CN117082730B - Airtight multilayer ceramic structure - Google Patents
Airtight multilayer ceramic structure Download PDFInfo
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- CN117082730B CN117082730B CN202311217671.9A CN202311217671A CN117082730B CN 117082730 B CN117082730 B CN 117082730B CN 202311217671 A CN202311217671 A CN 202311217671A CN 117082730 B CN117082730 B CN 117082730B
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- 239000000919 ceramic Substances 0.000 title claims abstract description 98
- 239000000758 substrate Substances 0.000 claims abstract description 47
- 239000002184 metal Substances 0.000 claims abstract description 45
- 229910052751 metal Inorganic materials 0.000 claims abstract description 45
- 238000003466 welding Methods 0.000 claims abstract description 20
- 239000011248 coating agent Substances 0.000 claims abstract description 18
- 238000000576 coating method Methods 0.000 claims abstract description 18
- 239000010410 layer Substances 0.000 claims description 36
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 239000002344 surface layer Substances 0.000 claims description 4
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 230000010354 integration Effects 0.000 description 4
- 238000004891 communication Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 210000001503 joint Anatomy 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/48—Earthing means; Earth screens; Counterpoises
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
Abstract
The invention provides an airtight multilayer ceramic structure which comprises a multilayer ceramic substrate, a radio frequency grounding hole, a bonding pad, a radio frequency input bonding pad, a radio frequency output bonding pad, a low-frequency power supply input bonding pad, a low-frequency power supply output bonding pad and a surface welding coating. The airtight multilayer ceramic structure comprises a multilayer ceramic substrate, wherein metal wires are distributed between layers of the airtight multilayer ceramic structure for interconnection, a radio frequency grounding hole is formed in the multilayer ceramic substrate, a radio frequency grounding pad, a radio frequency input pad, a radio frequency output pad, a low frequency power supply input pad, a low frequency power supply output pad and a surface welding coating are arranged on the surface of the multilayer ceramic substrate, and the radio frequency grounding hole, the radio frequency grounding pad, the radio frequency input pad, the radio frequency output pad, the low frequency power supply input pad and the low frequency power supply output pad are connected with the inner layer through metal wires and metal vias with corresponding attributes. The invention can realize various functions of various connectors, further integrate other passive circuits and expand other functions of the module.
Description
Technical Field
The invention belongs to the technical field of communication, and particularly relates to an airtight multilayer ceramic structure.
Background
In a military phased array radar/communication system, due to the complex working environment, in order to protect internal chips and components, and improve the reliability of the system in long-time working, the internal modules and components are required to be completely airtight, so that external harmful gases are prevented from entering to influence the normal working of the system; and recently, the technology and market development of the military products in China are rapid, and various devices are required to be high in reliability and low in cost.
Conventional rf modules and components require strict air tightness standards to be met, both in low frequency power control connectors and rf input/output connectors, which are generally expensive, large in size, inflexible to use, and long in processing cycle. The power amplifier architecture is disclosed in CN115996535A, wherein a power amplifier component, a control component and a power supply component are separately arranged, signals of the power amplifier component extend out of the side wall of a cavity through a radio frequency connector, and control and power supply extend out of the side wall of the cavity through a multi-core connector. This approach, while avoiding signal interference between components, is limited by the large size of the rf connector and the multi-core connector, the high failure rate of hermetic welding, and the high price of the hermetic welding.
With the recent increasing demand for multi-functional, low-cost, diverse environmental applications of military active phased array radar systems, the rf components must be developed toward lower cost, smaller size, higher air tightness, and integration of multiple functions.
Disclosure of Invention
Aiming at the requirements of the military market on high air tightness, low cost and miniaturization of the module, the invention provides an airtight multilayer ceramic structure which can realize various functions of various connectors, further integrate other passive circuits and expand other functions of the module.
The invention adopts the following technical scheme:
an airtight multilayer ceramic structure comprises a multilayer ceramic substrate A, a radio frequency grounding pad A, a radio frequency input pad A, a radio frequency output pad A, a low-frequency power supply input pad A, a low-frequency power supply output pad A, a surface welding coating A and a radio frequency grounding hole A.
