CN203225704U - W wave band upper frequency conversion module - Google Patents
W wave band upper frequency conversion module Download PDFInfo
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- CN203225704U CN203225704U CN 201320276629 CN201320276629U CN203225704U CN 203225704 U CN203225704 U CN 203225704U CN 201320276629 CN201320276629 CN 201320276629 CN 201320276629 U CN201320276629 U CN 201320276629U CN 203225704 U CN203225704 U CN 203225704U
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- wave band
- conversion module
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- power supply
- circuit board
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Abstract
The utility model relates to the technical field of communication and radar, in particular to a W wave band upper frequency conversion module, which comprises an upper layer cavity and a lower layer cavity, wherein a power supply printed circuit board and insulators are arranged in the upper layer cavity, a radio frequency link is arranged on the top portion of the lower layer cavity, and a power supply printed circuit board is vertically connected with the radio frequency link through the insulators. Various elements in the W wave band upper frequency conversion module are arranged by adopting a three-dimensional structure, and elements in the radio frequency link and the power supply printed circuit board are vertically connected with each other through the insulator, thereby enhancing isolation of a power supply and the elements, increasing electromagnetic compatibility of the W wave band upper frequency conversion module, and guaranteeing stability and reliability of the W wave band transceiver component. Different cavity layers are provided with different electron components, and are vertically connected through the insulator, and the elements in different cavity layers are arranged by adopting a plane mixing integrated mode, thereby achieving miniaturization and integration of the W wave band frequency multiplication module.
Description
Technical field
The utility model relates to communication and Radar Technology field, particularly a kind of W wave band up-conversion module for W wave band transmitting-receiving subassembly.
Background technology
According to frequency partition, millimeter wave generally refers to wavelength between the electromagnetic wave of 1mm～10mm, millimeter wave is compared its all band has wavelength short, it is strong to penetrate ionospheric ability, have than the infrared and stronger boisterous abilities such as flue dust, cloud and mist that penetrate of visible light, the energy all weather operations, and because relative bandwidth is wideer, can realize point-to-point high capacity communication and high-resolution imaging.Wherein the W wave band is the important window frequency in the millimeter wave, and the transmit-receive technology research of this wave band is the heat subject in the present Millimeter Wave Applications.The W wave band is because frequency is higher, and wavelength is shorter, and under the antenna of same bore, the wavelength weak point can be realized narrow beam, low secondary lobe, and high precision and good resolving power so just can be arranged.Fields such as the system of W wave band can be applied to a lot of occasions such as high ferro is crashproof, precise guidance, blind landing.External a lot of national all in the development work of carrying out W wave band equipment at present, and obtained very big progress, the millimeter wave equipment of the U.S. develops to higher frequency at W wave band practicability; So and that the restriction this respect work of domestic because process conditions and device is carried out is relative later, so lagged behind developed country on technical merit.
Important composition in the W band system is W wave band transmitting-receiving subassembly partly, generally comprise local oscillation power distribution plate, transmitting chain, reception link and local oscillator link, receive link and comprise W wave band receiver module, transmitting chain comprises W wave band up-conversion module, power synthesis module, and the local oscillator link comprises a times frequency module.Wherein W wave band up-conversion module mainly upconverts to W waveband radio frequency signal with the intermediate-freuqncy signal of S-band, can be used for the transmission of radar, communications field signal.As the important composition parts in the W wave band transmitting-receiving subassembly---W wave band up-conversion module, owing to also be difficult to reach at present the requirement of miniaturization, high integration, high reliability, the quality of its performance also directly has influence on the performance of whole W wave band transmitting-receiving subassembly.
The utility model content
The purpose of this utility model is to overcome the above-mentioned deficiency of prior art, provides a kind of in order to the miniaturization of satisfying the user demand of W wave band transmitting-receiving subassembly, the W wave band up-conversion module of high integration.
For achieving the above object, the utility model provides following technical scheme:
A kind of W wave band up-conversion module, comprise upper strata cavity and lower floor's cavity, in the cavity of described upper strata power supply printed circuit board and insulator are installed, the top of lower floor's cavity is equipped with radio frequency link, described power supply printed circuit board is connected by insulator and radio frequency link are vertical, also is respectively arranged with waveguiding structure in described upper strata cavity and the lower floor's cavity.
In the above-mentioned W wave band up-conversion module, described waveguiding structure is used for waveguide to the transition of little band.
In the above-mentioned W wave band up-conversion module, also comprise cover plate, described cover plate, upper strata cavity and lower floor's cavity are upper, middle and lower and distribute, and by the pin location, trip bolt fits together it.Described cover plate is for the protection of the power supply printed circuit board and play the effect of electromagnetic compatibility.
In the above-mentioned W wave band up-conversion module, described radio frequency link comprises W band amplifier, W wave band frequency mixer, intermediate frequency attenuator, and each components and parts adopts the integrated mode of planar hybrid to arrange.
