CN106679823B - Pyroelectric infrared sensor and manufacturing method thereof - Google Patents
Pyroelectric infrared sensor and manufacturing method thereof Download PDFInfo
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- CN106679823B CN106679823B CN201611119547.9A CN201611119547A CN106679823B CN 106679823 B CN106679823 B CN 106679823B CN 201611119547 A CN201611119547 A CN 201611119547A CN 106679823 B CN106679823 B CN 106679823B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 230000003287 optical effect Effects 0.000 claims abstract description 66
- 238000007789 sealing Methods 0.000 claims abstract description 40
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 27
- 239000011248 coating agent Substances 0.000 claims description 21
- 238000000576 coating method Methods 0.000 claims description 21
- 229920002635 polyurethane Polymers 0.000 claims description 19
- 239000004814 polyurethane Substances 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 18
- 239000000565 sealant Substances 0.000 claims description 17
- 229910052757 nitrogen Inorganic materials 0.000 claims description 13
- 239000004568 cement Substances 0.000 claims description 9
- 238000005476 soldering Methods 0.000 claims description 9
- 238000007639 printing Methods 0.000 claims description 8
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 7
- 229910000838 Al alloy Inorganic materials 0.000 claims description 7
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 7
- 239000000956 alloy Substances 0.000 claims description 7
- 238000007664 blowing Methods 0.000 claims description 7
- 238000001125 extrusion Methods 0.000 claims description 7
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- 230000005611 electricity Effects 0.000 claims description 6
- 238000012797 qualification Methods 0.000 claims description 2
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- 238000003854 Surface Print Methods 0.000 claims 2
- 229910001873 dinitrogen Inorganic materials 0.000 claims 1
- 230000002045 lasting effect Effects 0.000 claims 1
- 239000003292 glue Substances 0.000 abstract description 16
- 239000002861 polymer material Substances 0.000 abstract description 5
- 230000007547 defect Effects 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 239000004927 clay Substances 0.000 description 5
- 229910052732 germanium Inorganic materials 0.000 description 5
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000004146 energy storage Methods 0.000 description 2
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- 230000006698 induction Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/0205—Mechanical elements; Supports for optical elements
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- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Radiation Pyrometers (AREA)
Abstract
The invention discloses a pyroelectric infrared sensor and a manufacturing method thereof, and relates to the field of sensor manufacturing, the pyroelectric infrared sensor comprises a pipe cap, a window is arranged at the upper end of the pipe cap and close to the middle position, an optical filter is arranged at the window, a Fresnel lens is sleeved outside the pipe cap and close to the upper end, the inner wall of the opening at the lower end of the pipe cap is provided with a step hole, the hole shoulders of the step hole are downward and positioned in the same plane, the lower end face of the hole shoulders is provided with a layer of soft polymer material, the step hole at the lower end of the soft polymer material is internally provided with a base, sealing glue is arranged between the outer edge of the base and the inner wall of the step hole, and the base and the pipe cap jointly enclose a closed structure to form the basic outer package.
Description
Technical Field
The invention relates to the technical field of pyroelectric infrared sensor packaging, in particular to a pyroelectric infrared sensor for human body movement induction and a manufacturing method thereof.
Background
The pyroelectric infrared sensor and the pyroelectric infrared sensing module on the market are all manufactured by adopting the traditional packaging technology. As shown in fig. 1, the solar cell comprises a tube seat 8 and a tube cap 3 which form a closed structure, wherein a fresnel lens 1 is arranged on the outer side of the closed structure, an infrared optical filter 2 is stuck at a window on the upper surface of the tube cap 3, an infrared optical sensor 4 and a supporting component 6 for fixing the infrared optical sensor 4 are arranged in the closed structure, an electronic device 5 and a substrate 7 for fixing the electronic device 5 are arranged below the infrared optical sensor 4 and the supporting component 6, a circuit for electrically connecting the components is printed on the substrate 7, three pins 9a, 9b and 9c extend downwards in the tube seat 8, the tube seat 8 and the substrate 7 are electrically connected in a reflow soldering mode, the tube cap 3 and the tube seat 8 are welded in an energy storage soldering mode, the precision requirement on a fixture is high, the production process is complex, and if the welding process parameter is controlled improperly, the welding strength cannot meet the requirement, and the air tightness cannot be ensured; and the cost is high, the packaging area and the volume of the pyroelectric infrared sensing module are limited, and the pyroelectric infrared sensing module is not suitable for being applied to portable products.
Disclosure of Invention
The invention aims to overcome the defects and the shortcomings of the prior art and provide the pyroelectric infrared sensor which is simple in manufacturing method and has good anti-interference performance.
