CN115020979A - Multi-beam phased array antenna - Google Patents
Multi-beam phased array antenna Download PDFInfo
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- CN115020979A CN115020979A CN202210557155.XA CN202210557155A CN115020979A CN 115020979 A CN115020979 A CN 115020979A CN 202210557155 A CN202210557155 A CN 202210557155A CN 115020979 A CN115020979 A CN 115020979A
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- 230000007704 transition Effects 0.000 claims description 14
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- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 238000003786 synthesis reaction Methods 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 claims 1
- 238000012545 processing Methods 0.000 abstract description 6
- 230000010354 integration Effects 0.000 abstract description 5
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- 239000010410 layer Substances 0.000 abstract 12
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- 238000013461 design Methods 0.000 description 7
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q3/00—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
- H01Q3/26—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
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Abstract
The invention relates to a multi-beam phased array antenna, which comprises a tile-shaped antenna spliced by a plurality of antenna sub-array components, wherein an antenna layer is used for transmitting and receiving signals; the network component layer is used for integrating a network and a chip; the switching matching layer is arranged between the antenna layer and the network component layer and used for connecting the antenna layer and the network component layer. According to the invention, through adopting the switching matching layer, the flexibility of the position of the feed interface of the antenna layer can be improved, the network and the chip are integrated in the network component layer, the defects that the section height and the quality surface density are difficult to reduce, the thickness of the network component layer and the processing technology difficulty are reduced, the interlayer vertical interconnection span is large, the integration degree is difficult to improve and the like caused by excessive layers are avoided, and the antenna has the advantages of low section, easiness in assembly and maintenance and the like.
Description
Technical Field
The invention relates to the field of phased array antennas, in particular to a multi-beam phased array antenna based on a switching matching layer.
Background
The traditional phased array architecture is mainly divided into a brick type architecture and a tile type architecture. The circuit layout surface of the brick-type structure device is perpendicular to the antenna array surface, the phased array is generally high in thickness and size and weight, and is suitable for applications with low requirements on volume and weight, such as large radars, but the application popularization of the brick-type structure device is greatly limited in application scenes with strict requirements on size and weight, such as satellite communication terminals, satellite load antennas, 5G antennas and the like. The tile-type phased-array antenna adopts a high-integration-level chip and antenna surface parallel layout, has the characteristics of low section, light weight, easiness in integration and conformality with a platform and the like, and simultaneously has the design difficulty and the complexity of a processing technology.
The general antenna layer of current multi-beam tile formula phased array and network layer lug connection, wherein antenna and radio frequency receiving chip install in 2 planes of symmetry of network board to through multilayer circuit board through-hole interconnection, mainly adopt flip chip, multilayer substrate to realize integratively, there is subassembly network layer thickness big antenna layer and the direct pressfitting of network layer, the processing technology degree of difficulty is high, and the subassembly network is relatively fixed moreover, and the unable fine setting in antenna feed position, the flexibility is difficult to guarantee.
In general, due to consideration of large-scale commercial and mass production, design and process implementation requirements are considered; the method has good expandability; meanwhile, the integrated design of the mounting platform and different mounting platforms is considered, and a novel design framework needs to be considered. Aiming at the expandable framework of the multi-beam phased array, how to realize the expandability and considering the process maturity are not provided with a determined technical scheme at present.
Disclosure of Invention
The invention aims to provide a multi-beam phased array antenna, which comprises a tile antenna spliced by a plurality of antenna sub-array components, wherein the antenna sub-array components comprise:
the antenna layer is used for transmitting and receiving signals;
the network component layer is used for integrating a network and a chip;
and the switching matching layer is arranged between the antenna layer and the network component layer and is used for connecting the antenna layer and the network component layer.
In any of the above technical solutions, the transfer matching layer at least includes a top layer pad, a bottom layer pad, and at least 1 transmitting transfer layer and at least 1 receiving transfer layer between the top layer pad and the bottom layer pad.
In any of the above technical solutions, the network component layer includes a multi-beam network layer, a control network layer, a power supply network layer, a multi-beam component chip layer, and a vertical interconnection via.