Metal wires are distributed among all layers of ceramic substrates in the multilayer ceramic substrate A with the airtight multilayer ceramic structure for interconnection, a surface welding coating A, a radio frequency grounding pad A, a radio frequency input pad A, a radio frequency output pad A, a low-frequency power supply input pad A and a low-frequency power supply output pad A are arranged on the surface of the multilayer ceramic substrate A, and a radio frequency grounding hole A is formed in the multilayer ceramic substrate A. The radio frequency grounding hole A is a metallized through hole, and the top of the radio frequency grounding hole A is connected with a radio frequency grounding pad A on the surface of the multilayer ceramic substrate A. The radio frequency grounding pad A is connected with the metal wiring which is of radio frequency grounding property and is arranged on the inner layer of the multilayer ceramic substrate A through the radio frequency grounding hole A.
The radio frequency input bonding pad A is connected with the metal wire for transmitting radio frequency input signals at the inner layer through the metal wire and the metallized via hole with the same attribute, and the radio frequency output bonding pad A is connected with the metal wire for transmitting radio frequency output signals at the inner layer through the metal wire and the metallized via hole with the same attribute; the low-frequency power supply input bonding pad A is connected with the metal wire for transmitting the low-frequency power supply input signal through the metal wire and the metallized via hole with the same attribute, and the low-frequency power supply output bonding pad A is connected with the metal wire for transmitting the low-frequency power supply output signal through the metal wire and the metallized via hole with the same attribute. The radio frequency grounding pad A is connected with the radio frequency grounding hole to realize the connection between the radio frequency ground of the inner layer and the radio frequency ground of the surface layer of the multilayer ceramic substrate A.
The input end of the multilayer ceramic structure A, the radio frequency grounding hole A, the radio frequency grounding pad A and the radio frequency input pad A form a GSG structure; the output end of the multilayer ceramic structure A, the radio frequency grounding hole A, the radio frequency grounding pad A and the radio frequency output pad A form a GSG structure, so that radio frequency continuity can be ensured.
And a passive filtering or coupling circuit is integrated between a radio frequency input end formed by the radio frequency input bonding pad A and the radio frequency grounding bonding pad A and a radio frequency output end formed by the radio frequency output bonding pad A and the radio frequency grounding bonding pad A. The form of the passive filter is not limited to a microstrip filter, but also includes a ceramic multilayer cavity filter form.
When the high-frequency airtight connector or the low-frequency airtight connector is used as the high-frequency airtight connector or the low-frequency airtight connector, the high-frequency airtight connector or the low-frequency airtight connector is directly welded or sintered to the side wall of the module cavity through the surface welding coating.
The side wall of the cavity is in the horizontal direction and the vertical direction, and is suitable for low-temperature solder or high-temperature solder with different temperatures, so that high air tightness is realized.
The radio frequency circuit and the low frequency circuit in the airtight multilayer ceramic structure are passive reciprocal circuits, and the input end and the output end can be interchanged.
The radio frequency input pad A/radio frequency output pad A of the airtight multilayer ceramic structure and the radio frequency link input/output end in the module are connected through gold wire bonding to realize the radio frequency interconnection inside and outside the module, and the low frequency power supply input pad/low frequency power supply output pad of the airtight multilayer ceramic structure and the low frequency power supply input/output end in the module are connected through gold wire bonding to realize the low frequency interconnection inside and outside the module.
When the antenna is used as an antenna mode, metal wires are distributed among all layers of ceramic substrates of the airtight multilayer ceramic structure B for interconnection, a radio frequency grounding hole B is formed in the multilayer ceramic substrate B, a surface welding coating B, a radio frequency grounding pad B, a radio frequency input pad B, a yagi antenna or a Vivaldi antenna are arranged on the surface of the multilayer ceramic substrate B, and the radio frequency grounding pad B is connected with the metal wires with the property of radio frequency ground in the inner layer of the multilayer ceramic substrate through the radio frequency grounding hole B; the radio frequency input pad is connected with the metal wire of the inner layer for transmitting radio frequency input signals through the metal wire and the metallized via hole with the same attribute. The radio frequency grounding pad is connected with the radio frequency grounding hole to realize the connection between the radio frequency ground of the inner layer and the radio frequency ground of the surface layer of the multilayer ceramic substrate B. And the radio frequency grounding hole B, the radio frequency grounding pad B and the radio frequency input pad B form a GSG form to ensure radio frequency ground continuity of a radio frequency input signal and an end-fire antenna and feed of the radio frequency signal, and the antenna forms are a yagi antenna and a Vivaldi antenna.
The airtight multilayer ceramic structure is welded or sintered on the side wall of the module cavity through a surface welding coating, so that the airtight of the antenna unit is realized.
The radio frequency input pad B of the airtight multilayer ceramic structure and the radio frequency link input/output end in the module are connected through gold wire bonding, so that structural members and connectors required by butt joint of the module and the antenna are saved.
