JP3969321B2 - High frequency transmitter / receiver module - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a high-frequency transmission / reception module that transmits and receives a microwave or millimeter-wave band high-frequency signal using a waveguide.
[0002]
[Prior art]
Conventionally, a high-frequency transceiver module using a waveguide has a metal lead brazed to the package in order to apply a bias voltage to a semiconductor that operates in a high-frequency band such as a microwave or millimeter-wave band. The lead is soldered to a resin substrate or the like that supplies a bias. Further, the package, the resin substrate, and the like are screwed in alignment with the waveguide terminal of the housing. (For example, Patent Document 1)
[0003]
[Patent Document 1]
JP-A-5-343904 (page 2-4, FIG. 1)
[0004]
[Problems to be solved by the invention]
As described above, the conventional high-frequency transmission / reception module has a package in which a bias applying lead is brazed to the package, and the package and the resin substrate are positioned and screwed to the waveguide terminal of the housing. The cost of the module and the manufacturing process of the module are complicated, which ultimately leads to a high module cost.
[0005]
The present invention was made to solve the above-described problems, and greatly reduces the manufacturing cost for connection of a waveguide terminal, a signal terminal, a control signal terminal, a ground terminal, a bias terminal, and the like, In accordance with this, the object is to lead the package and reduce the package cost.
[0006]
[Means for Solving the Problems]
In order to achieve the above object, a high-frequency transmission / reception module according to the present invention includes a waveguide terminal, a signal terminal, a control signal terminal, a ground terminal, and a bias terminal on the lower surface of a multilayer dielectric substrate that constitutes a package. Corresponding to this package, waveguide terminals, signal terminals, control signal terminals, ground terminals and bias terminals are arranged on the top surface of the resin substrate, and the corresponding terminals are all melted and connected with spherical solder. In addition, the resin substrate on which this package was mounted was mounted on a waveguide circuit.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
Embodiment 1 FIG.
FIG. 1 shows a configuration of a high-frequency transceiver module according to the first embodiment.
[0008]
In FIG. 1, a package 1 has an airtight welding frame 3 placed on a multilayer dielectric substrate 2 by soldering or brazing, etc., and a cover 4 is placed thereon and welded to ensure airtightness. . The internal configuration of the package 1 is shown in FIG. 5, in which a semiconductor 18 is mounted (details will be described later). Further, on the lower surface of the multilayer dielectric substrate 2, a waveguide terminal 6, a signal, a control signal, a ground and bias terminal 7, a high-frequency signal terminal 9, and the like are arranged, but are omitted in FIG. The resin substrate 5 is arranged on the upper surface of the substrate corresponding to the waveguide terminal 6, signal, control signal, ground and bias terminal 7, and high-frequency signal terminal 9 disposed on the lower surface of the multilayer dielectric substrate 2. In addition, a peripheral circuit 10 is provided for exchanging signals and biases with the package 1. The terminals corresponding to each of the package 1 and the resin substrate 5 are secured by melting the spherical solder 8 (so-called bump connection). The resin substrate 5 on which the package 1 is mounted is screwed to a waveguide circuit 11 provided with a waveguide 12 corresponding to the waveguide terminal 6. At this time, in order to bring the waveguide terminal 6 of the resin substrate 5 and the waveguide 12 into contact with each other without a gap, a conductive resin 26 impregnated with a conductive paint is used as the opening of the waveguide 12 of the waveguide circuit 11. It is applied to a position as close to the opening end as possible around the part and sandwiched between the resin substrate 5.
[0009]
Next, the operation will be described. As shown in FIG. 1, the package 1 exchanges voltages and signals with the resin substrate 5 through signals, control signals, ground and bias terminals 7, high frequency signal terminals 9, and waveguide terminals 6. Then, the semiconductor 18 housed inside is operated. In addition, the resin substrate 5 melts the spherical solder 8 into a signal, a control signal, a ground and bias terminal 7, a high frequency signal terminal 9, and a waveguide terminal 6 in addition to the voltage and signal exchange with the package 1. As a result, the package 1 is fixed on the resin substrate 5. The waveguide circuit 11 is fixed to the external circuit (for example, an antenna or the like, omitted in FIG. 1) by fixing the resin substrate 5 on which the package 1 is mounted by screwing or the like and having the waveguide 12 provided inside. Then, high-frequency signals in the microwave or millimeter wave band are exchanged. At that time, the conductive resin 26 is applied so that the waveguide terminal 6 of the resin substrate 5 and the waveguide 11 of the waveguide circuit 12 are connected without a gap, thereby reducing the power loss of the signal at the connection portion. ing.
[0010]
FIG. 2A shows the arrangement of the spherical solder 8 connecting the waveguide terminals 6 at this time (part A in FIG. 1). FIG. 2B is a graph showing signal loss at the waveguide connection portion, and is parallel to the electric field surface of the waveguide terminal 6 (short side of the waveguide terminal 6). The distance between the eight rows of spherical solders arranged across 6 is L1, the spherical shape arranged across the waveguide terminals 6 parallel to the magnetic field surface of the waveguide terminals 6 (long side of the waveguide terminals 6) When the distance between the solder 8 rows and the end of the waveguide terminal 6 is L2, L1 is fixed and L2 is changed.
Thus, the passage loss can be reduced by optimizing the length of L2. FIG. 2 (c) shows the adjacent waveguide terminals according to the number of rows of spherical solders 8 provided around the waveguide terminals 6 when the waveguide terminals 6 are adjacent as shown in FIG. The degree of signal coupling is shown. When the number of rows is one for the curve a, the number of rows is 2 for the curve b, the curve c is 1 of the wavelength of the signal passing through the waveguide terminal 6 through the space between the two spherical solders 8. Characteristics when / 4 ± 30% are shown. As described above, when a plurality of rows are arranged and the interval is set to 1/4 ± 30% of the wavelength of the signal passing through the waveguide terminal 6, the coupling with the adjacent waveguide terminals can be reduced. .
[0011]
In this embodiment, in FIG. 2A, when the relationship between the distances L1 and L2 is λ as the wavelength of the signal passing through the waveguide terminal 6, λ × (0.7 to 1.3) = 2 / (1 / L1 ² + 1 / L2 ² ) ^1/2 is set. In this case, optimum L2 characteristics as shown in FIG. 2B can be obtained, and signal loss at the waveguide connection portion can be reduced. Further, by arranging a plurality of rows of spherical solder 8 rows and the interval thereof being 1/4 ± 30% of the wavelength of the signal passing through the waveguide terminal 6, the coupling with the adjacent waveguide can be achieved. It is more reduced.
[0012]
Next, FIG. 3 shows the arrangement of the spherical solder 8 (B portion in FIG. 1) for transmitting and receiving a high frequency signal such as a microwave band. The high-frequency signal terminal 9 is constituted by arranging a plurality of signal terminals 14 at substantially the center and a plurality of ground terminals 15 on concentric circles separated by a certain distance therefrom. This is to make the impedance between the signal terminal 14 and the ground terminal 15 constant, as in the coaxial cable generally used for transmitting a high-frequency signal. Each of these terminals is also connected to the other terminals by melting the spherical solder 8 correspondingly between the terminals disposed on the lower surface of the package 1 and the terminals disposed on the upper surface of the resin substrate 5. Connection is possible in a lump.
[0013]
Next, the mechanical strength of the package 1 and the spherical solder 8 disposed on the lower surface thereof will be described with reference to FIG. In general, the connection using the spherical solder 8 (so-called bump connection) has lower mechanical strength than the connection using the lead terminal. This is because, for example, a chip using a thin and hard substrate such as ceramic is completely fixed, so that when thermal stress or the like is applied, chipping or cracking is likely to occur. Therefore, the stress applied to the package 1 and the spherical solder 8 can be relieved by injecting an underfill material 16 based on a resin such as epoxy into the solder joint between the package 1 and the resin substrate 5. .
However, care must be taken not to inject into the waveguide terminal portion. This is because when an underfill material having a certain dielectric constant enters the signal passing portion, the impedance changes and the passing characteristics are deteriorated. In FIGS. 1 and 4, the underfill material 16 is injected into part C, that is, the four corners of the package 1. In general, since cracks and chips are likely to occur from the four corners of the package 1, even if this underfill material 16 is injected only into the four corners of the package 1, the effect is great. Needless to say, the mechanical strength is further improved when the injection is made in the entire region except the waveguide terminal 6 portion.
[0014]
Next, the structure of the package 1 is shown in FIG. FIG. 5A shows the inside of the package 1, and the multilayer dielectric substrate 2 has two cavities 17a and 17b on its upper surface, and a semiconductor 18a that operates in the microwave or millimeter wave band. And 18b, respectively. The multilayer dielectric substrate 2 and the semiconductors 18a and 18b are connected by a metal wire 19 such as Au, for example, and a high-frequency signal transferred to the semiconductors 18a and 18b is converted into a microstrip line-waveguide conversion to which the metal wire 19 is connected. The signal is converted into the waveguide mode by the device 20 or connected to the high-frequency signal terminal 9.
An airtight metal frame 3 is disposed on the multilayer dielectric substrate 2, and a cover 4 is welded onto the metal frame 3 to make the inside of the package 1 airtight. FIG. 5B shows an external appearance when the cover 4 is welded to the package of FIG. As shown in the figure, the inside of the package 1 can be hermetically sealed by welding. In FIG. 5C, the airtight metal frame 3 is not provided on the multilayer dielectric substrate 2, and at least the upper surfaces of the semiconductors 18a and 18b and the metal wire 19 are contacted with the upper surface of the multilayer dielectric substrate 2. A molded cover 21 formed of a metal plate is fixed to the upper surface of the multilayer dielectric substrate 2 using solder or a conductive adhesive, so that the inside of the package 1 can be hermetically sealed. In FIG. 5D, the sealing resin paste 22 is applied on the semiconductors 18a and 18b and the metal wire 19 disposed on the multilayer dielectric substrate 2, thereby making it possible to ensure the airtightness of the semiconductor.
[0015]
In the above description, the spherical solder 8 is melted to connect each terminal provided on the lower surface of the package 1 and each terminal provided on the upper surface of the resin substrate 5, but as shown in FIG. A method of injecting an anisotropic conductive resin in which a spherical solder 8 is electrically connected to each terminal by, for example, thermosetting in a state where the upper and lower sides are disposed between the package 1 and the resin substrate 5. There is also. Also by this, the same effect as described above can be obtained.
[0016]
Next, a manufacturing method will be described. As described above, when the package 1 is connected using the spherical solder 8 on the resin substrate 5, simultaneous soldering such as reflow is performed simultaneously with other components used for the peripheral circuit 10 on the resin substrate 5. This makes it possible to simplify the work of screwing only the package. In general, when the spherical solder 8 as described above is used, a so-called self-alignment effect is obtained in which the terminal position to be connected is corrected by itself. Therefore, the package 1 and the waveguide circuit 11 which have been conventionally performed are obtained. No positioning work is required.
[0017]
Next, the price will be described. In the package 1 using the conventional multilayer dielectric substrate 2, the raw material costs include the dielectric substrate 2, the airtight metal frame 3, the metal carrier disposed on the lower surface of the dielectric substrate 2 for screwing, and the like. It is done. In that case, work such as brazing of the metal carrier, the multilayer dielectric substrate 2 and the airtight metal frame 3 is required. Since the package 1 according to the present invention does not require a metal carrier, it is not necessary to braze it, and the cost can be reduced. Further, as described above, the manufacturing process can be simplified, for example, positioning / screwing work is not required for fixing the package 1.
[0018]
Thus, in the case of the present embodiment, the package 1 can be connected together with the components of the peripheral circuit 10 on the resin substrate 5 and the positioning work with the waveguide circuit 11 becomes unnecessary. Further, since the metal carrier or the like of the package 1 is unnecessary, the price can be reduced. Further, in terms of electrical characteristics, the passage loss of the connection portion of the waveguide terminal 6 can be reduced by optimizing the arrangement position, interval, and number of rows of the spherical solder 8 around the waveguide terminal 6. Further, the strength of the package 1 and the spherical solder 8 can be improved by injecting the underfill material 16. Further, the package 1 can be hermetically sealed by welding the cover 4 or applying the sealing resin paste 22.
[0019]
Embodiment 2. FIG.
FIG. 7 shows the configuration of the high-frequency transceiver module according to the second embodiment.
[0020]
In FIG. 7, 2 to 10 have the same configuration and operation as in the first embodiment. The metal base 24 is bonded to the resin substrate 5 with a resinous adhesive or the like to constitute a metal base substrate 25. In this case, a waveguide terminal is also provided on the metal base 24 so as to be connected to the waveguide terminal 6 provided on the resin substrate 5 (not shown in the figure).
[0021]
As a result, the heat generated in the resin substrate 5 can be efficiently conducted, and the waveguide terminal 11 in the first embodiment is not required by providing the waveguide terminal 6 on the metal base 24. The price can be reduced.
[0022]
Embodiment 3 FIG.
FIG. 8 shows the configuration of the back surface of the resin substrate used in the high-frequency transceiver module according to the third embodiment.
[0023]
In FIG. 8, the resin substrate 5 is provided with an antenna element 27 on the back surface of the resin substrate 5 through the waveguide terminal 6 on the back surface. Although omitted in FIG. 8, the package 1, the peripheral circuit 10 and the like are arranged on the surface as shown in FIG.
[0024]
Thus, by arranging the antenna element 27 on the back surface of the resin substrate 5, the waveguide circuit 11 is not required, and the metal base 24 such as the metal base substrate 25 is not required, so that the cost can be reduced. It becomes possible. Moreover, since metal parts are unnecessary, weight reduction is also possible.
[0025]
【The invention's effect】
According to the present invention, it is possible to connect and fix the package together with peripheral circuit components on the resin substrate, and the conventional positioning operation becomes unnecessary, so that the manufacturing process can be simplified and the manufacturing cost can be simplified. Can be reduced. In addition, since the metal carrier of the package is not required, raw material costs can be reduced.
[Brief description of the drawings]
FIG. 1 is a diagram showing a configuration of a high-frequency transceiver module according to Embodiment 1 of the present invention.
FIG. 2 is a diagram showing the arrangement of spherical solder around the waveguide terminal and the characteristics of the waveguide connection portion in the first embodiment of the present invention.
FIG. 3 is a diagram showing a configuration of a high-frequency signal terminal according to Embodiment 1 of the present invention.
FIG. 4 is a diagram showing the mechanical strength of a package and spherical solder according to Embodiment 1 of the present invention.
FIG. 5 is a diagram showing a configuration of a package in Embodiment 1 of the present invention.
FIG. 6 is a diagram showing a case where an anisotropic conductive resin is used in Embodiment 1 of the present invention.
FIG. 7 is a diagram showing a configuration of a high-frequency transceiver module according to Embodiment 2 of the present invention.
FIG. 8 is a diagram showing a configuration of a back surface of a resin substrate used in a high frequency transmission / reception module according to Embodiment 3 of the present invention.
[Explanation of symbols]
1 package, 2 multilayer dielectric substrate, 3 airtight sealing frame, 4 cover, 5 resin substrate, 6 waveguide terminal, 7 signal, control signal, ground and bias terminal, 8 spherical solder, 9 high frequency signal terminal DESCRIPTION OF SYMBOLS 10 Peripheral circuit, 11 Waveguide circuit, 12 Waveguide, 14 Signal terminal, 15 Ground terminal, 16 Underfill material, 17 Cavity, 18 Semiconductor, 19 Metal wire, 20 Microstrip line-waveguide converter, 21 Molded cover, 22 Resin paste, 23 Anisotropic conductive resin, 24 Metal base, 25 Metal base substrate, 26 Conductive resin, 27 Antenna element

Claims (8)

In a high-frequency transmission / reception module having one or more waveguide terminals and transmitting / receiving a millimeter-wave band high-frequency signal,
It is composed of a multilayer dielectric substrate in which one type or two or more types of dielectric materials are laminated, and one or more waveguide terminals, a control signal terminal, a ground terminal, and a bias terminal are provided on the lower surface of the dielectric substrate. A microstrip line-waveguide for accommodating a semiconductor element operating in a millimeter wave band on the upper surface of the dielectric substrate and transmitting a high-frequency signal between the semiconductor element and the waveguide terminal One or more packages connected by a converter;
One or two or more waveguide terminals, a control signal terminal, a ground terminal, and a bias terminal are arranged on the upper surface of the substrate corresponding to each terminal of the package, and a peripheral circuit is mounted on the upper surface of the substrate. A single-layer or multi-layer resin substrate having a lower surface of the package connected to the upper surface of the substrate,
One or two or more waveguide terminals are provided, and metal or metal is plated with metal to form a plurality of waveguides that are oriented in the parallel and vertical directions of the substrate surface in the resin substrate. In addition, the waveguide terminal on the upper surface is connected to the lower surface of the resin substrate, and a plate-like waveguide circuit that transmits a high-frequency signal to and from the antenna;
Comprising
The control signal terminal, the ground terminal and the bias terminal provided on the package and the resin substrate are connected by melting a plurality of spherical solders between corresponding terminals,
