CN115986433A - TR module architecture and process method thereof - Google Patents
TR module architecture and process method thereof Download PDFInfo
- Publication number
- CN115986433A CN115986433A CN202310276615.6A CN202310276615A CN115986433A CN 115986433 A CN115986433 A CN 115986433A CN 202310276615 A CN202310276615 A CN 202310276615A CN 115986433 A CN115986433 A CN 115986433A
- Authority
- CN
- China
- Prior art keywords
- module
- multilayer
- gold wire
- connector
- functional
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Details Of Aerials (AREA)
Abstract
The invention discloses a TR module architecture and a process method thereof, wherein the TR module architecture comprises a multilayer mixed pressing plate arranged in a module cavity, functional devices and a plurality of chips are integrated on the multilayer mixed pressing plate, a plurality of functional connecting devices are embedded in the module cavity, a transmission gold wire bonded with the functional connecting devices is arranged on the multilayer mixed pressing plate, and a grounding gold wire is arranged on two sides of each transmission gold wire so as to bond the module cavity and the multilayer mixed pressing plate. The chip and the functional device are integrated on the multilayer mixed pressing plate, the multilayer mixed pressing plate and the module cavity form a ground-signal-ground structure through the transmission gold wire and the grounding gold wire, the grounding performance of the multilayer mixed pressing plate is guaranteed, the functional connecting device is embedded in the module cavity and is bonded with the multilayer mixed pressing plate through the transmission gold wire, and the air tightness of the TR module is guaranteed.
Description
Technical Field
The invention belongs to the technical field of phased array antennas, and particularly relates to a TR module framework and a process method thereof.
Background
In the field of phased array antennas (radars), a T/R module is used as a core component of the whole phased array, the performance of the module almost determines the performance of the whole phased array, the module is generally divided into a radio frequency part and a low frequency part, the radio frequency part is used for ensuring the performance of the module, the low frequency part supplies power to control signals such as a radio frequency chip, and the like, a conventional framework is a structure with separated radio frequency and low frequency power supply, and is equivalent to two paths, for example, chinese patent application publication No. CN113271118A discloses a dual-frequency TR dual-polarized module, a radio frequency power supply board is adopted in the low frequency part to process low frequency control and power supply signals, then a low frequency pad and a radio frequency chip pad are bonded to realize power supply interconnection, the radio frequency part is generally transited through front and rear micro-strips of a radio frequency chip, and an output end and an input end realize a radio frequency path in a mode of spot welding insulators, which is specifically shown in figure 1; however, the module architecture has some defects, which are as follows:
1. the front and the back of the radio frequency chip must have microstrip transition, the more the chip has the more the transition microstrip, the more the process production is complicated;
2. in order to make the whole rf signal on the same horizontal plane, the rf transition performance is relatively good, it is desirable that there is no height difference between the feed and antenna end connectors in the design process, however, as shown in fig. 1, in practice, because of the channel spacing, there is usually a height difference between the feed and antenna ends, and in order to eliminate this height difference, on the basis of the architecture shown in fig. 1, a mode of microstrip transition to the chip position is usually adopted, i.e., the microstrip is divided into several small segments, and the whole rf signal is on the same horizontal plane by adjusting the positions of each chip and the microstrip position between two adjacent chips, but the above-mentioned mode not only has a complex process, but also is easy to deteriorate the rf transition performance because of the height difference between the chips, especially under the condition of a high frequency band or a large height difference;
3. the whole module has a complex structure, a hole needs to be formed in a structure cavity for installing and positioning a chip and a micro-strip, the structural part is complex to process, and the cost is high;
4. each chip is transited through a microstrip, the position of each chip and the position of the microstrip need to be designed, the microstrip and a radio frequency power supply board need to be designed, and the whole process design is very complex;
5. the radio frequency connector is characterized in that the radio frequency connector comprises a micro-strip, a pin is arranged on the micro-strip in a lap joint mode, and the micro-strip is arranged below the pin of the connector.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a TR module framework, a chip is integrated on a multilayer mixed pressing plate, the multilayer mixed pressing plate and a module cavity form a ground-signal-ground structure through a transmission gold wire and a grounding gold wire, the grounding performance of the multilayer mixed pressing plate is ensured, a functional connecting device is embedded in the module cavity and bonded with the multilayer mixed pressing plate through the transmission gold wire, the air tightness of the TR module is ensured, meanwhile, the chip and a bonding pad nearby the chip are positioned on the same horizontal plane in a mode that the gold wire with a certain arc length is bonded with a height difference through a connector in a transition mode to the position of the chip, the radio frequency transition performance is slightly influenced, the connector and the multilayer mixed pressing plate are not overlapped, and the working procedure can be adjusted according to the actual situation.