The invention has the beneficial effects that:
1. the invention can realize the radio frequency and low frequency airtight interconnection function and has strong flexibility.
2. The invention can be designed into single or multiple end-fire antennas, channel filters and channel couplers in an expanding way, and the functions of the module channels are increased.
3. Compared with the traditional airtight multi-core connector, the invention has low cost and short processing period;
4. the invention can replace the traditional radio frequency connection mode of the male head and the female head opposite insertion, greatly reduces the cost of the connector for a multi-channel phased array, has small size and increases the integration level of the module.
Drawings
FIGS. 1 (a) and 1 (b) are top and side views, respectively, of the present invention;
FIGS. 2 (a) and 2 (b) are top and side views, respectively, of the extended functionality achievable by the present invention;
FIG. 3 is a schematic top view of two multilayer ceramic structures of the present invention in a module cavity;
fig. 4 is a schematic three-dimensional structure of two multi-layered ceramic structures in a module cavity.
In the figure: 1-airtight multilayer ceramic structure (as high-low frequency airtight connector), 2-airtight multilayer ceramic structure (as end-fire antenna), 3-module cavity, 4-module cover plate, 5-in-module radio frequency link input/output end, 6-in-module low frequency power supply input/output end, 7-gold wire;
11-multilayer ceramic substrate A, 12-radio frequency grounding pad A, 13-radio frequency input pad A, 14-radio frequency output pad A, 15-low frequency power supply input pad A, 16-low frequency power supply output pad A, 17-surface welding coating A, 18-radio frequency grounding hole A;
the multi-layer ceramic substrate B is 21-a multi-layer ceramic substrate B, the radio frequency grounding pad B is 22-a radio frequency input pad B, the radio frequency input pad B is 24-a yagi antenna, the Vivaldi antenna is 25-and the surface welding coating B is 26-a radio frequency grounding hole B is 27-a multi-layer ceramic substrate.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present invention more apparent, the technical solutions in the present invention will be clearly and completely described below, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
As shown in fig. 1 (a) and 1 (b), the airtight multilayer ceramic structure of the present invention comprises a multilayer ceramic substrate a11, a radio frequency grounding pad a12, a radio frequency input pad a13, a radio frequency output pad a14, a low frequency power supply input pad a15, a low frequency power supply output pad a16, a surface welding coating layer a17, and a radio frequency grounding hole a18.
Metal wires are arranged among all layers of ceramic substrates in the airtight multilayer ceramic substrate for interconnection, a surface welding coating A17, a radio frequency grounding pad A12, a radio frequency input pad A13, a radio frequency output pad A14, a low-frequency power supply input pad A15 and a low-frequency power supply output pad A16 are arranged on the surface of the multilayer ceramic substrate A11, and a radio frequency grounding hole A18 is formed in the multilayer ceramic substrate A11. The radio frequency grounding hole A18 is a metallized via hole, the top of the radio frequency grounding hole A18 is connected with a radio frequency grounding pad A12 on the surface of the multilayer ceramic substrate A11, and the radio frequency grounding pad A12 is connected with a metal wiring with the property of radio frequency grounding in the inner layer of the multilayer ceramic substrate A11 through the radio frequency grounding hole A18; the radio frequency input pad A13 is connected with the metal wire for transmitting radio frequency input signals at the inner layer through the metal wire and the metallized via hole with the same attribute, and the radio frequency output pad A14 is connected with the metal wire for transmitting radio frequency output signals at the inner layer through the metal wire and the metallized via hole with the same attribute; the low-frequency power supply input pad A15 is connected with the metal wire for transmitting the low-frequency power supply input signal through the metal wire and the metallized via hole with the same attribute, and the low-frequency power supply output pad A16 is connected with the metal wire for transmitting the low-frequency power supply output signal through the metallized via hole and the inner layer through the metal wire with the same attribute.
The input end of the multilayer ceramic structure A11, the radio frequency grounding hole A18, the radio frequency grounding pad A12 and the radio frequency input pad A13 form a GSG structure; the output end of the multilayer ceramic structure A11, the radio frequency grounding hole A18, the radio frequency grounding pad A12 and the radio frequency output pad A14 form a GSG structure, so that radio frequency continuity can be ensured, a passive filter or a coupling circuit is integrated between a radio frequency input end formed by the radio frequency input pad A13 and the radio frequency grounding pad A12 and a radio frequency output end formed by the radio frequency output pad A14 and the radio frequency grounding pad A12, and the passive filter is not limited to a microstrip filter, and also comprises a ceramic multilayer cavity filter and the like.
