CN113364481A - Millimeter wave transceiving component processing technology - Google Patents
Millimeter wave transceiving component processing technology Download PDFInfo
- Publication number
- CN113364481A CN113364481A CN202110522067.1A CN202110522067A CN113364481A CN 113364481 A CN113364481 A CN 113364481A CN 202110522067 A CN202110522067 A CN 202110522067A CN 113364481 A CN113364481 A CN 113364481A
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- printed board
- shielding box
- power supply
- carrying
- radio frequency
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- 238000005516 engineering process Methods 0.000 title claims abstract description 10
- 239000012212 insulator Substances 0.000 claims abstract description 10
- 238000004140 cleaning Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 230000007547 defect Effects 0.000 claims description 6
- 238000005245 sintering Methods 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 6
- 230000000903 blocking effect Effects 0.000 claims description 3
- 239000003990 capacitor Substances 0.000 claims description 3
- 230000005496 eutectics Effects 0.000 claims description 3
- 238000007689 inspection Methods 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
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- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses a millimeter wave transceiving component processing technology, belongs to the technical field of microwave electronic component production, and aims to provide a millimeter wave transceiving component processing technology which solves the problems of large size, overhigh power consumption and narrow frequency band of the existing equipment. The receiving and transmitting ports of the high-frequency antenna adopt 2.92-K radio frequency connectors, and the radio frequency modulation and intermediate frequency output ports adopt SMP connectors. The inside adopts upper and lower chamber structural design, and one side is microwave face layout microwave signal circuit, and the opposite side is power plane layout power control circuit, realizes the interconnection of circuit through the insulator between the both sides. The invention is suitable for the millimeter wave transceiving component processing technology.
Description
Technical Field
The invention belongs to the technical field of microwave electronic component production, and particularly relates to a millimeter wave transceiver component processing technology.
Background
The millimeter wave receiving and transmitting component generates a millimeter wave point frequency signal by adopting an internal frequency source, amplifies the signal and divides the power into two paths: one path is used as a local oscillation signal, and the millimeter wave signal of the receiving channel is converted to zero intermediate frequency for output; and the other path is used as a transmitting channel excitation signal, and power amplification output is carried out after radio frequency modulation.
In the prior art, an electric fitting process is mainly adopted, the size of a module is large, the power consumption is over 20W, the intermediate frequency output of a receiving channel after frequency conversion cannot reach zero intermediate frequency, and the frequency band is narrow.
Disclosure of Invention
The invention aims to: the millimeter wave transceiving component processing technology is provided, and the problems of large size, overhigh power consumption and narrow frequency band of the existing equipment are solved.
The technical scheme adopted by the invention is as follows:
a millimeter wave transceiving component processing technology comprises the following steps:
(1) wire bonding is carried out on the shielding box, a 2.92-K radio frequency connector is installed at a receiving port, a 2.92-K radio frequency connector is installed at a transmitting port, and an SMP connector is installed at an intermediate frequency output port;
(2) bonding the microwave signal printed board in the shielding box;
(3) conducting conductive adhesive solidification on the microwave signal printed board;
(4) cleaning redundant conductive adhesive on the microwave signal printed board;
(5) sintering the insulator on the microwave signal printed board;
(6) cleaning the sintered insulator;
(7) performing eutectic post-sintering treatment on the power amplifier chip;
(8) bonding the power amplifier chip into the shielding box;
(9) carrying out lead bonding on the power amplifier chip, the receiving port 2.92-K radio frequency connector, the transmitting port 2.92-K radio frequency connector and the SMP connector with the microwave signal printed board;
(10) carrying out moisture removal treatment on the power supply printed board;
(11) carrying out solder paste printing treatment on the power supply printed board;
(12) carrying out surface mounting processing on the power supply printed board;
(13) carrying out reflow soldering treatment on the power supply printed board;
(14) performing repair welding treatment on the reflow welding defects of the power supply printed board;
(15) cleaning the power supply printed board;
(16) performing self-checking on the power supply printed board, wherein the step 17 is performed when the self-checking is passed, and the step 14 is performed when the self-checking is not passed;
(17) installing a power supply printed board into the shielding box, and interconnecting the power supply printed board and the microwave signal printed board through the insulator to finish the initial assembly of the shielding box;
(18) checking the functions of all parts of the shielding box, entering step 19 when the functions are qualified, and performing rework on corresponding unqualified defects when the functions are unqualified;
(19) carrying out function debugging on the shielding box;
(20) performing a function test on the shielding box;
(21) carrying out cover sealing treatment on the shielding box;
(22) inspecting the appearance of the shielding box;
(23) after the appearance inspection is finished, the shielding box is subjected to product acceptance;
(24) and packaging the shielding boxes passing the acceptance check and warehousing.
Furthermore, an amplifier capable of working at a bandwidth of DC-300 MHz is selected, the bias circuit has no resonance point at DC-300 MHz, and the DC blocking capacitor can pass through a radio frequency signal at DC-300 MHz.
In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that:
1. the microwave surface of the invention adopts a micro-assembly process, which can greatly reduce the volume occupied by the product and the size can be less than half of the prior product. And meanwhile, the power consumption of the product is reduced. The actual power consumption of the product is 7.4W, the power consumption is more than 10W compared with the optimized range of the prior art, the long-term stable work of the product is facilitated, and the reliability of the product is greatly improved. Meanwhile, the receiving channel can reach zero intermediate frequency.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and that for those skilled in the art, other relevant drawings can be obtained according to the drawings without inventive effort, wherein:
FIG. 1 is a process flow diagram of the present invention;
FIG. 2 is a schematic diagram of the IF output of the receive channel of the present invention;
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention.
A millimeter wave transceiving component processing technology comprises the following steps:
(1) wire bonding is carried out on the shielding box, a 2.92-K radio frequency connector is installed at a receiving port, a 2.92-K radio frequency connector is installed at a transmitting port, and an SMP connector is installed at an intermediate frequency output port;
(2) bonding the microwave signal printed board in the shielding box;
(3) conducting conductive adhesive solidification on the microwave signal printed board;
(4) cleaning redundant conductive adhesive on the microwave signal printed board;
(5) sintering the insulator on the microwave signal printed board;
(6) cleaning the sintered insulator;
(7) performing eutectic post-sintering treatment on the power amplifier chip;
(8) bonding the power amplifier chip into the shielding box;
(9) carrying out lead bonding on the power amplifier chip, the receiving port 2.92-K radio frequency connector, the transmitting port 2.92-K radio frequency connector and the SMP connector with the microwave signal printed board;
(10) carrying out moisture removal treatment on the power supply printed board;
(11) carrying out solder paste printing treatment on the power supply printed board;
(12) carrying out surface mounting processing on the power supply printed board;
(13) carrying out reflow soldering treatment on the power supply printed board;
(14) performing repair welding treatment on the reflow welding defects of the power supply printed board;
(15) cleaning the power supply printed board;
(16) performing self-checking on the power supply printed board, wherein the step 17 is performed when the self-checking is passed, and the step 14 is performed when the self-checking is not passed;
(17) installing a power supply printed board into the shielding box, and interconnecting the power supply printed board and the microwave signal printed board through the insulator to finish the initial assembly of the shielding box;
(18) checking the functions of all parts of the shielding box, entering step 19 when the functions are qualified, and performing rework on corresponding unqualified defects when the functions are unqualified;
(19) carrying out function debugging on the shielding box;
(20) performing a function test on the shielding box;
(21) carrying out cover sealing treatment on the shielding box;
(22) inspecting the appearance of the shielding box;
(23) after the appearance inspection is finished, the shielding box is subjected to product acceptance;
(24) and packaging the shielding boxes passing the acceptance check and warehousing.
Furthermore, an amplifier capable of working at a bandwidth of DC-300 MHz is selected, the bias circuit has no resonance point at DC-300 MHz, and the DC blocking capacitor can pass through a radio frequency signal at DC-300 MHz.
In the implementation process of the invention, the microwave surface adopts a micro-assembly process, so that the volume occupied by the product can be greatly reduced, and the size of the product can be less than half of the size of the conventional product. And meanwhile, the power consumption of the product is reduced. The actual power consumption of the product is 7.4W, the power consumption is more than 10W compared with the optimized range of the prior art, the long-term stable work of the product is facilitated, and the reliability of the product is greatly improved. Meanwhile, the receiving channel can reach zero intermediate frequency.
The above description is an embodiment of the present invention. The foregoing is a preferred embodiment of the present invention, and the preferred embodiments in the preferred embodiments can be combined and used in any combination if not obviously contradictory or prerequisite to a certain preferred embodiment, and the specific parameters in the embodiments and examples are only for the purpose of clearly illustrating the verification process of the invention and are not intended to limit the patent protection scope of the present invention, which is subject to the claims and all the equivalent structural changes made by the content of the description and the drawings of the present invention are also included in the protection scope of the present invention.
