CN106679823A - Pyroelectric infrared sensor and manufacturing method thereof - Google Patents
Pyroelectric infrared sensor and manufacturing method thereof Download PDFInfo
- Publication number
- CN106679823A CN106679823A CN201611119547.9A CN201611119547A CN106679823A CN 106679823 A CN106679823 A CN 106679823A CN 201611119547 A CN201611119547 A CN 201611119547A CN 106679823 A CN106679823 A CN 106679823A
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- Prior art keywords
- pipe cap
- base
- stepped hole
- infrared sensor
- hole
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- 238000004519 manufacturing process Methods 0.000 title abstract description 11
- 230000003287 optical effect Effects 0.000 claims abstract description 48
- 239000000565 sealant Substances 0.000 claims abstract description 30
- 239000000463 material Substances 0.000 claims abstract description 5
- 239000012530 fluid Substances 0.000 claims description 29
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 28
- 239000002861 polymer material Substances 0.000 claims description 19
- 229910052757 nitrogen Inorganic materials 0.000 claims description 14
- 229920002635 polyurethane Polymers 0.000 claims description 14
- 239000004814 polyurethane Substances 0.000 claims description 14
- 238000002360 preparation method Methods 0.000 claims description 9
- 238000005476 soldering Methods 0.000 claims description 8
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 7
- 229910000838 Al alloy Inorganic materials 0.000 claims description 7
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 7
- 239000000956 alloy Substances 0.000 claims description 7
- 238000002513 implantation Methods 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 7
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 7
- 238000010276 construction Methods 0.000 claims description 6
- 230000005611 electricity Effects 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims 2
- 229910021529 ammonia Inorganic materials 0.000 claims 1
- 238000007664 blowing Methods 0.000 claims 1
- 235000010985 glycerol esters of wood rosin Nutrition 0.000 claims 1
- 239000004927 clay Substances 0.000 description 12
- 238000004891 communication Methods 0.000 description 10
- 239000010408 film Substances 0.000 description 10
- 239000000758 substrate Substances 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 229910052732 germanium Inorganic materials 0.000 description 5
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 239000004588 polyurethane sealant Substances 0.000 description 5
- 230000000644 propagated effect Effects 0.000 description 5
- 238000009738 saturating Methods 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000003854 Surface Print Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/0205—Mechanical elements; Supports for optical elements
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Radiation Pyrometers (AREA)
Abstract
The invention discloses a pyroelectric infrared sensor and a manufacturing method thereof and relates to the field of sensor manufacturing. The sensor comprises a pipe cap, and a window is formed on the top end of the pipe cap, near the middle position, and an optical filter is arranged at the window. A Fresnel lens is disposed on the outer side of the pipe cap, close to the upper end, in a sleeving mode, a stepped hole is formed in the inner wall of an opening at the lower end of the pipe cap, and a hole shoulder of the stepped hole is downward and is located on the same plane. The lower end face of the hole shoulder is provided with a layer of soft high-molecular material, a base is arranged in the stepped hole at the lower end of the soft high-molecular material, and a sealant is arranged between the outer edge of the base and the inner wall of the stepped hole. The base and the pipe cap jointly define a closed structure, which constitutes a basic outer package, the product is simple in manufacturing method, and has a better anti-interference performance.
Description
Technical field
The present invention relates to pyroelectric infrared sensor encapsulation technology field, specially a kind of heat for human motion sensing
Release electric infrared sensor and preparation method thereof.
Background technology
Pyroelectric infrared sensor and rpyroelectric infrared sensing module on current market are all using conventional package technique
Make.As shown in figure 1, including the base 8 and pipe cap 3 to form enclosed construction, a Fresnel is installed on the outside of enclosed construction
Lens 1, post infrared optics optical filter 2 at the upper surface window of the pipe cap 3, it is quick to be provided with infrared optics in the enclosed construction
Sensing unit 4 and the support member 6 of the infrared optics sensing element 4 is fixed, in infrared optics sensing element 4 and support member 6
There is the substrate 7 of electronic device 5 and fixed electronic device 5 lower section, and being printed with substrate 7 makes the circuit of each component electrical connection,
Three pins 9a, 9b, 9c are extended downwardly inside base 8, electricity has been realized using Reflow Soldering mode between the base 8 and substrate 7
Gas is connected, and is welded using stored energy welding mode between the pipe cap 3 and base 8, and the precision requirement to frock clamp is higher, production
Complex process, if welding condition control it is improper if, weld strength be unable to reach requirement, air-tightness it cannot be guaranteed that；And
And it is relatively costly, the package area and volume of rpyroelectric infrared sensing module receive many limitations, suitable for application in can take
On band product.
