CN106654541A - Millimeter-wave 64 array element tile type phased array antenna - Google Patents
Millimeter-wave 64 array element tile type phased array antenna Download PDFInfo
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- CN106654541A CN106654541A CN201710090054.5A CN201710090054A CN106654541A CN 106654541 A CN106654541 A CN 106654541A CN 201710090054 A CN201710090054 A CN 201710090054A CN 106654541 A CN106654541 A CN 106654541A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q3/00—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
- H01Q3/26—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture
- H01Q3/30—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the relative phase between the radiating elements of an array
- H01Q3/34—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the relative phase between the radiating elements of an array by electrical means
- H01Q3/36—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the relative phase between the radiating elements of an array by electrical means with variable phase-shifters
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- Variable-Direction Aerials And Aerial Arrays (AREA)
Abstract
The invention relates to the field of radar systems, and particularly relates to a millimeter-wave 64 array element phased array radar system front end module based on a tile type structure. A millimeter-wave 64 array element tile type phased array antenna comprises 2*2 TR component arrays; the number of subarray channels of each TR component is 4*4 and 64 subarray channels are provided in total; each TR component includes a receiving-sending channel module, a power module, a control module and a structure cavity; the power module is connected with an external interface; the power module and the control module are vertically interconnected via a pin; the control module and the receiving-sending channel module are connected via gold wire bonding; and the three modules are placed sequentially in parallel. According to the millimeter-wave 64 array element tile type phased array antenna, the tile type structure is adopted, so that a vertical interconnection technology is adopted by a radio-frequency channel to interconnect a whole machine input with the antenna; the whole phased array antenna is arranged by the 2*2 TR components, and the area of the whole array is 75mm*75mm, so the volume of the TR components is reduced; an input of the TR components is an SMP interface, is vertically interconnected with the receiving-sending channel module via KK and then is vertically interconnected with an SMP via a one-to-sixteen multilayer microwave plate.
Description
Technical field
The present invention relates to radar system field, and in particular to one kind is based on tile type structure, the array element phased array of millimeter wave 64
Radar system front-end module.
Background technology
Phased array radar system is the revolution of field of radar, is compared to traditional mechanical scan, and it thoroughly changes
The spacescan mode of radar is become.Phased-array radar can mutually control the sensing of wave beam by controlling each passage width, also may be used
Radar is set to complete to stare target with rotary antenna.
Phased-array radar front-end module is the key component of whole system, typically with hundreds and thousands of antenna element compositions
Aerial array, and corresponding to each element antenna TR components composition, therefore, volume requirement of the whole system to TR components
Comparison is harsh.Traditional " fragment of brick " structure TR modular construction is larger so that its application receives great limitation.
The content of the invention
For the above-mentioned deficiency in prior art, a kind of array element tile type phased array day of millimeter wave 64 is specifically now proposed
Line.
Technical scheme is as follows：
A kind of array element tile type phased array antenna of millimeter wave 64, it is characterised in that：Including the TR assembly arrays of 2*2, each TR group
Part submatrix port number is 4*4, totally 64 submatrix passage；The channel pitch of phased array antenna is determined by operating frequency and antenna scanning scope
Fixed, the transmitting antenna channel pitch of the present invention is 9.5mm.Each TR component includes transceiver channel module, power module, control mould
Block and structural cavity body, power module is connected with external interface, and power module is interconnected with control module by pins normal, controls mould
Block is connected with transceiver channel module by gold wire bonding, and 3 modules are placed in parallel successively.
Transceiver channel module includes 16 transceiver channels；Each transceiver channel module include transmitting-receiving amplify multifunctional circuit,
Multifunctional circuit, power control circuit, ripple control control circuit and power splitter are amplified in decay phase shift.Multifunctional circuit reality is amplified in transmitting-receiving
The power amplification of existing transmission signal, receives the low noise amplification of signal and the function of transmitting-receiving switching；Decay phase shift amplifies multi-functional
Circuit realiration amplifies to the decay of component, phase shifting control and signal；Ripple control control circuit realizes the high speed string for sending in ripple control machine
Row data are converted into parallel control code, control decay phase-shift circuit；Power control circuit realizes 16 channel receptions, emission powers
It is individually controllable；Power splitter is realized the work(point of 16 channel signals or is synthesized.
Transceiver channel module is one piece of radio frequency circuit board, including the integrated SOC of Multi-channel multifunctional, radio-frequency channel transmission network
Network, control and power feeder network, radio frequency circuit board is designed by multiplayer microwave plate, and multiplayer microwave plate is radio frequency circuit board and FR4
Mixed pressure structure, integrated RF passage feeding network, control and power feeder network, multifunctional unit SOC and multiplayer microwave
Plate is interconnected by gold wire bonding mode.
