JP2007019153A - Optical link device - Google Patents

Optical link device Download PDF

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Publication number
JP2007019153A
JP2007019153A JP2005197431A JP2005197431A JP2007019153A JP 2007019153 A JP2007019153 A JP 2007019153A JP 2005197431 A JP2005197431 A JP 2005197431A JP 2005197431 A JP2005197431 A JP 2005197431A JP 2007019153 A JP2007019153 A JP 2007019153A
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optical link
link device
lead
transparent resin
base
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Inventor
Takeshi Miura
剛 三浦
Arata Shimozawa
新 下澤
Yuichiro Tanda
祐一郎 反田
Mitsusato Ishizaka
光識 石坂
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Citizen Electronics Co Ltd
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Citizen Electronics Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

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Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical link device which is provided with a base that can strengthen the fixation of a lead extending from a package with an optical link element or driving ICs and so on, and which is stabilized durably against high temperature under high-temperature environment such as reflow processing during mounting or vehicle mounting or the like. <P>SOLUTION: An optical link device 21 is provided with a package 23 which seals an optical link element comprised of an LED 25 and a driving IC 26 for driving the optical link device by a transparent resin body 27, and a lead 24 for external connection extending from the package 23. The package 23 is provided with a heat-resistant base 22 and a transparent resin 27 that seals the LED 25 mounted to the base 22 and the driving IC 26 for driving the LED 25, and the lead 24 is integrally fixed on the lead 22. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、発光ダイオード、面発光半導体レーザ、フォトダイオード、フォトＩＣ等の光リンク素子によって構成される光ファイバ通信用の小型の光リンクデバイスに関するものである。   The present invention relates to a small-sized optical link device for optical fiber communication constituted by an optical link element such as a light emitting diode, a surface emitting semiconductor laser, a photodiode, or a photo IC.

従来、発光ダイオードやフォトダイオード等の光リンク素子からなる光トランシーバや半導体レーザ等（以下、光リンクデバイスという）は、図１０（ａ）に示すように、リードフレーム４の一端に前記光リンク素子５やその駆動を司る駆動回路（駆動ＩＣ）６を実装し、前記リードフレーム４をそのまま透明樹脂体７によってパッケージ化した構造のものが多い（特許文献１、特許文献２参照）。前記透明樹脂体７は、透明なエポキシ樹脂をトランスファーモールド法と呼ばれる工法によって成形したもので、このエポキシ樹脂内に前記光リンク素子５や駆動ＩＣ６がリードフレーム４と共に固着される。   Conventionally, an optical transceiver, a semiconductor laser or the like (hereinafter referred to as an optical link device) composed of an optical link element such as a light emitting diode or a photodiode is connected to one end of a lead frame 4 as shown in FIG. 5 and a drive circuit (drive IC) 6 that controls the drive are mounted, and the lead frame 4 is packaged as it is with a transparent resin body 7 (see Patent Documents 1 and 2). The transparent resin body 7 is formed by molding a transparent epoxy resin by a method called a transfer molding method, and the optical link element 5 and the drive IC 6 are fixed together with the lead frame 4 in the epoxy resin.

前記エポキシ樹脂には、熱変形温度（Ｔｇ）を１３５℃以下に抑えたものが使用され、封止する際に、前記光リンク素子５や駆動ＩＣ６に対して強いストレスを与えないようにしている。   As the epoxy resin, one having a thermal deformation temperature (Tg) suppressed to 135 ° C. or lower is used, and the optical link element 5 and the driving IC 6 are not subjected to strong stress when sealed. .

また、前記光リンク素子５や駆動ＩＣ６をマザーボードに実装する際は、マザーボード上の電極パターン配列に合わせて、前記リードフレーム４の端部を適当な長さや角度に折曲げ、半田部材を介して接合される。
特開平７−３３５９８０号公報 特開平９−１０２６５０号公報 Further, when mounting the optical link element 5 or the driving IC 6 on the mother board, the end of the lead frame 4 is bent to an appropriate length or angle according to the electrode pattern arrangement on the mother board, and a solder member is interposed. Be joined.
JP 7-335980 A JP-A-9-102650

しかしながら、上記従来構造の光リンクバデバイス１にあっては、前述したように、光リンク素子５や駆動ＩＣ６が実装されているリードフレーム４の固定や封止するための透明樹脂体７のＴｇが低く設定されているため、耐熱性が十分でなく、高温になるような環境条件の下では使用できないといった問題がある。特に、−４０℃〜＋１００℃といった高い温度保証が要求されるような車載用途には不向きである。   However, in the optical link bar device 1 having the above-described conventional structure, as described above, the Tg of the transparent resin body 7 for fixing and sealing the lead frame 4 on which the optical link element 5 and the drive IC 6 are mounted. Is set low, the heat resistance is not sufficient, and there is a problem that it cannot be used under environmental conditions where the temperature is high. In particular, it is not suitable for in-vehicle applications that require a high temperature guarantee such as −40 ° C. to + 100 ° C.

