CN106532210A - Assembly method of multi-channel microstrip circulator assembly - Google Patents
Assembly method of multi-channel microstrip circulator assembly Download PDFInfo
- Publication number
- CN106532210A CN106532210A CN201611183742.8A CN201611183742A CN106532210A CN 106532210 A CN106532210 A CN 106532210A CN 201611183742 A CN201611183742 A CN 201611183742A CN 106532210 A CN106532210 A CN 106532210A
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- China
- Prior art keywords
- circulator
- assembly
- cavity
- microstrip
- multichannel
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/32—Non-reciprocal transmission devices
- H01P1/38—Circulators
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
The invention provides an assembly method of a multi-channel microstrip circulator assembly. The assembly method comprises the steps of firstly, sequentially placing a circuit boarding soldering sheet and a microstrip circuit board in a cavity of the circulator assembly, fixing the microstrip circuit board in the circulator assembly by a mode of eutectic sintering, and reducing a void ratio of a grounding surface at the bottom of the microstrip circuit board; secondly, welding a radio frequency connector in a connector installation hole of the cavity by welding paste, filling the connector installation hole with a pouring sealant so as to improve three-proof performance, pasting a circulator in the cavity of the circulator assembly by a conductive adhesive, and connecting the circulator and the microstrip circuit board by a lead bonding mode; and finally, placing the assembly soldering sheet on the circulator assembly. Two circulator assemblies are sealed and fixed by a soldering sealing mode, and low-temperature and high-airtight package of the double-sided cavity is achieved.
Description
Technical field
The present invention relates to microelectronics assembling process technique field, more particularly to a kind of multichannel microstrip circulator component assembling
Method.
Background technology
X-band multichannel microstrip circulator component is one of microwave system key component parts, in various passive, active microwaves
Be applied in circuit module, extension set, whole machine, play isolate between transmission duplex, level, prevent from harassing, impedance matching, decoupling etc. are made
With.Along with the development of active phase array antenna technology, tile type of the multichannel T/R components in now multichannel, miniaturization
Component trend development, and then the demand for development of high integration, miniaturization, light weight is proposed to circulator component.
The assembling of multichannel microstrip circulator component, comprising micro belt board ground connection welding, radio frequency connector it is airtight
Property assembling, the assembling between circulator and cavity, the sealing interconnection of two-sided cavity and overall circulator assembly three anti-process etc.
Content is assembled, the assembling content being related to and operation are more.
There is following defect in the packaging technology of prior art：
1st, the assembling under traditional same temperature cannot realize the integrated assembling of circulator assembly；
2nd, for the low latitude hole ground connection welding of micro belt board 2, cannot be realized using traditional reflow solder technique, such as be schemed
Shown in 1, conventional backflow welding can produce more cavity at the back side of micro belt board 2；
3rd, the sealing of two-sided cavity cannot also adopt traditional package sealing with laser or parallel envelope Type of Welding to realize air-tightness
Encapsulation；
4th, for three anti-disposal ability of efficient constructional appearance, traditional three anti-process meanses cannot be realized always.
The content of the invention
To overcome at least one defect of above-mentioned prior art presence, the invention provides a kind of multichannel microstrip circulator
Component assembly method, comprises the steps：
Step one, is placed on circuit board pads and micro belt board in the cavity of circulator assembly, successively by eutectic
The mode of sintering is fixed on micro belt board in circulator assembly；
Step 2, radio frequency connector is welded in the connector mounting hole of the cavity by soldering paste；
Step 3, is bonded to circulator in the cavity of circulator assembly by conducting resinl, and by wire bonding mode
Circulator and micro belt board are connected；
Step 4, the placing modules weld tabs on circulator assembly, by two circulator assemblies by way of sealed with brazing
Sealing is fixed.
Preferably, also including step 5, step 5 is that casting glue is filled into connector mounting hole.
Preferably, gold ribbon is adopted in step 3 as the lead in wire bonding mode.
Preferably, quantity identical alignment pin installing hole is provided with circulator assembly and component weld tabs, component weld tabs leads to
Cross alignment pin installing hole to align with circulator assembly.
Preferably, the fusing point of soldering paste is lower than the fusing point of circuit board pads at least 30 degree.
A kind of multichannel microstrip circulator component assembly method that the present invention is provided, is sintered using the eutectic of micro belt board
Technique, reduces micro belt board bottom ground plane voidage, and then the standing wave of the whole circulator assembly of reduction, improves circulator group
The first-time qualification rate of part；It is using the sealed with brazing technology based on eutectic welding tablet, by being accurately positioned for alignment pin installing hole, real
The low temperature of existing two-sided cavity, high airtight encapsulation；Using epoxy glue encapsulation technology, to circulator assembly multichannel connector position
Embedding protection is carried out, efficient three anti-abilities of overall circulator assembly is realized, is carried out the long-term reliability of deduction integral product.
