CN205723555U - A kind of pyroelectric infrared sensor of novel package structure - Google Patents
A kind of pyroelectric infrared sensor of novel package structure Download PDFInfo
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- CN205723555U CN205723555U CN201620298404.8U CN201620298404U CN205723555U CN 205723555 U CN205723555 U CN 205723555U CN 201620298404 U CN201620298404 U CN 201620298404U CN 205723555 U CN205723555 U CN 205723555U
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Abstract
The pyroelectric infrared sensor that the utility model discloses a kind of novel package structure includes the shell of the enclosed construction being made up of pipe cap and substrate, infrared optics optical filter, infrared-sensitive unit and signal processing circuit；Pipe cap surface configuration has the window that infrared optics optical filter uses, and pipe cap base or inside are convexly equipped with the frame that blocks of fixing substrate, form airtight receiving space between pipe cap and substrate；Substrate surface is provided with circuit and sensitivity unit support member, and infrared-sensitive unit is fixed on sensitive unit support member；Signal processing circuit is fixed on substrate, and electricity connects therewith, and signal processing circuit is junction field effect pipe or operational amplifier；Substrate surface is provided with pad, has downwardly extended multiple pin, composition one miniaturization, the pyroelectric infrared sensor of simple structure inside substrate.Simplifying structure and production technology, substrate uses metallized ceramic or epoxy resin pcb board, reduces product size and weight, reduces production and cost of labor.
Description
Technical field
The utility model relates to pyroelectric infrared sensor technical field, refers in particular to the pyroelectric infrared sensor of a kind of novel package structure.
Background technology
Pyroelectric infrared sensor is that one utilizes pyroelectric effect principle, the infrared radiation signal being sent human body or some animal, by filtering, is changed into the thermo-responsive detector of the signal of telecommunication after a series of actions such as amplification.
Pyroelectric infrared sensor on current market is all to use traditional material and structure fabrication, mainly there is pipe cap, base forms confined space, equipped with optical filter in the window on pipe cap surface, having infrared-sensitive unit, the support member of fixing infrared-sensitive unit in confined space, support member is fixed on the thereon being printed with circuit, thereon is fixed with FET, and between substrate and base, electricity connects.3 pins have been downwardly extended inside base.Its operation principle is will to be changed into faint voltage signal by the sensing of infrared-sensitive unit the infra-red radiation receiving, and carries out impedance transformation through FET or outwards export analog signal.
The base of existing sensor comprises substrate and base, fixes and loosely there will be electromagnetic interference phenomenon, complex manufacturing, inefficiency, be unfavorable for production line balance between substrate and base；Production cost and cost of labor are too high；And sensor bulk is excessive, it is difficult to adapt to Internet of Things miniaturization trend.
Content of the invention
The purpose of this utility model is to overcome the shortcoming and defect of prior art, provides a kind of while not affecting sensor performance, simple in construction, compact, the pyroelectric infrared sensor of the low novel package structure of production cost.
The utility model is achieved through the following technical solutions:
A kind of pyroelectric infrared sensor of novel package structure, including the shell of the enclosed construction being made up of pipe cap and substrate, infrared optics optical filter, infrared-sensitive unit and signal processing circuit；Pipe cap surface configuration has the window that infrared optics optical filter uses, and pipe cap base or inside are convexly equipped with the frame that blocks of fixing substrate, form airtight receiving space between pipe cap and substrate；Substrate surface is provided with circuit and sensitivity unit support member, and infrared-sensitive unit is fixed on sensitive unit support member；Signal processing circuit is fixed on substrate, and electricity connects therewith, signal processing circuit is junction field effect pipe or operational amplifier, by the ultra-weak electronic signal that sensitive for pyroelectricity unit discharges is converted to voltage/current signals, filtered, amplification etc. is embodied as simulation output after processing；Substrate surface is provided with pad, has downwardly extended multiple pin, composition one miniaturization, the pyroelectric infrared sensor of simple structure inside substrate.