The invention is realized by the following technical scheme: the utility model provides a pyroelectric infrared sensor, includes the tube cap, the tube cap upper end is close to the intermediate position and opens there is the window, window department is provided with the light filter, the tube cap is close to the outside cover of upper end and is equipped with fresnel lens, tube cap lower extreme opening, and the opening part is provided with the base, base and tube cap enclose into a seal structure jointly, be provided with electronic component in the seal structure, electronic component sets up on the base, the printing has the circuit on the base, electronic component is connected with the circuit electricity, the base lower extreme is provided with the pin, the pin is connected with the circuit electricity, still be provided with the support column in the enclosure space, the support column lower extreme is connected with the base, and the upper end is provided with infrared optical sensing element, infrared optical sensing element is connected with the circuit electricity, the inner wall of tube cap lower extreme opening part sets up to the step hole, the hole shoulder in the step hole just is located same plane down, be provided with one deck soft polymer material on the lower terminal surface of hole shoulder, be provided with the step hole of soft polymer material lower extreme, be provided with the pin, be provided with the step between base and the seal hole.
Preferably, the soft polymer material is polyurethane cement.
Preferably, the pin is in sealing connection with the base.
Preferably, the base is a PCB board, the upper surface of the base is printed with a circuit, and the lower surface of the base is printed with a passage for preventing static electricity.
Preferably, the pipe cap is made of an aluminum alloy material and is subjected to a pressure sealing test, wherein the test pressure is 1.3-1.5 MPax
Preferably, the air pressure in the sealing structure is 0.7-0.85 MPa, and the optical filter is in sealing connection with the pipe cap.
Preferably, the sealing structure is filled with nitrogen.
The manufacturing method of the pyroelectric infrared sensor comprises the following steps:
firstly, preparing a pipe cap, and coating polyurethane cement on a step hole of the pipe cap, wherein the coating thickness is 1-1.5 mm.
And secondly, preparing a base, printing a circuit on the upper surface of the base, printing a via on the lower surface of the base, connecting an electronic device into the circuit, fixing the electronic device, and printing the via on the lower surface of the base.
And thirdly, fixing a support column on the upper end surface of the base obtained in the second step, fixing an infrared optical sensitive element at the upper end of the support column, opening 3 downward through holes on the upper end surface of the base, dripping rosin water into the through holes, and then inserting pins into the through holes and soldering.
And fourthly, placing the base manufactured in the third step into a step hole of a pipe cap, extruding the base towards the direction of the pipe cap, wherein the extrusion pressure is 10-15N, and the duration is 3-5 s.
Fifthly, injecting nitrogen with the temperature of 60-80 ℃ into the space surrounded by the pipe cap, mounting the infrared optical filter at the window of the pipe cap after 1S, coating sealant, and blowing low-temperature dry air to the pipe cap to cool the pipe cap for 8-10S o
And sixthly, filling and sealing the joint of the base and the pipe cap of the product obtained in the fifth step, placing for 30min, sleeving a Fresnel lens on the outer side of the pipe cap close to the upper end, and obtaining the finished pyroelectric infrared sensor after test qualification.
Compared with the prior art, the invention has the beneficial effects that: 1. the pipe cap and the base are made of metal and PCB, so that energy storage welding or other sealing welding processes caused by the fact that all the metal is used are avoided, and the production process is simplified. 2. And complicated manufacturing procedures are not needed, a precise production machine is not needed, and alignment is easy to realize during packaging. 3. In addition, the use of the tube seat is reduced, and the production cost is reduced. 4. The size of the base is reduced, the packaging area is reduced, and the production cost is reduced. 5. The pipe cap and the base are bonded and sealed through a potting process, so that the operation is simple and convenient, and the cost is low.
Drawings
Fig. 1 is a schematic structural view of a conventional pyroelectric infrared sensor;
FIG. 2 is a schematic diagram of a package structure according to the present invention;
FIG. 3 is a schematic front view in cross section of the present invention;
fig. 4 is a schematic partial cross-sectional view at a.
The optical fiber comprises a Fresnel lens 1, an optical filter 2, a pipe cap 3, an infrared optical sensitive element 4, an electronic device 5, a supporting piece 6, a base 7, pins 8A/8B/8C, polyurethane cement 9, a first bulge 10 and a second bulge 11.
Detailed Description
The invention will be described in detail with reference to the drawings and the specific embodiments thereof:
embodiment 1 is as shown in fig. 2, fig. 3 and fig. 4, the pyroelectric infrared sensor comprises a pipe cap 3, the pipe cap 3 is made of an aluminum alloy material, the pipe cap 3 is subjected to pressure sealing test, the test pressure is 1.5MPa, the side wall of the pipe cap 3 is guaranteed not to have defects such as cracks and air holes, a window is formed in the upper end of the pipe cap 3 close to the middle position, a step is arranged on the inner wall of the window close to the lower end, the upper surface of the step is located in the same plane, an optical filter 2 is arranged in the window at the upper end of the step, the optical filter 2 is an infrared optical filter, and can be silicon-based, germanium-based, infrared glass-based and infrared-transmitting film-based optical filters, and is plated with an infrared antireflection film and a stop film, so that received radiant waves are purified, the optical filter 2 is in sealing connection with the inner wall of the window and the upper surface of the step through sealing glue, the sealing glue is polyurethane sealing glue, a fresnel lens 1 is sleeved on the outer side of the pipe cap 3 close to the upper end, a first bulge 10 is arranged near the lower end of the window, a second bulge 11 is also arranged on the position of the fresnel lens 1 close to the lower end, the second bulge 11 is arranged at the position close to the lower end of the fresnel lens 1, and the fresnel lens is not connected with the first bulge 10, and is convenient to rotate relatively, and the opening is made to rotate.
The inner wall of pipe cap 3 lower extreme opening part sets up to the step hole, the hole shoulder in step hole is downwards and be located the coplanar, be provided with one deck soft macromolecular material 9 on the lower terminal surface of hole shoulder, be provided with base 7 in the step hole of soft macromolecular material 9 lower extreme, base 7 sets up to the PCB board, its up end prints and has the circuit, base 3 upper surface still is fixed with electronic component 5, electronic component 5 links into the circuit, base 7 upper surface is close to the intermediate position and still is fixed with support column 6, support column 6 upper end is fixed with infrared optical sensing element 4, be provided with the conductive element on the support column 4, thereby make infrared optical sensing element 4 and circuit intercommunication, be provided with the sealant between base 7 outer fringe and the step hole inner wall and carry out sealing connection, soft macromolecular material 9 selects polyurethane clay, it can prevent to impress the sealant in the space that pipe cap 3 and base 7 enclose when the embedment.
The upper end face of the base 7 is provided with three downward through holes, pins 8, namely a first pin 8a, a second pin 8b and a third pin 8c, are penetrated in the through holes, the lower ends of the pins 8 extend out of the base 7, and the upper ends of the pins are communicated with a circuit, so that the product provided by the invention can exchange data with other equipment.
The lower end surface of the base 7 is also printed with a passage, and the passage is electrically connected with the pipe cap 3, so that a shielding layer is formed, and the interference of electromagnetic waves on the side surface of the pipe cap 3 on the internal circuit of the pipe cap 3 is reduced.
The base 7, the pipe cap 3 and the optical filter 2 together enclose a closed space filled with nitrogen, and the air pressure is lower than the normal atmospheric pressure, so that each component can be prevented from being oxidized, and the infrared propagation environment is improved.
The manufacturing method of the product provided by the invention comprises the following steps:
firstly, preparing a pipe cap 3, and coating polyurethane cement 9 on the step hole of the pipe cap, wherein the coating thickness is 1-1.5 mm.
In the second step, the base 7 is prepared, the circuit is printed on the upper surface of the base 7, the path is printed on the lower surface thereof, the electronic device 5 is connected into the circuit, and the path is printed on the lower surface of the base 7.
And thirdly, fixing a support column 6 on the upper end surface of the base obtained in the second step, fixing an infrared optical sensitive element 4 at the upper end of the support column, opening three downward through holes on the upper end surface of the base 7, dripping rosin water into the through holes, and then inserting pins 8 into the through holes and soldering.
And fourthly, placing the base manufactured in the third step into the step hole of the pipe cap 3, extruding the base towards the direction of the pipe cap 3, wherein the extrusion pressure is 10N, and continuing for 3s.
And fifthly, injecting nitrogen with the temperature of 80 ℃ into the space surrounded by the pipe cap 3, mounting the infrared optical filter 2 at the window of the pipe cap after 1S, coating sealant, and then blowing low-temperature dry air to the pipe cap to cool the pipe cap for 10S. The temperature of the low-temperature dry air is 5 ℃, so that the pipe cap 3 and accessories thereof can be rapidly cooled, and the damage of electric elements in the pipe cap is avoided.
And sixthly, the joint of the base 7 and the pipe cap 3 of the product obtained in the fifth step is encapsulated, the product is placed for 30min, the Fresnel lens 1 is sleeved outside the pipe cap close to the upper end, and the product is tested to be qualified, so that the finished pyroelectric infrared sensor is obtained.
