CN109888449B - Tile type TR module for vertical transmission of radio frequency signals - Google Patents
Tile type TR module for vertical transmission of radio frequency signals Download PDFInfo
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- CN109888449B CN109888449B CN201910163232.1A CN201910163232A CN109888449B CN 109888449 B CN109888449 B CN 109888449B CN 201910163232 A CN201910163232 A CN 201910163232A CN 109888449 B CN109888449 B CN 109888449B
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Abstract
The invention relates to the field of tile type active phased array antennas, in particular to a tile type TR module for vertical transmission of radio frequency signals, which comprises a shell, an upper chamber and a lower chamber are arranged in the shell, a radio frequency link and a radio frequency input connector are arranged in the upper chamber, the switching micro-strip is arranged in the lower cavity and is respectively connected with the radio frequency link and the radio frequency input connector in a signal transmission way, so that the transmission of radio frequency signals is carried out on the same part, the devices are closely arranged, the integration level is higher, the structural form and the space are compact, the stability and the reliability of signal transmission are ensured, the shell has simple structure and is beneficial to improving the production efficiency of the module, and the radio frequency signal is input into the radio frequency link after two times of vertical transition, so that the vertical input of the radio frequency signal is realized, the loss of the signal is reduced, and the stability and the reliability of signal transmission are further ensured.
Description
Technical Field
The invention relates to the field of tile type active phased array antennas, in particular to a tile type TR module for vertical transmission of radio frequency signals.
Background
The TR module is the core component among the active phased array radar, is located between antenna and the signal synthesis/decomposition network, and the main function is enlargies, moves looks and attenuates microwave signal according to external control signal, and in the radar system, each antenna element all has a TR module to correspond with it, has several thousands or even tens of thousands of TR modules in a radar, and the design of TR module is not only very important to the cost, weight and the volume that reduce the module, and is vital to the sensitivity of whole radar, reliability moreover.
The existing active phased array antenna TR module mainly comprises a longitudinal integrated transverse assembly structure based on a brick-type linear subarray and a transverse integrated longitudinal assembly structure based on a tile-type surface subarray, wherein the tile-type subarray adopts a layered structure, chips and circuits with the same functions of a plurality of channels are integrated on a plurality of tiles which are placed in parallel, then vertical interconnection is carried out, the longitudinal height, the weight and the cost of the subarray module and a whole machine are greatly reduced by utilizing a high-density assembly technology, however, devices forming a radio frequency input path are generally arranged on different parts, various interconnection modes among layers are complicated, radio frequency signals are transmitted through the devices arranged on different parts, the stability and the reliability of signal transmission are poor, meanwhile, EMI and mutual coupling effect are required to be well processed in design, and the thermal design of the middle layer and the reliability design of the radio frequency signal input are considered, The integral process of the tile type TR module is complex due to the design of air tightness, testability, maintainability and the like, and the production efficiency and the later repair efficiency are lower.
In summary, there is a need for a technical solution to solve the technical problems of complex structure process, poor stability and reliability of signal transmission, and low production efficiency and repair efficiency of the conventional tile-type TR module.
Disclosure of Invention
The invention aims to: the tile type TR module for the vertical transmission of radio frequency signals is provided aiming at the technical problems that the structure process of the existing tile type TR module is complex, the stability and the reliability of signal transmission are poor, and the production efficiency and the repair efficiency are low.
In order to achieve the purpose, the invention adopts the technical scheme that:
the utility model provides a tile formula TR module of radio frequency signal vertical transmission, includes the casing, be provided with cavity and lower cavity in the casing, be provided with radio frequency link and radio frequency input connector in the cavity, be provided with the switching microstrip in the lower cavity, the switching microstrip is connected with radio frequency link and radio frequency input connector signal transmission respectively.
According to the tile type TR module for vertical transmission of radio frequency signals, the devices forming the radio frequency transmission path are arranged in the two cavities arranged up and down in the shell, so that the devices forming the radio frequency transmission path are integrated on the shell, the transmission of the radio frequency signals is carried out on the same part, the devices are closely arranged, the integration level is high, and the stability and the reliability of signal transmission are ensured.
Preferably, the device also comprises a cover plate for closing the upper cavity and a cover plate for closing the lower cavity. Adopt apron and shrouding to seal upper and lower cavity, will constitute the device encapsulation of radio frequency input path in the casing, avoid receiving external environment influence, increased module life and use reliability.
Preferably, the cover plate is connected with the shell through laser welding, and the sealing plate is detachably connected with the shell. Adopt laser welding to realize the airtight of TR module, further guarantee module life and service reliability, simultaneously, be connected shrouding and casing detachable, be favorable to the installation and the change of switching microstrip, improve the production efficiency and the efficiency of reprocessing of TR module.
Preferably, the housing is made of ALSI50 material and the cover is made of ALSI27 material. The shell and the cover plate are made of specific materials, so that the thermal expansion coefficient of a microwave device is matched when the shell and the cover plate are welded, the welding quality between the shell and the cover plate is good, and the hermetic seal of the TR module is ensured.
Preferably, the cover plate is provided with a through hole, a mounting groove for mounting the radio frequency input connector is arranged in the upper chamber corresponding to the through hole, and a notch of the mounting groove is connected with the cover plate by laser welding. The setting up of this structure makes the inside gas tightness of TR module better on the one hand, guarantees signal transmission's stability and reliability, improves module life and service reliability, and on the other hand, because between the notch of apron and mounting groove, be laser welding between apron and the casing, and two laser welding points all are located the same face of TR module, can realize the laser welding shaping of TR module, also is favorable to the later stage of module to reprocess, and then improves the production efficiency and the efficiency of reprocessing of TR module.
Preferably, the radio frequency input connector is connected with the inner wall of the mounting groove by soldering. According to the actual conditions, the radio frequency input connector and the inner wall of the mounting groove are connected in a gold-tin welding or lead-tin welding mode, the radio frequency input connector is conveniently integrated on the shell, and the production efficiency of the TR module is improved.
Preferably, the radio frequency switch further comprises an insulator penetrating through the upper cavity and the lower cavity, one end of the insulator is connected with the radio frequency link, and the other end of the insulator is connected with the switching microstrip in a through hole soldering mode. The insulator is adopted to connect the radio frequency link and the switching microstrip, the structure is simple, the connection of the radio frequency link and the switching microstrip is convenient, and the production efficiency of the TR module is further improved.
Preferably, the switching microstrip and the insulator are respectively connected with the shell by gold-tin welding. The switching microstrip and the insulator are respectively connected with the shell through gold-tin welding, so that the air tightness of the upper cavity is further improved, the stability and reliability of radio frequency signal transmission are ensured, and the integral service life and the use reliability of the TR module are prolonged.
Preferably, the low-frequency input connector penetrates through the cover plate and then is connected with the radio frequency link, and the contact surface of the low-frequency input connector and the cover plate is connected by adopting gold-tin welding. And gold-tin welding is adopted between the low-frequency input connector and the cover plate, so that the air sealing of the radio frequency link part in the shell is further ensured, and the stability and reliability of the signal transmission of the radio frequency link are ensured.
Preferably, the radio frequency input connector is an SMP radio frequency connector, and the low frequency input connector is a glass sintered pin header. The SMP radio frequency connector can easily penetrate through the bottom of the mounting groove through the inner conductor and the thimble in the SMP radio frequency connector, so that the SMP radio frequency connector and the switching microstrip can be soldered in a perforated mode, the mounting is convenient, meanwhile, the glass sintering pin header is used as a low-frequency input connector, the transmission of low-frequency signals in the direction perpendicular to the module array surface is facilitated, and the vertical transmission of the signals is further achieved.
In summary, due to the adoption of the technical scheme, the tile type TR module for vertical transmission of radio frequency signals has the beneficial effects that:
1. the devices forming the radio frequency input path are integrated on the shell, so that the transmission of radio frequency signals is on the same part, the devices are closely arranged, the integration level is high, and the stability and the reliability of signal transmission are ensured;
2. the space layout structure of the upper chamber and the lower chamber is adopted, the structure form is compact in space, the structure is simple, and the production efficiency of the module is improved;
3. the radio frequency signal is input to the radio frequency link after two times of vertical transition, so that the vertical input of the radio frequency signal is realized, the loss of the signal is reduced, and the stability and the reliability of signal transmission are further ensured.
Drawings
Fig. 1 is a schematic structural diagram of a tile TR module for vertical transmission of radio frequency signals according to the present invention;
FIG. 2 is a schematic structural view taken along section A-A in FIG. 1;
FIG. 3 is a partially enlarged schematic view of FIG. 2 at I;
fig. 4 is a schematic diagram of the soldering position of a tile TR module for vertical transmission of radio frequency signals according to the present invention.
Reference numerals
The method comprises the following steps of 1-shell, 11-upper cavity, 12-lower cavity, 13-mounting groove, 2-radio frequency link, 3-radio frequency input connector, 4-switching microstrip, 5-cover plate, 51-through hole, 6-sealing plate, 7-insulator, 8-low frequency input connector, 91-laser welding and 92-gold-tin welding.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Example 1
As shown in fig. 1-4, a tile TR module for vertical transmission of radio frequency signals, includes a housing 1, an upper chamber 11 and a lower chamber 12 are arranged in the shell 1 along the thickness direction of the module, the upper chamber 11 and the lower chamber 12 both penetrate through the surface of the shell 1, and the opening directions are opposite, a radio frequency link 2 and a radio frequency input connector 3 are arranged in the upper cavity 11, the lower cavity 12 is internally provided with a switching microstrip 4, the upper cavity 11 is sealed by a cover plate 5 embedded at the opening of the upper cavity 11, the lower chamber 12 is sealed by a sealing plate 6 embedded at the opening of the lower chamber 12, so that the airtight sealing of the TR module is realized, the switching microstrip 4 is respectively connected with the radio frequency link 2 and the radio frequency input connector 3 by adopting through-hole soldering to realize the signal transmission connection of the radio frequency link 2 and the radio frequency input connector 3, so that the devices forming the radio frequency input path are all integrated in the shell 1.
In the tile type TR module for vertical transmission of radio frequency signals of the embodiment, radio frequency signals sequentially pass through the radio frequency input connector 3 of the upper chamber 11 and the switching microstrip 4 of the lower chamber 12 and then are vertically input into the radio frequency link 2 of the upper chamber 11, so that 180-degree steering input of the radio frequency signals on a module array surface perpendicular to the module array surface is realized, the transmission path is single, the signal loss is reduced, and the radio frequency input connector 3, the switching microstrip 4 and the radio frequency link 2 are all integrated on the same shell 1, so that the stability and the reliability of radio frequency signal transmission are ensured.
Furthermore, due to the adoption of the space layout structure of the upper chamber 11 and the lower chamber 12, the internal structure of the TR module of the structure is simple and compact, the production efficiency of the TR module is favorably improved, meanwhile, the upper chamber and the lower chamber are sealed by the cover plate 5 and the sealing cover 6, the airtight sealing of the TR module is realized, the influence of the external environment on devices forming a radio frequency input path is avoided, and the service life and the service reliability of the TR module are ensured.
Preferably, the shell 1 is made of ALSI50 made of the existing material, the cover plate 5 is made of ALSI27 made of the existing material, and the cover plate 5 and the shell 1 are connected by plane laser welding. The ALSI50 of the prior art has a thermal expansion coefficient of 11.5 ppm/DEG C and a thermal conductivity coefficient140W/(m.k), density 2.5X 103Kg/m3The heat conducting material has the characteristics of good heat conducting property and light weight, the thermal expansion coefficient of the ALSI27 of the existing material is 16.3 ppm/DEG C, the heat conducting coefficient is 170W/(m.k), and the density is 2.6 multiplied by 103Kg/m3The shell 1 and the cover plate 5 are prepared by the two materials and are welded along the matching area of the cover plate 5 and the shell 1 by a laser welding process, the influence of thermal deformation on devices can be reduced in material selection, good air sealing inside the TR module is realized by utilizing the characteristics of narrow laser welding heat affected zone, high joint strength, good air tightness and attractive welding line in the welding process, the integral mass of the manufactured TR module is lighter, the use of the TR module is convenient, and the matching of the two materials is facilitated, the thermal expansion coefficient of the microwave device is matched, the welding quality between the shell 1 and the cover plate 5 is improved, the air tightness of the TR module shell is ensured, the service life and the service reliability of the module are further ensured, and the leakage rate is less than or equal to 1 multiplied by 10 through test.-9 Pa.m3/s。
Preferably, the closing plate 6 is assembled and connected with the shell 1 by using screws. Adopt the mode of screw assembly to realize being connected of shrouding 6 and casing 1 in this embodiment, make through shrouding 6 with switching microstrip 4 encapsulation under in cavity 12, be favorable to switching microstrip 4's installation and change, improved the production efficiency and the efficiency of reprocessing of TR module.
Preferably, a through hole 51 is formed in the cover plate 5, an installation groove 13 for installing the radio frequency input connector 3 is formed in the upper chamber 11 corresponding to the through hole 51, and a notch of the installation groove 13 is connected with the cover plate 5 by laser welding. The mounting groove 13 of the embodiment is protruded from the annular structure at the bottom of the upper chamber 11 toward the top surface and extends into the through hole 51 of the cover plate 5 to form, so that the radio frequency input connector 3 arranged in the mounting groove 13 can be conveniently connected with an external device from the through hole 51 of the cover plate 5, and the adjustment of the connection mode between the radio frequency input connector 3 and the inner wall of the mounting groove 13 is facilitated, thereby ensuring the internal airtightness of the TR module, ensuring the stability and reliability of signal transmission, and improving the service life and the service reliability of the module, meanwhile, because the laser welding is carried out between the cover plate 5 and the notch of the mounting groove 13 and between the cover plate 5 and the shell 1, and the two laser welding positions are both positioned on the same surface of the TR module, one-time laser welding forming of the TR module can be realized, the TR module can be conveniently prepared, when the TR module needs to be repaired, after the material, can open apron 5 and reprocess each device, reprocess the airtight of accomplishing the back through laser welding once more and realize the TR module, improve the production efficiency and the efficiency of reprocessing of TR module.
Preferably, the radio frequency input connector 3 is an SMP radio frequency connector, and the radio frequency input connector 3 and the inner wall of the mounting groove 13 are welded by gold tin welding or lead tin welding. The SMP radio frequency connector of this embodiment is including the inner conductor that connects gradually, hair button and thimble, the top of inner conductor is located mounting groove 13, be used for pegging graft with external connector, the thimble runs through mounting groove 13 bottom and gets into down in cavity 12, adopt perforation tin soldering with switching microstrip 4 and be connected, realize radio frequency signal's perpendicular transmission, can be according to actual conditions, the tin soldering connected mode between 3 outer walls of adjustment radio frequency input connector and the 13 inner walls of mounting groove, make things convenient for the installation of radio frequency input connector 3, improve the production efficiency of TR module, and be favorable to guaranteeing the airtight of TR module.
Example 2
As shown in fig. 1 to 4, the tile TR module for vertical transmission of rf signals of this embodiment has the same structure as that of embodiment 1, except that: the radio frequency switch further comprises an insulator 7 penetrating through the upper cavity 11 and the lower cavity 12, wherein one end of the insulator 7 is connected with the radio frequency link 2, and the other end of the insulator is connected with the switching microstrip 4 through hole soldering.
The tile type TR module for the vertical transmission of the radio frequency signals adopts the insulator 7 to connect the radio frequency link 2 and the switching microstrip 4, the structure is simple, the connection of the radio frequency link 2 and the switching microstrip 4 is convenient, the production efficiency of the TR module is further improved, when the TR module is prepared, the hole-shaped structure is arranged in the shell 1 in advance to communicate the upper cavity 11 and the lower cavity 12, then the insulator 7 is connected with the inner wall of the hole-shaped structure in a gold-tin welding mode, the air sealing of the radio frequency link 2 in the TR module is realized, the air sealing of a radio frequency signal input position is improved, the leakage rate is reduced, the radio frequency signal transmission in the radio frequency link 2 is stable, the use reliability of the TR module is ensured, a customized gold-tin welding ring is preferably adopted as a welding material, the gold-tin welding ring is arranged at a position to be welded.
Preferably, the adapting microstrip 4 is connected with the housing 1 by gold-tin welding. Fixing the switching microstrip 4 in the lower chamber 12 of TR module through welding process, making the switching microstrip 4 integrated to the casing 1, making the integrated level of TR module higher, arrange closely between the device, and guaranteed the gas tightness of radio frequency signal input position, reduced the leakage rate, improved the use reliability of TR module, preferred switching microstrip 4 adopts current Rogers RT/duroid 5880 material to make, and the dielectric constant is 2.2, and substrate thickness is 0.127mm, during the preparation, adopts welding process to fix switching microstrip 4 on casing 1 in advance, again with switching microstrip 4 respectively with radio frequency input connector 3 and insulator 7 tin soldering connection, form the radio frequency signal transmission path from radio frequency input connector 3 to radio frequency link 2, realize radio frequency signal's stable transmission.
Example 3
As shown in fig. 1 to 4, the tile TR module for vertical transmission of rf signals of this embodiment has the same structure as that of embodiment 2, except that: still include low frequency input connector 8, low frequency input connector 8 runs through behind the apron 5 and is connected with radio frequency link 2, low frequency input connector 8 adopts gold tin welded connection with the contact surface of apron 5, low frequency input connector 8 is the glass sintering row needle.
The tile type TR module for vertical transmission of radio frequency signals adopts a glass sintering pin as a low-frequency input connector 8, so that a contact pin of the low-frequency input connector 8 is connected with a radio frequency link 2 along the direction perpendicular to a module array surface, the vertical input of low-frequency signals is realized, the radio frequency input signals and the low-frequency input signals of the TR module with the structure are transmitted in the direction perpendicular to the module array surface, the transmission direction is single, the loss of signals is reduced, and the stability and reliability of signal transmission are ensured.
Further, gold-tin welding is adopted between the low-frequency input connector 8 and the cover plate 5, so that the signal input position of the glass sintering pin header is hermetically sealed, the hermetic sealing of the insulator 7 input position, the hermetic sealing of the laser sealing position of the peripheral edges of the shell 1 and the cover plate 5 and the hermetic sealing of the laser sealing position of the notch edge of the mounting groove 13 and the inner wall of the through hole 51 of the cover plate 5 are matched, the hermetic sealing of the radio frequency link 2 in the TR module is realized, the hermetic sealing of the inner cavity of the TR module is further ensured, the leakage rate is reduced, and the stability and the reliability of signal transmission are ensured.
The above embodiments are only for illustrating the invention and not for limiting the technical solutions described in the invention, and although the present invention has been described in detail by referring to the above embodiments, the present invention is not limited to the above embodiments, and therefore, any modifications or equivalent substitutions may be made to the present invention, and all technical solutions and modifications without departing from the spirit and scope of the invention should be covered by the claims of the present invention.
Claims (10)
1. A tile type TR module for vertical transmission of radio frequency signals is characterized in that: including casing (1), be provided with cavity (11) and lower cavity (12) along the thickness direction of module in casing (1), go up cavity (11) and lower cavity (12) and all run through casing (1) surface, and the opening opposite direction, upward be provided with radio frequency link (2) and radio frequency input connector (3) in cavity (11), be provided with switching microstrip (4) down in cavity (12), switching microstrip (4) are connected with radio frequency link (2) and radio frequency input connector (3) signal transmission respectively, and radio frequency signal passes through radio frequency input connector (3) of last cavity (11) and switching microstrip (4) of lower cavity (12) in radio frequency link (2) of last cavity (11) vertical input again in proper order, realizes that radio frequency signal 180 turns to the input on the face of the perpendicular to module.
2. The tiled TR module of claim 1, wherein: the device also comprises a cover plate (5) used for closing the upper cavity (11) and a closing plate (6) used for closing the lower cavity (12).
3. The tiled TR module of claim 2, wherein: the cover plate (5) is connected with the shell (1) through laser welding, and the seal plate (6) is detachably connected with the shell (1).
4. The tiled TR module of claim 3, wherein: the shell (1) is made of ALSI50 material, and the cover plate (5) is made of ALSI27 material.
5. The tiled TR module of claim 2, wherein: be provided with a through-hole (51) on apron (5), through-hole (51) correspond be provided with mounting groove (13) that are used for installing radio frequency input connector (3) in last cavity (11), the notch and apron (5) of mounting groove (13) adopt laser welding to be connected.
6. The tiled TR module of claim 5, wherein: the radio frequency input connector (3) is connected with the inner wall of the mounting groove (13) by tin soldering.
7. The tiled TR module of any of claims 2-6, wherein: the radio frequency switch is characterized by further comprising an insulator (7) penetrating through the upper cavity (11) and the lower cavity (12), wherein one end of the insulator (7) is connected with the radio frequency link (2), and the other end of the insulator is connected with the switching microstrip (4) through hole soldering.
8. The tiled TR module of claim 7, wherein: the switching microstrip (4) and the insulator (7) are respectively connected with the shell (1) by adopting gold-tin welding.
9. The tiled TR module of claim 8, wherein: the low-frequency input connector (8) penetrates through the cover plate (5) and then is connected with the radio frequency link (2), and the contact surface of the low-frequency input connector (8) and the cover plate (5) is in gold-tin welding connection.
10. The tiled TR module of claim 9, wherein: the radio frequency input connector (3) is an SMP radio frequency connector, and the low frequency input connector (8) is a glass sintering pin header.
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| CN201910163232.1A CN109888449B (en) | 2019-03-05 | 2019-03-05 | Tile type TR module for vertical transmission of radio frequency signals |
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| CN109888449B true CN109888449B (en) | 2021-05-18 |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111541001B (en) * | 2020-07-08 | 2020-09-29 | 成都雷电微力科技股份有限公司 | Integrated tile active phased-array antenna |
| CN112234370B (en) * | 2020-09-29 | 2022-10-28 | 中国航空工业集团公司雷华电子技术研究所 | Ultrathin high-reliability tile assembly framework and assembling method thereof |
| CN113839201B (en) * | 2021-11-29 | 2022-02-11 | 成都雷电微力科技股份有限公司 | Thin type phased array antenna structure |
| CN114389065B (en) * | 2021-12-21 | 2024-01-02 | 贵州航天计量测试技术研究所 | PXI radio frequency module and radio frequency microwave system |
| CN114050423B (en) * | 2022-01-06 | 2022-04-12 | 成都雷电微晶科技有限公司 | Ka frequency band horizontal end-fire antenna framework |
| CN117674879B (en) * | 2024-01-31 | 2024-04-02 | 成都华兴大地科技有限公司 | Brick type TR module |
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| CN109245793B (en) * | 2018-09-29 | 2023-05-09 | 中国电子科技集团公司第五十四研究所 | Multichannel tile type phased array transceiver array and manufacturing method thereof |
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