CN116470270A - Co-fired ceramic phased array antenna - Google Patents
Co-fired ceramic phased array antenna Download PDFInfo
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- CN116470270A CN116470270A CN202310385060.9A CN202310385060A CN116470270A CN 116470270 A CN116470270 A CN 116470270A CN 202310385060 A CN202310385060 A CN 202310385060A CN 116470270 A CN116470270 A CN 116470270A
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- 239000000919 ceramic Substances 0.000 title claims abstract description 134
- 239000000758 substrate Substances 0.000 claims abstract description 99
- 230000005855 radiation Effects 0.000 claims abstract description 24
- 229910052751 metal Inorganic materials 0.000 claims description 40
- 239000002184 metal Substances 0.000 claims description 40
- 238000000034 method Methods 0.000 claims description 11
- 229910000833 kovar Inorganic materials 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 238000003466 welding Methods 0.000 claims description 6
- 230000010363 phase shift Effects 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 7
- 230000010354 integration Effects 0.000 abstract description 4
- 239000000956 alloy Substances 0.000 description 11
- 238000005219 brazing Methods 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 5
- 230000035882 stress Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000010344 co-firing Methods 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0087—Apparatus or processes specially adapted for manufacturing antenna arrays
- H01Q21/0093—Monolithic arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/061—Two dimensional planar arrays
- H01Q21/065—Patch antenna array
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Details Of Aerials (AREA)
Abstract
Embodiments of the present disclosure provide a co-fired ceramic phased array antenna comprising: the device comprises a low-temperature co-fired ceramic substrate, a radiation antenna array, a radio frequency feed network, a high-temperature co-fired ceramic substrate, a control and power supply network, a radio frequency interface and a device-level TR component; the radio frequency interface is welded on the lower surface of the high-temperature co-fired ceramic substrate; the control and power supply network is positioned in the high-temperature cofired ceramic substrate; the device-level TR component is welded on the lower surface of the high-temperature co-fired ceramic substrate; the upper surface of the high-temperature co-fired ceramic substrate and the lower surface of the low-temperature co-fired ceramic substrate are welded to form a mixed stacked ceramic substrate; the radio frequency feed network is positioned in the low-temperature co-fired ceramic substrate; the radiation antenna array is positioned on the upper surface of the low-temperature co-fired ceramic substrate. In this way, the internal stress of the whole structure can be reduced, the heat dissipation capacity of the phased array antenna is improved, the radiation performance of the phased array antenna is enhanced, the miniaturization, integration and light weight of the phased array antenna are realized, and meanwhile, the phased array antenna is guaranteed to have good reliability.
Description
Technical Field
The invention relates to the technical field of phased array antennas, in particular to a co-fired ceramic phased array antenna.
Background
In recent years, phased array antennas have been widely used with the advantages of beam scanning in a large airspace, beam agility, high-power space synthesis, and the like, and along with the rapid development of 5G communication technology and satellite communication technology, the demands of a communication system for low cost, miniaturization and light weight of phased array antennas are increasingly urgent.
But is limited by the characteristic of circuit board material, the existing phased array antenna has poor heat dissipation capability, so that the temperature of a power chip is overheated, great threat is caused to the use safety, and the performance improvement of the phased array antenna is severely restricted. Therefore, the method for improving the heat radiation capability of the phased array antenna and enhancing the radiation performance of the phased array antenna is a key for realizing the light weight and the miniaturization of the phased array antenna.
Disclosure of Invention
In order to solve the technical problems, the present disclosure provides a co-fired ceramic phased array antenna, which is used for solving the problems of poor heat dissipation capability and weak radiation performance of the existing phased array antenna, thereby meeting the requirements of miniaturization, integration and light weight of the phased array antenna and simultaneously ensuring good reliability.
According to a first aspect of the present invention there is provided a co-fired ceramic phased array antenna comprising: the device comprises a low-temperature co-fired ceramic substrate, a radiation antenna array, a radio frequency feed network, a high-temperature co-fired ceramic substrate, a control and power supply network, a radio frequency interface and a device-level TR component; wherein,,
the radio frequency interface is welded on the lower surface of the high-temperature co-fired ceramic substrate;
the control and power supply network is positioned in the high-temperature cofired ceramic substrate;
the device-level TR component is welded on the lower surface of the high-temperature co-fired ceramic substrate;
the upper surface of the high-temperature co-fired ceramic substrate and the lower surface of the low-temperature co-fired ceramic substrate are welded to form a mixed stacked ceramic substrate;
the radio frequency feed network is positioned in the low-temperature co-fired ceramic substrate;
the radiation antenna array is positioned on the upper surface of the low-temperature co-fired ceramic substrate.
