CN203553319U - Microstrip substrate-type double-junction circulator - Google Patents
Microstrip substrate-type double-junction circulator Download PDFInfo
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- CN203553319U CN203553319U CN201320740095.1U CN201320740095U CN203553319U CN 203553319 U CN203553319 U CN 203553319U CN 201320740095 U CN201320740095 U CN 201320740095U CN 203553319 U CN203553319 U CN 203553319U
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- microstrip
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Abstract
The utility model provides a microstrip substrate-type double-junction circulator and relates to the technical field of circulators. Microstrip circuits (4) are electroplated on the upper surface of a ferrite substrate (3) via lithography; a radio frequency resistor chip (1) is welded on a magnetic metal base (2) via a soldering paste; a welding point of the radio frequency resistor chip (1) is welded via the soldering paste and is connected with one pin of the microstrip circuit (4); two ceramic pieces (5) are glued on the microstrips circuit (4) via epoxy resin; two permanent magnets (6) are respectively glued on the two ceramic pieces (5) via epoxy resin; the central axis of the microstrip circuit (4), the central axis of the ceramic piece (5) and the central axis of the permanent magnet (6) are overlapped; and the ferrite substrate (3) is welded on the magnetic metal base (2) via the soldering paste. The microstrip substrate-type double-junction circulator has the advantages that the structure is simple, the size is small, the weight is light, the circulator is suitable for surface mounting and microwave circuit integration, the frequency band is wide, and the power is large.
Description
Technical field:
The utility model relates to circulator technical field, is specifically related to a kind of microstrip substrate formula binode circulator.
Background technology:
Along with developing rapidly of microwave communication, the application of microwave electron equipment is increasingly extensive, overall performance also improves a lot, ferrite circulator index, volume wherein are also had higher requirement, embedded circulator can not meet the demand of many system pasters substantially, and existing SMD circulator is because frequency band is narrower, volume is larger, can not meet the needs of miniaturization.
Utility model content:
The purpose of this utility model is to provide a kind of microstrip substrate formula binode circulator, and it is simple in structure, and volume is little, lightweight, is applicable to surface mount and microwave circuit is integrated, and bandwidth, power are large.
In order to solve the existing problem of background technology, the utility model is to adopt following technical scheme: it comprises radio-frequency resistance chip, magnetic metal base, ferrite substrate, microstrip circuit, potsherd and permanent magnet, microstrip circuit is electroplated at ferrite substrate upper surface by photoetching technique, radio-frequency resistance chip is welded on magnetic metal base by solder(ing) paste, the solder joint of radio-frequency resistance chip welds by solder(ing) paste and is connected with a pin of microstrip circuit, two potsherds are all glued on microstrip circuit by epoxy resin, two permanent magnets are glued on two potsherds by epoxy resin respectively, the central axis of microstrip circuit, the central axis overlaid of the central axis of potsherd and permanent magnet, ferrite substrate is welded on magnetic metal base by solder(ing) paste.
Described ferrite substrate is spinel ferrite, and described permanent magnet is samarium cobalt permanent magnet body, and described magnetic metal base is made with steel.
The utility model guarantees permanent magnet longitudinal magnetized ferrite substrate; the magnetization of ferrite substrate edge evenly; ground connection is good; and because the thermal coefficient of expansion of base and ferrite substrate is suitable; can when welding, protect ferrite substrate; reduce the risk that causes ferrite substrate cracking due to welding, improved the reliability of product.
Meanwhile, described ferrite substrate upper surface is taked polishing, utilizes chemical method degreasing and foreign particle, and physical method effects on surface activates, removes absorption impurity, guarantees the adhesive force of circuit rete.
Above-mentioned microstrip substrate formula binode circulator is applicable to surface mounting technology, and is connected with microwave circuit by gold wire bonding technology.
The utility model has following beneficial effect: simple in structure, volume is little, lightweight, is applicable to surface mount and microwave circuit is integrated, and bandwidth, power are large.
Accompanying drawing explanation:
Fig. 1 is decomposing schematic representation of the present utility model;
Fig. 2 is stereogram of the present utility model;
Fig. 3 is the key technical indexes schematic diagram in this embodiment.
