CN207021990U - A kind of tile type phased array TR components - Google Patents
A kind of tile type phased array TR components Download PDFInfo
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- CN207021990U CN207021990U CN201720963155.4U CN201720963155U CN207021990U CN 207021990 U CN207021990 U CN 207021990U CN 201720963155 U CN201720963155 U CN 201720963155U CN 207021990 U CN207021990 U CN 207021990U
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Abstract
Tile type phased-array technique field is the utility model is related to, especially a kind of tile type phased array TR components, including the transceiver channel module of superposed power module and bottom, the transceiver channel module include：First radio frequency connector, transceiver channel module cavity, transceiver plate and control panel, first radio frequency connector are arranged on transceiver channel module cavity bottom, transceiver plate and control panel have been sequentially distributed from bottom to top in the transceiver channel cavity block body；The power module includes power panel, power module cavity, the second radio frequency connector, low-frequency connector, is provided with power panel in the power module cavity, the power module cavity upper surface is respectively arranged with low-frequency connector and the second radio frequency connector.The application realizes that low frequency interconnects in Very Low Clearance between transceiver plate and control panel, makes whole TR component heights direction size interior reduction to greatest extent, realizes the Miniaturization Design of TR components by customizing pinboard.
Description
Technical field
Tile type phased-array technique field is the utility model is related to, especially a kind of tile type phased array TR components.
Background technology
This area mainly uses fragment of brick formula phased array TR components, and fragment of brick formula phased array TR components are laid out using longitudinal direction, such as existing
It is CN201621301206.9 to have patent such as number of patent application, and applying date 2016.11.30, entitled " X-band minimizes brick
Block formula binary channels TR components " utility model patent, its technical scheme is：It the utility model is related to a kind of X-band miniaturization brick
Block formula binary channels TR components, including box body, antenna opening SMP joints are set in the side of box body, electricity is set in the opposite side of box body
Source control port and collection heal up SMP joint SMP joints.Box body is connected by bottom plate, boss, the first partition wall and the second partition wall and is formed one
Body, in opening up inner cavity chamber in boss, wherein the first partition wall and the second partition wall are also in inner cavity chamber.In inner chamber indoor location LTCC bases
Plate, also it is glued HTCC substrates in the top of the first partition wall and the second partition wall.But above-mentioned patent is still based on brick block structure,
It is laid out there are still TR components using longitudinal direction, it is impossible to the problem of minimizing longitudinal size.
The content of the invention
In view of the above-mentioned problems existing in the prior art, a kind of tile type phased array TR components are specifically now proposed.
Technical solutions of the utility model are as follows：
A kind of tile type phased array TR components, it is characterised in that：Transmitting-receiving including superposed power module and bottom
Channel module, the transceiver channel module include：First radio frequency connector, transceiver channel module cavity, transceiver plate and control
Making sheet, first radio frequency connector are arranged on transceiver channel module cavity bottom, and the transceiver channel cavity block body is interior under
Transceiver plate and control panel have been sequentially distributed on and；The power module includes power panel, power module cavity, the second radio frequency
Connector, low-frequency connector, power panel is provided with the power module cavity, the power module cavity upper surface is set respectively
It is equipped with low-frequency connector and the second radio frequency connector.
The transceiver plate edge is provided with multiple pinboards, is connected at the top of the pinboard with control panel.Pinboard
Quantity determined by the interface quantity between transceiver plate and control panel, the application because interface it is more, can not cloth in structure
Put at one, therefore be distributed across at 3；The height of pinboard is mainly designed according to modular construction and determined, first by structure determination height
Degree, pinboard are made using pcb board processing technology, reach required height by changing the planning of its lamination.
Connected at the top of the pinboard between control panel by spun gold.Due to size limit, common low-frequency connector without
Method realize between transceiver plate plate and control panel low frequency interconnection, by one customization pinboard make up transceiver plate with
Difference in height between control panel, then realized by spun gold connection between pinboard and control panel between transceiver plate and control panel
Low frequency interconnection.
Pinboard is made using pcb board processing technology, height regulation can be carried out in the range of 4mm in difference in height.
Solve low frequency interconnection between two pieces of circuit boards in extra small difference in height, see accompanying drawing 2.Pinboard is made using pcb board processing technology,
Reach required height by changing the planning of its lamination.
Make-up connects into an entirety between transceiver channel module and power module, and internal radio frequency interconnection and low frequency interconnection are equal
It is blind with realization by connector.The four edges Laser Welding of transceiver channel module cavity and power module the cavity connecting portion
Connect realization connection.