また、前記リードフレーム４を実装ベースとして使用しているため、リフロー処理を行う際に、前記リードフレーム４全体に熱が加わり、ここから透明樹脂体７にも熱による影響が及ぶことになる。前述したようなＴｇが１３５℃以下の樹脂材では、３５０℃で５秒以上のリフロー処理を行うと、樹脂体の軟化現象が現れる。   In addition, since the lead frame 4 is used as a mounting base, heat is applied to the entire lead frame 4 during reflow processing, and the transparent resin body 7 is also affected by the heat. In the case of a resin material having a Tg of 135 ° C. or lower as described above, a softening phenomenon of the resin body appears when reflow treatment is performed at 350 ° C. for 5 seconds or longer.

このような透明樹脂体７の軟化現象が発生すると、図１０（ｂ）に示すように、樹脂材によって固定されていたリードフレーム４の固定位置がずれてしまう場合がある。また、前記リードフレーム４のずれに伴って、このリードフレーム４上に実装される光リンク素子５や駆動ＩＣ６及びワイヤ９の接続部分にストレスがかかり、接触不良や断線等といった初期不良や歩留りの低下を引き起こすことになる。また、経年変化による製品寿命の低下につながるといった問題も有することとなる。   When such a softening phenomenon of the transparent resin body 7 occurs, as shown in FIG. 10B, the fixing position of the lead frame 4 fixed by the resin material may be shifted. In addition, with the displacement of the lead frame 4, stress is applied to the connecting portion of the optical link element 5, the driving IC 6 and the wire 9 mounted on the lead frame 4, and initial defects such as contact failure and disconnection, and yield are reduced. Will cause a decline. In addition, there is a problem that the product life is reduced due to aging.

また、前記構造の光リンクバデバイス１をマザーボードに実装する際に、半田接合を安定且つ確実に行い得るような温度でのリフロー処理ができないため、実装の安定性が図られないといった問題もある。   Further, when the optical link bar device 1 having the above structure is mounted on a mother board, there is a problem that the mounting stability cannot be achieved because the reflow process cannot be performed at a temperature at which soldering can be performed stably and reliably. .

そこで、本発明の目的は、光リンク素子や駆動ＩＣ等が実装されているパッケージ部から延びるリード部の固定をより強固にすると共に、実装する際のリフロー処理や車載等の高温環境の下における高熱に対しても十分耐えうるような安定したベース部を備えた光リンクデバイスを提供することである。   Accordingly, an object of the present invention is to more firmly fix the lead portion extending from the package portion on which the optical link element, the driving IC, etc. are mounted, and to be used under a high temperature environment such as reflow processing when mounted or in-vehicle. An object of the present invention is to provide an optical link device having a stable base portion that can sufficiently withstand high heat.

上記課題を解決するために、本発明の光リンクデバイスは、光リンク素子及びこの光リンク素子を駆動する駆動回路が透明樹脂体によって封止されたパッケージ部と、このパッケージ部から延びる外部接続用のリード部とを備えた光リンクデバイスにおいて、前記パッケージ部が、耐熱性のベース部と、このベース部上に実装される前記光リンク素子及び前記駆動回路を封止する透明樹脂体とを備え、前記ベース部に前記リード部が一体に固定されていることを特徴とする。   In order to solve the above problems, an optical link device according to the present invention includes an optical link element and a package part in which a drive circuit for driving the optical link element is sealed with a transparent resin body, and an external connection extending from the package part. In the optical link device including the lead portion, the package portion includes a heat-resistant base portion, and a transparent resin body that seals the optical link element and the drive circuit mounted on the base portion. The lead portion is integrally fixed to the base portion.

