CN115225114A - Missile-borne frequency hopping communication system omnidirectional electric scanning radio frequency assembly - Google Patents
Missile-borne frequency hopping communication system omnidirectional electric scanning radio frequency assembly Download PDFInfo
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- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
Abstract
The invention discloses a missile-borne frequency hopping communication system omnidirectional electric scanning radio frequency assembly, which comprises a frequency synthesizer and three active phased array sub-array modules, wherein the frequency synthesizer is used for generating a frequency spectrum signal; the active phased array sub-array module adopts a tiled flat plate integrated structure and integrates an active phased array antenna array surface, a circuit board of a high-speed frequency hopping transceiving frequency conversion channel and a circuit board of a beam controller; the active phased array antenna array surface comprises an antenna radiation unit, a multilayer comprehensive wiring medium substrate containing a power division feed network and a multifunctional transceiving chip set; the active phased array subarray module takes a high-heat-conductivity metal box body as a structural foundation, a heat dissipation structure and a circuit board mounting surface are provided, a printed board is mounted inside the box body to achieve interconnection and external interconnection between devices, and the box body achieves cross-box body connection between the devices/the circuit boards through holes. The invention can meet the requirements of small volume, long communication distance, omnidirectional beam coverage and frequency hopping anti-interference capability in a missile-borne scene.
Description
Technical Field
The invention relates to the technical field of long-distance broadband high-speed communication, in particular to a missile-borne frequency hopping communication system omnidirectional electric scanning radio frequency assembly.
Background
Missile weapons have the characteristics of long range, high precision, high speed, great power and the like, have become 'strike tiles', 'protection shields' and 'killer maces' in modern war, and promote the development of missile-borne communication equipment along with the information and intelligent development of the war form.
With the continuous development of wireless communication technology, the functional and performance requirements for radio frequency systems are gradually increasing. In view of the requirements of high maneuverability and over-the-horizon communication of missile-borne platforms, the missile-borne traffic antenna needs to have a certain antenna gain within the communication coverage range thereof so as to meet the requirements of the required signal level for modulation and demodulation of the communication system. In addition, the constituent structure of the missile-borne communication device, which is a payload for communication, is restricted by the aerodynamics and mechanical strength of the missile. At present, the conventional missile-borne antenna generally adopts an inverted-F antenna, a microstrip antenna or a microstrip array antenna, and the like, and these passive antennas or antenna arrays have relatively low antenna gain, relatively low available bandwidth of the antenna, and large blind areas covered by beams, and can only be used for communication at a low code rate.
At present, in order to improve the gain and the transmitting power of an antenna, a general method is to adopt a high-gain antenna, because of the high dynamic characteristics of carriers such as an airborne carrier, a missile-borne carrier and the like, a beam is required to be rapidly scanned, and the traditional mechanical scanning mode has large structure size and low speed and is difficult to meet the development requirement of new-generation weaponry. Compared with a mechanical scanning antenna, the phased array antenna has the outstanding advantages of low profile, conformality, high beam scanning speed (microsecond level), flexible processing and the like. In order to meet the requirement of supporting multi-waveform application of a new generation of data link terminal, a multi-mode common-port high-integration-level phased array antenna technology, including a common-aperture array technology, a high-efficiency beam control technology, a high-integration-level phased array thermal control technology and a high-integration-level phased array transceiving isolation technology, needs to be researched urgently. The design of the multi-mode common-aperture array is realized by adopting the technologies of broadband antenna unit design, multi-band antenna unit design, antenna unit/array lamination design, array layout optimization, parasitic structure loading and the like, the problem of mutual coupling among the multi-mode antennas is mainly solved, and comprehensive optimization is realized. The high-efficiency wave beam control technology adopts a special ASIC technology, a high-performance bus technology and a high-speed serial-parallel conversion chip technology to realize the rapid phase distribution of a large-scale array, and adopts a conformal array wave beam control technology, a distributed wave beam control technology and a wave beam pointing accurate control technology to realize high-efficiency wave beam control. The high-integration phased array transmitting and receiving isolation technology needs to improve the space isolation between a transmitting array and a receiving array through optimization of antenna array elements and array layout, improve the out-of-band rejection capability of a transmitting and receiving antenna through the design of a miniaturized high-performance filter, carry out optimization design of the overall structure, the system architecture and the working mode of the multimode common-caliber high-integration phased array antenna, and improve the transmitting and receiving isolation of a phased array antenna system.
Phased array antenna systems most commonly implement active phased array antenna designs using "brick" structural integration. By utilizing the high-speed scanning characteristic of the active phased array antenna wave beam, the antenna has the capability of fast scanning and high gain in the wave beam coverage range, thereby meeting the requirement of high code rate transmission of a platform. For example: 2013, clift. Cole J, a "missile-borne communication link" article is published, which introduces an overview of the missile-borne communication links currently used by standard missiles, and discusses an enhanced link still in the product pre-research stage, which is a novel data link developed for both standard missiles and improved navy sparrow missiles still used on part of the U.S. navy warships. In 2016, an article of shallow analysis of application technical characteristics of satellite communication on a missile weapon system is published by the worship and the like, and the technical characteristics of the application of the satellite communication on the missile weapon system are analyzed according to the application requirements of the satellite communication on the missile weapon system. These documents mainly provide a feasibility demonstration of missile-borne communication using phased array antennas, but do not discuss related implementations of phased array antennas. In addition, a 'brick type' structural mode with relatively low integration is adopted, and the active phased array antenna is difficult to realize miniaturization and light weight design and cannot be well adapted to missile-borne application. With the rapid development of technologies associated with the electronics industry and advanced manufacturing industries, for example: the millimeter wave monolithic integrated circuit technology, the high-low frequency interconnection technology, the multifunctional integrated chip technology, the integrated packaging technology, and the like, people who developed 23428also slowly tried to realize the active phased-array antenna by adopting a tile-type structure mode of higher-density integration, and realized miniaturization, low cost and high-efficiency heat dissipation by adopting the tile-type structure integration mode. In addition, along with the development of the missile-borne platform technology, the data rate required to be transmitted shows a higher and higher development trend, and for this reason, the missile-borne communication device needs to have a high Equivalent Isotropic Radiation Power (EIRP) and a high reception Gain/Equivalent Temperature ratio (G/T) so as to meet the electrical performance use requirement of a high communication rate. Meanwhile, as an antenna working on a missile, the antenna needs to be designed in a miniaturized, light and low power consumption manner so as to meet the installation and use requirements of the platform. To meet this high performance requirement, the main technical approach is to use high gain active phased array antennas. But the area that a single array beam of a single tile type active phased array antenna can cover is limited.
