CN213026629U

CN213026629U - Microwave device, high-frequency microwave multilayer PCB and radio frequency connector connecting device

Info

Publication number: CN213026629U
Application number: CN202022347101.XU
Authority: CN
Inventors: 陆青
Original assignee: Beijing Runke General Technology Co Ltd
Current assignee: Beijing Runke General Technology Co Ltd
Priority date: 2020-10-20
Filing date: 2020-10-20
Publication date: 2021-04-20
Anticipated expiration: 2030-10-20

Abstract

The utility model discloses a connecting device that high frequency microwave multilayer PCB board and radio frequency connect for connect high frequency microwave multilayer PCB board and radio frequency and connect, it includes: the grounding structure is used for isolating the high-frequency microwave multilayer PCB from the radio frequency connector and is fixedly connected with the high-frequency microwave multilayer PCB and the radio frequency connector; the insulator penetrates through the grounding structure and is fixedly connected with the grounding structure, one end of the insulator is fixedly connected with the high-frequency microwave multilayer PCB, and the other end of the insulator is fixedly connected with the radio frequency connector. The insulator is added for transition, so that the connection reliability can be ensured, and in addition, the thickness of the whole module can be prevented from being increased by adopting a high-frequency microwave multilayer PCB, so that the size is saved.

Description

Microwave device, high-frequency microwave multilayer PCB and radio frequency connector connecting device

Technical Field

The utility model relates to a microwave product technical field, in particular to connecting device that microwave device, high frequency microwave multilayer PCB board and radio frequency connect.

Background

At present, the installation method of the high-frequency microwave multilayer PCB and the radio frequency connector specifically comprises the following steps: the radio frequency connector is directly welded with the high-frequency microwave multilayer PCB. The connection mode is convenient to install and small in occupied space, but the radio frequency connector is directly fixed with the high-frequency microwave multilayer PCB, when an external input/output cable is connected with the radio frequency connector, the torsion of the radio frequency connector can deform or even damage the high-frequency microwave multilayer PCB in the process of screwing the radio frequency connector, and in addition, the grounding area between the radio frequency connector and the high-frequency microwave multilayer PCB is small, so that the high-frequency performance and the reliability of a product are influenced.

Therefore, how to provide a connection device for a high-frequency microwave multilayer PCB and a radio frequency connector to ensure the reliability of connection is a problem to be solved urgently by those skilled in the art.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model provides a high frequency microwave multilayer PCB board and radio frequency joint's connecting device guarantees the reliability of connecting. The utility model also provides a microwave device, this microwave device include the connecting device that above-mentioned high frequency microwave multilayer PCB board and radio frequency connect, this microwave device still includes high frequency microwave multilayer PCB board and radio frequency connect.

In order to achieve the above object, the utility model provides a following technical scheme:

a connecting device of a high frequency microwave multilayer PCB and a radio frequency connector, which is used for connecting the high frequency microwave multilayer PCB and the radio frequency connector, comprises:

the grounding structure is used for isolating the high-frequency microwave multilayer PCB from the radio frequency connector and is fixedly connected with the high-frequency microwave multilayer PCB and the radio frequency connector;

the insulator penetrates through the grounding structure and is fixedly connected with the grounding structure, one end of the insulator is fixedly connected with the high-frequency microwave multilayer PCB, and the other end of the insulator is fixedly connected with the radio frequency connector.

Optionally, in the above connection device, the ground structure is an L-shaped structure, one of the right-angle sides is used for mounting the insulator, and the other right-angle side is connected to the lower surface of the high-frequency microwave multilayer PCB by welding.

Optionally, in the above connection device, the length and the direction of the another rectangular side are the same as those of a microstrip line for transmitting radio frequency signals of the radio frequency connector.

Optionally, in the above-mentioned connecting device, the connecting device further includes a metal shielding structure, the metal shielding structure is connected with the ground structure in a matching manner to form a cavity structure, the cavity structure is accommodated in a sealing manner in the high-frequency microwave multilayer PCB, the high-frequency microwave multilayer PCB divides the cavity structure into an upper cavity and a lower cavity, and the other right-angle side is located in the lower cavity.

Optionally, in the above connection device, the metal shielding structure includes a cover plate portion and an L-shaped matching portion, the ground structure and the L-shaped matching portion are connected in a matching manner to form a bottom surface and a side surface of the cavity structure, the cover plate portion forms a top surface of the cavity structure, and the cover plate portion is detachable.

Optionally, in the above connection device, the insulator is welded to the high-frequency microwave multilayer PCB, the radio frequency connector is mounted on the ground structure by a screw, and the outer conductor of the insulator is sintered in the mounting hole of the ground structure by a high-temperature conductive adhesive.

Optionally, in the above connection device, the insulator is a glass insulator, and the mounting hole is a stepped hole.

Optionally, in the above connection device, the ground structure is a metal piece, and the ground structure is connected to the high-frequency microwave multilayer PCB by welding.

Optionally, in the above connection device, a plurality of blind holes are formed on a contact surface where the high-frequency microwave multilayer PCB board is welded to the ground structure.

A microwave device comprises a connecting device of a high-frequency microwave multilayer PCB and a radio frequency connector, wherein the connecting device of the high-frequency microwave multilayer PCB and the radio frequency connector is any one of the connecting device of the high-frequency microwave multilayer PCB and the radio frequency connector, and further comprises the high-frequency microwave multilayer PCB and the radio frequency connector.

The utility model provides a pair of connecting device that high frequency microwave multilayer PCB board and radio frequency connect carries on excessively through increasing the insulator, can guarantee the reliability of connecting, in addition, adopts a high frequency microwave multilayer PCB board can avoid increasing the thickness of whole module, has saved the volume.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a connection device of a high-frequency microwave multilayer PCB board and a radio frequency connector disclosed in an embodiment of the present invention;

fig. 2 is a schematic back view of the grounding structure corresponding to the position of the microstrip line disclosed in the embodiment of the present invention;

fig. 3 is a schematic front view of the grounding structure corresponding to the position of the microstrip line disclosed in the embodiment of the present invention.

Detailed Description

The utility model discloses a high frequency microwave multilayer PCB board and radio frequency joint's connecting device guarantees the reliability of connecting. The utility model also discloses a microwave device, this microwave device include the connecting device that above-mentioned high frequency microwave multilayer PCB board and radio frequency connect, this microwave device still includes high frequency microwave multilayer PCB board and radio frequency connect.

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

As shown in fig. 1-3, the utility model discloses a connecting device that high frequency microwave multilayer PCB board and radio frequency connect for connect high frequency microwave multilayer PCB board 1 and radio frequency connect 3, it includes: the grounding structure 5 is used for isolating the high-frequency microwave multilayer PCB 1 from the radio frequency connector 3, the grounding structure 5 is fixedly connected with the high-frequency microwave multilayer PCB 1 and the radio frequency connector 3, and specifically, the grounding structure 5 is a metal structural member; the insulator 4 penetrates through the grounding structure 5 and is fixedly connected with the grounding structure 5, one end of the insulator 4 is fixedly connected with the high-frequency microwave multilayer PCB 1, and the other end of the insulator is fixedly connected with the radio frequency connector 3. The utility model discloses in carry out excessively through increasing insulator 4, can guarantee the reliability of connection, in addition, adopt the thickness that a high frequency microwave multilayer PCB board 1 can avoid increasing whole module, saved the volume.

The utility model discloses a public insulator 4 can be ceramic insulator, glass insulator etc, the utility model discloses do not injecing to the type of concrete insulator, as long as can realize that ground structure 5 and high frequency microwave multilayer PCB board 1 be connected can.

In a specific embodiment, the grounding structure 5 is an L-shaped structure, one of the right-angle sides is used for mounting the insulator 4, and the other right-angle side is connected with the lower surface of the high-frequency microwave multilayer PCB board 1 in a welding manner. It should be noted that: the grounding structure 5 and the welding surface of the high-frequency microwave multilayer PCB 1 need to be subjected to gold plating operation to ensure full welding; the solder adopts high-temperature solder paste to be distinguished from the welding temperature of components on the high-frequency microwave multilayer PCB board 1. In the specific installation process, the welding tray tool can be manufactured, the L-shaped grounding structure 5 is embedded into a groove of the tray tool, the high-frequency microwave multilayer PCB 1 and the metal grounding structure 5 are compacted through the welding pressing block, and the periphery of the tool is fixed and compacted through screws. After the tool is fixed, the high-frequency microwave multilayer PCB 1 and the grounding structure 5 are tightly connected together by welding in a hot bench or reflow soldering mode. Referring to fig. 2, the grounding structure 5 is welded to the grounding portion on the back side of the high-frequency microwave multilayer PCB, and corresponds to the microstrip line on the front side, so as to complete the grounding integrity design. The use scene is more flexible, the dense blind holes of the grounding layer of the high-frequency microwave multilayer PCB 1 are connected with the structure part of the radio frequency connector 3 into a whole, and the reliable grounding characteristic of high-frequency signals in the transmission process is ensured.

It will be appreciated by those skilled in the art that the L-shaped grounding structure described above is only one specific embodiment of the grounding structure 5. In actual use, other embodiments also exist. For example, the embodiment shown in fig. 1 is taken as an example, and in another specific embodiment, a cover plate portion 61 shown in the figure may be used as a part of the grounding structure 5 in addition to the L-shaped grounding structure. As long as can realize keeping apart between high frequency microwave multilayer PCB board and the radio frequency joint to can utilize the insulator to realize that signal connection's between the two ground structure all can utilize in the embodiment of the utility model provides a, corresponding connecting device is also all in the utility model provides a protection scope. Alternatively, the shape and size of the portion of the grounding structure 5 soldered to the lower surface of the high-frequency microwave multilayer PCB board 1 follow the transmission path design of the radio frequency signal. Specifically, the length and the direction of the other right-angle side of the grounding structure 5 are respectively the same as those of the microstrip line 11 for transmitting the radio-frequency signal of the radio-frequency connector 3, the width of the other right-angle side of the grounding structure 5 is designed according to the width covered by the radio-frequency signal, specifically, the width of the other right-angle side of the grounding structure 5 can be slightly larger than that of the microstrip line 11, and the central axis of the microstrip line 11 is coincident with the central axis of the right-angle side. In other words, the other right-angled side of the grounding structure 5 serves as a base for arranging the microstrip line 11, and the grounding structure 5 is arranged according to the required length and direction of the microstrip line 11 and the coverage width of the corresponding radio frequency signal. Therefore, the non-signal line part on the back of the high-frequency microwave multilayer PCB is vacant, the arrangement of a power supply and a control circuit can be carried out on the non-signal line part on the back of the high-frequency microwave multilayer PCB, the design of various functional circuits can be completed, the flying line of radio-frequency signals and the complexity of the circuit can be reduced, a large amount of space is saved, and the miniaturization of a microwave circuit is realized. For example, the power supply and the control circuit may be arranged in a strip or square small unit module on the back of the high-frequency microwave multilayer PCB shown in fig. 2.

The embodiment of the utility model provides an in also utilize the back of high frequency microwave multilayer PCB board 1, carry out the device welding. The thickness of the whole module is reduced, partial volume is saved, and a large amount of later welding of power supplies and control lines is reduced. The non-signal line part on the back of the high-frequency microwave multilayer PCB board 1 is used for arranging a power supply and a control circuit, can complete the design of a plurality of functional circuits, is beneficial to reducing the flying line of a radio frequency signal and the complexity of the circuit, saves a large amount of space and realizes the miniaturization of a microwave circuit.

In a further embodiment, the connecting device further includes a metal shielding structure 6, specifically, the metal shielding structure 6 is connected with the grounding structure in a matching manner to form a cavity structure, the cavity structure hermetically accommodates the high-frequency microwave multilayer PCB board 1, the cavity structure is divided into an upper cavity and a lower cavity by the high-frequency microwave multilayer PCB board 1, and another right-angle edge of the grounding structure is located in the lower cavity, that is, a right-angle edge of the grounding structure 5, which is welded to the lower surface of the high-frequency microwave multilayer PCB board 1, is located in the lower cavity. The metal shielding structure 6 can play a role in shielding, so that the module has a good electromagnetic shielding effect, and electromagnetic radiation and electromagnetic crosstalk are prevented from occurring in a circuit. Specifically, referring to fig. 1, one side of the metal shielding structure 6 may be a right-angle side of the L-shaped grounding structure 5.

The above disclosed metal shielding structure 6 includes a cover portion 61 and an L-shaped fitting portion 62, specifically, the grounding structure 5 is connected with the L-shaped fitting portion 62 in a fitting manner to form a bottom surface and a side surface of the cavity structure, the cover portion 61 forms a top surface of the cavity structure, and the cover portion 61 is detachably connected. In practice, the cover plate portion 61 and the L-shaped fitting portion 62 may be provided as an integral structure as long as a sealed cavity structure can be formed.

In an optional embodiment, the insulator 4 is welded to the high-frequency microwave multilayer PCB 1, the radio frequency connector 3 is mounted on the grounding structure 5 by a screw, and the outer conductor of the insulator 4 is sintered in the mounting hole of the grounding structure 5 by a high-temperature conductive adhesive. The specific connection mode is disclosed herein, and other fixed connection modes can be adopted in practice, and the specific connection modes of the insulator 4, the high-frequency microwave multilayer PCB board 1 and the grounding structure 5 can be selected according to different requirements.

