CN116505245A - Combined sub-millimeter wave phased array antenna and working method thereof - Google Patents
Combined sub-millimeter wave phased array antenna and working method thereof Download PDFInfo
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- CN116505245A CN116505245A CN202310385472.2A CN202310385472A CN116505245A CN 116505245 A CN116505245 A CN 116505245A CN 202310385472 A CN202310385472 A CN 202310385472A CN 116505245 A CN116505245 A CN 116505245A
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- 238000000034 method Methods 0.000 title claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 95
- 229910052751 metal Inorganic materials 0.000 claims abstract description 56
- 239000002184 metal Substances 0.000 claims abstract description 56
- 229910000679 solder Inorganic materials 0.000 claims abstract description 55
- SWPMTVXRLXPNDP-UHFFFAOYSA-N 4-hydroxy-2,6,6-trimethylcyclohexene-1-carbaldehyde Chemical compound CC1=C(C=O)C(C)(C)CC(O)C1 SWPMTVXRLXPNDP-UHFFFAOYSA-N 0.000 claims abstract 13
- 230000005855 radiation Effects 0.000 claims description 19
- 239000000919 ceramic Substances 0.000 claims description 18
- 230000008569 process Effects 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 7
- 238000009434 installation Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 58
- 238000004891 communication Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 230000010354 integration Effects 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 238000005219 brazing Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
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- 230000009286 beneficial effect Effects 0.000 description 1
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- 238000005266 casting Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
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- 239000011229 interlayer Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
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- 239000002002 slurry Substances 0.000 description 1
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- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q3/00—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
- H01Q3/26—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Radar Systems Or Details Thereof (AREA)
Abstract
The invention provides a combined sub-millimeter wave phased array antenna and a working method thereof, wherein the method comprises the following steps: HTCC base plate, TR chip, PCB base plate, radio frequency connector and low frequency connector; the radio frequency connector is welded on the lower surface of the PCB substrate and is used for transmitting microwave signals; the low-frequency connector is welded on the lower surface of the PCB substrate and is used for supplying power to the TR chip; the upper surface of the PCB substrate is connected with the lower surface of the HTCC substrate through a plurality of first metal solder balls, and a mounting space of a TR chip is formed between the adjacent first metal solder balls; the TR chip is positioned between the HTCC substrate and the PCB substrate and is welded on the lower surface of the HTCC substrate through the second metal solder ball. The invention can reduce the cost of the phased array antenna and meet the requirements of miniaturization and light weight of the phased array antenna.
Description
Technical Field
The invention relates to the technical field of phased arrays, in particular to a combined sub-millimeter wave phased array antenna and a working method thereof.
Background
In recent years, phased array antennas have been widely used with the advantages of beam scanning in a large airspace, beam agility, high-power space synthesis, and the like, and along with the rapid development of 5G communication technology and satellite communication technology, the demands of a communication system for low cost, miniaturization and light weight of phased array antennas are increasingly urgent.
Disclosure of Invention
The invention discloses a combined type submillimeter wave phased array antenna and a working method thereof, which are used for solving the problems of high difficulty, high cost and large volume of the integration of a submillimeter wave frequency band.
The technical scheme of the invention is as follows:
according to a first aspect of the present disclosure there is provided a combined sub-millimeter wave phased array antenna comprising:
HTCC base plate, TR chip, PCB base plate, radio frequency connector and low frequency connector; the radio frequency connector is welded on the lower surface of the PCB substrate and is used for transmitting microwave signals; the low-frequency connector is welded on the lower surface of the PCB substrate and is used for supplying power to the TR chip; the upper surface of the PCB substrate is connected with the lower surface of the HTCC substrate through a plurality of first metal solder balls, and a mounting space of a TR chip is formed between the adjacent first metal solder balls; the TR chip is positioned between the HTCC substrate and the PCB substrate and is welded on the lower surface of the HTCC substrate through the second metal solder ball.
In a specific embodiment, the HTCC substrate is a multilayer ceramic structure with a metallized via hole inside, and the multilayer ceramic structure of the HTCC substrate sequentially comprises a device surface-mounted layer, a ceramic layer, a control and power supply layer, a ceramic layer, a submillimeter wave feed network layer, a ceramic layer and a radiation antenna array layer from bottom to top; the device surface-mounted layer, the control and power supply layer, the sub-millimeter wave feed network layer and the radiation antenna array layer are interconnected through the metallized via holes.
In one embodiment, the diameter of the first metal ball is greater than the diameter of the second metal ball.
In one embodiment, the connection of the upper surface of the PCB substrate to the lower surface of the HTCC substrate through the plurality of first metal solder balls comprises:
the upper surface of the PCB substrate and the device surface-mounted layer of the HTCC substrate are welded through a plurality of first metal solder balls by using a reflow welding process.
In one embodiment, the printed circuit board is arranged in the PCB substrate and on the surface of the PCB substrate, and the printed circuit board is used for realizing transmission of radio frequency, control and power supply signals.
In one embodiment, the radiating antenna array layer is comprised of an arrangement of a plurality of radiating elements.
In one specific embodiment, the control and power supply method of the TR chip specifically includes:
control and power supply signals enter the PCB substrate through the low-frequency connector, are transmitted to the first metal solder balls through the PCB substrate and then are fed into the control and power supply layer of the HTCC substrate, and enter the TR chip after being transmitted to the second metal solder balls through the control and power supply layer, so that control and power supply to the TR chip are realized.
In another aspect, the present invention further provides a method for operating a phased array antenna, including:
when the phased array antenna works, microwave signals enter the PCB substrate through the radio frequency connector, are transmitted to the first metal solder balls by the PCB substrate and then are fed into the device surface-mounted layer, are transmitted to the second metal solder balls by the device surface-mounted layer, are then fed into the TR chip, are processed by the TR chip, generate microwave signals with required amplitude and phase, are fed into the sub-millimeter wave feed network layer by the first metal solder balls, and are transmitted to the radiation antenna array layer through transmission of the sub-millimeter wave feed network layer, so that space radiation is finally formed.
Compared with the prior art, the technical scheme provided by the invention has the following beneficial effects:
the problems of high integration difficulty, high cost and large volume of the prior art in the sub-millimeter wave frequency band are solved through the mode of mixing and stacking the HTCC substrate and the PCB substrate, and a feasible scheme is provided for realizing low cost, miniaturization and light weight of the sub-millimeter wave phased array.
It should be understood that what is described in this summary is not intended to limit the critical or essential features of the embodiments of the disclosure nor to limit the scope of the disclosure. Other features of the present disclosure will become apparent from the following description.
Drawings
The above and other features, advantages and aspects of embodiments of the present disclosure will become more apparent by reference to the following detailed description when taken in conjunction with the accompanying drawings. For a better understanding of the present disclosure, and without limiting the disclosure thereto, the same or similar reference numerals denote the same or similar elements, wherein:
FIG. 1 shows a three-dimensional schematic of a phased array antenna with a HTCC substrate stacked with a PCB substrate;
FIG. 2 shows a schematic cross-sectional view of a phased array antenna with a HTCC substrate stacked with a PCB substrate;
reference numerals in the schematic drawings illustrate:
HTCC substrate 2.PCB substrate 3. Metallized via 4. Radiating antenna array layer
5. A submillimeter wave feed network layer 6, a control layer 7, a device surface-mounted layer 8.TR chip
9. Second metal solder ball 10, first metal solder ball 11, radio frequency connector 12, low frequency connector
Detailed Description
For the purposes of making the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present disclosure, and it is apparent that the described embodiments are some embodiments of the present disclosure, but not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments in this disclosure without inventive faculty, are intended to be within the scope of this disclosure.
In addition, the term "and/or" herein is merely an association relationship describing an association object, and means that three relationships may exist, for example, a and/or B may mean: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.
In the method, the heat dissipation capacity of the phased array antenna is improved through the combination of the HTCC substrate and the PCB substrate, the cost of the phased array antenna is reduced, and the requirements of miniaturization and light weight of the phased array antenna are met.
Example 1
A phased array antenna provided by embodiments of the present disclosure is described below with reference to fig. 1 and 2.
The embodiment provides a combined type submillimeter wave phased array antenna, wherein the upper surface of a PCB substrate and a device surface-mounted layer of an HTCC substrate are welded through a plurality of first metal solder balls by using a reflow soldering process.
Wherein, high temperature co-fired Ceramic HTCC (High Temperature co-visual Ceramic) is printed on 92-96% alumina casting Ceramic green body by adopting high melting point metal heating resistor slurry made of tungsten, molybdenum, manganese and the like according to the design requirement of a heating circuit, and then is laminated in a plurality of layers by 4-8% sintering auxiliary agent, and is co-fired into a whole at a high temperature of 1500-1600 ℃.
And in the reflow soldering process, the solder of mechanical and electrical connection between the soldering terminal or pin of the surface-assembled component and the printed board bonding pad is realized by remelting the paste solder pre-distributed on the printed board bonding pad.
Referring to fig. 1-2, the present disclosure proposes a combined sub-millimeter wave phased array antenna comprising:
an HTCC substrate 1, a TR chip 8, a PCB substrate 2, a radio frequency connector 11, and a low frequency connector 12; the radio frequency connector 11 is welded on the lower surface of the PCB substrate 2 by adopting a high-temperature brazing process, and a sub-millimeter wave signal enters the integral structure from the radio frequency connector 11; the low-frequency connector 12 is welded on the lower surface of the PCB substrate 2 by adopting a high-temperature brazing process, control and power supply signals enter the whole structure from the low-frequency connector 12, and the low-frequency connector 12 mainly supplies power for the TR chip 8; the upper surface of the PCB substrate 2 is connected with the lower surface of the HTCC substrate 1 through a plurality of first metal solder balls 10, the plurality of first metal solder balls 10 are distributed in a certain array, and a certain installation space is formed between the adjacent first metal solder balls 10 and the upper surface of the PCB substrate 2 and between the adjacent first metal solder balls 10 and the lower surface of the HTCC substrate 1, and is the installation space of the TR chip 8; the TR chip 8 is located in the mounting space and is soldered to the lower surface of the HTCC substrate 1 through the second metal solder balls 9.
In this embodiment, the HTCC process used by the HTCC substrate 1 has the advantages of high processing precision, multiple processing layers, and high interlayer three-dimensional interconnection flexibility, and can integrate the submillimeter wave radiation antenna array, the submillimeter wave feed network, the control and the power supply network with higher precision requirements, and meanwhile, the mounting space of the TR chips 8 is formed by adopting the metal solder balls with different diameters, so as to realize the mounting of the TR chips 8.
In this embodiment, the HTCC substrate 1 is a multilayer ceramic structure with a metallized via hole inside, and the multilayer ceramic structure of the HTCC substrate 1 sequentially includes, from bottom to top, a device surface-mounted layer 7, a ceramic layer, a control and power supply layer 6, a ceramic layer, a submillimeter wave feed network layer 5, a ceramic layer, and a radiation antenna array layer 4; the device surface-mounted layer 7, the control and power supply layer 6, the sub-millimeter wave feed network layer 5 and the radiation antenna array layer 4 are interconnected through the metallized via 3.
In this embodiment, the device surface-mounted layer 7 is mainly used for soldering devices such as TR chips, and for realizing communication between metal solder balls.
In the above embodiment, the first metal solder ball 10 and the second metal solder ball 9 are soldered on the lower surface of the HTCC substrate 1, that is, the device surface mount layer 7 of the HTCC substrate 1.
In this embodiment, the control and power supply layer 6 is mainly used for transmitting control and power supply signals to the TR chip; the sub-millimeter wave feed network layer 5 is mainly used for transmitting sub-millimeter wave signals to the radiation antenna array layer 4; the radiating antenna array layer 4 is mainly used for completing the final radiating task.
In this embodiment, the HTCC substrate 1 is an HTCC substrate 1 that is formed by sintering a plurality of layers of ceramic materials and a plurality of layers of metal materials and integrates antenna radiation, a feed network and power supply control, wherein the metal materials of each layer of the HTCC substrate 1 can be vertically interconnected by a metallized via hole, and the metal materials of each layer can also be mutually overlapped. The HTCC substrate 1 in the present embodiment has good electromagnetic wave transmission performance and flexible circuit design characteristics, and can realize a multi-layer circuit layout.
In this embodiment, the TR chip 8 is a semiconductor chip having functions of transmitting and receiving signals, amplifying, phase-shifting, attenuating, and the like.
In the present embodiment, the diameter of the first metal solder ball 10 is larger than the diameter of the second metal solder ball 9; the first metal solder ball 10 is a solder ball with a larger diameter of 500um, and the second metal solder ball 9 is a solder ball with a smaller diameter of 80um. The use of metal solder balls of different diameters creates a mounting space for TR chip 8 while achieving connection up and down.
In the present embodiment, the signal in the HTCC substrate 1 is transmitted into the PCB substrate 2 through the first metal solder balls 10; the signal on the TR chip 8 is transferred into the HTCC substrate 1 through the second metal solder balls 9.
In the present embodiment, the connection of the upper surface of the PCB substrate 2 and the lower surface of the HTCC substrate 1 through the plurality of first metal solder balls 10 includes:
the upper surface of the PCB substrate 2 and the device surface mount layer 7 of the HTCC substrate 1 are soldered by a reflow process through a plurality of first metal solder balls 10. The PCB substrate 2 with low use cost is combined with the HTCC substrate 1 with good heat conductivity, so that the heat dissipation capacity of the phased array antenna is improved, and meanwhile, the cost of the phased array antenna is reduced.
In this embodiment, the PCB substrate 2 is provided with a printed circuit inside and on the surface thereof for implementing transmission of radio frequency, control and power supply signals.
In the present embodiment, the radiation antenna array layer 4 is composed of a plurality of radiation element arrangements.
According to an embodiment of the present invention, there is also provided a control and power supply method of the TR chip 8, including:
control and power supply signals enter the PCB substrate 2 through the low-frequency connector 12, are fed into the control and power supply layer 6 of the HTCC substrate 1 after being transmitted to the first metal solder balls 10 through the PCB substrate 2, enter the TR chip 8 after being transmitted to the second metal solder balls 9 through the control and power supply layer 6, and realize control and power supply to the TR chip 8.
According to an embodiment of the present invention, the present invention further provides a method for operating a phased array antenna, including:
when the phased array antenna works, microwave signals enter the PCB substrate 2 through the radio frequency connector 11, are transmitted to the first metal solder balls 10 from the PCB substrate 2 and then are fed into the device surface-mounted layer 7, are transmitted to the second metal solder balls 9 through the device surface-mounted layer 7, are then fed into the TR chip 8, are processed by the TR chip 8, generate microwave signals with required amplitude and phase, are fed into the sub-millimeter wave feed network layer 5 through the first metal solder balls 10, and are transmitted to the radiation antenna array layer 4 through the transmission of the sub-millimeter wave feed network layer 5, so that space radiation is finally formed.
According to the embodiment of the disclosure, the following technical effects are achieved:
the problems of high integration difficulty, high cost and large volume of the prior art in the sub-millimeter wave frequency band are solved through the combination mode of the HTCC substrate and the PCB substrate, and a feasible scheme is provided for realizing low cost, miniaturization and light weight of the sub-millimeter wave phased array.
In the description of the present specification, the terms "connected," "mounted," "secured," and the like are to be construed broadly, and for example, "connected" may be a fixed connection, a removable connection, or an integral connection; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.
In the description of the present specification, the terms "one embodiment," "some embodiments," and the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing is merely a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and variations may be made to the present application by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.
Claims (10)
1. A combined sub-millimeter wave phased array antenna comprising: an HTCC substrate (1), a TR chip (8), a PCB substrate (2), a radio frequency connector (11) and a low frequency connector (12);
the radio frequency connector (11) is welded on the lower surface of the PCB substrate (2) and is used for transmitting microwave signals;
the low-frequency connector (12) is welded on the lower surface of the PCB substrate (2) and is used for supplying power to the TR chip (8);
the upper surface of the PCB substrate (2) is connected with the lower surface of the HTCC substrate (1) through a plurality of first metal solder balls (10), and an installation space of the TR chip (8) is formed between the adjacent first metal solder balls (10);
the TR chip (8) is located between the HTCC substrate (1) and the PCB substrate (2), and is welded to the lower surface of the HTCC substrate (1) through the second metal solder ball (9).
