JP2006287962A - High frequency transmitting/receiving module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve a problem that a bias application lead is brazed on a package and that package and a resin substrate or the like are positioned and screwed on a waveguide terminal of a casing in a conventional high frequency transmitting/receiving mode so that costs of the package are increased and a module manufacturing process is complicated or the like thereby increasing costs of the module. <P>SOLUTION: A waveguide terminal, a signal terminal, a control signal terminal, a ground terminal and a bias terminal are disposed on a lower surface of a multilayered dielectric substrate comprising the package. Furthermore, terminals are disposed on an upper surface of a resin substrate in accordance with the package, and the corresponding terminals are all connected (bumped) and mounted by fusing spherical solders. Moreover, an antenna is provided on the rear side of the resin substrate with the package mounted thereon. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a high-frequency transmission / reception module that transmits and receives a microwave or millimeter-wave band high-frequency signal using a waveguide.

  Conventionally, a high-frequency transceiver module using a waveguide has a metal lead brazed to the package in order to apply a bias voltage to a semiconductor that operates in a high-frequency band such as a microwave or millimeter-wave band. The lead is soldered to a resin substrate or the like that supplies a bias. Further, the package, the resin substrate, and the like are screwed in alignment with the waveguide terminal of the housing. (For example, Patent Document 1)

JP-A-5-343904 (page 2-4, FIG. 1)

  As described above, the conventional high-frequency transmission / reception module has a package in which a bias applying lead is brazed to the package, and the package and the resin substrate are positioned and screwed to the waveguide terminal of the housing. The cost of the module and the manufacturing process of the module are complicated, which ultimately leads to a high module cost.

  The present invention was made to solve the above-described problems, and greatly reduces the manufacturing cost for connection of a waveguide terminal, a signal terminal, a control signal terminal, a ground terminal, a bias terminal, and the like, In accordance with this, the object is to lead the package and reduce the package cost.

  In order to achieve the above object, a high-frequency transmission / reception module according to the present invention includes a waveguide terminal, a signal terminal, a control signal terminal, a ground terminal, and a bias terminal on the lower surface of a multilayer dielectric substrate that constitutes a package. Corresponding to this package, waveguide terminals, signal terminals, control signal terminals, ground terminals and bias terminals are arranged on the top surface of the resin substrate, and the corresponding terminals are all melted and connected with spherical solder. In addition, it was configured as follows.

In a high-frequency transmission / reception module having one or two or more waveguide terminals and transmitting / receiving microwave and millimeter-wave band high-frequency signals, a multilayer dielectric substrate in which one type or two or more types of dielectric materials are laminated One or two or more waveguide terminals, signal terminals, ground terminals and bias terminals are arranged on the lower surface of the dielectric substrate, and microwave and millimeter wave bands are formed on the upper surface of the dielectric substrate. One or two or more packages, one or two, which house the semiconductor elements to be operated and connect the semiconductor elements and the waveguide terminals with a microstrip line-waveguide converter. The above-mentioned waveguide terminal, signal terminal, ground terminal and bias terminal are arranged on the upper surface of the substrate corresponding to the above package, and a single-layer or multi-layer resin base having a function of transmitting and receiving a bias voltage and a signal And, the equipped,
The signal terminal, the ground terminal, and the bias terminal provided on the package and the resin substrate are connected by melting a plurality of spherical solders, and the waveguide terminal of the package and the waveguide of the resin substrate. The terminals are connected by a plurality of spherical solders arranged so as to surround the periphery of both openings, and an antenna connected to the waveguide terminal on the top surface of the resin substrate is provided on the back surface of the resin substrate. It is characterized by that.

  Of the spherical solder that connects the corresponding terminals at the waveguide terminal, signal terminal, ground terminal, and bias terminal provided on the package or the resin substrate, of the opening of the waveguide terminal. Except for the spherical solder arranged in the periphery, at least a spherical solder portion arranged in the corner of the package is filled with an underfill material.

  Further, a gap between the plurality of spherical solders arranged around the waveguide terminal is ¼ or less of a signal wavelength passing through the waveguide terminal, and the electric field surface or magnetic field of the waveguide terminal is One or more of the spherical solder rows are provided in parallel to the interface with a gap of 1/4 ± 30% of the wavelength of the signal passing therethrough.