Description of the drawings
Fig. 1 is microstrip circuit back cavity schematic diagram in prior art；
Fig. 2 is the flow chart of multichannel microstrip circulator component assembly method；
Fig. 3 is circulator assembly schematic internal view；
Fig. 4 is the microstrip circuit back cavity schematic diagram under eutectic sintering technology；
Fig. 5 is the structural representation of radio frequency connector and circulator assembly junction；
Fig. 6 is the installation site figure of component weld tabs；
Fig. 7 is the side schematic view that the assembling of multichannel microstrip circulator component is completed；
Fig. 8 is the structural representation that the assembling of multichannel microstrip circulator component is completed.
Reference：Circulator assembly 1, micro belt board 2, soldering paste 3, radio frequency connector 4, connector mounting hole 5 go in ring
Device 6, component weld tabs 7, casting glue 8, alignment pin installing hole 9.
Specific embodiment
To make purpose, technical scheme and the advantage of present invention enforcement clearer, below in conjunction with the embodiment of the present invention
Accompanying drawing, the technical scheme in the embodiment of the present invention is further described in more detail.In the accompanying drawings, identical from start to finish or class
As label represent same or similar element or the element with same or like function.Described embodiment is the present invention
A part of embodiment, rather than the embodiment of whole.It is exemplary below with reference to the embodiment of Description of Drawings, it is intended to use
It is of the invention in explaining, and be not considered as limiting the invention.Based on the embodiment in the present invention, ordinary skill people
The every other embodiment obtained under the premise of creative work is not made by member, belongs to the scope of protection of the invention.
In describing the invention, it is to be understood that term " " center ", " longitudinal direction ", " horizontal ", "front", "rear",
The orientation or position relationship of the instruction such as "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outward " is based on accompanying drawing institute
The orientation for showing or position relationship, are for only for ease of the description present invention and simplify description, rather than indicate or imply indication
Device or element with specific orientation, with specific azimuth configuration and operation, therefore it is not intended that must be protected to the present invention
The restriction of shield scope.
Below by specific embodiment, the present invention is described in further detail.
Specific embodiment：
As shown in Fig. 2 the invention provides a kind of multichannel microstrip circulator component assembly method, comprises the steps：
Step one, as shown in figure 3, micro-strip is electric according to the order of micro belt board 2, circuit board pads, circulator assembly 1
Road plate 2 is placed on the welding position in 1 cavity of circulator assembly with circuit board pads, and is pressed with frock, wherein circuit board weldering
Piece preferably adopts AgSn solder sheets, then using prefabricated eutectic sintering temperature curve, carries out eutectic burning to micro belt board 2
Knot so as to be fixed in circulator assembly 1, the mode sintered using eutectic can substantially reduce 2 back side voidage of micro belt board,
As shown in Figure 4；
Step 2, as shown in figure 5, the radio frequency connector for coating soldering paste 3 is installed to circulator assembly 1 using customization frock
In the connector mounting hole 5 of cavity, and recruitment is put into row and is reinforced, and using solder reflow process, radio frequency connector 4 is soldered to chamber
On body, wherein the fusing point of soldering paste 3 is lower than the fusing point of circuit board pads at least 30 degree；
Circulator 6, using conducting resinl epoxy cement technique, is bonded to 1 chamber of circulator assembly by conducting resinl by step 3
In vivo at the circulator installation position in portion, and lead key closing process is adopted, the circuit of circulator 6 and micro belt board 2 is passed through
Gold ribbon connects；
Step 4, as shown in FIG. 6 and 7, the placing modules weld tabs 7 on circulator assembly 1, wherein 1 He of circulator assembly
Quantity identical alignment pin installing hole 9 is provided with component weld tabs 7, component weld tabs 7 is by alignment pin installing hole 9 and circulator group
Part 1 aligns, and component weld tabs 7 preferably adopts low temperature InPbAg weld tabs, is then based on the sealed with brazing technique of low temperature weld tabs, will
Two 1 cavitys of circulator assembly carry out sealed with brazing using back-off form, and the otherness of component weld tabs 7 is controllable, facilitates mass
Production.
Step 5, using dosing technology, fills casting glue 8 into connector mounting hole 5, and casting glue 8 preferably adopts epoxy
Resin glue, filling casting glue 8 can improve NBC protective performance, and three prevent referring to mould proof, moisture proof, Defend salt fog.
In being embodied as, Incoming Quality Control can be carried out to all parts first before execution step one as needed,
Product quality and solderability are verified, and the cavity to circulator assembly 1, micro belt board 2, circuit board pads are cleaned, with
Ensure that circulator assembly 1 normally can be assembled.
The schematic diagram being illustrated in figure 8 after the completion of circulator assembly is assembled, after the completion of circulator assembly assembling, can also root
According to needing which is screened to ensure product quality.