Being mechanically connected because size limits, between transceiver channel module and power module can not use traditional screw thread to connect
Connect, so first completing each sub-unit assembling in transceiver channel module and power module, then two parts make-up is connected into one
Entirety, internal radio frequency interconnection and low frequency interconnection are blind with realization by connector.Finally by transceiver channel module cavity and
Power module cavity connecting portion is that four edges laser welding realizes mechanical connection, sees accompanying drawing 3.
Whole component appearance and size is 37 ± 0.05mm × 37 ± 0.05mm × 20 ± 0.05mm.
Tile type phased array TR components use landscape layout, thus tile type phased array TR components can subtract to greatest extent
Small longitudinal size.
The beneficial effects of the utility model are：The application is realized between transceiver plate and control panel by customizing pinboard
Low frequency interconnects in Very Low Clearance, makes whole TR component heights direction size interior reduction to greatest extent, realizes the miniaturization of TR components
Design.
Brief description of the drawings
Fig. 1 is TR modular construction decomposing schematic representations.
Fig. 2 is spun gold connection diagram between pinboard and control panel on TR component transceiver plates.
Fig. 3 is TR component laser welding schematic diagrames.
Fig. 4 is TR component production procedure schematic diagrams.
In accompanying drawing：1 power module, 2 transceiver channel modules, 10 power panels, 11 power module cavitys, the connection of 12 second radio frequencies
Device, 13 low-frequency connectors, 20 first radio frequency connectors, 21 transceiver channel module cavitys, 22 transceiver plates, 23 control panels, 200
Pinboard, 300 four edges.
Embodiment
Embodiment 1
A kind of tile type phased array TR components include the transceiver channel module 2 of superposed power module 1 and bottom, institute
Stating transceiver channel module 2 includes：First radio frequency connector 20, transceiver channel module cavity 21, transceiver plate 22 and control panel
23, first radio frequency connector 20 is arranged on the bottom of transceiver channel module cavity 21, in the transceiver channel module cavity 21
Transceiver plate 22 and control panel 23 have been sequentially distributed from bottom to top；The power module 1 includes power panel 10, power module chamber
Body 11, the second radio frequency connector 12, low-frequency connector 13, power panel 10, the electricity is provided with the power module cavity 11
The upper surface of source module cavity 11 is respectively arranged with the radio frequency connector 12 of low-frequency connector 13 and second.The application is transferred by customizing
Plate 200 realizes that low frequency interconnects in Very Low Clearance between transceiver plate 22 and control panel 23, makes whole TR component heights direction chi
Very little reduction interior to greatest extent, realize the Miniaturization Design of TR components.
Embodiment 2
A kind of tile type phased array TR components include the transceiver channel module 2 of superposed power module 1 and bottom, institute
Stating transceiver channel module 2 includes：First radio frequency connector 20, transceiver channel module cavity 21, transceiver plate 22 and control panel
23, first radio frequency connector 20 is arranged on the bottom of transceiver channel module cavity 21, in the transceiver channel module cavity 21
Transceiver plate 22 and control panel 23 have been sequentially distributed from bottom to top；The power module 1 includes power panel 10, power module chamber
Body 11, the second radio frequency connector 12, low-frequency connector 13, power panel 10, the electricity is provided with the power module cavity 11
The upper surface of source module cavity 11 is respectively arranged with the radio frequency connector 12 of low-frequency connector 13 and second.
The edge of transceiver plate 22 is provided with multiple pinboards 200, and the top of pinboard 200 is connected with control panel 23.
The quantity of pinboard 200 determines by the interface quantity between transceiver plate 22 and control panel 23, the application because interface is more,
It can not be arranged at one, therefore be distributed across at 3 in structure；The height of pinboard 200 is mainly designed according to modular construction and determined,
First made by structure determination height, pinboard 200 using pcb board processing technology, reach required height by changing the planning of its lamination
Degree.
Connected between the top of pinboard 200 and control panel 23 by spun gold.Because size limits, common low-frequency connector 13
The low frequency interconnection between the plate of transceiver plate 22 and control panel 23 can not be realized, receipts are made up by the pinboard 200 of a customization
The difference in height between channel plate 22 and control panel 23 is sent out, then is realized and received by spun gold connection between pinboard 200 and control panel 23
The low frequency sent out between channel plate 22 and control panel 23 interconnects.
