CN115020979A - Multi-beam phased array antenna - Google Patents

Abstract

The invention relates to a multi-beam phased array antenna, which comprises a tile-shaped antenna spliced by a plurality of antenna sub-array components, wherein an antenna layer is used for transmitting and receiving signals; the network component layer is used for integrating a network and a chip; the switching matching layer is arranged between the antenna layer and the network component layer and used for connecting the antenna layer and the network component layer. According to the invention, through adopting the switching matching layer, the flexibility of the position of the feed interface of the antenna layer can be improved, the network and the chip are integrated in the network component layer, the defects that the section height and the quality surface density are difficult to reduce, the thickness of the network component layer and the processing technology difficulty are reduced, the interlayer vertical interconnection span is large, the integration degree is difficult to improve and the like caused by excessive layers are avoided, and the antenna has the advantages of low section, easiness in assembly and maintenance and the like.

Description

Multibeam Phased Array Antenna

technical field

The invention relates to the field of phased array antennas, in particular to a multi-beam phased array antenna based on a switching matching layer.

Background technique

The traditional phased array architecture is mainly divided into two types: brick type and tile type. The circuit layout surface of the brick-type device is perpendicular to the antenna array surface. Usually, the phased array has a high thickness, large size and weight, which is suitable for applications that do not require high volume and weight, such as large radars. Scenarios such as satellite communication terminals, satellite payload antennas, 5G antennas and other application scenarios have relatively limited application promotion. The tiled phased array antenna adopts a highly integrated chip and is arranged in parallel with the antenna surface. It has the characteristics of low profile, light weight, and easy integration with the platform.

In the existing multi-beam tiled phased array, the antenna layer and the network layer are generally directly connected, in which the antenna and the radio frequency receiving chip are installed on the two symmetrical planes of the network board, and are interconnected through the through holes of the multi-layer circuit board, mainly using flip-chip Chips and multi-layer substrates are integrated, and the antenna layer and the network layer are directly pressed together. The thickness of the component network layer is large, the processing technology is difficult, and the component network is relatively fixed, the antenna feeding position cannot be fine-tuned, and flexibility is difficult to guarantee.

In general, due to the consideration of large-scale commercial use and mass production, the design and process implementation requirements are considered; it has good scalability; at the same time, it is easy to integrate design with different installation platforms, and new design architectures need to be considered. Regarding the scalable architecture of the multi-beam phased array, how to achieve scalability, while considering the process maturity, there is no definite technical solution yet.

SUMMARY OF THE INVENTION

The object of the present invention is to provide a multi-beam phased array antenna, including a tile antenna spliced with multiple antenna sub-array components, and the antenna sub-array components include:

Antenna layer, used for signal transmission and reception;

The network component layer is used to integrate the network and the chip;

The switching matching layer is arranged between the antenna layer and the network component layer, and is used for connecting the antenna layer and the network component layer.

In any of the above technical solutions, the transfer matching layer at least includes a top layer pad, a bottom layer pad, and at least one layer of transmit transfer layer and at least one layer of receive transfer layer between the top layer pad and the bottom layer pad. Floor.

In any of the above technical solutions, the network component layer includes a multi-beam network layer, a control network layer, a power network layer, a multi-beam component chip layer, and a vertical interconnection via.

In any of the above technical solutions, the radio frequency feed signal of the antenna layer is connected to the switching matching layer through a feeding interface, the switching matching layer is connected to the control network layer through a feeding interface, and the switching matching layer is connected to the control network layer through a feeding interface. The control network layer is connected with the chip control port of the multi-beam component chip layer through vertical interconnection via holes.

In any of the above technical solutions, the transition matching layer and the antenna layer, and the transition matching layer and the network component layer are integrally pressed together through a BGA or LGA packaging process.

In any of the above technical solutions, the antenna layer, the transition matching layer and the network component layer are plate-like structures made by a multilayer microwave PCB lamination process or an LTCC process.

In any of the above technical solutions, the antenna layer, the transition matching layer and the inner layers of the network component layer of each plate-like structure are isolated by shielding ground.

In any of the above technical solutions, the power network layer is connected to the chip power port of the multi-beam component chip layer through a vertical interconnection via, and the multibeam network layer is connected to the multi-beam component through the vertical interconnection via. Chip synthesis port interconnection at the beam assembly chip level.

In any of the above technical solutions, the antenna layer includes a receiving antenna radiating element, a transmitting antenna radiating element, a receiving antenna network layer, a transmitting antenna network layer, a receiving feed vertical via and a transmitting feed vertical via, and the receiving The layout spacing between the antenna radiating element and the transmitting antenna radiating element satisfies the following relationship:

dx≤(1/sinα)(1/(1+sinθ))

dy≤(1/sinα)(1/(1+sinθ))

Among them, dx and dy are the cell spacings in the x and y directions, respectively, α is the base angle of the isosceles triangle in the triangular grid arrangement, and θ is the maximum scanning angle range.

In any of the above technical solutions, the multi-beam network layer is composed of at least a receiving network layer or a transmitting network layer, and the number is not less than one layer.

In any of the above technical solutions, the control network layer includes a clock network, a data writing network, a data reading network, a data downloading network, and a chip selection network.

In any of the above technical solutions, the multi-beam component chip layer is composed of multiple receiving multi-beam chips or multiple transmitting multi-beam chips, and the receiving multi-beam chips and the transmitting multi-beam chips are packaged in BGA, flip-chip Soldered to the chip circuit layer PAD.

In any of the above technical solutions, the receiving multi-beam chip and the transmitting multi-beam chip are welded in the same circuit plane.

In any of the above technical solutions, the receiving multi-beam chip and the transmitting multi-beam chip are single-beam chips, and the channel of any of the receiving multi-beam chips is connected to the receiving antenna through the receiving feed vertical via hole The radiating units are interconnected, and any channel of the transmitting multi-beam chip is interconnected with the transmitting antenna radiating unit through the transmitting and feeding vertical via holes.

Compared with the prior art, a multi-beam phased array antenna of the present invention includes a tile antenna spliced with multiple antenna sub-array components, the antenna layer is used for signal transmission and reception; the network component layer is used for integrating network and The chip; the transfer matching layer is arranged between the antenna layer and the network component layer, and is used to connect the antenna layer and the network component layer, thereby improving the flexibility of the position of the feeding interface of the antenna layer, and the network and the chip are integrated in the network component. In the layer, combined with the use of the transition matching layer, it can avoid the difficulty of reducing the section height and mass surface density caused by the excessive number of layers, reduce the thickness of the network component layer and the difficulty of the processing technology, the vertical interconnection span between the layers is large, and the integration degree is difficult to improve. , has the advantages of low profile, easy assembly and maintenance.

Description of drawings

FIG. 1 schematically shows a schematic structural diagram of a multi-beam phased array antenna according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of a transceiving common aperture antenna of a multi-beam phased array antenna according to an embodiment of the present invention;

FIG. 3 is a schematic diagram schematically showing a multi-layer circuit lamination stack of a single-beam transceiving common aperture active phased array antenna according to an embodiment of the present invention.

Among them, the corresponding relationship between the reference numerals and the component names in Fig. 1 to Fig. 3 is:

10. Antenna layer; 11. Antenna radiation unit layer; 12. Transmitting unit antenna network layer; 13. Receiving unit antenna network layer; 25, bottom pad; 30, network component layer; 31, power network layer; 32, receiving network layer; 33, transmitting network layer; 34, multi-beam component chip layer; 40, feeding interface.

Detailed ways

In order to more clearly describe the embodiments of the present invention or the technical solutions in the prior art, the accompanying drawings required in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention, and for those of ordinary skill in the art, other drawings can also be obtained from these drawings without creative effort.

When describing embodiments of the present invention, the terms "portrait", "landscape", "top", "bottom", "front", "rear", "left", "right", "vertical", " The orientation or positional relationship expressed by "horizontal", "top", "bottom", "inside" and "outside" is based on the orientation or positional relationship shown in the relevant drawings, which are only for the convenience of describing the present invention and simplifying the description, and It is not intended to indicate or imply that the referred device or element must have a particular orientation, be constructed and operate in a particular orientation, and thus the above terms should not be construed as limiting the invention.

The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. The embodiments cannot be repeated here, but the embodiments of the present invention are not limited to the following embodiments.

Referring to FIG. 1 to FIG. 3, a multi-beam phased array antenna of the present invention includes a tile antenna spliced by multiple antenna sub-array components, and the antenna sub-array components include:

The antenna layer 10 is used for signal transmission and reception;

The network component layer 30 is used to integrate the network and the chip;

The transition matching layer 20 is disposed between the antenna layer 10 and the network component layer 30 , and is used for connecting the antenna layer 10 and the network component layer 30 .