The parameters of the product obtained in this example are shown in Table 1
Embodiment 2 is as shown in fig. 2, fig. 3 and fig. 4, the pyroelectric infrared sensor comprises a pipe cap 3, the pipe cap 3 is made of an aluminum alloy material, the pipe cap 3 is subjected to pressure sealing test, the test pressure is 1.5MPa, the side wall of the pipe cap 3 is guaranteed not to have defects such as cracks and air holes, a window is formed in the upper end of the pipe cap 3 close to the middle position, a step is arranged on the inner wall of the window close to the lower end, the upper surface of the step is located in the same plane, an optical filter 2 is arranged in the window at the upper end of the step, the optical filter 2 is an infrared optical filter, and can be silicon-based, germanium-based, infrared glass-based and infrared-transmitting film-based optical filters, and is plated with an infrared antireflection film and a stop film, so that received radiant waves are purified, the optical filter 2 is in sealing connection with the inner wall of the window and the upper surface of the step through sealing glue, the sealing glue is polyurethane sealing glue, a fresnel lens 1 is sleeved on the outer side of the pipe cap 3 close to the upper end, a first bulge 10 is arranged near the lower end of the window, a second bulge 11 is also arranged on the position of the fresnel lens 1 close to the lower end, the second bulge 11 is arranged at the position, the second bulge 11 is arranged in the position, and the opening is opposite to the fresnel lens 1, and the opening is not convenient to rotate.
The inner wall of pipe cap 3 lower extreme opening part sets up to the step hole, the hole shoulder in step hole is downwards and be located the coplanar, be provided with one deck soft macromolecular material 9 on the lower terminal surface of hole shoulder, be provided with base 7 in the step hole of soft macromolecular material 9 lower extreme, base 7 sets up to the PCB board, its up end prints and has the circuit, base 3 upper surface still is fixed with electronic component 5, electronic component 5 links into the circuit, base 7 upper surface is close to the intermediate position and still is fixed with support column 6, support column 6 upper end is fixed with infrared optical sensing element 4, be provided with the conductive element on the support column 4, thereby make infrared optical sensing element 4 and circuit intercommunication, be provided with the sealant between base 7 outer fringe and the step hole inner wall and carry out sealing connection, soft macromolecular material 9 selects polyurethane clay, it can prevent to impress the sealant in the space that pipe cap 3 and base 7 enclose when the embedment.
The upper end face of the base 7 is provided with three downward through holes, pins 8, namely a first pin 8a, a second pin 8b and a third pin 8c, are penetrated in the through holes, the lower ends of the pins 8 extend out of the base 7, and the upper ends of the pins are communicated with a circuit, so that the product provided by the invention can exchange data with other equipment.
The lower end surface of the base 7 is also printed with a passage, and the passage is electrically connected with the pipe cap 3, so that a shielding layer is formed, and the interference of electromagnetic waves on the side surface of the pipe cap 3 on the internal circuit of the pipe cap 3 is reduced.
The base 7, the pipe cap 3 and the optical filter 2 are enclosed together to form a closed space filled with nitrogen, and the air pressure is lower than the atmospheric pressure, so that the oxidation of each component can be prevented, and the infrared propagation environment is improved.
The manufacturing method of the product provided by the invention comprises the following steps:
firstly, preparing a pipe cap 3, and coating polyurethane cement 9 on the step hole of the pipe cap, wherein the coating thickness is 1-1.5 mm.
In the second step, the base 7 is prepared, the circuit is printed on the upper surface of the base 7, the path is printed on the lower surface thereof, the electronic device 5 is connected into the circuit, and the path is printed on the lower surface of the base 7.
And thirdly, fixing a support column 6 on the upper end surface of the base obtained in the second step, fixing an infrared optical sensitive element 4 at the upper end of the support column, opening three downward through holes on the upper end surface of the base 7, dripping rosin water into the through holes, and then inserting pins 8 into the through holes and soldering.
And fourthly, placing the base manufactured in the third step into the step hole of the pipe cap 3, extruding the base towards the direction of the pipe cap 3, wherein the extrusion pressure is 10N, and continuing for 3s.
And fifthly, injecting nitrogen with the temperature of 75 ℃ into the space surrounded by the pipe cap 3, mounting the infrared optical filter 2 at the window of the pipe cap after 1S, coating sealant, and then blowing low-temperature dry air to the pipe cap to cool the pipe cap for 9S. The temperature of the low-temperature dry air is 5 ℃, so that the pipe cap 3 and accessories thereof can be rapidly cooled, and the damage of electric elements in the pipe cap is avoided.