In one embodiment, the low temperature co-fired ceramic substrate and the high temperature co-fired ceramic substrate are both multilayer ceramic structures;
the forming of the hybrid stacked ceramic substrate by welding the upper surface of the high temperature co-fired ceramic substrate and the lower surface of the low temperature co-fired ceramic substrate comprises: the upper surface of the high-temperature co-fired ceramic substrate and the lower surface of the low-temperature co-fired ceramic substrate are welded through a metal solder ball A to form a mixed stacked ceramic substrate;
the welding of device level TR subassembly at the lower surface of high temperature cofired ceramic substrate includes: the device-level TR component is welded on the lower surface of the high-temperature co-fired ceramic substrate through a metal solder ball B.
In one embodiment, the control and power supply network is comprised of multiple layers of metal circuits electrically connected to each other by metal posts within the high temperature co-fired ceramic substrate.
In one embodiment, the radio frequency feed network is comprised of multiple layers of metal circuits and resistive elements.
In one embodiment, the radiating antenna array is comprised of a plurality of identical metallic circuits arranged uniformly.
In one embodiment, the phased array antenna further comprises a mounting structure welded to the lower surface of the high temperature co-fired ceramic substrate; the device-level TR component is positioned in the mounting structure, and an elastic insulating heat conducting pad is arranged between the device-level TR component and the mounting structure.
In one embodiment, one end of the radio frequency interface is connected with a metal column in the high-temperature co-fired ceramic substrate, and the other end penetrates through the mounting structure; the phased array antenna further comprises a control power supply connector, one end of the control power supply connector is connected with a control and power supply network positioned in the high-temperature co-fired ceramic substrate, and the other end of the control power supply connector penetrates through the mounting structure.
In one embodiment, the mounting structure, the radio frequency interface and the control power connector are made of kovar alloy materials.
According to a second aspect of the present invention there is provided a method for application to a co-fired ceramic phased array antenna, the method comprising:
when the phased array antenna works, microwave signals enter a radio frequency interface and enter a radio frequency feed network in the low-temperature co-fired ceramic substrate through metal columns in the high-temperature co-fired ceramic substrate; after power distribution is carried out by the radio frequency feed network, metal columns in the high-temperature co-fired ceramic substrate enter a collection port of the device-level TR component; the device-level TR component amplifies the signal, phase-shifts the signal and feeds the signal into the radiation antenna array through the metal column in the high-temperature co-fired ceramic substrate, and finally space radiation is formed.
Compared with the prior art, the technical scheme provided by the invention has the following beneficial effects:
the structure of combining low-temperature co-fired ceramic and high-temperature co-fired ceramic is matched with the kovar alloy material component, so that the internal stress of the whole structure is reduced, the heat dissipation capacity of the phased array antenna is improved, the radiation performance of the phased array antenna is enhanced, and the miniaturization, integration and light weight of the phased array antenna are realized while good reliability is ensured.
It should be understood that what is described in this summary is not intended to limit the critical or essential features of the embodiments of the disclosure nor to limit the scope of the disclosure. Other features of the present disclosure will become apparent from the following description.
Drawings
The above and other features, advantages and aspects of embodiments of the present disclosure will become more apparent by reference to the following detailed description when taken in conjunction with the accompanying drawings. For a better understanding of the present disclosure, and without limiting the disclosure thereto, the same or similar reference numerals denote the same or similar elements, wherein:
FIG. 1 is a schematic diagram of a structure of an embodiment of the present disclosure;
fig. 2 is a circuit diagram of a radiating antenna array in accordance with an embodiment of the present disclosure;
fig. 3 is a circuit diagram of a radio frequency feed network of an embodiment of the present disclosure;
FIG. 4 is a control and power network circuit diagram of an embodiment of the present disclosure;
the reference numerals in the schematic drawings indicate:
1. the low-temperature co-fired ceramic substrate 2, the radiation antenna array 3, the radio frequency feed network 4, the high-temperature co-fired ceramic substrate 5, the control and power supply network 6, the mounting structure 7, the radio frequency interface 8 and the control and power supply connector
9. Metal solder ball A10, elastic insulating heat conducting pad 11, device level TR component 12, metal solder ball B
Detailed Description
For the purposes of making the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present disclosure, and it is apparent that the described embodiments are some embodiments of the present disclosure, but not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments in this disclosure without inventive faculty, are intended to be within the scope of this disclosure.
In addition, the term "and/or" herein is merely an association relationship describing an association object, and means that three relationships may exist, for example, a and/or B may mean: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.
Example 1
The purpose of the disclosure is to disclose a co-fired ceramic phased array antenna, which uses a stacked structure of low-temperature co-fired ceramic and high-temperature co-fired ceramic to absorb stress in an integral structure by matching with a component made of a kovar alloy material, reduce the temperature of the integral structure and ensure that the integral structure has high reliability.
The co-fired ceramic phased array antenna provided by the embodiments of the present disclosure is described below with reference to fig. 1 to 4.
The embodiment of the disclosure is based on a millimeter wave phased array antenna, wherein the phased array antenna is a co-fired ceramic phased array antenna with a kovar alloy mounting structure, and a welding process used between the kovar alloy and the co-fired ceramic is a high-temperature brazing process.
Wherein the co-fired ceramic comprises a low temperature co-fired ceramic and a high temperature co-fired ceramic.
The low temperature co-fired ceramic technology LTCC (Low Temperature Cofired Ceramic) is a multilayer circuit made by stacking unsintered cast ceramic materials together with printed interconnect conductors, elements and circuits therein and firing the structure into an integrated ceramic multilayer material.
The high temperature co-fired ceramic HTCC (High Temperature Cofired Ceramic) is prepared by printing high melting point metal heating resistor slurry of tungsten, molybdenum, manganese and the like on 92-96% of aluminum oxide casting ceramic green body according to the design requirement of a heating circuit, laminating 4-8% of sintering auxiliary agent, and co-firing at a high temperature of 1500-1600 ℃ into a whole.
The kovar alloy is a hard glass iron-based sealing alloy containing 29% of nickel and 18% of cobalt, is an international iron-nickel-cobalt hard glass sealing alloy, has an expansion coefficient close to that of glass or ceramic and other sealed materials within the temperature range of-70-500 ℃, and has good low-temperature tissue stability.
The high temperature brazing process is a process in which a material is heated to a brazing temperature in the presence of a filler metal having a liquidus higher than 840 degrees fahrenheit (450 degrees celsius) and lower than the solidus of a base material, thereby agglomerating the material.
Brazing refers to a welding method for connecting metals by filling gaps of solid workpieces with liquid brazing filler metal after the brazing filler metal below the melting point of a weldment and the weldment are heated to the melting temperature of the brazing filler metal at the same time.
The co-fired ceramic phased array antenna of the present embodiment, as shown in fig. 1, includes:
the low-temperature co-fired ceramic substrate 1, the radiation antenna array 2, the radio frequency feed network 3, the high-temperature co-fired ceramic substrate 4, the control and power supply network 5, the radio frequency interface 7 and the device-level TR component 11. The radio frequency interface 7 is welded on the lower surface of the high-temperature co-fired ceramic substrate 4; the control and power supply network 5 is positioned in the high-temperature cofired ceramic substrate 4; the device-level TR component 11 is welded on the lower surface of the high-temperature co-fired ceramic substrate 4; the upper surface of the high-temperature co-fired ceramic substrate 4 and the lower surface of the low-temperature co-fired ceramic substrate 1 are welded to form a mixed stacked ceramic substrate; the radio frequency feed network 3 is positioned in the low-temperature co-fired ceramic substrate 1; the radiation antenna array is positioned on the upper surface of the low-temperature co-fired ceramic substrate 1.
In the above embodiment, as shown in fig. 1, the low-temperature co-fired ceramic substrate 1 and the high-temperature co-fired ceramic substrate 4 are both of a multilayer ceramic structure. Forming the hybrid stacked ceramic substrate by soldering the upper surface of the high temperature co-fired ceramic substrate 4 and the lower surface of the low temperature co-fired ceramic substrate 1 includes: the upper surface of the high-temperature co-fired ceramic substrate 4 and the lower surface of the low-temperature co-fired ceramic substrate 1 are welded through a metal solder ball A9 to form a mixed stacked ceramic substrate; the welding of the device-level TR assembly 11 on the lower surface of the high-temperature co-fired ceramic substrate 4 includes: the device-level TR assembly 11 is soldered to the lower surface of the high-temperature co-fired ceramic substrate 4 through metal solder balls B12. The integrated structure has good high-frequency transmission characteristics and circuit design flexibility, can realize multi-layer radio frequency circuit layout and multi-path heat dissipation, provides a good heat conduction environment for the power device, and simultaneously realizes a complex control and power supply circuit.
In the above embodiment, as shown in fig. 1, the control and power supply network 5 is composed of a plurality of layers of metal circuits, and the metal circuits of each layer are electrically connected through metal pillars inside the high-temperature co-fired ceramic substrate 4. The metal posts are used as connecting paths to connect the metal circuits of each layer, so that complex control and power supply circuits are realized.
In the above embodiment, the radio frequency feed network 3 is composed of a multilayer metal circuit and a resistive element. And the multi-layer radio frequency circuit layout realizes the power distribution of the whole structure.
In the above embodiment, as shown in fig. 2, the radiation antenna array 2 is composed of a plurality of identical metal circuits uniformly arranged. The radiation antenna array 2 is located on the upper surface of the low-temperature co-fired ceramic substrate 1 to complete the final radiation task.
In the above embodiment, the mounting structure 6 is further included, and the mounting structure 6 is welded on the lower surface of the high-temperature co-fired ceramic substrate 4; the device-level TR assembly 11 is located in the mounting structure 6, and an elastic insulating thermal pad 10 is disposed between the device-level TR assembly and the mounting structure 6. The elastic insulating heat conducting pad increases a heat dissipation path for the integral structure, and ensures that the integral structure has a good heat conducting environment.
In the above embodiment, one end of the radio frequency interface 7 is connected with the metal column in the high-temperature co-fired ceramic substrate 4, and the other end penetrates the mounting structure 6; and the control power supply connector 8 is also included, one end of the control power supply connector 8 is connected with the control and power supply network 5 positioned in the high-temperature co-fired ceramic substrate 4, and the other end penetrates through the mounting structure 6. The radio frequency interface 7 can be connected with the outside, and microwave signals enter the whole structure through the radio frequency interface 7.
In the above embodiment, the mounting structure 6, the radio frequency interface 7 and the control power supply connector 8 are made of kovar alloy materials. Due to the characteristic of the kovar alloy material, a large amount of thermal stress cannot be generated in the ceramic substrate under the high-low temperature condition; meanwhile, structural stress generated during the installation of the phased array antenna and other structural members can be absorbed, so that stress damage of the ceramic substrate in the installation process is avoided, and the co-fired ceramic phased array antenna is guaranteed to have good reliability.
According to an embodiment of the present invention, the present invention further provides a working method applied to a co-fired ceramic phased array antenna, including:
when the phased array antenna works, microwave signals enter a radio frequency interface 7 and enter a radio frequency feed network 3 in the low-temperature co-fired ceramic substrate 1 through metal columns in the high-temperature co-fired ceramic substrate 4; after power distribution is carried out by the radio frequency feed network 3, metal columns in the high-temperature co-fired ceramic substrate 4 enter a collection port of the device-level TR assembly 11; the device-level TR module 11 amplifies the signal, shifts the phase, and feeds the signal into the radiation antenna array 2 through the metal column in the high-temperature co-fired ceramic substrate 4, and finally forms space radiation.
According to the embodiment of the invention, the following technical effects are achieved:
the structure of combining low-temperature co-fired ceramic and high-temperature co-fired ceramic is matched with the kovar alloy material component, so that the internal stress of the whole structure is reduced, the heat dissipation capacity of the phased array antenna is improved, the radiation performance of the phased array antenna is enhanced, and the miniaturization, integration and light weight of the phased array antenna are realized while good reliability is ensured.
In the description of the present specification, the terms "connected," "mounted," "secured," and the like are to be construed broadly, and for example, "connected" may be a fixed connection, a removable connection, or an integral connection; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.
In the description of the present specification, the terms "one embodiment," "some embodiments," and the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing is merely a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and variations may be made to the present application by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.
Claims (9)
1. A co-fired ceramic phased array antenna, comprising: the low-temperature co-fired ceramic substrate (1), the radiation antenna array (2), the radio frequency feed network (3), the high-temperature co-fired ceramic substrate (4), the control and power supply network (5), the radio frequency interface (7) and the device-level TR component (11); wherein,,
the radio frequency interface (7) is welded on the lower surface of the high-temperature co-fired ceramic substrate (4);
the control and power supply network (5) is positioned in the high-temperature co-fired ceramic substrate (4);
the device-level TR component (11) is welded on the lower surface of the high-temperature co-fired ceramic substrate (4);
the upper surface of the high-temperature co-fired ceramic substrate (4) and the lower surface of the low-temperature co-fired ceramic substrate (1) are welded to form a mixed stacked ceramic substrate;
the radio frequency feed network (3) is positioned in the low-temperature co-fired ceramic substrate (1);
the radiation antenna array (2) is positioned on the upper surface of the low-temperature co-fired ceramic substrate (1).
2. Phased array antenna according to claim 1, characterized in that the high temperature co-fired ceramic substrate (4) and the low temperature co-fired ceramic substrate (1) are both of a multilayer ceramic structure;
the forming of the mixed stacked ceramic substrate by welding the upper surface of the high-temperature co-fired ceramic substrate (4) and the lower surface of the low-temperature co-fired ceramic substrate (1) comprises the following steps: the upper surface of the high-temperature co-fired ceramic substrate (4) and the lower surface of the low-temperature co-fired ceramic substrate (1) are welded through a metal solder ball A (9) to form a mixed stacked ceramic substrate;
the device-level TR component (11) is welded on the lower surface of the high-temperature co-fired ceramic substrate (4) and comprises: the device-level TR component (11) is welded on the lower surface of the high-temperature co-fired ceramic substrate (4) through a metal solder ball B (12).
3. Phased array antenna according to claim 2, characterized in that the control and supply network (5) consists of a plurality of layers of metal circuits electrically connected to each other by metal studs inside the high temperature co-fired ceramic substrate (4).
4. A phased array antenna as claimed in claim 3, characterised in that the radio frequency feed network (3) consists of a multilayer metal circuit and a resistive element.
5. Phased array antenna according to claim 4, characterized in that the radiating antenna array (2) consists of a plurality of identical metal circuits arranged uniformly.
6. Phased array antenna according to claim 1, characterized in that it further comprises a mounting structure (6), which mounting structure (6) is soldered to the lower surface of the high temperature co-fired ceramic substrate (4);
the device-level TR component (11) is located in the mounting structure (6), and an elastic insulating heat conducting pad (10) is arranged between the device-level TR component and the mounting structure (6).
7. Phased array antenna according to claim 6, characterized in that the radio frequency interface (7) is connected at one end to a metal post in the high temperature co-fired ceramic substrate (4) and at the other end penetrates the mounting structure (6);
the phased array antenna further comprises a control power supply connector (8), one end of the control power supply connector (8) is connected with a control and power supply network (5) positioned in the high-temperature co-fired ceramic substrate (4), and the other end of the control power supply connector penetrates through the mounting structure (6).
8. Phased array antenna according to claim 7, characterized in that the mounting structure (6), the radio frequency interface (7) and the control supply connector (8) are made of kovar material.
9. A method of operation for use with the co-fired ceramic phased array antenna of any of claims 1-8, the method comprising:
when the phased array antenna works, microwave signals enter the radio frequency interface (7), and enter the radio frequency feed network (3) in the low-temperature co-fired ceramic substrate (1) through metal columns in the high-temperature co-fired ceramic substrate (4); after the radio frequency feed network (3) distributes power, the power enters a collection port of the device-level TR assembly (11) through a metal column in the high-temperature co-fired ceramic substrate (4); the device-level TR component (11) amplifies and phase-shifts signals, and then the signals are fed into the radiation antenna array (2) through metal columns in the high-temperature co-fired ceramic substrate (4) to finally form space radiation.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310385060.9A CN116470270A (en) | 2023-04-12 | 2023-04-12 | Co-fired ceramic phased array antenna |
| DE202023104881.1U DE202023104881U1 (en) | 2023-04-12 | 2023-08-28 | Phased array antenna made of co-fired ceramic |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310385060.9A CN116470270A (en) | 2023-04-12 | 2023-04-12 | Co-fired ceramic phased array antenna |
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| Publication Number | Publication Date |
|---|---|
| CN116470270A true CN116470270A (en) | 2023-07-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310385060.9A Pending CN116470270A (en) | 2023-04-12 | 2023-04-12 | Co-fired ceramic phased array antenna |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN116470270A (en) |
| DE (1) | DE202023104881U1 (en) |
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2023
- 2023-04-12 CN CN202310385060.9A patent/CN116470270A/en active Pending
- 2023-08-28 DE DE202023104881.1U patent/DE202023104881U1/en active Active
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| Publication number | Publication date |
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| DE202023104881U1 (en) | 2023-11-17 |
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