CN116885457A - Phased array antenna, antenna packaging structure and manufacturing method thereof - Google Patents

Abstract

The invention provides a phased array antenna, an antenna packaging structure and a manufacturing method thereof, wherein the antenna packaging structure comprises an upper-layer PCB (printed circuit board), a metal cover plate, a lower-layer PCB and a BGA (ball grid array), wherein the upper-layer PCB comprises a plurality of antenna radiating units, coaxial feed columns, a radio frequency connecting link, a metal shielding cavity, an MMIC (MMIC chip and a first bonding pad; the metal cover plate covers the metal shielding cavity opening to realize metal shielding of the MMIC chip; the second bonding pads in the lower PCB are respectively and electrically connected with the power division network structure and the wave control data distribution network; and a plurality of solder balls in the BGA ball grid array are respectively and electrically connected with the first bonding pad and the second bonding pad so as to realize cascade connection of the upper PCB and the lower PCB. According to the invention, through the split design of the upper PCB and the lower PCB, the lamination quantity and lamination times during processing among all structures of the antenna packaging structure are reduced, and the production cost is reduced while the yield of the antenna packaging structure is ensured.

Description

Phased array antenna, antenna packaging structure and manufacturing method thereof

Technical Field

The invention relates to the field of radio frequency antennas, in particular to a phased array antenna, an antenna packaging structure and a manufacturing method thereof.

Background

In conventional phased Array antenna designs, the passive antenna structure is packaged separately from the transmit/receive (Transmitter and Receiver, T/R) components, which are cascaded by a BGA Ball Grid Array (BGA). T/R assemblies often use high temperature co-fired multilayer ceramic substrate (HTCC) packaging technology, which has poorer metal conductivity than Printed Circuit Boards (PCBs), introduces higher losses, and has greater HTCC process uncertainty and higher packaging cost. As shown in fig. 1, a schematic structural diagram of an antenna packaging structure is shown, which includes a first PCB board 01 (an antenna, a network, a power supply and a waveguide are disposed in the first PCB board), a BGA ball grid array 02, a system-in-package (SIP) transceiver 03 and a heat dissipation structural member 04, in order to improve the system integration level, to realize the low profile and lightweight requirements of an array plane, the antenna radiating unit, the feed network, the power supply distribution network and the waveguide data distribution network are designed integrally, and a large number of networks are stacked longitudinally, so that the number of stacked PCBs is increased, the integrated processing difficulty is increased, the product yield is reduced, and meanwhile, different networks can introduce multiple pressing in the process, thereby increasing the cost.

At present, there is little research about reducing the cost of the active phased array antenna array, and the antenna array structure mainly adopted is shown in fig. 2 and 3, which are another schematic structure diagram of an antenna package structure and a third schematic structure diagram of the antenna package structure respectively, where the package structure in fig. 2 includes a first PCB 01 (an antenna, a power division network, a power supply and a waveguide are disposed in the first PCB 01), a heat dissipation structure 04, an antenna radiation unit 05 and an MMIC chip 06, and the package structure in fig. 3 includes the first PCB 01 (the active division network, the power supply and the waveguide are disposed in the first PCB), the antenna radiation unit 05, the MMIC chip 06, a metal lead 07 and a metal shielding cavity 08 which are disposed in the second PCB 09. The phased array antenna array surface architecture in fig. 2 integrally encapsulates an antenna radiating unit, a multifunctional network board and a microwave integrated circuit (MMIC) chip, and realizes the interconnection of radio frequency signals through metal wire bonding. The architecture shown in fig. 3 realizes metal shielding of an MMIC chip by splicing two PCB boards, wherein the upper PCB board is an antenna radiating unit, a cavity is dug at the back of the PCB board, and the inner wall of the cavity is gold-plated. The radio frequency chip is tiled on the lower-layer PCB and is in signal interconnection with the PCB through the metal lead. The two are spliced into an integral multi-layer PCB board through a PCB crimping process, and the surface gold plating layer of the lower-layer PCB board and the gold plating layer in the cavity form a metal shielding cavity, so that the MMIC chip is protected, and the defect of the scheme of FIG. 2 is effectively overcome. However, the PCB manufactured by the compression bonding process cannot be repeatedly disassembled and assembled, once a certain MMIC chip is damaged, the whole PCB needs to be damaged to replace the chip, and the PCB cannot be rebuilt any more, so that maintainability is not provided.

In view of this, there is an urgent need for an antenna package structure that is simple in process and has maintainability while being capable of reducing costs.

Disclosure of Invention

In view of the above-mentioned drawbacks of the prior art, an object of the present invention is to provide a phased array antenna, an antenna packaging structure and a manufacturing method thereof, which are used for solving the problems of complex process, high cost and non-maintainability when damage occurs in the phased array antenna in the prior art.

