CN103579729A - Satellite-borne low insertion loss vertical conversion circuit from high frequency micro band to waveguide broad band - Google Patents
Satellite-borne low insertion loss vertical conversion circuit from high frequency micro band to waveguide broad band Download PDFInfo
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Abstract
The invention discloses a satellite-borne low insertion loss vertical conversion circuit from a high frequency micro band to a waveguide broad band, and belongs to the transitional conversion technology of microwave millimeter waves among waveguide micro bands. The conversion circuit comprises a micro band line, an open circuit matching branch end socket, an interconnected gold band between the micro band and a coaxial line end socket, a coaxial glass body insulator with flat end socket and sintered in a cavity and a step type probe welded on the end socket of the insulator, wherein the micro band line, the open circuit matching branch end socket, the interconnected gold band, the coaxial glass body insulator and the step type probe are connected in sequence. According to the satellite-borne low insertion loss vertical conversion circuit from the high frequency micro band to the waveguide broad band, the mode transitional conversion of the electromagnetic field between the dominant mode of a rectangular waveguide and the dominant mode of the micro band line is achieved, the transmission of electromagnetic signals between the rectangular waveguide and the micro band line is completed, and the satellite-borne low insertion loss vertical conversion circuit from the high frequency micro band to the waveguide broad band has the advantages of being ingenious in design, compact in structure, capable of being sealed, low in insertion loss, wide in frequency band and good in standing wave characteristics, and transitional conversion directions can be designed to be homodromous.
Description
Technical field
The present invention relates to a kind of micro-vertical transition circuit that takes rectangular waveguide to, band is transformed into a circuit for rectangular waveguide through vertical coaxial configuration specifically, is mainly used in the field that HF receiver, transmitter, antenna etc. relate to the conversion of signal transmission form.
Background technology
Micro-conversion of taking waveguide to is a kind of conventional microwave circuit transformational structure, has developed polytype.From type of architecture, comprise micro-direct transition of taking waveguide to, micro-band is through being coaxially transformed into the transition of waveguide again; From transmission direction, comprise that micro-band is vertical with waveguide direction, micro-band two kind forms parallel with waveguide direction; From sealing direction, comprise and can realize complete airtight transition, and transition that can not be airtight, but micro-conversion of taking waveguide to of general type is all difficult to take into account air-tightness simultaneously, transmission can same tropism and broadband filter with low insertion loss characteristic.
Summary of the invention
Technology of the present invention is dealt with problems: overcomes the deficiencies in the prior art, provides a kind of spaceborne high-frequency microstrip to waveguide broad-band filter with low insertion loss vertical transition circuit, there is symport, air-tightness, and bandwidth, insertion loss is low, the advantage that reliability is high.
Technical solution of the present invention: a kind of spaceborne high-frequency microstrip, to waveguide broad-band filter with low insertion loss vertical transition circuit, is characterized in that comprising: microstrip line (1), open circuit coupling minor matters (2), interconnected gold ribbon (3), coaxial glass insulator (4), silver coated aluminum matter notch cuttype probe (5), dielectric substrate (6), cylindrical cavity (7), wave-guide cavity wave (8) and micro-attached cavity (9), wherein microstrip line (1) mates minor matters (2) both is all positioned on dielectric substrate (6) with open circuit, and interconnect, dielectric substrate (6) is adhered on micro-attached cavity (9) inner surface, coaxial glass insulator (4) is sintered in micro-attached cavity (9), glass insulator (4) lead-in wire upper end and lower end all expose outside cavity, must guarantee between insulator (4) upper end and medium substrate (6) gapped, insulator (4) upper end mates minor matters (2) by interconnected gold ribbon (3) crimping with open circuit, silver coated aluminum matter notch cuttype probe (5) is welded on glass insulator (4) lower end, and insulator (4) must leave gap between lower surface, probe (5) is centered close to half position on wave-guide cavity wave (8) the narrow limit of rectangular waveguide, as a/2 in Fig. 2 indicates, cylindrical cavity (7) is opened on wave-guide cavity wave (8), in order to stretch into silver coated aluminum matter probe (5), cavity (7) centre-to-centre spacing guide floor is certain value, as e in Fig. 2 indicates, this size is about 1/4 of corresponding transmitted signal wavelengths.
Height after described dielectric substrate (6) is bonding should be consistent with the height of glass insulator (4) upper end, in order to guarantee that (3) two crimping points of interconnected gold ribbon (glass insulator (4) upper end mates minor matters (2) with open circuit) are on sustained height, the length that realizes crimping interconnection gold ribbon (3) is the shortest, reduce the discontinuity of electromagnetic field transmission, interconnected gold ribbon should be arch, can improve interconnected antivibration reliability.
Microstrip line (1) mates minor matters termination (2) with open circuit and is all positioned on same dielectric substrate, and open circuit coupling minor matters (2) are mainly used for comprehensively falling the inductance characteristic that interconnected gold ribbon (3) is introduced, thereby realizes coaxial to the impedance matching between micro-band.
The minimum distance of dielectric substrate (6) and glass insulator (4) upper end should be controlled 0.1mm, as d in Fig. 2 marks, can guarantee that interconnected gold ribbon (3) crimping span is little, and path is short, insulator (4) upper end not with the ground short circuit of dielectric substrate (6) bottom surface.
Glass insulator (4) adopts scolder sintering in micro-attached cavity, can realize the gas barrier between micro-attached cavity (9) and wave-guide cavity wave (8).Glass insulator (4) lower end is in wave-guide cavity wave (8) cylindrical hole (7), and cylindrical hole (7) aperture is greater than the diameter of probe (5), guarantees in the complete deep enough wave-guide cavity wave of probe energy of welding.Between cylindrical hole (7) and probe (5), formed equivalent electric capacity, participated in coupling, adjust its size and can further widen utilized bandwidth, cylindrical hole (7) is the wavelength that λ/4(λ is corresponding frequency transmission signal apart from the distance of wave-guide cavity wave (8) rectangular waveguide bottom surface), as e in Fig. 2 indicates.
The silver-plated probe of aluminium matter (5) is stairstepping, realize waveguide to the stepped change of impedance between coaxial, with respect to straight barrel type probe, can expand utilized bandwidth, after welding, probe (5) upper surface should be 0.1mm apart from glass insulator (4) lower surface, as h in Fig. 2 indicates, prevents on the one hand probe decentralization, vibration radius is excessive, and nearer distance also can reduce the discontinuity that introduce termination on the other hand.Welding hole A and through hole B as shown in Figure 2 contained in probe (5) inside, strengthens silver-plated quality and the soldering reliability of probe.
Coaxial interconnected owing to having adopted, in coaxial, the TEM pattern of transmission has determined that the transmission direction of micro-attached cavity and wave-guide cavity wave can arrange arbitrarily, the design adopts design in the same way, for microwave current modular product main flow thinking, specifically as shown in Figure 1, signal is along microstrip line (1) transmission direction, consistent with the transmission direction of the rectangular waveguide of signal in wave-guide cavity wave (8).
The principle that realizes of the present invention:
Realize target of the present invention is from microstrip line converting transmission to waveguide by signal.Specific implementation principle is, as shown in Figure 1, first by microstrip line (1), mate minor matters (2) and interconnected crimping gold ribbon (3) with open circuit by the coaxial insulator of signal leading (4), by coaxial glass insulator (4), import to the notch cuttype probe (5) that is welded on lower end, this probe (5) is placed in the strength, magnetic field of the main mould TE10 of wave-guide cavity wave (8) rectangular waveguide mould, be generally half of Narrow Wall of Waveguide limit, as a/2 in Fig. 2 indicates, apart from guide floor, be the wavelength of the corresponding transmission frequency of λ/4(), as e in Fig. 2 indicates, now reflection coefficient is about 1, be that signal goes back to probe (5) end face position through guide floor total reflection, reflected wave and incident wave at probe place with superimposed, energy to conversion place transmission is strengthened, so can guarantee that signal coupling as much as possible enters wave-guide cavity wave, thereby obtain lower insertion loss and good standing wave.Open circuit coupling minor matters are in transmission, mainly to curb the transmission discontinuity that interconnected gold ribbon (3) is introduced, what guarantee that signal can be complete imports to coaxial insulator (4) from microstrip line (1), the Space Coupling of notch cuttype probe and rectangular waveguide cavity, complete coaxial 50 Ω impedances to the Broadband Matching of rectangular waveguide wave impedance, realized broadband converting transmission.
The present invention's advantage is compared with prior art:
(1) compared with micro-conversion of taking waveguide to, and the vertical transition transmission direction of the conversion of micro-band-horizontal coaxial-waveguide, micro-conversion of taking waveguide to that the present invention adopts vertical coaxial configuration to realize, can realize symport, can be compacter in whole star layout.
(2) compared with the patent No.: CN101752631A, the rectangular waveguide of < < based on magnetic coupling principle and the described change-over circuit of patent of microstrip transition change-over circuit > >, this design can realize symport, can realize good air-tightness again, for the spaceborne product that adopts bare chip to build, more reliable.
(3) adopt the interconnected soft lap joint process of gold ribbon, compare with the change-over circuit that existing employing soldering is built, resistance to shock is higher, is more suitable for spaceborne use.
(4) adopt notch cuttype probe and open circuit coupling minor matters, expanded utilized bandwidth, reduced insertion loss, and probe includes welding hole and through hole (deriving the bubble that welding produces), as A in Fig. 2 and B indicate, can improve silver-plated quality and welding quality, further improve the reliability of product.
In a word, the present invention adopts vertical coaxial configuration to realize micro-transition and conversion of taking rectangular waveguide to, possesses symport, air-tightness, bandwidth, and insertion loss is low, the feature that reliability is high.
Accompanying drawing explanation
Fig. 1 is circuit diagram of the present invention;
Fig. 2 is circuit partial, detailed view of the present invention;
Fig. 3 is wave-guide cavity wave perspective view in one embodiment of the invention;
Fig. 4 is the schematic diagram of the dielectric substrate that contains a pair of back-to-back transition and conversion circuit in one embodiment of the invention;
Fig. 5 is the vertical view after one embodiment of the invention medium substrate and the assembling of micro-attached cavity;
Fig. 6 is micro-attached cavity and wave-guide cavity wave assembling trailing flank schematic diagram in one embodiment of the invention;
Fig. 7 is micro-attached cavity and the rear front schematic view of wave-guide cavity wave assembling in one embodiment of the invention;
Fig. 8 is at the S21 of Ka frequency range simulation result figure in one embodiment of the invention;
Fig. 9 is at the S11 of Ka frequency range simulation result figure in one embodiment of the invention;
Figure 10 be in one embodiment of the invention sample at the S21 of Ka frequency range measured result figure;
Figure 11 be in one embodiment of the invention sample at the S11 of Ka frequency range measured result schematic diagram;
Embodiment
As shown in Figure 1, a kind of spaceborne high-frequency microstrip to waveguide broad-band filter with low insertion loss vertical transition circuit comprises: microstrip line 1, open circuit coupling minor matters 2, interconnected gold ribbon 3, coaxial glass insulator 4, silver coated aluminum matter notch cuttype probe 5, dielectric substrate 6, cylindrical cavity 7, wave-guide cavity wave 8 and micro-attached cavity 9; Wherein microstrip line 1 mates minor matters 2 with open circuit both is all positioned on dielectric substrate 6, and interconnect, dielectric substrate 6 is adhered on micro-attached cavity 9 inner surfaces, coaxial glass insulator 4 is sintered in micro-attached cavity 9, coaxial insulator 4 lead-in wire upper ends and lower end all expose outside cavity, by interconnected gold ribbon 3, insulator 4 upper ends are mated to minor matters 2 crimping with open circuit, 5 of silver coated aluminum matter notch cuttype probes are welded on insulator 4 lower ends, cylindrical cavity 7 is opened on wave-guide cavity wave 8, in order to stretch into silver coated aluminum matter probe 5.
Height after described dielectric substrate 6 is bonding should be consistent with the height of glass insulator 4 upper ends, specifically as shown in Figure 1, can guarantee that like this 3 two crimping point glass insulator 4 upper ends of interconnected gold ribbon mate minor matters 2 with open circuit and are on sustained height, thereby can realize the shortest crimping length.
Described interconnected gold ribbon 3 crimping shapes should be camber line, specifically as shown in Figure 2, sagitta should be controlled between 0.05～0.1mm, span between 2 crimping points should guarantee in 0.3mm, guarantee approximately 0.4～0.5mm of shorter crimping length, interconnected gold ribbon 3 is divided into rectangle and fan-shaped two kinds, specifically as C in Fig. 2 and D indicate.
Described dielectric substrate 6 should be controlled 0.1mm with the minimum distance of glass insulator 4 terminations, specifically as d in Fig. 2 indicates, can either guarantee that 3 liang of crimping point spans of interconnected gold ribbon are in 0.3mm, reduce the transmission discontinuity that long interconnected gold ribbon 3 is introduced, can guarantee again insulator 4 upper ends not with the short circuit in large area at dielectric substrate 6 back sides, cause mismatch.
The diameter of described cylindrical cavity 7 should be greater than the diameter of probe 5, assurance is welded on the probe 5 of the termination of insulator, in the deep enough wave-guide cavity wave 8 of energy, the distance of the centre-to-centre spacing rectangular waveguide bottom surface of cylindrical cavity 7 is the wavelength of the corresponding transmission frequency in λ/4, as e in Fig. 2 indicates.
Institute's weld probe 5 is 0.1mm apart from insulator 4 lower surface distances, as h in Fig. 2 indicates, guarantee close as much as possible insulator 4 lower surfaces, probe 5 upper surfaces, reduce electrical transmission discontinuity, prevent probe 5 and micro-attached cavity 9 end face short circuits simultaneously, cause mismatch, probe 5 is centered close to half the position on the wave-guide cavity wave 8 narrow limits of rectangular waveguide, as a/2 in Fig. 2 indicates.
Described probe 5 is stairstepping, includes wire bonds hole, termination, and through hole, as A in Fig. 2 and B indicate, guarantee that probe 5 is in silver-plated, silver layer can circulate hole inwall, and bubble can effectively be got rid of in welding, thereby improve welding quality.
Described micro-attached cavity 9 is design in the same way with the transmission direction of wave-guide cavity wave 8, and as shown in Figure 1, the transmission direction of signal on microstrip line 1 is with consistent in the transmission direction of cavity cavity 8 rectangular waveguides.
The course of work of the present invention: the present invention is therefore that passive circuit is regardless of two kinds of mode of operations of Static and dynamic, its signal transmission path is, first signal starts transmission from micro-attached cavity 9, through the microstrip line 1 being positioned on dielectric substrate 6, mate after minor matters 2 with open circuit, by interconnected gold ribbon 3, signal is imported to the upper end of coaxial glass insulator 4, through insulator 4, with shaft portion, be transferred on the silver-plated notch cuttype aluminium matter probe 5 stretching in cylindrical hole 7, by probe 5, be coupled in wave-guide cavity wave 8 again, finally by waveguide mouth, export.
In signal converting transmission process, open circuit coupling minor matters 2 are comprehensively fallen the discontinuity that interconnected gold ribbon 3 is introduced, realize the continuous transmission of 50 Ω between microstrip line 1 and insulator 4 coaxial lines, the coupling of notch cuttype probe 5 and waveguide cavity 8 rectangular waveguides, realize the step conversion of insulator 4 coaxial line 50 Ω to wave impedance, thereby guaranteed the coupling transmission of microwave signal.
As shown in Figure 1, this transformational structure is containing bonding micro-attached cavity 9 of dielectric substrate 6, be positioned on dielectric substrate the microstrip line 1 on 6, open circuit coupling minor matters termination 2, micro-interconnected gold ribbon 3 taking between coaxial line termination, the coaxial glass body insulator 4 of sintering in structural member, and pass the cylindrical hole 7 on wave-guide cavity wave 8, and be welded on the silver-plated probe 5 of notch cuttype aluminium matter of insulator 4 lower ends.
Embodiment
For convenient test, first by the same dielectric substrate 6 of being arranged at of two identical change-over circuit symmetries of the present invention, and the microstrip line in two change-over circuits 1 is connected, two change-over circuits are communicated with as shown in Figure 4, then the micro-attached cavity of two insulators of having prepared sintering, and the wave-guide cavity wave that includes two cylinder cavities (for probe deeply) and two rectangular waveguides (cavity all surface is silver-plated) as shown in Figure 3, by the medium substrate shown in Fig. 4 with conductive adhesive to micro-attached cavity, guarantee that substrate is 0.1mm apart from the distance of two insulator terminations, substrate setting height(from bottom) is concordant with insulator port, with gold ribbon will open a way coupling minor matters and insulator termination interconnected, gold ribbon interconnection paths is got the shortest, sagitta between 0.05mm between 0.1mm, span is in 0.3mm.Lower end, insulator termination welding notch cuttype probe, guarantees that probe end face and insulator end face remain on the distance of 0.1mm.After welding, micro-attached cavity is assembled in wave-guide cavity wave, with screw, two cavitys are fastening, as shown in Figures 6 and 7, be externally two Waveguide interfaces, be easy to test.
According to above-mentioned theory, first carry out on computers simulation optimization design below, then, according to optimal design processing sample, finally sample is tested.
The software application HFSS14 Microwave simulation software of simulation calculation, medium substrate adopts A493 potsherd, dielectric constant 9.9, thickness 0.38mm, gold plating thickness 2～3um, micro belt line width adopts standard 50 Ω live widths, 0.38mm, and open circuit minor matters are positioned at microstrip line port, width >=0.38mm, gold ribbon sagitta is made as between 0.05～0.1mm, and between span 0.25～0.3mm, rectangular waveguide adopts BJ260 size.
In 18～34GHz frequency range, above-mentioned example has been carried out to analog simulation, analog simulation result is as Fig. 8, shown in Fig. 9, be better than-20dB of 22GHz～31GHz return loss, insertion loss is better than 0.1dB, according to the corresponding design size of this optimum results, processed corresponding exemplar, adopt AgilentE8363C to test exemplar, test result as shown in figure 10, can see that test result and simulation result are basic identical, insertion loss 1.1dB, deduction test waves is with the loss of conversion 0.6dB, monolateral change-over circuit insertion loss is better than 0.3dB, as shown in figure 11, be better than at 21.5～28GHz-15dB of return loss.Prove that thus the present invention is not only feasible, and implementation result has has met or exceeded prior art.Therefore the present invention is not only a kind of brand-new selection in the engineering design of transition and conversion between microwave and millimeter wave frequency range rectangular waveguide and microstrip line, and compact conformation, and dependable performance can symport, can be airtight, to be with widely, and Insertion Loss is low, has very high value.
Claims (9)
1. spaceborne high-frequency microstrip, to a waveguide broad-band filter with low insertion loss vertical transition circuit, is characterized in that comprising: microstrip line (1), open circuit coupling minor matters (2), interconnected gold ribbon (3), coaxial glass insulator (4), silver coated aluminum matter notch cuttype probe (5), dielectric substrate (6), cylindrical cavity (7), wave-guide cavity wave (8) and micro-attached cavity (9), wherein microstrip line (1) mates minor matters (2) both is all positioned on dielectric substrate (6) with open circuit, and interconnect, dielectric substrate (6) is adhered on micro-attached cavity (9) inner surface, coaxial glass insulator (4) is sintered in micro-attached cavity (9), glass insulator (4) lead-in wire upper end and lower end all expose outside cavity, must guarantee between insulator (4) upper end and medium substrate (6) gapped, insulator (4) upper end mates minor matters (2) by interconnected gold ribbon (3) crimping with open circuit, silver coated aluminum matter notch cuttype probe (5) is welded on glass insulator (4) lower end, and insulator (4) must leave gap between lower surface, probe (5) is centered close to half position on wave-guide cavity wave (8) the narrow limit of rectangular waveguide, cylindrical cavity (7) is opened on wave-guide cavity wave (8), in order to stretch into silver coated aluminum matter probe (5).
2. spaceborne high-frequency microstrip according to claim 1 is to waveguide broad-band filter with low insertion loss vertical transition circuit, it is characterized in that: the height after described dielectric substrate (6) is bonding should be consistent with the height of glass insulator (4) upper end, in order to guarantee that (3) two crimping points of interconnected gold ribbon are on sustained height, these two crimping points are that glass insulator (4) upper end mates minor matters (2) with open circuit, and the length that realizes crimping interconnection gold ribbon (3) is the shortest.
3. spaceborne high-frequency microstrip according to claim 1, to waveguide broad-band filter with low insertion loss vertical transition circuit, is characterized in that: described interconnected gold ribbon (3) crimping shape should be camber line, and it is short that the control of sagitta and span should meet path, antivibration.
4. spaceborne high-frequency microstrip according to claim 1 is to waveguide broad-band filter with low insertion loss vertical transition circuit, it is characterized in that: described dielectric substrate (6) should be controlled 0.1mm with the minimum distance of glass insulator (4) termination, guarantee that interconnected gold ribbon (3) path is short, insulator (4) termination not with the short circuit in large area at dielectric substrate (6) back side.
5. spaceborne high-frequency microstrip according to claim 1 is to waveguide broad-band filter with low insertion loss vertical transition circuit, it is characterized in that: the diameter of described cylindrical cavity (7) should be greater than the diameter of probe (5), assurance is welded on the probe (5) of the termination of insulator, in the deep enough wave-guide cavity wave of energy (8), cylindrical cavity (7) centre-to-centre spacing guide floor is λ/4, the wavelength that λ is corresponding frequency transmission signal.
6. spaceborne high-frequency microstrip according to claim 1 is to waveguide broad-band filter with low insertion loss vertical transition circuit, it is characterized in that, institute's weld probe (5) is 0.1mm apart from insulator (4) distance, guarantee close as much as possible insulator (4) end face of probe (5), reduce electrical transmission discontinuity, prevent probe (5) and micro-attached cavity (9) end face short circuit simultaneously.
7. spaceborne high-frequency microstrip, to waveguide broad-band filter with low insertion loss vertical transition circuit, is characterized in that according to claim 1: described probe (5) is stairstepping, includes wire bonds hole, termination A, and through hole B, guarantees the silver-plated and welding quality of probe (5).
According to claim 1 spaceborne high-frequency microstrip to waveguide broad-band filter with low insertion loss vertical transition circuit, it is characterized in that: described micro-attached cavity (9) is design in the same way with the transmission direction of wave-guide cavity wave (8), signal is along microstrip line (1) transmission direction, consistent with the transmission direction of the rectangular waveguide of signal in wave-guide cavity wave (8).
9. spaceborne high-frequency microstrip, to waveguide broad-band filter with low insertion loss vertical transition circuit, is characterized in that according to claim 1: described interconnected gold ribbon (3) is rectangle and fan-shaped two kinds.
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