Device includes LDO and DC-DC in power module, realizes that input power is changed, and is converted into electricity needed for TR component internals
Source.
Device includes FPGA in control module, realizes the SPI communication with ripple control motherboard, is instructed according to ripple control motherboard, control
The working condition of each passage.
Transceiver channel module includes 4 multifunctional unit SOCs, and 16 TR transceiving chips are driven respectively, by ripple control
Plate realizes amplitude-phase control, transmitting-receiving power supply and mode of operation switching, and each passage amplifies, receives low comprising final power
Noise amplifies, receives and dispatches drive amplification, transmitting-receiving phase shift, receiving attenuation, transmit-receive switch and mode selector switch function, wherein TR transmitting-receivings
Integrated chip final stage power amplifier, reception LNA, transmit-receive switch and mode selection switch, the integrated transmitting-receiving of multifunctional unit SOC
Phase shift, receiving attenuation, transmit-receive switch and transmitting-receiving drive amplification.
Structural cavity body includes power panel cavity and antenna chamber two parts；Power module includes that power panel and low frequency connect
Device；Control module includes panel and low frequency contact pin；Transceiver channel module includes radio frequency circuit board, radio frequency connector, screening cover；
Power panel is mounted in power panel cavity, and by low-frequency connector and external connection, panel is mounted in antenna cavity with radio frequency circuit board
In body, power panel realizes interconnection with panel by low frequency contact pin, and radio frequency circuit board is vertical with radio frequency connector to be interconnected, by day
Line realizes the transmitting-receiving of signal, and so designing tile type structure can greatly reduce the volume of TR components.Electricity is provided with power panel
Device on source plate, is provided with device on panel on panel.
During transmitting, signal is input to 16 passage submatrixs by public port, and 1 point of 4 power splitter of Jing is divided into 4 tunnels, is input into respectively
To 4 multifunctional unit SOCs, then 4 tunnels are divided into by multifunctional unit SOC, being transported to TR transceiving chips carries out work(
Rate is amplified, and is finally output to antenna port.
During reception, signal is input into by antenna port, and Jing after the low noise amplification of TR transceiving chips multifunctional unit is input to
SOC, Jing after drive amplification, phase shift and decay, 4 tunnels synthesize 1 tunnel, by the total port outputs of SMP, carry out 4 tunnels again in submatrix
Synthesis, is exported by total port of submatrix.
Transceiver channel module includes 16 road transceiver channels, and according to every four-way split plot design is carried out, and transmission signal is through defeated
To enter entered into after power distributing network multifunctional unit SOC, being distributed into 4 passages carries out phase shift, decay and drive amplification, most
Afterwards final power output is realized by TR transceiving chips.Receiving channel signal is entered after module, is carried out by TR transceiving chips
Amplify, subsequently into multifunctional unit SOC the unification output of 4 passages is realized, export finally by power distributing network.
There is substantial amounts of power supply and control interconnecting interface between three parts of TR component internals, be to reduce interconnecting interface, by TR
The radio frequency part of component is divided into four regions, and four passages in each region are divided into into four positions number（1、2、3、4）, calibrating die
During formula, the TR transceiving chips work of each region jack per line position, the TR transceiving chip power-off of other number.
Control module receive from higher level's motherboard ripple control instruct, complete ripple control instruction parsing, by SPI protocol to many work(
Energy chip enters the read-write of line amplitude and phase place.Under such mode of operation, T/R module includes 4 multifunctional unit SOCs
Region, each region unit parallel control, 4 channel serials read-write in each region.So, ripple control instruction being performed quickly.
Whole TR component common clock signals, chip selection signal, latch signal and transmit-receive switch signal, the control of each passage
Data using parallel transmitting-receiving mode, realize high speed phase and amplitude control and each channel multi-functional chip on working condition
Control.
Beneficial effects of the present invention：
1st, the present invention adopts " tile type " structure, radio frequency path to be input into whole machine and antenna interconnection using vertical interconnection technique.It is whole
Individual phased array antenna is 75mm*75mm by 2*2 TR arrangement of components, whole array area, reduces the volume of TR components.TR groups
Part input is 1 SMP interface, is interconnected by the way that KK is vertical with transceiver channel module, then vertical with SMP by 1 point 16 of multiplayer microwave plate
Straight interconnection.