The content of the invention
A kind of shortcoming and defect it is an object of the invention to overcome prior art, there is provided pyroelectric infrared sensor, should
Production method is simple, and with preferable interference free performance.
The present invention is achieved through the following technical solutions：A kind of pyroelectric infrared sensor, including pipe cap, the pipe
Cap upper end is provided with window near centre position, and optical filter is provided with the window, and the pipe cap is equipped near upper end outer sheath
Fresnel Lenses, the pipe cap lower ending opening, and base is provided with opening, the base surrounds a closing jointly with pipe cap
Structure, is provided with electronic device in the enclosed construction, the electronic device is arranged on base, is printed with the base
Circuit, the electronic device is electrically connected with circuit, and the base lower end is provided with pin, and the pin is electrically connected with circuit, institute
State and support column is additionally provided with closing space, the support column lower end is connected with base, upper end is provided with the sensitive unit of infrared optics
Part, the infrared optics sensing element is electrically connected with circuit, and the inwall at the pipe cap lower ending opening is set to stepped hole, described
The hole shoulder of stepped hole is provided with one layer of soft polymer material downwards and in being generally aligned in the same plane on the lower surface of the hole shoulder,
Base is provided with the stepped hole of the soft polymer material lower end, is provided between the base outer rim and stepped hole inwall
Fluid sealant.
Preferably, the soft macromolecular material of the matter is polyurethane clay.
Preferably, it is tightly connected between the pin and base.
Preferably, the base is pcb board, and surface printing has circuit thereon, and lower surface is printed with for the logical of antistatic
Road.
Preferably, the pipe cap is made up of aluminum alloy materials, and it is tested by pressure seal, and described test pressure is
1.3~1.5MPa.
Preferably, air pressure is 0.7~0.85MPa in the sealing structure, is tightly connected between the optical filter and pipe cap.
Preferably, filling nitrogen in the sealing structure.
The preparation method of pyroelectric infrared sensor, comprises the following steps：
The first step, prepares pipe cap, then polyurethane adhesive mash is overlayed at the stepped hole of pipe cap, and smearing thickness is 1~1.5mm.
Second step, prepares base, in base upper surface printed circuit, and path is printed in its lower surface, by electronic device
It is connected into circuit, and it is fixed, print path in base lower surface.
3rd step, support column is fixed in the base upper surface obtained by second step, holds fixed infrared optics quick on the support columns
Sensing unit, 3 downward through holes are outputed in base upper surface, and rosin is instilled in through hole, then insert in through hole pin
And carry out soldering.
4th step, base obtained in the 3rd step is put into the stepped hole of pipe cap, and is extruded to pipe cap direction, squeeze pressure
It is 10~15N, continues 3~5s.
5th step, the interior implantation temperature in the space surrounded to pipe cap is 60oC~80oThe nitrogen of C, filters infrared optics after 1s
Mating plate is arranged at the window of pipe cap, and coats fluid sealant, and then blow low temperature dry air to pipe cap lowers the temperature to it, blows
A length of 8~10s when sending.
6th step, base and pipe cap junction to the 5th step products obtained therefrom carry out embedding treatment, 30min are placed, at it
Pipe cap is qualified after tested near upper end position outside suit Fresnel Lenses, both obtains finished product pyroelectric infrared sensor.
Compared with prior art, the beneficial effects of the present invention are：1st, the material of pipe cap and base uses metal and pcb board
It is used in combination, it is to avoid the stored energy welding of whole use metal tapes or other sealing Weldings, production technology simplify.2nd, it is not required to
Complicated production process is wanted, without using accurate production board, easy fitted during encapsulation.3rd, the use of base is reduced in addition,
Reduce production cost.4th, base dimensions reduce, and package area reduces, production cost reduction.5th, pipe cap and base pass through embedding
Technique cohered with sealing, it is easy to operate, it is with low cost.
Brief description of the drawings
Fig. 1 is the structural representation of traditional pyroelectric infrared sensor；
Fig. 2 is encapsulating structure schematic diagram of the invention；
Fig. 3 is main view generalized section of the invention；
Fig. 4 is partial cutaway schematic at A.
1 is Fresnel Lenses, and 2 is optical filter, and 3 is pipe cap, and 4 is infrared optics sensing element, and 5 is electronic device, and 6 is branch
Support member, 7 is base, and 8A/8B/8C is pin, and 9 is polyurethane clay, and 10 is first raised, and 11 is second raised.