本発明に係る光リンクデバイスによれば、光リンク素子やその駆動回路が耐熱性を有するベース部に直接実装されると共に、このベース部に対して外部接続用のリード部が一体に固定形成されているため、リード部の安定性がよくなり、特に、車載等の高温環境下における信頼性を高めることができる。   According to the optical link device of the present invention, the optical link element and its drive circuit are directly mounted on the heat-resistant base part, and the lead part for external connection is integrally fixed to the base part. Therefore, the stability of the lead portion is improved, and in particular, the reliability in a high temperature environment such as in-vehicle can be improved.

また、前記リード部に駆動回路を直接実装する必要がないため、パッケージ内に外部から伝わる熱の進入を抑えることができる。これによって、前記駆動回路の熱による誤動作や破壊を防止することができる。   In addition, since it is not necessary to directly mount a drive circuit on the lead portion, it is possible to suppress the invasion of heat transmitted from the outside into the package. This can prevent malfunction and destruction of the drive circuit due to heat.

また、前記ベース部は、熱変形温度が２６０℃以上の液晶ポリマーやポリフタルアミド等による耐熱性に優れた樹脂材で形成されているため、リフロー処理を用いてマザーボードに実装する際にも樹脂材の伸縮が抑えられるため、接合されているリード部の位置ずれやそれに伴う回路部の接触不良や断線等を防止することができる。   In addition, since the base portion is formed of a resin material having a heat deformation temperature of 260 ° C. or higher, such as a liquid crystal polymer or polyphthalamide, the resin is excellent when mounted on a motherboard using a reflow process. Since the expansion and contraction of the material is suppressed, it is possible to prevent misalignment of the joined lead parts, contact failure of the circuit part, disconnection, and the like.

さらに、前記ベース部が透明樹脂体で封止されることによって気密性が確保できると共に、前記透明樹脂体の上面から光リンク素子に向けた凹設部を設け、この凹設部の底部にレンズ部を成形することで、指向性及び受発光感度の向上を図ることができる。   Furthermore, the base portion is sealed with a transparent resin body to ensure airtightness, and a concave portion is provided from the upper surface of the transparent resin body toward the optical link element, and a lens is provided at the bottom of the concave portion. By shaping the portion, it is possible to improve directivity and light receiving / emitting sensitivity.

以下、添付図面に基づいて本発明に係る光リンクデバイスの実施形態を詳細に説明する。なお、この光リンクデバイスは、光ファイバを媒介として双方向通信を行うため、送信フォトチップと受信フォトチップとによって構成される。以下に示す実施形態では、送信フォトチップを例にして説明する。   Embodiments of an optical link device according to the present invention will be described below in detail with reference to the accompanying drawings. This optical link device includes a transmission photochip and a reception photochip because bidirectional communication is performed via an optical fiber. In the following embodiment, a transmission photochip will be described as an example.

図１及び図２は、本発明の光リンクデバイスを構成する第１実施形態の送信フォトチップ２１の構造を示したものである。この送信フォトチップ２１は、パッケージ部２３と、このパッケージ部２３から延びるリード部２４とで構成されている。前記パッケージ部２３は、四角形状のベース部２２と、このベース部２２上に実装される光リンク素子（ＬＥＤ）２５及びこのＬＥＤ２５の駆動を司る駆動回路（駆動ＩＣ）２６と、前記ベース部２２全体を封止する透明樹脂体２７とを備えている。前記リード部２４は、前記ＬＥＤ２５や駆動ＩＣ２６に信号を入出力させたり、電源電圧を供給したりするための端子であり、マザーボード等に半田部材を介して実装される。このリード部２４は、前記ベース部２２に固定されている。   FIGS. 1 and 2 show the structure of the transmission photochip 21 of the first embodiment constituting the optical link device of the present invention. The transmission photo chip 21 includes a package part 23 and a lead part 24 extending from the package part 23. The package portion 23 includes a rectangular base portion 22, an optical link element (LED) 25 mounted on the base portion 22, a drive circuit (driving IC) 26 that controls driving of the LED 25, and the base portion 22. And a transparent resin body 27 for sealing the whole. The lead part 24 is a terminal for inputting / outputting a signal to / from the LED 25 and the driving IC 26 and supplying a power supply voltage, and is mounted on a mother board or the like via a solder member. The lead portion 24 is fixed to the base portion 22.