2nd, phase controlling, adjustable attenuation, the power amplification function of each passage of the invention, the COMS for selecting silicon-based technology comes
Realize.Make full use of CMOS integrated levels it is high, can digital-to-analogue hybrid integrated advantage, by the phase shift in radio frequency link, decay, drive and put
It is big to wait functional circuit and digital control and power management integrated, the integrated level of radio-frequency channel is greatly improved, each
TR assembly volumes are only 37mm*37mm*18mm.
Description of the drawings
Fig. 1 structures the formation schematic diagram for 64 array element of the invention.
Fig. 2 is TR components composition frame chart schematic diagram of the present invention.
Fig. 3 is that the passage of TR components 16 of the present invention receives and dispatches submatrix theory diagram.
Fig. 4 is unit subregion in inventive antenna submatrix.
Fig. 5 is cross-section structure structure chart of the present invention.
In accompanying drawing：TR components 1, transceiver channel module 2, power module 3, control module 4, structural cavity body 5, power panel 6, electricity
Source plate cavity 7, low-frequency connector 8, panel 9, radio frequency circuit board 10, antenna chamber 11, low frequency contact pin 12, radio frequency connector
13, screening cover 14.
Specific embodiment
Embodiment 1
A kind of array element tile type phased array antenna of millimeter wave 64 includes the array of TR components 1 of 2*2, each submatrix passage of TR components 1
Number is 4*4, totally 64 submatrix passage；The channel pitch of phased array antenna is determined by operating frequency and antenna scanning scope, of the invention
Transmitting antenna channel pitch be 9.5mm.Each TR component 1 includes transceiver channel module 2, power module 3, the and of control module 4
Structural cavity body 5, power module 3 is connected with external interface, and power module 3 is interconnected with control module 4 by pins normal, controls mould
Block 4 is connected with transceiver channel module 2 by gold wire bonding, and 3 modules are placed in parallel successively.The present invention is using " tile type " knot
Structure, radio frequency path is interconnected the input of whole machine and antenna using vertical interconnection technique.Whole phased array antenna is by the row of 2*2 TR components 1
Row, whole array area is 75mm*75mm, reduces the volume of TR components 1.The input of TR components 1 is 1 SMP interface, by KK
Interconnection vertical with transceiver channel module 2, then interconnect by the way that 1 point 16 of multiplayer microwave plate is vertical with SMP.
Embodiment 2
A kind of array element tile type phased array antenna of millimeter wave 64, it is characterised in that：Including the array of TR components 1 of 2*2, each TR
The submatrix port number of component 1 is 4*4, totally 64 submatrix passage；The channel pitch of phased array antenna is by operating frequency and antenna scanning model
Decision is enclosed, the transmitting antenna channel pitch of the present invention is 9.5mm.Each TR component 1 includes transceiver channel module 2, power module
3rd, control module 4 and structural cavity body 5, power module 3 is connected with external interface, and power module 3 is hung down with control module 4 by contact pin
Straight interconnection, control module 4 is connected with transceiver channel module 2 by gold wire bonding, and 3 modules are placed in parallel successively.
Transceiver channel module 2 includes 16 transceiver channels；Each transceiver channel module 2 includes that multi-functional electricity is amplified in transmitting-receiving
Multifunctional circuit, power control circuit, ripple control control circuit and power splitter are amplified in road, decay phase shift.Multi-functional electricity is amplified in transmitting-receiving
The power amplification of transmission signal is realized on road, receives the low noise amplification of signal and the function of transmitting-receiving switching；Decay phase shift amplifies many
Functional circuit realizes that the decay to component, phase shifting control and signal amplify；Ripple control control circuit realizes the height for sending in ripple control machine
Fast serial data is converted into parallel control code, control decay phase-shift circuit；Power control circuit realizes 16 channel receptions, transmitting
Power supply is individually controllable；Power splitter is realized the work(point of 16 channel signals or is synthesized.
Transceiver channel module 2 be one piece of radio frequency circuit board 10, including the integrated SOC of Multi-channel multifunctional, radio-frequency channel feed
Network, control and power feeder network, radio frequency circuit board 10 is designed by multiplayer microwave plate, and multiplayer microwave plate is radio frequency circuit board 10
With FR4 mixed pressure structures, integrated RF passage feeding network, control and power feeder network, multifunctional unit SOC and multilamellar
Microwave board is interconnected by gold wire bonding mode.
Device is mainly LDO and DC-DC in power module 3, realizes that input power is changed, and is converted into the inside institute of TR components 1
Need power supply.