In the above-mentioned W wave band up-conversion module, described power supply printed circuit board comprises pad, the LDO voltage stabilizing circuit of input and output and the pulse modulated circuit of being made up of modulator and metal-oxide-semiconductor.The power supply printed circuit board is used for finishing power supply and the control work of module.
In the above-mentioned W wave band up-conversion module, also be connected with the intermediate frequency micro connector on the socket of described power supply printed circuit board, described intermediate frequency micro connector comprises an intermediate frequency mini jack and an intermediate frequency mini cable assembly, and its connected mode is blind slotting connection.
In the above-mentioned W wave band up-conversion module, described W wave band up-conversion module also comprises local oscillator input interface, intermediate frequency input interface, radio frequency output interface and external power source, control signal input interface.Described external power source, control signal input interface are connected with the power supply printed circuit board by fly line, and described intermediate frequency micro connector is as the intermediate frequency input interface.
Compared with prior art, the beneficial effects of the utility model:W wave band up-conversion module of the present utility model, the intermediate-freuqncy signal of S-band can be upconverted to W waveband radio frequency signal, each components and parts in the module adopt 3-D solid structure to arrange, components and parts in the radio frequency link and power supply printed circuit board are by the insulator perpendicular interconnection, strengthened the isolation of power supply and components and parts, improve the Electro Magnetic Compatibility of module, guaranteed stability and the reliability of W wave band up-conversion module; Different cavity layers are installed different electronic devices and components, carry out perpendicular interconnection by insulator again, each components and parts that is in layer adopt the integrated mode of planar hybrid to arrange, spacing and the size of signal lead in the module, pad, pin etc. are reduced greatly, finally realize the miniaturization of W wave band up-conversion module and integrated.
Description of drawings
Fig. 1 is overall structure schematic diagram of the present utility model.
Fig. 2 is fractionation structural representation of the present utility model.
Fig. 3 is circuit theory diagrams of the present utility model.
Fig. 4 is the schematic block circuit diagram of power supply printed circuit board among Fig. 2.
Mark among the figure: 301-cover plate, 302-upper strata cavity, 303-lower floor cavity, 304-power supply printed circuit board, 305-insulator, 306-intermediate frequency micro connector.
3001-the one W band amplifier, 3002-the 2nd W band amplifier, 3003-intermediate frequency attenuator, 3004-W wave band frequency mixer, 3005-the 3rd W band amplifier, 3006-the 4th W band amplifier device.
3041-the one LDO voltage stabilizing chip, 3042-the 2nd LDO voltage stabilizing chip, the 3043-MOS switch, 3044-MOS drives chip.
Embodiment
Below in conjunction with the drawings and specific embodiments the utility model is further described.
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explaining the utility model, and be not used in restriction the utility model.
Embodiment 1
Shown in accompanying drawing 1, accompanying drawing 2, the W wave band up-conversion module of present embodiment comprises cover plate 301, upper strata cavity 302, lower floor's cavity 303, power supply printed circuit board 304 and insulator 305 are installed in the described upper strata cavity 302, the top of lower floor's cavity 303 is equipped with radio frequency link, described power supply printed circuit board 304 is connected by insulator 305 and radio frequency link are vertical, also is respectively arranged with waveguiding structure (first waveguiding structure and second waveguiding structure are set respectively in upper cavity and the lower chamber) in described upper strata cavity 302 and the lower floor's cavity 303.Also be connected with intermediate frequency micro connector 306 on the socket of described power supply printed circuit board 304.As shown in Figure 3, described radio frequency link comprises a W band amplifier 3001 and the 2nd W band amplifier 3002, W wave band frequency mixer 3004, the 3rd W band amplifier 3005 and the 4th W band amplifier device 3006, intermediate frequency attenuator 3003, and each components and parts adopts the integrated mode of planar hybrid to arrange.Each components and parts in the module adopt 3-D solid structure to arrange, components and parts in the radio frequency link and power supply printed circuit board are by the insulator perpendicular interconnection, strengthened the isolation of power supply and components and parts, improve the Electro Magnetic Compatibility of up-conversion module, guaranteed stability and the reliability of W wave band up-conversion module; Different cavity layers are installed different electronic devices and components, carry out perpendicular interconnection by insulator again, each components and parts that is in layer adopt the integrated mode of planar hybrid to arrange, spacing and the size of signal lead in the module, pad, pin etc. are reduced greatly, finally realize the miniaturization of W wave band up-conversion module and integrated.
W wave band up-conversion module cover plate 301, upper strata cavity 302 and lower floor's cavity 303 are upper, middle and lower and distribute, and by the pin location, trip bolt fits together it.Described power supply printed circuit board 304 comprises pad, the LDO voltage stabilizing circuit of input and output and the pulse modulated circuit of being made up of modulator and metal-oxide-semiconductor.Described W wave band up-conversion module also comprises local oscillator input interface, intermediate frequency input interface, radio frequency output interface and external power source, control signal input interface.Described external power source, control signal input interface are connected with power supply printed circuit board 304 by fly line.Described intermediate frequency micro connector is as the intermediate frequency input interface, and intermediate frequency micro connector 306 comprises an intermediate frequency mini jack and an intermediate frequency mini cable assembly, and its connected mode is blind slotting connection.
W wave band up-conversion module with the operation principle that the intermediate-freuqncy signal of S-band upconverts to W waveband radio frequency signal is: as shown in Figure 3, local oscillation signal after times frequency module frequency multiplication enters from the local oscillator input interface and imports a W band amplifier 3001 and 3002 amplifications of the 2nd W band amplifier after first waveguiding structure carries out waveguide-little band conversion successively, carry out up-conversion with the intermediate-freuqncy signal that enters from the intermediate frequency input interface by frequency mixer 3004 again, the radiofrequency signal after the up-conversion is exported by radio frequency output interface behind the 3rd W band amplifier 3005 and the 4th W band amplifier device 3006.Intermediate frequency attenuator 3003 is used for the control transmitted power level.Second waveguiding structure carries out little band-waveguide conversion to the radio frequency output signal.
The power supply of W wave band up-conversion module and control operation principle are: as shown in Figure 4, power supply printed circuit board 304 comprises pad, two LDO voltage stabilizing chips (a LDO voltage stabilizing chip 3041, the 2nd LDO voltage stabilizing chip 3042), pulse modulated circuit of being made up of modulator and metal-oxide-semiconductor of a plurality of input and output.The negative voltage of power supply printed circuit board 304 via arriving o pads after a LDO voltage stabilizing chip 3041 voltage stabilizings, is connected to insulator 305 through fly line by the input pad of outside fly line to printed circuit board again, powers to radio frequency link; Positive voltage is by the input pad of outside fly line to printed circuit board 304, via arriving MOS switch 3043 after 3042 voltage stabilizings of the 2nd LDO voltage stabilizing chip, to the printed circuit board o pads, be connected to insulator 305 through fly line by MOS switch 3043 control backs again, provide voltage to radio frequency link; Control level, is driven chip 3044 via MOS again and forms the break-make that control signal is controlled MOS switch 3043, to realize pulse working mode to printed circuit board 304 input pads by outside fly line.
The above only is preferred embodiment of the present utility model; not in order to limit the utility model; all any modifications of within spirit of the present utility model and principle, doing, be equal to and replace and improvement etc., all should be included within the protection range of the present utility model.
Claims (5)
1. W wave band up-conversion module, it is characterized in that: comprise upper strata cavity and lower floor's cavity, in the cavity of described upper strata power supply printed circuit board and insulator are installed, the top of lower floor's cavity is equipped with radio frequency link, described power supply printed circuit board is connected by insulator and radio frequency link are vertical, also is respectively arranged with waveguiding structure in described upper strata cavity and the lower floor's cavity.
2. W wave band up-conversion module according to claim 1, it is characterized in that: described W wave band up-conversion module also comprises cover plate, described cover plate, upper strata cavity and lower floor's cavity are upper, middle and lower and distribute, and by the pin location, trip bolt fits together it.
3. W wave band up-conversion module according to claim 1, it is characterized in that: described radio frequency link comprises W band amplifier, W wave band frequency mixer, intermediate frequency attenuator, each components and parts adopts the integrated mode of planar hybrid to arrange.
4. W wave band up-conversion module according to claim 1, it is characterized in that: described power supply printed circuit board comprises pad, the LDO voltage stabilizing circuit of input and output and the pulse modulated circuit of being made up of modulator and metal-oxide-semiconductor.
5. W wave band up-conversion module according to claim 1, it is characterized in that: also be connected with the intermediate frequency micro connector on the socket of described power supply printed circuit board, described intermediate frequency micro connector comprises an intermediate frequency mini jack and an intermediate frequency mini cable assembly, and its connected mode is blind slotting connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320276629 CN203225704U (en) | 2013-05-20 | 2013-05-20 | W wave band upper frequency conversion module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320276629 CN203225704U (en) | 2013-05-20 | 2013-05-20 | W wave band upper frequency conversion module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203225704U true CN203225704U (en) | 2013-10-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320276629 Expired - Fee Related CN203225704U (en) | 2013-05-20 | 2013-05-20 | W wave band upper frequency conversion module |
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| CN (1) | CN203225704U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103296973A (en) * | 2013-05-20 | 2013-09-11 | 成都雷电微力科技有限公司 | W-band up-conversion module |
| CN109888449A (en) * | 2019-03-05 | 2019-06-14 | 成都雷电微力科技有限公司 | A kind of tile type T/R module of radiofrequency signal vertical transfer |
-
2013
- 2013-05-20 CN CN 201320276629 patent/CN203225704U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103296973A (en) * | 2013-05-20 | 2013-09-11 | 成都雷电微力科技有限公司 | W-band up-conversion module |
| CN103296973B (en) * | 2013-05-20 | 2016-06-01 | 成都雷电微力科技有限公司 | W-band up-conversion module |
| CN109888449A (en) * | 2019-03-05 | 2019-06-14 | 成都雷电微力科技有限公司 | A kind of tile type T/R module of radiofrequency signal vertical transfer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131002 Termination date: 20160520 |