Specific embodiment
It is next with specific embodiment below in conjunction with the accompanying drawings that the present invention is described in detail：
The pyroelectric infrared sensor as shown in Figure 2, Figure 3 and Figure 4 of embodiment 1, including pipe cap 3, pipe cap 3 is by aluminum alloy materials
It is made, it is tested by pressure seal, and test pressure is 1.5MPa, it is ensured that the side wall of pipe cap 3 is not in that crack, stomata etc. lack
Fall into, the upper end of pipe cap 3 is provided with window near centre position, and window is provided with step, the upper surface of step on the inwall of lower end
In being generally aligned in the same plane, optical filter 2 is provided with the window of step upper end, optical filter 2 is infrared optics optical filter, and it can be
Silicon substrate, germanium base, infrared glass base, saturating Infrared Thin Films base optical filter, and one layer of infrared anti-reflection film and cut film are coated with, so as to dock
The radiated wave of receipts is purified, and optical filter 2 is tightly connected by fluid sealant with window inwall and step upper surface, and fluid sealant is selected
Polyurethane sealant, pipe cap 3 is also set with Fresnel Lenses 1 near upper end outside, and pipe cap 3 is provided with first near lower end
Raised 10, Fresnel Lenses 1 is also equipped with the second projection 11 near lower end position, and the second raised 11 lower end is provided with opening, the
One raised 10 is located in opening, so that pipe cap 3 is not relatively rotated with Fresnel Lenses 1, convenient connection.
Inwall at the lower ending opening of pipe cap 3 is set to stepped hole, and the hole shoulder of the stepped hole is downward and is generally aligned in the same plane
It is interior, one layer of soft polymer material 9 is provided with the lower surface of hole shoulder, set in the stepped hole of the lower end of soft polymer material 9
There is base 7, base 7 is set to pcb board, its upper surface is printed with circuit, the upper surface of base 3 is further fixed on electronic device 5, electronics
Device 5 is connected into circuit, and the upper surface of base 7 is further fixed on support column 6 near centre position, and the upper end of support column 6 is fixed with infrared
Optical sensing element 4, conducting element is provided with support column 4, so that infrared optics sensing element 4 and circuit communication, base 7
Fluid sealant is provided between outer rim and stepped hole inwall to be connected and sealed, soft polymer material 9 selects polyurethane clay, its
It is prevented from that fluid sealant is pressed into the space that pipe cap 3 is surrounded with base 7 in embedding.
The upper surface of base 7 is provided with three downward through holes, and pin 8, respectively the first pin 8a, second are coated with through hole
Pin 8b, the 3rd pin 8c, the lower end of pin 8 are extended to outside base 7, upper end and circuit communication, so that the product that the present invention is provided
Product can carry out data exchange with other equipment.
The lower surface of base 7 is also printed with path, and path is electrically connected with pipe cap 3, so as to form screen layer, reduces the side of pipe cap 3
Interference of the electromagnetic wave in face to the internal circuit of pipe cap 3.
Nitrogen is filled with the confined space that base 7, pipe cap 3 and optical filter 2 are surrounded jointly, and its air pressure is less than normality
Under atmospheric pressure, be prevented from the oxidation of each part, improve the environment that infrared ray is propagated.
The preparation method of the product that the present invention is provided is as follows：
The first step, prepares pipe cap 3, then polyurethane clay 9 is coated at the stepped hole of pipe cap, and coating thickness is 1~1.5mm.
Second step, prepares base 7, in the upper surface printed circuit of base 7, and path is printed in its lower surface, by electronics device
Part 5 is connected into circuit, and fixed, and path is printed in the lower surface of base 7.
3rd step, support column 6 is fixed in the base upper surface obtained by second step, holds fixed infrared optics quick on the support columns
Sensing unit 4, three downward through holes are outputed in the upper surface of base 7, and rosin is instilled in through hole, and pin 8 then is inserted into logical
In hole and carry out soldering.
4th step, base obtained in the 3rd step is put into the stepped hole of pipe cap 3, and is extruded to the direction of pipe cap 3, extruding pressure
Power is 10N, continues 3s.
5th step, the interior implantation temperature in the space surrounded to pipe cap 3 is 80oThe nitrogen of C, by infrared optics optical filter after 1s
2 are arranged at the window of pipe cap, and coat fluid sealant, and then blow low temperature dry air to pipe cap lowers the temperature to it, blows
Shi Changwei 10s.Low temperature dry air temperature is 5oC, quickly can lower the temperature to pipe cap 3 and its annex, it is to avoid its inside
Electric elements are damaged.