Device is mainly FPGA in control module 4, realizes the SPI communication with ripple control motherboard, is instructed according to ripple control motherboard, control
Make the working condition of each passage.
Transceiver channel module 2 includes 4 multifunctional unit SOCs, and 16 TR transceiving chips are driven respectively, by ripple control
Plate realizes amplitude-phase control, transmitting-receiving power supply and mode of operation switching, and each passage amplifies, receives low comprising final power
Noise amplifies, receives and dispatches drive amplification, transmitting-receiving phase shift, receiving attenuation, transmit-receive switch and mode selector switch function, wherein TR transmitting-receivings
Integrated chip final stage power amplifier, reception LNA, transmit-receive switch and mode selection switch, the integrated transmitting-receiving of multifunctional unit SOC
Phase shift, receiving attenuation, transmit-receive switch and transmitting-receiving drive amplification.
Structural cavity body 5 includes power panel cavity 7 and the two parts of antenna chamber 11；Power module 3 includes power panel 6 and low frequency
Adapter 8；Control module 4 includes panel 9 and low frequency contact pin 12；Transceiver channel module 2 connects including radio frequency circuit board 10, radio frequency
Connect device 13, screening cover 14；Power panel 6 is mounted in power panel cavity 7, by low-frequency connector 8 and external connection, panel 9 with
Radio frequency circuit board 10 is mounted in antenna chamber 11, and power panel 6 realizes interconnection with panel 9 by low frequency contact pin 12, and radio frequency is integrated
The interconnection vertical with radio frequency connector 13 of plate 10, by antenna the transmitting-receiving of signal is realized, so designing tile type structure can be significantly
Reduce the volume of TR components 1.Device on power panel 6 is provided with power panel 6, device on panel 9 is provided with panel 9.
During transmitting, signal is input to 16 passage submatrixs by public port, and 1 point of 4 power splitter of Jing is divided into 4 tunnels, is input into respectively
To 4 multifunctional unit SOCs, then 4 tunnels are divided into by multifunctional unit SOC, being transported to TR transceiving chips carries out work(
Rate is amplified, and is finally output to antenna port.
During reception, signal is input into by antenna port, and Jing after the low noise amplification of TR transceiving chips multifunctional unit is input to
SOC, Jing after drive amplification, phase shift and decay, 4 tunnels synthesize 1 tunnel, by the total port outputs of SMP, carry out 4 tunnels again in submatrix
Synthesis, is exported by total port of submatrix.
Transceiver channel module 2 includes 16 road transceiver channels, and according to every four-way split plot design is carried out, and transmission signal is through defeated
To enter entered into after power distributing network multifunctional unit SOC, being distributed into 4 passages carries out phase shift, decay and drive amplification, most
Afterwards final power output is realized by TR transceiving chips.Receiving channel signal is entered after module, is carried out by TR transceiving chips
Amplify, subsequently into multifunctional unit SOC the unification output of 4 passages is realized, export finally by power distributing network.
It is to reduce mutual as shown in figure 4, there is substantial amounts of power supply and control interconnecting interface between three parts inside TR components 1
Connecting port, by the radio frequency part of TR components 1 four regions, respectively region 1, region 2, region 3 and region 4 are divided into, and will be every
Four passages in individual region are divided into four numbers positions, respectively No. 1 position, No. 2 positions, No. 3 positions and No. 4 positions, during calibration mode, each area
The TR transceiving chips work of domain jack per line position, the TR transceiving chip power-off of other number position.
Control module 4 receive from higher level's motherboard ripple control instruct, complete ripple control instruction parsing, by SPI protocol to many
Functional chip enters the read-write of line amplitude and phase place.Under such mode of operation, T/R module includes 4 multifunctional unit SOC cores
Panel region, each region unit parallel control, 4 channel serials read-write in each region.So, ripple control instruction being held quickly
OK.
The whole common clock signal of TR components 1, chip selection signal, latch signal and transmit-receive switch signal, the control of each passage
Data processed using parallel transmitting-receiving mode, realize high speed phase and amplitude control and each channel multi-functional chip on work shape
State is controlled.
The present invention adopts " tile type " structure, radio frequency path to be input into whole machine and antenna interconnection using vertical interconnection technique.
Whole phased array antenna is arranged by 2*2 TR components 1, and whole array area is 75mm*75mm, reduces the volume of TR components 1.
The input of TR components 1 is 1 SMP interface, is interconnected by the way that KK is vertical with transceiver channel module 2, then by 1 point 16 of multiplayer microwave plate
It is vertical with SMP to interconnect.