前記ベース部２２は、液晶ポリマーやポリフタルアミド等の耐熱性樹脂材が使用され、前記リード部２４の一部をインサートモールド法によって固着成形される。前記耐熱性樹脂材は、車載等の高温環境化での使用や製造時におけるリフロー処理に耐えうるように、２６０℃以上の熱変形温度（Ｔｇ）が保証されているものが望ましい。   The base portion 22 is made of a heat-resistant resin material such as a liquid crystal polymer or polyphthalamide, and a part of the lead portion 24 is fixedly formed by an insert molding method. The heat-resistant resin material desirably has a heat distortion temperature (Tg) of 260 ° C. or higher so that it can withstand use in high-temperature environments such as in-vehicle use and reflow treatment during manufacturing.

前記リード部２４は、例えば、ＬＥＤ２５及び駆動ＩＣ２６に供給される共通のＶｃｃ，ＧＮＤと、ＬＥＤ２５への入力電圧Ｖｉｎ、その他のコントロール端子などから構成されている。このリード部２４は、導電率の高いりん青銅等で形成され、マザーボード等への実装形態に応じて高さを調節したり、折り曲げたりすることが容易になるように、薄板状に形成されている。また、このリード部２４は、前述したように、一端が前記ベース部２２と一体に固定され、他端が所定の長さを有してベース部２２から外方向に平行に突出して設けられる。なお、このリード部２４の長さや設置間隔は、規格によって決められている。   The lead portion 24 is composed of, for example, common Vcc and GND supplied to the LED 25 and the driving IC 26, an input voltage Vin to the LED 25, and other control terminals. The lead portion 24 is made of phosphor bronze or the like having high conductivity, and is formed in a thin plate shape so that the height can be easily adjusted or bent according to the mounting form on the mother board or the like. Yes. Further, as described above, one end of the lead portion 24 is fixed integrally with the base portion 22, and the other end has a predetermined length and is provided so as to protrude from the base portion 22 in parallel outward. The length and installation interval of the lead portion 24 are determined by standards.

前記ＬＥＤ２５は、アノード及びカソードからなる一対の素子電極部を有する赤色系の発光ダイオードで構成され、前記素子電極部の一方はベース部２２内の電極部２９上に表面実装され、他方はボンディングワイヤを介してベース部２２内にあるリード部２４の一端に接続される。前記駆動ＩＣ２６は、ベース部２２の表面に絶縁性接着剤を介して実装され、ボンディングワイヤを介して対応するリード部２４上の電極部２８と半田接続される。この駆動ＩＣ２６は、主に前記ＬＥＤ２５における発光制御や供給される電流値を調整する機能を有している。   The LED 25 is composed of a red light-emitting diode having a pair of element electrode parts including an anode and a cathode. One of the element electrode parts is surface-mounted on an electrode part 29 in the base part 22, and the other is a bonding wire. To one end of the lead portion 24 in the base portion 22. The drive IC 26 is mounted on the surface of the base portion 22 via an insulating adhesive, and is soldered to the corresponding electrode portion 28 on the lead portion 24 via a bonding wire. The drive IC 26 mainly has a function of controlling light emission in the LED 25 and adjusting a supplied current value.

前記ＬＥＤ２５及び駆動ＩＣ２６の実装が完了したベース部２２は、透明樹脂体２７によって気密封止される。この透明樹脂体２７は、前記ＬＥＤ２５と対向する部分がレンズ部２７ａとなっている。このレンズ部２７ａは、上面が平坦面で前記ＬＥＤ２５に対向する下面が凸状面として形成されている。この透明樹脂体２７の形成は、前記ベース部２２の上に、前記レンズ部２７ａをかたどった金型を装着し、この金型内に透明なエポキシ樹脂を充填するトランスファーモールド法によって行われる。前記ＬＥＤ２５から発せられた光は、前記レンズ部２７ａを介して集光された状態で上方に出射される。このため、一方向に対して指向性を持たせることができる。前記レンズ部２７ａの形状は、ＬＥＤ２５の焦点距離や光の強度等に応じて適宜設定される。   The base portion 22 on which the LED 25 and the driving IC 26 have been mounted is hermetically sealed with a transparent resin body 27. The transparent resin body 27 has a lens portion 27 a at a portion facing the LED 25. The lens portion 27a has a flat upper surface and a lower surface facing the LED 25 as a convex surface. The transparent resin body 27 is formed by a transfer molding method in which a mold having the lens part 27a is mounted on the base part 22, and a transparent epoxy resin is filled in the mold. The light emitted from the LED 25 is emitted upward while being condensed through the lens portion 27a. For this reason, directivity can be given to one direction. The shape of the lens portion 27a is appropriately set according to the focal length of the LED 25, the light intensity, and the like.