6th step, base 7 and the junction of pipe cap 3 to the 5th step products obtained therefrom carry out embedding treatment, place 30min,
Its pipe cap is qualified after tested near upper end position outside suit Fresnel Lenses 1, both obtains finished product pyroelectric infrared sensor.
The present embodiment products obtained therefrom parameter sees attached list 1
The pyroelectric infrared sensor as shown in Figure 2, Figure 3 and Figure 4 of embodiment 2, including pipe cap 3, pipe cap 3 is by aluminum alloy materials
It is made, it is tested by pressure seal, and test pressure is 1.5MPa, it is ensured that the side wall of pipe cap 3 is not in that crack, stomata etc. lack
Fall into, the upper end of pipe cap 3 is provided with window near centre position, and window is provided with step, the upper surface of step on the inwall of lower end
In being generally aligned in the same plane, optical filter 2 is provided with the window of step upper end, optical filter 2 is infrared optics optical filter, and it can be
Silicon substrate, germanium base, infrared glass base, saturating Infrared Thin Films base optical filter, and one layer of infrared anti-reflection film and cut film are coated with, so as to dock
The radiated wave of receipts is purified, and optical filter 2 is tightly connected by fluid sealant with window inwall and step upper surface, and fluid sealant is selected
Polyurethane sealant, pipe cap 3 is also set with Fresnel Lenses 1 near upper end outside, and pipe cap 3 is provided with first near lower end
Raised 10, Fresnel Lenses 1 is also equipped with the second projection 11 near lower end position, and the second raised 11 lower end is provided with opening, the
One raised 10 is located in opening, so that pipe cap 3 is not relatively rotated with Fresnel Lenses 1, convenient connection.
Inwall at the lower ending opening of pipe cap 3 is set to stepped hole, and the hole shoulder of the stepped hole is downward and is generally aligned in the same plane
It is interior, one layer of soft polymer material 9 is provided with the lower surface of hole shoulder, set in the stepped hole of the lower end of soft polymer material 9
There is base 7, base 7 is set to pcb board, its upper surface is printed with circuit, the upper surface of base 3 is further fixed on electronic device 5, electronics
Device 5 is connected into circuit, and the upper surface of base 7 is further fixed on support column 6 near centre position, and the upper end of support column 6 is fixed with infrared
Optical sensing element 4, conducting element is provided with support column 4, so that infrared optics sensing element 4 and circuit communication, base 7
Fluid sealant is provided between outer rim and stepped hole inwall to be connected and sealed, soft polymer material 9 selects polyurethane clay, its
It is prevented from that fluid sealant is pressed into the space that pipe cap 3 is surrounded with base 7 in embedding.
The upper surface of base 7 is provided with three downward through holes, and pin 8, respectively the first pin 8a, second are coated with through hole
Pin 8b, the 3rd pin 8c, the lower end of pin 8 are extended to outside base 7, upper end and circuit communication, so that the product that the present invention is provided
Product can carry out data exchange with other equipment.
The lower surface of base 7 is also printed with path, and path is electrically connected with pipe cap 3, so as to form screen layer, reduces the side of pipe cap 3
Interference of the electromagnetic wave in face to the internal circuit of pipe cap 3.
Nitrogen, and its air pressure subatmospheric are filled with the confined space that base 7, pipe cap 3 and optical filter 2 are surrounded jointly
By force, each part oxidation is prevented from, the environment that infrared ray is propagated is improved.
The preparation method of the product that the present invention is provided is as follows：
The first step, prepares pipe cap 3, then polyurethane clay 9 is coated at the stepped hole of pipe cap, and coating thickness is 1~1.5mm.
Second step, prepares base 7, in the upper surface printed circuit of base 7, and path is printed in its lower surface, by electronics device
Part 5 is connected into circuit, and fixed, and path is printed in the lower surface of base 7.
3rd step, support column 6 is fixed in the base upper surface obtained by second step, holds fixed infrared optics quick on the support columns
Sensing unit 4, three downward through holes are outputed in the upper surface of base 7, and rosin is instilled in through hole, and pin 8 then is inserted into logical
In hole and carry out soldering.
4th step, base obtained in the 3rd step is put into the stepped hole of pipe cap 3, and is extruded to the direction of pipe cap 3, extruding pressure
Power is 10N, continues 3s.
5th step, the interior implantation temperature in the space surrounded to pipe cap 3 is 75oThe nitrogen of C, by infrared optics optical filter after 1s
2 are arranged at the window of pipe cap, and coat fluid sealant, and then blow low temperature dry air to pipe cap lowers the temperature to it, blows
Shi Changwei 9s.Low temperature dry air temperature is 5oC, quickly can lower the temperature to pipe cap 3 and its annex, it is to avoid its internal electricity
Device component wear.
