CN103296973A - W-band up-conversion module - Google Patents
W-band up-conversion module Download PDFInfo
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- CN103296973A CN103296973A CN201310188257XA CN201310188257A CN103296973A CN 103296973 A CN103296973 A CN 103296973A CN 201310188257X A CN201310188257X A CN 201310188257XA CN 201310188257 A CN201310188257 A CN 201310188257A CN 103296973 A CN103296973 A CN 103296973A
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Abstract
The invention relates to the field of communication and radar technologies, in particular to a W-band up-conversion module which comprises an upper-layer cavity and a lower-layer cavity. A power printed circuit board and insulators are mounted in the upper-layer cavity, a radiofrequency chain is mounted on the top of the lower-layer cavity, and the power printed circuit board is perpendicularly connected with the radiofrequency chain by the insulators. The W-band up-conversion module has the advantages that various components in the W-band up-conversion module are arranged to form three-dimensional structures, the components in the radiofrequency chain are perpendicularly connected with the power printed circuit board by the insulators, so that an isolation effect is improved for a power source and the components, the electromagnetic compatibility of the module is enhanced, and the stability and the reliability of the W-band up-conversion module are guaranteed; different electronic components are mounted on different cavity layers and then are perpendicularly connected with one another by the insulators, and the various components of the same layer are arranged in a planar hybrid integration mode, so that the W-band up-conversion module is minimized and integrated ultimately.
Description
Technical field
The present invention relates to communication and Radar Technology field, particularly a kind of W wave band up-conversion module for W wave band transmitting-receiving subassembly.
Background technology
According to frequency partition, millimeter wave generally refers to wavelength between the electromagnetic wave of 1mm～10mm, millimeter wave is compared its all band has wavelength short, it is strong to penetrate ionospheric ability, have than the infrared and stronger boisterous abilities such as flue dust, cloud and mist that penetrate of visible light, the energy all weather operations, and because relative bandwidth is wideer, can realize point-to-point high capacity communication and high-resolution imaging.Wherein the W wave band is the important window frequency in the millimeter wave, and the transmit-receive technology research of this wave band is the heat subject in the present Millimeter Wave Applications.The W wave band is because frequency is higher, and wavelength is shorter, and under the antenna of same bore, the wavelength weak point can be realized narrow beam, low secondary lobe, and high precision and good resolving power so just can be arranged.Fields such as the system of W wave band can be applied to a lot of occasions such as high ferro is crashproof, precise guidance, blind landing.External a lot of national all in the development work of carrying out W wave band equipment at present, and obtained very big progress, the millimeter wave equipment of the U.S. develops to higher frequency at W wave band practicability; So and that the restriction this respect work of domestic because process conditions and device is carried out is relative later, so lagged behind developed country on technical merit.
Important composition in the W band system is W wave band transmitting-receiving subassembly partly, generally comprise local oscillation power distribution plate, transmitting chain, reception link and local oscillator link, receive link and comprise W wave band receiver module, transmitting chain comprises W wave band up-conversion module, power synthesis module, and the local oscillator link comprises a times frequency module.Wherein W wave band up-conversion module mainly upconverts to W waveband radio frequency signal with the intermediate-freuqncy signal of S-band, can be used for the transmission of radar, communications field signal.As the important composition parts in the W wave band transmitting-receiving subassembly---W wave band up-conversion module, owing to also be difficult to reach at present the requirement of miniaturization, high integration, high reliability, the quality of its performance also directly has influence on the performance of whole W wave band transmitting-receiving subassembly.
Summary of the invention
The objective of the invention is to overcome the above-mentioned deficiency of prior art, provide a kind of in order to the miniaturization of satisfying the user demand of W wave band transmitting-receiving subassembly, the W wave band up-conversion module of high integration.
For achieving the above object, the invention provides following technical scheme:
W wave band up-conversion module, comprise upper strata cavity and lower floor's cavity, in the cavity of described upper strata power supply printed circuit board and insulator are installed, the top of lower floor's cavity is equipped with radio frequency link, described power supply printed circuit board is connected by insulator and radio frequency link are vertical, also is respectively arranged with waveguiding structure in described upper strata cavity and the lower floor's cavity.
In the above-mentioned W wave band up-conversion module, described waveguiding structure is used for waveguide to the transition of little band.
In the above-mentioned W wave band up-conversion module, also comprise cover plate, described cover plate, upper strata cavity and lower floor's cavity are upper, middle and lower and distribute, and by the pin location, trip bolt fits together it.Described cover plate is for the protection of the power supply printed circuit board and play the effect of electromagnetic compatibility.