As preferably, inside described pipe cap, fixing substrate blocks frame, for protruding edge/point.
As preferably, what substrate was fixed on described pipe cap base blocks frame, the edge being formed for base die casting.
As preferably, described pipe cap has at least one for the sign position indicating positioning.
As preferably, described substrate surface has electromagnetic shielding to process structure, by technique and pipe cap encapsulation such as bonding, SMT surface mount, or Reflow Soldering, parallel soldering and sealing, laser welding, it is achieved electromagnetic shielding.
As preferably, described substrate is epoxy resin pcb board or metallized ceramic substrate.
As preferably, described pin is the external pin that substrate surface pad metal via downwardly extended or welded formation, and can need to assemble according to interlock circuit.
As preferably, described infrared-sensitive unit is unit or polynary infrared-sensitive unit.
As preferably, described infrared optics optical filter surface evaporation has infrared anti-reflection film and by film；Described infrared optics optical filter is silica-based, germanium base, infrared glass base and saturating Infrared Thin Films base optical filter.
Compared with prior art, the beneficial effects of the utility model are: sensitive unit support member, and signal processing circuit is directly anchored on base plate, simplify structure and production technology, substrate uses metallized ceramic or epoxy resin pcb board, reduces product size and weight, reduces production and cost of labor, it is particularly well-suited to number, security protection, household electrical appliances, toy, and Internet of Things application in future, wide market.
Brief description
Below by embodiment, in conjunction with accompanying drawing, the utility model is further described.
Fig. 1 is the structural representation of the utility model embodiment 1-2；
Fig. 2 is the equivalent circuit theory figure of Fig. 1；
Fig. 3 is the structural representation of the utility model embodiment 3-4；
Fig. 4 is the schematic diagram of the utility model base plate；
The schematic diagram that Fig. 5-10 is the utility model tube cap structure；
1 is substrate, and 2 is signal processing chip module, and 3 is sensitive unit support member, and 4 is infrared-sensitive unit, and 5 is pipe cap, and 6 is infrared optics optical filter, and 7 is pin.
Detailed description of the invention
With specific embodiment, the utility model is described in detail below in conjunction with the accompanying drawings:
As Figure 1-10 shows, the pyroelectric infrared sensor of a kind of novel package structure includes the shell of the enclosed construction being made up of pipe cap 5 and substrate 1, infrared optics optical filter 6, infrared-sensitive unit 4, sensitive unit support member 3, signal processing circuit 2.Pipe cap 5 surface configuration has the window that infrared optics optical filter 6 uses.Forming airtight receiving space between pipe cap 5 and substrate 1, sensitive unit's support member 3 and signal processing circuit 2 are directly anchored on substrate 1, substrate 1 is printed with the circuit connecting each components and parts, has downwardly extended pin 7A/7B/7C bottom substrate 1.
Inside described pipe cap 5, fixing substrate 1 blocks frame (not shown), for protruding edge/point.What substrate was fixed on described pipe cap 5 base blocks frame (not shown), is the edge that the outside die casting in base is formed.Described base plate 1 is metallized ceramic substrate.Described base plate 1 is epoxy resin pcb board.Described pipe cap 5 and base plate 1 form closed structure.Described infrared optics optical filter 6 is that silica-based/germanium base/infrared glass base/saturating Infrared Thin Films base optical filter is coated with infrared anti-reflection film and by film.Described signal processing circuit 2 is FET/operational amplifier etc., and by the ultra-weak electronic signal that sensitive for pyroelectricity unit discharges is converted to voltage/current signals, filtered, amplification etc. realizes simulation output after processing.