And sixthly, the joint of the base 7 and the pipe cap 3 of the product obtained in the fifth step is encapsulated, the product is placed for 30min, the Fresnel lens 1 is sleeved outside the pipe cap close to the upper end, and the product is tested to be qualified, so that the finished pyroelectric infrared sensor is obtained.
Embodiment 3 is as shown in fig. 2, fig. 3 and fig. 4, the pyroelectric infrared sensor comprises a pipe cap 3, the pipe cap 3 is made of an aluminum alloy material, the pipe cap 3 is subjected to pressure sealing test, the test pressure is 1.5MPa, the side wall of the pipe cap 3 is guaranteed not to have defects such as cracks and air holes, a window is formed in the upper end of the pipe cap 3 close to the middle position, a step is arranged on the inner wall of the window close to the lower end, the upper surface of the step is located in the same plane, an optical filter 2 is arranged in the window at the upper end of the step, the optical filter 2 is an infrared optical filter, and can be silicon-based, germanium-based, infrared glass-based and infrared-transmitting film-based optical filters, and is plated with an infrared antireflection film and a stop film, so that received radiant waves are purified, the optical filter 2 is in sealing connection with the inner wall of the window and the upper surface of the step through sealing glue, the sealing glue is polyurethane sealing glue, a fresnel lens 1 is sleeved on the outer side of the pipe cap 3 close to the upper end, a first bulge 10 is arranged near the lower end of the window, a second bulge 11 is also arranged on the position of the fresnel lens 1 close to the lower end, the second bulge 11 is arranged at the position close to the lower end of the fresnel lens 1, and the fresnel lens is not connected with the first bulge 10, and is convenient to rotate relatively, and the opening is made to rotate.
The inner wall of pipe cap 3 lower extreme opening part sets up to the step hole, the hole shoulder in step hole is downwards and be located the coplanar, be provided with one deck soft macromolecular material 9 on the lower terminal surface of hole shoulder, be provided with base 7 in the step hole of soft macromolecular material 9 lower extreme, base 7 sets up to the PCB board, its up end prints and has the circuit, base 3 upper surface still is fixed with electronic component 5, electronic component 5 links into the circuit, base 7 upper surface is close to the intermediate position and still is fixed with support column 6, support column 6 upper end is fixed with infrared optical sensing element 4, be provided with the conductive element on the support column 4, thereby make infrared optical sensing element 4 and circuit intercommunication, be provided with the sealant between base 7 outer fringe and the step hole inner wall and carry out sealing connection, soft macromolecular material 9 selects polyurethane clay, it can prevent to impress the sealant in the space that pipe cap 3 and base 7 enclose when the embedment.
The upper end face of the base 7 is provided with three downward through holes, pins 8, namely a first pin 8a, a second pin 8b and a third pin 8c, are penetrated in the through holes, the lower ends of the pins 8 extend out of the base 7, and the upper ends of the pins are communicated with a circuit, so that the product provided by the invention can exchange data with other equipment.
The lower end surface of the base 7 is also printed with a passage, and the passage is electrically connected with the pipe cap 3, so that a shielding layer is formed, and the interference of electromagnetic waves on the side surface of the pipe cap 3 on the internal circuit of the pipe cap 3 is reduced.
The base 7, the pipe cap 3 and the optical filter 2 are enclosed together to form a closed space filled with nitrogen, and the air pressure is lower than the atmospheric pressure, so that the oxidation of each component can be prevented, and the infrared propagation environment is improved.
The manufacturing method of the product provided by the invention comprises the following steps:
firstly, preparing a pipe cap 3, and coating polyurethane cement 9 on the step hole of the pipe cap, wherein the coating thickness is 1-1.5 mm.
In the second step, the base 7 is prepared, the circuit is printed on the upper surface of the base 7, the path is printed on the lower surface thereof, the electronic device 5 is connected into the circuit, and the path is printed on the lower surface of the base 7.
And thirdly, fixing a support column 6 on the upper end surface of the base obtained in the second step, fixing an infrared optical sensitive element 4 at the upper end of the support column, opening three downward through holes on the upper end surface of the base 7, dripping rosin water into the through holes, and then inserting pins 8 into the through holes and soldering.
And fourthly, placing the base manufactured in the third step into the step hole of the pipe cap 3, extruding the base towards the direction of the pipe cap 3, wherein the extrusion pressure is 10N, and continuing for 3s.
And fifthly, injecting nitrogen with the temperature of 70 ℃ into the space surrounded by the pipe cap 3, mounting the infrared optical filter 2 at the window of the pipe cap after 1S, coating sealant, and then blowing low-temperature dry air to the pipe cap to cool the pipe cap for 9S. The temperature of the low-temperature dry air is 5 ℃, so that the pipe cap 3 and accessories thereof can be rapidly cooled, and the damage of electric elements in the pipe cap is avoided.
