CN106230465B - Millimeter wave multichannel transmitting-receiving circuit module and power division network high density integrated circuit - Google Patents
Millimeter wave multichannel transmitting-receiving circuit module and power division network high density integrated circuit Download PDFInfo
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- CN106230465B CN106230465B CN201610596270.2A CN201610596270A CN106230465B CN 106230465 B CN106230465 B CN 106230465B CN 201610596270 A CN201610596270 A CN 201610596270A CN 106230465 B CN106230465 B CN 106230465B
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
Abstract
A kind of millimeter wave multichannel transmitting-receiving circuit module disclosed by the invention and power division network high density integrated circuit, provide that a kind of cabling is compact, and low frequency control and power supply power supply are not take up the high density integrated circuit of chip and network sheaf space.The technical scheme is that：The chip attachment interface of multichannel transmitting-receiving circuit module is with power division network in same layer, and two channel transmission circuits of mirror symmetry are carried out by rectangle group battle array using 1 point of 2 power splitter, the attachment interface of amplifier chip and phase shifter chip therein is integrated in the transmission that same dielectric layer completes radiofrequency signal with power division network, prevention at radio-frequency port connects antenna element and wave control device with low frequency port by elastic touching mode, the low frequency control pin of amplifier chip and phase shifter chip on attachment interface and the pin of power supply power supply control pad (4) and power supply power supply pad (5) connections by gold wire bonding mode low frequency corresponding on medium substrate, and it is arranged toward medium substrate surrounding.
Description
Technical field
The present invention relates to a kind of millimeter wave frequencies can be used for multiple technical fields such as radar, data-link communication, satellite communication
Section multichannel transmitting-receiving circuit module and power division network high-density integration technology, the technology are suitable for millimeter wave two dimensional phased array antenna
In system.
Background technology
The increasingly crowded and light and infrared system of modern microwave frequency spectrum resource are penetrating the adverse circumstances such as flue dust, cloud and mist
With the limitation worked at night, research of the people to millimeter wave frequency band is promoted, with the development of wireless communication technique, low-frequency range
Frequency spectrum it is more and more crowded, the demand to high-quality heaped capacity wireless telecom equipment so that communication frequency be continuously improved, milli
Metric wave can efficiently solve many problems that high-speed wideband wireless access faces since its wavelength is short, bandwidth, thus short
It has a wide range of applications in distance communication.Modern advanced radar and communication system are smart in order to improve sweep speed and direction
Working frequency range is not only promoted to millimeter wave frequency band, while having abandoned tradition machinery scanning platform by degree, using phased array antenna,
Realize fast two-dimensional phased scanning.Transmitting-receiving subassembly is the core of phased array system, especially two-dimentional active phased array day
Line, integrated horizontal determine the performance and cost of whole system.Working frequency is higher, and the area of each array element is smaller, integrates
Degree requires higher.The cost of transmitting-receiving subassembly accounts for relatively high in entire phased array antenna simultaneously, and assembling procedure is various, interconnects up and down
Expend a large amount of connector and auxiliary material.
Currently, many about the document of Millimeter Wave Phased Array Antenna both at home and abroad, the composition of phased array antenna is generally divided into:It
Linear array face, transmitting-receiving subassembly module, power division network, wave control unit and power supply etc..Wherein transmitting-receiving subassembly module usually uses thin-film electro
Road or LTCC techniques, power division network use the forms such as waveguide or micro-strip, module are realized by way of connector again between the two
Interconnection.And in multichannel transmitting-receiving module and the intensive layer of power division network and interlayer cabling not only influences the power distribution of power division network
Or synthesis, it is also possible to which causing chip self-excitation that transmission-receiving function is caused to deteriorate cannot even use.Transmitting-receiving subassembly (includes transmission circuit
With multifunction chip) and important composition component of the power division network as phased array antenna, wherein transmitting-receiving subassembly it is phased for completing
The amplification and phase shift etc. of signal, power division network then complete power combing and the distribution of signal under array antenna reiving/transmitting state.Usual phase
The transmitting-receiving subassembly and power division network for controlling array antenna separately design, and are standalone module, the connection of intermodule is by connector to even shape
Formula realizes interconnection.This connection type not only increases complexity and the system loss of circuit, while longitudinal size is larger, unfavorable
In system compact, lightweight and integrated design.As phased array antenna is in the development of millimeter wave frequency band, minimize and compact
Type is the important need of phased array antenna, is badly in need of a kind of integrated technology and breaks barrier between transmission circuit and power division network, letter
Change interconnecting interface form, reduces cost of manufacture, and realized from processing and manufacturing and technique and find practicable method.