Embodiment one:
As shown in Figure 1: the frame (not shown) that blocks of the internal fixing substrate 1 of pipe cap 5 is protruding edge/point, infrared optics optical filter 6 is for being that silica-based/germanium base/infrared glass base/saturating Infrared Thin Films base optical filter is coated with infrared anti-reflection film and by film, infrared optics optical filter 6 is embedded in pipe cap window, and fixes with resin glue.Signal processing circuit 2 is FET/operational amplifier etc., is directly anchored on substrate, and substrate 1 is metallized ceramic material, and surface printing has circuit.By bonding between pipe cap 5 and substrate 1, SMT surface mount, or Reflow Soldering, parallel soldering and sealing, the technique such as laser welding carries out airtight.Realize the purpose that structure simplifies.
Embodiment two:
As shown in Figure 1: the frame (not shown) that blocks of the internal fixing substrate 1 of pipe cap 5 is protruding edge/point, infrared optics optical filter 6 is for being that silica-based/germanium base/infrared glass base/saturating Infrared Thin Films base optical filter is coated with infrared anti-reflection film and by film, infrared optics optical filter 6 is embedded in pipe cap window, and fixes with resin glue.Signal processing circuit 2 is FET/operational amplifier etc., is directly anchored on substrate 1, and substrate 1 is epoxy resin pcb board, and surface printing has circuit.By bonding between pipe cap 5 and substrate 1, SMT surface mount, or Reflow Soldering, parallel soldering and sealing, the technique such as laser welding carries out airtight.Realize the purpose that structure simplifies.
Embodiment three:
As shown in Figure 3: what substrate 1 was fixed on pipe cap 5 base blocks frame (not shown), the edge being formed for the outside die casting in base, infrared optics optical filter 6 is for being that silica-based/germanium base/infrared glass base/saturating Infrared Thin Films base optical filter is coated with infrared anti-reflection film and by film, infrared optics optical filter 6 is embedded in pipe cap window, and fixes with resin glue.Signal processing circuit 2 is FET/operational amplifier etc., is directly anchored on substrate 1, and substrate 1 is metallized ceramic material, and surface printing has circuit.By bonding between pipe cap 5 and substrate 1, SMT surface mount, or Reflow Soldering, parallel soldering and sealing, the technique such as laser welding carries out airtight.Realize the purpose that structure simplifies.
Embodiment four:
As shown in Figure 3: what substrate 1 was fixed on pipe cap 5 base blocks frame (not shown), the edge being formed for the outside die casting in base, infrared optics optical filter 6 is for being that silica-based/germanium base/infrared glass base/saturating Infrared Thin Films base optical filter is coated with infrared anti-reflection film and by film, infrared optics optical filter 6 is embedded in pipe cap window, and fixes with resin glue.Signal processing circuit 2 is FET/operational amplifier etc., is directly anchored on substrate 1, and substrate 1 is epoxy resin pcb board, and surface printing has circuit.By bonding between pipe cap 5 and substrate 1, SMT surface mount, or Reflow Soldering, parallel soldering and sealing, the technique such as laser welding carries out airtight.Realize the purpose that structure simplifies.
Above-described embodiment, is only four embodiments of the present utility model, is not for limiting of the present utility model enforcement and interest field, all technical schemes identical or equivalent with the utility model claim content, all should include in protection domain of the present utility model.
Claims (9)
1. the pyroelectric infrared sensor of a novel package structure, it is characterised in that: include the shell of the enclosed construction being made up of pipe cap and substrate, infrared optics optical filter, infrared-sensitive unit and signal processing circuit；Pipe cap surface configuration has the window that infrared optics optical filter uses, and pipe cap base or inside are convexly equipped with the frame that blocks of fixing substrate, form airtight receiving space between pipe cap and substrate；Substrate surface is provided with circuit and sensitivity unit support member, and infrared-sensitive unit is fixed on sensitive unit support member；Signal processing circuit is fixed on substrate, and electricity connects therewith, and signal processing circuit is junction field effect pipe or operational amplifier；Substrate surface is provided with pad, has downwardly extended multiple pin inside substrate.
