CN113013154B - Integrated packaging tube shell of flat phased array antenna transceiver component - Google Patents
Integrated packaging tube shell of flat phased array antenna transceiver component Download PDFInfo
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- CN113013154B CN113013154B CN202110183854.8A CN202110183854A CN113013154B CN 113013154 B CN113013154 B CN 113013154B CN 202110183854 A CN202110183854 A CN 202110183854A CN 113013154 B CN113013154 B CN 113013154B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/165—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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- Engineering & Computer Science (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
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- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
Abstract
The invention discloses an integrated packaging tube shell of a flat phased array antenna transceiver component, which aims to solve the problem of efficient heat dissipation of the transceiver component in a narrow space during working. The invention is realized by the following technical scheme: the shell cavity is divided into an upper shell cavity and a lower shell cavity by the middle dielectric layer, chip capacitors are distributed on two sides of the radio frequency chip, and the radio frequency chip is communicated with the phase change material layer through an array heat dissipation through hole penetrating through the middle dielectric layer; the radio frequency chip realizes signal transmission with an antenna network through printed metal wires, printed resistors on the metal wires and linear array solder balls arranged on two sides of an upper cover of an interconnection tube shell, wherein the printed metal wires extend to the bottom of an embedded cavity along a dielectric layer on the inner wall of the tube shell; the radio frequency chip is communicated with the heat dissipation through holes arranged in an array in the middle medium and the phase change material layer filled in the lower cavity of the tube shell, and the tube shell heat sink fixedly connected to the bottom end of the tube shell realizes heat exchange with the external environment, so that the high-efficiency heat dissipation function of the radio frequency chip in the integrated airtight packaging structure during working is completed.
Description
Technical Field
The invention relates to a flat phased array antenna which is mainly used for communication navigation functions in the aerospace field, in particular to an antenna transceiver component packaging tube shell which can be used as a structural member of a device carrier such as a transceiver component radio frequency chip and the like and can be used as a functional member for interconnecting a device and an antenna network.
Background
The phased array antenna can carry out beam forming configuration on N antenna array elements, intelligently control the amplitude and phase excitation of each individual antenna array element in the phased array antenna in an electronic mode, generate beams pointing to the required direction, and can carry out beam forming and beam scanning rapidly without inertia under the condition that the physical structure is fixed. The very excellent performance in beam-forming designs at the front end of phased array antennas makes this type of integrated die a dominant approach in large phased array radar and satellite communications applications. The conventional satellite communication antennas are mostly mechanical parabolic antennas, and the antennas have high section and heavy weight and need a servo system to provide antenna pointing changes. The electric scanning phased array antenna adopts a phase shifter to control the phase, does not need a mechanical structure, has the advantages of low profile, easy conformal performance, light weight and the like, and therefore, the electric scanning phased array antenna is increasingly applied to the construction of space-based systems such as high-orbit broadband, low-orbit mobile satellites and the like, and has wide application prospects in the fields of civil aviation/high-speed rail high-speed mobile communication, broadband internet access of maritime terminals in remote areas, enterprise/government big data platform construction and the like which are developed at present. The core active function of the electric scanning phased array antenna is realized by the transceiver component, and meanwhile, the transceiver component is the link with the highest cost ratio (60% -80%) and the finest assembly process and the most complex flow in the electric scanning phased array antenna, so that the performance of the transceiver component has a decisive influence on the index quality of the active function of the electric scanning phased array antenna.
Digital phase shifters and digital attenuators are important components of phased array antenna receiving assemblies. The phase shift accuracy and the attenuation accuracy directly affect the performance of the whole phased array antenna, so that a high-bit digital phase shifter and a digital attenuator become necessary choices. Assuming that the receiving assembly uses a 6-bit digital phase shifter and a 6-digital attenuator, the receiving assembly has 4096 (2 6 ×2 6 ) Phase-shifting attenuation states. Such a large number of phase-shifting attenuation states presents a significant challenge for testing of the receiving element. When the existing transceiver component consisting of an active chip, a circuit board, a connector, a metal shell and a cover plate fails, the performance problems of each component and a structural member and the connection problems during the assembly are required to be gradually examined due to the complex assembly process and the various types of used components, so that the problem positioning is difficult and the repair time is long. The existing transceiver component mostly adopts an integrated scheme of encapsulating active chips, circuit boards, connectors and other parts in a metal shell, and the scheme must use a radio frequency connector to realize signal interconnection between the transceiver component and an antenna. Because of the large number of radio frequency connectors, not only the manufacturing cost of the transceiver component is increased, but also the welding quality of the radio frequency connectors is extremely severely required, and the transceiver component is increasedDifficulty in assembly and repair. Therefore, in order to reduce the manufacturing cost of the transceiver component and improve the integration level of the transceiver component, a flat-panel phased array antenna transceiver component manufacturing scheme is formed, wherein the active functions of the transceiver component are chipped and chip-level devices are integrally packaged. In this scheme, the chip-level device needs to be packaged independently, and then is mounted on an antenna carrier board integrating multiple functions such as an antenna network. This requires the package housing to have not only the structural function of carrying the chip scale device and achieving its packaging, but also the functional function of achieving signal interconnection of the chipped device and the antenna carrier. Meanwhile, the active functional chip of the transceiver component can produce a large amount of heat during working, in the scheme, the active functional chip is packaged in a narrow packaging tube shell, and great difficulty is brought to heat dissipation of the active functional chip, so that the packaging tube shell also has to have good heat dissipation characteristics, and a heat dissipation channel between the active functional chip and the external environment is established.
The low temperature co-fired ceramic (LTCC) technology is a manufacturing technology that forms a multilayer interconnect substrate by performing processes such as hole cavity punching, wiring and via metallization, lamination, co-firing, etc. on green tapes. The LTCC substrate has the excellent characteristics of low thermal expansion, low transmission loss and low dielectric loss, so the LTCC substrate can meet the characteristic requirements of high current, high temperature resistance, high frequency communication and the like, and is widely applied to the front-edge fields of aerospace communication, microsystem integration and the like. In order to form a cavity structure in an LTCC substrate, research has been carried out by researchers outside China, for example, tick T uses a pressure-assisted sintering technology to manufacture a microwave guide cavity of a 160GHz waveguide antenna on the LTCC substrate, when the cavity is manufactured, an upper cover, an inner cavity and a bottom of the cavity are respectively laminated, and then the three parts are bonded and sintered to form the microwave guide cavity of 1.3mm multiplied by 0.615 mm. The research results provide technical basis for manufacturing the integrated package tube shell of the panel phased array antenna transceiver component by utilizing the low-temperature co-fired ceramic (LTCC) technology.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a packaging tube shell with integrated structure and function and good heat dissipation characteristic according to the manufacturing requirements of a flat phased array antenna aiming at a receiving and transmitting assembly packaging body which can be used as a structural member of a device carrier such as a receiving and transmitting assembly radio frequency chip and can also be used as a device and antenna network interconnection function.
The technical scheme adopted for solving the technical problems is as follows: the utility model provides a dull and stereotyped phased array antenna transceiver module integration encapsulation shell of having one and pass through the rectangular shell cavity 1 of shell upper cover 4 encapsulation and its shell heat sink 8 who links firmly in the bottom, its characterized in that: the shell cavity 1 is divided into a shell upper cavity 2 and a shell lower cavity 6 by a middle dielectric layer, a radio frequency chip 10 serving as a transceiver component and chip capacitors which are connected with the radio frequency chip 10 through bond alloy wires and are symmetrically distributed on two sides of the radio frequency chip 10 are arranged in the middle of the step surface of the middle dielectric layer, the radio frequency chip 10 and the chip capacitors are connected with a connecting pad 11 through the bond alloy wires and are connected to a radio frequency transmission hole 12 embedded in the middle dielectric, and the radio frequency chip 10 is communicated with a phase change material layer 7 through an array heat dissipation through hole 9 penetrating through the middle dielectric layer; the printed metal wires 3 which extend along the side walls of the two sides and are connected with the linear array solder balls 5 are embedded in the middle dielectric layer, the printed metal wires 3 extend to the bottom of the embedded cavity along the dielectric layer of the inner wall of the tube shell, the printed resistors 13 which are symmetrically distributed on the heat dissipation through holes 9 are arranged on the printed metal wires 3, the printed resistors on the metal wires and the linear array solder balls which are distributed along the dielectric layer of the inner wall of the tube shell and extend to the bottom of the embedded cavity are connected with the upper cover of the interconnected tube shell, and signal transmission with an antenna network is realized; the radio frequency chip is communicated with the phase change material layer 7 filled in the lower cavity 6 of the tube shell through the heat dissipation through holes 9 arranged in the middle medium layer in an array manner, the bottom end of the tube shell is provided with the fixedly connected tube shell heat sink 8, and the radio frequency chip realizes heat exchange with the external environment through the heat dissipation through holes arranged in the middle medium layer in an array manner, the phase change material layer communicated with the heat dissipation through holes and filled in the lower cavity of the tube shell, and the tube shell heat sink fixedly connected at the bottom end of the tube shell, so that the high-efficiency heat dissipation function of the radio frequency chip in the integrated airtight packaging structure during operation is completed.
Compared with the prior art, the invention has the following beneficial effects:
the invention adopts a rectangular tube shell cavity 1 packaged by the tube shell upper cover 4 and a tube shell heat sink 8 fixedly connected with the bottom end thereof, the tube shell cavity 1 is divided into a tube shell upper cavity 2 and a tube shell lower cavity 6 by a middle dielectric layer, the signal transmission between a radio frequency chip of a transceiver component and an antenna network is realized through a connecting pad 11, a radio frequency transmission hole 12, an embedded printed metal wire 3, a printed resistor 13 and a linear array solder ball 5 which are mutually connected with the printed metal wire, the manufacturing problems of difficult welding and difficult repairing of the radio frequency connector caused by using a large amount of radio frequency connectors of the conventional transceiver component are solved, and the repairing property of the transceiver component is improved while the manufacturing cost of the transceiver component is reduced.
Miniaturization and light weight. The invention installs the radio frequency chip, the chip capacitor and the bond alloy wire of the receiving and transmitting component in the shell cavity 1 and the shell upper cavity 2, embeds the printed metal wire and the printed resistor in the shell, implants the linear array solder ball 5 in the shell upper cover 4, and seals the shell upper cavity 2 and the shell lower cavity 6 by using the shell upper cover 4 and the shell heat sink 8, thus realizing the integral packaging of the structure and function of the whole receiving and transmitting component. Compared with the existing transceiver component, the metal shell, the metal cover plate for sealing the metal shell and the fastener are omitted, so that the volume and the weight of the transceiver component are reduced by more than 50%.
The shell cavity 1 of the invention is connected with the shell upper cover 4 in a lead-tin welding mode to form a seal for the shell upper cavity 2; the tube shell heat sink 8 is interconnected with the cavity of the tube shell 1 in a tin-silver welding mode, and forms a seal with the lower cavity 6 of the tube shell; by sealing the upper cavity 2 and the lower cavity 6 of the tube shell, the airtight packaging of the whole tube shell can be realized, and the environmental adaptability of the tube shell under severe conditions such as damp heat, salt fog and the like is enhanced.
The heat dissipation capacity is improved. The shell lower cavity 6 of the shell cavity 1 is filled with the phase-change material layer 7 for rapid heat dissipation, a large amount of heat generated when the transceiver component radio frequency chip works can be conducted to the phase-change material layer 7 through the heat dissipation through holes 9, the phase-change material is utilized to conduct the heat generated when the transceiver component radio frequency chip works to the phase-change material layer 7, and the phase-change material is utilized to conduct the heat generated when the phase-change material reaches the phase-change temperature, so that the heat is rapidly transferred from the transceiver component radio frequency chip to the phase-change material, and the transceiver component radio frequency chip is at a normal working temperature. After absorbing a large amount of heat, the phase-change material exchanges heat with a tube shell heat sink 8 made of diamond-copper, when the temperature of the phase-change material is lower than the phase-change temperature, the phase-change material changes again to release heat, and the heat is dissipated to the external environment through the diamond-copper heat sink. The upper tube shell cavity 2 and the lower tube shell cavity 6 in the tube shell cavity 1 are manufactured by a sacrificial layer filling technology and a low-temperature co-firing ceramic technology, and the filled sacrificial layer material can be plugged in during lamination to avoid excessive collapse or deformation of the cavity during lamination, and can be completely volatilized below 450 ℃ during sintering without forming any residues in the cavity. The structure and function integrated manufacturing problem of the flat phased array antenna transceiver component tube shell and the efficient heat dissipation problem of the transceiver component radio frequency chip in a narrow space during working are solved.
And the reworkability is improved. The invention adopts the printed metal wire 3 buried in the tube shell to be interconnected with the linear array solder balls 5 arranged at the two sides of the upper cover 4 of the tube shell, so as to realize the signal transmission with an antenna network; the transceiver component radio frequency chip is communicated to the phase change material layer 7 filled in the lower cavity 6 of the tube shell through the radiating through holes 9 arranged in an array in the middle medium, and performs heat exchange with the heat sink 8 of the tube shell, so that the integrated package of the transceiver component radio frequency chip of the flat-plate phased array antenna is realized in the airtight structure of the cavity 1 of the tube shell, and the efficient radiating function during working is completed. The wire array solder balls 5 are implanted in the upper cover 4 of the tube shell, and are interconnected with the antenna carrier plate by adopting an SMT mounting process. When the flat phased array antenna fails, the problematic transceiver assembly can be accurately positioned through an electrical test, and the problematic transceiver assembly can be quickly replaced through a hot air repair station. The problems that when the existing transceiver component consisting of an active chip, a circuit board, a connector, a metal shell and a cover plate breaks down, the performance problems of each component and a structural member and the connection problem during the assembly are required to be gradually checked due to complex assembly process and multiple types of used components, positioning is difficult and repair time is long are solved. Compared with the existing assembly mode of the receiving and transmitting assembly, the invention has the advantages that the fault location is easier, and the reworkability is effectively improved.
The invention is applicable to receiving assemblies of different array sizes.
Drawings
Fig. 1 is a perspective view of a planar phased array antenna transceiver module integrated package envelope structure of the present invention;
FIG. 2 is a top view of FIG. 1;
FIG. 3 is a flow chart of the fabrication of the cavity of the integrated package housing of FIG. 1;
in the figure: the device comprises a shell cavity body 1, a shell upper cavity 2, a printed metal wire 3, a shell upper cover 4, a linear array solder ball 5, a shell lower cavity 6, a phase change material layer 7, a shell heat sink 8, a heat dissipation through hole 9, a radio frequency chip of a receiving and transmitting component 10, a connecting pad 11, a radio frequency transmission hole 12 and a printed resistor 13.
Detailed Description
See fig. 1 and 2. In the embodiments described below, a flat phased array antenna transceiver module integrally encapsulates a package having a rectangular package cavity 1 encapsulated by a package top cover 4 and a package heat sink 8 fixedly attached to the bottom end thereof. The shell cavity 1 is divided into a shell upper cavity 2 and a shell lower cavity 6 by a middle dielectric layer, a radio frequency chip 10 serving as a transceiver component and chip capacitors which are connected with the radio frequency chip 10 through bond alloy wires and are symmetrically distributed on two sides of the radio frequency chip 10 are arranged in the middle of the step surface of the middle dielectric layer, the radio frequency chip 10 and the chip capacitors are connected with a connecting pad 11 through the bond alloy wires and are connected to a radio frequency transmission hole 12 embedded in the middle dielectric, and the radio frequency chip 10 is communicated with a phase change material layer 7 through an array heat dissipation through hole 9 penetrating through the middle dielectric layer; the printed metal wires 3 which extend along the side walls of the two sides and are connected with the linear array solder balls 5 are embedded in the middle dielectric layer, the printed metal wires 3 extend to the bottom of the embedded cavity along the dielectric layer of the inner wall of the tube shell, the printed resistors 13 which are symmetrically distributed on the heat dissipation through holes 9 are arranged on the printed metal wires 3, the printed resistors on the metal wires and the linear array solder balls which are distributed along the dielectric layer of the inner wall of the tube shell and extend to the bottom of the embedded cavity are connected with the upper cover of the interconnected tube shell, and signal transmission with an antenna network is realized; the radio frequency chip is communicated with the phase change material layer 7 filled in the lower cavity 6 of the tube shell through the heat dissipation through holes 9 arranged in the middle medium layer in an array manner, the bottom end of the tube shell is provided with the fixedly connected tube shell heat sink 8, and the radio frequency chip realizes heat exchange with the external environment through the heat dissipation through holes arranged in the middle medium layer in an array manner, the phase change material layer communicated with the heat dissipation through holes and filled in the lower cavity of the tube shell, and the tube shell heat sink fixedly connected at the bottom end of the tube shell, so that the high-efficiency heat dissipation function of the radio frequency chip in the integrated airtight packaging structure during operation is completed.
The integrated packaging tube shell is divided into a tube shell cavity 1, a tube shell upper cover 4 and a tube shell heat sink 8. The shell cavity 1 comprises a shell upper cavity 2 and a shell lower cavity 6, wherein the shell upper cavity 2 is used for bonding a radio frequency chip, a chip capacitor and a bond alloy wire of a transceiver component, and the shell lower cavity 6 is mainly used for filling a phase change material layer 7.
The printed metal wire 3 and the printed resistor 13 are buried in the tube shell cavity 1, the wire array solder ball 5 is planted in the tube shell upper cover 4, and the radio frequency chip of the receiving and transmitting component can form signal interconnection with the antenna network on the antenna carrier plate through the connecting pad 11, the radio frequency transmission hole 12, the buried printed metal wire 3, the printed resistor 13 and the wire array solder ball 5 which are interconnected with the buried printed metal wire. The upper cover 4 of the tube shell is welded to the cavity 1 of the tube shell through a lead-tin welding process, and the upper cavity 2 of the tube shell is sealed. The shell heat sink 8 is welded to the shell cavity 1 through a tin-silver welding process to seal the shell lower cavity 6, and the phase change material layer is tightly contacted with the shell heat sink to establish a heat exchange channel between the phase change material layer and the external environment.
In an alternative embodiment, the embedded printed metal wire 3 and the passive printed resistor 13 are manufactured inside the tube shell by utilizing a low-temperature co-firing ceramic technology, the embedded printed metal wire and the passive printed resistor are printed on a low-temperature co-firing ceramic tile through high-precision alignment, laminated and sintered together with the tile, and the signal interconnection of the radio frequency chip of the transceiver component and the antenna network in the package tube shell can be realized through the embedded printed metal wire, the passive printed resistor and the linear array solder ball 5.
The linear array solder ball 5 is a Sn/Ag/Cu solder ball, the bottom of the solder ball is provided with a lower composite metal layer of a solder joint for enhancing the connection strength with the tube shell, and the composite metal layer consists of an Au layer serving as an oxidation barrier layer, a Pd layer serving as an adhesion and diffusion barrier layer and a Ni layer serving as a solder wetting layer.
The phase-change material layer 7 is positioned in the lower cavity 6 of the tube shell, heat generated during the operation of the radio frequency chip of the transceiver component can be conducted to the phase-change material through the heat dissipation through hole 9, and the phase-change material is subjected to phase change when the phase-change temperature of the phase-change material is exceeded, so that a large amount of heat is absorbed. After absorbing a large amount of heat, the phase-change material performs heat exchange with a tube shell heat sink 8 made of diamond-copper, when the temperature of the phase-change material is lower than the phase-change temperature, phase change occurs, and the released heat dissipates heat to the external environment through the diamond-copper heat sink, so that the efficient heat dissipation of the transceiver component radio frequency chip during operation is realized.
See fig. 3. The shell cavity 1 is mainly manufactured by a low-temperature co-firing ceramic process and a sacrificial layer technology. Firstly, cutting a raw porcelain tape into 8 inch by 8 inch standard porcelain pieces, tearing off a protective film on the back surface of the porcelain piece on a film tearing machine, and placing the porcelain piece in a constant temperature and humidity box for 24 hours to release residual stress of the porcelain pieces after film tearing. And then punching radio frequency holes and heat conducting holes on the ceramic chip by using a high-speed mechanical puncher, and filling metal into the radio frequency holes and the heat conducting holes by using a printing hole filling mode. To reduce manufacturing costs, hole-filling slurries use hole-filling silver slurries. After the ceramic chip is filled with holes, the ceramic chip is required to be stood for 24 hours or dried in a vacuum oven at the temperature of 120 ℃ for 20 minutes so as to dry and solidify the silver paste filled with holes. And printing the printed metal wires of each layer on each layer of ceramic chip by using a printing screen tooling through a printing machine according to the design drawing, wherein printing silver paste is adopted during printing so as to reduce the manufacturing cost. And standing the printed ceramic tiles for 4 hours, and drying and solidifying the printed metal wires. And then printing the printed resistor on the ceramic chip according to the design drawing, and paying attention to the relative position of the metal line and the printed resistor during printing, which has an important influence on the resistance value of the internal printed resistor. After the printing resistor paste is dried, cutting the positions of the upper cavity of the tube shell and the lower cavity of the tube shell in the ceramic chip by an ultraviolet laser cutting method, and laminating the ceramic chip by an automatic lamination machine to form a ceramic chip laminate.
Before lamination of the tile laminate, a sacrificial layer fill material is required. In this embodiment, the filler is formed by casting a polypropylene carbonate composite material by a powder casting process, the sheet material is softened at 60-80 ℃, the softened sheet material is cut into a regular shape by a hot cutting machine, and the thickness of the formed filler is 0.04mm.
After the sacrificial layer filling material block is manufactured, the upper cavity and the lower cavity of the ceramic chip laminated body are respectively filled, so that the deformation and collapse of the cavity in the lamination process are avoided. After filling, the ceramic chip laminate is placed into a packaging bag for vacuumizing, and laminated and formed by a warm water isostatic pressing mode. After the lamination is completed, the ceramic chip laminate is sintered by using a sintering furnace, and a sintered body is obtained after the sintering is completed.
Since the surface metal of the sintered body is silver and cannot be used for subsequent gold bonding, a chemical plating method is needed to replace the surface silver layer metal with a composite metal layer of Ni/Pd/Au, wherein the Au layer is used as an oxidation barrier layer, the Pd layer is used as an adhesion and diffusion barrier layer and the Ni layer is used as a solder wetting layer. After the chemical plating is completed, the shell cavity 1 can be obtained.
The phase change material layer 7 of the present embodiment is made of a paraffin/graphite foam composite phase change material. When the preparation is carried out, the foam graphite is used as a reinforced heat conduction framework structure, and a liquid phase infiltration method is adopted, so that the preparation is carried out by utilizing good adsorption performance of graphite on paraffin. The thermal conductivity of the prepared paraffin/graphite foam composite phase-change material is about 6W/m.K, which is improved by about 20 times compared with that of pure paraffin, and the enhanced heat transfer effect is remarkable. The prepared paraffin/graphite foam composite phase-change material is cut into a size matched with the lower cavity 6 of the tube shell in an ultraviolet laser cutting mode, and the tube shell is filled with the lower cavity; and then the tube shell heat sink 8 is welded at the bottom of the tube shell cavity 1 by using tin-silver solder, so that the sealing of the tube shell lower cavity 6 is completed.
In this embodiment, the transceiver component rf chip and the chip capacitor are bonded to corresponding positions in the upper cavity 2 of the package by using conductive silver paste, and then signal interconnection between the transceiver component rf chip and the chip capacitor, and between the transceiver component rf chip and the bonding pad in the package is completed by using a semi-automatic gold wire bonder by using 25 μm. After the gold wire bonding is completed, the upper cover 4 of the tube shell is welded to the top of the cavity 1 of the tube shell by adopting lead-tin solder Sn63Pb37, and the sealing of the upper cavity 2 of the tube shell is completed. The soldering temperature is set to 210 ℃ during soldering to ensure that the linear array solder balls 5 are not melted. The airtight packaging of the whole tube shell can be realized by welding and sealing the lower cavity 6 of the tube shell and the upper cavity 2 of the tube shell, and the leakage rate is 1 multiplied by 10 through helium mass spectrum leakage detection test -6 Pa.m 3 And/s, achieves the airtight standard, effectively enhances the receiving and transmitting assembly under severe conditions such as damp heat, salt fog and the likeEnvironmental adaptability.
It should be understood that the specific examples described above are intended to be illustrative of the invention only and are not intended to be limiting of the invention, as any feature disclosed by the invention may be replaced by alternative features serving the equivalent or similar purpose unless expressly stated otherwise.
Claims (10)
1. The utility model provides a dull and stereotyped phased array antenna transceiver module integration encapsulation shell of having one and pass through rectangular shell cavity (1) of shell upper cover (4) encapsulation and its shell heat sink (8) of attaching firmly in the bottom, its characterized in that: the shell cavity (1) is divided into a shell upper cavity (2) and a shell lower cavity (6) by an intermediate medium layer, a radio frequency chip (10) serving as a receiving and transmitting component and chip capacitors which are connected with the radio frequency chip (10) through bond alloy wires and symmetrically distributed on two sides of the radio frequency chip (10) are arranged in the middle of the step surface of the intermediate medium layer, the radio frequency chip (10) and the chip capacitors are connected with a connecting pad (11) through the bond alloy wires and are connected to a radio frequency transmission hole (12) embedded in the intermediate medium, and the radio frequency chip (10) is communicated with a phase change material layer (7) through an array heat dissipation through hole (9) penetrating through the intermediate medium layer; printed metal wires (3) which extend along the side walls of two sides and are connected with the linear array solder balls (5) are embedded in the middle dielectric layer, the printed metal wires (3) extend to the bottom of the embedded cavity along the dielectric layer of the inner wall of the tube shell, printed resistors (13) which are symmetrically distributed on the heat dissipation through holes (9) are arranged on the printed metal wires (3), the printed resistors on the metal wires and the linear array solder balls which are distributed along the dielectric layer of the inner wall of the tube shell and extend to the bottom of the embedded cavity are connected with the upper cover of the tube shell, and signal transmission with an antenna network is realized; the radio frequency chip is communicated with the phase change material layer (7) filled in the lower cavity (6) of the tube shell through the heat dissipation through holes (9) arranged in the middle medium layer in an array manner, the bottom end of the tube shell is provided with the fixedly connected tube shell heat sink (8), and the radio frequency chip realizes heat exchange with the external environment through the heat dissipation through holes arranged in the middle medium layer in an array manner, the phase change material layer communicated with the heat dissipation through holes and filled in the lower cavity of the tube shell, and the tube shell heat sink fixedly connected to the bottom end of the tube shell, so that the high-efficiency heat dissipation function of the radio frequency chip in the integrated airtight packaging structure during operation is completed.
2. The flat panel phased array antenna transceiver assembly integrated package of claim 1, wherein: the shell cavity (1) comprises a shell upper cavity (2) and a shell lower cavity (6), the shell upper cavity (2) is used for bonding a radio frequency chip, a chip capacitor and a bond alloy wire of a transceiver component, and the shell lower cavity (6) is filled with a phase change material layer (7); the metal wire (3) and the printed resistor (13) are embedded in the cavity (1) of the tube shell, the wire array solder ball (5) is planted in the upper cover (4) of the tube shell, and the radio frequency chip of the receiving-transmitting component forms signal interconnection with the antenna network on the antenna carrier plate through the connecting pad (11), the radio frequency transmission hole (12), the embedded printed metal wire (3) and the printed resistor (13) which are interconnected with the embedded printed metal wire, and the wire array solder ball (5).
3. The flat panel phased array antenna transceiver assembly integrated package of claim 1, wherein: the upper shell cover (4) is welded to the shell cavity (1) through a lead-tin welding process, the upper shell cavity (2) is sealed, the shell heat sink (8) is welded to the shell cavity (1) through a tin-silver welding process, sealing of the lower shell cavity (6) is completed, the phase change material layer (7) is in close contact with the shell heat sink, and a heat exchange channel between the phase change material layer and the external environment is established.
4. The flat panel phased array antenna transceiver assembly integrated package of claim 1, wherein: the embedded printed metal wire (3) and the printed resistor (13) are manufactured inside the tube shell by utilizing a low-temperature co-fired ceramic technology, the embedded printed metal wire and the passive printed resistor are printed on the low-temperature co-fired ceramic tile through high-precision alignment, laminated and sintered together with the tile, and the signal interconnection of the radio frequency chip of the receiving and transmitting component and the antenna network in the package tube shell is realized through the embedded printed metal wire, the printed resistor and the linear array solder ball (5).
5. The flat panel phased array antenna transceiver assembly integrated package of claim 4, wherein: the linear array solder ball (5) is a Sn/Ag/Cu solder ball, the bottom of the solder ball is provided with a composite metal layer under a welding spot for enhancing the connection strength with the tube shell, and the composite metal layer consists of an Au layer serving as an oxidation barrier layer, a Pd layer serving as an adhesion and diffusion barrier layer and a Ni layer serving as a solder wetting layer.
6. The flat panel phased array antenna transceiver assembly integrated package of claim 1, wherein: the phase-change material layer (7) is positioned in the lower cavity (6) of the tube shell, heat generated when the radio frequency chip of the transceiver component works is conducted to the phase-change material through the heat dissipation through hole (9), the phase-change material is subjected to phase change when the phase-change temperature exceeds the phase-change temperature of the phase-change material, a large amount of heat is absorbed by the phase-change material, the phase-change material exchanges heat with the tube shell heat sink (8) made of diamond-copper after absorbing a large amount of heat, when the temperature of the phase-change material is lower than the phase-change temperature of the phase-change material, the phase-change material is subjected to phase change, and the released heat dissipates heat to the external environment through the diamond-copper heat sink, so that the efficient heat dissipation when the radio frequency chip of the transceiver component works is realized.
7. The flat panel phased array antenna transceiver assembly integrated package of claim 1, wherein: the shell cavity (1) is manufactured by combining a low-temperature co-firing ceramic process with a sacrificial layer technology, firstly, a raw ceramic tape is cut into 8 inch x 8 inch standard ceramic chips, a protective film on the back is torn off on a film tearing machine, the shell cavity is placed in a constant temperature and humidity box for 24 hours to release residual stress of the ceramic chips after film tearing, then a high-speed mechanical puncher is used for punching radio frequency holes and heat conducting holes on the ceramic chips, metal filling is carried out on the radio frequency holes and the heat conducting holes in a printing hole filling mode, and hole filling slurry is used for hole filling silver slurry.
8. The flat panel phased array antenna transceiver assembly integrated package of claim 7, wherein: standing for 24 hours after the ceramic chip is filled with holes or drying in a vacuum oven at 120 ℃ for 20 minutes so as to dry and solidify the silver paste filled with holes; printing the printed metal wires of each layer on each layer of ceramic chip by a printing screen tool according to a design drawing, standing the printed ceramic chips of each layer for 4 hours, drying and solidifying the printed metal wires, printing a printed resistor on the ceramic chip according to the design drawing, cutting the positions of an upper cavity and a lower cavity of a tube shell in the ceramic chip by an ultraviolet laser cutting method after the printed resistor slurry is dried, and laminating the ceramic chips by an automatic lamination machine to form a ceramic chip laminate.
9. The flat panel phased array antenna transceiver assembly integrated package of claim 8, wherein: before the lamination of the ceramic chip laminated body, a sacrificial layer filling material is manufactured, the filling material is formed into a sheet material by casting a polypropylene carbonate composite material through a powder casting process, the sheet material is softened at 60-80 ℃, the sheet material is cut into a regular shape by a hot cutting machine after the softening, and the thickness of the formed filling material is 0.04mm.
10. The flat panel phased array antenna transceiver assembly integrated package of claim 9, wherein: after the manufacturing of the sacrificial layer filling material block is completed, filling the upper cavity and the lower cavity of the ceramic chip laminated body respectively, after the filling is completed, placing the ceramic chip laminated body into a packaging bag, vacuumizing, laminating and forming in a warm water isostatic pressing mode, and after the lamination is completed, sintering the ceramic chip laminated body by using a sintering furnace to obtain a sintered body; and replacing the silver layer metal on the surface with a Ni/Pd/Au composite metal layer by adopting an electroless plating method, wherein the Au layer is used as an oxidation barrier layer, the Pd layer is used as an adhesion and diffusion barrier layer, and the Ni layer is used as a solder wetting layer, and obtaining the shell cavity (1) after electroless plating is completed.
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| CN113423198B (en) * | 2021-06-23 | 2022-03-08 | 中国电子科技集团公司第二十九研究所 | Printed circuit board embedded with micro flat heat pipe and packaging method thereof |
| CN113851923B (en) * | 2021-10-19 | 2024-08-06 | 北京大学东莞光电研究院 | TO packaging structure of laser |
| CN114256175B (en) * | 2021-12-07 | 2023-09-01 | 中国电子科技集团公司第二十九研究所 | Tile type TR (transmitter-receiver) component embedded in micro-channel and preparation method thereof |
| CN115549721A (en) * | 2022-10-10 | 2022-12-30 | 航天科工微电子系统研究院有限公司 | Miniaturized data chain radio frequency front end receiving and transmitting assembly and design method thereof |
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