Further, when the spherical solder is disposed, the spherical solder distance L1 disposed parallel to the electric field surface of the waveguide terminal and sandwiching the waveguide terminal, and the waveguide terminal The distance L2 from the spherical solder arranged parallel to the magnetic field surface and sandwiching the waveguide terminal to the end of the waveguide magnetic field surface is the wavelength of the high-frequency signal passing through the waveguide terminal. The following relational expression including λ × (0.7 to 1.3) = 2 / (1 / L1 ² + 1 / L2 ² ) ^1/2
It is characterized by satisfying.

  In addition, one or more high-frequency signal terminals having a plurality of concentric ground terminals are provided around one signal terminal.

  In the package constituted by the multilayer dielectric substrate, a metal frame is mounted on the multilayer dielectric substrate, and a metal cover is placed on the frame and welded, or the dielectric substrate is mounted. Is fixed with solder or a conductive adhesive, and the inside of the package is hermetically sealed.

  Further, in the package composed of the multilayer dielectric substrate, a cover formed by applying metal plating or the like to metal or resin is fixed to the multilayer dielectric substrate with solder or a conductive adhesive, and the inside of the package is hermetically sealed. It is characterized by being in a state.

  Further, the semiconductor device is characterized in that a resin paste is applied on a semiconductor element to be housed in a package constituted by the multilayer dielectric substrate to make the semiconductor airtight.

  According to the present invention, it is possible to connect and fix the package together with peripheral circuit components on the resin substrate, and the conventional positioning operation becomes unnecessary, so that the manufacturing process can be simplified and the manufacturing cost can be simplified. Can be reduced. In addition, since the waveguide terminal of the package is directly connected to the waveguide terminal of the resin substrate provided with the antenna, the metal carrier of the package is unnecessary, so that the raw material costs can be reduced and the price can be reduced. In addition, further weight reduction is possible.

Embodiment 1 FIG.
FIG. 1 shows a configuration of a high-frequency transceiver module according to the first embodiment.

  In FIG. 1, a package 1 has an airtight welding frame 3 placed on a multilayer dielectric substrate 2 by soldering or brazing, etc., and a cover 4 is placed thereon and welded to ensure airtightness. . The internal configuration of the package 1 is shown in FIG. 5, in which a semiconductor 18 is mounted (details will be described later). Further, on the lower surface of the multilayer dielectric substrate 2, a waveguide terminal 6, a signal, a control signal, a ground and bias terminal 7, a high-frequency signal terminal 9, and the like are arranged, but are omitted in FIG. The resin substrate 5 is arranged on the upper surface of the substrate corresponding to the waveguide terminal 6, signal, control signal, ground and bias terminal 7, and high-frequency signal terminal 9 disposed on the lower surface of the multilayer dielectric substrate 2. In addition, a peripheral circuit 10 is provided for exchanging signals and biases with the package 1. The terminals corresponding to each of the package 1 and the resin substrate 5 are secured by melting the spherical solder 8 (so-called bump connection). The resin substrate 5 on which the package 1 is mounted is screwed to a waveguide circuit 11 provided with a waveguide 12 corresponding to the waveguide terminal 6. At this time, in order to bring the waveguide terminal 6 of the resin substrate 5 and the waveguide 12 into contact with each other without a gap, a conductive resin 26 impregnated with a conductive paint is used as the opening of the waveguide 12 of the waveguide circuit 11. It is applied to a position as close to the opening end as possible around the part and sandwiched between the resin substrate 5.

  Next, the operation will be described. As shown in FIG. 1, the package 1 exchanges voltages and signals with the resin substrate 5 through signals, control signals, ground and bias terminals 7, high frequency signal terminals 9, and waveguide terminals 6. Then, the semiconductor 18 housed inside is operated. In addition, the resin substrate 5 melts the spherical solder 8 into a signal, a control signal, a ground and bias terminal 7, a high frequency signal terminal 9, and a waveguide terminal 6 in addition to the voltage and signal exchange with the package 1. As a result, the package 1 is fixed on the resin substrate 5. The waveguide circuit 11 is fixed to the external circuit (for example, an antenna or the like, omitted in FIG. 1) by fixing the resin substrate 5 on which the package 1 is mounted by screwing or the like and having the waveguide 12 provided inside. Then, high-frequency signals in the microwave or millimeter wave band are exchanged. At that time, the conductive resin 26 is applied so that the waveguide terminal 6 of the resin substrate 5 and the waveguide 11 of the waveguide circuit 12 are connected without a gap, thereby reducing the power loss of the signal at the connection portion. ing.

  FIG. 2A shows the arrangement of the spherical solder 8 connecting the waveguide terminals 6 at this time (part A in FIG. 1). FIG. 2B is a graph showing signal loss at the waveguide connection portion, and is parallel to the electric field surface of the waveguide terminal 6 (short side of the waveguide terminal 6). The distance between the eight rows of spherical solders arranged across 6 is L1, the spherical shape arranged across the waveguide terminals 6 parallel to the magnetic field surface of the waveguide terminals 6 (long side of the waveguide terminals 6) When the distance between the solder 8 rows and the end of the waveguide terminal 6 is L2, L1 is fixed and L2 is changed.

  Thus, the passage loss can be reduced by optimizing the length of L2. FIG. 2 (c) shows the adjacent waveguide terminals according to the number of rows of spherical solders 8 provided around the waveguide terminals 6 when the waveguide terminals 6 are adjacent as shown in FIG. The degree of signal coupling is shown. When the number of rows is one for the curve a, the number of rows is 2 for the curve b, the curve c is 1 of the wavelength of the signal passing through the waveguide terminal 6 through the space between the two spherical solders 8. Characteristics when / 4 ± 30% are shown. As described above, when a plurality of rows are arranged and the interval is set to 1/4 ± 30% of the wavelength of the signal passing through the waveguide terminal 6, the coupling with the adjacent waveguide terminals can be reduced. .

In this embodiment, in FIG. 2A, when the relationship between the distances L1 and L2 is λ as the wavelength of the signal passing through the waveguide terminal 6, λ × (0.7 to 1.3) = 2 / (1 / L1 ² + 1 / L2 ² ) ^1/2 is set. In this case, optimal L2 characteristics as shown in FIG. 2B can be obtained, and signal loss at the waveguide connection portion can be reduced. Further, by arranging a plurality of rows of spherical solder 8 and setting the interval to 1/4 ± 30% of the wavelength of the signal passing through the waveguide terminal 6, the coupling with the adjacent waveguide can be achieved. It is more reduced.

  Next, FIG. 3 shows the arrangement of the spherical solder 8 (B portion in FIG. 1) for transmitting and receiving a high frequency signal such as a microwave band. The high-frequency signal terminal 9 is constituted by arranging a plurality of signal terminals 14 at substantially the center and a plurality of ground terminals 15 on concentric circles separated by a certain distance therefrom. This is to make the impedance between the signal terminal 14 and the ground terminal 15 constant, as in the coaxial cable generally used for transmitting a high-frequency signal. Each of these terminals is also connected to the other terminals by melting the spherical solder 8 correspondingly between the terminals disposed on the lower surface of the package 1 and the terminals disposed on the upper surface of the resin substrate 5. Connection is possible in a lump.

Next, the mechanical strength of the package 1 and the spherical solder 8 disposed on the lower surface thereof will be described with reference to FIG. In general, the connection using the spherical solder 8 (so-called bump connection) has lower mechanical strength than the connection using the lead terminal. This is because, for example, a chip using a thin and hard substrate such as ceramic is completely fixed, and therefore, when thermal stress is applied, chipping, cracking, etc. are likely to occur. Therefore, for example, by injecting an underfill material 16 based on a resin such as epoxy into the solder joint between the package 1 and the resin substrate 5, the stress applied to the package 1 and the spherical solder 8 can be relieved. .
However, care must be taken not to inject into the waveguide terminal portion. This is because when the underfill material having a certain dielectric constant enters the signal passing portion, the impedance changes and the passing characteristics are deteriorated. In FIG. 1 and FIG. 4, the underfill material 16 is injected into part C, that is, the four corners of the package 1. In general, cracks and chips are likely to occur from the four corners of the package 1, and therefore, even if this underfill material 16 is injected only into the four corners of the package 1, the effect is great. Needless to say, the mechanical strength is further improved when the injection is performed in the entire region except the waveguide terminal 6 portion.