To achieve the above and other related objects, the present invention provides an antenna package structure, comprising:

the upper-layer PCB comprises a plurality of antenna radiating units, coaxial feed columns, radio frequency connection links, a metal shielding cavity, MMIC chips and first bonding pads, wherein two ends of each coaxial feed column are respectively and electrically connected with the antenna radiating units and the MMIC chips, an opening of each metal shielding cavity is formed in the bottom surface of the upper-layer PCB, at least one MMIC chip is positioned in each metal shielding cavity, the radio frequency connection links are electrically connected with the MMIC chips, and the first bonding pads are electrically connected with the radio frequency connection links;

a metal cover plate covering the metal shielding cavity opening to realize metal shielding of the MMIC chip;

The lower layer PCB comprises a power division network structure, a wave control data distribution network, a low-frequency signal inlet, a radio frequency signal inlet and a second bonding pad, wherein the second bonding pad is electrically connected with the power division network structure and the wave control data distribution network respectively;

the BGA ball grid array is positioned between the upper PCB and the lower PCB and comprises a plurality of solder balls which are respectively and electrically connected with the first bonding pad and the second bonding pad so as to realize cascade connection of the upper PCB and the lower PCB.

Optionally, a first radio frequency interconnection structure is further arranged between the MMIC chip and the coaxial feed post.

Optionally, the first radio frequency interconnection structure includes a radio frequency signal vertical transition structure, a strip line-microstrip structure, a first metal lead and a first metal shielding hole.

Optionally, a metal slide for fixing the MMIC chip is further disposed between the MMIC chip and the inner bottom surface of the metal shielding cavity.

Optionally, the size of the metal slide is not smaller than the size of the MMIC chip.

Optionally, a solder ring is further arranged on the periphery of the opening of the metal shielding cavity.

Optionally, the metal cover plate is fixed on the bottom surface of the upper layer PCB through the solder ring.

Optionally, the first pad includes a ground pad, a control signal pad, a radio frequency signal pad, and an electrical pad.

Optionally, the antenna radiating unit includes a plurality of antenna radiating patches distributed in an array, and a U-shaped slot and a radio frequency signal metal via hole are disposed on the antenna radiating patches.

Optionally, the MMIC chip is electrically connected with the radio frequency connection link through a second metal lead.

The invention also provides a manufacturing method of the antenna packaging structure, which comprises the following steps:

providing an upper-layer PCB, wherein the upper-layer PCB comprises a plurality of antenna radiating units, a coaxial feed column, a radio frequency connecting link, a metal shielding cavity, an MMIC chip and a first bonding pad, wherein two ends of the coaxial feed column are respectively and electrically connected with the antenna radiating units and the MMIC chip, an opening of the metal shielding cavity is formed in the bottom surface of the upper-layer PCB, at least one MMIC chip is positioned in the metal shielding cavity, the radio frequency connecting link is electrically connected with the MMIC chip, and the first bonding pad is electrically connected with the radio frequency connecting link;

forming a metal cover plate covering the opening of the metal shielding cavity on the bottom surface of the upper PCB to realize metal shielding of the MMIC chip;

Providing a lower-layer PCB, wherein the lower-layer PCB comprises a power division network structure, a wave control data distribution network, a low-frequency signal inlet, a radio frequency signal inlet and a second bonding pad, and the second bonding pad is electrically connected with the power division network structure and the wave control data distribution network respectively;

and forming a plurality of solder balls electrically connected with the first bonding pads below the upper PCB to obtain a BGA ball grid array, and electrically connecting the solder balls with the second bonding pads to realize cascade connection of the upper PCB and the lower PCB.

The invention also provides a phased array antenna comprising the antenna packaging structure.

As described above, the phased array antenna, the antenna packaging structure and the manufacturing method thereof have the following beneficial effects: the antenna radiating unit, the coaxial feed column, the metal shielding cavity, the MMIC chip positioned in the metal shielding cavity, the radio frequency connection link and the first bonding pad are arranged in the upper PCB, the radio frequency signal inlet, the low frequency signal inlet, the wave control data distribution network, the power division network structure and the second bonding pad are arranged in the lower PCB, the upper PCB and the lower PCB are in cascade connection through the BGA ball grid array which is respectively and electrically connected with the first bonding pad and the second bonding pad, and through arranging all part circuits and elements of an antenna in the upper PCB and the lower PCB respectively, the signal processing and transmission of the antenna packaging structure are realized, the number of lamination and the number of lamination times during processing among all structures of the antenna packaging structure are reduced, the yield of the antenna packaging structure is ensured, and the production cost is greatly reduced; the metal cover plate covers the opening of the metal shielding cavity, so that metal shielding of the MMIC chip is realized, and the MMIC chip positioned in the metal shielding cavity is protected; the upper PCB and the lower PCB are cascaded through the BGA ball grid array, the metal cover plate is fixed on the bottom surface of the upper PCB through the solder ring, and the melting temperature of the solder balls and the solder ring is low, so that the antenna packaging structure is convenient to detach and the MMIC chip is convenient to maintain; the cascade connection between the upper layer PCB and the lower layer PCB can be realized through ball implantation and welding processes, so that the packaging process is simplified; after the MMIC chip is welded on the metal carrier, the first metal lead, the second metal lead and the third metal lead are formed, so that the problem that the metal leads are stretched or broken due to the fact that the upper PCB is in a high-temperature environment for a long time during welding is avoided; the phased array antenna adopting the antenna packaging structure has good return loss and in-band scanning range, realizes good impedance matching, reduces production cost on the premise of ensuring the radio frequency performance of the phased array antenna, and has good application prospect.

Drawings

Fig. 1 is a schematic structural diagram of an antenna package structure.

Fig. 2 is a schematic diagram of another structure of an antenna package.

Fig. 3 shows a third structure of the antenna package structure.

Fig. 4 is a schematic structural diagram of an antenna package structure according to the present invention.