In the above-mentioned W wave band up-conversion module, described radio frequency link comprises W band amplifier, W wave band frequency mixer, intermediate frequency attenuator, and each components and parts adopts the integrated mode of planar hybrid to arrange.
In the above-mentioned W wave band up-conversion module, described power supply printed circuit board comprises pad, the LDO voltage stabilizing circuit of input and output and the pulse modulated circuit of being made up of modulator and metal-oxide-semiconductor.The power supply printed circuit board is used for finishing power supply and the control work of module.
In the above-mentioned W wave band up-conversion module, also be connected with the intermediate frequency micro connector on the socket of described power supply printed circuit board, described intermediate frequency micro connector comprises an intermediate frequency mini jack and an intermediate frequency mini cable assembly, and its connected mode is blind slotting connection.
In the above-mentioned W wave band up-conversion module, described W wave band up-conversion module also comprises local oscillator input interface, intermediate frequency input interface, radio frequency output interface and external power source, control signal input interface.Described external power source, control signal input interface are connected with the power supply printed circuit board by fly line, and described intermediate frequency micro connector is as the intermediate frequency input interface.
Compared with prior art, beneficial effect of the present invention:W wave band up-conversion module of the present invention, the intermediate-freuqncy signal of S-band can be upconverted to W waveband radio frequency signal, each components and parts in the module adopt 3-D solid structure to arrange, components and parts in the radio frequency link and power supply printed circuit board are by the insulator perpendicular interconnection, strengthened the isolation of power supply and components and parts, improve the Electro Magnetic Compatibility of module, guaranteed stability and the reliability of W wave band up-conversion module; Different cavity layers are installed different electronic devices and components, carry out perpendicular interconnection by insulator again, each components and parts that is in layer adopt the integrated mode of planar hybrid to arrange, spacing and the size of signal lead in the module, pad, pin etc. are reduced greatly, finally realize the miniaturization of W wave band up-conversion module and integrated.
Description of drawings
Fig. 1 is overall structure schematic diagram of the present invention.
Fig. 2 is fractionation structural representation of the present invention.
Fig. 3 is circuit theory diagrams of the present invention.
Fig. 4 is the schematic block circuit diagram of power supply printed circuit board among Fig. 2.
Mark among the figure: 301-cover plate, 302-upper strata cavity, 303-lower floor cavity, 304-power supply printed circuit board, 305-insulator, 306-intermediate frequency micro connector.
3001-the one W band amplifier, 3002-the 2nd W band amplifier, 3003-intermediate frequency attenuator, 3004-W wave band frequency mixer, 3005-the 3rd W band amplifier, 3006-the 4th W band amplifier device.
3041-the one LDO voltage stabilizing chip, 3042-the 2nd LDO voltage stabilizing chip, the 3043-MOS switch, 3044-MOS drives chip.
Embodiment
The present invention is further illustrated below in conjunction with the drawings and specific embodiments.
In order to make purpose of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explaining the present invention, and be not used in restriction the present invention.
Embodiment 1
Shown in accompanying drawing 1, accompanying drawing 2, the W wave band up-conversion module of present embodiment comprises cover plate 301, upper strata cavity 302, lower floor's cavity 303, power supply printed circuit board 304 and insulator 305 are installed in the described upper strata cavity 302, the top of lower floor's cavity 303 is equipped with radio frequency link, described power supply printed circuit board 304 is connected by insulator 305 and radio frequency link are vertical, also is respectively arranged with waveguiding structure (first waveguiding structure and second waveguiding structure are set respectively in upper cavity and the lower chamber) in described upper strata cavity 302 and the lower floor's cavity 303.Also be connected with intermediate frequency micro connector 306 on the socket of described power supply printed circuit board 304.As shown in Figure 3, described radio frequency link comprises a W band amplifier 3001 and the 2nd W band amplifier 3002, W wave band frequency mixer 3004, the 3rd W band amplifier 3005 and the 4th W band amplifier device 3006, intermediate frequency attenuator 3003, and each components and parts adopts the integrated mode of planar hybrid to arrange.Each components and parts in the module adopt 3-D solid structure to arrange, components and parts in the radio frequency link and power supply printed circuit board are by the insulator perpendicular interconnection, strengthened the isolation of power supply and components and parts, improve the Electro Magnetic Compatibility of up-conversion module, guaranteed stability and the reliability of W wave band up-conversion module; Different cavity layers are installed different electronic devices and components, carry out perpendicular interconnection by insulator again, each components and parts that is in layer adopt the integrated mode of planar hybrid to arrange, spacing and the size of signal lead in the module, pad, pin etc. are reduced greatly, finally realize the miniaturization of W wave band up-conversion module and integrated.
W wave band up-conversion module cover plate 301, upper strata cavity 302 and lower floor's cavity 303 are upper, middle and lower and distribute, and by the pin location, trip bolt fits together it.Described power supply printed circuit board 304 comprises pad, the LDO voltage stabilizing circuit of input and output and the pulse modulated circuit of being made up of modulator and metal-oxide-semiconductor.Described W wave band up-conversion module also comprises local oscillator input interface, intermediate frequency input interface, radio frequency output interface and external power source, control signal input interface.Described external power source, control signal input interface are connected with power supply printed circuit board 304 by fly line.Described intermediate frequency micro connector is as the intermediate frequency input interface, and intermediate frequency micro connector 306 comprises an intermediate frequency mini jack and an intermediate frequency mini cable assembly, and its connected mode is blind slotting connection.
W wave band up-conversion module with the operation principle that the intermediate-freuqncy signal of S-band upconverts to W waveband radio frequency signal is: as shown in Figure 3, local oscillation signal after times frequency module frequency multiplication enters from the local oscillator input interface and imports a W band amplifier 3001 and 3002 amplifications of the 2nd W band amplifier after first waveguiding structure carries out waveguide-little band conversion successively, carry out up-conversion with the intermediate-freuqncy signal that enters from the intermediate frequency input interface by frequency mixer 3004 again, the radiofrequency signal after the up-conversion is exported by radio frequency output interface behind the 3rd W band amplifier 3005 and the 4th W band amplifier device 3006.Intermediate frequency attenuator 3003 is used for the control transmitted power level.Second waveguiding structure carries out little band-waveguide conversion to the radio frequency output signal.
The power supply of W wave band up-conversion module and control operation principle are: as shown in Figure 4, power supply printed circuit board 304 comprises pad, two LDO voltage stabilizing chips (a LDO voltage stabilizing chip 3041, the 2nd LDO voltage stabilizing chip 3042), pulse modulated circuit of being made up of modulator and metal-oxide-semiconductor of a plurality of input and output.The negative voltage of power supply printed circuit board 304 via arriving o pads after a LDO voltage stabilizing chip 3041 voltage stabilizings, is connected to insulator 305 through fly line by the input pad of outside fly line to printed circuit board again, powers to radio frequency link; Positive voltage is by the input pad of outside fly line to printed circuit board 304, via arriving MOS switch 3043 after 3042 voltage stabilizings of the 2nd LDO voltage stabilizing chip, to the printed circuit board o pads, be connected to insulator 305 through fly line by MOS switch 3043 control backs again, provide voltage to radio frequency link; Control level, is driven chip 3044 via MOS again and forms the break-make that control signal is controlled MOS switch 3043, to realize pulse working mode to printed circuit board 304 input pads by outside fly line.
The above only is preferred embodiment of the present invention, not in order to limiting the present invention, all any modifications of doing within the spirit and principles in the present invention, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.
Claims (5)
1.W wave band up-conversion module, it is characterized in that: comprise upper strata cavity and lower floor's cavity, in the cavity of described upper strata power supply printed circuit board and insulator are installed, the top of lower floor's cavity is equipped with radio frequency link, described power supply printed circuit board is connected by insulator and radio frequency link are vertical, also is respectively arranged with waveguiding structure in described upper strata cavity and the lower floor's cavity.
2. W wave band up-conversion module according to claim 1, it is characterized in that: described W wave band up-conversion module also comprises cover plate, described cover plate, upper strata cavity and lower floor's cavity are upper, middle and lower and distribute, and by the pin location, trip bolt fits together it.
3. W wave band up-conversion module according to claim 1, it is characterized in that: described radio frequency link comprises W band amplifier, W wave band frequency mixer, intermediate frequency attenuator, each components and parts adopts the integrated mode of planar hybrid to arrange.
4. W wave band up-conversion module according to claim 1, it is characterized in that: described power supply printed circuit board comprises pad, the LDO voltage stabilizing circuit of input and output and the pulse modulated circuit of being made up of modulator and metal-oxide-semiconductor.