Phase controlling, adjustable attenuation, the power amplification function of each passage of the invention, the COMS for selecting silicon-based technology comes real
It is existing.Make full use of CMOS integrated levels it is high, can digital-to-analogue hybrid integrated advantage, by the phase shift in radio frequency link, decay, drive amplification
It is integrated Deng functional circuit and digital control and power management, the integrated level of radio-frequency channel is greatly improved, each TR
The volume of component 1 is only 37mm*37mm*18mm.
The channel pitch of phased array antenna determines by operating frequency and antenna scanning scope, the transmitting antenna passage of this project
Spacing only has 9.5mm, to realize that phase controlling, adjustable attenuation and the power of each passage independence are put in so little space
Greatly, there is at a relatively high requirement to the integrated level of radio-frequency channel, this programme selection is realized multi-functional based on the CMOS of silicon-based technology
It is integrated, make full use of CMOS integrated levels it is high, can digital-to-analogue hybrid integrated advantage, by the phase shift in radio frequency link, decay,
The functional circuits such as drive amplification and digital control and power management are integrated.
4 × 4 submatrix TR components 1, channel unit spacing is 9.5mm, and four adjacent passages take TR transceiving chips and four
The densely covered mode of unification multifunction chip, is assembled using microwave assembly technology, improves interchannel isolation.Four multifunction chip synthesis
Afterwards, realize that radio frequency is interconnected by the total port of SMP and whole machine.The amplitude and phase controlling of T/R module each passage adopts serial
Control mode, transmitting-receiving power supply is controlled using grid voltage modulation system, mutual with ripple control daughter board by the gold wire bonding pad of the left and right sides
Connection.
All radio frequency links of this programme integrated 16 passages in the limited space of radio frequency circuit board 10, each passage
Chip is required for independent power supply to power, the signal kinds on width phase control and power management, therefore microwave multi-layer boards are various, line
Road is intensive, needs fully to be classified, hierarchical design, optimizes Electro Magnetic Compatibility, simplify control and power supply interconnecting interface.To be many
Radiofrequency signal layer, bus plane and key-course hierarchical design in layer microwave board, is carried out sufficiently around radio frequency link with ground hole
Electromagnetic shielding.Clock single channel cabling in key-course, and shielded, it is to avoid the interference to other signals.In radio frequency chip week
Enclose carries out em filtering using electric capacity.
This programme takes the TR transceiving chips of each four passage to concentrate the mode layout placed, in spatial separation, will
Four passages are used together shielding cavity is isolated, it is ensured that total spatial separation between port and each access port, radio frequency is integrated
The inside of plate 10 is electromagnetically shielded using ground hole.
The side that the chips control interface of TR components 1 and voltage interface pass through each row pad gold wire bonding of radio frequency circuit board 10
Interconnect to realize between formula and panel 9.
Claims (10)
1. the array element tile type phased array antenna of a kind of millimeter wave 64, it is characterised in that：Including the TR components of 2*2（1）Array, often
Individual TR components（1）Submatrix port number is 4*4, totally 64 submatrix passage；Each TR component（1）Including transceiver channel module（2）, power supply
Module（3）, control module（4）And structural cavity body（5）, power module（3）It is connected with external interface, power module（3）With control
Module（4）Interconnected by pins normal, control module（4）With transceiver channel module（2）It is connected by gold wire bonding, 3 modules
It is placed in parallel successively.
2. the array element tile type phased array antenna of millimeter wave according to claim 1 64, it is characterised in that：Transceiver channel module
（2）Including 16 transceiver channels；Each transceiver channel module（2）Amplify multifunctional circuit, decay phase shift including transmitting-receiving and amplify many
Functional circuit, power control circuit, ripple control control circuit and power splitter.
3. the array element tile type phased array antenna of millimeter wave according to claim 1 64, it is characterised in that：Transceiver channel module
（2）For one piece of radio frequency circuit board（10）, including the integrated SOC of Multi-channel multifunctional, radio-frequency channel feeding network, control and electricity
Source feeder network, radio frequency circuit board（10）Designed by multiplayer microwave plate, multiplayer microwave plate is radio frequency circuit board（10）With FR4 mixed pressures
Structure, integrated RF passage feeding network, control and power feeder network, multifunctional unit SOC and multiplayer microwave plate by
Gold wire bonding mode is interconnected.
4. the array element tile type phased array antenna of millimeter wave according to claim 1 64, it is characterised in that：Power module（3）
Middle device includes LDO and DC-DC；Control module（4）Middle device includes FPGA.