The purpose of the invention is realized by the following technical scheme:
the utility model provides a TR module framework, mixes the clamp plate including installing the multilayer in the module cavity, and the multilayer mixes and is integrated with functional device and many chips on the clamp plate, still inlay in the module cavity and be equipped with a plurality of functional connection devices, be provided with on the multilayer mixes the clamp plate with the transmission gold wire of functional connection device bonding, and every transmission gold wire both sides still are provided with the ground connection gold wire, for the module cavity mixes the clamp plate bonding with the multilayer.
In one embodiment, the functional connection devices include a power supply connector, a feed radio frequency connector, an antenna radio frequency connector and a control connector, the functional connection devices are all sintered in the module cavity, through the embodiment, a plurality of mounting grooves are formed in the module cavity, and the plurality of connection devices are embedded in the module cavity in a sintering mode, so that the integration level of the whole antenna module is higher.
In one embodiment, the functional connection devices are respectively embedded around the module cavity, and the power supply connector and the control connector are respectively arranged on two sides of the module cavity.
In one embodiment, the antenna module further comprises a cover plate, wherein the cover plate is welded on the module cavity to seal the multilayer hybrid board, and the antenna module can be assembled by welding the cover plate on the module cavity in a sealing mode after the multilayer hybrid board, the chip and the functional connecting device are arranged.
In one embodiment, the radio frequency connector is provided with an inner core connected with the transmission gold wire, the inner core is arranged in a shell of the radio frequency connector, and part of side walls of the shell are of a square structure.
The invention also provides a process method based on the TR module architecture, which comprises the following steps:
step A, sintering a plurality of functional connecting devices in a module cavity;
b, welding the chip and the functional device on a multilayer mixed pressing plate, and then installing the multilayer mixed pressing plate in a module cavity;
step C, the multilayer mixed pressing plate is in flexible connection with the functional connecting device;
wherein the processing sequence between the step A and the step B can be interchanged;
because the multilayer mixed pressing plate is provided with the transmission gold wire bonded with the functional connecting device, and the transmission gold wire is embedded in the module cavity, namely, the processing step A and the processing step B are not necessary to be in a sequential relation, the multilayer mixed pressing plate can be firstly installed in the module cavity, and then a plurality of functional connectors are sintered in the module cavity, the working procedure can be adjusted according to actual conditions, the welding times are few in the whole processing process, the welding temperature gradient is easier to adjust, and the working procedure welding temperature is convenient to adjust according to actual process conditions so as to reduce the cost.
In one embodiment, in step C, the functional connection device and the multilayer hybrid board are flexibly connected by gold wire bonding;
by adopting the embodiment, the gold wire bonding radio frequency and low-frequency power supply channel is adopted, the response to vibration is small, and the reliability of the whole machine is improved.
