CN115225114B - Omnidirectional electric scanning radio frequency assembly of missile-borne frequency hopping communication system - Google Patents
Omnidirectional electric scanning radio frequency assembly of missile-borne frequency hopping communication system Download PDFInfo
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
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- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/69—Spread spectrum techniques
- H04B1/713—Spread spectrum techniques using frequency hopping
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- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
Abstract
The invention discloses an omnidirectional electric scanning radio frequency component of a missile-borne frequency hopping communication system, which comprises a frequency synthesizer and three active phased array subarray modules; the active phased array sub-array module adopts a tiled flat plate integrated structure, and integrates an active phased array antenna array face, a circuit board of a high-speed frequency hopping receiving and transmitting frequency conversion channel and a circuit board of a beam controller; the active phased array antenna array surface comprises an antenna radiation unit, a multilayer comprehensive wiring medium substrate comprising a power division feed network and a multifunctional transceiver chip set; the active phased array sub-array module is based on a high heat conduction metal box body, a heat dissipation structure and a circuit board mounting surface are provided, a printed board is mounted in the box body to realize interconnection between devices and external interconnection, and the box body realizes cross-box body connection between the devices/circuit boards through holes. The invention can solve the requirements of small volume, long communication distance, omnidirectional coverage of wave beams and frequency hopping anti-interference capability in a missile-borne scene.
Description
Technical Field
The invention relates to the technical field of long-distance broadband high-speed communication, in particular to an omnidirectional electric scanning radio frequency assembly of a missile-borne frequency hopping communication system.
Background
The missile weapon has the characteristics of long range, high precision, high speed, great power and the like, has become a 'knock brick', 'protection shield' and 'killer mace' in modern war, and promotes the development of missile-borne communication equipment along with the informatization and intelligent development of war forms.
With the continuous development of wireless communication technology, the functional and performance requirements of radio frequency systems are gradually increasing. Considering the requirements of high maneuvering performance and 'beyond-the-horizon' communication of a missile-borne platform, a missile-borne passing antenna needs to have a certain antenna gain in the communication coverage range of the missile-borne passing antenna so as to meet the requirements of the signal level required by the modulation and demodulation of a communication system. In addition, the configuration of the missile-borne communication device, as a payload for communication, is limited by the aerodynamic and mechanical strength of the missile. At present, conventional missile-borne antennas generally adopt inverted-F antennas, microstrip antennas or microstrip array antennas and the like, the gain of the passive antennas or the antenna arrays is relatively low, the available bandwidth of the antennas is relatively low, the blind area of beam coverage is relatively large, and the antenna can only be used for communication with lower code rate.
At present, in order to improve the antenna gain and the transmitting power, a common method is to use a high-gain antenna, and due to the high dynamic characteristics of carriers such as an airborne carrier, a missile-borne carrier and the like, the beam is required to be scanned quickly, and the traditional mechanical scanning mode has large structural size and low speed, so that the development requirement of new-generation weaponry is difficult to meet. Compared with a mechanical scanning antenna, the phased array antenna has the outstanding advantages of low profile, conformal shape, high beam scanning speed (microsecond level), flexible processing and the like. In order to meet the requirement of supporting multi-waveform application of a new generation of data chain end machine, a multi-mode common-port high-integration phased array antenna technology is to be researched, wherein the multi-mode common-port high-integration phased array antenna technology comprises a common-caliber array technology, a high-efficiency beam control technology, a high-integration phased array thermal control technology and a high-integration phased array transceiving isolation technology. The design of the multi-mode common-caliber array is realized by adopting the technologies of broadband antenna unit design, multi-band antenna unit design, antenna unit/array lamination design, array layout optimization, parasitic structure loading and the like, so that the problem of mutual coupling among multi-mode antennas is mainly solved, and comprehensive optimization is realized. The high-efficiency beam control technology adopts a special ASIC technology, a high-performance bus technology and a high-speed serial-parallel conversion chip technology to realize the rapid phase distribution of the large-scale array, and adopts a conformal array beam control technology, a distributed beam control technology and a beam pointing accurate control technology to realize the high-efficiency beam control. The high-integration phased array receiving and transmitting isolation technology needs to improve the space isolation between a transmitting array and a receiving array through optimization of antenna array elements and array layout, improves the out-of-band rejection capability of a receiving and transmitting antenna through design of a miniaturized high-performance filter, performs optimization design of the overall structure, system architecture and working mode of the multi-mode common-caliber high-integration phased array antenna, and improves the receiving and transmitting isolation of a phased array antenna system.
Phased array antenna systems are most commonly implemented with active phased array antenna designs in a "brick-type" structural integration. By utilizing the high-speed scanning characteristic of the active phased array antenna beam, the antenna has the capability of fast scanning and high gain in the coverage area of the beam, thereby meeting the high code rate transmission requirement of a platform. For example: 2013, clift. Cole J published an article of "missile-borne communication links" which describes an overview of the missile-borne communication links currently used by standard missiles, discussing enhanced links still in the product pre-research stage, which are new data links developed for both standard missiles and improved maritime sparrow missiles still in use on the naval part of the battle in the united states. In 2016, mo Jing et al published a "shallow analysis of technical characteristics of application of satellite communications to missile weapon systems", and analyzed the technical characteristics of application of satellite communications to missile weapon systems. These documents provide a viable demonstration of the implementation of missile-borne communications using phased array antennas, but there is no discussion about phased array antenna implementations. In addition, by adopting a brick-type structure mode with relatively low integration, the active phased array antenna is difficult to realize miniaturization and light weight design and cannot be well suitable for missile-borne application. With the rapid development of related technologies in the electronics industry and advanced manufacturing industries, for example: millimeter wave monolithic integrated circuit technology, high-low frequency interconnection technology, multifunctional integrated chip technology, integrated packaging technology, and the like, research is also slowly trying to realize an active phased array antenna by adopting a higher-density integrated tile structure mode, and miniaturization, low wood formation and high-efficiency heat dissipation are realized by adopting a tile structure integrated mode. In addition, with the development of the technology of the missile-borne platform, the data rate required to be transmitted has a trend of higher and higher, so that the missile-borne communication device needs to have a high emission equivalent omni-directional radiation power value (EIRP, equivalent Isotropic Radiated Power) and a high receiving Gain/equivalent Temperature ratio (G/T) so as to meet the electrical performance use requirement of the high communication rate. Meanwhile, as an antenna working on the missile, the design of miniaturization, light weight and low power consumption is required to meet the installation and use requirements of a platform. To meet this high performance requirement, the main technical approach is to use high gain active phased array antennas. But the area that a single phased array antenna can cover with a single phased array beam is limited.
In addition, in the modern battlefield complex electromagnetic environment emphasizing informatization combined combat, active interference and passive interference in multiple forms exist simultaneously, and higher requirements are put on the anti-interference performance of a wireless communication data chain. Frequency hopping communication gradually becomes a main anti-interference communication means by virtue of the inherent advantage of rapid frequency conversion, and is widely applied to a communication data link system. The frequency hopping communication adopts a mode that the frequency of a carrier signal is pseudo-randomly changed to carry out spread spectrum communication, and can be used for realizing the anti-interference function of a wireless communication data chain. The frequency synthesizer is a core component of the anti-interference data link terminal in the frequency hopping communication system and is used for providing carrier frequency signals, and the bandwidth range and the frequency point conversion rate of the output signals of the frequency synthesizer greatly influence the anti-interference capability of the wireless communication data link. But frequency hopping communications in combination with active phased array antenna technology has not yet been established.
In summary, the missile-borne communication reported in the current domestic and foreign literature is mainly realized by adopting a passive antenna or an antenna array, and has low gain, dead zone coverage of wave beams, poorer performance of an equivalent emission power value (EIRP) and an equivalent receiving gain/temperature ratio (G/T), and can only be applied to the transmission of data such as simple telemetry, control and the like.
The high-transmission code rate missile-borne communication can be realized by adopting a high-gain and high-bandwidth phased array antenna scheme, but the integrated radio frequency assembly technical scheme is not determined in the aspects of missile-borne data communication aiming at the requirements of ultra-long-distance communication, omnidirectional beam coverage, communication frequency hopping anti-interference and the like.
Disclosure of Invention
In view of the above, the invention provides an omnidirectional electric scanning radio frequency component of a missile-borne frequency hopping communication system, which has the advantages of small volume, long communication distance, omnidirectional coverage of wave beams and frequency hopping anti-interference capability.
The present invention is so implemented as to solve the above-mentioned technical problems.
An omni-directional electronically scanned radio frequency assembly for a missile-borne frequency hopping communication system, comprising: three active phased array subarray modules and a frequency synthesizer;
the frequency synthesizer provides local oscillation signals, control signals and power supply for the active phased array subarray module;
the active phased array sub-array module adopts a tiled flat plate integrated structure, integrates an active phased array antenna array surface, a circuit board of a high-speed frequency hopping receiving and transmitting frequency conversion channel electrically connected with the active phased array antenna array surface and a circuit board of a beam controller; the active phased array antenna array surface comprises an antenna radiation unit, a multilayer comprehensive wiring medium substrate comprising a power division feed network and a multifunctional transceiver chip set; the active phased array sub-array module is based on a high heat conduction metal box body, a heat dissipation structure, a circuit board mounting surface and a mounting groove are provided, a printed board is mounted in the box body to realize interconnection and external interconnection between devices, and the box body realizes cross-box body connection between devices/circuit boards through holes;
The three active phased array subarray modules are uniformly distributed on the wall of the cylindrical missile-borne radome, and under the common control of the frequency synthesizer and the beam controllers of the three active phased array subarray modules, the capacity of simultaneously electrically scanning three beams and covering 360 degrees is realized.
Preferably, the active phased array subarray module is:
the active phased array sub-array module takes a high-heat-conductivity metal box body as a structural basis; the circuit board of the high-speed frequency hopping receiving and transmitting frequency conversion channel and the circuit board of the beam controller are arranged in a cavity below the high-heat conduction metal box body in parallel left and right, and are connected with corresponding external interconnection connectors and other components through printed board jumpers in the cavity; the upper surface of the high heat conduction metal box body is provided with a groove, and a multifunctional transceiver chip set is arranged in the groove; the multilayer comprehensive wiring medium substrate is arranged on the upper surface of the high-heat-conductivity metal box body;
the upper surface of the multilayer comprehensive wiring medium substrate is embedded with an antenna radiation unit, and the inside of the substrate is connected with a power division feed network; the power division feed network interconnects the high-frequency connector of the external interconnection by adopting a first SMP joint welded on a substrate, and the high-speed frequency hopping receiving and transmitting frequency conversion channel circuit board through the SMP-KK joint and a second SMP joint welded at a groove of the high-heat-conductivity metal box body; the low-frequency connector for the power division feed network to the external interconnection is arranged on the right side of the multilayer comprehensive wiring medium substrate, and is interconnected with the low-frequency connector on the beam controller circuit board through a structure window on the right side of the high-heat-conductivity metal box body.
Preferably, the frequency synthesizer is connected with three active phased array subarray modules through three radio frequency connecting cables with the length of 2.92mm, so as to realize the transmission of high-speed frequency hopping local oscillation signals; and the three J30J connecting cables are connected with the three active phased array subarray modules, so that the transmission of control signals and power supplies is realized.
Preferably, at the time of transmission, for the control section: the frequency synthesizer receives a control signal from the outside, generates beam pointing information according to the control signal and sends the beam pointing information to the three active phased array subarray modules; the FPGA of the beam controller in each active phased array sub-array module calculates the beam direction of the corresponding active phased array antenna array face in real time, converts the beam direction into phase data required by the multifunctional transceiver chip, sends the phase data to the multilayer comprehensive wiring medium substrate through the low-frequency connector, and sends the phase data to the multifunctional transceiver chip through comprehensive wiring in the substrate; the multifunctional transceiver chip completes the control of transmitting radio frequency signals and realizes the synchronous electric scanning function of the active phased array transmitting wave beams;
for the radio frequency part: the SMA connector of the high-speed frequency hopping receiving and transmitting frequency conversion channel receives the modulated intermediate frequency signal to carry out up-conversion treatment to become a radio frequency signal, and the up-converted local oscillator signal is generated by a frequency synthesizer and is sent to the high-speed frequency hopping receiving and transmitting frequency conversion channel of each active phased array subarray module; the radio frequency signals are sent to the active phased array antenna array surface through the second SMP connector, the SMP-KK connector and the first SMP connector of the active phased array antenna array surface, power division feeding is carried out through a power division feed network in the multilayer comprehensive wiring medium substrate, and the power division feed is sent to the multifunctional transceiver chip for corresponding treatment, and then the power division feed is emitted outwards through the antenna radiation unit.
Preferably, in each active phased array subarray module, the scanning range of the wave beam of the active phased array antenna array is +/-60 degrees, the antenna radiation unit comprises 64 array elements, and 16 multifunctional transceiver chips form a multifunctional transceiver chip set; the number of array elements of the whole omnidirectional electric scanning radio frequency component is 3 multiplied by 64=192, the working center frequency of the component is 28G, the working bandwidth is 6GHz, and the instantaneous bandwidth is 20MHz.
Preferably, the high-speed frequency hopping transceiver frequency conversion channel comprises a first radio frequency switch, a second radio frequency switch, a third radio frequency switch, a fourth radio frequency switch, a first PA amplifier, a first attenuator, a second attenuator, a mixer, a first filter, a second PA amplifier, a second filter, a first LNA, a second LNA, a third filter and a fourth filter;
when transmitting signals, the intermediate frequency signals enter a high-speed frequency hopping receiving and transmitting frequency conversion channel, are connected with a first PA (power amplifier) through a first radio frequency switch, are amplified and then are sent to a second radio frequency switch, are connected with a mixer through a first attenuator, are mixed with a high-speed frequency hopping local oscillator to generate radio frequency signals in K, ka frequency bands, are sent to a third radio frequency switch after passing through a second attenuator and a second filter, are amplified by the second PA, are filtered by the third filter, are sent to a fourth radio frequency switch, and are output and sent to an active phased array antenna array surface;
When receiving signals, the K, ka-frequency-band radio frequency signals from the active phased array antenna array surface are sent to a fourth radio frequency switch, amplified by a fourth filter and a first LNA, sent to a mixer through a second filter and a second attenuator, and then sent to the second radio frequency switch through the first attenuator, amplified by the second LNA and a VGA amplifier, filtered by the first filter, sent to the first radio frequency switch and then output.
Preferably, the beam controller adopts a hardware architecture of FPGA+flash; immediately loading compensation data in Flash into the FPGA after power-on, calling once each time of power-on, and directly calling data from the FPGA during later calculation; after receiving the wave beam switching instruction, resolving the amplitude and phase data through data analysis and protocol conversion; after the calculation is completed, data is forwarded to the multifunctional transceiver chip through SPI serial port communication, temporarily stored in a cache of the multifunctional transceiver chip, and waiting for the arrival of a beam update instruction; when the beam update instruction arrives, the multifunctional transceiver chip directly uses the data in the buffer memory to update the internal register to realize the beam switching.
Preferably, the frequency synthesizer is disposed in a metal housing, and the external interface includes:
the first frequency synthesizer J30J connector is a control signal and power interface of the assembly;
the second frequency synthesizer J30J connector, the third frequency synthesizer J30J connector and the fourth frequency synthesizer J30J connector are respectively connected with control signals and power interfaces in the pairs of the three active phased array subarray modules;
the SMA joint is an input interface of the 100MHz reference clock of the assembly;
the first frequency synthesizer 2.92mm joint, the second frequency synthesizer 2.92mm joint and the third frequency synthesizer 2.92mm joint are output interfaces for respectively connecting the high-speed frequency hopping local oscillation signals in the pairs of the three active phased array subarray modules, the second active phased array subarray module and the third active phased array subarray module.
Preferably, the frequency synthesizer comprises an FPGA control circuit, a clock distribution module, a PLL, a DDS, a frequency synthesis local oscillation amplifying circuit, a local oscillation filtering module, a frequency synthesis low-frequency amplifying circuit, a low-frequency filtering module, a frequency mixing module, a radio frequency filtering module, a 2 frequency multiplication module, a frequency synthesis radio frequency amplifying circuit and a one-to-three module;
the clock distribution module provides clock signals for the PLL and the DDS module;
The FPGA control circuit controls the PLL to generate local oscillation signals according to the control signals, and the DDS generates low-frequency signals; the local oscillation signal enters a frequency synthesis local oscillation amplifying circuit and a local oscillation filtering module to amplify and filter so as to obtain a first signal; the low-frequency signal enters a frequency synthesis low-frequency amplifying circuit, and a low-frequency filtering module performs amplification filtering to obtain a second signal; the frequency mixing module mixes the first signal and the second signal, and then the first signal and the second signal are divided into three paths after being filtered, multiplied by frequency and amplified by the radio frequency filtering module, the 2-frequency multiplication module and the frequency synthesis radio frequency amplification circuit, and the three paths are used as local oscillation signals of the three active phased array subarray modules.
Preferably, the power division feed network adopts a Wilkinson power divider designed by a strip line, and the isolation resistor adopts a buried resistor process.
The beneficial effects are that:
(1) According to the omni-directional electric scanning radio frequency component of the missile-borne frequency hopping communication system, under the condition of small missile-borne environment, the implementation scheme with small volume, long communication distance, omni-directional beam coverage and frequency hopping anti-interference capability is provided through the design of the active phased array sub-array module tiled flat plate integrated structure.
(2) The active phased array sub-array module takes the high heat conduction metal box body as a structural basis, not only provides a heat radiation structure, but also provides a circuit board mounting surface and a mounting groove, the printed boards are arranged in the box body to realize the interconnection and external interconnection between devices, the box body realizes the cross-box body connection between the devices and the circuit boards through the holes, and the active phased array sub-array module has the characteristics of simple structure, low profile, light weight and good heat control performance, can shorten the production period of the active phased array sub-array module, reduce the production and processing cost, improve the production efficiency, improve the system integration level and the space utilization rate, and improve the reliability of the module.
The active phased array sub-array module fully utilizes the surface, the inner space and the open pore structure of the box body, realizes compact installation of the sub-array module component parts, reduces the volume of the sub-array module, does not influence interconnection, avoids signal transmission problems caused by independent wiring and external wiring, effectively solves the electromagnetic interference problem and the receiving problem of Ka frequency band weak signals, has the advantages of flexible module configuration, rich functions and simple external interface because the external interface is only provided with a power supply control interface and a radio frequency interface, and is very suitable for the missile-borne use environment with flexible beam configuration and compact volume.
In addition, each module is relatively independent, allowing for higher module level testability and maintainability. Therefore, the active phased array sub-array module can be widely applied to broadband communication electronic technology systems such as missile-borne communication systems, navigation systems, radars, 5G and the like.
(3) The three active phased array subarray modules are uniformly distributed on the wall of the cylindrical missile-borne radome, and can realize simultaneous electric scanning of three beams under the control of the frequency synthesizer, thereby providing the capability of covering 360 degrees.
(4) The high-speed frequency hopping receiving and transmitting frequency conversion channel can carry out frequency hopping and mixing on the local oscillation signal hopped at high speed and the intermediate frequency signal, so that high-speed frequency hopping modulation on communication data is realized; in addition, the received radio frequency signal and the high-speed hopped local oscillation signal can be subjected to frequency hopping and frequency mixing, so that the 'debounce' processing of the radio frequency signal is realized; the above functions are the hardware basis for implementing the frequency hopping anti-interference function of the wireless communication data link.
(5) The frequency synthesizer can generate the high-speed hopping local oscillation signal with the frequency hopping time less than 1us, and generates 3 paths of coherent high-speed hopping local oscillation signals after amplification and power division processing, wherein the signals are key signals for realizing the frequency hopping anti-interference function of a wireless communication data chain.
(6) The power division feed network adopts the Wilkinson power divider designed by a strip line, adopts a 'buried resistance' process, and has good electrical properties of low standing wave, high amplitude phase consistency, high isolation and the like. Because of the special laminated structure, and the electromagnetic leakage interference is prevented by punching metal through holes around the printed board, a shielding box is omitted, and the power divider has the advantages of compact structure, light weight and simple processing.
Drawings
Fig. 1 is a schematic structural diagram of an omnidirectional electric scanning radio frequency assembly of a missile-borne frequency hopping communication system according to the present invention;
FIG. 2 is a schematic diagram of the operation of an omni-directional electronically scanned RF component in accordance with the present invention;
fig. 3 is a schematic diagram of the active phased array antenna operation;
fig. 4 is a schematic diagram of a single sub-array module of an omni-directional electric scanning radio frequency assembly with a missile-borne frequency hopping communication system according to the present invention;
FIG. 5 is a schematic diagram of the operation of the high-speed frequency hopping transceiver frequency conversion channel in the sub-array module of FIG. 4;
Fig. 6 is a schematic diagram of the operation of the beam controller in the subarray module of fig. 4;
fig. 7 is a schematic diagram of a frequency synthesizer in an omni-directional electric scanning radio frequency assembly with a missile-borne frequency hopping communication system according to the present invention;
FIG. 8 is a schematic diagram of the operation of a frequency synthesizer in an omni-directional electronically scanned RF assembly with a missile-borne frequency hopping communication scheme in accordance with the present invention;
fig. 9 is a schematic diagram of a feed network in an active phased array antenna array plane in an omni-directional electronically scanned radio frequency assembly with a missile-borne frequency hopping communication system in accordance with the present invention;
fig. 10 is a diagram of a single sub-array module transmitting beam of an omnidirectional electric scanning radio frequency assembly in different scanning angles in a missile-borne frequency hopping communication system according to the present invention;
FIG. 11 is a diagram of a single sub-array module receive beam of an omni-directional electronically scanned RF component in accordance with an on-board frequency hopping communication scheme of the present invention at different scan angles;
in the figure: 1 first active phased array subarray module, 1-1 first active phased array antenna array surface, 1-2 first high-speed frequency hopping receiving and transmitting frequency conversion channel, 1-3 first wave beam controller, 2 second active phased array subarray module, 2-1 second active phased array antenna array surface, 2-2 second high-speed frequency hopping receiving and transmitting frequency conversion channel, 2-3 second wave beam controller, 3 third active phased array subarray module, 3-1 third active phased array antenna array surface, 3-2 third high-speed frequency hopping receiving and transmitting frequency conversion channel, 3-3 third wave beam controller, 10 frequency synthesizer, 11 multi-layer comprehensive wiring medium substrate, 12 multifunctional receiving and transmitting chip set, 13 power division feed network, 14 SMP joint of active phased array antenna array surface, 15SMP-KK joint, 16 high heat conduction metal box body 17SMP joint, 18SMA joint (female), 19.92 mm joint (female), low frequency (male) connector of 20 active phased array antenna array face, low frequency (female) connector on 21 beam controller, circuit board of 22 high-speed frequency hopping receiving and transmitting frequency conversion channel, circuit board of 23 beam controller, 24 beam controller J30J (female), 25 multifunctional receiving and transmitting chip, 26 antenna radiating unit, 27 missile-borne radome, 28 first beam, 29 second beam, 30 third beam, 31 first frequency synthesizer J30J (female), 32 second frequency synthesizer J30J (female), 33 third frequency synthesizer J30J (female), 34 fourth frequency synthesizer J30J (female), 35, first frequency synthesizer 2.92mm joint (female), 36 second frequency synthesizer 2.92mm joint (female), A third frequency synthesizer 2.92mm connector (mother), a 38 frequency synthesizer SMA connector (mother), a 39 antenna circular polarization feed network and a 40 cover plate.
Detailed Description
The invention provides an omnidirectional electric scanning radio frequency assembly of a missile-borne frequency hopping communication system, which comprises three active phased array subarray modules and a frequency synthesizer. The frequency synthesizer provides local oscillator signals, control signals and power for the active phased array sub-array module. The active phased array subarray module is an important design object, adopts a tiled flat plate integrated structure, integrates an active phased array antenna array surface, a circuit board of a high-speed frequency hopping receiving and transmitting frequency conversion channel electrically connected with the active phased array antenna array surface and a circuit board of a beam controller. The active phased array antenna array surface comprises an antenna radiation unit, a multilayer comprehensive wiring medium substrate containing a power division feed network and a multifunctional transceiver chip set. In order to solve the problems of miniaturization and heat dissipation, the active phased array sub-array module is based on a high-heat-conductivity metal box body, a heat dissipation structure, a circuit board mounting surface and a mounting groove are provided, a printed board is mounted in the box body to realize interconnection between devices and external interconnection, and the box body realizes cross-box body connection between the devices/circuit boards through holes.
The three active phased array subarray modules are uniformly distributed on the wall of the cylindrical missile-borne radome 27, and under the common control of the frequency synthesizer and the beam controllers of the three active phased array subarray modules, the capacity of simultaneously electrically scanning three beams and covering 360 degrees is realized.
The present invention will be described in detail below with reference to the accompanying drawings and with reference to preferred embodiments.
Referring to fig. 1 and 2, fig. 1 is a configuration of an omnidirectional electric scanning radio frequency assembly with a missile-borne frequency hopping communication system in the present embodiment. Fig. 2 shows the electrical connection of the important components of the present assembly. As shown, the omni-directional electrically scanned radio frequency assembly includes a first active phased array sub-array module 1, a second active phased array sub-array module 2, a third active phased array sub-array module 3, and a frequency synthesizer 10. The frequency synthesizer adopts three radio frequency connecting cables with the diameter of 2.92mm and three J30J connecting cables to realize high-low frequency interconnection with the first active phased array sub-array module, the second active phased array sub-array module and the third active phased array sub-array module. The 2.92mm radio frequency connection cable realizes the transmission of high-speed frequency hopping local oscillation signals; the J30J connection cable realizes transmission of control signals and power supply. In this embodiment, each sub-array module includes 64 channels, each 4 channels has 1 independent multi-functional transceiver chip, the 64 channels share 16 multi-functional transceiver chips, and the three sub-arrays are commonly connected to the frequency synthesizer.
Referring to fig. 2, the high-speed modulation frequency-receiving/transmitting frequency-converting channels 1-2,2-2,3-2 in fig. 2, the beam controllers 1-3,2-3,3-3 and the antenna array surfaces 1-1,2-1,3-1 form three active phased array subarray modules. Which are commonly connected to a frequency synthesizer. The frequency synthesizer receives a reference clock, a control signal and a power supply from the outside. And generating local oscillation signals according to the reference clock under the control of the control signals, and providing the local oscillation signals for high-speed frequency modulation receiving and transmitting frequency conversion channels of the three active phased array subarrays. While generating beam control signals to be provided to the beam controller.
See fig. 3. Fig. 3 is a block diagram of the active phased array antenna vibrating surface of fig. 2. The active phased array antenna array surface adopts a high-integration integrated multi-layer dielectric printed board welding multifunctional transceiver chip set scheme. As shown, from top to bottom: a microstrip patch antenna array composed of 64 antenna radiating monomers 26, an antenna circular polarization feed network 39, a multifunctional transceiver chip set and a power division feed network 13. In order to improve the integration level of the whole phased array antenna array surface, the internal interconnection mode is finished by adopting printed board wiring, a 5690 series 60 core board-to-board connector which is welded by pasting is adopted for the low-frequency connector of the external interconnection, the interval is 0.635mm, the plug connector is vertical, the interconnection with the beam controller is realized, an embedded welded SMP connector is adopted for the high-frequency connector of the external interconnection, and the SMP-KK connector is connected with a high-speed frequency hopping receiving-transmitting frequency conversion channel.
Referring to fig. 4, fig. 4 shows a block diagram of an active phased array sub-array module employing an integrated design. The structure adopts a tiled flat plate integrated structure, can reduce the volume, and has heat dissipation and effective signal transmission, and integrates an active phased array antenna array surface, a circuit board 22 of a high-speed frequency hopping receiving and transmitting frequency conversion channel electrically connected with the active phased array antenna array surface and a circuit board 23 of a beam controller. The active phased array antenna array surface comprises 64 antenna radiating units 26, a multilayer comprehensive wiring medium substrate 11 (comprising a power division feed network), an SMP joint 14 of the active phased array antenna array surface, an active phased array antenna array surface low-frequency (male) connector 20 and a multifunctional transceiver chip set.
The components are all based on the high heat conduction metal box 16. Referring to the lower part of fig. 4, the circuit board 22 of the high-speed frequency hopping receiving and transmitting frequency conversion channel and the circuit board 23 of the beam controller are arranged in parallel left and right in the cavity below the high-heat conduction metal box body, and the transmission of radio frequency signals, local oscillation signals and intermediate frequency signals is respectively realized through coaxial SMP vertical interconnection, coaxial 2.92mm horizontal interconnection and coaxial SMA horizontal interconnection structures. The high-speed frequency hopping receiving and transmitting variable frequency channel and the beam controller are connected through a printed board jumper inside the cavity.
Referring to the upper part of fig. 4, the upper surface of the high heat conduction metal box body is provided with a groove, and the multifunctional transceiver chip set 12 is arranged in the groove; the multilayer comprehensive wiring medium substrate 11 is tightly arranged on the upper surface of the high heat conduction metal box body through the through holes on the printed board, and heat generated by the multifunctional transceiver chip set is led out to the heat dissipation teeth around the box body through the box body to realize heat balance.
The upper surface of the multilayer comprehensive wiring medium substrate 11 is embedded with an antenna radiation unit 26, and the substrate is internally connected with a power division feed network. The power division feed network is used for interconnecting the external interconnected high-frequency connector with the radio-frequency signal through the SMP joint 14 welded on the base plate, the SMP joint 15 welded at the groove of the high-heat-conductivity metal box body and the high-speed frequency hopping receiving and transmitting frequency conversion channel circuit board. The low frequency (male) connector 20 for the power division feed network to the external interconnection is arranged on the right side of the multilayer comprehensive wiring medium substrate and is interconnected with the low frequency (female) connector 21 on the beam controller circuit board through a structure window on the right side of the high heat conduction metal box body. The high-speed frequency hopping receiving and transmitting frequency conversion channel and the beam controller are arranged in a cavity below the high-heat-conductivity metal box body. The J30J (female) connector 24 mounted on the highly thermally conductive metal box is connected to the beam controller by wire bonding within the cavity to complete the interconnection with the frequency synthesizer. The cover plate 40 is welded at the bottom of the high heat conduction metal box body through a laser welding process, and sealing of the metal box body is completed. The subarray module can adopt a laser seal welding process, so that the reliability and maintainability of the subarray module are improved.
During transmitting, the control part receives corresponding control signals through a control circuit of the frequency synthesizer, processes the control signals according to the content of the control signals, then transmits beam pointing information to three sub-array modules, an FPGA (field programmable gate array) of a beam controller in each sub-array module calculates the beam pointing of an active phased array antenna array surface of the corresponding sub-array module in real time, the beam pointing of the active phased array antenna array surface is converted into phase data required by a multifunctional transceiver chip under the control of the beam controller, and the phase data is transmitted to a multilayer comprehensive wiring medium substrate through a low-frequency (mother) connector on the beam controller, and is transmitted to the multifunctional transceiver chip through comprehensive wiring in the substrate, and the multifunctional transceiver chip completes the control of transmitting radio frequency signals so as to realize the synchronous electric scanning function of the active phased array transmitting beam; the radio frequency part carries out up-conversion treatment on a modulated intermediate frequency signal input by an SMA connector (master) of a high-speed frequency hopping receiving and transmitting frequency conversion channel, the up-converted high-speed frequency hopping local oscillation signal is generated by a frequency synthesizer and is transmitted to the high-speed frequency hopping receiving and transmitting frequency conversion channel of each subarray, the modulated intermediate frequency signal is changed into a radio frequency signal after up-conversion, the radio frequency signal is transmitted to the active phased array antenna array surface through the SMP connector, the SMP-KK connector and the SMP connector of the active phased array antenna array surface, and power division feeding is carried out through a power division feed network in a multilayer comprehensive wiring medium substrate, and the radio frequency signal is transmitted to the multifunctional receiving and transmitting chip to the outside through an antenna radiation unit after corresponding treatment; under the common control of the frequency synthesizer and the beam controllers of the three active phased array subarray modules, the capacity of simultaneously and electrically scanning three beams and covering 360 degrees can be realized; the control circuit of the frequency synthesizer receives the corresponding opposite control signal to complete the receiving of the signal.
Specific embodiments are based on a 24 GHz-30 GHz eight-channel multifunctional transceiver chip, an electric scanning active phased array controlled by a tile type framework mode is adopted, the number of component array elements is 3 multiplied by 64=192, the working center frequency of the component is 28G, the working bandwidth is 6GHz, the instantaneous bandwidth is 20MHz, the scanning range of a single active phased array antenna array wave beam is +/-60 degrees, and the polarization mode is as follows: circularly polarizing. Each active phased array sub-array module comprises 64 channels, 16 multifunctional transceiver chips are integrated, after the radio frequency component receives three paths of intermediate frequency transmitting signals, the three paths of radio frequency signals are output after up-conversion is carried out through three high-speed frequency hopping transceiver frequency conversion channels and are sent to three active phased array antenna array surfaces through radio frequency interfaces, the radio frequency signals of each array surface are divided into 16 paths of signals through a power division feed network and are sent to the multifunctional transceiver chip groups, under the control of a beam controller, the multifunctional transceiver chip groups send 16 multiplied by 8=128 paths of signals to the antenna circular polarization feed network and then complete signal transmission through 64 antenna radiation units, electric scanning of phased array antenna transmitting beams is achieved, the three array surfaces can achieve the functions of 360-degree electric scanning and high-speed frequency hopping in all directions, and the receiving function is opposite to the transmitting function.
See fig. 5. Fig. 5 shows a schematic diagram of a high-speed frequency hopping transceiver frequency conversion channel. As shown in the figure, the high-speed frequency hopping transceiving frequency conversion channel comprises a first radio frequency switch, a second radio frequency switch, a third radio frequency switch, a fourth radio frequency switch, a first PA amplifier, a first attenuator, a second attenuator, a mixer, a first filter, a second PA amplifier, a second filter, a first LNA, a second LNA, a third filter and a fourth filter;
When transmitting signals, intermediate frequency signals enter a high-speed frequency hopping receiving and transmitting frequency conversion channel, are connected with a first PA (power amplifier) through a first radio frequency switch, are amplified and then are sent to a second radio frequency switch, are connected to a mixer through a first attenuator, are mixed with a high-speed frequency hopping local oscillator and then generate radio frequency signals in K, ka frequency bands, are sent to a third radio frequency switch after passing through a second attenuator and a second filter, are amplified by the second PA, are filtered by the third filter, are sent to a fourth radio frequency switch and are output to an active phased array antenna array surface.
When receiving signals, the K, ka-frequency-band radio frequency signals from the active phased array antenna array surface are sent to a fourth radio frequency switch, amplified by a fourth filter and a first LNA, sent to a mixer through a second filter and a second attenuator, and then sent to the second radio frequency switch through the first attenuator, amplified by the second LNA and a VGA amplifier, filtered by the first filter, sent to the first radio frequency switch and then output.
See fig. 6. Fig. 6 shows a block diagram of a beam controller. As shown in the figure, the beam controller receives the control signal from the frequency synthesizer through J30J (mother) and adopts a combined mode of FPGA and Flash to realize the hardware architecture. The method is realized by adopting a centralized resolving mode, compensation data in Flash is immediately loaded into the FPGA after the array surface is electrified, and is invoked once each time when electrified, and the data is directly invoked from the FPGA in the later resolving process. After receiving the wave beam switching instruction of the array surface, the resolving module resolves the amplitude and phase data through data analysis and protocol conversion. After the calculation is completed, the data is forwarded to the multifunctional chip through SPI serial communication, and is temporarily stored in an internal register of the multifunctional chip, and the arrival of a beam update instruction is waited. And after the instruction arrives, the data in the buffer memory is directly updated to a final register to realize beam switching.
See fig. 7. Fig. 7 shows an exterior structure of the beam controller. The frequency synthesizer sets up in the metal casing, and the external interface includes: the first frequency synthesizer J30J (female) connector is a control signal and power interface of the assembly; the second frequency synthesizer J30J (mother), the third frequency synthesizer J30J (mother) and the fourth frequency synthesizer J30J (mother) are respectively connected with control signals and power interfaces in the pairs of the first active phased array sub-array module, the second active phased array sub-array module and the third active phased array sub-array module. The SMA connector (mother) of the frequency synthesizer is an input interface of the 100MHz reference clock of the component. The first frequency synthesizer 2.92mm joint (mother), the second frequency synthesizer 2.92mm joint (mother) and the third frequency synthesizer 2.92mm joint (mother) are output interfaces respectively connected with high-speed frequency hopping local oscillation signals in the pairs of the first active phased array sub-array module, the second active phased array sub-array module and the third active phased array sub-array module.
See fig. 8. Fig. 8 is a schematic diagram of a frequency synthesizer. As shown in the figure, the frequency synthesizer adopts an FPGA control method, realizes the miniaturization design of the frequency synthesizer based on high-density integration and wiring technology, generates 3 paths of high-speed frequency hopping local oscillation signals required by the components, analyzes and distributes control signals received by the components to each active phased array sub-array module, processes an input power supply and distributes the processed power supply to each active phased array sub-array module. The frequency synthesizer comprises an FPGA control circuit, a clock distribution module, a PLL, a DDS, a frequency synthesis local oscillation amplifying circuit, a local oscillation filtering module, a frequency synthesis low-frequency amplifying circuit, a low-frequency filtering module, a mixing module, a radio frequency filtering module, a 2 frequency multiplication module, a frequency synthesis radio frequency amplifying circuit and a one-to-three module.
The clock distribution module provides clock signals for the PLL and the DDS module;
the FPGA control circuit controls the PLL to generate local oscillation signals according to the control signals, and the DDS generates low-frequency signals; the local oscillation signal enters a frequency synthesis local oscillation amplifying circuit and a local oscillation filtering module to amplify and filter so as to obtain a first signal; the low-frequency signal enters a frequency synthesis low-frequency amplifying circuit, and a low-frequency filtering module performs amplification filtering to obtain a second signal; the frequency mixing module mixes the first signal and the second signal, and then the first signal and the second signal are divided into three paths after being filtered, multiplied by frequency and amplified by the radio frequency filtering module, the 2-frequency multiplication module and the frequency synthesis radio frequency amplification circuit, and the three paths are used as local oscillation signals of the three active phased array subarray modules.
In this embodiment, the phase-locked loop uses LMX2594 for TI, with an output frequency in the range of 10MHz-15GHz. The DDS adopts CX8242 chip of city core science and technology, supports: transmission frequency range: 10 MHz-6000 MHz supporting fast frequency hopping: < 1us. The power module adopts a high-efficiency DCDC converter to realize higher power efficiency.
See fig. 9. The power divider feed network adopts a Wilkinson power divider designed by a strip line, and the isolation resistor adopts a buried resistor process, so that the power divider feed network has the characteristics of small volume and high reliability. During transmitting, K, ka frequency band radio frequency signals are input by SMP joints of the active phased array antenna array surface, and fed to the multifunctional transceiver chip after passing through a 1:16 power division feed network. The receive function is opposite to the transmit function.
Through practical processing tests, the size of a single active phased array subarray module in the radio frequency assembly is as follows: 130mm x 65mm x 40mm, weight: 570g; frequency synthesizer size: 200mm×120mm×21mm, weight: 950g, the whole assembly has the characteristics of small volume and light weight. The active phased array subarray module of the radio frequency assembly can realize beam scanning of +/-60 degrees, EIRP is more than or equal to 53dBm, G/T value is more than or equal to-15 dB/K, normal side lobe level is less than or equal to-12 dB, and the active phased array subarray module has good electrical performance. The beam coverage capacity of 360 degrees in all directions can be better realized under the joint work of the three subarrays. The beam test results for the individual sub-arrays are shown with reference to fig. 10 and 11.
The above specific embodiments merely describe the design principle of the present invention, and the shapes of the components in the description may be different, and the names are not limited. Therefore, the technical scheme described in the foregoing embodiments can be modified or replaced equivalently by those skilled in the art; such modifications and substitutions do not depart from the spirit and technical scope of the invention, and all of them should be considered to fall within the scope of the invention.
Claims (10)
1. An omni-directional electronically scanned radio frequency assembly for a missile-borne frequency hopping communication system, comprising: three active phased array subarray modules and a frequency synthesizer;
The frequency synthesizer provides local oscillation signals, control signals and power supply for the active phased array subarray module;
the active phased array sub-array module adopts a tiled flat plate integrated structure, integrates an active phased array antenna array surface, a circuit board of a high-speed frequency hopping receiving and transmitting frequency conversion channel electrically connected with the active phased array antenna array surface and a circuit board of a beam controller; the active phased array antenna array surface comprises an antenna radiation unit, a multilayer comprehensive wiring medium substrate comprising a power division feed network and a multifunctional transceiver chip set; the active phased array sub-array module is based on a high heat conduction metal box body, a heat dissipation structure, a circuit board mounting surface and a mounting groove are provided, a printed board is mounted in the box body to realize interconnection and external interconnection between devices, and the box body realizes cross-box body connection between devices/circuit boards through holes;
the three active phased array subarray modules are uniformly distributed on the wall of the cylindrical missile-borne radome, and under the common control of the frequency synthesizer and the beam controllers of the three active phased array subarray modules, the capacity of simultaneously electrically scanning three beams and covering 360 degrees is realized;
the active phased array sub-array module takes a high-heat-conductivity metal box body as a structural basis; the circuit board of the high-speed frequency hopping receiving and transmitting frequency conversion channel and the circuit board of the beam controller are arranged in a cavity below the high-heat conduction metal box body in parallel left and right, and are connected with corresponding external interconnection connectors and other components through printed board jumpers in the cavity; the upper surface of the high heat conduction metal box body is provided with a groove, and a multifunctional transceiver chip set is arranged in the groove; the multilayer comprehensive wiring medium substrate is arranged on the upper surface of the high-heat-conductivity metal box body;
The low-frequency connector for the power division feed network to the external interconnection is arranged on the right side of the multilayer comprehensive wiring medium substrate, and is interconnected with the low-frequency connector on the beam controller circuit board through a structure window on the right side of the high-heat-conductivity metal box body.
2. The omni-directional electronically scanned radio frequency assembly of a missile-borne frequency hopping communication system of claim 1, wherein the active phased array sub-array module:
the upper surface of the multilayer comprehensive wiring medium substrate is embedded with an antenna radiation unit, and the inside of the substrate is connected with a power division feed network; the power division feed network interconnects the external interconnected high-frequency connector by adopting a first SMP joint welded on the substrate, and the high-speed frequency hopping receiving and transmitting frequency conversion channel circuit board is connected with radio-frequency signals through the SMP-KK joint and a second SMP joint welded at the groove of the high-heat-conductivity metal box body.
3. The omni-directional electric scanning radio frequency assembly of the missile-borne frequency hopping communication system according to claim 2, wherein the frequency synthesizer is connected with three active phased array subarray modules through three 2.92mm radio frequency connecting cables to realize the transmission of high-speed frequency hopping local oscillation signals; and the three J30J connecting cables are connected with the three active phased array subarray modules, so that the transmission of control signals and power supplies is realized.
4. The omni-directional electronically scanned radio frequency assembly of the missile-borne frequency hopping communication system of claim 2, wherein upon transmission, for the control portion: the frequency synthesizer receives a control signal from the outside, generates beam pointing information according to the control signal and sends the beam pointing information to the three active phased array subarray modules; the FPGA of the beam controller in each active phased array sub-array module calculates the beam direction of the corresponding active phased array antenna array face in real time, converts the beam direction into phase data required by the multifunctional transceiver chip, sends the phase data to the multilayer comprehensive wiring medium substrate through the low-frequency connector, and sends the phase data to the multifunctional transceiver chip through comprehensive wiring in the substrate; the multifunctional transceiver chip completes the control of transmitting radio frequency signals and realizes the synchronous electric scanning function of the active phased array transmitting wave beams;
for the radio frequency part: the SMA connector of the high-speed frequency hopping receiving and transmitting frequency conversion channel receives the modulated intermediate frequency signal to carry out up-conversion treatment to become a radio frequency signal, and the up-converted local oscillator signal is generated by a frequency synthesizer and is sent to the high-speed frequency hopping receiving and transmitting frequency conversion channel of each active phased array subarray module; the radio frequency signals are sent to the active phased array antenna array surface through the second SMP connector, the SMP-KK connector and the first SMP connector of the active phased array antenna array surface, power division feeding is carried out through a power division feed network in the multilayer comprehensive wiring medium substrate, and the power division feed is sent to the multifunctional transceiver chip for corresponding treatment, and then the power division feed is emitted outwards through the antenna radiation unit.
5. The omni-directional electric scanning radio frequency assembly of the missile-borne frequency hopping communication system according to claim 2, wherein in each active phased array subarray module, the scanning range of an active phased array antenna array beam is +/-60 degrees, the antenna radiation unit comprises 64 array elements, and 16 multifunctional transceiver chips form a multifunctional transceiver chip set; the number of array elements of the whole omnidirectional electric scanning radio frequency component is 3 multiplied by 64=192, the working center frequency of the component is 28G, the working bandwidth is 6GHz, and the instantaneous bandwidth is 20MHz.
6. The omni-directional electronically scanned rf assembly of claim 2, wherein the high-speed frequency hopping communications system comprises a first rf switch, a second rf switch, a third rf switch, a fourth rf switch, a first PA amplifier, a first attenuator, a second attenuator, a mixer, a first filter, a second PA amplifier, a second filter, a first LNA, a second LNA, a third filter, a fourth filter;
when transmitting signals, the intermediate frequency signals enter a high-speed frequency hopping receiving and transmitting frequency conversion channel, are connected with a first PA (power amplifier) through a first radio frequency switch, are amplified and then are sent to a second radio frequency switch, are connected with a mixer through a first attenuator, are mixed with a high-speed frequency hopping local oscillator to generate radio frequency signals in K, ka frequency bands, are sent to a third radio frequency switch after passing through a second attenuator and a second filter, are amplified by the second PA, are filtered by the third filter, are sent to a fourth radio frequency switch, and are output and sent to an active phased array antenna array surface;
When receiving signals, the K, ka-frequency-band radio frequency signals from the active phased array antenna array surface are sent to a fourth radio frequency switch, amplified by a fourth filter and a first LNA, sent to a mixer through a second filter and a second attenuator, and then sent to the second radio frequency switch through the first attenuator, amplified by the second LNA and a VGA amplifier, filtered by the first filter, sent to the first radio frequency switch and then output.
7. The omni-directional electronically scanned radio frequency assembly of the missile-borne frequency hopping communication system of claim 2, wherein the beam controller adopts a hardware architecture of fpga+flash; immediately loading compensation data in Flash into the FPGA after power-on, calling once each time of power-on, and directly calling data from the FPGA during later calculation; after receiving the wave beam switching instruction, resolving the amplitude and phase data through data analysis and protocol conversion; after the calculation is completed, data is forwarded to the multifunctional transceiver chip through SPI serial port communication, temporarily stored in a cache of the multifunctional transceiver chip, and waiting for the arrival of a beam update instruction; when the beam update instruction arrives, the multifunctional transceiver chip directly uses the data in the buffer memory to update the internal register to realize the beam switching.
8. The omni-directional electronically scanned radio frequency assembly of claim 2, wherein the frequency synthesizer is disposed in a metal housing, the external interface comprising:
the first frequency synthesizer J30J connector is a control signal and power interface of the assembly;
the second frequency synthesizer J30J connector, the third frequency synthesizer J30J connector and the fourth frequency synthesizer J30J connector are respectively connected with control signals and power interfaces in the pairs of the three active phased array subarray modules;
the SMA joint is an input interface of the 100MHz reference clock of the assembly;
the first frequency synthesizer 2.92mm joint, the second frequency synthesizer 2.92mm joint and the third frequency synthesizer 2.92mm joint are output interfaces for respectively connecting the high-speed frequency hopping local oscillation signals in the pairs of the three active phased array subarray modules, the second active phased array subarray module and the third active phased array subarray module.
9. The omni-directional electric scanning radio frequency assembly of the missile-borne frequency hopping communication system according to claim 8, wherein the frequency synthesizer comprises an FPGA control circuit, a clock distribution module, a PLL, a DDS, a frequency synthesis local oscillation amplifying circuit, a local oscillation filtering module, a frequency synthesis low-frequency amplifying circuit, a low-frequency filtering module, a mixing module, a radio frequency filtering module, a 2-frequency multiplication module, a frequency synthesis radio frequency amplifying circuit and a one-to-three module;
The clock distribution module provides clock signals for the PLL and the DDS module;
the FPGA control circuit controls the PLL to generate local oscillation signals according to the control signals, and the DDS generates low-frequency signals; the local oscillation signal enters a frequency synthesis local oscillation amplifying circuit and a local oscillation filtering module to amplify and filter so as to obtain a first signal; the low-frequency signal enters a frequency synthesis low-frequency amplifying circuit, and a low-frequency filtering module performs amplification filtering to obtain a second signal; the frequency mixing module mixes the first signal and the second signal, and then the first signal and the second signal are divided into three paths after being filtered, multiplied by frequency and amplified by the radio frequency filtering module, the 2-frequency multiplication module and the frequency synthesis radio frequency amplification circuit, and the three paths are used as local oscillation signals of the three active phased array subarray modules.
10. The omni-directional electronically scanned radio frequency component of a missile-borne frequency hopping communication system according to any one of claims 1 to 9, wherein the power division feed network is a wilkinson power divider designed by a strip line, and the isolation resistor is a buried resistor process.
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