CN105758531A - Vacuum packaging assembly for non-refrigeration infrared detector - Google Patents
Vacuum packaging assembly for non-refrigeration infrared detector Download PDFInfo
- Publication number
- CN105758531A CN105758531A CN201610242421.4A CN201610242421A CN105758531A CN 105758531 A CN105758531 A CN 105758531A CN 201610242421 A CN201610242421 A CN 201610242421A CN 105758531 A CN105758531 A CN 105758531A
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- shell
- getter
- housing
- thermoelectric cooling
- cooling module
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- 238000009461 vacuum packaging Methods 0.000 title abstract description 4
- 238000005057 refrigeration Methods 0.000 title abstract 5
- 238000003466 welding Methods 0.000 claims abstract description 30
- 229910052751 metal Inorganic materials 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims abstract description 11
- 239000003292 glue Substances 0.000 claims abstract description 9
- 238000005516 engineering process Methods 0.000 claims abstract description 8
- 229910001220 stainless steel Inorganic materials 0.000 claims abstract description 4
- 239000010935 stainless steel Substances 0.000 claims abstract description 4
- 238000010521 absorption reaction Methods 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 claims description 49
- 238000001816 cooling Methods 0.000 claims description 43
- 230000003287 optical effect Effects 0.000 claims description 25
- 238000009413 insulation Methods 0.000 claims description 24
- 239000000919 ceramic Substances 0.000 claims description 12
- 238000007747 plating Methods 0.000 claims description 11
- 230000007704 transition Effects 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 10
- 238000005476 soldering Methods 0.000 claims description 7
- 238000009434 installation Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 230000008719 thickening Effects 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 238000005275 alloying Methods 0.000 claims description 4
- 239000011159 matrix material Substances 0.000 claims description 4
- 238000001465 metallisation Methods 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 3
- 230000008020 evaporation Effects 0.000 claims description 3
- 238000001704 evaporation Methods 0.000 claims description 3
- 238000012536 packaging technology Methods 0.000 claims description 3
- 238000004544 sputter deposition Methods 0.000 claims description 3
- 230000000007 visual effect Effects 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 238000005219 brazing Methods 0.000 claims description 2
- 230000004907 flux Effects 0.000 abstract 2
- 238000004021 metal welding Methods 0.000 abstract 2
- 230000001681 protective effect Effects 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 7
- 230000005496 eutectics Effects 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 230000005855 radiation Effects 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 235000012149 noodles Nutrition 0.000 description 4
- 239000011324 bead Substances 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 238000002604 ultrasonography Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229920002472 Starch Polymers 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000006263 metalation reaction Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 210000003437 trachea Anatomy 0.000 description 1
- 230000003245 working effect Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/20—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/20—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
- G01J2005/202—Arrays
- G01J2005/204—Arrays prepared by semiconductor processing, e.g. VLSI
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Radiation Pyrometers (AREA)
Abstract
The invention discloses a vacuum packaging assembly for a non-refrigeration infrared detector. The vacuum packaging assembly for a non-refrigeration infrared detector is characterized in that a thermoelectric cooler is welded on a housing through metal welding flux; a lead of the thermoelectric cooler is welded on a thermoelectric cooler electrical connection pin on the housing; a getter with a gas absorption function is connected with a getter pin of the housing through an electric resistance welding technology; a stainless steel metal sheet with a special shape is welded between the getter and the thermoelectric cooler; a non-refrigeration infrared detector chip is pasted on a cold end surface of the non-refrigeration thermoelectric cooler, and is connected with a chip electrical connection pin on the housing through a bonding technology; a window is welded with a pipe cap through metal welding flux, and is sealed with the housing through parallel seam welding; after accomplishment of parallel seam welding, a combination piece is connected with the cavity of a vacuum device through an exhaust pipe, and is maintained under certain temperature and then is exhausted for a period of time; and after end of exhausting, the exhaust pipe is cold-clamp-sealed, and is sealed and coated with protective glue.