In one embodiment, the step C further includes disposing a transmission gold wire for bonding with the functional connection device on the multilayer hybrid board, and disposing a grounding gold wire on two sides of the transmission gold wire for bonding the multilayer hybrid board with the module cavity;
through the embodiment, namely the control connector, the power supply connector, the feed radio frequency connector and the antenna radio frequency connector are all bonded with the multi-layer mixed pressing plate gold wires, specifically, transmission gold wires corresponding to the positions of all the function connecting devices are arranged on the multi-layer mixed pressing plate, if a plurality of radio frequency transmission gold wires are arranged in the area corresponding to the position of the feed radio frequency connector, the inner core of the feed radio frequency connector is connected with the multi-layer mixed pressing plate through the radio frequency transmission gold wires, the two sides of each radio frequency transmission gold wire are also provided with grounding gold wires, the grounding gold wires on the multi-layer mixed pressing plate are bonded with the structural cavity, the multi-layer mixed pressing plate and the module cavity form a ground-signal-ground structure, so that a ground loop is continuous, the function connecting devices are all embedded in the module cavity and bonded with the multi-layer mixed pressing plate through the transmission gold wires, the air tightness of the whole antenna module is ensured, meanwhile, as the plurality of chips are integrated on the multi-layer mixed pressing plate, the connector is transited to the chip position, so that the chip bonding with a certain arc length has a height difference to enable the chip and the chip to be located on the same horizontal plane, and the chip transition to reduce the influence on the micro-strip performance, and the micro-strip process is reduced.
In one embodiment, in step B, the multilayer hybrid board is screwed with the module cavity, or the multilayer hybrid board is welded in the module cavity, or the multilayer hybrid board is bonded in the module cavity;
through this embodiment, make things convenient for operating personnel to install the pressure plate that will mix in the module cavity according to actual conditions.
In one embodiment, after step C, further comprising:
step D, welding a cover plate on the module cavity to seal the multilayer mixed pressing plate;
through the embodiment, after the multilayer mixed compression plate and the functional connecting device are installed, the final capping operation is carried out, and the TR module is assembled.
The invention has the beneficial effects that:
the TR module is high in integral integration level, a chip is integrated on the multilayer mixed pressing plate, and the multilayer mixed pressing plate integrates radio frequency and low frequency into a channel in a mode of gold wire bonding with a functional connecting device, so that the structure and the process are simplified; meanwhile, the multilayer mixed pressing plate and the module cavity form a ground-signal-ground structure, so that the continuity of a ground loop is ensured; the connector is transited to the position of the chip, so that a gold wire with a certain arc length is bonded in a height difference mode, the chip and a bonding pad nearby the chip are positioned on the same horizontal plane, compared with a micro-strip transition mode, the influence on radio frequency transition performance is greatly reduced, the connector and the multilayer mixed pressing plate are not mutually overlapped, and the process can be adjusted according to actual conditions; the process is simpler, the welding frequency is less, the welding temperature gradient is easier to adjust, the welding temperature of the working procedure can be adjusted according to the actual process condition so as to reduce the cost, and meanwhile, the condition that the microstrip and the chip are welded together is avoided, and the repair is convenient.
Drawings
The invention will be described in more detail hereinafter on the basis of embodiments and with reference to the accompanying drawings. Wherein:
fig. 1 shows a schematic structural diagram of an antenna module in the prior art;
FIG. 2 shows a schematic of the structure of the present invention;
FIG. 3 shows a schematic view of the expanded configuration of the present invention;
FIG. 4 shows an enlarged partial schematic view at I of FIG. 3;
fig. 5 shows a schematic structural view of a feed rf connector of the present invention;
in the drawings, like parts are provided with like reference numerals. The drawings are not to scale.
Reference numerals:
1-module cavity, 2-multilayer mixed pressing plate, 3-chip, 4-radio frequency transmission gold wire, 5-grounding gold wire, 6-power supply connector, 7-feed radio frequency connector, 8-antenna radio frequency connector, 9-control connector and 10-inner core.
Detailed Description
The invention will be further explained with reference to the drawings.