Invention content
The purpose of the present invention is shortcoming in view of the above technology, it is compact to provide a kind of cabling, small in volume, nothing
Palpus connector, low cost, low frequency control and power supply power supply are not take up chip and network sheaf space, chip can be avoided to generate self-excitation
The millimeter wave millimeter wave multichannel transmitting-receiving circuit module and power division network high density integrated circuit that equal harsh conditions occur.
To achieve the goals above, technical solution of the invention is：A kind of millimeter wave multichannel transmitting-receiving circuit module
With power division network high density integrated circuit, including：The medium substrate 3 prepared using microwave printed board is laid out on medium substrate 3
Multichannel transmitting-receiving circuit module 1 and power division network 2, and by medium substrate hole knockout formed coaxial transmission, complete to penetrate
The low-and high-frequency interface of frequency signal transmission, it is characterised in that：The chip attachment face of multichannel transmitting-receiving circuit module 1 and power division network 2
Two channel transmission circuits of mirror symmetry are subjected to rectangle group battle array in same layer, and using 1 point of 2 power splitter, power division network 2 wraps
The transition cabling for the strip line-microstrip line being connect with multichannel transmitting-receiving circuit module 1 is included, and is opened up with I-shaped strip line work(point
The form composition for flutterring structure is distributed in the group of networks array element of medium substrate 3, amplifier chip and phase shifter chip therein
Attachment interface is integrated in the transmission that same dielectric layer completes radiofrequency signal with power division network 2, and prevention at radio-frequency port and low frequency port pass through
Elastic touching mode connects antenna element and wave control device, is located at amplifier chip attachment interface 11 and phase shifter chip attachment
The pin of low frequency control pin and power supply power supply on interface 12 is corresponding on medium substrate 3 low by gold wire bonding mode
Frequency control pad 4 and power supply power supply pad 5 connections, low frequency control pad 4 and power supply power supply pad respectively by low-frequency control signal with
Power supply signal is transmitted downwards by the vertical cabling between printed board, and is arranged toward 3 surrounding of medium substrate；Medium substrate interlayer metal
Change the both sides that via is distributed in power division network cabling, forms metal insulated column 9 and the circuit trace of power division network 2 is isolated；
Thus completed in medium substrate 3 radiofrequency signal of multichannel transmitting-receiving circuit module 1 and power division network 2, low-frequency control signal and
The transmission of power supply signal and low-and high-frequency interconnection.
Power division network 2 divides topology transmission radiofrequency signal, power division network (2) and multichannel using I-shaped strip line work(
The regional area of the radio frequency pin connection of transmission circuit module (1) uses the transition cabling of strip line-microstrip line so that work(subnetting
The cabling of network 2 is locally exposed, is convenient for the cabling of power division network 2 and multichannel transmitting-receiving circuit module by the way of gold wire bonding
The radio frequency pin of amplifier, phase shifter chip in 1 is connected to；In the low-and high-frequency interface of electrical connection power division network 2, work(divides port
6 and synthesis port 7 by the vertical cabling of 3 interlayer of medium substrate respectively to the front and back of medium substrate 3, realize with it is front and back
The radio frequency of end equipment connects, and low frequency control and power interface 8 are then distributed to medium substrate 3 by the cabling of 3 interlayer of medium substrate
Surrounding,
The present invention has the advantages that compared with the prior art：
Cabling is compact.The present invention is passed through in medium substrate layer using prevention at radio-frequency port and low frequency port and interlayer completes layout
Cabling, port flexible design, form are succinct.Port 6, ingenious arrangement power division network is divided to walk using non-homogeneous periodic arrangement work(
Line, synthesis port 7 is realized by the back side of the vertical cabling between medium substrate 3 to medium substrate 3 to be connected with the radio frequency of rear end equipment
It connects, since the chip attachment face of power division network and multichannel transmitting-receiving circuit module 1 is in same layer, and between millimeter wave frequency band antenna element
Away from smaller, the occupied average area of single channel is about 5mm × 5mm so that the electricity of multichannel transmitting-receiving module 1 and power division network 2
Road cabling is extremely compact.