In addition, under the complex electromagnetic environment of modern battlefield emphasizing informatization combined combat, active interference and passive interference of various forms exist simultaneously, and higher requirements are put on the anti-interference performance of wireless communication data chains. Frequency hopping communication gradually becomes a main anti-interference communication means by virtue of the inherent advantage of rapid frequency conversion, and is widely applied to a communication data link system. The frequency hopping communication adopts a mode that the frequency of a carrier signal changes pseudo-randomly and constantly to carry out spread spectrum communication, and can be used for realizing the anti-interference function of a wireless communication data link. The frequency synthesizer is a core component of an anti-interference data link terminal in the frequency hopping communication system and is used for providing carrier frequency signals, and the bandwidth range and the frequency point conversion rate of output signals of the carrier frequency signals greatly influence the anti-interference capacity of a wireless communication data link. However, there is no established solution for combining frequency hopping communications with active phased array antenna technology.
In summary, the missile-borne communication reported in domestic and foreign documents at present is mainly realized by using a passive antenna or an antenna array, and has low gain, a blind zone covered by a wave beam, poorer performances of an emission equivalent omnidirectional radiation power value (EIRP) and a reception gain/equivalent temperature ratio (G/T), and can only be applied to the transmission of data such as simple remote measurement, control and the like.
The high-gain and high-bandwidth phased array antenna scheme can be used for realizing high-transmission-rate missile-borne communication, but no integrated radio frequency assembly technical scheme is determined in terms of missile-borne data communication aiming at requirements on ultra-long distance communication, omnidirectional beam coverage, communication frequency hopping anti-interference and the like.
Disclosure of Invention
In view of this, the invention provides an omnidirectional electrical scanning radio frequency assembly with a missile-borne frequency hopping communication system, which has a small volume, a long communication distance, omnidirectional beam coverage and frequency hopping anti-interference capability.
In order to solve the above-mentioned technical problems, the present invention has been achieved as described above.
A missile-borne frequency hopping communication system omnidirectional electronic scanning radio frequency assembly comprises: three active phased array sub-array modules and a frequency synthesizer;
the frequency synthesizer provides local oscillation signals, control signals and power supplies for the active phased array sub-array module;
the active phased array sub-array module adopts a tiled flat plate integrated structure and integrates an active phased array antenna array surface, a circuit board of a high-speed frequency hopping transceiving frequency conversion channel electrically connected with the active phased array antenna array surface and a circuit board of a beam controller; the active phased array antenna array surface comprises an antenna radiation unit, a multilayer comprehensive wiring medium substrate containing a power division feed network and a multifunctional transceiving chip set; the active phased array subarray module takes a high-heat-conductivity metal box body as a structural foundation, and provides a heat dissipation structure, a circuit board mounting surface and a mounting groove, a printed board is mounted inside the box body to realize interconnection and external interconnection among devices, and the box body realizes cross-box body connection among the devices/circuit boards through holes;
the three active phased array subarray modules are uniformly distributed on the cylinder wall of the cylinder type missile-borne radome, and under the common control of the frequency synthesizer and the beam controllers of the three active phased array subarray modules, the three beams are electrically scanned simultaneously, and the capability of covering 360 degrees is achieved.
Preferably, the active phased array sub-array module is:
the active phased array sub-array module takes a high-heat-conductivity metal box body as a structural foundation; the circuit board of the high-speed frequency hopping transceiving frequency conversion channel and the circuit board of the wave beam controller are arranged in parallel in the cavity below the high-heat-conductivity metal box body from left to right, and are connected with corresponding external interconnection connectors and other parts through printed board jumpers in the cavity; the upper surface of the high-heat-conductivity metal box body is provided with a groove, and a multifunctional transceiving chip set is arranged in the groove; the multilayer comprehensive wiring medium substrate is arranged on the upper surface of the high-heat-conductivity metal box body;
the upper surface of the multilayer comprehensive wiring medium substrate is embedded with an antenna radiation unit, and a power distribution feed network is connected inside the substrate; the power division feed network adopts a first SMP joint welded on the substrate for the externally interconnected high-frequency connector, and the power division feed network interconnects radio-frequency signals with the high-speed frequency hopping receiving-transmitting frequency conversion channel circuit board through an SMP-KK joint and a second SMP joint welded at the groove of the high-heat-conductivity metal box body; the low-frequency connector of the power distribution feed network, which is interconnected outwards, is arranged on the right side of the multilayer comprehensive wiring medium substrate and is interconnected with the low-frequency connector on the wave beam controller circuit board through the structural windowing on the right side of the high-heat-conductivity metal box body.
Preferably, the frequency synthesizer is connected with the three active phased array sub-array modules through three 2.92mm radio frequency connecting cables, so that transmission of high-speed frequency hopping local oscillation signals is realized; the three active phased array sub-array modules are connected through three J30J connecting cables, and transmission of control signals and power supplies is achieved.
Preferably, at the time of transmission, for the control section: the frequency synthesizer receives a control signal from the outside, generates beam pointing information according to the control signal and sends the beam pointing information to the three active phased array sub-array modules; the FPGA of the wave beam controller in each active phased array sub-array module calculates in real time to obtain the wave beam direction corresponding to the active phased array antenna array surface, converts the wave beam direction into phase data required by the multifunctional transceiver chip, sends the phase data to the multi-layer comprehensive wiring medium substrate through the low-frequency connector, and sends the phase data to the multifunctional transceiver chip through comprehensive wiring in the substrate; the multifunctional transceiver chip completes the control of transmitting radio frequency signals and realizes the synchronous electric scanning function of active phased array transmitting beams;
for the radio frequency part: the SMA connector of the high-speed frequency hopping transceiving frequency conversion channel receives the modulated intermediate frequency signal, performs up-conversion processing on the modulated intermediate frequency signal to obtain a radio frequency signal, and the up-converted local oscillator signal is generated by the frequency synthesizer and is sent to the high-speed frequency hopping transceiving frequency conversion channels of each active phased array sub-array module; and the radio frequency signal is transmitted to the active phased array antenna array surface through the second SMP connector, the SMP-KK connector and the first SMP connector of the active phased array antenna array surface, is subjected to power division feeding through a power division feeding network in the multilayer comprehensive wiring medium substrate, is transmitted to the multifunctional transceiving chip for corresponding processing, and is transmitted to the outside through the antenna radiation unit.