2. the pyroelectric infrared sensor of novel package structure according to claim 1, it is characterised in that: inside described pipe cap, fixing substrate blocks frame, for protruding edge/point.
3. the pyroelectric infrared sensor of novel package structure according to claim 1, it is characterised in that: what substrate was fixed on described pipe cap base blocks frame, the edge being formed for base die casting.
4. the pyroelectric infrared sensor of novel package structure according to claim 1, it is characterised in that: described pipe cap has at least one for the sign position indicating positioning.
5. the pyroelectric infrared sensor of novel package structure according to claim 1, it is characterised in that: described substrate surface has electromagnetic shielding to process structure.
6. the pyroelectric infrared sensor of novel package structure according to claim 1, it is characterised in that: described substrate is epoxy resin pcb board or metallized ceramic substrate.
7. the pyroelectric infrared sensor of novel package structure according to claim 1, it is characterised in that: described pin is the external pin that substrate surface pad metal via downwardly extended or welded formation.
8. the pyroelectric infrared sensor of novel package structure according to claim 1, it is characterised in that: described infrared-sensitive unit is unit or polynary infrared-sensitive unit.
9. the pyroelectric infrared sensor of novel package structure according to claim 1, it is characterised in that: described infrared optics optical filter surface evaporation has infrared anti-reflection film and by film；Described infrared optics optical filter is silica-based, germanium base, infrared glass base and saturating Infrared Thin Films base optical filter.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201620298404.8U CN205723555U (en) | 2016-04-12 | 2016-04-12 | A kind of pyroelectric infrared sensor of novel package structure |
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| CN201620298404.8U CN205723555U (en) | 2016-04-12 | 2016-04-12 | A kind of pyroelectric infrared sensor of novel package structure |
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| CN205723555U true CN205723555U (en) | 2016-11-23 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106679823A (en) * | 2016-12-08 | 2017-05-17 | 南阳森霸光电股份有限公司 | Pyroelectric infrared sensor and manufacturing method thereof |
| CN108645521A (en) * | 2018-05-09 | 2018-10-12 | 东莞传晟光电有限公司 | A kind of pyroelectric sensor |
| CN112420913A (en) * | 2020-10-10 | 2021-02-26 | 杭州敏和光电子技术有限公司 | Packaging structure applied to infrared sensor and packaging method of infrared sensor |
| CN113270788A (en) * | 2021-06-01 | 2021-08-17 | 江苏索尔思通信科技有限公司 | TO packaging structure, tube cap, optical device and packaging method |
-
2016
- 2016-04-12 CN CN201620298404.8U patent/CN205723555U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106679823A (en) * | 2016-12-08 | 2017-05-17 | 南阳森霸光电股份有限公司 | Pyroelectric infrared sensor and manufacturing method thereof |
| CN106679823B (en) * | 2016-12-08 | 2023-08-15 | 森霸传感科技股份有限公司 | Pyroelectric infrared sensor and manufacturing method thereof |
| CN108645521A (en) * | 2018-05-09 | 2018-10-12 | 东莞传晟光电有限公司 | A kind of pyroelectric sensor |
| CN112420913A (en) * | 2020-10-10 | 2021-02-26 | 杭州敏和光电子技术有限公司 | Packaging structure applied to infrared sensor and packaging method of infrared sensor |
| CN113270788A (en) * | 2021-06-01 | 2021-08-17 | 江苏索尔思通信科技有限公司 | TO packaging structure, tube cap, optical device and packaging method |
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Address after: 473300 Sen Ba Industrial Park, Xiangshan Road, Nanyang, Henan Patentee after: Ssba sensing Polytron Technologies Inc Address before: 473300 Sen Ba Industrial Park, Xiangshan Road, Nanyang, Henan Patentee before: NANYANG SENBA OPTICAL ELECTRONIC CO., LTD. |
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| CP01 | Change in the name or title of a patent holder |