Small in volume.The present invention breaches this think of of module independent design in traditional Millimeter Wave Phased Array Antenna
Road, by the circuit design of multichannel transmitting-receiving circuit module and power division network on same medium substrate, by dielectric layer with layer
Between stereo circuit layout, highdensity to be integrated with multichannel transmitting-receiving circuit module and power division network, thickness only 1mm or so, greatly
The big section height for reducing transmitting-receiving subassembly module and power division network, single channel weight are reduced to 1.5g by typical 10g, realize
Phased array antenna miniaturization, lightweight and incorporated high density Integrated design.
Without connector.The present invention completes multichannel transmitting-receiving circuit module and power division network on same medium substrate 3,
Also there are interlayer, prevention at radio-frequency port and low frequency port to pass through elastic touching mode and antenna list in radio frequency, the existing layer of low-frequency channel cabling
The connections such as member and wave control device form the high density interconnection of zero insertion force, radio frequency and low frequency are completed in the medium substrate of 1mm thickness
The arrangement of circuit is formed as radio frequency input, the work(point port 6 of output port, synthesis port 7 by medium substrate hole knockout
Coaxial transmission, the control of linear array low frequency and power interface 8 are then distributed to substrate surrounding by the cabling between medium substrate, and multichannel is received
3 interlayer cabling of medium substrate is only leaned on to realize low-and high-frequency interconnection between Power Generation Road module and power division network, that thus completes is more
Channel transmission circuit module 1 is integrated with power division network 2, High Density Integration design facilitates multichannel receipts without connector
Power Generation Road module and power division network are designed and using the integrally formed of ripe microwave printed board processing technology processing, are overcome previous
Prior art transmitting-receiving subassembly module uses thin film circuit or LTCC techniques, and power division network is using the forms such as waveguide or micro-strip, and two
Realize the defect of module interconnection between person by way of connector again.
Amplitude-phase consistency is good, and avoids the generation that chip generates the harsh conditions such as self-excitation.The present invention penetrates in order to prevent
The signal of frequency transmission line influences each other, and chip is avoided to generate the generation of the harsh conditions such as self-excitation, using aperture gold between pcb layer
Metal insulated column 9 is made in categoryization processing mode, and circuit trace is isolated, and reduces the coupling effect between transmission line, not only solves
Chip self-excitation of having determined causes transmission-receiving function to deteriorate even non-serviceable problem, while increasing and closely arranging in power division network 2
Transmission line between isolation, improve channel amplitude-phase consistency.
Altogether and heat conductivility is good.It is needed in multichannel transmitting-receiving circuit module 1 for amplifier chip and phase shifter chip
It provides altogether and heat dissipation channel, it is the same with the processing mode of metal insulated column, it is made on the medium substrate of chip attachment position
Realization is connected well with the metal layer of base plate bottom in the ground of amplifier chip and phase shifter chip by intensive solid ground column 10
Ground connection, while the heat of amplifier chip and phase shifter chip being exported by solid ground column to base plate bottom metal layer.