As shown in fig. 1, most of the existing TR module architectures are divided into two parts, namely, a radio frequency part and a low frequency part, the low frequency part forms a first path (connector + radio frequency power supply board), that is, the radio frequency power supply board is used to process low frequency control and power supply signals, then a low frequency pad and a radio frequency chip pad are bonded to realize power supply interconnection, the radio frequency part forms a second path (chip + microstrip + connector), that is, transition is performed through front and rear microstrips of a radio frequency chip, an output end and an input end realize a radio frequency path in a form of spot welding insulators, and both the structure and the process method are complex; meanwhile, although it is desirable that there is no height difference between the feed and antenna end connectors in the design, due to the channel spacing in practice, as shown in fig. 1, there is usually a height difference between the feed and antenna ends, based on the architecture, the microstrip transits to the chip position, that is, there is a height difference between the chip and the microstrip at each transition, and the height difference is gradually eliminated at a little point.
The invention provides a TR (transmitter-receiver) module framework which comprises a multilayer mixed pressing plate 2 arranged in a module cavity 1, wherein a functional device and a plurality of chips 3 are integrated on the multilayer mixed pressing plate 2, a plurality of functional connecting devices are also embedded in the module cavity 1, a transmission gold wire bonded with the functional connecting devices is arranged on the multilayer mixed pressing plate 2, and a grounding gold wire 5 is also arranged on two sides of each transmission gold wire so as to bond the module cavity 1 and the multilayer mixed pressing plate 2;
it should be noted that, the functional devices include devices such as resistors and capacitors, and a bonding pad is designed on the multilayer hybrid board for chips and functional devices to be mounted, as shown in fig. 2, 3, and 4, in this embodiment, a plurality of chips 3 are integrated on the multilayer hybrid board 2, then the multilayer hybrid board 2 is bonded with a plurality of functional connection devices through a transmission gold wire, respectively, a low frequency and a radio frequency are integrated into one channel, the multilayer hybrid board 2 is bonded with the module cavity 1 through a grounding gold wire 5, so that the multilayer hybrid board 2 and the module cavity form a ground-signal-ground structure, and the grounding performance of the multilayer hybrid board is ensured;
specifically, as shown in fig. 3 and 4, the feed rf connector 7 is bonded to the multilayer hybrid board 2 through the rf transmission gold wire 4, and meanwhile, the ground gold wires 5 are disposed on two sides of the rf transmission gold wire 4, and the ground gold wire 5 is bonded to the multilayer hybrid board 2 and the module cavity 1, that is, when bonding, one end of the ground gold wire 5 is connected to the multilayer hybrid board 2, and the other end is connected to the module cavity 1, so as to ensure the grounding performance of the multilayer hybrid board, based on the module architecture of this embodiment, because the rf transmission gold wire 4 has a certain arc length, it is bonded to the feed rf connector 7 in a manner of height difference, so as to eliminate the height difference between the feed end and the antenna end connector, so that the chip and the pads near the chip are located on the same horizontal plane, and the connector transitions to the chip 3 position, which significantly reduces the influence on the rf transition performance compared to the microstrip transition manner;
furthermore, the functional connecting devices comprise a power supply connector 6, a feed radio frequency connector 7, an antenna radio frequency connector 8 and a control connector 9, and the functional connecting devices are sintered in the module cavity 1;
specifically, the functional connection devices are respectively embedded around the module cavity 1, and the power supply connector 6 and the control connector 9 are respectively arranged at two sides of the module cavity 1; the antenna module is characterized in that a plurality of mounting grooves are formed in the module cavity 1, a plurality of connecting devices are embedded in the module cavity 1 in a sintering mode, so that the integration level of the whole antenna module is higher, meanwhile, the power supply connector 6 and the control connector 9 are designed on two sides of the module, the layout of the whole antenna module is not influenced, the integration level of the antenna module is further improved, and the functional connecting devices are embedded in the module cavity and bonded with the multilayer mixed pressing plate through transmission gold wires, so that the air tightness of the TR module is ensured;
furthermore, the antenna module also comprises a cover plate, wherein the cover plate is welded on the module cavity 1 so as to seal the multilayer mixed pressure plate 2, and the cover plate is sealed and welded on the module cavity 1 in a welding mode to complete the assembly of the antenna module;
in one embodiment, as shown in fig. 5, the rf connector has a core 10 connected to a transmission gold wire, the core 10 is disposed in a housing of the rf connector, and a part of the side wall of the housing has a square structure;
it should be noted that, during assembly, the radio frequency connector is sintered in the module cavity 1, the inner core 10 of the radio frequency connector is bonded with the multilayer mixed pressing plate 2 through the transmission gold wire, that is, no lapping condition exists between the radio frequency connector and the multilayer mixed pressing plate 2, so that in the assembly process, the radio frequency connector can be sintered firstly, and the multilayer mixed pressing plate 2 can be installed firstly, which is convenient for adjusting the process according to the actual condition, and meanwhile, part of the side wall of the radio frequency connector shell is of a square structure, so that the plane of the bonding gold wire does not rotate in the welding process.