この第１実施形態の送信フォトチップ２１は、リード部２４を所定の間隔で配置させ、このリード部２４の一部を液晶ポリマー等の耐熱性樹脂材で固めて成形される。この成形はインサートモールド法によって行われる。そして、前記ベース部２２上に電極部２８，２９を蒸着形成した後、前記ＬＥＤ２５及び駆動ＩＣ２６を所定位置に実装し、ボンディングワイヤを介して所定の電極部２８，２９に半田接続する。この実装及び接続が終了した後、前記ベース部２２をレンズ部２７ａとなる箇所が形成された金型を用いて透明樹脂体２７を成形する。この透明樹脂体２７の成形は、トランスファーモールド法によって行われる。最後に、前記ベース部２２から外方向に延びるリード部２４の端部を所定の長さに切断する。以上の工程を経た後、外観や電気的特性等の試験が行われる。   The transmission photochip 21 of the first embodiment is formed by arranging lead portions 24 at a predetermined interval and fixing a part of the lead portions 24 with a heat-resistant resin material such as a liquid crystal polymer. This molding is performed by an insert molding method. Then, after the electrode portions 28 and 29 are formed on the base portion 22 by vapor deposition, the LED 25 and the driving IC 26 are mounted at predetermined positions and soldered to the predetermined electrode portions 28 and 29 via bonding wires. After this mounting and connection is completed, the transparent resin body 27 is molded using a mold in which the base portion 22 is formed with a portion that becomes the lens portion 27a. The transparent resin body 27 is molded by a transfer mold method. Finally, the end portion of the lead portion 24 extending outward from the base portion 22 is cut to a predetermined length. After going through the above steps, tests such as appearance and electrical characteristics are performed.

図３及び図４は上記構造による送信フォトチップ２１の実装形態を示したものである。図３に示したように、前記送信フォトチップ２１内のＬＥＤ２５から発せられる光の放射方向をマザーボード３０と平行となるように設定する場合は、前記リード部２４を適当な長さのところでＬ字状に折り曲げ、その折り曲げた端部をマザーボード３０上の電極パターン上に載置して半田接合される。また、図４に示したように、前記ＬＥＤ２５の発光方向を上向きに設定する場合は、前記リード部２４をコ字状に折り曲げ、その折り曲げた端部をマザーボード３０の電極パターン上に載置して半田接合される。この送信フォトチップ２１は、リード部２４が耐熱性樹脂材からなるベース部２２に固定された構造となっているので、リフロー処理による表面実装を安定且つ確実に行うことができる。   3 and 4 show a mounting form of the transmission photochip 21 having the above structure. As shown in FIG. 3, when the radiation direction of the light emitted from the LED 25 in the transmission photochip 21 is set to be parallel to the mother board 30, the lead portion 24 is L-shaped at an appropriate length. The bent end is placed on the electrode pattern on the mother board 30 and soldered. As shown in FIG. 4, when the light emitting direction of the LED 25 is set upward, the lead portion 24 is bent in a U shape, and the bent end portion is placed on the electrode pattern of the mother board 30. Soldered together. Since the transmission photochip 21 has a structure in which the lead portion 24 is fixed to the base portion 22 made of a heat-resistant resin material, surface mounting by reflow processing can be performed stably and reliably.