  Next, the structure of the package 1 is shown in FIG. FIG. 5A shows the inside of the package 1, and the multilayer dielectric substrate 2 has two cavities 17a and 17b on its upper surface, and a semiconductor 18a that operates in the microwave or millimeter wave band. And 18b, respectively. The multilayer dielectric substrate 2 and the semiconductors 18a and 18b are connected by a metal wire 19 such as Au, for example, and a high-frequency signal transferred to the semiconductors 18a and 18b is converted into a microstrip line-waveguide conversion to which the metal wire 19 is connected. The signal is converted into the waveguide mode by the device 20 or connected to the high-frequency signal terminal 9.

  An airtight metal frame 3 is disposed on the multilayer dielectric substrate 2, and a cover 4 is welded onto the metal frame 3 to make the inside of the package 1 airtight. FIG. 5B shows an external appearance when the cover 4 is welded to the package of FIG. As shown in the figure, the inside of the package 1 can be hermetically sealed by welding. In FIG. 5C, the airtight metal frame 3 is not provided on the multilayer dielectric substrate 2, and at least the upper surfaces of the semiconductors 18a and 18b and the metal wire 19 are contacted with the upper surface of the multilayer dielectric substrate 2. A molded cover 21 formed of a metal plate is fixed to the upper surface of the multilayer dielectric substrate 2 using solder or a conductive adhesive, so that the inside of the package 1 can be hermetically sealed. In FIG. 5D, the sealing resin paste 22 is applied on the semiconductors 18a and 18b and the metal wire 19 disposed on the multilayer dielectric substrate 2, thereby making it possible to ensure the airtightness of the semiconductor.

  In the above description, the spherical solder 8 is melted to connect each terminal provided on the lower surface of the package 1 and each terminal provided on the upper surface of the resin substrate 5, but as shown in FIG. A method of injecting an anisotropic conductive resin in which a spherical solder 8 is electrically connected to each terminal by, for example, thermosetting in a state where the upper and lower sides are disposed between the package 1 and the resin substrate 5. There is also. Also by this, the same effect as described above can be obtained.

  Next, a manufacturing method will be described. As described above, when the package 1 is connected using the spherical solder 8 on the resin substrate 5, simultaneous soldering such as reflow is performed simultaneously with other components used for the peripheral circuit 10 on the resin substrate 5. This makes it possible to simplify the work of screwing only the package. In general, when the spherical solder 8 as described above is used, a so-called self-alignment effect is obtained in which the terminal position to be connected is corrected by itself. No positioning work is required.

  Next, the price will be described. In the package 1 using the conventional multilayer dielectric substrate 2, the raw material costs include the dielectric substrate 2, the airtight metal frame 3, the metal carrier disposed on the lower surface of the dielectric substrate 2 for screwing, and the like. It is done. In that case, work such as brazing of the metal carrier, the multilayer dielectric substrate 2 and the airtight metal frame 3 is required. Since the package 1 according to the present invention does not require a metal carrier, it is not necessary to braze it, and the cost can be reduced. Further, as described above, the manufacturing process can be simplified, for example, positioning / screwing work is not required for fixing the package 1.

  Thus, in the case of the present embodiment, the package 1 can be connected together with the components of the peripheral circuit 10 on the resin substrate 5 and the positioning work with the waveguide circuit 11 becomes unnecessary. Further, since the metal carrier or the like of the package 1 is unnecessary, the price can be reduced. Further, in terms of electrical characteristics, the passage loss of the connection portion of the waveguide terminal 6 can be reduced by optimizing the arrangement position, interval, and number of rows of the spherical solder 8 around the waveguide terminal 6. Further, the strength of the package 1 and the spherical solder 8 can be improved by injecting the underfill material 16. Further, the package 1 can be hermetically sealed by welding the cover 4 or applying the sealing resin paste 22.

Embodiment 2. FIG.
FIG. 7 shows the configuration of the high-frequency transceiver module according to the second embodiment.

  In FIG. 7, 2 to 10 have the same configuration and operation as in the first embodiment. The metal base 24 is bonded to the resin substrate 5 with a resinous adhesive or the like to constitute a metal base substrate 25. In this case, a waveguide terminal is also provided on the metal base 24 so as to be connected to the waveguide terminal 6 provided on the resin substrate 5 (not shown in the figure).