Claims (2)
1. A millimeter wave transceiving component processing technology is characterized by comprising the following steps:
(1) wire bonding is carried out on the shielding box, a 2.92-K radio frequency connector is installed at a receiving port, a 2.92-K radio frequency connector is installed at a transmitting port, and an SMP connector is installed at an intermediate frequency output port;
(2) bonding the microwave signal printed board in the shielding box;
(3) conducting conductive adhesive solidification on the microwave signal printed board;
(4) cleaning redundant conductive adhesive on the microwave signal printed board;
(5) sintering the insulator on the microwave signal printed board;
(6) cleaning the sintered insulator;
(7) performing eutectic post-sintering treatment on the power amplifier chip;
(8) bonding the power amplifier chip into the shielding box;
(9) carrying out lead bonding on the power amplifier chip, the receiving port 2.92-K radio frequency connector, the transmitting port 2.92-K radio frequency connector and the SMP connector with the microwave signal printed board;
(10) carrying out moisture removal treatment on the power supply printed board;
(11) carrying out solder paste printing treatment on the power supply printed board;
(12) carrying out surface mounting processing on the power supply printed board;
(13) carrying out reflow soldering treatment on the power supply printed board;
(14) performing repair welding treatment on the reflow welding defects of the power supply printed board;
(15) cleaning the power supply printed board;
(16) performing self-checking on the power supply printed board, wherein the step 17 is performed when the self-checking is passed, and the step 14 is performed when the self-checking is not passed;
(17) installing a power supply printed board into the shielding box, and interconnecting the power supply printed board and the microwave signal printed board through the insulator to finish the initial assembly of the shielding box;
(18) checking the functions of all parts of the shielding box, entering step 19 when the functions are qualified, and performing rework on corresponding unqualified defects when the functions are unqualified;
(19) carrying out function debugging on the shielding box;
(20) performing a function test on the shielding box;
(21) carrying out cover sealing treatment on the shielding box;
(22) inspecting the appearance of the shielding box;
(23) after the appearance inspection is finished, the shielding box is subjected to product acceptance;
(24) and packaging the shielding boxes passing the acceptance check and warehousing.
2. The millimeter wave transceiver module processing process according to claim 1, further comprising the steps of: an amplifier capable of working at a bandwidth of DC-300 MHz is selected, a bias circuit has no resonance point at DC-300 MHz, and a DC blocking capacitor can pass through a radio frequency signal at DC-300 MHz.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110522067.1A CN113364481A (en) | 2021-05-13 | 2021-05-13 | Millimeter wave transceiving component processing technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110522067.1A CN113364481A (en) | 2021-05-13 | 2021-05-13 | Millimeter wave transceiving component processing technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113364481A true CN113364481A (en) | 2021-09-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110522067.1A Pending CN113364481A (en) | 2021-05-13 | 2021-05-13 | Millimeter wave transceiving component processing technology |
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| CN (1) | CN113364481A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201273946Y (en) * | 2008-09-19 | 2009-07-15 | 飞康技术(深圳)有限公司 | Single fiber bi-direction three-terminal transceiving component arrangement |
| CN201570679U (en) * | 2009-12-02 | 2010-09-01 | 成都联帮微波通信工程有限公司 | Novel microwave RF blind insert |
| CN202050038U (en) * | 2011-03-14 | 2011-11-23 | 南京才华科技集团有限公司 | Ka-band millimeter wave TR (transmitter-receiver) component |
| CN106654541A (en) * | 2017-02-20 | 2017-05-10 | 成都瑞迪威科技有限公司 | Millimeter-wave 64 array element tile type phased array antenna |
| CN206432957U (en) * | 2017-02-06 | 2017-08-22 | 南京华瓯电子科技有限公司 | A kind of ultra wide band millimeter wave frequency conversion component |
| CN211629275U (en) * | 2020-04-16 | 2020-10-02 | 四川汇英光电科技有限公司 | Phased array antenna |
-
2021
- 2021-05-13 CN CN202110522067.1A patent/CN113364481A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201273946Y (en) * | 2008-09-19 | 2009-07-15 | 飞康技术(深圳)有限公司 | Single fiber bi-direction three-terminal transceiving component arrangement |
| CN201570679U (en) * | 2009-12-02 | 2010-09-01 | 成都联帮微波通信工程有限公司 | Novel microwave RF blind insert |
| CN202050038U (en) * | 2011-03-14 | 2011-11-23 | 南京才华科技集团有限公司 | Ka-band millimeter wave TR (transmitter-receiver) component |
| CN206432957U (en) * | 2017-02-06 | 2017-08-22 | 南京华瓯电子科技有限公司 | A kind of ultra wide band millimeter wave frequency conversion component |
| CN106654541A (en) * | 2017-02-20 | 2017-05-10 | 成都瑞迪威科技有限公司 | Millimeter-wave 64 array element tile type phased array antenna |
| CN211629275U (en) * | 2020-04-16 | 2020-10-02 | 四川汇英光电科技有限公司 | Phased array antenna |
Non-Patent Citations (2)
| Title |
|---|
| 成立峰: "毫米波T/R组件微组装工艺技术研究", 《中国优秀硕士学位论文全文数据库》 * |
| 高宏伟: "《电子制造装备技术》", 1 September 2015, 西安电子科大出版社 * |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210907 |