5. the array element tile type phased array antenna of millimeter wave according to claim 1 64, it is characterised in that：Transceiver channel module
（2）Including 4 multifunctional unit SOCs, 16 TR transceiving chips are driven respectively, amplitude-phase control is realized by ripple control daughter board
System, transmitting-receiving power supply and mode of operation switch, and each passage amplifies comprising final power, receives low noise amplification, transmitting-receiving drive
It is dynamic to amplify, receive and dispatch phase shift, receiving attenuation, transmit-receive switch and mode selector switch function, the wherein integrated final stage work(of TR transceiving chips
Put, receive LNA, transmit-receive switch and mode selection switch, the integrated transmitting-receiving phase shift of multifunctional unit SOC, receiving attenuation,
Transmit-receive switch and transmitting-receiving drive amplification.
6. the array element tile type phased array antenna of millimeter wave according to claim 1 64, it is characterised in that：Structural cavity body（5）
Including power panel cavity（7）And antenna chamber（11）Two parts；Power module（3）Including power panel（6）And low-frequency connector
（8）；Control module（4）Including panel（9）With low frequency contact pin（12）；Transceiver channel module（2）Including radio frequency circuit board（10）、
Radio frequency connector（13）, screening cover（14）；Power panel（6）It is mounted in power panel cavity（7）In, by low-frequency connector（8）With it is outer
Portion connects, panel（9）With radio frequency circuit board（10）It is mounted in antenna chamber（11）In, power panel（6）With panel（9）By low
Frequency contact pin（12）Realize interconnection, radio frequency circuit board（10）With radio frequency connector（13）Vertical interconnection, by antenna signal is realized
Transmitting-receiving, power panel（6）On be provided with power panel（6）Upper device, panel（9）On be provided with panel（9）Upper device.
7. the array element tile type phased array antenna of millimeter wave according to claim 1 64, it is characterised in that：During transmitting, signal
16 passage submatrixs are input to by public port, 1 point of 4 power splitter of Jing is divided into 4 tunnels, is separately input to 4 multifunctional unit SOC cores
Piece, then 4 tunnels are divided into by multifunctional unit SOC, being transported to TR transceiving chips carries out power amplification, is finally output to antenna
Port.
8. the array element tile type phased array antenna of millimeter wave according to claim 1 64, it is characterised in that：During reception, signal
It is input into by antenna port, is input to multifunctional unit SOC Jing after the low noise amplification of TR transceiving chips, Jing drive amplifications,
After phase shift and decay, 4 tunnels synthesize 1 tunnel, by the total port outputs of SMP, 4 tunnel synthesis are carried out again in submatrix, by total port of submatrix
Output.
9. the array element tile type phased array antenna of millimeter wave according to claim 1 64, it is characterised in that：Transceiver channel module
（2）Including 16 road transceiver channels, split plot design is carried out according to every four-way, transmission signal is laggard through input Power Distribution network
Enter to multifunctional unit SOC, being distributed into 4 passages carries out phase shift, decay and drive amplification, finally by TR transceiving chip realities
Now final power output；Receiving channel signal is entered after module, is amplified by TR transceiving chips, subsequently into multi-functional
Integrated SOC realizes the unification output of 4 passages, exports finally by power distributing network.