6th step, base 7 and the junction of pipe cap 3 to the 5th step products obtained therefrom carry out embedding treatment, place 30min,
Its pipe cap is qualified after tested near upper end position outside suit Fresnel Lenses 1, both obtains finished product pyroelectric infrared sensor.
The pyroelectric infrared sensor as shown in Figure 2, Figure 3 and Figure 4 of embodiment 3, including pipe cap 3, pipe cap 3 is by aluminium alloy
Material is made, and it is tested by pressure seal, and test pressure is 1.5MPa, it is ensured that the side wall of pipe cap 3 is not in crack, stomata
Etc. defect, the upper end of pipe cap 3 is provided with window near centre position, and window is provided with step on the inwall of lower end, step it is upper
In surface is generally aligned in the same plane, optical filter 2 is provided with the window of step upper end, optical filter 2 is infrared optics optical filter, and it can
To be silicon substrate, germanium base, infrared glass base, saturating Infrared Thin Films base optical filter, and one layer of infrared anti-reflection film and cut film are coated with, so that
Radiated wave to receiving is purified, and optical filter 2 is tightly connected by fluid sealant with window inwall and step upper surface, fluid sealant
From polyurethane sealant, pipe cap 3 is also set with Fresnel Lenses 1 near upper end outside, and pipe cap 3 is provided near lower end
First projection 10, Fresnel Lenses 1 is also equipped with the second projection 11 near lower end position, and the second raised 11 lower end is provided with out
Mouthful, first raised 10 is located in opening, so that pipe cap 3 is not relatively rotated with Fresnel Lenses 1, convenient connection.
Inwall at the lower ending opening of pipe cap 3 is set to stepped hole, and the hole shoulder of the stepped hole is downward and is generally aligned in the same plane
It is interior, one layer of soft polymer material 9 is provided with the lower surface of hole shoulder, set in the stepped hole of the lower end of soft polymer material 9
There is base 7, base 7 is set to pcb board, its upper surface is printed with circuit, the upper surface of base 3 is further fixed on electronic device 5, electronics
Device 5 is connected into circuit, and the upper surface of base 7 is further fixed on support column 6 near centre position, and the upper end of support column 6 is fixed with infrared
Optical sensing element 4, conducting element is provided with support column 4, so that infrared optics sensing element 4 and circuit communication, base 7
Fluid sealant is provided between outer rim and stepped hole inwall to be connected and sealed, soft polymer material 9 selects polyurethane clay, its
It is prevented from that fluid sealant is pressed into the space that pipe cap 3 is surrounded with base 7 in embedding.
The upper surface of base 7 is provided with three downward through holes, and pin 8, respectively the first pin 8a, second are coated with through hole
Pin 8b, the 3rd pin 8c, the lower end of pin 8 are extended to outside base 7, upper end and circuit communication, so that the product that the present invention is provided
Product can carry out data exchange with other equipment.
The lower surface of base 7 is also printed with path, and path is electrically connected with pipe cap 3, so as to form screen layer, reduces the side of pipe cap 3
Interference of the electromagnetic wave in face to the internal circuit of pipe cap 3.
Nitrogen, and its air pressure subatmospheric are filled with the confined space that base 7, pipe cap 3 and optical filter 2 are surrounded jointly
By force, each part oxidation is prevented from, the environment that infrared ray is propagated is improved.
The preparation method of the product that the present invention is provided is as follows：
The first step, prepares pipe cap 3, then polyurethane clay 9 is coated at the stepped hole of pipe cap, and coating thickness is 1~1.5mm.
Second step, prepares base 7, in the upper surface printed circuit of base 7, and path is printed in its lower surface, by electronics device
Part 5 is connected into circuit, and fixed, and path is printed in the lower surface of base 7.
3rd step, support column 6 is fixed in the base upper surface obtained by second step, holds fixed infrared optics quick on the support columns
Sensing unit 4, three downward through holes are outputed in the upper surface of base 7, and rosin is instilled in through hole, and pin 8 then is inserted into logical
In hole and carry out soldering.
4th step, base obtained in the 3rd step is put into the stepped hole of pipe cap 3, and is extruded to the direction of pipe cap 3, extruding pressure
Power is 10N, continues 3s.