Description
Technical field
The invention discloses the vacuum packaging method of a kind of non-refrigerated infrared detector, the method can realize the vacuum of non-refrigerated infrared detector and seal, by local directed complete set design of part and assembling position, this method is also applied for the Vacuum Package of MEMS (MEMS) detector.
Background technology
Non-refrigerated infrared detector is a kind of special hot-probing device, generally it is made up of million or more detection unit, the main part of each detection unit is bridge-type hanging structure, and two ends are connected with the circuit of lower section by bridge pier, bridge pier have concurrently heat insulation, support and be electrically connected the effect of several respects.This structure is very sensitive to thermal signal, and the conduction of heat of gas will significantly reduce detection performance, even cause detector cannot normal operation, therefore red watt of detector of non-brake method must be encapsulated in vacuum cavity.
Relatively common version is the butterfly structure that exit is drawn from the side, and this structure must take into the exit size of side when mounted, and the board area taken comparatively speaking is larger.Exit is drawn from bottom can alleviate this situation, but traditional mode is to be welded on metal shell by bead by exit, due to the characteristic that bead is more crisp, when exit stress bends easily caused by bead occurs micro-crack, thus causing micro-small opening.In order to solve this problem, the present invention proposes exit and is first welded on a multi-layer ceramics rebound, then stack of ceramic plates again with the housing soldering of metal shell.
In addition to improve the vacuum holding capacity of encapsulated detector internal cavity, an electrically heated getter is had internally installed, when getter works, its surface temperature will more than 300 DEG C, it is easy to cause heat radiation to damage neighbouring thermoelectric cooling module and detector chip.For this, the present invention proposes the method setting thermal insulation board between getter and thermoelectric cooling module, is completely cut off by direct heat radiation, and thermal insulation board and shell weld together, by shell, thermal insulation board being lowered the temperature, this method can avoid heat radiation to damage when not losing getter working effect.
Summary of the invention
It is an object of the invention to provide the Vacuum Package assembly of a kind of non-refrigerated infrared detector, assembly profile is rectangle, and stitch is drawn from the bottom of shell by stack of ceramic plates, and stack of ceramic plates and shell pass through Welding.Detector encapsulates internally installed thermoelectric cooling module and thermal insulation board, and thermoelectric cooling module is arranged on enclosure bottom, and thermal insulation board is between getter and thermoelectric cooling module.Thermal insulation board is half-surrounded, together with shell, the heat radiation surface of getter is blocked.Be electrically connected pin and the getter pin of thermoelectric cooling module lay respectively at the both sides of stack of ceramic plates.After detector has encapsulated, completing bakeout degassing by heater and vacuum pump set, cold clamp is also coated with the Vacuum Package protecting glue to complete detector.The feature of assembly is that pin pottery transition is drawn, it is to avoid the assembly gas leakage that bending pins causes；Internal with thermal insulation board, it is possible to when being prevented effectively from getter work, the heat radiation of detector and thermoelectric cooling module to be damaged.
The structure of the Vacuum Package assembly of a kind of non-refrigerated infrared detector of this patent is as shown in Figure 1.It includes shell 1, pipe cap 2, optical window 3, non-brake method chip circuit module 4, thermoelectric cooling module 5, getter 6, thermal insulation board 7.Its housing 1 is made up of housing 110, pottery transition seat 120, exhaustor 130.Component package completes heel row trachea 130 clamp, sealing part coating protection glue 131.Pottery transition seat 120 comprises ceramic matrix 121, getter pin 122, the pin 123 that is electrically connected, thermoelectric cooling module are electrically connected, and the several part of pin 124 forms.Getter pin 122, the pin 123 that is electrically connected, the thermoelectric cooling module pin 124 that is electrically connected is through ceramic matrix 121.Processing mounting holes 111 on housing 110.