10. the array element tile type phased array antenna of millimeter wave according to claim 1 64, it is characterised in that：TR components（1）
Radio frequency part be divided into four regions, and four passages in each region are divided into into four positions number, during calibration mode, each region
The TR transceiving chips work of jack per line position, the TR transceiving chip power-off of other number；Control module（4）Receive from higher level's motherboard
Ripple control is instructed, and is completed ripple control instruction parsing, is entered the read-write of line amplitude and phase place to multifunction chip by SPI protocol；T/R module
Including 4 multifunctional unit SOC regions, each region unit parallel control, 4 channel serials read-write in each region；Entirely
TR components（1）Common clock signal, chip selection signal, latch signal and transmit-receive switch signal, the control data of each passage is adopted
Parallel transmitting-receiving mode, realize high speed phase and amplitude control and each channel multi-functional chip on working state control.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710090054.5A CN106654541A (en) | 2017-02-20 | 2017-02-20 | Millimeter-wave 64 array element tile type phased array antenna |
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| CN201710090054.5A CN106654541A (en) | 2017-02-20 | 2017-02-20 | Millimeter-wave 64 array element tile type phased array antenna |
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Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108732563A (en) * | 2018-08-21 | 2018-11-02 | 无锡华测电子系统有限公司 | A kind of multichannel tile type transmitting-receiving subassembly |
| CN108767423A (en) * | 2018-04-27 | 2018-11-06 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | The expansible chip architecture of tile style TR component millimeter waves |
| CN108768438A (en) * | 2018-08-21 | 2018-11-06 | 无锡华测电子系统有限公司 | A kind of 64 channel transmitting-receiving subassembly of solid-state |
| CN108931765A (en) * | 2018-04-20 | 2018-12-04 | 西安电子工程研究所 | High-power vertical tile type multi-channel digital receives and dispatches submatrix design method |
| CN109193132A (en) * | 2018-09-13 | 2019-01-11 | 垣纬多媒体卫星通信（上海）有限公司 | A kind of compact low-power consumption Ka frequency range transmitting multi-beam phased array antenna |
| CN109216938A (en) * | 2018-10-17 | 2019-01-15 | 成都瑞迪威科技有限公司 | A kind of low section miniaturization phased array antenna |
| CN109257061A (en) * | 2018-08-24 | 2019-01-22 | 中国电子科技集团公司第二十九研究所 | A kind of spaceborne K-band multichannel T/R constructing method of component |
| CN109444823A (en) * | 2018-10-17 | 2019-03-08 | 成都瑞迪威科技有限公司 | A kind of highly integrated active sum-difference network of phased array |
| CN110739537A (en) * | 2019-09-28 | 2020-01-31 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | High-density high-integration millimeter wave tile-type phase-controlled antenna T component |
| CN111103598A (en) * | 2019-12-26 | 2020-05-05 | 中国电子科技集团公司第五十五研究所 | Vehicle-mounted bidirectional transceiver based on millimeter wave active phased array |
| CN111257860A (en) * | 2020-04-28 | 2020-06-09 | 南京星腾通信技术有限公司 | Phased array antenna control system based on FPGA |
| CN112187309A (en) * | 2019-06-13 | 2021-01-05 | 中兴通讯股份有限公司 | Millimeter wave transceiver |
| CN112271448A (en) * | 2020-09-25 | 2021-01-26 | 北京空间飞行器总体设计部 | Phased array antenna of tile formula layering framework |
| CN112332075A (en) * | 2020-11-02 | 2021-02-05 | 中国电子科技集团公司第三十八研究所 | Multi-beam phased array integration system and method |
| CN112367093A (en) * | 2021-01-13 | 2021-02-12 | 成都天锐星通科技有限公司 | Phased array receiving radio frequency network and system |
| CN113328265A (en) * | 2021-04-27 | 2021-08-31 | 中国电子科技集团公司第十四研究所 | Extensible E-band digital active array |
| CN113364481A (en) * | 2021-05-13 | 2021-09-07 | 成都联帮微波通信工程有限公司 | Millimeter wave transceiving component processing technology |
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| CN113948848A (en) * | 2021-12-20 | 2022-01-18 | 成都瑞迪威科技有限公司 | Antenna interconnection structure with good grounding |
| CN114496996A (en) * | 2022-01-21 | 2022-05-13 | 中国电子科技集团公司第十研究所 | Electromagnetic shielding structure of TR subassembly |
| CN115986433A (en) * | 2023-03-21 | 2023-04-18 | 成都雷电微力科技股份有限公司 | TR module architecture and process method thereof |
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| CN108931765A (en) * | 2018-04-20 | 2018-12-04 | 西安电子工程研究所 | High-power vertical tile type multi-channel digital receives and dispatches submatrix design method |