次に、本発明の光リンクデバイスを構成する第２実施形態の送信フォトチップ３１の構造を図５及び図６に示す。この送信フォトチップ３１は、耐熱性樹脂材からなるベース部３２、このベース部３２上を満たす透明樹脂体３９、この透明樹脂体３９を覆う透明成形体３７とからなるパッケージ部３３と、前記ベース部３２と共にインサートモールド成形によって固定されるリード部３４とで構成されている。前記ベース部３２は、ＬＥＤ２５や駆動ＩＣ２６が実装される底部３２ａと、この底部３２ａの外周部を囲う側壁部３２ｂとによって一体成形される。前記透明樹脂体３９は、前記側壁部３２ｂで囲われた内部を満たすようにして透明なエポキシ樹脂材を充填して成形される。また、この透明成形体３７は、透明なエポキシ樹脂やガラス等によって成形されたもので、ＬＥＤ２５に対応する位置にレンズ部３７ａが設けられる。この透明成形体３７には、樹脂注入部３８が厚み方向に貫通して設けられ、この樹脂注入部３８を通して前記透明樹脂体３９を成形するための樹脂材が充填される。   Next, FIGS. 5 and 6 show the structure of the transmission photochip 31 of the second embodiment constituting the optical link device of the present invention. The transmission photochip 31 includes a base portion 32 made of a heat-resistant resin material, a transparent resin body 39 filling the base portion 32, a package portion 33 made up of a transparent molded body 37 covering the transparent resin body 39, and the base The lead portion 34 is fixed together with the portion 32 by insert molding. The base portion 32 is integrally formed with a bottom portion 32a on which the LED 25 and the driving IC 26 are mounted, and a side wall portion 32b surrounding the outer periphery of the bottom portion 32a. The transparent resin body 39 is molded by filling a transparent epoxy resin material so as to fill the inside surrounded by the side wall portion 32b. The transparent molded body 37 is formed of a transparent epoxy resin, glass, or the like, and a lens portion 37a is provided at a position corresponding to the LED 25. The transparent molded body 37 is provided with a resin injection portion 38 penetrating in the thickness direction, and filled with a resin material for molding the transparent resin body 39 through the resin injection portion 38.

次に、本発明の光リンクデバイスを構成する第３実施形態の送信フォトチップ４１の構造を図７及び図８に示す。この送信フォトチップ４１は、耐熱性樹脂材からなるベース部４２、このベース部４２上に設けられる透明樹脂体４９、この透明樹脂体４９を覆う透明成形体４７とからなるパッケージ部４３と、前記ベース部４２と共にインサートモールド成形によって固定されるリード部４４とで構成されている。前記ベース部４２は、ＬＥＤ２５や駆動ＩＣ２６が実装される底部４２ａと、この底部４２ａの外周部を囲う四方の側壁部４２ｂとによって一体成形されると共に、前記各側壁部４２ｂの内周面に前記透明成形体４７を載置するためのつば部４８が設けられている。前記透明樹脂体４９は、側壁部４２ｂで囲われた内部を前記つば部４８の高さまで透明なエポキシ樹脂材を充填して成形される。前記透明成形体４７は、透明なエポキシ樹脂やガラス等によって成形されたもので、ＬＥＤ２５に対応する位置にレンズ部４７ａが設けられる。この透明成形体４７は、前記つば部４８を介して載置される。このようなつば部４８を設けたことによって、透明樹脂体４７をより安定した状態で設置することができる。なお、前記透明成形体４７のコーナ部等に開口部５０を設けることで、充填された余剰分の樹脂材を排出することができると共に、この排出された樹脂材によって透明成形体４７のコーナ部での固着をより強固にすることができる。   Next, the structure of the transmission photochip 41 of the third embodiment constituting the optical link device of the present invention is shown in FIGS. The transmission photochip 41 includes a package portion 43 including a base portion 42 made of a heat-resistant resin material, a transparent resin body 49 provided on the base portion 42, and a transparent molded body 47 covering the transparent resin body 49, The lead portion 44 is fixed together with the base portion 42 by insert molding. The base portion 42 is integrally formed by a bottom portion 42a on which the LED 25 and the driving IC 26 are mounted and four side wall portions 42b that surround the outer periphery of the bottom portion 42a, and is formed on the inner peripheral surface of each side wall portion 42b. A collar portion 48 for placing the transparent molded body 47 is provided. The transparent resin body 49 is molded by filling the inside surrounded by the side wall part 42 b with a transparent epoxy resin material up to the height of the collar part 48. The transparent molded body 47 is formed of a transparent epoxy resin, glass or the like, and a lens portion 47a is provided at a position corresponding to the LED 25. The transparent molded body 47 is placed via the collar portion 48. By providing such a flange portion 48, the transparent resin body 47 can be installed in a more stable state. In addition, by providing the opening part 50 in the corner part etc. of the said transparent molded object 47, while filling the excess resin material, the corner part of the transparent molded object 47 can be discharged | emitted by this discharged | emitted resin material. Can be more firmly fixed.