And sixthly, the joint of the base 7 and the pipe cap 3 of the product obtained in the fifth step is encapsulated, the product is placed for 30min, the Fresnel lens 1 is sleeved outside the pipe cap close to the upper end, and the product is tested to be qualified, so that the finished pyroelectric infrared sensor is obtained.
Embodiment 4 the pyroelectric infrared sensor as shown in fig. 2, 3 and 4 comprises a tube cap 3, wherein the tube cap 3 is made of an aluminum alloy material, the tube cap 3 is subjected to pressure sealing test, the test pressure is 1.5MPa, the side wall of the tube cap 3 is guaranteed not to have defects such as cracks and air holes, a window is formed in the upper end of the tube cap 3 close to the middle position, a step is arranged on the inner wall of the window close to the lower end, the upper surface of the step is positioned in the same plane, an optical filter 2 is arranged in the window at the upper end of the step, the optical filter 2 is an infrared optical filter, and can be silicon-based, germanium-based, infrared glass-based and infrared-transmitting film-based optical filters, and is plated with an infrared antireflection film and a stop film, so that received radiant waves are purified, the optical filter 2 is in sealing connection with the inner wall of the window and the upper surface of the step through a sealing glue, the sealing glue is polyurethane sealing glue, a fresnel lens 1 is sleeved on the outer side of the tube cap 3 close to the upper end, a first bulge 10 is arranged near the lower end of the window, a second bulge 11 is also arranged on the position of the fresnel lens 1 close to the lower end, the second bulge 11 is arranged in the position, the second bulge 11 is arranged at the position close to the lower end of the window, and the fresnel lens 1 is not connected with the first bulge 10 in a rotary mode, and the opening is convenient.
The inner wall of pipe cap 3 lower extreme opening part sets up to the step hole, the hole shoulder in step hole is downwards and be located the coplanar, be provided with one deck soft macromolecular material 9 on the lower terminal surface of hole shoulder, be provided with base 7 in the step hole of soft macromolecular material 9 lower extreme, base 7 sets up to the PCB board, its up end prints and has the circuit, base 3 upper surface still is fixed with electronic component 5, electronic component 5 links into the circuit, base 7 upper surface is close to the intermediate position and still is fixed with support column 6, support column 6 upper end is fixed with infrared optical sensing element 4, be provided with the conductive element on the support column 4, thereby make infrared optical sensing element 4 and circuit intercommunication, be provided with the sealant between base 7 outer fringe and the step hole inner wall and carry out sealing connection, soft macromolecular material 9 selects polyurethane clay, it can prevent to impress the sealant in the space that pipe cap 3 and base 7 enclose when the embedment.
The upper end face of the base 7 is provided with three downward through holes, pins 8, namely a first pin 8a, a second pin 8b and a third pin 8c, are penetrated in the through holes, the lower ends of the pins 8 extend out of the base 7, and the upper ends of the pins are communicated with a circuit, so that the product provided by the invention can exchange data with other equipment.
The lower end surface of the base 7 is also printed with a passage, and the passage is electrically connected with the pipe cap 3, so that a shielding layer is formed, and the interference of electromagnetic waves on the side surface of the pipe cap 3 on the internal circuit of the pipe cap 3 is reduced.
The base 7, the pipe cap 3 and the optical filter 2 jointly enclose a closed space filled with nitrogen, and the air pressure is lower than the normal atmospheric pressure, so that each component can be prevented from being oxidized, and the infrared propagation environment is improved.
The manufacturing method of the product provided by the invention comprises the following steps:
firstly, preparing a pipe cap 3, and coating polyurethane cement 9 on the step hole of the pipe cap, wherein the coating thickness is 1-1.5 mm.
In the second step, the base 7 is prepared, the circuit is printed on the upper surface of the base 7, the path is printed on the lower surface thereof, the electronic device 5 is connected into the circuit, and the path is printed on the lower surface of the base 7.
And thirdly, fixing a support column 6 on the upper end surface of the base obtained in the second step, fixing an infrared optical sensitive element 4 at the upper end of the support column, opening three downward through holes on the upper end surface of the base 7, dripping rosin water into the through holes, and then inserting pins 8 into the through holes and soldering.
And fourthly, placing the base manufactured in the third step into the step hole of the pipe cap 3, extruding the base towards the direction of the pipe cap 3, wherein the extrusion pressure is 10N, and continuing for 3s.