5th step, the interior implantation temperature in the space surrounded to pipe cap 3 is 70oThe nitrogen of C, by infrared optics optical filter after 1s
2 are arranged at the window of pipe cap, and coat fluid sealant, and then blow low temperature dry air to pipe cap lowers the temperature to it, blows
Shi Changwei 9s.Low temperature dry air temperature is 5oC, quickly can lower the temperature to pipe cap 3 and its annex, it is to avoid its internal electricity
Device component wear.
6th step, base 7 and the junction of pipe cap 3 to the 5th step products obtained therefrom carry out embedding treatment, place 30min,
Its pipe cap is qualified after tested near upper end position outside suit Fresnel Lenses 1, both obtains finished product pyroelectric infrared sensor.
The pyroelectric infrared sensor as shown in Figure 2, Figure 3 and Figure 4 of embodiment 4, including pipe cap 3, pipe cap 3 is by aluminium alloy
Material is made, and it is tested by pressure seal, and test pressure is 1.5MPa, it is ensured that the side wall of pipe cap 3 is not in crack, stomata
Etc. defect, the upper end of pipe cap 3 is provided with window near centre position, and window is provided with step on the inwall of lower end, step it is upper
In surface is generally aligned in the same plane, optical filter 2 is provided with the window of step upper end, optical filter 2 is infrared optics optical filter, and it can
To be silicon substrate, germanium base, infrared glass base, saturating Infrared Thin Films base optical filter, and one layer of infrared anti-reflection film and cut film are coated with, so that
Radiated wave to receiving is purified, and optical filter 2 is tightly connected by fluid sealant with window inwall and step upper surface, fluid sealant
From polyurethane sealant, pipe cap 3 is also set with Fresnel Lenses 1 near upper end outside, and pipe cap 3 is provided near lower end
First projection 10, Fresnel Lenses 1 is also equipped with the second projection 11 near lower end position, and the second raised 11 lower end is provided with out
Mouthful, first raised 10 is located in opening, so that pipe cap 3 is not relatively rotated with Fresnel Lenses 1, convenient connection.
Inwall at the lower ending opening of pipe cap 3 is set to stepped hole, and the hole shoulder of the stepped hole is downward and is generally aligned in the same plane
It is interior, one layer of soft polymer material 9 is provided with the lower surface of hole shoulder, set in the stepped hole of the lower end of soft polymer material 9
There is base 7, base 7 is set to pcb board, its upper surface is printed with circuit, the upper surface of base 3 is further fixed on electronic device 5, electronics
Device 5 is connected into circuit, and the upper surface of base 7 is further fixed on support column 6 near centre position, and the upper end of support column 6 is fixed with infrared
Optical sensing element 4, conducting element is provided with support column 4, so that infrared optics sensing element 4 and circuit communication, base 7
Fluid sealant is provided between outer rim and stepped hole inwall to be connected and sealed, soft polymer material 9 selects polyurethane clay, its
It is prevented from that fluid sealant is pressed into the space that pipe cap 3 is surrounded with base 7 in embedding.
The upper surface of base 7 is provided with three downward through holes, and pin 8, respectively the first pin 8a, second are coated with through hole
Pin 8b, the 3rd pin 8c, the lower end of pin 8 are extended to outside base 7, upper end and circuit communication, so that the product that the present invention is provided
Product can carry out data exchange with other equipment.
The lower surface of base 7 is also printed with path, and path is electrically connected with pipe cap 3, so as to form screen layer, reduces the side of pipe cap 3
Interference of the electromagnetic wave in face to the internal circuit of pipe cap 3.
Nitrogen, and its air pressure are filled with the confined space that base 7, pipe cap 3 and optical filter 2 are surrounded jointly less than under normality
Atmospheric pressure, be prevented from the oxidation of each part, improve the environment that infrared ray is propagated.
The preparation method of the product that the present invention is provided is as follows：
The first step, prepares pipe cap 3, then polyurethane clay 9 is coated at the stepped hole of pipe cap, and coating thickness is 1~1.5mm.
Second step, prepares base 7, in the upper surface printed circuit of base 7, and path is printed in its lower surface, by electronics device
Part 5 is connected into circuit, and fixed, and path is printed in the lower surface of base 7.
3rd step, support column 6 is fixed in the base upper surface obtained by second step, holds fixed infrared optics quick on the support columns
Sensing unit 4, three downward through holes are outputed in the upper surface of base 7, and rosin is instilled in through hole, and pin 8 then is inserted into logical
In hole and carry out soldering.
4th step, base obtained in the 3rd step is put into the stepped hole of pipe cap 3, and is extruded to the direction of pipe cap 3, extruding pressure
Power is 10N, continues 3s.