The invention also provides a process method of the TR module architecture, which comprises the following steps:
step A, sintering a plurality of functional connecting devices in a module cavity;
b, welding the chip and the functional device on the multilayer mixed pressing plate, and then installing the multilayer mixed pressing plate in the module cavity;
step C, the multilayer mixed pressing plate is in flexible connection with the functional connecting device;
step D, welding a cover plate on the module cavity to seal the multilayer mixing plate;
the processing sequence between the step A and the step B can be interchanged;
it should be noted that, as shown in fig. 3 and 4, since the multilayer hybrid board 2 and the functional connecting device are bonded by the transmission gold wire, that is, there is no necessary sequence relationship between step a and step B, the multilayer hybrid board 2 may be mounted in the module cavity 1, then the plurality of functional connectors are sintered in the module cavity 1, and then the multilayer hybrid board 2 is connected to the functional connecting device, that is, an operator may adjust the process according to actual conditions;
as shown in fig. 1, the process of the conventional architecture is roughly as follows:
s1, sintering a radio frequency connector and a low-frequency connector on a structural cavity;
s2, welding the chip on a chip carrier plate (for matching the problem of mismatching of the heat capacity of the chip and the structural cavity, and preventing thermal stress from being pulled and cracked);
s3, welding the micro-strip on the structural cavity;
s4, installing the radio frequency power supply board on the structure cavity;
s5, spot welding an antenna connector, a feed connector, a microstrip (two ends) and a low-frequency power supply connector;
s6, carrying out gold wire bonding on the microstrip, the radio frequency bias power supply board, the chip and the low-frequency connector;
and S7, sealing the cover to ensure the airtightness of the module cavity.
Compared with the prior art, obviously, based on the TR module framework provided by the invention, the process steps are fewer, the whole process is simpler, the welding times are less, the process method in the prior art needs manual spot welding, the TR module framework provided by the invention basically uses gold wire bonding in transition, the structure is simple, the automatic production is convenient, the efficiency is high, the TR module framework is suitable for batch production, the welding temperature gradient is easier to adjust, the actual process condition is convenient, the welding temperature of the working procedure is adjusted to reduce the cost, and meanwhile, in the design stage, a microstrip and a radio frequency power supply board do not need to be designed;
meanwhile, in the process method in the prior art, as the welding frequency is more, the welding temperature gradient is insufficient, the situation that the radio frequency power supply board needs to be welded with the chip is easy to occur, and the devices which are welded together need to be detached simultaneously during repair, but the process method in the embodiment has less welding frequency, and each device can use different welding temperature gradients, so that the subsequent repair is facilitated;
in step C, the functional connecting device and the multilayer hybrid board 2 are connected flexibly through gold wire bonding, that is, gold wire bonding radio frequency and low-frequency power supply paths are adopted, so that the response to vibration is small, and the reliability of the whole machine is improved;
in step C, a transmission gold wire bonded with the functional connection device is arranged on the multilayer hybrid board 2, and meanwhile, grounding gold wires 5 positioned on two sides of the transmission gold wire are arranged on the multilayer hybrid board 2, and the grounding gold wires 5 are bonded with the module cavity 1; namely, the control connector 9, the power supply connector 6, the feed radio frequency connector 7 and the antenna radio frequency connector 8 are all bonded with the multilayer mixed pressing plate 2 by gold wires;
as shown in fig. 3 and 4, specifically, a transmission gold wire corresponding to each functional connection device is arranged on the multilayer hybrid board 2, for example, a plurality of radio frequency transmission gold wires 4 are arranged in an area corresponding to the position of the feed radio frequency connector 7, an inner core 10 of the feed radio frequency connector 7 is connected with the multilayer hybrid board 2 through the radio frequency transmission gold wires 4, while two sides of each radio frequency transmission gold wire 4 are also provided with a grounding gold wire 5, the grounding gold wires 5 on the multilayer hybrid board 2 are bonded with the module cavity 1, and a ground-signal-ground structure is formed between the multilayer hybrid board 2 and the module cavity 1 to ensure the continuity of ground loops;