Thermoelectric cooling module (5) hot side (501) is welded on the housing (110) of shell (1) between two parties；The stitch of thermoelectric cooling module (5) is welded on the thermoelectric cooling module of shell (1) and is electrically connected on pin (124), getter (6) is placed in corresponding getter pin (122) position of the housing (110) of shell (1), the stitch of getter (6) is contacted with the getter pin (122) of shell (1), and is connected by resistance-welding process fixing；Thermal insulation board (7) is placed in housing (110) relevant position of shell (1), and it is positioned between getter (6) and thermoelectric cooling module (5), by resistance-welding process, thermal insulation board (7) and shell (1) sidewall are fixed；Non-brake method chip circuit module (4) is placed on thermoelectric cooling module (5), bonding with thermoelectric cooling module by glue；On pipe cap (2) interstitial hole (230), brazing metal is installed, then places optical window (3), and by being welded and fixed；Pipe cap (2) is placed on shell (1), and is welded and fixed by parallel seam welding technique；To exhaustor (130) cold clamp after aerofluxus, sealing part coating protection glue (131), it is achieved complete assembly.
Described shell 1 selects Covar metal.The housing 110 of shell 1 is processed 4 symmetrical installing holes 111, for installation and the para-position of assembly；Pottery transition seat 120 is welded on the housing 110 of shell 1 simultaneously；By exhaustor 130 soldering on the housing 110 of shell 1.Shell 1 surface gold-plating, the sealing for shell 1 with pipe cap 2 is welded.Exhaustor 130 adopts oxygen-free copper pipe to process, surface gold-plating, it is prevented that oxidation.
Described thermoelectric cooling module 5 is the refrigerator of two-sided metallization.
The described hot-probing device that non-brake method chip circuit module 4 is bridge architecture.
Described getter 6 is absorption H2, the gas such as CO getter.
Described thermal insulation board 7 is processed into the thermal insulation board of specific moulding for stainless steel materials.
Described pipe cap 2 selects the alloying metal processing such as 4J29,4J42.Pipe cap comprises location-plate 210 and thickening plate 220 two parts, and first etched figure on the face 211 of location-plate 210 during making, etching limit positions and parallel seam welding technique with shell 1 installation for pipe cap 2；Soldering thickening plate 220 on face 212, fixed and positioned for optical window 3；The perforate size of pipe cap 2 interstitial hole 230 is determined according to detector scale, the angle of visual field and packaging technology, for the logical light of the photosensitive unit of detector chip.The surface metalation of pipe cap 2, for the eutectic welding procedure of optical window 3 with pipe cap 2.
The optical material processing substrate that 8～14 micron waveband transmitances are higher selected by described optical window 3, such as Ge etc.；Substrate adopt evaporation or sputtering technology plating anti-reflection film complete the optical window needed for non-brake method chip operation wave band.Optical window 3 bottom edge 301 and side 302 metalized, for the eutectic welding procedure of optical window 3 with pipe cap 2.
Technical scheme is as follows:
Shell 1 is positioned on a level table, starches solder by the hot side 501 of thermoelectric cooling module 5 together with shell 1 assembly connection by heat conduction silver, is electrically connected by the stitch of thermoelectric cooling module 5 together with pin 124 is interconnected at thermoelectric cooling module by welding procedure；Together with getter 6 stitch is interconnected at by resistance-welding process with getter pin 122；By welding procedure, the housing 110 of thermal insulation board 7 with shell 1 is welded together.
Solder is starched by heat conduction silver, by non-brake method chip circuit module 4 together with huyashi-chuuka (cold chinese-style noodles) 502 assembly connection of thermoelectric cooling module 5, press together with the output pin of non-brake method chip circuit module 4 is interconnected at by mode with the pin 122 that is electrically connected on the ceramic transition seat 120 of shell 1 with ultrasound wave key；By eutectic welding, pipe cap 2 and optical window 3 are welded together；By parallel seam welding technique, pipe cap 2 and shell 1 are welded together, it is achieved seal；Realize vacuum seal by exhaust station aerofluxus, cold clamping & sealing technology and sealing coating protection glue.
It is an advantage of the current invention that: the vacuum that can realize non-refrigerated infrared detector seals, it may be achieved high leakproofness, Stability Analysis of Structures, is not likely to produce micro-small opening, and leak rate is low, and air heat conduction is little, it may be achieved the black box of high-performance non-refrigerated infrared detector.
Accompanying drawing explanation
Fig. 1 non-refrigerated infrared detector appearance schematic diagram.
Fig. 2 shell schematic diagram.
Fig. 3 pipe cap schematic diagram.
Fig. 4 window schematic diagram.
Fig. 5 thermoelectric cooling module schematic diagram.
Detailed description of the invention:
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in detail.
1, the making of parts and preparation
A) shell 1 selects the alloying metal processing such as kovar.The housing 110 of shell 1 is processed 4 symmetrical installing holes 111, for installation and the para-position of assembly；Pottery transition seat 120 is welded on the housing 110 of shell 1 simultaneously；By exhaustor 130 soldering on the housing 110 of shell 1.Shell 1 surface gold-plating, the sealing for shell 1 with pipe cap 2 is welded.Exhaustor 130 adopts oxygen-free copper pipe to process, surface gold-plating, it is prevented that oxidation.
B) refrigerator of two-sided metallization selected by thermoelectric cooling module 5, stitch be tin-coated copper lead-in wire, the scale of selection ground non-brake method chip circuit module, power consumption, operating temperature and ambient temperature and determine.
C) non-brake method chip circuit module 4 is welded on the huyashi-chuuka (cold chinese-style noodles) 502 of thermoelectric cooling module 5 by heat conduction silver slurry solder, presses mode that with the pin 123 that is electrically connected on the ceramic transition seat 120 of shell 1, the output pin of non-brake method chip circuit module 4 is realized interconnection with ultrasound wave key.
D) stitch of getter 6 and getter pin 122 are with together with resistance-welding process is interconnected at.
E) thermal insulation board 7 adopts stainless steel materials to be processed into specific moulding, and is positioned between thermoelectric cooling module 5 and getter 6 by thermal insulation board 7, is welded together by the housing 110 of thermal insulation board 7 with shell 1 by welding procedure.
F) pipe cap 2 selects the alloying metal processing such as 4J29,4J42.Pipe cap comprises location-plate 210 and thickening plate 220 two parts, and first etched figure on the face 211 of location-plate 210 during making, etching limit positions and parallel seam welding technique with shell 1 installation for pipe cap 2；Soldering thickening plate 220 on face 212, fixed and positioned for optical window 3；The perforate size of pipe cap 2 interstitial hole 230 is determined according to detector scale, the angle of visual field and packaging technology, for the logical light of the photosensitive unit of detector chip.The surface gold-plating of pipe cap 2, for the eutectic welding procedure of optical window 3 with pipe cap 2.
G) the optical material processing substrate that 8～14 micron waveband transmitances are higher selected by optical window 3, such as Ge etc.；Substrate adopt evaporation or sputtering technology plating anti-reflection film complete the optical window needed for non-brake method chip operation wave band.Optical window 3 bottom edge and side metalization process, for the eutectic welding procedure of optical window 3 with pipe cap 2.
2, assembling and sealing technology
First shell 1 is positioned on a level table, next on the hot side 501 of thermoelectric cooling module 5, smear heat conduction silver slurry solder, and thermoelectric cooling module 5 is installed to housing 110 centre position of shell 1 and solidifies, the stitch of thermoelectric cooling module 5 is electrically connected pin interconnection by welding procedure and thermoelectric cooling module；Then getter 6 is arranged on the housing 110 of shell 1, and by resistance-welding process, getter 6 stitch and getter pin 122 is interconnected；Thermal insulation board 7 is arranged between thermoelectric cooling module 5 and getter 6, and by welding procedure, the housing 110 of thermal insulation board 7 with shell 1 is welded together.
Thermoelectric cooling module 5 huyashi-chuuka (cold chinese-style noodles) 502 is smeared heat conduction silver slurry solder, and non-brake method chip circuit module 4 is installed on thermoelectric cooling module 5 huyashi-chuuka (cold chinese-style noodles) 502 and solidifies, press mode that with the pin 123 that is electrically connected on the ceramic transition seat 120 of shell 1, the output pin of non-brake method chip circuit module 4 is realized interconnection with ultrasound wave key；The window installed surface of pipe cap 2 is placed solder ring, then optical window 3 is placed on solder ring, is fixed together by eutectic welding procedure；Then pass through parallel seam welding technique pipe cap 2 is welded with shell 1, it is achieved seal；Molectron is connected with the cavity of a vacuum equipment after completing by parallel seam welding by exhaustor 130, and makes molectron be under uniform temperature, aerofluxus a period of time；After aerofluxus terminates, cold clamp exhaustor 130, sealing coating protection glue 131.