It is at low cost.The attachment interface of amplifier chip and phase shifter chip and power division network are integrated in same Jie by the present invention
Matter layer completes the transmission of radiofrequency signal, and completes radiofrequency signal upward or downward respectively by the vertical cabling on medium substrate 3
Power combing or distribution, while the low frequency control interface of multichannel transmitting-receiving circuit module 1 and power supply power supply interface pass through multilayer
Vertical cabling between medium substrate 3 is arranged toward 3 surrounding of medium substrate, and Multi-channel multifunctional circuit one is realized on medium substrate
The High Density Integration of body designs, and not only saves the connector between transmitting-receiving subassembly module and power division network, while using ripe
Microwave printed board preparation method, fabrication cycle is lower relative to the short cost of LTCC techniques, is especially producing in batches
When, cost of manufacture can be reduced significantly.
Millimeter wave multichannel transmitting-receiving circuit module proposed by the invention and power division network high-density integration technology in a word, no
It is only capable of reaching good transceiver channel electric property in millimeter wave frequency band, phased array antenna is helped to realize high-precision beam scanning,
Meanwhile by multichannel transmitting-receiving circuit module and power division network High Density Integration, longitudinal height dimension and weight is greatly reduced, is
Miniaturization, the lightweight of phased array antenna provide realization means, also provide important design for skin antenna technology in future
Thinking.Simultaneously using ripe microwave printed board preparation method, cost of manufacture and period is greatly reduced, has and minimizes, is light
It the features such as quantization, integrated incorporated high density, is combined with existing microwave printed board processing technology, easy processing is realized, and cost
Low, the period is short, very significant for engineer application.
Description of the drawings
Present invention will be further explained below with reference to the attached drawings and examples.
Fig. 1 is the front view of millimeter wave multichannel transmitting-receiving circuit module and power division network High Density Integration of the present invention.
Fig. 2 is the rearview of Fig. 1.
Fig. 3 is the schematic diagram that the chip in Fig. 1 multichannel transmitting-receivings circuit module 1 is designed with heat dissipation channel altogether.
In figure：1 multichannel transmitting-receiving circuit module, 2 power division networks, 3 medium substrates, 4 low frequencies control pad, 5 power supply power supplies
Pad, the 6 work(point ports being connect with antenna, 7 synthesis ports, the control of 8 low frequencies and power interface, 9 metal insulated columns, 10 solid connect
Ground column, 11 amplifier chips mount interface, and 12 phase shifter chips mount interface.
Specific implementation mode
- Fig. 3 refering to fig. 1.Fig. 1, Fig. 2 and Fig. 3 describe millimeter wave multichannel transmitting-receiving circuit module and work(subnetting of the present invention
One best embodiment of network high density integrated circuit design.In a best embodiment, which receives
Power Generation Road module and power division network high density integrated circuit, including：The medium substrate 3 prepared using microwave printed board, layout are existed
Multichannel transmitting-receiving circuit module 1, power division network 2 on medium substrate 3, and the low frequency that is distributed on 3 surrounding of medium substrate
Control and power interface 8, wherein multichannel transmitting-receiving circuit module 1 includes that the rectangle equipped with phase shifter chip circuit mounts interface
12 and positioned at rectangle attachment 12 two sides of interface on amplifier chip mount interface 11, and positioned at the rectangle mount interface 12
Neighbouring low frequency controls pad 4 and power supply power supply pad 5, is mounted on amplifier chip attachment interface 11 and phase shifter chip attachment
The side that the low frequency control pin and power supply power supply pin of phase shifter chip and amplifier chip on interface 12 pass through gold wire bonding
Formula is connect with low frequency control pad4 and power supply power supply pad5.
Low-and high-frequency interface includes：It is electrically connected to the work(point port 6 on 1 both sides π font foots of multichannel transmitting-receiving circuit module
With the synthesis port 7 being electrically connected on 2 I-shaped strip line of power division network, and it is distributed in low on 3 surrounding of medium substrate
Frequency control and power interface 8.