meanwhile, in the face of the problem of channel spacing in practice, on the basis of the process method, the connector is transited to the chip position, so that the chip and a bonding pad nearby the chip are positioned on the same horizontal plane in a mode that a gold wire with a certain arc length has height difference in bonding, and compared with a mode that a microstrip transits to the chip position, the connector is transited to the chip position, the degree of performance deterioration is greatly reduced, namely, the mode has small influence on radio frequency transition performance, and the process is simpler;
the TR module framework provided by the invention has higher integration level, can enable the whole radio frequency signal to be on the same level under the condition of less influence on radio frequency transition performance, simultaneously reduces the process steps and obviously reduces the welding times compared with the conventional framework, ensures that the welding temperature gradient is easier to adjust, can adjust the welding temperature of the process according to the actual process condition so as to reduce the cost, simultaneously can adjust the whole processing process according to the actual condition, is convenient to operate, has simple disassembly, assembly and repair processes, and can directly repair a PCB or a connector for repair in the subsequent use process.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "bottom", "top", "front", "rear", "inner", "outer", "left", "right", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the present invention.
Although the invention herein has been described with reference to particular embodiments, it is to be understood that these embodiments are merely illustrative of the principles and applications of the present invention. It is therefore to be understood that numerous modifications may be made to the illustrative embodiments and that other arrangements may be devised without departing from the spirit and scope of the present invention as defined by the appended claims. It should be understood that features described in different dependent claims and herein may be combined in ways different from those described in the original claims. It is also to be understood that features described in connection with individual embodiments may be used in other described embodiments.
Claims (10)
1. The utility model provides a TR module framework, its characterized in that, is including installing the mixed clamp plate of multilayer in the module cavity, integrated functional device and many chips on the mixed clamp plate of multilayer, still inlay in the module cavity and be equipped with a plurality of functional connection device, be provided with on the mixed clamp plate of multilayer with the transmission gold wire of functional connection device bonding, and every transmission gold wire both sides still are provided with the ground connection gold wire, for the module cavity mixes the clamp plate bonding with multilayer.
2. A TR module architecture according to claim 1, wherein the functional connections comprise a power supply connector, a feed rf connector, an antenna rf connector and a control connector, the functional connections being sintered in the module cavity.
3. A TR module architecture as claimed in claim 2, wherein said functional connectors are embedded around said module cavity respectively, and said power supply connector and said control connector are disposed on both sides of said module cavity respectively.
4. A TR module architecture as claimed in claim 1, further comprising a cover plate welded to the module cavity to enclose the multi-layer mixing plate.
5. A TR module architecture as claimed in claim 2, wherein said rf connector has a core connected to said transmission gold wire, said core being disposed within a housing of said rf connector, a portion of a side wall of said housing having a square configuration.
6. A process of TR module architecture as claimed in any one of claims 1 to 5, comprising the steps of:
step A, sintering a plurality of functional connecting devices in a module cavity;
b, welding the chip and the functional device on a multilayer mixed pressing plate, and then installing the multilayer mixed pressing plate in a module cavity;
step C, the multilayer mixed pressing plate is in flexible connection with the functional connecting device;
wherein the processing sequence between the step A and the step B can be interchanged.