The above, the only specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, any
Those familiar with the art the invention discloses technical scope in, the change or replacement that can be readily occurred in all are answered
It is included within the scope of the present invention.Therefore, protection scope of the present invention with the scope of the claims should be
It is accurate.
Claims (5)
1. a kind of multichannel microstrip circulator component assembly method, it is characterised in that comprise the steps：
Step one, is placed on circuit board pads and micro belt board (2) in the cavity of circulator assembly (1) successively, by altogether
The mode of brilliant sintering is fixed on micro belt board (2) in circulator assembly (1)；
Step 2, radio frequency connector (4) is welded to by soldering paste (3) in the connector mounting hole (5) of the cavity；
Step 3, is bonded to circulator (6) in the cavity of circulator assembly (1) by conducting resinl, and passes through wire bonding side
Circulator (6) and micro belt board (2) are connected by formula；
Step 4, the placing modules weld tabs (7) on circulator assembly (1), by two circulator groups by way of sealed with brazing
Part (1) sealing is fixed.
2. multichannel microstrip circulator component assembly method according to claim 1, it is characterised in that also including step
Five, step 5 is filling casting glue (8) into connector mounting hole (5).
3. multichannel microstrip circulator component assembly method according to claim 1, it is characterised in that adopt in step 3
Gold ribbon is used as the lead in wire bonding mode.
4. multichannel microstrip circulator component assembly method according to claim 1, it is characterised in that circulator assembly
(1) quantity identical alignment pin installing hole (9) and on component weld tabs (7) is provided with, component weld tabs (7) is by alignment pin installing hole
(9) align with circulator assembly (1).
5. multichannel microstrip circulator component assembly method according to claim 1, it is characterised in that soldering paste (3) it is molten
Point is lower than the fusing point of circuit board pads at least 30 degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611183742.8A CN106532210A (en) | 2016-12-20 | 2016-12-20 | Assembly method of multi-channel microstrip circulator assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611183742.8A CN106532210A (en) | 2016-12-20 | 2016-12-20 | Assembly method of multi-channel microstrip circulator assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106532210A true CN106532210A (en) | 2017-03-22 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611183742.8A Pending CN106532210A (en) | 2016-12-20 | 2016-12-20 | Assembly method of multi-channel microstrip circulator assembly |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109347450A (en) * | 2018-09-13 | 2019-02-15 | 安徽华东光电技术研究所有限公司 | A kind of processing method of Asia 20 watts of pulse power amplifiers of terahertz wave band |
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| CN201054461Y (en) * | 2007-06-25 | 2008-04-30 | 镇江市电子管厂 | Thin type high power gas discharge tube |
| US20100060373A1 (en) * | 2008-09-08 | 2010-03-11 | Kabushiki Kaisha Toshiba | High frequency package and manufacturing method thereof |
| CN201487610U (en) * | 2009-07-30 | 2010-05-26 | 比亚迪股份有限公司 | LED component |
| CN203553319U (en) * | 2013-11-22 | 2014-04-16 | 南京广顺电子技术研究所 | Microstrip substrate-type double-junction circulator |
| CN204794891U (en) * | 2015-07-30 | 2015-11-18 | 苏州同泰新能源科技有限公司 | Photovoltaic terminal box with integrated module of bypass |
| CN205648301U (en) * | 2016-03-17 | 2016-10-12 | 长沙启科电子有限公司 | Be used for brushless electric pick back heat dissipation post linear distribution intercalary band round hole radiator |
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2016
- 2016-12-20 CN CN201611183742.8A patent/CN106532210A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201054461Y (en) * | 2007-06-25 | 2008-04-30 | 镇江市电子管厂 | Thin type high power gas discharge tube |
| US20100060373A1 (en) * | 2008-09-08 | 2010-03-11 | Kabushiki Kaisha Toshiba | High frequency package and manufacturing method thereof |
| CN201487610U (en) * | 2009-07-30 | 2010-05-26 | 比亚迪股份有限公司 | LED component |
| CN203553319U (en) * | 2013-11-22 | 2014-04-16 | 南京广顺电子技术研究所 | Microstrip substrate-type double-junction circulator |
| CN204794891U (en) * | 2015-07-30 | 2015-11-18 | 苏州同泰新能源科技有限公司 | Photovoltaic terminal box with integrated module of bypass |
| CN205648301U (en) * | 2016-03-17 | 2016-10-12 | 长沙启科电子有限公司 | Be used for brushless electric pick back heat dissipation post linear distribution intercalary band round hole radiator |
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| 房迅雷: "微波立体组装技术研究", 《中国优秀硕士学位论文全文数据库信息科技辑》 * |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109347450A (en) * | 2018-09-13 | 2019-02-15 | 安徽华东光电技术研究所有限公司 | A kind of processing method of Asia 20 watts of pulse power amplifiers of terahertz wave band |
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Application publication date: 20170322 |
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