Optionally, the insulator 4 is a glass insulator, and the mounting hole of the grounding structure 5 for mounting the insulator 4 is a stepped hole. The axial limiting of the insulator 4 can be realized through the stepped hole, the insulator 4 is positioned when being installed, and the stability of the connection of the insulator 4 and other parts is ensured through preventing the axial movement of the insulator 4.

The utility model discloses a

ground structure

5 and 1 welded connection of high frequency microwave multilayer PCB board, this provides a concrete connected mode, also can adopt other fixed connection modes of realizing in practice, and all in protection range. In particular, in order to ensure the welding stability, dense blind holes are punched on the contact surface of the high-frequency microwave multilayer PCB 1 welded with the grounding structure 5, so as to ensure the sufficient grounding capability of the high-frequency microwave multilayer PCB. The number and size of the blind holes are not specifically limited, and the number of the blind holes can be set according to the actual situation and is within the protection range.

Furthermore, the utility model also discloses a microwave device, including the connecting device that high frequency microwave multilayer PCB board and radio frequency connect, still include high frequency microwave multilayer PCB board and radio frequency connect. The connecting device for the high-frequency microwave multilayer PCB and the radio frequency connector is the connecting device for the high-frequency microwave multilayer PCB and the radio frequency connector disclosed in the above embodiments, and therefore, the microwave device having the connecting device for the high-frequency microwave multilayer PCB and the radio frequency connector also has all the technical effects described above, and further description is omitted here.

The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A connecting device for connecting a high-frequency microwave multilayer PCB (1) and a radio frequency connector (3) is characterized by comprising:

the grounding structure (5) is used for isolating the high-frequency microwave multilayer PCB (1) and the radio frequency connector (3), and the grounding structure (5) is fixedly connected with the high-frequency microwave multilayer PCB (1) and the radio frequency connector (3);

the insulator (4), the insulator (4) pass ground structure (5), and with ground structure (5) fixed connection, insulator (4) one end with high frequency microwave multilayer PCB board (1) fixed connection, the other end with radio frequency joint (3) fixed connection.

2. The connecting device according to claim 1, characterized in that the grounding structure (5) is an L-shaped structure, wherein one square edge is used for mounting the insulator (4), and the other square edge is connected with the lower surface of the high-frequency microwave multilayer PCB (1) in a welding way.

3. The connecting device according to claim 2, characterized in that the length and direction of the other cathetus are the same as the length and direction of the microstrip line (11) for radio frequency signal transmission of the radio frequency connector (3).

4. The connecting device according to claim 2, further comprising a metal shielding structure (6), wherein the metal shielding structure (6) is connected with the grounding structure in a matching manner to form a cavity structure, the cavity structure hermetically accommodates the high-frequency microwave multilayer PCB (1), the high-frequency microwave multilayer PCB (1) divides the cavity structure into an upper cavity and a lower cavity, and the other right-angle edge is located in the lower cavity.

5. The connecting device according to claim 4, characterized in that the metallic shielding structure (6) comprises a cover plate portion (61) and an L-shaped mating portion (62), the grounding structure (5) and the L-shaped mating portion (62) are cooperatively connected to form a bottom surface and a side surface of the cavity structure, the cover plate portion (61) forms a top surface of the cavity structure, and the cover plate portion (61) is detachable.

6. The connecting device according to claim 1, characterized in that the insulator (4) is welded to the high frequency microwave multilayer PCB (1), the radio frequency connector (3) is mounted on the grounding structure (5) by screws, and the outer conductor of the insulator (4) is sintered in the mounting hole of the grounding structure (5) by high temperature conductive glue.

7. Connecting device according to claim 6, characterized in that the insulator (4) is a glass insulator and the mounting hole is a stepped hole.

8. The connecting device according to claim 1, wherein the grounding structure (5) is a metal piece, and the grounding structure (5) is welded with the high-frequency microwave multilayer PCB (1).

9. The connecting device according to claim 8, wherein the interface of the high frequency microwave multilayer PCB board (1) and the grounding structure (5) is welded with a plurality of blind holes.

10. A microwave device, characterized in that it comprises a connecting device of a high frequency microwave multilayer PCB board and a radio frequency connector according to any of claims 1-9, and further comprises said high frequency microwave multilayer PCB board (1) and said radio frequency connector (3).