Preferably, in each active phased array sub-array module, the wave beam scanning range of an active phased array antenna array surface is +/-60 degrees, the antenna radiation unit comprises 64 array elements, and 16 multifunctional transceiver chips form a multifunctional transceiver chip set; the number of array elements of the whole omnidirectional electrical scanning radio frequency component is 3 × 64=192, the working center frequency of the component is 28G, the working bandwidth is 6GHz, and the instantaneous bandwidth is 20MHz.
Preferably, the high-speed frequency hopping transceiving frequency conversion channel comprises a first radio frequency switch, a second radio frequency switch, a third radio frequency switch, a fourth radio frequency switch, a first PA amplifier, a first attenuator, a second attenuator, a mixer, a first filter, a second PA amplifier, a second filter, a first LNA, a second LNA, a third filter, and a fourth filter;
when transmitting signals, the intermediate frequency signals enter a high-speed frequency hopping transceiving frequency conversion channel, are connected with a first PA amplifier through a first radio frequency switch, are amplified and then sent to a second radio frequency switch, are connected to a frequency mixer through a first attenuator, generate radio frequency signals of K and Ka frequency bands after being mixed with a high-speed frequency hopping local oscillator, are sent to a third radio frequency switch through a second attenuator and a second filter, are amplified by a second PA amplifier and then filtered by a third filter, are sent to a fourth radio frequency switch, and are output and sent to an active phased array antenna array surface;
when receiving signals, the radio-frequency signals of K and Ka frequency bands from the array surface of the active phased array antenna are sent to a fourth radio-frequency switch, amplified by a fourth filter and a first LNA and sent to a mixer by a second filter and a second attenuator, mixed with a high-speed frequency hopping local oscillator to generate intermediate-frequency signals, sent to a second radio-frequency switch by a first attenuator, amplified by a second LNA and a VGA amplifier, filtered by the first filter and sent to the first radio-frequency switch, and then output.
Preferably, the beam controller adopts a hardware architecture of FPGA + Flash; after electrification, the compensation data in the Flash is loaded into the FPGA immediately, calling is carried out once every time of electrification, and data calling is directly carried out from the FPGA during later-stage calculation; after receiving a beam switching command, resolving amplitude-phase data through data analysis and protocol conversion; after the resolving is finished, data are transmitted to the multifunctional transceiving chip through SPI serial port communication, temporarily stored in a cache of the multifunctional transceiving chip, and a beam updating instruction is waited to arrive; when the beam updating instruction comes, the multifunctional transceiver chip directly updates the internal register by using the data in the cache to realize beam switching.
Preferably, the frequency synthesizer is disposed in the metal housing, and the external interface includes:
the first frequency synthesizer J30J connector is an external control signal and power supply interface of the component;
the second frequency synthesizer J30J connector, the third frequency synthesizer J30J connector and the fourth frequency synthesizer J30J connector are control signals and power interfaces in a pair respectively connected with the three active phased array sub-array modules;
the SMA connector is an input interface of the 100MHz reference clock of the assembly;
the 2.92mm joint of the first frequency synthesizer, the 2.92mm joint of the second frequency synthesizer and the 2.92mm joint of the third frequency synthesizer are output interfaces of high-speed frequency hopping local oscillator signals in pairs respectively connected with the three active phased array sub-array modules, the second active phased array sub-array module and the third active phased array sub-array module.
Preferably, the frequency synthesizer comprises an FPGA control circuit, a clock distribution module, a PLL, a DDS, a frequency synthesizer local oscillator amplifying circuit, a local oscillator filtering module, a frequency synthesizer low-frequency amplifying circuit, a low-frequency filtering module, a frequency mixing module, a radio frequency filtering module, a frequency 2 doubling module, a frequency synthesizer radio frequency amplifying circuit and a module of dividing three;
the clock distribution module provides clock signals for the PLL and the DDS module;
the FPGA control circuit controls the PLL to generate a local oscillation signal according to the control signal, and the DDS generates a low-frequency signal; the local oscillation signal enters a frequency synthesis local oscillation amplifying circuit and a local oscillation filtering module to be amplified and filtered to obtain a first signal; the low-frequency signal enters a frequency synthesis low-frequency amplifying circuit, and a low-frequency filtering module performs amplification and filtering to obtain a second signal; the frequency mixing module carries out frequency mixing on the first signal and the second signal, and the first signal and the second signal are divided into three paths after being filtered, multiplied and amplified by the radio frequency filtering module, the frequency multiplication module 2 and the frequency synthesis radio frequency amplifying circuit and serve as local oscillation signals of the three active phased array sub-array modules.
Preferably, the power dividing feed network adopts a Wilkinson power divider designed by a strip line, and the isolation resistor of the power dividing feed network adopts a buried resistance process.
Has the advantages that:
(1) The missile-borne frequency hopping communication system omnidirectional electric scanning radio frequency assembly provided by the invention provides a scheme for realizing small volume, long communication distance, omnidirectional beam coverage and frequency hopping anti-interference capability through the integrated structural design of the tile-shaped flat plate of the active phased array subarray module under the condition of very small missile-borne environment.
(2) The active phased array subarray module takes the high-heat-conduction metal box body as a structural foundation, not only is a heat dissipation structure provided, but also a circuit board installation surface and installation grooves are provided, a printed board is installed inside the box body to achieve interconnection and external interconnection between devices, and the box body achieves cross-box body connection between the devices/circuit boards through holes.
Active phased array subarray module make full use of the surface of box body, inner space and open pore structure, realize the compact installation of subarray module component, reduce the volume of subarray module, and do not influence the interconnection, avoid independently walking the line, the signal transmission problem that the line brought is walked to the outside, the problem of electromagnetic interference and the receiving problem of the weak signal of Ka frequency channel has effectively been solved, and external interface only has power supply control interface and radio frequency interface, it is nimble to have the module configuration, the function is abundant, the simple advantage of external interface, be particularly suitable for having nimble beam configuration, compact volume's missile-borne service environment.
In addition, each module is relatively independent, and high module-level testability and maintainability can be achieved. Therefore, the active phased array sub-array module can also be widely applied to wide-band communication electronic technology systems such as missile-borne communication systems, navigation systems, radars, 5G and the like.
(3) The three active phased array subarray modules are uniformly distributed on the cylinder wall of the cylinder type missile-borne antenna cover, and under the control of the frequency synthesizer, three beams can be electrically scanned at the same time, so that the capability of covering 360 degrees is provided.