Embodiment:
Referring to Fig. 1-Fig. 2, this embodiment adopts following technical scheme: it comprises radio-frequency resistance chip 1, magnetic metal base 2, ferrite substrate 3, microstrip circuit 4, potsherd 5 and permanent magnet 6, microstrip circuit 4 is electroplated at ferrite substrate 3 upper surfaces by photoetching technique, radio-frequency resistance chip 1 is welded on magnetic metal base 2 by solder(ing) paste, the solder joint of radio-frequency resistance chip 1 welds by solder(ing) paste and is connected with a pin of microstrip circuit 4, two potsherds 5 are all glued on microstrip circuit 4 by epoxy resin, two permanent magnets 6 are glued on two potsherds 5 by epoxy resin respectively, the central axis of microstrip circuit 4, the central axis overlaid of the central axis of potsherd 5 and permanent magnet 6, ferrite substrate 3 is welded on magnetic metal base 2 by solder(ing) paste.
Described ferrite substrate 3 is spinel ferrite, and described permanent magnet 6 is samarium cobalt permanent magnet body, and described magnetic metal base 2 use steel are made.
Described microstrip substrate formula binode circulator is applicable to surface mounting technology, and is connected with microwave circuit by gold wire bonding technology.
The key technical indexes of described microstrip substrate formula binode circulator as shown in Figure 3.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all within spirit of the present utility model and principle, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection range of the present utility model.
Claims (2)
1. a microstrip substrate formula binode circulator, it is characterized in that it comprises radio-frequency resistance chip (1), magnetic metal base (2), ferrite substrate (3), microstrip circuit (4), potsherd (5) and permanent magnet (6), microstrip circuit (4) is electroplated at ferrite substrate (3) upper surface by photoetching technique, radio-frequency resistance chip (1) is welded on magnetic metal base (2) by solder(ing) paste, the solder joint of radio-frequency resistance chip (1) welds by solder(ing) paste and is connected with a pin of microstrip circuit (4), two potsherds (5) are all glued on microstrip circuit (4) by epoxy resin, two permanent magnets (6) are glued on two potsherds (5) by epoxy resin respectively, the central axis of microstrip circuit (4), the central axis overlaid of the central axis of potsherd (5) and permanent magnet (6), ferrite substrate (3) is welded on magnetic metal base (2) by solder(ing) paste.
2. a kind of microstrip substrate formula binode circulator according to claim 1, is characterized in that described ferrite substrate (3) is spinel ferrite, and permanent magnet (6) is samarium cobalt permanent magnet body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320740095.1U CN203553319U (en) | 2013-11-22 | 2013-11-22 | Microstrip substrate-type double-junction circulator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320740095.1U CN203553319U (en) | 2013-11-22 | 2013-11-22 | Microstrip substrate-type double-junction circulator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203553319U true CN203553319U (en) | 2014-04-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320740095.1U Expired - Fee Related CN203553319U (en) | 2013-11-22 | 2013-11-22 | Microstrip substrate-type double-junction circulator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203553319U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106532210A (en) * | 2016-12-20 | 2017-03-22 | 中国航空工业集团公司雷华电子技术研究所 | Assembly method of multi-channel microstrip circulator assembly |
| CN110885060A (en) * | 2019-10-29 | 2020-03-17 | 河北美泰电子科技有限公司 | Packaging method of MEMS circulator |
-
2013
- 2013-11-22 CN CN201320740095.1U patent/CN203553319U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106532210A (en) * | 2016-12-20 | 2017-03-22 | 中国航空工业集团公司雷华电子技术研究所 | Assembly method of multi-channel microstrip circulator assembly |
| CN110885060A (en) * | 2019-10-29 | 2020-03-17 | 河北美泰电子科技有限公司 | Packaging method of MEMS circulator |
| CN110885060B (en) * | 2019-10-29 | 2023-07-21 | 河北美泰电子科技有限公司 | Packaging method of MEMS circulator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140416 Termination date: 20191122 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |