CN210489608U

CN210489608U - Ceramic shell meeting Ka-band TR (transmitter-receiver) component packaging

Info

Publication number: CN210489608U
Application number: CN201921243048.XU
Authority: CN
Inventors: 周昊; 施梦侨; 龚锦林
Original assignee: Clp Guoji Nanfang Group Co ltd
Current assignee: Clp Guoji Nanfang Group Co ltd
Priority date: 2019-08-02
Filing date: 2019-08-02
Publication date: 2020-05-08
Anticipated expiration: 2029-08-02

Abstract

The utility model relates to a can satisfy TR subassembly integration ceramic package that Ka wave band was used. The shell is provided with the reinforcing ribs on the ceramic substrate to relieve the strain gradient of the high-temperature welding transition joint, so that the high-temperature brazing of the large-size ceramic substrate and the metal part is realized; the radio frequency transmission of assembly signals and an external circuit in a Ka wave band is realized by using the wiring design of a same-layer transition port of CPW-SL-CPW; the ceramic substrate is subjected to a special plating process, and nickel plating and gold plating of isolated bonding pads in the multi-chip assembly are realized. The integrated ceramic shell can replace the 'LTCC' packaging scheme of the traditional TR component, and the packaging cost is greatly reduced.

Description

Ceramic shell meeting Ka-band TR (transmitter-receiver) component packaging

Technical Field

The utility model relates to a satisfy ceramic package of Ka wave band TR subassembly belongs to HTCC multilayer ceramic technical field.

Background

The solid-state active phased array radar is the mainstream direction of the modern radar technology development, the T/R assembly is used as a core component of the solid-state active phased array radar, the structural indexes such as the volume and the weight of the T/R assembly have important influence on the application of the T/R assembly in the phased array radar, and particularly the volume and the weight of the T/R assembly applied to the airborne and satellite-borne radars are directly limited by the loading capacity of equipment. At present, the low temperature co-fired ceramic (LTCC) technology is generally adopted in China to manufacture the high-density T/R assembly integrated substrate, and the high-density T/R assembly integrated substrate is placed in a metal shell to play the roles of mechanical protection, electromagnetic shielding and airtight packaging. As T/R modules continue to be further developed for integration, light weight, and particularly low cost, such conventional packaging forms increasingly exhibit limitations.

Disclosure of Invention

The utility model provides a satisfy ceramic package of Ka wave band TR subassembly, its purpose aims at overcoming the parasitic mode scheduling problem that present HTCC integration ceramic package is poor in the high temperature welding reliability of course of working, plane transmission interface easily introduces in high frequency transmission process, fills the vacancy of internal Ka wave band jumbo size TR subassembly encapsulation ceramic package.

The technical solution of the utility model is as follows: a ceramic shell meeting Ka-band TR component packaging comprises a base and a cover plate, wherein the base comprises a sealing frame, a ceramic substrate, a heat sink and a lead, the sealing frame, the ceramic substrate, the heat sink and the lead are assembled and connected in a brazing mode respectively, reinforcing rib structures are arranged on two sides of the ceramic substrate, and the reinforcing rib structures are combined with layers of the ceramic substrate through laminated organic glue; the port of the ceramic substrate adopts a CPW-SL-CPW same-layer transition port wiring structure.

The detailed dimension of the CPW-SL-CPW same-layer transition port wiring structure is described as follows, wherein a round hole is a grounding through hole.

Parameter(s)

W1

G1

W2

G2

d

h1

h2

Typical value (mm)

0.45

0.25

0.10

0.15

0.35

0.50

0.30

Tolerance (mm)

±0.10

±0.03

±0.06

±0.10

±0.06

Wherein W1 is the central conduction band linewidth; g1 is the center conduction band ground spacing; w2 is stripline width; g2 is stripline spacing; d is the distance from the ground holes at the two sides of the strip line to the center of the strip line; h1 is the distance of the central conduction band and stripline to the underlying ground plane; h2 is the distance of the central conduction band and stripline to the ground plane above.

The rib structure is illustrated in fig. 4, and the detailed dimensions thereof satisfy the following requirements.

Where X1 is long, Y1 is wide, and H1 is high.

Silver-copper solder is used as brazing filler metal for brazing.

And a parallel seam welding mode is adopted between the cover plate and the base.

The nondestructive plating method is characterized by comprising the following steps:

1) an auxiliary process edge structure is arranged in a non-wiring area of the ceramic substrate, and the isolated bonding pad is connected to the area by using wiring;

2) sintering the ceramic substrate with the auxiliary process edge structure at high temperature and welding the ceramic substrate with other metal parts at high temperature;

3) the non-destructive plating is realized by utilizing the contact of the electroplating clamp and the auxiliary process;

4) the auxiliary process edge is removed using vice.

The auxiliary process side. The distances between the outline of the ceramic substrate and the process edge are denoted by X and Y, respectively, and the detailed dimensions thereof should satisfy the following requirements.

The utility model has the advantages that:

1) the partition wall design of the reinforcing ribs is adopted, the welding upper limit size of the ceramic substrate and the metal part is increased to the range of 50mm-70mm, and the application range of the HTCC ceramic in TR component packaging is further increased.

2) The upper limit of the radio frequency application of the HTCC ceramic in the TR component packaging is improved by adopting a CPW-SL-CPW port design. The metal pad formed by electroplating provides effective and reliable interconnection of external circuits, circulators and other elements. Compare with the gold thick liquids of "LTCC" base plate burn pad altogether, the utility model discloses a gold layer of plating mode has the advantage in the aspect of weldability and reliability.