(4) The high-speed frequency hopping receiving and transmitting frequency conversion channel can perform frequency hopping and mixing on the high-speed hopping local oscillation signal and the intermediate frequency signal, so as to realize high-speed frequency hopping modulation on communication data; in addition, the received radio frequency signal and the local oscillator signal hopping at high speed can be subjected to frequency hopping and mixing, so that the radio frequency signal is subjected to 'hopping' processing; the above functions are the hardware basis for realizing the frequency hopping anti-interference function of the wireless communication data link.
(5) The frequency synthesizer can generate a high-speed hopping local oscillator signal with frequency hopping time less than 1us, and the high-speed hopping local oscillator signal is amplified and power-divided to generate 3 paths of coherent high-speed hopping local oscillator signals, which are key signals for realizing the frequency hopping anti-interference function of a wireless communication data chain.
(6) The power dividing feed network adopts a Wilkinson power divider designed by strip lines, adopts a buried resistance process, and has good electrical properties such as low standing wave, high amplitude phase consistency, high isolation and the like. Due to the special laminating structure and the fact that metal through holes are punched on the periphery of the printed board to prevent electromagnetic leakage interference, the shielding box is omitted, and the power divider has the advantages of being compact in structure, light in weight and simple in processing.
Drawings
Fig. 1 is a schematic structural diagram of an omnidirectional electronic scanning radio frequency assembly of a missile-borne frequency hopping communication system according to the present invention;
FIG. 2 is a schematic diagram of an omnidirectional electrical scanning radio frequency assembly of a missile-borne frequency hopping communication system according to the present invention;
FIG. 3 is a schematic diagram of the operation of an active phased array antenna;
fig. 4 is a schematic structural diagram of a single subarray module of a missile-borne frequency hopping communication system omnidirectional electrical scanning radio frequency assembly according to the present invention;
FIG. 5 is a schematic diagram of the operation of the high-speed frequency hopping transceiving frequency conversion channel in the sub-array module of FIG. 4;
fig. 6 is a schematic diagram of the operation of the beam controller in the sub-array module of fig. 4;
fig. 7 is a schematic structural diagram of a frequency synthesizer in an omnidirectional electrical scanning radio frequency assembly of a missile-borne frequency hopping communication system according to the present invention;
FIG. 8 is a schematic diagram of the operation of a frequency synthesizer in the omnidirectional electronic scanning radio frequency assembly of the missile-borne frequency hopping communication system of the present invention;
fig. 9 is a schematic diagram of a feed network in an active phased array antenna array plane in an omnidirectional electrical scanning radio frequency assembly of a missile-borne frequency hopping communication system according to the present invention;
fig. 10 is a directional diagram of the single sub-array module transmitting beam of the omnidirectional electric scanning radio frequency assembly of the missile-borne frequency hopping communication system of the present invention at different scanning angles;
fig. 11 is a directional diagram of a single sub-array module receiving beam at different scanning angles of a missile-borne frequency hopping communication system omnidirectional electronic scanning radio frequency assembly according to the present invention;
in the figure: 1 first active phased array sub-array module, 1-1 first active phased array antenna array surface, 1-2 first high-speed frequency hopping transceiving frequency conversion channels, 1-3 first wave beam controllers, 2 second active phased array sub-array modules, 2-1 second active phased array antenna array surface, 2-2 second high-speed frequency hopping transceiving frequency conversion channels, 2-3 second wave beam controllers, 3 third active phased array sub-array modules, 3-1 third active phased array antenna array surfaces, 3-2 third high-speed frequency hopping transceiving frequency conversion channels, 3-3 third wave beam controllers, 10 frequency synthesizers, 11 multi-layer comprehensive wiring medium substrates, 12 multifunctional transceiving chip sets, 13 power division feed networks, 14 SMP joints of active phased array antenna array surfaces, 15-KK joints, 16 high-heat-conductivity metal box bodies 17SMP joint, 18SMA joint (female), 19.92mm joint (female), 20 active phased array antenna array low frequency (male) connector, 21 low frequency (female) connector on the beam controller, 22 high-speed frequency hopping transceiving frequency conversion channel circuit board, 23 beam controller circuit board, 24 beam controller J30J (female), 25 multifunctional transceiving chip, 26 antenna radiating element, 27 missile-borne radome, 28 first beam, 29 second beam, 30 third beam, 31 first frequency synthesizer J30J (female), 32 second frequency synthesizer J30J (female), 33 third frequency synthesizer J30J (female), 34 fourth frequency synthesizer J30J (female), 35, first frequency synthesizer 2.92mm joint (female), 36 second frequency synthesizer 2.92mm joint (female), A 37 third frequency synthesizer 2.92mm connector (female), a 38 frequency synthesizer SMA connector (female), a 39 antenna circular polarization feed network and a 40 cover plate.
Detailed Description
The invention provides a missile-borne frequency hopping communication system omnidirectional electric scanning radio frequency assembly which comprises three active phased array sub-array modules and a frequency synthesizer. The frequency synthesizer provides local oscillation signals, control signals and power supplies for the active phased array sub-array module. The active phased array sub-array module is a key design object, adopts a tile-shaped flat plate integrated structure, and integrates an active phased array antenna array surface, a circuit board of a high-speed frequency hopping transceiving frequency conversion channel electrically connected with the active phased array antenna array surface and a circuit board of a beam controller. The active phased array antenna array surface comprises antenna radiation units, a multilayer comprehensive wiring medium substrate containing a power dividing feed network and a multifunctional transceiving chip set. In order to solve the miniaturization and heat dissipation problems, the active phased array sub-array module takes a high-heat-conduction metal box body as a structural foundation, a heat dissipation structure, a circuit board installation surface and a mounting groove are provided, a printed board is installed inside the box body to achieve interconnection and external interconnection between devices, and the box body achieves cross-box body connection between the devices/the circuit boards through holes.
The three active phased array sub-array modules are uniformly distributed on the cylinder wall of the cylinder type missile-borne antenna housing 27, and under the common control of the frequency synthesizer and the beam controllers of the three active phased array sub-array modules, the capacity of simultaneously electrically scanning three beams to cover 360 degrees is realized.
The invention is described in detail below with reference to the drawings and preferred embodiments.
Referring to fig. 1 and 2, fig. 1 is a schematic diagram of an omnidirectional electrical scanning radio frequency device of a missile-borne frequency hopping communication system in this embodiment. Fig. 2 shows the electrical connection of the important components of the assembly. As shown, the omnidirectional electric scanning radio frequency assembly includes a first active phased array sub-array module 1, a second active phased array sub-array module 2, a third active phased array sub-array module 3, and a frequency synthesizer 10. The frequency synthesizer adopts three 2.92mm radio frequency connecting cables and three J30J connecting cables to realize high-low frequency interconnection with the first active phased array sub-array module, the second active phased array sub-array module and the third active phased array sub-array module. The 2.92mm radio frequency connection cable realizes the transmission of high-speed frequency hopping local oscillation signals; the J30J connection cable realizes the transmission of control signals and power supply. In this embodiment, each subarray module comprises 64 channels, each 4 channels has 1 independent multifunctional transceiver chip, the 64 channels share 16 multifunctional transceiver chips, and the three subarrays are connected to the frequency synthesizer.
Referring to fig. 2, the high-speed frequency modulation transceiving frequency conversion channels 1-2,2-2,3-2, the beam controllers 1-3,2-3,3-3, and the antenna array surfaces 1-1,2-1,3-1 in fig. 2 constitute three active phased array sub-array modules. They are connected in common to a frequency synthesizer. The frequency synthesizer receives a reference clock, a control signal and a power supply from the outside. According to the reference clock, under the control of the control signal, a local oscillation signal is generated and provided for the high-speed frequency modulation receiving and transmitting frequency conversion channels of the three active phased array sub-array modules. While beam control signals are generated and provided to the beam controller.
See fig. 3. Fig. 3 is a block diagram of the elements of the active phased array antenna element of fig. 2. The active phased array antenna array surface adopts a scheme of welding a multifunctional transceiving chip set by adopting an integrated multilayer medium printed board with high integration level. As shown, the following are sequentially from top to bottom: a microstrip patch antenna array composed of 64 antenna radiation units 26, an antenna circular polarization feed network 39, a multifunctional transceiving chip set and a power division feed network 13. In order to improve the integration level of the whole phased array antenna array surface, the internal interconnection mode is completed by printed board wiring, the low-frequency connector of the external interconnection adopts a 60 core board to board connector of a 5690 series of surface mounting welding, the distance is 0.635mm, the plug connector is vertical, the interconnection with the beam controller is realized, the high-frequency connector of the external interconnection adopts an SMP connector of embedded welding, and the SMP connector is connected with a high-speed frequency hopping receiving and transmitting frequency conversion channel through an SMP-KK connector.
Referring to fig. 4, fig. 4 shows a structural diagram of an active phased array sub-array module adopting an integrated design. The structure adopts a tiling flat plate integrated structure, can reduce the size, gives consideration to heat dissipation and effective signal transmission, and integrates an active phased array antenna array surface, a circuit board 22 of a high-speed frequency hopping transceiving frequency conversion channel electrically connected with the active phased array antenna array surface and a circuit board 23 of a beam controller. The active phased array antenna array comprises 64 antenna radiation units 26, a multilayer comprehensive wiring medium substrate 11 (including a power division feed network), an SMP joint 14 of the active phased array antenna array, an active phased array antenna array low-frequency (male) connector 20 and a multifunctional transceiving chip set.
The above components are all mounted on the structural base of the high thermal conductivity metal can 16. Referring to the lower part of fig. 4, the circuit board 22 of the high-speed frequency hopping transceiving frequency conversion channel and the circuit board 23 of the beam controller are installed in parallel in the left and right in a cavity below the high-heat-conductivity metal box body, and the transmission of radio-frequency signals, local oscillation signals and intermediate-frequency signals is respectively realized through coaxial SMP vertical interconnection, coaxial 2.92mm horizontal interconnection and coaxial SMA horizontal interconnection structures. The high-speed frequency hopping transceiving frequency conversion channel is connected with the wave beam controller through a printed board jumper wire in the cavity.
Referring to the middle upper part of fig. 4, a groove is formed on the upper surface of the high heat-conducting metal box body, and a multifunctional transceiver chip set 12 is installed in the groove; the multilayer comprehensive wiring medium substrate 11 is tightly installed on the upper surface of the high-heat-conductivity metal box body through via holes in the printed board, and heat generated by the multifunctional transceiving chip set is conducted to heat dissipation teeth around the box body through the box body to achieve heat balance.
The antenna radiation unit 26 is embedded in the upper surface of the multilayer integrated wiring dielectric substrate 11, and a power division feed network is connected to the inside of the substrate. The power division feed network adopts an SMP joint 14 welded on the substrate for the externally interconnected high-frequency connector, and the SMP-KK joint 15 and an SMP joint 17 welded at the groove of the high-heat-conductivity metal box body are interconnected with the high-speed frequency hopping receiving and transmitting frequency conversion channel circuit board to carry out radio-frequency signal interconnection. The low-frequency (male) connector 20 of the power distribution feed network which is interconnected outwards is arranged on the right side of the multilayer comprehensive wiring medium substrate and is interconnected with the low-frequency (female) connector 21 on the wave beam controller circuit board through the structural windowing on the right side of the high-heat-conductivity metal box body. The high-speed frequency hopping transceiving frequency conversion channel and the beam controller are arranged in a cavity below the high-heat-conductivity metal box body. A J30J (female) connector 24 mounted on the high thermal conductivity metal box is connected to the beam controller by intra-cavity bond wires to complete the interconnection with the frequency synthesizer. The cover plate 40 is welded to the bottom of the high thermal conductivity metal box by a laser welding process to complete the sealing of the metal box. The subarray module can adopt a laser sealing welding process, and the reliability and maintainability of the subarray module are improved.
When transmitting, the control part receives a corresponding control signal through a control circuit of the frequency synthesizer, processes the control signal according to the content of the control signal and then sends beam pointing information to the three sub-array modules, the FPGA of the beam controller in each sub-array module calculates in real time to obtain the beam pointing of the active phased array antenna array surface of the corresponding sub-array module, the beam pointing of the active phased array antenna array surface is controlled by the beam controller and is converted into phase data required by the multifunctional transceiver chip, the phase data is sent to the multilayer comprehensive wiring medium substrate through a low-frequency (mother) connector on the beam controller and is sent to the multifunctional transceiver chip through comprehensive wiring in the substrate, the multifunctional transceiver chip finishes the control of transmitting radio-frequency signals, and the synchronous electric scanning function of transmitting beams by the active phased array is realized; the radio frequency part carries out up-conversion processing on a modulated intermediate frequency signal input by an SMA joint (mother) of a high-speed frequency hopping receiving and transmitting frequency conversion channel, the up-converted high-speed frequency hopping local oscillator signal is generated by a frequency synthesizer and is sent to the high-speed frequency hopping receiving and transmitting frequency conversion channels of each sub-array, the modulated intermediate frequency signal is converted into a radio frequency signal after up-conversion, the radio frequency signal is sent to an active phased array antenna array surface through the SMP joint, the SMP-KK joint and an SMP joint of the active phased array antenna array surface, and the radio frequency signal is subjected to power division feeding through a power division feeding network in a multilayer comprehensive wiring medium substrate, is sent to a multifunctional receiving and transmitting chip for corresponding processing and is transmitted to the outside through an antenna radiation unit; under the common control of the frequency synthesizer and the beam controllers of the three active phased array sub-array modules, the capacity of simultaneously electrically scanning three beams to cover 360 degrees can be realized; similarly, the control circuit of the frequency synthesizer receives corresponding opposite control signals to complete the signal reception.
The specific embodiment is based on a 24 GHz-30 GHz eight-channel multifunctional transceiver chip, an electric scanning active phased array controlled by a tile type framework mode is adopted, the number of array elements of the component is 3 multiplied by 64=192, the working center frequency of the component is 28G, the working bandwidth is 6GHz, the instantaneous bandwidth is 20MHz, the scanning range of a wave beam of a single active phased array antenna array surface is +/-60 degrees, and the polarization mode is as follows: circular polarization. Each active phased array sub-array module comprises 64 channels, 16 multifunctional transceiving chips are integrated, after a radio frequency component receives three paths of intermediate frequency transmitting signals, the three paths of intermediate frequency transmitting signals are subjected to up-conversion through three high-speed frequency hopping transceiving frequency conversion channels and then output three paths of radio frequency signals to be sent to three active phased array antenna array surfaces through a radio frequency interface, the radio frequency signals of each array surface are divided into 16 paths of signals through a power division feed network and then sent to a multifunctional transceiving chipset, the multifunctional transceiving chipset sends 16 x 8=128 paths of signals to an antenna circular polarization feed network under the control of a beam controller and then completes the transmission of the signals through 64 antenna radiation units, the omnidirectional electric scanning of transmitting beams of the phased array antennas is realized, the 360-degree electric scanning and high-speed frequency hopping functions of the three array surfaces can be realized, and the receiving function is opposite to the transmitting function.
See fig. 5. Fig. 5 shows a schematic diagram of high-speed frequency hopping transceiving frequency conversion channels. As shown in the figure, the high-speed frequency hopping transceiving frequency conversion channel comprises a first radio frequency switch, a second radio frequency switch, a third radio frequency switch, a fourth radio frequency switch, a first PA amplifier, a first attenuator, a second attenuator, a mixer, a first filter, a second PA amplifier, a second filter, a first LNA, a second LNA, a third filter and a fourth filter;
when transmitting signals, the intermediate frequency signals enter a high-speed frequency hopping transceiving frequency conversion channel, are connected with a first PA amplifier through a first radio frequency switch, are amplified and then are sent to a second radio frequency switch, are connected to a frequency mixer through a first attenuator, generate radio frequency signals of K and Ka frequency bands after being mixed with a high-speed frequency hopping local oscillator, are sent to a third radio frequency switch through a second attenuator and a second filter, are amplified by a second PA amplifier and then are filtered by a third filter, and are sent to a fourth radio frequency switch and then are output to an active phased array antenna array face.
When receiving signals, the radio frequency signals of K and Ka frequency bands from the active phased array antenna array surface are sent to a fourth radio frequency switch, amplified by a fourth filter and a first LNA and then sent to a third radio frequency switch, and sent to a mixer by a second filter and a second attenuator, mixed with a high-speed frequency hopping local oscillator to generate intermediate frequency signals, sent to a second radio frequency switch by a first attenuator, amplified by a second LNA and a VGA amplifier, filtered by a first filter and sent to the first radio frequency switch and then output.
See fig. 6. Fig. 6 shows a block diagram of a beam controller. As shown in the figure, the beam controller receives a control signal from the frequency synthesizer through J30J (mother), and the hardware architecture is realized by adopting a combination mode of FPGA + Flash. The method is realized by adopting a centralized resolving mode, compensation data in the Flash are loaded into the FPGA immediately after the array surface is electrified, the data are called once when the array surface is electrified, and the data are directly called from the FPGA during later resolving. After receiving the wave beam switching instruction of the array surface, the amplitude and phase data are resolved by the resolving module through data analysis and protocol conversion. After resolving is completed, data are transmitted to the multifunctional chip through SPI serial communication and temporarily stored in a register inside the multifunctional chip to wait for a beam updating command. And directly updating the data in the cache to a final register after the instruction arrives to realize beam switching.
See fig. 7. Fig. 7 shows an external configuration of the beam controller. Frequency synthesizer sets up in metal casing, and external interface includes: the first frequency synthesizer J30J (female) connector is an external control signal and power interface of the component; the second frequency synthesizer J30J (mother), the third frequency synthesizer J30J (mother) and the fourth frequency synthesizer J30J (mother) are control signals and power interfaces in pairs respectively connected with the first active phased array sub-array module, the second active phased array sub-array module and the third active phased array sub-array module. The frequency synthesizer SMA connector (mother) is the input interface of the 100MHz reference clock of the assembly. The 2.92mm joint (mother) of the first frequency synthesizer, the 2.92mm joint (mother) of the second frequency synthesizer and the 2.92mm joint (mother) of the third frequency synthesizer are output interfaces of the high-speed frequency hopping local oscillator signals in pairs, and the output interfaces are respectively connected with the first active phased array sub-array module, the second active phased array sub-array module and the third active phased array sub-array module.
See fig. 8. Fig. 8 is a schematic diagram of a frequency synthesizer. As shown in the figure, the frequency synthesizer adopts an FPGA control method, realizes a miniaturized design of the frequency synthesizer based on a high-density integration and wiring technology, generates 3 paths of high-speed frequency hopping local oscillator signals required by the components, analyzes and distributes control signals received by the components to each active phased array sub-array module, processes input power and distributes the processed power to each active phased array sub-array module. Specifically, the frequency synthesizer comprises an FPGA control circuit, a clock distribution module, a PLL, a DDS, a frequency synthesis local oscillator amplification circuit, a local oscillator filtering module, a frequency synthesis low-frequency amplification circuit, a low-frequency filtering module, a frequency mixing module, a radio-frequency filtering module, a frequency multiplication module 2, a frequency synthesis radio-frequency amplification circuit and a one-to-three module.
The clock distribution module provides clock signals for the PLL and the DDS module;
the FPGA control circuit controls the PLL to generate a local oscillation signal according to the control signal, and the DDS generates a low-frequency signal; the local oscillation signal enters a frequency synthesis local oscillation amplifying circuit and a local oscillation filtering module to be amplified and filtered to obtain a first signal; the low-frequency signal enters a frequency synthesis low-frequency amplifying circuit, and a low-frequency filtering module carries out amplification and filtering to obtain a second signal; the frequency mixing module carries out frequency mixing on the first signal and the second signal, and the first signal and the second signal are divided into three paths after being filtered, multiplied and amplified by the radio frequency filtering module, the frequency multiplication module 2 and the frequency synthesis radio frequency amplifying circuit and serve as local oscillation signals of the three active phased array sub-array modules.
In this embodiment, the PLL uses TI LMX2594, which has an output frequency in the range of 10MHz-15GHz. The DDS adopts CX8242 chip of city core science and technology, supports: transmission frequency range: 10 MHz-6000 MHz, support fast frequency hopping: is less than 1us. The power module adopts a high-efficiency DCDC converter to realize higher power efficiency.
See fig. 9. The power distribution feed network adopts a Wilkinson power divider designed by strip lines, and the isolation resistor of the power distribution feed network adopts a buried resistor process, so that the power distribution feed network has the characteristics of small volume and high reliability. When in transmission, K and Ka frequency band radio frequency signals are input by an SMP joint of an active phased array antenna array surface, and are fed to the multifunctional transceiving chip after passing through a power division feed network of 1. The receive function is the reverse of the transmit function.
Through actual processing tests, the size of a single active phased array sub-array module in the radio frequency assembly is as follows: 130mm × 65mm × 40mm, weight: 570g of a basic material; size of frequency synthesizer: 200mm × 120mm × 21mm, weight: 950g, the whole assembly has the characteristics of small volume and light weight. The active phased array sub-array module of the radio frequency assembly can realize +/-60-degree beam scanning, the EIRP is more than or equal to 53dBm, the G/T value is more than or equal to-15 dB/K, the normal side lobe level is less than or equal to-12 dB, and the radio frequency assembly has good electrical performance. The three subarrays can better realize the omnidirectional 360-degree beam coverage capability under the common work. The results of the beam testing of the individual subarrays are shown in fig. 10 and 11.
The above embodiments only describe the design principle of the present invention, and the shapes and names of the components in the description may be different without limitation. Therefore, a person skilled in the art of the present invention can modify or substitute the technical solutions described in the foregoing embodiments; such modifications and substitutions do not depart from the spirit and scope of the present invention.
Claims (10)
1. A missile-borne frequency hopping communication system omnidirectional electrical scanning radio frequency assembly is characterized by comprising: three active phased array sub-array modules and a frequency synthesizer;
the frequency synthesizer provides a local oscillation signal, a control signal and a power supply for the active phased array sub-array module;
the active phased array sub-array module adopts a tiled flat plate integrated structure and integrates an active phased array antenna array surface, a circuit board of a high-speed frequency hopping transceiving frequency conversion channel electrically connected with the active phased array antenna array surface and a circuit board of a beam controller; the active phased array antenna array surface comprises an antenna radiation unit, a multilayer comprehensive wiring medium substrate containing a power division feed network and a multifunctional transceiving chip set; the active phased array sub-array module takes a high-heat-conductivity metal box body as a structural foundation, a heat dissipation structure, a circuit board mounting surface and a mounting groove are provided, a printed board is mounted in the box body to realize interconnection between devices and external interconnection, and the box body realizes cross-box body connection between the devices/the circuit boards through holes;
the three active phased array subarray modules are uniformly distributed on the cylinder wall of the cylinder type missile-borne radome, and under the common control of the frequency synthesizer and the beam controllers of the three active phased array subarray modules, the three beams are electrically scanned simultaneously, and the capability of covering 360 degrees is achieved.
2. The missile-borne frequency hopping communication system omnidirectional electrical scanning radio frequency assembly of claim 1, wherein the active phased array sub-array module is:
the active phased array subarray module takes a high-heat-conductivity metal box body as a structural foundation; the circuit board of the high-speed frequency hopping transceiving frequency conversion channel and the circuit board of the wave beam controller are arranged in parallel in the cavity below the high-heat-conductivity metal box body from left to right, and are connected with corresponding external interconnection connectors and other parts through printed board jumpers in the cavity; the upper surface of the high-heat-conductivity metal box body is provided with a groove, and a multifunctional transceiving chip set is arranged in the groove; the multilayer comprehensive wiring medium substrate is arranged on the upper surface of the high-heat-conductivity metal box body;
the upper surface of the multilayer comprehensive wiring medium substrate is embedded with an antenna radiation unit, and a power division feed network is connected inside the substrate; the power division feed network adopts a first SMP joint welded on the substrate for the externally interconnected high-frequency connector, and the high-speed frequency hopping receiving-transmitting variable frequency channel circuit board is interconnected with the radio-frequency signal through the SMP-KK joint and a second SMP joint welded at the groove of the high-heat-conductivity metal box body; the low-frequency connector of the power distribution feed network which is interconnected outwards is arranged on the right side of the multilayer comprehensive wiring medium substrate and is interconnected with the low-frequency connector on the wave beam controller circuit board through the structural window on the right side of the high-heat-conductivity metal box body.
3. The missile-borne frequency hopping communication system omnidirectional electrical scanning radio frequency assembly according to claim 2, wherein the frequency synthesizer is connected with three active phased array sub-array modules through three 2.92mm radio frequency connection cables to realize transmission of high-speed frequency hopping local oscillator signals; the three active phased array sub-array modules are connected through three J30J connecting cables, and transmission of control signals and power supplies is achieved.
