JP3152530B2 - Parallel optical module and radiation fin with parallel optical module - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a parallel optical module used for optical communication and a radiating fin with the parallel optical module.

[0002]

2. Description of the Related Art In recent years, high-speed parallel optical modules using arrayed light emitting and receiving elements have been proposed as parallel optical modules for parallel transmission between racks and boards in large computers and exchanges.

FIG. 4 is a perspective view showing the configuration of a conventional parallel optical module. As shown in FIG. 1, a package 21 forming an outer shell of the parallel optical module 20 includes a light emitting and receiving element array including a light emitting diode or a photodiode and an IC for driving the light emitting and receiving element array (neither is shown). By arranging the driving ICs close to the light emitting and receiving element array in this manner, electrical crosstalk between adjacent channels and deterioration of response speed are suppressed. The bottom plate of the package 21 extends outward in a flange shape, and a plurality of mounting portions 21a are formed on the periphery of the bottom plate. The parallel optical module 20 is mounted on a printed circuit board (not shown) or the like using these mounting portions 21a. The package 21
An optical fiber 22 is fixed on the side surface of the optical fiber 22. The optical fiber 22 is optically coupled to the light emitting and receiving element array in the package 21.

[0004] Techniques related to this type of parallel optical module include, for example, IEICE Technical Report, vol. 91, No. 197 "Thin L for Optical Parallel Transmission
ED / PD array module ”.

[0005]

In the conventional parallel optical module 20 constructed as described above, the mounting portion 21a for mounting on an external device is formed on the periphery of the bottom plate of the package 21. There is a problem that the outer dimensions of the package 21 are increased by the portion 21a. In particular, the I stored in the package 21
In the case where a radiating fin is attached to the parallel optical module 20 in order to reduce the heat generation of C, a mounting screw portion for attaching to the radiating fin is absolutely necessary for the parallel optical module 20, and the problem of increasing the size of the parallel optical module is remarkable. become.

[0006] The present invention has been made in view of the drawbacks inherent in the related art, an object of the drive IC of the light emitting array can be efficiently radiating, suitable for miniaturization parallel optical module and parallel light An object of the present invention is to provide a radiation fin with a module .

[0007]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a parallel optical module in which an optical element array and an IC for driving the optical element array are housed in a package, and which is mounted on a heat radiation fin on the back of the package. Mounting hole was slightly shifted from immediately below the mounting position of the IC.
This is achieved by providing a position . As this mounting hole, a screw hole for inserting a screw or a fixing hole for inserting a press-fit pin is preferable.

[0008]

[Function] Heat generated from the driving IC housed in the package is efficiently radiated by the radiation fins.
A mounting hole for mounting the parallel optical module to the radiation fin is provided on the back surface of the package, so that the size of the parallel optical module can be reduced.
Attachment on the back of the package to attach to the radiation fins
The hole is slightly shifted from the position directly below the mounting position of the driving IC.
The package is attached to the radiation fins.
This drive IC when attached with a screw or a press-fit pin
The acting stress can be reduced.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view of a parallel optical module according to an embodiment of the present invention. In FIG. 1, reference numeral 1 generally indicates the parallel optical module. Reference numeral 2 denotes a package forming an outer shell of the parallel optical module 1, and an optical element array 3 and a wiring board 4 are fixed in the package 2. The optical element array 3 is a light emitting element array or a light receiving element array,
An IC 5 for driving the optical element array 3 is mounted on the wiring board 4. Reference numeral 6 denotes a lens array. The lens array 6 is air-tightly fixed to a lens array holder 7 with low-melting glass. The lens array holder 7 is air-tightly fixed to one side surface of the package 2 by soldering or welding after adjusting the position so that the optical element array 3 and the lens array 6 have a light transmitting relationship. A terminal plate 8 is hermetically fixed to the other side surface of the package 2, and terminals 9 are fixed to the terminal plate 8 outside the package 2. The terminal plate 8 and the IC 5, and the IC 5 and the optical element array 3 are electrically connected inside the package 2 via wires. A cap 10 is welded to an upper open end of the package 2, and the inside of the package 2 is kept airtight by the cap 10. Further, a plurality of screw holes 11 are provided on the back surface of the package 2 (only one is shown in the figure).
It is processed at a position slightly shifted from immediately below the mounting position of C5.