And fifthly, injecting nitrogen with the temperature of 65 ℃ into the space surrounded by the pipe cap 3, mounting the infrared optical filter 2 at a window of the pipe cap after 1S, coating sealant, and then blowing low-temperature dry air to the pipe cap to cool the pipe cap for 8S. The temperature of the low-temperature dry air is 5 ℃, so that the pipe cap 3 and accessories thereof can be rapidly cooled, and the damage of electric elements in the pipe cap is avoided.
And sixthly, the joint of the base 7 and the pipe cap 3 of the product obtained in the fifth step is encapsulated, the product is placed for 30min, the Fresnel lens 1 is sleeved outside the pipe cap close to the upper end, and the product is tested to be qualified, so that the finished pyroelectric infrared sensor is obtained.
Embodiment 5 the pyroelectric infrared sensor as shown in fig. 2, 3 and 4 comprises a tube cap 3, wherein the tube cap 3 is made of an aluminum alloy material, the tube cap 3 is subjected to pressure sealing test, the test pressure is 1.5MPa, the side wall of the tube cap 3 is guaranteed not to have defects such as cracks and air holes, a window is formed in the upper end of the tube cap 3 close to the middle position, a step is arranged on the inner wall of the window close to the lower end, the upper surface of the step is positioned in the same plane, an optical filter 2 is arranged in the window at the upper end of the step, the optical filter 2 is an infrared optical filter, and can be silicon-based, germanium-based, infrared glass-based and infrared-transmitting film-based optical filters, and is plated with an infrared antireflection film and a stop film, so that received radiant waves are purified, the optical filter 2 is in sealing connection with the inner wall of the window and the upper surface of the step through a sealing glue, the sealing glue is polyurethane sealing glue, a fresnel lens 1 is sleeved on the outer side of the tube cap 3 close to the upper end, a first bulge 10 is arranged near the lower end of the window, a second bulge 11 is also arranged on the position of the fresnel lens 1 close to the lower end, the second bulge 11 is arranged in the position, the second bulge 11 is arranged at the position close to the lower end of the window, and the fresnel lens 1 is not connected with the first bulge 10 in a rotary mode, and the opening is convenient.
The inner wall of pipe cap 3 lower extreme opening part sets up to the step hole, the hole shoulder in step hole is downwards and be located the coplanar, be provided with one deck soft macromolecular material 9 on the lower terminal surface of hole shoulder, be provided with base 7 in the step hole of soft macromolecular material 9 lower extreme, base 7 sets up to the PCB board, its up end prints and has the circuit, base 3 upper surface still is fixed with electronic component 5, electronic component 5 links into the circuit, base 7 upper surface is close to the intermediate position and still is fixed with support column 6, support column 6 upper end is fixed with infrared optical sensing element 4, be provided with the conductive element on the support column 4, thereby make infrared optical sensing element 4 and circuit intercommunication, be provided with the sealant between base 7 outer fringe and the step hole inner wall and carry out sealing connection, soft macromolecular material 9 selects polyurethane clay, it can prevent to impress the sealant in the space that pipe cap 3 and base 7 enclose when the embedment.
The upper end face of the base 7 is provided with three downward through holes, pins 8, namely a first pin 8a, a second pin 8b and a third pin 8c, are penetrated in the through holes, the lower ends of the pins 8 extend out of the base 7, and the upper ends of the pins are communicated with a circuit, so that the product provided by the invention can exchange data with other equipment.
The lower end surface of the base 7 is also printed with a passage, and the passage is electrically connected with the pipe cap 3, so that a shielding layer is formed, and the interference of electromagnetic waves on the side surface of the pipe cap 3 on the internal circuit of the pipe cap 3 is reduced.
The base 7, the pipe cap 3 and the optical filter 2 jointly enclose a closed space filled with nitrogen, and the air pressure is lower than the normal atmospheric pressure, so that each component can be prevented from being oxidized, and the infrared propagation environment is improved.
The manufacturing method of the product provided by the invention comprises the following steps:
firstly, preparing a pipe cap 3, and coating polyurethane cement 9 on the step hole of the pipe cap, wherein the coating thickness is 1-1.5 mm.
In the second step, the base 7 is prepared, the circuit is printed on the upper surface of the base 7, the path is printed on the lower surface thereof, the electronic device 5 is connected into the circuit, and the path is printed on the lower surface of the base 7.
And thirdly, fixing a support column 6 on the upper end surface of the base obtained in the second step, fixing an infrared optical sensitive element 4 at the upper end of the support column, opening three downward through holes on the upper end surface of the base 7, dripping rosin water into the through holes, and then inserting pins 8 into the through holes and soldering.
And fourthly, placing the base manufactured in the third step into the step hole of the pipe cap 3, extruding the base towards the direction of the pipe cap 3, wherein the extrusion pressure is 10N, and continuing for 3s.