7. The process of a TR module architecture of claim 6, wherein in said step C, said functional connection device and said multilayer hybrid board are flexibly connected by gold wire bonding.
8. The TR module architecture process of claim 7, wherein said step C further comprises disposing a transmission gold wire on said multi-layer hybrid board for bonding with said functional connection device, and disposing a grounding gold wire on both sides of said transmission gold wire for bonding with said module cavity.
9. The TR module architecture process of claim 6 wherein said plurality of hybrid boards are threaded into said module cavity, or said plurality of hybrid boards are welded into said module cavity, or said plurality of hybrid boards are bonded into said module cavity.
10. The TR module architecture process of claim 6, further comprising, after step C:
and D, welding a cover plate on the module cavity to seal the multilayer mixed pressing plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310276615.6A CN115986433B (en) | 2023-03-21 | 2023-03-21 | TR module architecture and process method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310276615.6A CN115986433B (en) | 2023-03-21 | 2023-03-21 | TR module architecture and process method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115986433A true CN115986433A (en) | 2023-04-18 |
| CN115986433B CN115986433B (en) | 2023-08-04 |
Family
ID=85959996
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310276615.6A Active CN115986433B (en) | 2023-03-21 | 2023-03-21 | TR module architecture and process method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115986433B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117082730A (en) * | 2023-09-20 | 2023-11-17 | 成都华兴大地科技有限公司 | Airtight multilayer ceramic structure |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07245328A (en) * | 1994-03-04 | 1995-09-19 | Sanyo Electric Co Ltd | Integrated circuit device |
| US20040227666A1 (en) * | 2003-02-26 | 2004-11-18 | Masakazu Adachi | Antenna switch module, all-in-one communication module, communication apparatus and method for manufacturing antenna switch module |
| US20110068990A1 (en) * | 2008-04-15 | 2011-03-24 | Janusz Grzyb | Surface-mountable antenna with waveguide connector function, communication system, adaptor and arrangement comprising the antenna device |
| CN104538371A (en) * | 2015-01-13 | 2015-04-22 | 河北博威集成电路有限公司 | Semiconductor chip capsule with high reliability and low cost |
| CN106654541A (en) * | 2017-02-20 | 2017-05-10 | 成都瑞迪威科技有限公司 | Millimeter-wave 64 array element tile type phased array antenna |
| CN108258393A (en) * | 2017-12-29 | 2018-07-06 | 中国电子科技集团公司第二十研究所 | A kind of K-band minimizes millimeter wave T/R components |
| CN109245793A (en) * | 2018-09-29 | 2019-01-18 | 中国电子科技集团公司第五十四研究所 | A kind of multichannel tile type phased array transmitting-receiving array and its manufacturing method |
| CN110739537A (en) * | 2019-09-28 | 2020-01-31 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | High-density high-integration millimeter wave tile-type phase-controlled antenna T component |
| CN113922839A (en) * | 2021-12-14 | 2022-01-11 | 成都雷电微力科技股份有限公司 | Transmit-receive unit, transmit-receive assembly and phased array antenna structure |
| CN114256175A (en) * | 2021-12-07 | 2022-03-29 | 中国电子科技集团公司第二十九研究所 | Tile type TR (transmitter-receiver) component embedded in micro-channel and preparation method thereof |
-
2023
- 2023-03-21 CN CN202310276615.6A patent/CN115986433B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07245328A (en) * | 1994-03-04 | 1995-09-19 | Sanyo Electric Co Ltd | Integrated circuit device |
| US20040227666A1 (en) * | 2003-02-26 | 2004-11-18 | Masakazu Adachi | Antenna switch module, all-in-one communication module, communication apparatus and method for manufacturing antenna switch module |