3) And a nondestructive plating processing mode of 'welding-spot-free' is adopted, more bonding pad spaces can be reserved for micro-assembly, and the difficulty of the assembly in the sealing and testing stage is reduced.

Drawings

FIG. 1 is a schematic structural view of a ceramic housing.

Figure 2 is a schematic diagram of a ceramic reinforcing rib structure.

FIG. 3 is a diagram of the structural dimension parameters of CPW-SL-CPW ".

FIG. 4 is a schematic view of an auxiliary process edge structure.

Fig. 5 is a schematic diagram of the insertion loss result of the input port of the package.

Figure 6 is a schematic diagram of the result of a standing wave at the input port of the package.

FIG. 1 shows a sealing frame; 2 is a ceramic substrate; 3 is a heat sink; 4 is a reinforcing rib; w1 is the central conduction band linewidth; g1 is the center conduction band ground spacing; w2 is stripline width; g2 is stripline spacing; d is the distance from the ground holes at the two sides of the strip line to the center of the strip line; h1 is the distance of the central conduction band and stripline to the underlying ground plane; h2 is the distance of the central conduction band and stripline to the upper ground plane; x1 indicates the rib length, Y1 indicates the rib width, and H1 indicates the rib height.

Detailed Description

A large-size TR component integrated ceramic shell capable of meeting Ka waveband application and a manufacturing method thereof. The method is characterized in that: the shell utilizes the reinforcing ribs with special structures and manufacturing methods to relieve the strain gradient of a high-temperature welding transition joint, and realizes the high-temperature brazing of a large-size ceramic substrate and a metal part; the radio frequency transmission of assembly signals and an external circuit in a Ka wave band is realized by using the wiring design of a same-layer transition port of CPW-SL-CPW; the nickel plating and gold plating of the isolated bonding pad in the multi-chip assembly are realized by using a non-destructive plating processing mode of 'free of welding spots'.

The technical scheme of the utility model is further explained by combining the attached drawings

As shown in fig. 1, the ceramic housing includes a base and a cover. Wherein, the base includes sealing frame, ceramic insulator, heat sink totally 3 parts. The ceramics are processed by adopting HTCC technology; assembling all parts together in a brazing mode, wherein the brazing filler metal is silver copper brazing filler metal (AgCu 28); the cover plate and the base can meet the requirement of air tightness grade by adopting a parallel seam welding mode.

As shown in fig. 2, two sides of the ceramic substrate are provided with a reinforcing rib structure, and the reinforcing ribs need to be combined with the ceramic substrate by using laminated organic glue without using a physical isostatic pressing manner.

As shown in fig. 3, a schematic diagram of CPW-SL-CPW structure size parameters adjusts values of the 7 sets of parameters shown in the diagram to make the transmission port satisfy impedance matching of the target frequency band, so as to suppress generation of higher order modes. The ceramic parameters used for the simulation calculations are shown in table 1.

TABLE 1 ceramic substrate Material parameters

As shown in fig. 4, the ceramic gang structure with the plating auxiliary process edge is attached. The process edge can ensure the plating requirement of 'no welding point' residue of the isolated bonding pad. The main processing mode is as follows: 1) designing an auxiliary process edge structure in a non-wiring area of the ceramic substrate as shown in FIG. 4, and connecting the isolated pad to the area by using a wiring; 2) sintering the ceramic substrate with the process edge structure at a high temperature and welding the ceramic substrate with other metal parts at the high temperature; 3) plating is realized by utilizing the contact of an electroplating clamp and an auxiliary process edge; 4) the auxiliary process edge is removed using vice.

As shown in the attached figures 5 and 6, the simulation result of the integrated ceramic shell transmission channel of the TR component in the Ka waveband shows that the insertion loss is less than 0.65dB and the voltage standing wave ratio is less than 1.25 in the frequency band of 0GHz-40 GHz.

Claims

1. A ceramic shell meeting Ka-band TR component packaging is characterized by comprising a base and a cover plate, wherein the base comprises a sealing frame (1), a ceramic substrate (2) and a heat sink (3) which are assembled and connected in a brazing mode respectively, reinforcing rib structures (4) are arranged on two sides of the ceramic substrate and combined with the layers of the ceramic substrate through laminated organic glue; the port of the ceramic substrate adopts a CPW-SL-CPW same-layer transition port wiring structure.

2. The ceramic package for satisfying the package of the Ka-band TR module as claimed in claim 1, wherein said CPW-SL-CPW peer transition port wiring structure has the following detailed dimensions:

parameter(s) W1 G1 W2 G2 d h1 h2 Typical value (mm) 0.45 0.25 0.10 0.15 0.35 0.50 0.30 Tolerance (mm) ±0.10 ±0.10 ±0.03 ±0.06 ±0.10 ±0.10 ±0.06

3. The ceramic shell according to claim 1, wherein the detailed dimensions of the rib structure are as follows:

parameter(s) X1 Y1 H1 Typical value (mm) 10%X≤X1≤30%X 10%X≤Y1≤30%X 5%H≤H1≤10%H Minimum (mm) 1.00 1.00 0.50

Where X1 is long, Y1 is wide, and H1 is high.

4. The ceramic shell for satisfying the package of the Ka-band TR component as claimed in claim 1, wherein said brazing is performed with silver copper solder as brazing filler metal.