Fig. 5 is a schematic structural diagram of an antenna radiating element of the antenna package structure of the present invention.

Fig. 6 is a schematic structural diagram of a first rf interconnection structure of the antenna package structure of the present invention.

Fig. 7 is a schematic structural view of a wiring layer of an upper PCB board according to the present invention.

Fig. 8 is a schematic view showing another structure of the wiring layer of the upper PCB board of the present invention.

Fig. 9 is a schematic structural view of an antenna package structure according to the present invention, in which a first bonding pad is disposed on a bottom layer of an upper PCB.

Fig. 10 is a schematic diagram of a third structure of a wiring layer of an upper PCB of the antenna package structure of the present invention.

Fig. 11 is a schematic diagram showing simulation results of the phased array antenna of the present invention.

Fig. 12 shows a pattern of scan angles for a phased array antenna of the present invention.

Description of element reference numerals

01. First PCB board

02 BGA ball grid array

03 SIP transceiver module

04. Heat dissipation structural member

05. Antenna radiation unit

06 MMIC chip

07. Metal lead

08. Metal shielding cavity

09. Second PCB board

1. Upper layer PCB board

11. Antenna radiation unit

111. Antenna radiation patch

111a U shaped slit

111b radio frequency signal metal via

112. Second metal shielding hole

12. Coaxial feed column

13. Radio frequency connection link

131. Second radio frequency interconnection structure

132. Power plane

133. Control signal wiring

134. Metal via for control signals

135. Surface layer bonding pad of control signal

136. Radio frequency main port connection structure

137. Power signal line

138. Control signal connecting wire

14. Metal shielding cavity

15 MMIC chip

16. First bonding pad

161. Ground pad

162. Control signal bonding pad

163. Radio frequency signal bonding pad

17. Metal slide

2. Metal cover plate

3. Lower layer PCB board

31. Power division network structure

32. Wave control data distribution network

33. Low frequency signal inlet

34. Radio frequency signal inlet

4 BGA ball grid array

41. Solder ball

5. First radio frequency interconnection structure

51. Vertical transition structure of radio frequency signal

52. Strip line-microstrip structure

53. First metal shielding hole

54. First metal lead

6. Second metal lead

7. Third metal lead

Detailed Description

Further advantages and effects of the present invention will become apparent to those skilled in the art from the disclosure of the present invention, which is described by the following specific examples.

Please refer to fig. 4 to 12. It should be understood that the structures, proportions, sizes, etc. shown in the drawings are for illustration purposes only and should not be construed as limiting the invention to the extent that it can be practiced, since modifications, changes in the proportions, or otherwise, used in the practice of the invention, are not intended to be critical to the essential characteristics of the invention, but are intended to fall within the spirit and scope of the invention. Also, the terms such as "upper," "lower," "left," "right," "middle," and "a" and the like recited in the present specification are merely for descriptive purposes and are not intended to limit the scope of the invention, but are intended to provide relative positional changes or modifications without materially altering the technical context in which the invention may be practiced.

Example 1

The invention provides an antenna packaging structure, as shown in fig. 4, which is a schematic structural diagram of the antenna packaging structure, and the antenna packaging structure comprises: the antenna comprises an upper-layer PCB 1, a metal cover plate 2, a lower-layer PCB 3 and a BGA ball grid array 4, wherein the upper-layer PCB comprises a plurality of antenna radiating units 11, a coaxial feed column 12, a radio frequency connecting link 13, a metal shielding cavity 14, an MMIC chip 15 and a first bonding pad 16, two ends of the coaxial feed column 12 are respectively and electrically connected with the antenna radiating units 11 and the MMIC chip 15, an opening of the metal shielding cavity 14 is formed in the bottom surface of the upper-layer PCB 1, at least one MMIC chip 15 is positioned in the metal shielding cavity 14, the radio frequency connecting link 13 is electrically connected with the MMIC chip 15, and the first bonding pad 16 is electrically connected with the radio frequency connecting link 13; the metal cover plate 2 covers the opening of the metal shielding cavity 14 to realize metal shielding of the MMIC chip 15; the lower PCB 3 includes a power division network structure 31, a wave control data distribution network 32, a low-frequency signal inlet 33, a radio frequency signal inlet 34, and a second bonding pad (not shown), where the second bonding pad is electrically connected to the power division network structure 31 and the wave control data distribution network 32; the BGA ball grid array 4 is located between the upper PCB 1 and the lower PCB 3, and includes a plurality of solder balls 41 electrically connected to the first pads 16 and the second pads, respectively, so as to realize cascading of the upper PCB 1 and the lower PCB 3.

Specifically, under the condition that the performance of the antenna packaging structure is satisfied, the size, shape and thickness of the upper PCB board 1 may be selected according to practical situations, which is not limited herein.

Specifically, the upper PCB board 1 includes a plurality of radio frequency radiation layers and wiring layers for implementing the mutual cooperation of devices in the package structure. In this embodiment, the upper PCB board 1 includes four radio frequency radiation layers and four wiring layers.

As an example, as shown in fig. 5, a schematic structural diagram of the antenna radiating unit 11 is shown, the antenna radiating unit 11 includes a plurality of antenna radiating patches 111 distributed in an array, and a U-shaped slot 111a and a radio frequency signal metal via 111b are disposed on the antenna radiating patches 111.