Pinboard 200 is made using pcb board processing technology, height tune can be carried out in the range of 4mm in difference in height
Section.Solve low frequency interconnection between two pieces of circuit boards in extra small difference in height, see accompanying drawing 2.Pinboard 200 is using pcb board processing work
Skill makes, and reaches required height by changing the planning of its lamination.
Make-up connects into an entirety, internal radio frequency interconnection and low frequency interconnection between transceiver channel module 2 and power module 1
It is blind with realization by connector.The four edges of the transceiver channel module cavity 21 and the connecting portion of power module cavity 11
300 realize connection with laser welding.
Being mechanically connected because size limits, between transceiver channel module 2 and power module 1 can not use traditional screw thread to connect
Connect, so first completing each sub-unit assembling in transceiver channel module 2 and power module 1, then two parts make-up is connected into one
Individual entirety, internal radio frequency interconnection and low frequency interconnection are blind with realization by connector.Finally by transceiver channel module cavity
21 and the connecting portion of power module cavity 11 be the laser welding of four edges 300 realize mechanically connect, see accompanying drawing 3.
Whole component appearance and size is 37 ± 0.05mm × 37 ± 0.05mm × 20 ± 0.05mm.Tile type phased array TR groups
Part uses landscape layout, thus tile type phased array TR components can reduce longitudinal size to greatest extent.
The application realizes that low frequency is mutual in Very Low Clearance between transceiver plate 22 and control panel 23 by customizing pinboard 200
Connection, makes whole TR component heights direction size interior reduction to greatest extent, realizes the Miniaturization Design of TR components.
The TR module production process is as follows：
1. electronic component and customization pinboard 200SMT pasters on transceiver plate 22.
2. electronic component SMT pasters on control panel 23.
3. electronic component SMT pasters on power panel 10.
4. the first radio frequency connector 20 is welded on transceiver channel module cavity 21 → transceiver plate 22 is welded on transmitting-receiving
On channel module cavity 21 → inner wire of the first radio frequency connector 20 and transceiver plate 22 weld → control panel 23 is welded on receipts
Send out on channel module cavity 21 → transceiver plate 22 on spun gold connection → rf adapter between pinboard 200 and control panel 23
Insert on transceiver plate 22 in corresponding first radio frequency connector 20.
5. the second radio frequency connector 12 and low-frequency connector 13 be welded on power module cavity 11 → power panel 10 passes through
Screw is fixed on power module cavity 11 → contact pin of low-frequency connector 13 and the plate weld of power panel 10.
6. 1 make-up of transceiver channel module 2 and power module → transceiver channel module cavity 21 and power module cavity 11 swash
Photocoagulation.
Claims (6)
- A kind of 1. tile type phased array TR components, it is characterised in that：Including superposed power module（1）With the transmitting-receiving of bottom Channel module（2）, the transceiver channel module（2）Including：First radio frequency connector（20）, transceiver channel module cavity（21）、 Transceiver plate（22）And control panel（23）, first radio frequency connector（20）Installed in transceiver channel module cavity（21）Bottom Portion, the transceiver channel module cavity（21）Transceiver plate has inside been sequentially distributed from bottom to top（22）And control panel（23）；Institute State power module（1）Including power panel（10）, power module cavity（11）, the second radio frequency connector（12）, low-frequency connector （13）, the power module cavity（11）Inside it is provided with power panel（10）, the power module cavity（11）Upper surface is set respectively It is equipped with low-frequency connector（13）With the second radio frequency connector（12）.
- A kind of 2. tile type phased array TR components according to claim 1, it is characterised in that：The transceiver plate（22） Edge is provided with multiple pinboards（200）, the pinboard（200）Top and control panel（23）It is connected.
- A kind of 3. tile type phased array TR components according to claim 2, it is characterised in that：The pinboard（200）Top Portion and control panel（23）Between connected by spun gold.
- A kind of 4. tile type phased array TR components according to claim 3, it is characterised in that：Pinboard（200）Using PCB Board machining process is made, and height regulation can be carried out in the range of 4mm in difference in height.
- A kind of 5. tile type phased array TR components according to claim 4, it is characterised in that：Transceiver channel module（2）With Power module（1）Between make-up connect into an entirety, the transceiver channel module cavity（21）With power module cavity（11） The four edges of connecting portion（300）Realized and connected with laser welding.
- A kind of 6. tile type phased array TR components according to claim 5, it is characterised in that：Entirely component appearance and size is 37±0.05mm×37±0.05mm×20±0.05mm。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720963155.4U CN207021990U (en) | 2017-08-03 | 2017-08-03 | A kind of tile type phased array TR components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720963155.4U CN207021990U (en) | 2017-08-03 | 2017-08-03 | A kind of tile type phased array TR components |
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| Publication Number | Publication Date |
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| CN207021990U true CN207021990U (en) | 2018-02-16 |
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| CN201720963155.4U Active CN207021990U (en) | 2017-08-03 | 2017-08-03 | A kind of tile type phased array TR components |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109888449A (en) * | 2019-03-05 | 2019-06-14 | 成都雷电微力科技有限公司 | A kind of tile type T/R module of radiofrequency signal vertical transfer |
| CN110138408A (en) * | 2019-05-16 | 2019-08-16 | 中国电子科技集团公司第十三研究所 | Tile type T/R component and its design method |
| CN110794373A (en) * | 2019-11-08 | 2020-02-14 | 成都华芯天微科技有限公司 | Integrated millimeter wave tile formula TR subassembly |
| CN111525284A (en) * | 2020-07-03 | 2020-08-11 | 成都雷电微力科技股份有限公司 | Multi-frequency composite high-power tile type active phased array antenna |
| CN112234370A (en) * | 2020-09-29 | 2021-01-15 | 中国航空工业集团公司雷华电子技术研究所 | Ultrathin high-reliability tile assembly framework and assembling method thereof |
| CN112444781A (en) * | 2020-10-10 | 2021-03-05 | 北京无线电测量研究所 | Control signal transmission structure for transceiving component and phased array radar |
| CN113067191A (en) * | 2021-03-19 | 2021-07-02 | 成都雷电微晶科技有限公司 | Tile type module power supply switching structure |
| CN114389065A (en) * | 2021-12-21 | 2022-04-22 | 贵州航天计量测试技术研究所 | PXI radio frequency module and radio frequency microwave system |
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2017
- 2017-08-03 CN CN201720963155.4U patent/CN207021990U/en active Active
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109888449B (en) * | 2019-03-05 | 2021-05-18 | 成都雷电微力科技股份有限公司 | Tile type TR module for vertical transmission of radio frequency signals |
| CN109888449A (en) * | 2019-03-05 | 2019-06-14 | 成都雷电微力科技有限公司 | A kind of tile type T/R module of radiofrequency signal vertical transfer |
| CN110138408A (en) * | 2019-05-16 | 2019-08-16 | 中国电子科技集团公司第十三研究所 | Tile type T/R component and its design method |
| CN110138408B (en) * | 2019-05-16 | 2021-04-06 | 中国电子科技集团公司第十三研究所 | Tile type T/R assembly |
| CN110794373A (en) * | 2019-11-08 | 2020-02-14 | 成都华芯天微科技有限公司 | Integrated millimeter wave tile formula TR subassembly |
| CN111525284A (en) * | 2020-07-03 | 2020-08-11 | 成都雷电微力科技股份有限公司 | Multi-frequency composite high-power tile type active phased array antenna |
| CN111525284B (en) * | 2020-07-03 | 2020-09-22 | 成都雷电微力科技股份有限公司 | Multi-frequency composite high-power tile type active phased array antenna |
| CN112234370A (en) * | 2020-09-29 | 2021-01-15 | 中国航空工业集团公司雷华电子技术研究所 | Ultrathin high-reliability tile assembly framework and assembling method thereof |
| CN112444781A (en) * | 2020-10-10 | 2021-03-05 | 北京无线电测量研究所 | Control signal transmission structure for transceiving component and phased array radar |
| CN112444781B (en) * | 2020-10-10 | 2024-04-12 | 北京无线电测量研究所 | Control signal transmission structure for receiving and transmitting assembly and phased array radar |
| CN113067191A (en) * | 2021-03-19 | 2021-07-02 | 成都雷电微晶科技有限公司 | Tile type module power supply switching structure |
| CN113067191B (en) * | 2021-03-19 | 2022-03-01 | 成都雷电微晶科技有限公司 | Tile type module power supply switching structure |
| CN114389065A (en) * | 2021-12-21 | 2022-04-22 | 贵州航天计量测试技术研究所 | PXI radio frequency module and radio frequency microwave system |
| CN114389065B (en) * | 2021-12-21 | 2024-01-02 | 贵州航天计量测试技术研究所 | PXI radio frequency module and radio frequency microwave system |
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