5th step, the interior implantation temperature in the space surrounded to pipe cap 3 is 65oThe nitrogen of C, by infrared optics optical filter after 1s
2 are arranged at the window of pipe cap, and coat fluid sealant, and then blow low temperature dry air to pipe cap lowers the temperature to it, blows
Shi Changwei 8s.Low temperature dry air temperature is 5oC, quickly can lower the temperature to pipe cap 3 and its annex, it is to avoid its internal electricity
Device component wear.
6th step, base 7 and the junction of pipe cap 3 to the 5th step products obtained therefrom carry out embedding treatment, place 30min,
Its pipe cap is qualified after tested near upper end position outside suit Fresnel Lenses 1, both obtains finished product pyroelectric infrared sensor.
The pyroelectric infrared sensor as shown in Figure 2, Figure 3 and Figure 4 of embodiment 5, including pipe cap 3, pipe cap 3 is by aluminium alloy
Material is made, and it is tested by pressure seal, and test pressure is 1.5MPa, it is ensured that the side wall of pipe cap 3 is not in crack, stomata
Etc. defect, the upper end of pipe cap 3 is provided with window near centre position, and window is provided with step on the inwall of lower end, step it is upper
In surface is generally aligned in the same plane, optical filter 2 is provided with the window of step upper end, optical filter 2 is infrared optics optical filter, and it can
To be silicon substrate, germanium base, infrared glass base, saturating Infrared Thin Films base optical filter, and one layer of infrared anti-reflection film and cut film are coated with, so that
Radiated wave to receiving is purified, and optical filter 2 is tightly connected by fluid sealant with window inwall and step upper surface, fluid sealant
From polyurethane sealant, pipe cap 3 is also set with Fresnel Lenses 1 near upper end outside, and pipe cap 3 is provided near lower end
First projection 10, Fresnel Lenses 1 is also equipped with the second projection 11 near lower end position, and the second raised 11 lower end is provided with out
Mouthful, first raised 10 is located in opening, so that pipe cap 3 is not relatively rotated with Fresnel Lenses 1, convenient connection.
Inwall at the lower ending opening of pipe cap 3 is set to stepped hole, and the hole shoulder of the stepped hole is downward and is generally aligned in the same plane
It is interior, one layer of soft polymer material 9 is provided with the lower surface of hole shoulder, set in the stepped hole of the lower end of soft polymer material 9
There is base 7, base 7 is set to pcb board, its upper surface is printed with circuit, the upper surface of base 3 is further fixed on electronic device 5, electronics
Device 5 is connected into circuit, and the upper surface of base 7 is further fixed on support column 6 near centre position, and the upper end of support column 6 is fixed with infrared
Optical sensing element 4, conducting element is provided with support column 4, so that infrared optics sensing element 4 and circuit communication, base 7
Fluid sealant is provided between outer rim and stepped hole inwall to be connected and sealed, soft polymer material 9 selects polyurethane clay, its
It is prevented from that fluid sealant is pressed into the space that pipe cap 3 is surrounded with base 7 in embedding.
The upper surface of base 7 is provided with three downward through holes, and pin 8, respectively the first pin 8a, second are coated with through hole
Pin 8b, the 3rd pin 8c, the lower end of pin 8 are extended to outside base 7, upper end and circuit communication, so that the product that the present invention is provided
Product can carry out data exchange with other equipment.
The lower surface of base 7 is also printed with path, and path is electrically connected with pipe cap 3, so as to form screen layer, reduces the side of pipe cap 3
Interference of the electromagnetic wave in face to the internal circuit of pipe cap 3.
Nitrogen, and its air pressure are filled with the confined space that base 7, pipe cap 3 and optical filter 2 are surrounded jointly less than under normality
Atmospheric pressure, be prevented from the oxidation of each part, improve the environment that infrared ray is propagated.
The preparation method of the product that the present invention is provided is as follows：
The first step, prepares pipe cap 3, then polyurethane clay 9 is coated at the stepped hole of pipe cap, and coating thickness is 1~1.5mm.
Second step, prepares base 7, in the upper surface printed circuit of base 7, and path is printed in its lower surface, by electronics device
Part 5 is connected into circuit, and fixed, and path is printed in the lower surface of base 7.
3rd step, support column 6 is fixed in the base upper surface obtained by second step, holds fixed infrared optics quick on the support columns
Sensing unit 4, three downward through holes are outputed in the upper surface of base 7, and rosin is instilled in through hole, and pin 8 then is inserted into logical
In hole and carry out soldering.
4th step, base obtained in the 3rd step is put into the stepped hole of pipe cap 3, and is extruded to the direction of pipe cap 3, extruding pressure
Power is 10N, continues 3s.