Power division network 2 divides topological structure, the radio frequency of power division network 2 and multichannel transmitting-receiving circuit module 1 using strip line work(
The regional area of pin connection uses the transition cabling of strip line-microstrip line, in order to the implementation of gold wire bonding.Power division network 2
The group of networks array element for being distributed in medium substrate 3 is formed in the form of I-shaped strip line work(divides topological structure.In each net
On the circumferential endpoint of the I-shaped strip line of network group array element, it is electrically connected with opposite symmetrical multichannel transmitting-receiving circuit module two-by-two
1, two-by-two opposite symmetrical multichannel transmitting-receiving circuit module 1 by respective rectangle mount interface 12 be electrically connected it is I-shaped upper and lower
On one word line of both sides, two rectangle group battle arrays of mirror symmetry are formed, two rectangle group battle arrays each are attached to I-shaped upper and lower
Between the tie point of one word line of both sides, the rectangular net group array element formed with an I-shaped line is constituted.Thus
The rectangular net group array element of composition is laid out with the uniformly distributed connection type of four deciles on medium substrate 3.Four rectangle nets
Network group array element constitutes again using the midpoint of respective I-shaped vertical join line as line and is located at aforementioned four rectangular net group array element
The I-shaped strip line network at middle part, midpoint and the synthesis port 7 of the I-shaped vertical join line of the I-shaped strip line network connect
It connects and constitutes positive font strip line group battle array network.Each group of networks array element is connected to by respective I-shaped vertical join line
On four I-shaped endpoints of the I-shaped strip line network.
In multichannel transmitting-receiving circuit module 1, attachment interface and the power division network collection of amplifier chip and phase shifter chip
At the transmission for completing radiofrequency signal in same dielectric layer, the low frequency control pin and power supply of amplifier chip and phase shifter chip supply
For the pin of electricity by pad 4 corresponding on medium substrate 3 and pad 5 connections of gold wire bonding mode, pad 4 and pad 5 will be low
Frequency control signal and power supply signal are transmitted downwards by the vertical cabling between printed board, and are arranged toward 3 surrounding of medium substrate.Work(point
Network 2 divides topological structure using I-shaped strip line work(, and the signal of transmission is radiofrequency signal, with multichannel transmitting-receiving circuit module 1
The regional area of connection uses the transition of strip line-microstrip line so that the cabling of power division network 2 is locally exposed, convenient for using gold
The mode of silk bonding is by the radio frequency of amplifier, phase shifter chip in the cabling of power division network 2 and multichannel transmitting-receiving circuit module 1
Pin is connected to, and work(divides port 6, synthesis port 7 to form coaxial transmission by medium substrate hole knockout, completes the biography of radiofrequency signal
Defeated, in addition medium substrate interlayer metallization via mode is used to form metal insulated column 9 in the both sides of power division network cabling will be electric
Road cabling is isolated；The work(of power division network 2 divide port 6 and synthesis port 7 by the vertical cabling between medium substrate 3 respectively extremely
The front and back realization of substrate is connect with the radio frequency of front and back end equipment, and the control of linear array low frequency and power interface 8 then pass through medium
Cabling between substrate 3 is distributed to substrate surrounding, and multichannel transmitting-receiving circuit module 1 and work(subnetting are thus completed in medium substrate 3
The radiofrequency signal of network 2, the transmission of low-frequency control signal and power supply signal and low-and high-frequency interconnection.
Medium substrate 3 is microwave printed board, and material properties are generally the different glass fibre polytetrafluoroethyl-ne of dielectric constant
Alkene or the polytetrafluoroethylene (PTFE) of ceramics mixing.In microwave printed board processing, interface 11 and phase shifter are mounted for amplifier chip
At chip attachment interface 12, the installation site of reserved open is convenient for the realization of the above gold wire bonding step.
In multichannel transmitting-receiving circuit module 1, the low frequency control pad 4 and power supply power supply pad 5 of amplifier is located at amplification
Device mounts the both sides up and down at interface 12, and the low frequency control pad 4 and power supply power supply pad 5 of phase shifter is located at phase shifter attachment interface
Upside or downside.The low frequency of amplifier chip and phase shifter chip controls pin and the pin of power supply power supply passes through spun gold key
Conjunction mode low frequency corresponding on medium substrate 3 controls pad 4 and power supply power supply pad 5 connections.Low frequency controls pad 4 and power supply
Power supply pad 5 transmits downwards low-frequency control signal and power supply signal by the vertical cabling of 3 interlayer of medium substrate, and past medium
3 surrounding of substrate is arranged.
Stripline segment in power division network 2 uses multiple 1 point of 2 work(form-separating, uses 1 point of 2 power splitter will first
Two channel transmission circuits of mirror symmetry carry out rectangle group battle array, then use second 1 point of 2 power splitter by the two of two pairs of rectangle group battle arrays
Channel transmission circuit connects, and forms I-shaped group of networks battle array, and so on, the I-shaped group of networks battle array of each two array again with
Centrally located I-shaped strip line connection, forms and multichannel transmitting-receiving circuit module and power division network circuit is distributed in same Jie
Topology network architecture on matter substrate, wherein being synthesized with the network of rear end equipment connection, port 7 is vertical to be connected electrically in above-mentioned center
On the extension line of the vertical strip line of I-shaped strip line, the work(point port 6 that is connect with antenna element is then vertical to be connected electrically among the above
The both ends of heart I-shaped strip line π shape structures, can complete the transmission of radiofrequency signal above.
The attachment interface of amplifier chip and phase shifter chip is integrated in same dielectric layer with power division network 2 and completes radio frequency letter
Number transmission, the power that power division network 2 completes radiofrequency signal by vertical cabling on medium substrate 3 upward or downward respectively closes
At or distribution, while multichannel transmitting-receiving circuit module 1 low frequency control chip and power supply power supply interface pass through multilayer dielectric substrate 3
Between vertical cabling toward 3 surrounding of medium substrate arrange, work(divide port 6, synthesis port 7 pass through medium substrate metallization VIA mode
Coaxial transmission is formed, work(divides port 6, synthesis port 7 respectively by the vertical cabling between medium substrate 3 to the front of substrate and the back of the body
Realize and connect with the radio frequency of front and back ends equipment that the control of linear array low frequency and power interface 8 then pass through the cabling between medium substrate 3 in face
Be distributed to substrate surrounding, the control of long side low frequency and power interface are distributed in the left and right ends of medium substrate, the control of short side low frequency and
Power interface is distributed in the upper and lower ends of medium substrate, and the above electrical connection is multichannel transmitting-receiving circuit module 1 and power division network 2
Low-and high-frequency interconnection.
Refering to Fig. 3.Multichannel transmitting-receiving circuit module 1 includes that the amplifier chip of the chips such as amplifier and phase shifter mounts boundary
Face 11 and phase shifter mount interface 12, and the low frequency control pad 4 and power supply power supply pad 5 near attachment interface,
In, it is that rectangle mounts interface, the attachment interface of amplifier and phase shifter that amplifier, which mounts interface 11 and phase shifter attachment interface 12,
A group battle array is carried out relative to the cabling mirror symmetry of power division network 2, and as unit.Metal insulated column 9 is along power division network 2
Cabling both sides are distributed, and form isolation to the transmission line of power division network 2, while mounting interface and phase shifter attachment in amplifier
On medium substrate below interface, intensive solid ground column 10 is equally made by the way of metallization VIA, by amplifier
The ground of chip and phase shifter chip is connected with the metal layer of base plate bottom, while by the heat of amplifier chip and phase shifter chip
It is exported to base plate bottom metal layer by solid ground column, for amplifier chip and phase shifter chip provides altogether and heat dissipation is logical
Road.
It is the description to the present invention and its embodiment provided to the engineers and technicians in familiar field of the present invention above,
These descriptions should be considered to be illustrative and not restrictive.Engineers and technicians can be accordingly in invention claims
Thought is done specific operation and is implemented, without prejudice to the spirit and scope of the invention as defined in the appended claims, can be right
It makes a variety of changes in the form and details.Above-mentioned these are regarded as coverage of the invention.
Claims (5)
1. a kind of millimeter wave multichannel transmitting-receiving circuit module and power division network high density integrated circuit, including：Using printed board system
Standby medium substrate（3）, it is laid out in medium substrate（3）On multichannel transmitting-receiving circuit module（1）And power division network（2）, and
Coaxial transmission is formed by medium substrate hole knockout, completes the low-and high-frequency interface of radio signal transmission, low-and high-frequency interface includes：
It is electrically connected to multichannel transmitting-receiving circuit module（1）Work(on the π font foots of both sides divides port（6）Be electrically connected to power division network
（2）Synthesis port on I-shaped strip line（7）, and it is distributed in medium substrate（3）Low frequency control on surrounding and power supply
Interface（8）, it is characterised in that：It is operated in the multichannel transmitting-receiving circuit module of millimeter wave frequency band（1）Chip attachment face and work(point
Network（2）In same layer, power division network（2）In stripline segment use multiple 1 point of 2 work(form-separating, first use one 1 point 2
Two channel transmission circuits of mirror symmetry are carried out rectangle group battle array by power splitter, then use second 1 point of 2 power splitter by two pairs of rectangles
Two channel transmission circuits of group battle array connect, and form I-shaped group of networks battle array；In the I-shaped band of each group of networks array element
On the circumferential endpoint of shape line, it is electrically connected with opposite symmetrical multichannel transmitting-receiving circuit module two-by-two（1）, opposite symmetrical more two-by-two
Channel transmission circuit module（1）Interface is mounted by the phase shifter chip of respective rectangle（12）It is electrically connected I-shaped upper and lower two
On one word line of side, two rectangle group battle arrays of mirror symmetry are formed, two rectangle group battle arrays each are attached to I-shaped upper and lower two
Between the tie point of one word line of side, the rectangular net group array element formed with an I-shaped line, rectangle net are constituted
Network group array element is laid out with the uniformly distributed connection type of four deciles in medium substrate（3）On, four rectangular net group array elements are again
Using the midpoint of respective I-shaped vertical join line as line, constitute I-shaped in the middle part of four rectangular nets group array element
Strip line network, midpoint and the synthesis port of the I-shaped vertical join line of the I-shaped strip line network（7）It has connected and composed just
Font strip line group battle array network, each group of networks array element are connected to by respective I-shaped vertical join line described I-shaped
On four I-shaped endpoints of strip line network；With multichannel transmitting-receiving circuit module（1）The mistake of strip line-microstrip line of connection
Cross cabling, power division network（2）Cabling and multichannel transmitting-receiving circuit module（1）In amplifier, phase shifter chip RF tube
Foot is connected to, and the group of networks battle array list for being distributed in medium substrate (3) is formed in the form of I-shaped strip line work(divides topological structure
Member, the attachment interface of amplifier chip and phase shifter chip therein and power division network（2）Same dielectric layer completion is integrated in penetrate
The transmission of frequency signal, prevention at radio-frequency port and low frequency port connect antenna element and wave control device by elastic touching mode, are located at amplification
Device chip attachment interface（11）, phase shifter chip mount interface（12）On amplifier chip and phase shifter chip low frequency control
Tubulation foot and the pin of power supply power supply pass through gold wire bonding mode and medium substrate（3）Upper corresponding low frequency controls pad（4）With
Power supply power supply pad（5）Connection, low frequency control pad（4）With power supply power supply pad（5）Low-frequency control signal and power supply are believed respectively
It number is transmitted downwards by the vertical cabling between printed board, and toward medium substrate（3）Surrounding is arranged；Medium substrate interlayer metallization mistake
Pore size distribution forms metal insulated column in the both sides of power division network cabling（9）By power division network（2）Circuit trace be isolated；
Thus in medium substrate（3）Middle completion multichannel transmitting-receiving circuit module（1）And power division network（2）Radiofrequency signal, low frequency control
The transmission of signal and power supply signal and low-and high-frequency interconnection.
2. millimeter wave multichannel transmitting-receiving circuit module as described in claim 1 and power division network high density integrated circuit, special
Sign is：Power division network（2）Divide topology transmission radiofrequency signal using I-shaped strip line work(, using strip line-microstrip line
Transition makes power division network（2）Cabling it is locally exposed, convenient for by the way of gold wire bonding by power division network（2）Cabling with
Multichannel transmitting-receiving circuit module（1）In amplifier, phase shifter chip radio frequency pin connection.
3. millimeter wave multichannel transmitting-receiving circuit module as described in claim 1 and power division network high density integrated circuit, special
Sign is：In electrical connection power division network（2）Low-and high-frequency interface in, work(divides port（6）With synthesis port（7）Pass through medium substrate
（3）The vertical cabling of interlayer is respectively to medium substrate（3）Front and back, realization connect with the radio frequency of front and back end equipment, it is low
Frequency control and power interface（8）Then pass through medium substrate（3）The cabling of interlayer is distributed to medium substrate（3）Surrounding.
4. millimeter wave multichannel transmitting-receiving circuit module as described in claim 1 and power division network high density integrated circuit, special
Sign is：The I-shaped group of networks battle array of each two array is connect with centrally located I-shaped strip line again, is formed multichannel transmitting-receiving
Circuit module is distributed in the topology network architecture on same medium substrate with power division network circuit, wherein connects with rear end equipment
The network synthesis port connect（7）It is vertically connected electrically on the extension line of the above-mentioned vertical strip line of center I-shaped strip line, with antenna
The work(of unit connection divides port（6）The both ends of above-mentioned center I-shaped strip line π shape structures are then vertically connected electrically in, radio frequency letter is completed
Number transmission.
5. millimeter wave multichannel transmitting-receiving circuit module as described in claim 1 and power division network high density integrated circuit, special
Sign is：Metal insulated column（9）Along power division network（2）Cabling both sides be distributed, to power division network（2）Transmission it is linear
At isolation, while on the medium substrate below amplifier and phase shifter attachment interface, equally by the way of metallization VIA
Intensive solid ground column is made（10）, the ground of amplifier chip and phase shifter chip is connected with the metal layer of base plate bottom,
The heat of amplifier chip and phase shifter chip is exported by solid ground column to base plate bottom metal layer simultaneously, is amplifier
Chip and phase shifter chip provide altogether and heat dissipation channel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610596270.2A CN106230465B (en) | 2016-09-21 | 2016-09-21 | Millimeter wave multichannel transmitting-receiving circuit module and power division network high density integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610596270.2A CN106230465B (en) | 2016-09-21 | 2016-09-21 | Millimeter wave multichannel transmitting-receiving circuit module and power division network high density integrated circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106230465A CN106230465A (en) | 2016-12-14 |
| CN106230465B true CN106230465B (en) | 2018-08-31 |
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| CN108802695B (en) * | 2018-06-13 | 2020-09-01 | 中国电子科技集团公司第十三研究所 | Millimeter wave 3D radar system and signal processing flow |
| CN109245793B (en) * | 2018-09-29 | 2023-05-09 | 中国电子科技集团公司第五十四研究所 | Multichannel tile type phased array transceiver array and manufacturing method thereof |
| CN109216938A (en) * | 2018-10-17 | 2019-01-15 | 成都瑞迪威科技有限公司 | A kind of low section miniaturization phased array antenna |
| CN112103637B (en) * | 2020-08-30 | 2022-09-02 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Modularized satellite-borne Ka-frequency-band active phased-array antenna system |
| CN111970012B (en) * | 2020-10-22 | 2021-01-05 | 成都天锐星通科技有限公司 | Fan-shaped radio frequency network and radio frequency signal sending device |
| CN112367093B (en) * | 2021-01-13 | 2021-04-02 | 成都天锐星通科技有限公司 | Phased array receiving radio frequency network and system |
| CN117371391B (en) * | 2023-12-05 | 2024-04-12 | 成都恪赛科技有限公司 | Miniaturized millimeter wave frequency conversion assembly |
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| CN102200574A (en) * | 2010-03-25 | 2011-09-28 | 费元春 | High-performance low-cost miniature low temperature co-fired ceramic (LTCC) transceiving component |
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