Specifically, the antenna radiating patch 111 is made of copper, gold, silver or other suitable conductive metal materials.

Specifically, in the case of satisfying the performance of the antenna package structure, the thickness, size, number and spacing between adjacent antenna radiation patches 111 may be selected according to practical situations, which is not limited herein.

Specifically, in the case of satisfying the performance of the antenna package structure, the specific arrangement manner of the antenna radiating patches 111 in the antenna radiating unit 11 may be selected according to practical situations, which is not limited herein.

Specifically, in the case of meeting the performance of the antenna package structure, the width and length of the U-shaped slot 111a may be selected according to practical situations, which is not limited herein.

Specifically, the U-shaped slot 111a is disposed on the antenna radiation patch 111, which widens the bandwidth and gain of the antenna radiation unit 11 and improves the radiation characteristics of the antenna radiation patch 111.

Specifically, in the case of meeting the performance of the antenna package structure, the size, number and shape of the rf signal metal vias 111b may be selected according to practical situations, which is not limited herein.

Specifically, a second metal shielding hole 112 surrounding the antenna radiation patch 111 is provided around the antenna radiation patch 111.

Specifically, in the case of satisfying the performance of the antenna package structure, the size, number and shape of the second metal shielding holes 112 may be selected according to practical situations, which is not limited herein.

Specifically, the isolation of the antenna radiation patches 111 may be improved by shielding the radiation energy between the adjacent antenna radiation patches 111 with the second metal shielding holes 112.

Specifically, in the case of meeting the performance of the antenna package structure, the shape, size, and material of the coaxial feed post 12 may be selected according to practical situations, which is not limited herein.

Specifically, in the case of satisfying the performance of the antenna package structure, the size and depth of the opening of the metal shielding cavity 14 may be selected according to practical situations, which is not limited herein. The depth here refers to the vertical distance from the opening of the metallic shielding cavity 14 to the bottom surface.

Specifically, a plurality of MMIC chips 15 are disposed in the metal shielding cavity 14, and adjacent MMIC chips 15 are connected to each other through a third metal lead 7.

Specifically, a metal shielding layer (not shown) covering the inner surface of the metal shielding cavity is further disposed in the metal shielding cavity 14, so as to realize metal shielding of the MMIC chip 15.

Specifically, in the case of satisfying the performance of the antenna package structure, the number, thickness, size and material of the MMIC chips 15 may be selected according to practical situations, which is not limited herein.

Specifically, the MMIC chip 15 is used for signal transmission control and reception signal processing.

Specifically, in the case of satisfying the performance of the antenna package structure, the shape and the diameter of the third metal lead 7 may be selected according to practical situations, which is not limited herein.

As an example, as shown in fig. 6, which is a schematic structural diagram of the first radio frequency interconnection structure 5, a first radio frequency interconnection structure 5 is further disposed between the MMIC chip 15 and the coaxial feed post 12.

As an example, the first rf interconnection structure 5 includes an rf signal vertical transition structure 51, a strip-line microstrip structure 52, a first metal lead 54, and a first metal shielding hole 53.

Specifically, in the case of satisfying the performance of the antenna package structure, the shape and the diameter of the first metal lead 54 may be selected according to practical situations, which is not limited herein.

Specifically, in the case of meeting the performance of the antenna package structure, the shape, size and material of the rf signal vertical transition structure 51 may be selected according to practical situations, which is not limited herein.

Specifically, in the case of meeting the performance of the antenna package structure, the shape, size and material of the stripline-microstrip structure 52 may be selected according to practical situations, which is not limited herein.

Specifically, the stripline-to-microstrip structure 52 is located between the rf signal vertical transition structure 51 and the first metal lead 6, and is used for connecting the rf signal vertical transition structure 51 and the first metal lead 54.

Specifically, in the case of satisfying the performance of the antenna package structure, the size, number and shape of the first metal shielding holes 53 may be selected according to practical situations, which is not limited herein.

Specifically, the first metal shielding hole 53 is used to shield the feeding signal, so that a good signal transmission path can be formed between the MMIC chip 15 and the coaxial feeding post 12, and the quality of the transmission signal is ensured.

Specifically, as shown in fig. 7 and 8, a schematic structural diagram of the wiring layer of the upper PCB board 1 and another schematic structural diagram of the wiring layer of the upper PCB board 1 (i.e. a schematic distribution diagram of the radio frequency connection link 13 in the upper PCB board 1) are shown respectively, where the radio frequency connection link 13 includes a part of the control signal link and the power signal link between the BGA ball grid array 4 and the MMIC chip 15, that is, the control signal link includes a second radio frequency interconnection structure 131, a power plane 132, a control signal trace 133, a metal via 134 of a control signal, a surface pad 135 of a control signal, and a radio frequency total port connection structure 136; the power signal link includes a power signal line 137 and a control signal connection line 138.

As an example, the MMIC chip 15 is electrically connected to the radio frequency connection link 13 via a second metal lead 6.

Specifically, in the case of satisfying the performance of the antenna package structure, the shape and diameter of the second metal lead 6 may be selected according to the actual situation, which is not limited herein.

As an example, a metal carrier 17 for carrying the MMIC chip 15 is further provided between the MMIC chip 15 and the inner bottom surface of the metal shielding cavity 14.

As an example, the size of the metal slide 17 is not smaller than the size of the MMIC chip 15.

Specifically, in the case of satisfying the performance of the antenna package structure, the thickness and the material of the metal carrier 17 may be selected according to practical situations, which is not limited herein.

Specifically, the metal carrier 17 is located at the bottom of the metal shielding cavity 14, and is used for carrying and protecting the MMIC chip 15.

As an example, as shown in fig. 9, the first bonding pad 16 is disposed on the bottom layer of the upper PCB board 1, and the first bonding pad 16 includes a ground bonding pad 161, a control signal bonding pad 162, a radio frequency signal bonding pad 163, and an electric bonding pad (not shown).

Specifically, in the case of meeting the performance of the antenna package structure, the number, shape and material of the ground pads 161 may be selected according to practical situations, which is not limited herein.

Specifically, the ground pad 161 located at the bottom layer of the upper PCB 1 is mainly used to ensure the flatness of the plane where the upper PCB 1 is located.

Specifically, in the case of meeting the performance of the antenna package structure, the number, shape and material of the control signal pads 162 may be selected according to practical situations, which is not limited herein.

Specifically, in the case of satisfying the performance of the phased array antenna, the number, shape and material of the rf signal pads 163 may be selected according to practical situations, which is not limited herein.

Specifically, the control signal pad 162 and the radio frequency signal pad 163 are respectively used for implementing transmission of control signals in the phased array antenna.

Specifically, in the case of meeting the performance of the antenna package structure, the number, shape and material of the electrical pads may be selected according to practical situations, which is not limited herein.

Specifically, as shown in fig. 10, the third structural schematic diagram of the wiring layer of the upper PCB (i.e., the schematic diagram of the first bonding pad 16 electrically connected to the radio frequency connection link 13) is shown, and the first bonding pad 16 is electrically connected to the radio frequency connection link 13.

Specifically, in the case of satisfying the phased array antenna performance and covering the opening of the metal shielding cavity 14, the thickness and size of the metal cover plate 2 may be selected according to practical situations, and are not limited herein.

As an example, the periphery of the opening of the metallic shielding cavity 14 is also provided with a solder ring (not shown).

As an example, the metal cover plate 2 is fixed to the bottom surface of the upper PCB 3 through the solder ring.

Specifically, the material of the solder ring includes at least one of gold, silver, tin, lead and indium, and may be other suitable soldering materials.

Specifically, in the case of satisfying the performance of the antenna package structure, the shape, thickness and size of the solder ring may be selected according to practical situations, which is not limited herein.

Specifically, the metal cover plate 2 covers the opening of the metal shielding cavity 14, encapsulates the MMIC chip 15 together with the metal carrier 17 inside the metal shielding cavity 14, and protects the MMIC chip 15 while realizing metal shielding of the MMIC chip 15.

Specifically, under the condition that the performance of the antenna packaging structure is satisfied, the size, shape, number of layers and thickness of the lower PCB 3 may be selected according to practical situations, which is not limited herein.

Specifically, in the case of meeting the performance of the antenna package structure, the distribution of the power division network structure 31 in the lower PCB 3 may be selected according to the actual situation, which is not limited herein.

Specifically, in the case of meeting the performance of the antenna package structure, the distribution of the wave control data distribution network 32 in the lower PCB 3 may be selected according to the actual situation, which is not limited herein.

Specifically, in the case of satisfying the performance of the antenna package structure, the position of the low frequency signal inlet 33 may be selected according to the actual situation, which is not limited herein.

Specifically, the position of the rf signal inlet 34 may be selected according to the practical situation, and is not limited herein, in the case of meeting the performance of the antenna package structure.

Specifically, in the case of meeting the performance of the antenna packaging structure, the shape, size and number of the second pads may be selected according to the actual situation, which is not limited herein.

Specifically, the material of the solder ball 41 includes at least one of gold, silver, tin, lead, and indium, and may be other suitable soldering materials.

Specifically, in the case of satisfying the performance of the antenna package structure, the size and the number of the solder balls 41 may be selected according to the actual situation, which is not limited herein.

Specifically, the solder balls 41 are electrically connected to the second bonding pads and the first bonding pads 16, respectively, so as to realize signal transmission between the upper PCB 1 and the lower PCB 3.

Specifically, the antenna radiating unit 11, the coaxial feed post 12, the radio frequency connection link 13, the MMIC chip 15 located inside the metal shielding cavity 14, and the first bonding pad 16 are disposed in the upper PCB 1, the radio frequency signal inlet 34, the low frequency signal inlet 33, the power division network structure 31, the beam control network 32, and the second bonding pad are disposed in the lower PCB 3, and the BGA ball grid array 4 electrically connected with the first bonding pad 16 and the second bonding pad is cascaded between the upper PCB 1 and the lower PCB 3, so that signal processing and transmission are achieved between the upper PCB 1 and the lower PCB 3 through a split design, the number of layers and the number of pressing times during processing between each structure of the antenna packaging structure are reduced, and the production cost is greatly reduced while the yield of the antenna packaging structure is ensured.

Specifically, the upper PCB 1 and the lower PCB 3 are cascaded through the BGA ball grid array 4, the metal cover plate 2 is fixed on the bottom surface of the upper PCB 1 through the solder ring, when the MMIC chip 15 is damaged, the solder balls 41 and the solder ring in the BGA ball grid array 4 can be melted only at a lower temperature, and the separation of the upper PCB 1 and the lower PCB 3 is realized on the premise of not damaging the upper PCB 1 and the lower PCB 3, so that the MMIC chip 15 is convenient to replace and maintain, and the simple disassembly and maintainability of the antenna packaging structure are realized.

According to the antenna packaging structure of the embodiment, the antenna radiating unit 11, the coaxial feed post 12, the radio frequency connection link 13, the MMIC chip 15 positioned in the metal shielding cavity 14 and the first bonding pad 16 are arranged in the upper layer PCB board 1, the radio frequency signal inlet 34, the low frequency signal inlet 33, the power division network structure 31, the wave control data distribution network 32 and the second bonding pad are arranged in the lower layer PCB board 3, the upper layer PCB board 1 and the lower layer PCB board 3 are cascaded through the BGA ball grid array 4, and the number of lamination times during processing between each structure between the antenna packaging structures are reduced by arranging each part circuit and each element of an antenna in the upper layer PCB board 1 and the lower layer PCB board 3 respectively, so that the yield of the antenna packaging structure is ensured, and meanwhile, the production cost is greatly reduced; in addition, the upper PCB 1 and the lower PCB 3 are cascaded through the BGA ball grid array 4, the metal cover plate 2 is fixed on the bottom surface of the upper PCB 1 through the solder ring, and the melting temperature of the solder balls 41 and the solder ring is low, so that the MMIC chip 15 in the antenna packaging structure can be replaced and maintained conveniently.

Example two

The embodiment provides a manufacturing method of an antenna packaging structure, which comprises the following steps:

s1: providing an upper-layer PCB, wherein the upper-layer PCB comprises a plurality of antenna radiating units, a coaxial feed column, a radio frequency connecting link, a metal shielding cavity, an MMIC chip and a first bonding pad, wherein two ends of the coaxial feed column are respectively and electrically connected with the antenna radiating units and the MMIC chip, an opening of the metal shielding cavity is formed in the bottom surface of the upper-layer PCB, at least one MMIC chip is positioned in the metal shielding cavity, the radio frequency connecting link is electrically connected with the MMIC chip, and the first bonding pad is electrically connected with the radio frequency connecting link;

s2: forming a metal cover plate covering the opening of the metal shielding cavity on the bottom surface of the upper PCB to realize metal shielding of the MMIC chip;

s3: providing a lower-layer PCB, wherein the lower-layer PCB comprises a power division network structure, a wave control data distribution network, a low-frequency signal inlet, a radio frequency signal inlet and a second bonding pad, and the second bonding pad is electrically connected with the power division network structure and the wave control data distribution network respectively;

s4: and forming a plurality of solder balls electrically connected with the first bonding pads below the upper PCB to obtain a BGA ball grid array, and electrically connecting the solder balls with the second bonding pads to realize cascade connection of the upper PCB and the lower PCB.

Specifically, the steps S1-S2 are formed, an upper PCB board 1 is provided, the upper PCB board 1 includes a plurality of antenna radiating units 11, a coaxial feed post 12, a radio frequency connection link 13, a metal shielding cavity 14, an MMIC chip 15 and a first bonding pad 16, two ends of the coaxial feed post 12 are respectively electrically connected with the antenna radiating units 11 and the MMIC chip 15, an opening of the metal shielding cavity 14 is opened at the bottom surface of the upper PCB board 1, the MMIC chip 15 is located in the metal shielding cavity 14, the radio frequency connection link 13 is electrically connected with the MMIC chip 15, and the first bonding pad 16 is electrically connected with the radio frequency connection link 13; a metal cover plate 2 covering the opening of the metal shielding cavity 14 is formed below the upper PCB 1 to realize metal shielding of the MMIC chip 15.

Specifically, the antenna radiating unit 11 includes a plurality of antenna radiating patches 111 distributed in an array, and a second metal shielding hole 112 surrounding the antenna radiating patches 111, and the antenna radiating patches 111 are provided with a U-shaped slot 111a and a radio frequency signal metal via hole 111b.

Specifically, the formation of the antenna radiation patch 111 and the second metal shielding hole 112 is a conventional technical means, and will not be described herein.

Specifically, forming the coaxial feed post 12 includes performing inter-layer stripline processing, metal vias, and drilling plating in the upper PCB board.

Specifically, a first rf interconnection structure 5 is disposed between the MMIC chip 15 and the coaxial feed post 12, and the first rf interconnection structure 5 includes a rf signal vertical transition structure 51, a strip line-microstrip structure 52, a first metal shielding hole 53, and a first metal lead 54.

Specifically, the formation of the radio frequency signal vertical transition structure 51, the strip line-microstrip structure 52, and the first metal shielding hole 53 is a conventional technical means, and will not be described herein.

Specifically, the method of forming the first metal lead 54 includes bonding or other suitable method.

Specifically, forming the rf connection link 13 includes sequentially processing the interlayer strip line, the metal via hole and the drill electroplating in the upper PCB board 1.

Specifically, the forming of the metal shielding cavity 14, the MMIC chip 15 and the metal cover plate 2 includes the following steps: forming a groove by opening the surface of the upper-layer PCB 1 far away from the antenna radiation patch 111, forming a metal shielding layer by electroplating in the groove, forming a metal carrier 17 on the metal shielding layer in the groove, welding the MMIC chip 15 on the metal carrier 17, presetting a solder ring around the groove, melting the solder ring at a preset temperature after bonding metal leads, welding the metal cover plate 2 to the bottom surface of the upper-layer PCB 1, and packaging the MMIC chip 15 and the metal carrier 17 into the metal shielding cavity 14 to realize packaging of the MMIC chip 15.

In particular, the method of forming the second metal lead 6 includes bonding or other suitable method.

Specifically, the method of forming the third metal wire 7 includes bonding or other suitable method.

Specifically, after the first metal lead 54, the second metal lead 6 and the third metal lead 7 are formed and the MMIC chip 15 is soldered on the metal carrier 17, the problem that the bonded metal lead is stretched or broken due to a certain deformation of the upper PCB board 1 in a high-temperature environment for a long time during soldering is avoided.

Specifically, the step S3 is executed, a lower PCB 3 is provided, and the lower PCB 3 includes a power division network structure 31, a wave control data distribution network 32, a low-frequency signal inlet 33, a radio frequency signal inlet 34, and a second bonding pad, where the second bonding pad is electrically connected to the power division network structure 31 and the wave control data distribution network 32, respectively.

Specifically, forming the power division network structure 31 and the wave control data distribution network 32 includes performing interlayer strip line processing and metal via holes on the lower PCB 3.

Specifically, in the case of meeting the performance of the antenna package structure, the method for forming the low-frequency signal inlet 33 and the radio-frequency signal inlet 34 is a conventional technical means, which is not described herein again.

Specifically, the step S4 is performed, a plurality of solder balls 41 electrically connected to the first pads 16 are formed under the upper PCB 3 to obtain a BGA ball grid array 4, and the solder balls 41 are electrically connected to the second pads to realize cascading of the upper PCB 1 and the lower PCB 3.

Specifically, the realization that the upper layer PCB board 1 and the lower layer PCB board 3 are cascaded includes the following steps: a plurality of solder balls 41 electrically connected with the first bonding pads 16 are formed below the upper PCB 3 by a ball-implanting process, and the solder balls 41 are soldered on the second bonding pads, so as to realize cascading between the upper PCB 1 and the lower PCB 3.

Specifically, a plurality of solder balls 41 electrically connected with the first bonding pads 16 are formed under the upper PCB 3 by a ball-mounting process, and the solder balls 41 are soldered on the second bonding pads, so that cascading between the upper PCB 1 and the lower PCB 3 can be realized, and the packaging process of the antenna packaging structure is simplified.

According to the manufacturing method of the antenna packaging structure, the BGA ball grid array 4 is formed through ball mounting and welding processes, so that cascading between the upper-layer PCB 1 and the lower-layer PCB 3 can be achieved, the packaging process of the antenna packaging structure is simplified, metal leads are formed after the MMIC chip 15 is welded on the metal carrier 17, and the situation that the bonded metal leads stretch or break due to deformation of the upper-layer PCB 1 in a high-temperature environment for a long time during welding is avoided.

Example III

The present embodiment provides a phased array antenna, where the antenna package structure in the phased array antenna is the antenna package structure described in the first embodiment.

Specifically, as shown in fig. 11, as a schematic diagram of a simulation result (the abscissa indicates frequency and the ordinate indicates bandwidth) of the phased array antenna, as can be seen from the simulation result, the return loss (|s11|) of the phased array antenna is better than 18dB in a frequency band of 15GHz-17GHz, which indicates that the phased array antenna has a good impedance matching.

Specifically, as shown in fig. 12, the scanning angle pattern (the horizontal axis is the scanning angle, and the vertical axis is the gain) of the phased array antenna, and as can be seen from the figure, the phased array antenna achieves a scanning range of ±60° in-band.

Specifically, the scanning angle interval of the phased array antenna can be changed by increasing or decreasing the number of antenna arrays and the scanning angle of the antenna arrays.

Specifically, by adopting the antenna packaging structure in the first embodiment, the return loss (|s11|) of the phased array antenna is better than 18dB in the frequency band of 15GHz-17GHz, so that good impedance matching is realized, the phased array antenna realizes the scanning range of + -60 ° in the band, and the production cost is reduced on the premise of ensuring the radio frequency performance of the phased array antenna, so that the phased array antenna has good application prospect.

The antenna packaging structure of the phased array antenna of the embodiment is the antenna packaging structure of the embodiment I, in the frequency band of 15GHz-17GHz, return loss (|S11|) is better than 18dB, good impedance matching is achieved, the phased array antenna achieves a scanning range of +/-60 degrees in the band, production cost is reduced on the premise of guaranteeing radio frequency performance of the phased array antenna, and the antenna packaging structure has good application prospect.

In summary, according to the phased array antenna, the antenna packaging structure and the manufacturing method thereof, the antenna radiating unit, the coaxial feed column, the MMIC chip positioned in the metal shielding cavity, the radio frequency connecting link and the first bonding pad are arranged in the upper-layer PCB, the radio frequency signal inlet, the low-frequency signal inlet, the wave control data distribution network, the power division network structure and the second bonding pad are arranged in the lower-layer PCB, the upper-layer PCB and the lower-layer PCB are cascaded through the BGA ball grid array which is respectively and electrically connected with the first bonding pad and the second bonding pad, so that the signal processing and transmission of the antenna packaging structure are realized through split design between the upper-layer PCB and the lower-layer PCB, the stacking number and the pressing times during processing between each structure of the antenna packaging structure are reduced, the yield of the antenna packaging structure is ensured, and the production cost is greatly reduced; the metal cover plate covers the opening of the metal shielding cavity, so that the metal shielding of the MMIC chip is realized, and the MMIC chip positioned in the metal shielding cavity is protected; the upper layer PCB board and the lower layer PCB board are cascaded through the BGA ball grid array, the metal cover plate is fixed on the bottom surface of the upper layer PCB board through the solder ring, the melting temperature of the solder balls and the solder ring is low, and the antenna packaging structure is convenient to detach and repair the MMIC chip; the ball mounting and welding process and the cascading between the upper layer PCB and the lower layer PCB can be realized, so that the packaging process is simplified; after the first metal lead, the second metal lead and the third metal lead are formed on the MMIC chip and welded on the metal carrier, the problem that the bonded metal lead is stretched or broken due to deformation of an upper PCB in a high-temperature environment for a long time during welding is avoided; the phased array antenna adopting the antenna packaging structure has good return loss and in-band scanning range, good impedance matching is realized, and the production cost of the phased array antenna is reduced on the premise of ensuring the radio frequency performance of the phased array antenna, so that the phased array antenna has good application prospect. Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.

The above embodiments are merely illustrative of the principles of the present invention and its effectiveness, and are not intended to limit the invention. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the invention. Accordingly, it is intended that all equivalent modifications and variations of the invention be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.

Claims (12)

1. An antenna package structure, comprising:

the upper-layer PCB comprises a plurality of antenna radiating units, coaxial feed columns, radio frequency connection links, a metal shielding cavity, MMIC chips and first bonding pads, wherein two ends of each coaxial feed column are respectively and electrically connected with the antenna radiating units and the MMIC chips, an opening of each metal shielding cavity is formed in the bottom surface of the upper-layer PCB, at least one MMIC chip is positioned in each metal shielding cavity, the radio frequency connection links are electrically connected with the MMIC chips, and the first bonding pads are electrically connected with the radio frequency connection links;

a metal cover plate covering the metal shielding cavity opening to realize metal shielding of the MMIC chip;

The lower layer PCB comprises a power division network structure, a wave control data distribution network, a low-frequency signal inlet, a radio frequency signal inlet and a second bonding pad, wherein the second bonding pad is electrically connected with the power division network structure and the wave control data distribution network respectively; the BGA ball grid array is positioned between the upper PCB and the lower PCB and comprises a plurality of solder balls which are respectively and electrically connected with the first bonding pad and the second bonding pad so as to realize cascade connection of the upper PCB and the lower PCB.

2. The antenna package of claim 1, wherein: and a first radio frequency interconnection structure is arranged between the MMIC chip and the coaxial feed column.

3. The antenna package of claim 2, wherein: the first radio frequency interconnection structure comprises a radio frequency signal vertical transition structure, a strip line-microstrip structure, a first metal lead and a first metal shielding hole.

4. The antenna package of claim 1, wherein: and a metal slide for bearing the MMIC chip is arranged between the MMIC chip and the inner bottom surface of the metal shielding cavity.

5. The antenna package as defined in claim 4, wherein: the size of the metal slide is not smaller than the size of the MMIC chip.

6. The antenna package of claim 1, wherein: and the periphery of the opening of the metal shielding cavity is also provided with a solder ring.

7. The antenna package of claim 6, wherein: the metal cover plate is fixed on the bottom surface of the upper PCB through the solder ring.

8. The antenna package of claim 1, wherein: the first pads include ground pads, control signal pads, radio frequency signal pads, and electrical pads.

9. The antenna package of claim 1, wherein: the antenna radiation unit comprises a plurality of antenna radiation patches distributed in an array, and the antenna radiation patches are provided with U-shaped slits and radio frequency signal metal through holes.

10. The antenna package of claim 1, wherein: the MMIC chip is electrically connected with the radio frequency connection link through a second metal lead.

11. A manufacturing method of an antenna packaging structure comprises the following steps:

providing an upper-layer PCB, wherein the upper-layer PCB comprises a plurality of antenna radiating units, a coaxial feed column, a radio frequency connecting link, a metal shielding cavity, an MMIC chip and a first bonding pad, wherein two ends of the coaxial feed column are respectively and electrically connected with the antenna radiating units and the MMIC chip, an opening of the metal shielding cavity is formed in the bottom surface of the upper-layer PCB, at least one MMIC chip is positioned in the metal shielding cavity, the radio frequency connecting link is electrically connected with the MMIC chip, and the first bonding pad is electrically connected with the radio frequency connecting link;

Forming a metal cover plate covering the opening of the metal shielding cavity on the bottom surface of the upper PCB to realize metal shielding of the MMIC chip;

providing a lower-layer PCB, wherein the lower-layer PCB comprises a power division network structure, a wave control data distribution network, a low-frequency signal inlet, a radio frequency signal inlet and a second bonding pad, and the second bonding pad is electrically connected with the power division network structure and the wave control data distribution network respectively;

and forming a plurality of solder balls electrically connected with the first bonding pads below the upper PCB to obtain a BGA ball grid array, and electrically connecting the solder balls with the second bonding pads to realize cascade connection of the upper PCB and the lower PCB.

12. A phased array antenna comprising the antenna package structure of any of claims 1-10.