5. W wave band up-conversion module according to claim 1, it is characterized in that: also be connected with the intermediate frequency micro connector on the socket of described power supply printed circuit board, described intermediate frequency micro connector comprises an intermediate frequency mini jack and an intermediate frequency mini cable assembly, and its connected mode is blind slotting connection.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310188257.XA CN103296973B (en) | 2013-05-20 | 2013-05-20 | W-band up-conversion module |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310188257.XA CN103296973B (en) | 2013-05-20 | 2013-05-20 | W-band up-conversion module |
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| CN103296973A true CN103296973A (en) | 2013-09-11 |
| CN103296973B CN103296973B (en) | 2016-06-01 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105245270A (en) * | 2015-09-21 | 2016-01-13 | 西安空间无线电技术研究所 | Miniature spaceborne 8mm frequency band transmission channel |
| CN109921159A (en) * | 2019-03-14 | 2019-06-21 | 安徽华东光电技术研究所有限公司 | A kind of upconverter modular structure |
| CN110429953A (en) * | 2019-07-26 | 2019-11-08 | 中国科学院上海微系统与信息技术研究所 | A kind of three frequency range of L-type anti-interference proximity detection device front end and its installation method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202421493U (en) * | 2011-12-15 | 2012-09-05 | 中国电子科技集团公司第三十八研究所 | X band-based bandwidth primary and secondary frequency up/down-conversion module |
| CN203225704U (en) * | 2013-05-20 | 2013-10-02 | 成都雷电微力科技有限公司 | W wave band upper frequency conversion module |
-
2013
- 2013-05-20 CN CN201310188257.XA patent/CN103296973B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202421493U (en) * | 2011-12-15 | 2012-09-05 | 中国电子科技集团公司第三十八研究所 | X band-based bandwidth primary and secondary frequency up/down-conversion module |
| CN203225704U (en) * | 2013-05-20 | 2013-10-02 | 成都雷电微力科技有限公司 | W wave band upper frequency conversion module |
Non-Patent Citations (1)
| Title |
|---|
| 陈坤等: "W波段收发组件技术研究", 《CNKI知识网络服务平台》 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105245270A (en) * | 2015-09-21 | 2016-01-13 | 西安空间无线电技术研究所 | Miniature spaceborne 8mm frequency band transmission channel |
| CN105245270B (en) * | 2015-09-21 | 2018-08-07 | 西安空间无线电技术研究所 | A kind of spaceborne 8mm frequency ranges transmission channel of miniaturization |
| CN109921159A (en) * | 2019-03-14 | 2019-06-21 | 安徽华东光电技术研究所有限公司 | A kind of upconverter modular structure |
| CN110429953A (en) * | 2019-07-26 | 2019-11-08 | 中国科学院上海微系统与信息技术研究所 | A kind of three frequency range of L-type anti-interference proximity detection device front end and its installation method |
| CN110429953B (en) * | 2019-07-26 | 2024-04-19 | 中国科学院上海微系统与信息技术研究所 | L-shaped tri-band anti-interference near-distance detector front end and installation method thereof |
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| Publication number | Publication date |
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| CN103296973B (en) | 2016-06-01 |
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Denomination of invention: W-band up-conversion module Effective date of registration: 20170519 Granted publication date: 20160601 Pledgee: Chengdu SME financing Company Limited by Guarantee Pledgor: RML Technology Co., Ltd. Registration number: 2017510000025 |
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Date of cancellation: 20181106 Granted publication date: 20160601 Pledgee: Chengdu SME financing Company Limited by Guarantee Pledgor: RML Technology Co., Ltd. Registration number: 2017510000025 |
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Denomination of invention: W-band up-conversion module Effective date of registration: 20181116 Granted publication date: 20160601 Pledgee: Chengdu SME financing Company Limited by Guarantee Pledgor: RML Technology Co., Ltd. Registration number: 2018510000122 |
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Date of cancellation: 20190820 Granted publication date: 20160601 Pledgee: Chengdu SME financing Company Limited by Guarantee Pledgor: RML Technology Co., Ltd. Registration number: 2018510000122 |
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Address after: 610041 Shiyang Industrial Park, No.288, Yixin Avenue, hi tech Zone, Chengdu, Sichuan Province Patentee after: Chengdu lightning Micro Power Technology Co., Ltd Address before: 610041 Shiyang Industrial Park, hi tech Zone, Chengdu, Sichuan Patentee before: RML TECHNOLOGY Co.,Ltd. |