| US20110068990A1 (en) * | 2008-04-15 | 2011-03-24 | Janusz Grzyb | Surface-mountable antenna with waveguide connector function, communication system, adaptor and arrangement comprising the antenna device |
| CN104538371A (en) * | 2015-01-13 | 2015-04-22 | 河北博威集成电路有限公司 | Semiconductor chip capsule with high reliability and low cost |
| CN106654541A (en) * | 2017-02-20 | 2017-05-10 | 成都瑞迪威科技有限公司 | Millimeter-wave 64 array element tile type phased array antenna |
| CN108258393A (en) * | 2017-12-29 | 2018-07-06 | 中国电子科技集团公司第二十研究所 | A kind of K-band minimizes millimeter wave T/R components |
| CN109245793A (en) * | 2018-09-29 | 2019-01-18 | 中国电子科技集团公司第五十四研究所 | A kind of multichannel tile type phased array transmitting-receiving array and its manufacturing method |
| CN110739537A (en) * | 2019-09-28 | 2020-01-31 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | High-density high-integration millimeter wave tile-type phase-controlled antenna T component |
| CN114256175A (en) * | 2021-12-07 | 2022-03-29 | 中国电子科技集团公司第二十九研究所 | Tile type TR (transmitter-receiver) component embedded in micro-channel and preparation method thereof |
| CN113922839A (en) * | 2021-12-14 | 2022-01-11 | 成都雷电微力科技股份有限公司 | Transmit-receive unit, transmit-receive assembly and phased array antenna structure |
Non-Patent Citations (3)
| Title |
|---|
| DONGLIANG WANG等: "Reliability of High Density Wire Bonding in X band T/R Module", 《2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)》 * |
| 王立发等: "一种宽带高性能T/Ｒ 组件的设计", 《航空兵器》, no. 6 * |
| 裴乃昌: "W 频段机场异物探测雷达收发前端", 《电讯技术》, vol. 53, no. 10 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117082730A (en) * | 2023-09-20 | 2023-11-17 | 成都华兴大地科技有限公司 | Airtight multilayer ceramic structure |
| CN117082730B (en) * | 2023-09-20 | 2024-02-09 | 成都华兴大地科技有限公司 | Airtight multilayer ceramic structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115986433B (en) | 2023-08-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8040286B2 (en) | High frequency module | |
| CN111525284B (en) | Multi-frequency composite high-power tile type active phased array antenna | |
| US9648725B2 (en) | High-frequency circuit package and sensor module | |
| US7388756B1 (en) | Method and system for angled RF connection using a flexible substrate | |
| CN1089396A (en) | Composite microwave circuit module assembly and syndeton thereof | |
| US6911733B2 (en) | Semiconductor device and electronic device | |
| EP1289060A2 (en) | Low cost communication phased array antenna | |
| US20070085636A1 (en) | Waveguide coupler | |
| CN109245793B (en) | Multichannel tile type phased array transceiver array and manufacturing method thereof | |
| CN115986433A (en) | TR module architecture and process method thereof | |
| CN109888449B (en) | Tile type TR module for vertical transmission of radio frequency signals | |
| CN106711565B (en) | A kind of miniaturization is three-dimensional to be inverted T/R component | |
| CN113725629B (en) | High-power dual-frequency dual-polarized tile-type active phased-array antenna | |
| JP3969321B2 (en) | High frequency transmitter / receiver module | |
| CN113271118B (en) | Dual-frequency dual-polarization TR module | |
| JP2006287962A (en) | High frequency transmitting/receiving module | |
| JP2798070B2 (en) | Composite microwave integrated circuit | |
| CN110601705B (en) | Phased array multi-beam radio frequency receiving assembly | |
| CN114337720B (en) | Phased array antenna radio frequency front end assembly and system | |
| CN117082730B (en) | Airtight multilayer ceramic structure | |
| CN116938277B (en) | Multichannel radio frequency front end and composite substrate | |
| US20240178575A1 (en) | Antenna module | |
| CN114243252A (en) | Tile type TR assembly integrated with liquid cooling runner | |
| CN116819452A (en) | Millimeter wave double-sided radio frequency transceiver component and radar phased array system | |
| CN117543225A (en) | Millimeter wave TR component, and device and method for cutting wave-absorbing material |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |