting of a lower joining piece (53) formed by extending a part of the lower portion of the main plate portion (51), and the upper contact piece (52) being the housing side wall (42). A socket (40) arranged on the housing (41) so that the lower joint piece (53) is parallel to the mounting surface of the motherboard (9), and the socket (40) is The bottom surface of the housing (41) is closely attached to the mounting surface of the motherboard (9) and is mounted on the motherboard (9), and the lower joint piece (53) is a pad of the motherboard (9). (9A)
The upper contact piece (52) is mounted on the socket (40) with the optical parallel link according to claim 1 or 2, and the upper contact piece (52) is attached by using a bolt (19). By fixing the heat dissipation base (20) of the optical parallel link to the motherboard (9), the electronic circuit mounting board (3
An optical parallel link mounting structure in which the lead (35) of (0) is pressed and joined. 4. The electronic circuit mounting board according to claim 1 or 2.
The housing side wall of the socket (40) according to claim 3, wherein the lead (35) arranged on the lower surface of the (30) has an extending portion (35A) that horizontally protrudes to the outside of the electronic circuit mounting board (30). A mounting structure for an optical parallel link, characterized in that guide grooves (45) into which the extended portions (35A) of the leads (35) are fitted are arranged on the upper surface of (42). 5. A hollow (55) is provided in the central portion of the main plate portion (51) of each contact (50) according to claim 3 or 4,
A mounting structure of an optical parallel link, characterized in that a facing area between main plate portions of the parallel contacts (50) is reduced.