| CN108767423A (en) * | 2018-04-27 | 2018-11-06 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | The expansible chip architecture of tile style TR component millimeter waves |
| CN108732563B (en) * | 2018-08-21 | 2024-02-09 | 无锡华测电子系统有限公司 | Multichannel tile formula transceiver module |
| CN108768438A (en) * | 2018-08-21 | 2018-11-06 | 无锡华测电子系统有限公司 | A kind of 64 channel transmitting-receiving subassembly of solid-state |
| CN108732563A (en) * | 2018-08-21 | 2018-11-02 | 无锡华测电子系统有限公司 | A kind of multichannel tile type transmitting-receiving subassembly |
| CN108768438B (en) * | 2018-08-21 | 2023-10-10 | 无锡华测电子系统有限公司 | Solid 64-channel receiving and transmitting assembly |
| CN109257061A (en) * | 2018-08-24 | 2019-01-22 | 中国电子科技集团公司第二十九研究所 | A kind of spaceborne K-band multichannel T/R constructing method of component |
| CN109193132A (en) * | 2018-09-13 | 2019-01-11 | 垣纬多媒体卫星通信（上海）有限公司 | A kind of compact low-power consumption Ka frequency range transmitting multi-beam phased array antenna |
| CN109193132B (en) * | 2018-09-13 | 2021-08-10 | 上海垣信卫星科技有限公司 | Compact low-power-consumption Ka frequency band emission multi-beam phased array antenna |
| CN109216938A (en) * | 2018-10-17 | 2019-01-15 | 成都瑞迪威科技有限公司 | A kind of low section miniaturization phased array antenna |
| CN109444823B (en) * | 2018-10-17 | 2023-08-29 | 成都瑞迪威科技有限公司 | Highly integrated active sum and difference network for phased array |
| CN109444823A (en) * | 2018-10-17 | 2019-03-08 | 成都瑞迪威科技有限公司 | A kind of highly integrated active sum-difference network of phased array |
| CN112187309A (en) * | 2019-06-13 | 2021-01-05 | 中兴通讯股份有限公司 | Millimeter wave transceiver |
| CN110739537A (en) * | 2019-09-28 | 2020-01-31 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | High-density high-integration millimeter wave tile-type phase-controlled antenna T component |
| CN110739537B (en) * | 2019-09-28 | 2021-06-15 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | High-density high-integration millimeter wave tile-type phase-controlled antenna T/R assembly |
| CN111103598A (en) * | 2019-12-26 | 2020-05-05 | 中国电子科技集团公司第五十五研究所 | Vehicle-mounted bidirectional transceiver based on millimeter wave active phased array |
| CN111103598B (en) * | 2019-12-26 | 2022-03-25 | 南京国微电子有限公司 | Vehicle-mounted bidirectional transceiver based on millimeter wave active phased array |
| CN111257860A (en) * | 2020-04-28 | 2020-06-09 | 南京星腾通信技术有限公司 | Phased array antenna control system based on FPGA |
| CN111257860B (en) * | 2020-04-28 | 2020-08-07 | 南京星腾通信技术有限公司 | Phased array antenna control system based on FPGA |
| CN112271448A (en) * | 2020-09-25 | 2021-01-26 | 北京空间飞行器总体设计部 | Phased array antenna of tile formula layering framework |
| CN112271448B (en) * | 2020-09-25 | 2022-12-27 | 北京空间飞行器总体设计部 | Phased array antenna of tile formula layering framework |
| CN112332075B (en) * | 2020-11-02 | 2022-04-15 | 中国电子科技集团公司第三十八研究所 | Multi-beam phased array integration system and method |
| CN112332075A (en) * | 2020-11-02 | 2021-02-05 | 中国电子科技集团公司第三十八研究所 | Multi-beam phased array integration system and method |
| CN112367093B (en) * | 2021-01-13 | 2021-04-02 | 成都天锐星通科技有限公司 | Phased array receiving radio frequency network and system |
| CN112367093A (en) * | 2021-01-13 | 2021-02-12 | 成都天锐星通科技有限公司 | Phased array receiving radio frequency network and system |
| CN113328265A (en) * | 2021-04-27 | 2021-08-31 | 中国电子科技集团公司第十四研究所 | Extensible E-band digital active array |
| CN113364481A (en) * | 2021-05-13 | 2021-09-07 | 成都联帮微波通信工程有限公司 | Millimeter wave transceiving component processing technology |
| CN113451776A (en) * | 2021-06-22 | 2021-09-28 | 广州中雷电科科技有限公司 | High-integration-level digital phased array system |
| CN113451776B (en) * | 2021-06-22 | 2024-03-26 | 广州中雷电科科技有限公司 | High-integration digital phased array system |
| CN113948848A (en) * | 2021-12-20 | 2022-01-18 | 成都瑞迪威科技有限公司 | Antenna interconnection structure with good grounding |
| CN114496996A (en) * | 2022-01-21 | 2022-05-13 | 中国电子科技集团公司第十研究所 | Electromagnetic shielding structure of TR subassembly |
| CN114496996B (en) * | 2022-01-21 | 2023-09-01 | 中国电子科技集团公司第十研究所 | Electromagnetic shielding structure of TR assembly |
| CN115986433A (en) * | 2023-03-21 | 2023-04-18 | 成都雷电微力科技股份有限公司 | TR module architecture and process method thereof |
| CN115986433B (en) * | 2023-03-21 | 2023-08-04 | 成都雷电微力科技股份有限公司 | TR module architecture and process method thereof |
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