And fifthly, injecting nitrogen with the temperature of 60 ℃ into the space surrounded by the pipe cap 3, mounting the infrared optical filter 2 at a window of the pipe cap after 1s, coating sealant, and then blowing low-temperature dry air to the pipe cap to cool the pipe cap for 8s. The temperature of the low-temperature dry air is 5 ℃, so that the pipe cap 3 and accessories thereof can be rapidly cooled, and the damage of electric elements in the pipe cap is avoided.
And sixthly, the joint of the base 7 and the pipe cap 3 of the product obtained in the fifth step is encapsulated, the product is placed for 30min, the Fresnel lens 1 is sleeved outside the pipe cap close to the upper end, and the product is tested to be qualified, so that the finished pyroelectric infrared sensor is obtained.
Table 1
Claims (6)
1. The utility model provides a pyroelectric infrared sensor, includes the tube cap, the tube cap upper end is close to the intermediate position and opens there is the window, window department is provided with the light filter, the tube cap is close to the outside cover of upper end and is equipped with fresnel lens, tube cap lower extreme opening, and the opening part is provided with the base, the base is the PCB board, and its upper surface printing has the circuit, and the lower surface printing has the passageway that is used for preventing static, base and tube cap enclose into a seal structure jointly, be provided with electronic device in the seal structure, electronic device sets up on the base, the last printing has the circuit of base, electronic device is connected with the circuit electricity, the base lower extreme is provided with the pin, the pin is connected with the circuit electricity, still be provided with the support column in the seal structure, the support column lower extreme is connected with the base, and the upper end is provided with infrared optical sensing element, the base is the PCB board, its characterized in that, the inner wall of tube cap lower extreme opening part is provided with the step hole, the hole shoulder is just is located same plane face down, a high-quality soft shoulder material is provided with the step hole, the high-quality soft shoulder material is provided with the base, high-quality soft shoulder material is provided with the outer fringe between the base.
2. The pyroelectric infrared sensor of claim 1, wherein said pins are sealingly connected to said base.
3. The pyroelectric infrared sensor according to claim 1, wherein said cap is made of an aluminum alloy material, which is subjected to a pressure sealing test, said test pressure being 1.3 to 1.5MPa.
4. The pyroelectric infrared sensor according to claim 1, wherein the air pressure in said closed structure is 0.7-0.85 MPa, and said optical filter is hermetically connected to said cap.
5. The pyroelectric infrared sensor according to claim 1, wherein said closed structure is filled with nitrogen gas.
6. The method of manufacturing a pyroelectric infrared sensor according to any one of claims 1 to 5, comprising the steps of:
firstly, preparing a pipe cap, and coating polyurethane cement on a step hole of the pipe cap, wherein the coating thickness is 1-1.5 mm;
secondly, preparing a base, printing a circuit on the upper surface of the base, printing a passage on the lower surface of the base, connecting an electronic device into the circuit, fixing the electronic device, and printing the passage on the lower surface of the base;
thirdly, fixing a support column on the upper end surface of the base obtained in the second step, fixing an infrared optical sensitive element at the upper end of the support column, opening 3 downward through holes on the upper end surface of the base, dripping rosin water into the through holes, inserting pins into the through holes, and soldering;
fourthly, placing the base manufactured in the third step into a step hole of a pipe cap, extruding the base towards the direction of the pipe cap, wherein the extrusion pressure is 10-15N, and lasting for 3-5 s;
fifthly, injecting nitrogen with the temperature of 60-80 ℃ into a space surrounded by the pipe cap, mounting an infrared optical filter at a window of the pipe cap after 1s, coating sealant, and blowing low-temperature dry air to the pipe cap to cool the pipe cap for 8-10 s;
and sixthly, filling and sealing the joint of the base and the pipe cap of the product obtained in the fifth step, placing for 30min, sleeving a Fresnel lens on the outer side of the pipe cap close to the upper end, and obtaining the finished pyroelectric infrared sensor after test qualification.
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| WO1986007449A1 (en) * | 1985-06-06 | 1986-12-18 | Nippon Ceramic Co., Ltd. | Pyroelectric infrared sensor |
| CN103413806A (en) * | 2013-08-23 | 2013-11-27 | 电子科技大学 | Pyroelectric sensor packaging structure |
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| WO1986007449A1 (en) * | 1985-06-06 | 1986-12-18 | Nippon Ceramic Co., Ltd. | Pyroelectric infrared sensor |
| CN103413806A (en) * | 2013-08-23 | 2013-11-27 | 电子科技大学 | Pyroelectric sensor packaging structure |
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