上記第２実施形態及び第３実施形態で示した構造の送信フォトチップ３１，４１によれば、ベース部３２，４２が側壁部３２ｂ，４２ｂを有して一体成形されているため、構造的にもより強固となり、熱変形が起きにくい。また、前記透明成形体３７，４７がベース部３２，４２と別体で形成され、前記側壁部３２ｂ，４２ｂを介して載置する構造であるので、前述したような樹脂材に限定されず、使用目的に応じて透明なガラス材等を用いて形成することも可能となる。   According to the transmission photochips 31 and 41 having the structure shown in the second and third embodiments, the base portions 32 and 42 are integrally formed with the side wall portions 32b and 42b. It becomes stronger and less susceptible to thermal deformation. In addition, since the transparent molded bodies 37 and 47 are formed separately from the base portions 32 and 42 and are placed via the side wall portions 32b and 42b, the transparent molded bodies 37 and 47 are not limited to the resin materials as described above. It can be formed using a transparent glass material or the like according to the purpose of use.

図９は、駆動ＩＣ２６の実装領域を一のリード部５４の一端に設け、他のリード部５５，５６，５７と共に、前記ベース部５２にインサートモールド成形によって固定させた構造の送信フォトチップ５１を示したものである。前記リード部５４は、実装される駆動ＩＣ２６の形状やサイズに合わせた実装部５４ａと、この実装部５４ａからパッケージ部５３の外周部に向けて延びる内部リード部５４ｂと、パッケージ部５３から外方向に延びる外部接続用の外部リード部５４ｃとで構成される。また、前記内部リード部５４ｂは、外部リード部５４ｃに対して幅狭に形成される。このように、前記内部リード部５４ｂを幅狭に形成することで、前記外部リード部５４ｃから伝導される熱が実装部５４ａに伝導しにくくなるので、直接実装されている駆動ＩＣ２６の熱による誤作動や破壊を有効に防止することができる。   FIG. 9 shows a transmission photochip 51 having a structure in which a mounting region of the driving IC 26 is provided at one end of one lead portion 54 and fixed to the base portion 52 together with the other lead portions 55, 56, 57 by insert molding. It is shown. The lead portion 54 includes a mounting portion 54 a that matches the shape and size of the drive IC 26 to be mounted, an internal lead portion 54 b that extends from the mounting portion 54 a toward the outer periphery of the package portion 53, and an outward direction from the package portion 53. And an external lead portion 54c for external connection extending to the outside. The internal lead portion 54b is formed narrower than the external lead portion 54c. In this way, by forming the internal lead portion 54b to be narrow, heat conducted from the external lead portion 54c is less likely to be conducted to the mounting portion 54a. Operation and destruction can be effectively prevented.

なお、説明は省略するが、上記実施形態で示した送信フォトチップと対で使用される受信フォトチップにあっては、前記ＬＥＤがフォトダイオード（ＰＤ）で構成され、駆動ＩＣは前記ＰＤの駆動を司る機能に置き換わる。ただし、前記ＰＤや駆動ＩＣが実装されるベース部については上記実施形態と同様に、耐熱性樹脂材が用いられ、インサートモールド法によってリード部が前記ベース部と一体に成形される。   Although explanation is omitted, in the reception photochip used in a pair with the transmission photochip shown in the above embodiment, the LED is composed of a photodiode (PD), and the drive IC is a drive of the PD. It replaces the function that controls However, a heat resistant resin material is used for the base portion on which the PD and the driving IC are mounted as in the above embodiment, and the lead portion is integrally formed with the base portion by an insert molding method.

本発明に係る第１実施形態の光リンクデバイスの平面図である。1 is a plan view of an optical link device according to a first embodiment of the present invention. 図１における光リンクデバイスの断面図である。It is sectional drawing of the optical link device in FIG. 図１における光リンクデバイスの第１の実装形態を示す断面図である。It is sectional drawing which shows the 1st mounting form of the optical link device in FIG. 図１における光リンクデバイスの第２の実装形態を示す断面図である。It is sectional drawing which shows the 2nd mounting form of the optical link device in FIG. 本発明に係る第２実施形態の光リンクデバイスの平面図である。It is a top view of the optical link device of 2nd Embodiment which concerns on this invention. 図５における光リンクデバイスの断面図である。It is sectional drawing of the optical link device in FIG. 本発明に係る第３実施形態の光リンクデバイスの平面図である。It is a top view of the optical link device of 3rd Embodiment which concerns on this invention. 図７における光リンクデバイスの断面図である。It is sectional drawing of the optical link device in FIG. 耐熱構造のリード部を用いた光リンクデバイスの平面図である。It is a top view of the optical link device using the lead part of a heat-resistant structure. 従来の光リンクデバイスの構成例を示す平面図である。It is a top view which shows the structural example of the conventional optical link device.