Referring to fig. 3 and 4, the structure can be used as a module high-low frequency airtight connector or can be used separately at high and low frequencies, and when the invention is used as a connector, the airtight multilayer ceramic structure 1 (serving as a high-low frequency airtight connector) is directly welded or sintered to the side wall of the module cavity 3 through a surface welding coating A17, is not limited to the horizontal direction of the cavity, can be welded to the vertical direction of the cavity, and can be suitable for low-temperature solders or high-temperature solders with different temperatures to realize high air tightness. The radio frequency circuit and the low frequency circuit in the airtight multilayer ceramic structure are passive reciprocal circuits (a high frequency (radio frequency) circuit is arranged between the radio frequency input pad A13 and the radio frequency output pad A14, and a low frequency circuit is arranged between the low frequency input pad and the low frequency output pad), and the input end and the output end can be interchanged.
As shown in fig. 3, the radio frequency input pad a 13/radio frequency output pad a14 of the airtight multilayer ceramic structure 1 and the radio frequency link input/output terminal 5 in the module are bonded through the wires 7 to realize radio frequency interconnection inside and outside the module; the low-frequency power supply input pad A15/low-frequency power supply output pad A16 of the airtight multilayer ceramic structure 1 is connected with the low-frequency power supply input/output end 6 in the module through the bonding of the gold wires 7.
When the structure is used as a radio frequency connector independently, the structure can replace the traditional radio frequency male-female connector, reduce the cost of the connector and increase the integration level of the module.
Example 2
Referring to fig. 2 (a) and 2 (b), the other end of the airtight multilayer ceramic structure can be set to an end-fire antenna mode to realize channel radiation capability when the other end of the airtight multilayer ceramic structure is not used for high-low frequency interconnection.
Metal wires are arranged among the layers of ceramic substrates of the multilayer ceramic substrate B21 of the airtight multilayer ceramic structure 2 for interconnection, a radio frequency grounding hole B27 is formed in the multilayer ceramic substrate B21, a surface welding coating B26, a radio frequency grounding pad B22, a radio frequency input pad B23, a yagi antenna 24 or a Vivaldi antenna 25 are arranged on the surface of the multilayer ceramic substrate B21, and the radio frequency grounding pad B22 is connected with the metal wires with the property of radio frequency ground in the inner layer of the multilayer ceramic substrate B21 through the radio frequency grounding hole B27; the radio frequency input pad B23 is connected with the metal wire of the inner layer for transmitting radio frequency input signals through the metal wire with the same attribute and the metallized via hole.
The radio frequency grounding pad B22 is connected with the radio frequency grounding hole B27, so that the connection between the radio frequency ground of the inner layer and the radio frequency ground of the surface layer of the multilayer ceramic substrate B21 is realized.
Also, the rf ground hole B27, the rf ground pad B22, and the rf input pad 23 form a GSG structure to ensure rf ground continuity between the rf input signal and the endfire antenna and feed in the rf signal, and the antenna may be configured as a yagi antenna 24, a Vivaldi antenna 25, or other endfire antennas. As shown in fig. 2 (B), 3 and 4, the multilayer ceramic structure 2 (as an end-fire antenna) is welded or sintered to the side wall of the module cavity 3 by a surface welding coating B26, so as to realize the airtight of the antenna unit. The radio frequency input pad B23 of the airtight multilayer ceramic structure 2 and the radio frequency link input/output end 5 in the module are bonded through the gold wire 7 to realize the interconnection of the module and the antenna, so that structural members and connectors required by butt joint of the module and the antenna can be saved, the product integration level is increased, and the product cost is reduced.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (6)
1. A multi-layer ceramic structure capable of being airtight, characterized in that, when used as a connector,
comprises a multilayer ceramic substrate A, a radio frequency grounding pad A, a radio frequency input pad A, a radio frequency output pad A a low-frequency power supply input pad A, a low-frequency power supply output pad A, a surface welding coating A and a radio frequency grounding hole A; metal wires are distributed among all layers of ceramic substrates in the multi-layer ceramic substrate A with the airtight multi-layer ceramic structure for interconnection, a surface welding coating A, a radio frequency grounding pad A, a radio frequency input pad A, a radio frequency output pad A, a low-frequency power supply input pad A and a low-frequency power supply output pad A are arranged on the surface of the multi-layer ceramic substrate A, a radio frequency grounding hole A is formed in the multi-layer ceramic substrate A and is a metalized through hole, the top of the multi-layer ceramic substrate A is connected with the radio frequency grounding pad A on the surface of the multi-layer ceramic substrate A, and the radio frequency grounding pad A is connected with the metal wires with the property of radio frequency ground on the inner layer of the multi-layer ceramic substrate A through the radio frequency grounding hole A;