Reference numeral 12 denotes an optical fiber array, and the optical fiber array 12 is fixed to the package 2 via an optical fiber array holder 13. The position of the optical fiber array holder 13 is adjusted so that the optical fiber array 12 and the optical element array 3 are opposed to each other, and then the respective joint portions between the lens array holder 7 and the optical fiber array 12 are soldered or welded. The optical fiber array 12 is fixed to the package 2.

FIG. 2 is a sectional view of a parallel optical module according to another embodiment of the present invention, and portions corresponding to FIG. 1 are denoted by the same reference numerals. This embodiment is different from the previous embodiment in that a plurality of unthreaded fixing holes 14 are provided on the back surface of the package 2 in place of the screw holes 11, and the remaining configuration is the same. .

FIG. 3 is a perspective view showing a mounted state of the parallel optical module. In FIG. 3, reference numeral 15 denotes a radiation fin. A plurality of grooves 16 are formed on the upper surface of the radiation fin 15, and the parallel optical module 1 configured as described above is formed.
After being arranged in these grooves 16, a screw (not shown) is screwed into the screw hole 11 in the case of the embodiment shown in FIG. 1 and into the fixing hole 14 in the case of the embodiment shown in FIG. Each of the fins 15 is attached to the upper surface of the radiation fin 15 by inserting a press-fit pin (not shown). At this time, since the mounting holes (the screw holes 11 or the fixing holes 14) are provided on the back surface of the package 2, the size of the parallel optical module 1 can be reduced.
The heat generated from C5 is efficiently radiated by the radiation fins 15, so that performance degradation of the optical element array 3 can be prevented. Further, the screw hole 11 and the fixing hole 14 are IC5
Since it is processed at a position slightly displaced from immediately below the mounting position, the stress from the screw or the press-fit pin acting on the IC 5 can be reduced.

[0013]

As described above, according to the present invention,
Since the mounting holes for mounting the parallel optical modules to the heat radiation fins are provided on the back surface of the package, the heat generated by the ICs housed in the package can be efficiently radiated by the heat radiation fins, thereby impairing the heat radiation efficiency of the IC driving the optical element array. it can reduce the size of the parallel optical module without also threaded and press-fit pin a package to the radiating fin
A switch acting on this drive IC when attached by a
Tresses can be eased.

[Brief description of the drawings]

FIG. 1 is a sectional view of a parallel optical module according to one embodiment of the present invention.

FIG. 2 is a sectional view of a parallel optical module according to another embodiment of the present invention.

FIG. 3 is a perspective view showing a state where the parallel optical module of the present invention is mounted on a radiation fin.

FIG. 4 is a perspective view showing a configuration of a conventional optical parallel module.

[Explanation of symbols]

 Reference Signs List 1 parallel optical module 2 package 3 optical element array 4 wiring board 5 IC 6 lens array 7 lens array holder case 8 terminal plate 9 terminal 10 cap 11 screw hole (mounting hole) 12 optical fiber array 13 optical fiber array holder 14 fixing hole ( (Mounting hole) 15 Heat radiation fin 16 Groove

Continued on the front page (72) Inventor Satoshi Kaneko 216 Totsuka-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture Inside the Hitachi, Ltd.Information and Communications Division (72) Inventor Shigefumi Kito 216 Totsuka-cho, Totsuka-ku, Yokohama-shi, Kanagawa Hitachi, Ltd. (72) Inventor Kazutoshi Takayama 216 Totsuka-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture Hitachi, Ltd. Information and Communication Division (56) References JP-A-3-296288 (JP, A) 60-159411 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) G02B 6/42 H01L 23/36 H01L 27/14

Claims (4)

(57) [Claims] 1. A parallel optical module in which an optical element array and an IC for driving the optical element array are housed in a package, wherein a mounting hole for mounting the back surface of the package to a radiation fin is provided immediately below a mounting position of the IC. Slightly shifted
A parallel optical module, wherein the parallel optical module is provided at a different position . 2. The parallel optical module according to claim 1, wherein the mounting hole is a screw hole. 3. The parallel optical module according to claim 1, wherein the mounting hole is a fixing hole for inserting a press-fit pin. 4. The method according to claim 1, wherein
Characterized by mounting multiple parallel optical modules
Radiation fin with parallel optical module.