In this embodiment, by setting the multi-beam phased array antenna into a plate structure of the antenna layer 10, the switching matching layer 20 and the network component layer 30, the switching matching layer 20 is arranged between the antenna layer 10 and the network component layer 30. In the meantime, the antenna layer 10 and the network component layer 30 are connected by the transfer matching layer 20, which can improve the flexibility of the position of the feeding interface 40 of the antenna layer 10. The network and the chip are integrated in the network component layer 30, combined with the transfer matching layer. It can avoid the difficulty of reducing the section height and mass surface density caused by the excessive number of layers, reduce the thickness of the network component layer 30 and the difficulty of processing technology, the vertical interconnection span between layers is large, and the integration degree is difficult to improve. Maintenance and other advantages.

Specifically, the antenna layer 10 is separately pressed into a multi-layer first-layer PCB board, the transition matching layer 20 is separately pressed into a multi-layer second-layer PCB board, and the network component layer 30 is overall pressed into a multi-layer PCB board. The third layer PCB board of the first layer, the first layer PCB board and the second layer PCB board are pressed together by LGA or BGA packaging process, and the second layer PCB board and the third layer PCB board are pressed together by LGA or BGA packaging process. Finally, the transceiver common aperture antenna assembly is formed.

Further, the transceiver sub-aperture antenna needs to place the receiving and transmitting antenna parts separately, while the transceiver common-aperture antenna only needs the size of the receiving aperture to realize the receiving and transmitting functions, which saves the area of the transmitting aperture and improves the aperture utilization rate. Increase the number of transmitting arrays and increase the gain of the array, thereby improving the performance of the antenna.

Among them, the layout, feed structure, polarization design, and stack design of the transceiver common aperture antenna need to match the size, polarization, bandwidth, scanning range and other parameters required by the application, and the actual design layer number can be adjusted according to the actual situation.

In addition, the antenna layer 10 may include a receiving radiating element, a transmitting radiating element, or a transceiving common-aperture radiating element. The above-mentioned antenna element may adopt a microstrip structure or a stripline structure, and the feeding method may adopt direct feeding or coupling feeding, and its type may be Use a single-polarized antenna or a dual-polarized antenna.

In an embodiment of the present invention, preferably, the transfer matching layer 20 includes at least a top layer pad 22 , a bottom layer pad 25 and at least one layer of emission transfer layer 23 between the top layer pad 22 and the bottom layer pad 25 . and at least one receiving transition layer 24.

In this embodiment, the transfer matching layer 20 includes a top layer pad 22 , a bottom layer pad 25 , and a transmit transfer layer 23 and a receive transfer layer between the top layer pad 22 and the bottom layer pad 25 , and the transmit transfer layer 23 The number of layers with the receiving transition layer is at least 1, and can also be adjusted according to actual needs. For example, the transmitting transition layer is 231 layers, the receiving transition layer is 2 layers, and there is a ground layer between the two adjacent layers, which can avoid For mutual influence between signals, by arranging a switching matching layer 20 between the antenna layer 10 and the network component layer 30 , the position of the feeding interface 40 of the antenna layer 10 can be fine-tuned.

As shown in FIG. 3, in an embodiment of the present invention, preferably, the network component layer 30 includes a multi-beam network layer, a control network layer, a power network layer 31, a multi-beam component chip layer 34, and vertical interconnection vias.

In this embodiment, each layer is pressed together by a multi-layer PCB, and the number of vias can be adjusted according to constraints such as the actual array size, the number of beams, and the number of networks. In fact, the lower stacking sequence can be adjusted according to actual needs.

The power supply network and the adjacent upper and lower GND ground layers form the power network layer 31, the receiving beam network and the adjacent upper and lower GND ground layers form the receiving composite network layer, the transmitting beam network and the adjacent upper and lower GND layers The ground layer composes the transmitting synthesis network layer; the receiving synthesis network layer and the transmitting synthesis network layer constitute the multi-beam network layer.

In an embodiment of the present invention, preferably, the radio frequency feed signal of the antenna layer 10 is connected to the switching matching layer 20 through a feeding interface, and the switching matching layer 20 is connected to the control network layer through the feeding interface, and the control network layer The connection is made with the chip control port of the chip layer 34 of the multi-beam assembly through the vertical interconnection via hole.

In an embodiment of the present invention, preferably, the transition matching layer 20 and the antenna layer 10 and the transition matching layer 20 and the network component layer 30 are integrally pressed together through a BGA or LGA packaging process.