the radio frequency input bonding pad A is connected with the metal wire for transmitting radio frequency input signals at the inner layer through the metal wire and the metallized via hole with the same attribute, and the radio frequency output bonding pad A is connected with the metal wire for transmitting radio frequency output signals at the inner layer through the metal wire and the metallized via hole with the same attribute; the low-frequency power supply input bonding pad A is connected with the metal wire for transmitting the low-frequency power supply input signal through the metal wire and the metallized via hole with the same attribute, and the low-frequency power supply output bonding pad A is connected with the metal wire for transmitting the low-frequency power supply output signal through the metal wire and the metallized via hole with the same attribute;
the input end of the multilayer ceramic structure A, the radio frequency grounding hole A, the radio frequency grounding pad A and the radio frequency input pad A form a GSG structure; the output end of the multilayer ceramic structure A, the radio frequency grounding hole A, the radio frequency grounding pad A and the radio frequency output pad A form a GSG structure;
the connector is directly welded or sintered on the side wall of the module cavity through the surface welding coating A; the side wall of the module cavity is in the horizontal direction of the cavity or in the vertical direction of the cavity, and the module is suitable for low-temperature solder or high-temperature solder with different temperatures.
2. The hermetically sealed multilayer ceramic structure of claim 1 wherein the trace between the rf input comprised of rf input pad a, rf ground pad a and the rf output comprised of rf output pad a, rf ground pad a integrates a passive filter or coupling circuit, the passive filter being in the form of a microstrip filter or ceramic multilayer cavity filter.
3. The hermetically sealed multilayer ceramic structure of claim 1 wherein the radio frequency circuitry and the low frequency circuitry within the hermetically sealed multilayer ceramic structure are passive reciprocal circuits with inputs and outputs being interchangeable.
4. The hermetically sealable multilayer ceramic structure of claim 1, wherein the radio frequency input/output pads of the hermetically sealable multilayer ceramic structure are connected to the in-module radio frequency link input/output terminals via gold wire bonding to provide in-module radio frequency interconnection, and the low frequency power supply input/output pads of the hermetically sealable multilayer ceramic structure are connected to the in-module low frequency power supply input/output terminals via gold wire bonding to provide in-module low frequency interconnection.
5. The airtight multilayer ceramic structure is characterized in that when the airtight multilayer ceramic structure is used as an antenna mode, metal wires are distributed among ceramic substrates of the airtight multilayer ceramic structure B for interconnection, a radio frequency grounding hole B is formed in the multilayer ceramic substrate B, a surface welding coating B, a radio frequency grounding pad B, a radio frequency input pad B, a yagi antenna or a Vivaldi antenna are arranged on the surface of the multilayer ceramic substrate B, and the radio frequency grounding pad B is connected with the metal wires with the property of radio frequency ground in the inner layer of the multilayer ceramic substrate through the radio frequency grounding hole B; the radio frequency input pad B is connected with the metal wiring of the inner layer for transmitting radio frequency input signals through the metal wiring and the metallized via holes with the same attribute, and the radio frequency grounding pad B is connected with the radio frequency grounding hole B to realize the connection between the inner layer radio frequency ground and the surface layer radio frequency ground of the multilayer ceramic substrate B;
the radio frequency grounding hole B, the radio frequency grounding pad B and the radio frequency input pad B form a GSG form to ensure radio frequency ground continuity of a radio frequency input signal and an end-fire antenna and feed of the radio frequency signal, and the antenna form is set as a yagi antenna or a Vivaldi antenna;
the antenna is welded or sintered to the module cavity side wall by a surface weld coating B.
6. The hermetically sealed multilayer ceramic structure of claim 5 wherein the radio frequency input pads B of the hermetically sealed multilayer ceramic structure are connected to the radio frequency link input/output terminals within the module by gold wire bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311217671.9A CN117082730B (en) | 2023-09-20 | 2023-09-20 | Airtight multilayer ceramic structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311217671.9A CN117082730B (en) | 2023-09-20 | 2023-09-20 | Airtight multilayer ceramic structure |
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| CN117082730B true CN117082730B (en) | 2024-02-09 |
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