Claims (8)
1. the Vacuum Package assembly of a non-refrigerated infrared detector, including shell (1), pipe cap (2), optical window (3), non-brake method chip circuit module (4), thermoelectric cooling module (5), getter (6), thermal insulation board (7), it is characterised in that:
Described shell (1) includes housing (110), pottery transition seat (120) and exhaustor (130), at the upper processing mounting holes (111) of housing (110)；Pottery transition seat (120) includes ceramic matrix (121), getter pin (122), the pin that is electrically connected (123), thermoelectric cooling module are electrically connected pin (124)；Getter pin (122), the pin that is electrically connected (123), thermoelectric cooling module are electrically connected pin (124) through ceramic matrix (121)；
The hot side (501) of described thermoelectric cooling module (5) is welded on the housing (110) of shell (1) between two parties；The stitch of thermoelectric cooling module (5) is welded on the thermoelectric cooling module of shell (1) and is electrically connected on pin (124), getter (6) is placed in corresponding getter pin (122) position of the housing (110) of shell (1), the stitch of getter (6) is contacted with the getter pin (122) of shell (1), and is connected by resistance-welding process fixing；Thermal insulation board (7) is placed in housing (110) relevant position of shell (1), and it is positioned between getter (6) and thermoelectric cooling module (5), by resistance-welding process, thermal insulation board (7) and shell (1) sidewall are fixed；Non-brake method chip circuit module (4) is placed on thermoelectric cooling module (5), bonding with thermoelectric cooling module by glue；On pipe cap (2) interstitial hole (230), brazing metal is installed, then places optical window (3), and by being welded and fixed；Pipe cap (2) is placed on shell (1), and is welded and fixed by parallel seam welding technique；To exhaustor (130) cold clamp after aerofluxus, sealing part coating protection glue (131), it is achieved complete assembly.
2. the Vacuum Package assembly of a kind of non-refrigerated infrared detector according to claim 1, it is characterized in that: described shell (1) selects Covar metal, housing (110) in shell (1) 4 symmetrical installing holes (111) of upper processing, for installation and the para-position of assembly；Pottery transition seat (120) is welded on the housing (110) of shell (1) simultaneously；By exhaustor (130) soldering on the housing (110) of shell (1), shell (1) surface gold-plating, sealing for shell (1) with pipe cap (2) is welded, exhaustor (130) adopts oxygen-free copper pipe processing, surface gold-plating.
3. the Vacuum Package assembly of a kind of non-refrigerated infrared detector according to claim 1, it is characterized in that: pipe cap (2) selects the processing of 4J29 or 4J42 alloying metal, pipe cap comprises location-plate (210) and thickening plate (220) two parts, the upper etched figure in the first face (211) in location-plate (210) during making, etching limit is used for pipe cap (2) and shell (1) installation location and parallel seam welding technique；At face (212) upper soldering thickening plate (220), fixed and positioned for optical window (3)；The perforate size of pipe cap (2) interstitial hole (230) is determined according to detector scale, the angle of visual field and packaging technology, for the logical light of the photosensitive unit of detector chip.The surface gold-plating of pipe cap (2).
4. the Vacuum Package assembly of a kind of non-refrigerated infrared detector according to claim 1, it is characterised in that: 8～14 micron waveband transmitances optical material processing substrate higher than 70% selected by optical window (3)；Substrate adopt evaporation or sputtering technology plating anti-reflection film complete the optical window needed for non-brake method chip operation wave band, optical window (3) bottom edge (301) and side (302) metalized.
5. the Vacuum Package assembly of a kind of non-refrigerated infrared detector according to claim 1, it is characterised in that: the refrigerator that described thermoelectric cooling module (5) is two-sided metallization, the stitch of thermoelectric cooling module (5) is tin-coated copper lead-in wire.
6. the Vacuum Package assembly of a kind of non-refrigerated infrared detector according to claim 1, it is characterised in that: the hot-probing device that described non-brake method chip circuit module (4) is bridge architecture.
7. the Vacuum Package assembly of a kind of non-refrigerated infrared detector according to claim 1, it is characterised in that: described getter (6) is absorption H2, CO gas getter.
8. the Vacuum Package assembly of a kind of non-refrigerated infrared detector according to claim 1, it is characterised in that: described thermal insulation board (7) is stainless steel materials thermal insulation board.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510868727.6A CN105444894A (en) | 2015-12-01 | 2015-12-01 | Vacuum packaging assembly for non-refrigeration infrared detector |
| CN2015108687276 | 2015-12-01 |
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|---|---|
| CN105758531A true CN105758531A (en) | 2016-07-13 |
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| CN201510868727.6A Pending CN105444894A (en) | 2015-12-01 | 2015-12-01 | Vacuum packaging assembly for non-refrigeration infrared detector |
| CN201620328482.8U Expired - Fee Related CN205808563U (en) | 2015-12-01 | 2016-04-19 | The Vacuum Package assembly of non-refrigerated infrared detector |
| CN201610242421.4A Pending CN105758531A (en) | 2015-12-01 | 2016-04-19 | Vacuum packaging assembly for non-refrigeration infrared detector |
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| CN201510868727.6A Pending CN105444894A (en) | 2015-12-01 | 2015-12-01 | Vacuum packaging assembly for non-refrigeration infrared detector |
| CN201620328482.8U Expired - Fee Related CN205808563U (en) | 2015-12-01 | 2016-04-19 | The Vacuum Package assembly of non-refrigerated infrared detector |
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| CN107246889A (en) * | 2017-06-22 | 2017-10-13 | 江苏物联网研究发展中心 | Shell structure and infrared sensor encapsulating structure for non-refrigerating infrared sensor Vacuum Package |
| CN108180672A (en) * | 2017-12-13 | 2018-06-19 | 中国科学院光电技术研究所 | A kind of Vacuum Package Dewar of EMCCD detectors |
| CN111001545A (en) * | 2019-11-25 | 2020-04-14 | 烟台艾睿光电科技有限公司 | Method for preventing getter from falling particles and getter and reinforced coating assembly |
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| CN105444894A (en) * | 2015-12-01 | 2016-03-30 | 中国科学院上海技术物理研究所 | Vacuum packaging assembly for non-refrigeration infrared detector |
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| CN110887569B (en) * | 2019-11-04 | 2021-11-05 | 中国电子科技集团公司第十一研究所 | Getter assembly, Dewar assembly, assembly method of Dewar assembly and infrared detector |
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| CN205808563U (en) * | 2015-12-01 | 2016-12-14 | 中国科学院上海技术物理研究所 | The Vacuum Package assembly of non-refrigerated infrared detector |
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- 2016-04-19 CN CN201620328482.8U patent/CN205808563U/en not_active Expired - Fee Related
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107246889A (en) * | 2017-06-22 | 2017-10-13 | 江苏物联网研究发展中心 | Shell structure and infrared sensor encapsulating structure for non-refrigerating infrared sensor Vacuum Package |
| CN108180672A (en) * | 2017-12-13 | 2018-06-19 | 中国科学院光电技术研究所 | A kind of Vacuum Package Dewar of EMCCD detectors |
| CN111001545A (en) * | 2019-11-25 | 2020-04-14 | 烟台艾睿光电科技有限公司 | Method for preventing getter from falling particles and getter and reinforced coating assembly |
| CN114459603A (en) * | 2022-01-13 | 2022-05-10 | 山东大学 | High-power laser sensor and laser power meter |
| CN114459603B (en) * | 2022-01-13 | 2023-10-24 | 山东大学 | High-power laser sensor and laser power meter |
Also Published As
| Publication number | Publication date |
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| CN205808563U (en) | 2016-12-14 |
| CN105444894A (en) | 2016-03-30 |
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