  As a result, the heat generated in the resin substrate 5 can be efficiently conducted, and the waveguide terminal 11 in the first embodiment is not required by providing the waveguide terminal 6 on the metal base 24. The price can be reduced.

Embodiment 3 FIG.
FIG. 8 shows the configuration of the back surface of the resin substrate used in the high-frequency transceiver module according to the third embodiment.

  In FIG. 8, the resin substrate 5 is provided with an antenna element 27 on the back surface of the resin substrate 5 through the waveguide terminal 6 on the back surface. Although omitted in FIG. 8, the package 1, the peripheral circuit 10 and the like are arranged on the surface as shown in FIG.

  Thus, by arranging the antenna element 27 on the back surface of the resin substrate 5, the waveguide circuit 11 is not required, and the metal base 24 such as the metal base substrate 25 is not required, so that the cost can be reduced. It becomes possible. Moreover, since metal parts are unnecessary, weight reduction is also possible.

It is a figure which shows the structure of the high frequency transmission / reception module by Embodiment 1 of this invention. It is a figure which shows the arrangement | positioning of the spherical solder around the waveguide terminal in Embodiment 1 of this invention, and the characteristic of a waveguide connection part. It is a figure which shows the structure of the high frequency signal terminal in Embodiment 1 of this invention. It is a figure which shows the mechanical strength of the package and spherical solder in Embodiment 1 of this invention. It is a figure which shows the structure of the package in Embodiment 1 of this invention. It is a figure which shows the case where anisotropic conductive resin is used in Embodiment 1 of this invention. It is a figure which shows the structure of the high frequency transmission / reception module by Embodiment 2 of this invention. It is a figure which shows the structure of the back surface of the resin substrate used for the high frequency transmission / reception module by Embodiment 3 of this invention.

Explanation of symbols

  1 package, 2 multilayer dielectric substrate, 3 airtight sealing frame, 4 cover, 5 resin substrate, 6 waveguide terminal, 7 signal, control signal, ground and bias terminal, 8 spherical solder, 9 high frequency signal terminal DESCRIPTION OF SYMBOLS 10 Peripheral circuit, 11 Waveguide circuit, 12 Waveguide, 14 Signal terminal, 15 Ground terminal, 16 Underfill material, 17 Cavity, 18 Semiconductor, 19 Metal wire, 20 Microstrip line-waveguide converter, 21 molding cover, 22 resin paste, 23 anisotropic conductive resin, 24 metal base, 25 metal base substrate, 26 conductive resin, 27 antenna element.

Claims (2)

In a high-frequency transmission / reception module having one or two or more waveguide terminals and transmitting / receiving a high-frequency signal in a microwave and millimeter wave band,
It is composed of a multilayer dielectric substrate in which one type or two or more types of dielectric materials are laminated, and one or more waveguide terminals, signal terminals, ground terminals, and bias terminals are provided on the lower surface of the dielectric substrate. A semiconductor element that operates in a microwave and millimeter wave band on the upper surface of the dielectric substrate, and a microstrip line-waveguide converter between the semiconductor element and the waveguide terminal. One or more connected packages; and
One or more waveguide terminals, signal terminals, ground terminals, and bias terminals are arranged on the upper surface of the substrate corresponding to the package, and have a function of transmitting and receiving a bias voltage and a signal. A substrate,
Comprising
Between the signal terminal, the ground terminal and the bias terminal, which are provided on the package and the resin substrate, respectively, are connected by melting a plurality of spherical solders,
The waveguide terminal of the package and the waveguide terminal of the resin substrate are connected by a plurality of spherical solders arranged so as to surround the periphery of both openings,
A high-frequency transceiver module, wherein an antenna connected to a waveguide terminal on the upper surface of the resin substrate is provided on the back surface of the resin substrate.   Of the spherical solder connecting the corresponding terminals at the waveguide terminal, signal terminal, ground terminal and bias terminal provided on the package or the resin substrate, around the opening of the waveguide terminal. 2. The high-frequency transceiver module according to claim 1, wherein an underfill material is filled at least in a spherical solder portion disposed in a corner of the package except for the arranged spherical solder.

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