2. The phased array antenna of claim 1, wherein the antenna comprises a plurality of antenna elements,
the HTCC substrate (1) is of a multilayer ceramic structure with a metalized via hole (3) arranged inside;
the multi-layer ceramic structure of the HTCC substrate (1) comprises a device surface-mounted layer (7), a ceramic layer, a control and power supply layer (6), a ceramic layer, a sub-millimeter wave feed network layer (5), a ceramic layer and a radiation antenna array layer (4) from bottom to top in sequence;
the device surface-mounted layer (7), the control and power supply layer (6), the sub-millimeter wave feed network layer (5) and the radiation antenna array layer (4) are interconnected through the metallized via (3).
3. The phased array antenna of claim 2, wherein the antenna comprises a plurality of antenna elements,
the diameter of the first metal ball (10) is larger than the diameter of the second metal ball (9).
4. A phased array antenna according to claim 3, characterized in that the connection of the upper surface of the PCB substrate (2) with the lower surface of the HTCC substrate (1) by means of a plurality of first metal solder balls (10) comprises:
the upper surface of the PCB substrate (2) and the device surface-mounted layer (7) of the HTCC substrate (1) are welded by a reflow process through a plurality of first metal solder balls (10).
5. The phased array antenna of claim 4, wherein the antenna comprises a plurality of antenna elements,
and the inner part and the surface of the PCB substrate (2) are respectively provided with a printed circuit for realizing the transmission of radio frequency, control and power supply signals.
6. The phased array antenna of claim 5, wherein the antenna comprises a plurality of antenna elements,
the radiation antenna array layer (4) is composed of a plurality of radiation units arranged.
7. The phased array antenna of claim 6, wherein the antenna comprises a plurality of antenna elements,
the diameter of the first metal solder ball (10) is 500um, and the diameter of the second metal solder ball (9) is 80um.
8. The phased array antenna of claim 7,
the TR chip (8) is a semiconductor chip and has the functions of receiving and transmitting signals, amplifying, phase shifting and attenuating.
9. A control and power supply method applied to the TR chip (8) as claimed in any one of claims 1 to 8, characterized in that it comprises:
control and power supply signals enter the PCB substrate (2) through the low-frequency connector (12), are transmitted to the first metal solder balls (10) through the PCB substrate (2) and then are fed into the control and power supply layer (6) of the HTCC substrate (1), and enter the TR chip (8) after being transmitted to the second metal solder balls (9) through the control and power supply layer (6), so that control and power supply to the TR chip (8) are realized.
10. A method of operation for use with a phased array antenna as claimed in any one of claims 1 to 6, the method comprising:
when the phased array antenna works, microwave signals enter the PCB substrate (2) through the radio frequency connector (11), are transmitted to the first metal solder balls (10) through the PCB substrate (2) and then are fed into the device surface-mounted layer (7), are transmitted to the second metal solder balls (9) through the device surface-mounted layer (7), are fed into the TR chip (8), are processed by the TR chip (8) to generate microwave signals with required amplitude and phase, are fed into the sub-millimeter wave feed network layer (5) through the first metal solder balls (10), are transmitted to the radiation antenna array layer (4) through the transmission of the sub-millimeter wave feed network layer (5), and finally form space radiation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310385472.2A CN116505245A (en) | 2023-04-12 | 2023-04-12 | Combined sub-millimeter wave phased array antenna and working method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310385472.2A CN116505245A (en) | 2023-04-12 | 2023-04-12 | Combined sub-millimeter wave phased array antenna and working method thereof |
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| CN116505245A true CN116505245A (en) | 2023-07-28 |
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| CN202310385472.2A Pending CN116505245A (en) | 2023-04-12 | 2023-04-12 | Combined sub-millimeter wave phased array antenna and working method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117082730A (en) * | 2023-09-20 | 2023-11-17 | 成都华兴大地科技有限公司 | Airtight multilayer ceramic structure |
-
2023
- 2023-04-12 CN CN202310385472.2A patent/CN116505245A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117082730A (en) * | 2023-09-20 | 2023-11-17 | 成都华兴大地科技有限公司 | Airtight multilayer ceramic structure |
| CN117082730B (en) * | 2023-09-20 | 2024-02-09 | 成都华兴大地科技有限公司 | Airtight multilayer ceramic structure |
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