The waveguide terminal of the package and the waveguide terminal of the resin substrate are connected by melting a plurality of spherical solders arranged so as to surround the periphery of both openings,
The package and the waveguide terminals provided on the resin substrate, a control signal terminal, at the ground terminal and the bias terminal, among the solder sphere connected between respective corresponding terminals were divided opening of the waveguide terminal A high-frequency transmission / reception module characterized in that an underfill material is filled in at least a spherical solder portion disposed in a corner of the package. In a high-frequency transceiver module that has a plurality of waveguide terminals and transmits and receives millimeter-wave high-frequency signals,
It is composed of a multilayer dielectric substrate in which dielectric materials are laminated, and a plurality of waveguide terminals, control signal terminals, ground terminals and bias terminals are arranged on the lower surface of the dielectric substrate, and on the upper surface of the dielectric substrate, A microstrip line and a semiconductor element that is electrically connected to each terminal and operates in the millimeter wave band are housed, the semiconductor element is connected to the microstrip line, and between the semiconductor element and the waveguide terminal A package formed by connecting a high-frequency signal to a waveguide mode using a microstrip line-waveguide converter;
A plurality of waveguide terminals, control signal terminals, ground terminals, and bias terminals are arranged on the upper surface of the substrate corresponding to the terminals of the package, and are electrically connected to the terminals and outside the arrangement area of the terminals. A peripheral circuit is placed on the upper surface of the substrate, and the lower surface of the package is placed on the upper surface of the substrate, and a multilayer resin substrate that exchanges a bias voltage and a signal between the package and the peripheral circuit;
A plurality of waveguide terminals are provided, and a plurality of waveguides oriented in the parallel direction and the vertical direction of the substrate surface in the resin substrate are formed inside the metal, and the waveguide terminals are oriented in the vertical direction. Connected to the waveguide on the resin substrate side, the waveguide on the resin substrate side is connected to one end side of the waveguide oriented in the parallel direction, and the waveguide oriented in the parallel direction the other end is connected to the waveguide of the antenna side oriented in the vertical direction Rutotomoni, the waveguide terminal of the upper surface to the lower surface of the resin substrate are connected, a plate for transmitting a high frequency signal between the antenna Shaped waveguide circuit;
Comprising
Waveguide terminal of the waveguide terminal and the resin substrate of the package is to melt the solder of a plurality of spherical arranged to surround the opening surround both connected with a air gap between both ,
The control signal terminal, the ground terminal, and the bias terminal provided on the package and the resin substrate are connected by melting a plurality of spherical solders between the corresponding terminals, and the plurality of spherical solders are connected to each other. A high-frequency transmission / reception module, characterized in that it is arranged around a spherical solder connecting between a package and waveguide terminals of the resin substrate.   The high-frequency transmitting / receiving module according to claim 1, wherein a plurality of cavities for mounting a plurality of semiconductors are provided in a package constituted by the multilayer substrate.   In the package constituted by the multilayer dielectric substrate, a metal frame is mounted on the multilayer dielectric substrate, and a metal cover is placed on the frame and welded, or the dielectric substrate is soldered. 4. The high-frequency transmission / reception module according to claim 1, wherein the package is hermetically sealed by fixing with a conductive adhesive or the like.   5. The package of the multilayer dielectric substrate according to claim 1, wherein a molded cover formed of a metal is fixed to the upper surface of the multilayer dielectric substrate with solder. 6. High frequency transmission / reception module.   6. The semiconductor device according to claim 1, wherein a resin paste is applied on a semiconductor element to be housed in a package composed of the multilayer dielectric substrate to make the semiconductor airtight. High frequency transceiver module.   7. The high frequency device according to claim 1, wherein the resin substrate is a metal base substrate having a metal plate disposed on a back surface of the substrate, and a waveguide terminal is disposed on the metal plate. Transmit / receive module.   By applying a conductive resin obtained by impregnating a resin with a conductive paint around the waveguide circuit and the waveguide terminal of the resin substrate, and sandwiching between the waveguide circuit and the resin substrate, The high-frequency transmission / reception module according to claim 1, wherein a waveguide terminal is connected.

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