4. The missile-borne frequency hopping communication system omnidirectional electronic scanning radio frequency assembly of claim 2, wherein during transmission, for the control portion: the frequency synthesizer receives a control signal from the outside, generates beam pointing information according to the control signal and sends the beam pointing information to the three active phased array sub-array modules; the FPGA of the wave beam controller in each active phased array sub-array module calculates in real time to obtain the wave beam direction corresponding to the active phased array antenna array surface, converts the wave beam direction into phase data required by the multifunctional transceiver chip, sends the phase data to the multi-layer comprehensive wiring medium substrate through the low-frequency connector, and sends the phase data to the multifunctional transceiver chip through comprehensive wiring in the substrate; the multifunctional receiving and transmitting chip completes the control of transmitting radio frequency signals and realizes the synchronous electric scanning function of active phased array transmitting beams;
for the radio frequency part: the SMA connector of the high-speed frequency hopping transceiving frequency conversion channel receives the modulated intermediate frequency signal, performs up-conversion processing on the modulated intermediate frequency signal to obtain a radio frequency signal, and the up-converted local oscillator signal is generated by the frequency synthesizer and is sent to the high-speed frequency hopping transceiving frequency conversion channels of each active phased array sub-array module; and the radio frequency signal is transmitted to the active phased array antenna array surface through the second SMP connector, the SMP-KK connector and the first SMP connector of the active phased array antenna array surface, is subjected to power division feeding through a power division feeding network in the multilayer comprehensive wiring medium substrate, is transmitted to the multifunctional transceiving chip for corresponding processing, and is transmitted to the outside through the antenna radiation unit.
5. The missile-borne frequency hopping communication system omnidirectional electrical scanning radio frequency assembly according to claim 2, wherein in each active phased array subarray module, a wave beam scanning range of an active phased array antenna array surface is +/-60 degrees, an antenna radiation unit comprises 64 array elements, and 16 multifunctional transceiver chips form a multifunctional transceiver chip set; the number of array elements of the whole omnidirectional electric scanning radio frequency assembly is 3 multiplied by 64=192, the working center frequency of the assembly is 28G, the working bandwidth is 6GHz, and the instantaneous bandwidth is 20MHz.
6. The missile-borne frequency hopping communication regime omnidirectional electronic scanning radio frequency assembly of claim 2, wherein the high-speed frequency hopping transceiver frequency conversion channel comprises a first radio frequency switch, a second radio frequency switch, a third radio frequency switch, a fourth radio frequency switch, a first PA amplifier, a first attenuator, a second attenuator, a mixer, a first filter, a second PA amplifier, a second filter, a first LNA, a second LNA, a third filter, a fourth filter;
when transmitting signals, the intermediate frequency signals enter a high-speed frequency hopping transceiving frequency conversion channel, are connected with a first PA amplifier through a first radio frequency switch, are amplified and then sent to a second radio frequency switch, are connected to a frequency mixer through a first attenuator, generate radio frequency signals of K and Ka frequency bands after being mixed with a high-speed frequency hopping local oscillator, are sent to a third radio frequency switch through a second attenuator and a second filter, are amplified by a second PA amplifier and then filtered by a third filter, are sent to a fourth radio frequency switch, and are output and sent to an active phased array antenna array surface;
when receiving signals, the radio-frequency signals of K and Ka frequency bands from the array surface of the active phased array antenna are sent to a fourth radio-frequency switch, amplified by a fourth filter and a first LNA and sent to a mixer by a second filter and a second attenuator, mixed with a high-speed frequency hopping local oscillator to generate intermediate-frequency signals, sent to a second radio-frequency switch by a first attenuator, amplified by a second LNA and a VGA amplifier, filtered by the first filter and sent to the first radio-frequency switch, and then output.
7. The missile-borne frequency hopping communication system omnidirectional electronic scanning radio frequency assembly according to claim 2, wherein the beam controller adopts a hardware architecture of FPGA + Flash; after electrification, the compensation data in the Flash is loaded into the FPGA immediately, calling is carried out once every time of electrification, and data calling is directly carried out from the FPGA during later-stage calculation; after receiving a beam switching command, resolving amplitude-phase data through data analysis and protocol conversion; after resolving is completed, data are forwarded to the multifunctional transceiving chip through SPI serial port communication, temporarily stored in a cache of the multifunctional transceiving chip, and a beam updating instruction is waited for; when the beam updating instruction comes, the multifunctional transceiver chip directly updates the internal register by using the data in the cache to realize beam switching.
8. The missile-borne frequency hopping communication system omnidirectional electric scanning radio frequency assembly according to claim 2, wherein the frequency synthesizer is arranged in the metal shell, and the external interface comprises:
the first frequency synthesizer J30J connector is an external control signal and power interface of the component;
the second frequency synthesizer J30J connector, the third frequency synthesizer J30J connector and the fourth frequency synthesizer J30J connector are respectively connected with the control signals and the power supply interface in the pair of the three active phased array subarray modules;
the SMA connector is an input interface of the 100MHz reference clock of the assembly;
the 2.92mm joint of the first frequency synthesizer, the 2.92mm joint of the second frequency synthesizer and the 2.92mm joint of the third frequency synthesizer are output interfaces of high-speed frequency hopping local oscillator signals in pairs, wherein the output interfaces are respectively connected with the three active phased array sub-array modules, the second active phased array sub-array module and the third active phased array sub-array module.
9. The missile-borne frequency hopping communication system omnidirectional electrical scanning radio frequency assembly of claim 8, wherein the frequency synthesizer comprises an FPGA control circuit, a clock distribution module, a PLL, a DDS, a frequency synthesizer local oscillator amplifying circuit, a local oscillator filtering module, a frequency synthesizer low-frequency amplifying circuit, a low-frequency filtering module, a frequency mixing module, a radio frequency filtering module, a frequency 2 doubling module, a frequency synthesizer radio frequency amplifying circuit and a module of one in three;
the clock distribution module provides clock signals for the PLL and the DDS module;
the FPGA control circuit controls the PLL to generate a local oscillation signal according to the control signal, and the DDS generates a low-frequency signal; the local oscillation signal enters a frequency synthesis local oscillation amplifying circuit and a local oscillation filtering module to be amplified and filtered to obtain a first signal; the low-frequency signal enters a frequency synthesis low-frequency amplifying circuit, and a low-frequency filtering module performs amplification and filtering to obtain a second signal; the frequency mixing module carries out frequency mixing on the first signal and the second signal, and the first signal and the second signal are divided into three paths after being filtered, multiplied and amplified by the radio frequency filtering module, the frequency multiplication module 2 and the frequency synthesis radio frequency amplifying circuit and serve as local oscillation signals of the three active phased array sub-array modules.
10. The omni-directional electrical scanning radio frequency assembly of the missile-borne frequency hopping communication system according to any one of claims 1 to 9, wherein the power dividing feed network adopts a Wilkinson power divider designed by a stripline, and the isolation resistor of the power dividing feed network adopts a buried resistance process.
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