5th step, the interior implantation temperature in the space surrounded to pipe cap 3 is 60oThe nitrogen of C, by infrared optics optical filter after 1s
2 are arranged at the window of pipe cap, and coat fluid sealant, and then blow low temperature dry air to pipe cap lowers the temperature to it, blows
Shi Changwei 8s.Low temperature dry air temperature is 5oC, quickly can lower the temperature to pipe cap 3 and its annex, it is to avoid its internal electricity
Device component wear.
6th step, base 7 and the junction of pipe cap 3 to the 5th step products obtained therefrom carry out embedding treatment, place 30min,
Its pipe cap is qualified after tested near upper end position outside suit Fresnel Lenses 1, both obtains finished product pyroelectric infrared sensor.
Subordinate list 1
Claims (8)
1. a kind of pyroelectric infrared sensor, including pipe cap, the pipe cap upper end is provided with window, the window near centre position
Place is provided with optical filter, and the pipe cap is equipped with Fresnel Lenses near upper end outer sheath, the pipe cap lower ending opening, and at opening
Base is provided with, the base surrounds an enclosed construction, electronic device is provided with the enclosed construction jointly with pipe cap,
The electronic device is arranged on base, and circuit is printed with the base, and the electronic device is electrically connected with circuit, the bottom
Seat lower end is provided with pin, and the pin is electrically connected with circuit, and support column, the support column are additionally provided with the closing space
Lower end is connected with base, and upper end is provided with infrared optics sensing element, and the infrared optics sensing element is by support column and electricity
Road forms electrical connection, it is characterised in that the inwall at the pipe cap lower ending opening is set to stepped hole, the hole shoulder of the stepped hole
Downwards and in being generally aligned in the same plane, one layer of soft polymer material, the soft high score are provided with the lower surface of the hole shoulder
Base is provided with the stepped hole of sub- material lower end, fluid sealant is provided between the base outer rim and stepped hole inwall.
2. pyroelectric infrared sensor according to claim 1, it is characterised in that the soft polymer material is poly- ammonia
Ester gum mud.
3. pyroelectric infrared sensor according to claim 1, it is characterised in that the company of sealing between the pin and base
Connect.
4. pyroelectric infrared sensor according to claim 1, it is characterised in that the base is pcb board, its upper surface
Circuit is printed with, lower surface is printed with the path for antistatic.
5. pyroelectric infrared sensor according to claim 1, it is characterised in that the pipe cap is by aluminum alloy materials system
Into it is tested by pressure seal, and described test pressure is 1.3~1.5MPa.
6. pyroelectric infrared sensor according to claim 1, it is characterised in that air pressure is 0.7 in the sealing structure
~0.85MPa, is tightly connected between the optical filter and pipe cap.
7. pyroelectric infrared sensor according to claim 6, it is characterised in that filling nitrogen in the sealing structure.
8. according to the preparation method of the pyroelectric sensor described in any one of claim 1~7, it is characterised in that including with
Lower step：
The first step, prepares pipe cap, then polyurethane adhesive mash is overlayed at the stepped hole of pipe cap, and smearing thickness is 1~1.5mm；
Second step, prepares base, in base upper surface printed circuit, and prints path in its lower surface, and electronic device is connected into
It is in circuit and fixed, print path in base lower surface；
3rd step, support column is fixed in the base upper surface obtained by second step, and the sensitive unit of fixed infrared optics is held on the support columns
Part, 3 downward through holes are outputed in base upper surface, and rosin is instilled in through hole, are then inserted pin and are gone forward side by side in through hole
Row soldering；
4th step, base obtained in the 3rd step is put into the stepped hole of pipe cap, and is extruded to pipe cap direction, and squeeze pressure is 10
~15N, continues 3~5s；
5th step, the interior implantation temperature in the space surrounded to pipe cap is 60oC~80oThe nitrogen of C, by infrared optics optical filter after 1s
At the window of pipe cap, and fluid sealant is coated, then blow low temperature dry air to pipe cap lowers the temperature to it, when blowing
A length of 8~10s；
6th step, base and pipe cap junction to the 5th step products obtained therefrom carry out embedding treatment, 30min are placed, in its pipe cap
It is qualified after tested near upper end position outside suit Fresnel Lenses, both obtain finished product pyroelectric infrared sensor.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112420913A (en) * | 2020-10-10 | 2021-02-26 | 杭州敏和光电子技术有限公司 | Packaging structure applied to infrared sensor and packaging method of infrared sensor |
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