符号の説明Explanation of symbols

２１ 送信フォトチップ（光リンクデバイス）
２２ ベース部
２３ パッケージ部
２４ リード部
２５ ＬＥＤ（光リンク素子）
２６ 駆動ＩＣ（駆動回路）
２７ 透明樹脂体
２７ａ レンズ部
２８ 電極部
２９ 電極部
３０ マザーボード
21 Transmitting photochip (optical link device)
22 Base part 23 Package part 24 Lead part 25 LED (Optical link element)
26 Drive IC (Drive circuit)
27 Transparent resin body 27a Lens part 28 Electrode part 29 Electrode part 30 Motherboard

Claims (10)

光リンク素子及びこの光リンク素子を駆動する駆動回路が透明樹脂体によって封止されたパッケージ部と、このパッケージ部から延びる外部接続用のリード部とを備えた光リンクデバイスにおいて、
前記パッケージ部が、耐熱性のベース部と、このベース部上に実装される前記光リンク素子及び前記駆動回路を封止する透明樹脂体とを備え、前記ベース部に前記リード部が一体に固定されていることを特徴とする光リンクデバイス。 In an optical link device comprising an optical link element and a package part in which a drive circuit for driving the optical link element is sealed with a transparent resin body, and a lead part for external connection extending from the package part.
The package part includes a heat-resistant base part and a transparent resin body that seals the optical link element and the drive circuit mounted on the base part, and the lead part is integrally fixed to the base part. An optical link device. 前記リード部が前記ベース部と一体にインサートモールドによって固定される請求項１記載の光リンクデバイス。 The optical link device according to claim 1, wherein the lead portion is fixed integrally with the base portion by an insert mold. 前記ベース部は、耐熱変形温度が２６０度以上の耐熱性樹脂材によって形成される請求項１又は２記載の光リンクデバイス。 The optical link device according to claim 1, wherein the base portion is formed of a heat-resistant resin material having a heat-resistant deformation temperature of 260 ° C. or more. 前記耐熱性樹脂材は、液晶ポリマー、ポリフタルアミドである請求項３記載の光リンクデバイス。 4. The optical link device according to claim 3, wherein the heat resistant resin material is a liquid crystal polymer or polyphthalamide. 前記透明樹脂体の上面には、前記光リンク素子に対応する位置に凹設部が設けられ、この凹設部の底部にレンズ部が形成されている請求項１記載の光リンクデバイス。 The optical link device according to claim 1, wherein a concave portion is provided on a top surface of the transparent resin body at a position corresponding to the optical link element, and a lens portion is formed at a bottom portion of the concave portion. 前記ベース部が、底部と、この底部の外周部を囲う側壁部とで形成され、前記側壁部で囲まれた内部が前記透明樹脂体で封止される請求項１乃至３のいずれかに記載の光リンクデバイス。 The said base part is formed in the bottom part and the side wall part which surrounds the outer peripheral part of this bottom part, and the inside enclosed by the said side wall part is sealed with the said transparent resin body. Optical link device. 前記側壁部の上部に前記透明樹脂体を覆う透明成形体が配置される請求項６記載の光リンクデバイス。 The optical link device according to claim 6, wherein a transparent molded body that covers the transparent resin body is disposed on an upper portion of the side wall portion. 前記側壁部の上部に透明成形体が配置され、この透明樹脂体に設けられた樹脂注入部から前記側壁部で囲まれた内部に透明樹脂体が充填される請求項６記載の光リンクデバイス。 The optical link device according to claim 6, wherein a transparent molded body is disposed on an upper portion of the side wall portion, and a transparent resin body is filled from a resin injection portion provided in the transparent resin body into the inside surrounded by the side wall portion. 前記透明成形体の上面には、前記光リンク素子に対応する位置に凹設部が設けられ、この凹設部の底部にレンズ部が形成されている請求項７記載の光リンクデバイス。 The optical link device according to claim 7, wherein a concave portion is provided at a position corresponding to the optical link element on the upper surface of the transparent molded body, and a lens portion is formed at the bottom of the concave portion. 前記ベース部内に延びるリード部の一部にベース部の外部に延びるリード部より幅狭の部分が形成される請求項１記載の光リンクデバイス。 The optical link device according to claim 1, wherein a portion narrower than the lead portion extending outside the base portion is formed in a part of the lead portion extending into the base portion.
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