In any of the above technical solutions, the radio frequency feed signal of the antenna layer is connected to the transit matching layer through a feed interface, the transit matching layer is connected to the control network layer through a feed interface, and the control network layer is connected to the chip control port of the multi-beam component chip layer through a vertical interconnection via hole.
In any of the above technical solutions, the transfer matching layer and the antenna layer, and the transfer matching layer and the network component layer are integrally pressed through a BGA or LGA packaging process.
In any of the above technical solutions, the antenna layer, the transition matching layer, and the network element layer are plate-shaped structures manufactured by a multilayer microwave PCB lamination process or an LTCC process.
In any of the above technical solutions, the antenna layer, the transition matching layer, and the network component layer of each plate-like structure are isolated from each other by shielding.
In any of the above technical solutions, the power network layer is connected to the chip power port of the multi-beam component chip layer through a vertical interconnection via, and the multi-beam network layer is interconnected to the chip combining port of the multi-beam component chip layer through the vertical interconnection via.
In any of the above technical solutions, the antenna layer includes a receiving antenna radiation unit, a transmitting antenna radiation unit, a receiving antenna network layer, a transmitting antenna network layer, a receiving feed vertical via hole, and a transmitting feed vertical via hole, and a layout distance between the receiving antenna radiation unit and the transmitting antenna radiation unit satisfies the following relationship:
dx≤(1/sinα)(1/(1+sinθ))
dy≤(1/sinα)(1/(1+sinθ))
wherein dx and dy are unit spacing in x and y directions respectively, alpha is a base angle of an isosceles triangle in triangular grid arrangement layout, and theta is a scanning maximum angle range.
In any of the above technical solutions, the multi-beam network layer is at least formed by a receiving network layer or a transmitting network layer, and the number of the multi-beam network layers is not less than 1 layer.
In any of the above technical solutions, the control network layer includes a clock network, a data write network, a data read network, a data download network, and a chip select network.
In any of the above technical solutions, the multi-beam component chip layer is formed by a plurality of receiving multi-beam chips or a plurality of transmitting multi-beam chips, and the receiving multi-beam chips and the transmitting multi-beam chips are packaged by BGA and flip-chip bonded to the PAD of the chip circuit layer.
In any of the above technical solutions, the receiving multi-beam chip and the transmitting multi-beam chip are soldered in the same circuit plane.
In any one of the above technical solutions, the receive multi-beam chip and the transmit multi-beam chip are single-beam chips, a channel of any one of the receive multi-beam chips is interconnected with the receive antenna radiation unit through the receive feed vertical via hole, and a channel of any one of the transmit multi-beam chips is interconnected with the transmit antenna radiation unit through the transmit feed vertical via hole.
Compared with the prior art, the multi-beam phased-array antenna comprises a tile-shaped antenna formed by splicing a plurality of antenna sub-array components, wherein an antenna layer is used for transmitting and receiving signals; the network component layer is used for integrating a network and a chip; the switching matching layer is arranged between the antenna layer and the network component layer and used for connecting the antenna layer and the network component layer, so that the flexibility of the feed interface position of the antenna layer is improved, a network and a chip are integrated in the network component layer, the use of the switching matching layer is combined, the defects that the section height and the quality surface density caused by too many layers are difficult to reduce, the thickness and the processing difficulty of the network component layer are reduced, the vertical interconnection span between layers is large, the integration degree is difficult to improve and the like are overcome, and the switching matching layer has the advantages of low section, easiness in assembly, maintenance and the like.
Drawings
Figure 1 schematically illustrates an architecture of a multi-beam phased array antenna according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a transmitting/receiving common aperture antenna of a multi-beam phased array antenna according to an embodiment of the present invention;
fig. 3 is a schematic diagram schematically illustrating a multi-layer circuit lamination stack of a single-beam transmit-receive common-aperture active phased array antenna according to an embodiment of the present invention.
Wherein, the correspondence between the reference numbers and the component names in fig. 1 to 3 is:
10. an antenna layer; 11. an antenna radiation unit layer; 12. a transmit unit antenna network layer; 13. receiving a unit antenna network layer; 20. switching a matching layer; 22. a top layer pad; 23. an emission relay layer; 24. receiving a switching layer; 25. a bottom layer bonding pad; 30. a network component layer; 31. a power network layer; 32. receiving a network layer; 33. a transmitting network layer; 34. a multi-beam assembly chip layer; 40. a feed interface.
Detailed Description
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
In describing embodiments of the present invention, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship that is based on the orientation or positional relationship shown in the associated drawings, which is for convenience and simplicity of description only, and does not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus, the above-described terms should not be construed as limiting the present invention.
The present invention is described in detail below with reference to the drawings and the specific embodiments, which are not repeated herein, but the embodiments of the present invention are not limited to the following embodiments.
Referring to fig. 1 to 3, a multi-beam phased array antenna of the present invention includes a tiled antenna formed by splicing a plurality of antenna sub-array components, where the antenna sub-array component includes:
an antenna layer 10 for transmitting and receiving signals;
a network component layer 30 for integrating a network and a chip;
and the transition matching layer 20 is arranged between the antenna layer 10 and the network component layer 30 and is used for connecting the antenna layer 10 and the network component layer 30.
In this embodiment, the multi-beam phased array antenna is arranged in a plate structure of the antenna layer 10, the switching matching layer 20 and the network component layer 30, the switching matching layer 20 is arranged between the antenna layer 10 and the network component layer 30, the antenna layer 10 is connected with the network component layer 30 through the switching matching layer 20, the flexibility of the position of the feed interface 40 of the antenna layer 10 can be improved, a network and a chip are integrated in the network component layer 30, and by combining the use of the switching matching layer, the defects that the section height caused by too many layers and the quality surface density are difficult to reduce, the thickness and the processing difficulty of the network component layer 30 are reduced, the vertical interconnection span between layers is large, the integration degree is difficult to improve, and the like are overcome.
Specifically, the antenna layer 10 is pressed and combined into a multi-layer first layer PCB, the adapting matching layer 20 is pressed and combined into a multi-layer second layer PCB, the network component layer 30 is pressed and combined into a multi-layer third layer PCB, the first layer PCB and the second layer PCB are pressed and combined integrally through LGA or BGA packaging technology, the second layer PCB and the third layer PCB are pressed and combined integrally through LGA or BGA packaging technology, and finally the transceiving common-caliber antenna component is formed.
Furthermore, the receiving and transmitting sub-aperture antenna needs to be separately arranged between the receiving and transmitting antenna parts, and the receiving and transmitting common-aperture antenna can realize receiving and transmitting functions only by the size of the receiving aperture, so that the transmitting aperture area is saved, the aperture utilization rate is improved, the transmitting array number can be increased, the array surface gain is improved, and the antenna performance is improved.
The layout, feed structure, polarization design and lamination design of the transmitting-receiving common-aperture antenna need to be matched with the parameters such as size, polarization, bandwidth and scanning range required by application, and the actual design layer number can be adjusted according to the actual situation.
In addition, the antenna layer 10 may include a receiving radiation element, a transmitting radiation element, or a transceiving common-caliber radiation element, the antenna elements may adopt a microstrip structure or a stripline structure, the feeding manner may adopt direct feeding or coupled feeding, and the type may adopt a single-polarized antenna or a dual-polarized antenna.
In one embodiment of the present invention, the interposer matching layer 20 preferably includes at least a top layer pad 22, a bottom layer pad 25, and at least 1 transmitting interposer layer 23 and at least 1 receiving interposer layer 24 between the top layer pad 22 and the bottom layer pad 25.
In this embodiment, the adapting matching layer 20 includes a top pad 22, a bottom pad 25, and a transmitting adapting layer 23 and a receiving adapting layer between the top pad 22 and the bottom pad 25, the number of layers of the transmitting adapting layer 23 and the receiving adapting layer is at least 1, and can be adjusted according to actual requirements, for example, the transmitting adapting layer 231 and the receiving adapting layer 2 are provided with a ground layer between two adjacent layers, which can avoid mutual influence between signals, and fine tuning of the position of the feeding interface 40 of the antenna layer 10 can be realized by arranging the adapting matching layer 20 between the antenna layer 10 and the network component layer 30.
As shown in fig. 3, in one embodiment of the present invention, network component layers 30 preferably include a multi-beam network layer, a control network layer, a power network layer 31, a multi-beam component chip layer 34, vertical interconnect vias.
In this embodiment, each layer is laminated by a plurality of layers of PCBs, the number of via holes can be adjusted according to constraints such as actual array scale, number of beams, number of networks, and the like, and the actual stacking sequence can be adjusted according to actual needs.
The power network and the adjacent upper and lower GND ground layers form a power network layer 31, the receiving beam network and the adjacent upper and lower GND ground layers form a receiving synthetic network layer, and the transmitting beam network and the adjacent upper and lower GND ground layers form a transmitting synthetic network layer; the receiving synthesis network layer and the transmitting synthesis network layer form a multi-beam network layer.
In one embodiment of the present invention, preferably, the rf feed signal of the antenna layer 10 is connected to the transition matching layer 20 through a feed interface, the transition matching layer 20 is connected to the control network layer through a feed interface, and the control network layer is connected to the chip control port of the multi-beam module chip layer 34 through a vertical interconnection via.
In one embodiment of the present invention, the interposer matching layer 20 and the antenna layer 10, and the interposer matching layer 20 and the network component layer 30 are preferably integrally bonded by BGA or LGA packaging process.
In one embodiment of the present invention, the antenna layer 10, the transition matching layer 20 and the network component layer 30 are preferably a plate-shaped structure made by a multilayer microwave PCB lamination process or LTCC process.
In this embodiment, the antenna layer 10, the adapting matching layer 20 and the network component layer 30 are pressed into a plate-shaped structure by a multilayer microwave PCB lamination process or LTCC process, and the adapting matching layer 20 and the antenna layer 10, and the adapting matching layer 20 and the network component layer 30 are integrally pressed by BGA or LGA packaging process, and are integrally formed.
Further, antenna integrated into one piece processes forms, need not additionally to set up connector, cable etc. and avoided connector, cable to damage and the product trouble that the installation problem arouses effectively to the stability and the reliability of antenna have been promoted.
In one embodiment of the present invention, the internal layers of the antenna layer 10, the transition matching layer 20 and the network component layer 30 of each plate-like structure are preferably isolated from each other by shielding.
In this embodiment, the antenna layer 10 is generally provided with an antenna radiation unit layer 11, a transmitting unit antenna network layer 12 and a receiving unit antenna network layer 13, the transit matching layer 20 is generally provided with a transmitting transit layer 23 and a receiving transit layer, and the network component layer 30 is at least provided with a control network layer, a power supply network layer 31 and a multi-beam network layer, and the antenna layer 10, the transit matching layer 20 or the network component layer 30 are isolated from each other by shielding, so that interference between signals can be effectively avoided, and the antenna stability is improved.
In one embodiment of the present invention, the power network layer 31 is preferably connected to the chip power ports of the multi-beam component chip layer 34 through vertical interconnection vias, and the multi-beam network layer is preferably interconnected to the chip combining ports of the multi-beam component chip layer 34 through vertical interconnection vias.
In this embodiment, the power network layer 31 mainly provides power to the multi-beam module chip layer 34, vertical interconnection vias are disposed in the network element layer, the power network layer 31 is electrically connected to the chip power port of the multi-beam module chip layer 34 through the vertical interconnection vias to supply power to the multi-beam module chip layer 34,
as shown in fig. 2, in one embodiment of the present invention, preferably, the antenna layer 10 includes a receiving antenna radiation element, a transmitting antenna radiation element, a receiving antenna network layer, a transmitting antenna network layer, a receiving feeding vertical via hole and a transmitting feeding vertical via hole, and the layout spacing between the receiving antenna radiation element and the transmitting antenna radiation element satisfies the following relationship:
dx≤(1/sinα)(1/(1+sinθ))
dy≤(1/sinα)(1/(1+sinθ))
wherein dx and dy are unit spacing in x and y directions, respectively, α is a low angle of isosceles triangle in triangular grid arrangement layout, and θ is a maximum scanning angle range.
In the embodiment, grating lobes can appear during beam scanning of the phased array antenna, the amplitude of the grating lobes is the same as that of a main lobe, multivalue exists in angle measurement due to the existence of the grating lobes, and through the control unit interval, the grating lobes do not appear during beam scanning of the phased array antenna, so that the problem of antenna gain reduction is avoided, interference signals are prevented from entering through the grating lobes to influence normal work of the antenna, and the stability and reliability of the antenna are improved.
In one embodiment of the present invention, preferably, the multi-beam network layer is made up of at least the reception network layer 32 or the transmission network layer 33, and the number is not lower than 1 layer.
In this embodiment, the receiving network layer and the transmitting network layer 33 together form a multi-beam network layer, the number of layers is determined according to the antenna unit spacing and the area of the transceiver chip, and the receiving network layer and the transmitting network layer 33 adopt multi-stage wilkins bridge cascade connection and adopt a resistance burying process.
In one embodiment of the present invention, preferably, the control network layer includes a clock network CLK, a DATA write network DATA, a DATA download network LD, and a chip select network CS.
In this embodiment, the clock network provides the clock for multi-beam component chip interface communications. The data write network provides data write for multi-beam component chip interface communications. The data read network provides a data read back function for multi-beam component chip interface communication. The data download network provides data download control for multi-beam component chip interface communications. The chip select network provides chip enable for multi-beam component chip interface communications.
In one embodiment of the present invention, the multi-beam component chip layer 34 is preferably formed by a plurality of receiving multi-beam chips or a plurality of transmitting multi-beam chips, and the receiving multi-beam chips and the transmitting multi-beam chips are flip-chip bonded to the chip circuit layer PAD using BGA packages.
In one embodiment of the present invention, preferably, the receiving multi-beam die and the transmitting multi-beam die are soldered in the same circuit plane.
In the embodiment, the receiving multi-beam chip and the transmitting multi-beam chip are welded in the same circuit plane, so that the antenna profile is reduced, and the volume and weight of the antenna are reduced.
In one embodiment of the present invention, preferably, the receive multi-beam chip and the transmit multi-beam chip are single-beam chips, the channel of any one of the receive multi-beam chips is interconnected with the receive antenna radiation unit through the receive feed vertical via hole, and the channel of any one of the transmit multi-beam chips is interconnected with the transmit antenna radiation unit through the transmit feed vertical via hole.
In this embodiment, a low-cost soldering process such as reflow soldering can be used to solder the pads of the chip circuit layer, which contributes to low-cost and mass production.
The invention discloses a multi-beam phased array antenna, which comprises a tile-shaped antenna spliced by a plurality of antenna sub-array components, wherein an antenna layer is used for transmitting and receiving signals; the network component layer is used for integrating a network and a chip; the switching matching layer is arranged between the antenna layer and the network component layer and used for connecting the antenna layer and the network component layer, so that the flexibility of the feed interface position of the antenna layer is improved, a network and a chip are integrated in the network component layer, the use of the switching matching layer is combined, the defects that the number of layers is too large to cause section height, the quality surface density is difficult to reduce, the thickness and the processing technology difficulty of the network component layer are reduced, the vertical interconnection span between the layers is large, the integration degree is difficult to improve and the like are overcome, and the switching matching layer has the advantages of low section, easiness in assembly, maintenance and the like.
The above description is only one embodiment of the present invention, and is not intended to limit the present invention, and it is apparent to those skilled in the art that various modifications and variations can be made in the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A multi-beam phased array antenna comprising a tiled antenna tiled by a plurality of antenna sub-array components, wherein the antenna sub-array components comprise:
the antenna layer is used for transmitting and receiving signals;
the network component layer is used for integrating a network and a chip;
and the switching matching layer is arranged between the antenna layer and the network component layer and is used for connecting the antenna layer and the network component layer.
2. The multi-beam phased array antenna of claim 1, wherein the transition matching layers comprise at least a top layer pad, a bottom layer pad, and at least 1 transmit transition layer and at least 1 receive transition layer between the top and bottom layer pads.
3. The multi-beam phased array antenna of claim 1, wherein the network component layers comprise a multi-beam network layer, a control network layer, a power network layer, a multi-beam component chip layer, vertical interconnect vias;
the multi-beam network layer is at least composed of a receiving network layer or a transmitting network layer, and the number of the multi-beam network layers is not less than 1 layer;
the control network layer comprises a clock network, a data writing network, a data reading network, a data downloading network and a chip selection network;
the power network layer is connected with the chip power port of the multi-beam component chip layer through a vertical interconnection via hole, and the multi-beam network layer is interconnected with the chip synthesis port of the multi-beam component chip layer through the vertical interconnection via hole.
4. The multi-beam phased array antenna of claim 3, wherein the radio frequency feed signal of the antenna layer is connected to the transition matching layer through a feed interface, the transition matching layer is connected to the control network layer through a feed interface, and the control network layer is connected to the chip control ports of the multi-beam component chip layer through vertical interconnect vias.
5. The multi-beam phased array antenna of claim 1, wherein the interposer matching layer is integrally bonded to the antenna layer and the network component layer by a BGA or LGA packaging process.
6. The multi-beam phased array antenna of claim 1, wherein the antenna layer, the transition matching layer, and the network component layer are slab structures made by a multi-layer microwave PCB lamination process or LTCC process;
the antenna layer, the transition matching layer and the inner layer of the network component layer of each plate-shaped structure are isolated from each other by shielding.
7. The multi-beam phased array antenna of claim 3, wherein the antenna layers comprise receive antenna radiating elements, transmit antenna radiating elements, a receive antenna network layer, a transmit antenna network layer, receive feed vertical vias, and transmit feed vertical vias, and wherein the receive antenna radiating elements are spaced apart from the transmit antenna radiating elements by a distance that satisfies the following relationship:
dx≤(1/sinα)(1/(1+sinθ))
dy≤(1/sinα)(1/(1+sinθ))
wherein dx and dy are unit spacing in x and y directions respectively, α is a base angle of an isosceles triangle in a triangular grid arrangement layout, and θ is a scanning maximum angle range.
8. The multi-beam phased array antenna of claim 7, wherein the multi-beam component chip layer is comprised of a plurality of receive multi-beam chips or a plurality of transmit multi-beam chips, the receive multi-beam chips and the transmit multi-beam chips being flip-chip bonded to a chip circuit layer PAD using BGA packaging.
9. The multi-beam phased array antenna of claim 8, wherein the receive multi-beam die and the transmit multi-beam die are soldered within a same circuit plane.
10. The multi-beam phased array antenna of claim 8, wherein the receive multi-beam chips and the transmit multi-beam chips are single beam chips, wherein a channel of any one of the receive multi-beam chips is interconnected to the receive antenna radiating elements through the receive feed vertical via, and wherein a channel of any one of the transmit multi-beam chips is interconnected to the transmit antenna radiating elements through the transmit feed vertical via.
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| CN202210557155.XA CN115020979A (en) | 2022-05-19 | 2022-05-19 | Multi-beam phased array antenna |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115332765A (en) * | 2022-09-19 | 2022-11-11 | 航天恒星科技有限公司 | Multi-beam laminate assembly for phased array antenna |
| CN115458954A (en) * | 2022-09-19 | 2022-12-09 | 航天恒星科技有限公司 | Transmitting-receiving common-caliber multi-beam active phased array antenna with expandable brick type framework |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102136847A (en) * | 2010-01-26 | 2011-07-27 | 宏达国际电子股份有限公司 | Wideband antenna matching device and method thereof |
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| CN114069233A (en) * | 2021-11-22 | 2022-02-18 | 中国电子科技集团公司第五十四研究所 | Phased array antenna |
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| CN115332765A (en) * | 2022-09-19 | 2022-11-11 | 航天恒星科技有限公司 | Multi-beam laminate assembly for phased array antenna |
| CN115458954A (en) * | 2022-09-19 | 2022-12-09 | 航天恒星科技有限公司 | Transmitting-receiving common-caliber multi-beam active phased array antenna with expandable brick type framework |
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