In an embodiment of the present invention, preferably, the antenna layer 10 , the transition matching layer 20 and the network component layer 30 are plate-like structures made by a multilayer microwave PCB lamination process or an LTCC process.

In this embodiment, the antenna layer 10 , the transfer matching layer 20 and the network component layer 30 are pressed into a plate-like structure by a multi-layer microwave PCB lamination process or LTCC process, and the transfer matching layer 20 is connected to the antenna layer 10 , the transfer The matching layer 20 and the network component layer 30 are integrally pressed together through the BGA or LGA packaging process, and are integrally formed. The processing is simple, the cost is low, it can be quickly automated and assembled, the production cycle is shortened, mass production can be realized, and the processing cost is low. , chips and various signal connection lines are integrated on a multi-layer PCB board, eliminating the cost of additional connectors and various connection cables, as well as the labor cost and time cost of assembling products.

Furthermore, the antenna is integrally processed, and there is no need to provide additional connectors, cables, etc., which effectively avoids damage to connectors and cables and product failures caused by installation problems, thereby improving the stability and reliability of the antenna.

In an embodiment of the present invention, preferably, the inner layers of the antenna layer 10 , the switching matching layer 20 and the network component layer 30 of each plate-like structure are isolated by shielding.

In this embodiment, the antenna layer 10 is generally provided with an antenna radiation unit layer 11, a transmitting unit antenna network layer 12 and a receiving unit antenna network layer 13, and the switching matching layer 20 is generally provided with a transmitting switching layer 23 and a receiving switching layer , and the network component layer 30 is provided with at least a control network layer, a power network layer 31 and a multi-beam network layer. Whether it is the antenna layer 10, the switching matching layer 20 or the network component layer 30, the internal layers pass through the layers. Shielded ground isolation can effectively avoid interference between signals and improve antenna stability.

In an embodiment of the present invention, preferably, the power network layer 31 is connected to the chip power port of the multi-beam component chip layer 34 through vertical interconnection vias, and the multi-beam network layer is connected to the multi-beam component chip layer through vertical interconnection vias 34 chip synthesis port interconnects.

In this embodiment, the power network layer 31 mainly provides power for the chip layer 34 of the multi-beam module, the network module layer is provided with vertical interconnection vias, and the power network layer 31 is connected to the multi-beam module chip layer 34 through the vertical interconnection vias. The chip power port is electrically connected to achieve power supply to the chip layer 34 of the multi-beam assembly,

As shown in FIG. 2 , in an embodiment of the present invention, preferably, the antenna layer 10 includes a receiving antenna radiating element, a transmitting antenna radiating element, a receiving antenna network layer, a transmitting antenna network layer, a receiving and feeding vertical via and a transmitting Feed vertical vias, and the layout spacing between the receiving antenna radiating element and the transmitting antenna radiating element satisfies the following relationship:

dx≤(1/sinα)(1/(1+sinθ))

dy≤(1/sinα)(1/(1+sinθ))

Among them, dx and dy are the cell spacings in the x and y directions, respectively, α is the low angle angle of the isosceles triangle in the triangular grid arrangement, and θ is the maximum scanning angle range.

In this embodiment, grating lobes will appear during beam scanning of the phased array antenna. The amplitude of the grating lobes is the same as that of the main lobes. The existence of the grating lobes will lead to multi-valued angle measurement. By controlling the unit spacing, the phased array antenna can be made to There is no grating lobe when the beam is scanned, so as to avoid the problem of reducing the antenna gain and prevent the interference signal from entering through the grating lobe to affect the normal operation of the antenna, which improves the stability and reliability of the antenna.

In an embodiment of the present invention, preferably, the multi-beam network layer is composed of at least a receiving network layer 32 or a transmitting network layer 33, and the number is not less than one layer.

In this embodiment, the receiving network layer and the transmitting network layer 33 together form a multi-beam network layer, and the number of layers needs to be determined according to the distance between the antenna units and the area of the transceiver chip. The receiving network layer and the transmitting network layer 33 use multi-level Wilkins Bridge cascade, using buried resistance process.

In an embodiment of the present invention, preferably, the control network layer includes a clock network CLK, a data write network DATA, a data download network LD, and a chip select network CS.

In this embodiment, the clock network provides the clock for the multi-beam assembly chip interface communications. The data writing network provides data writing for the multi-beam component chip interface communication. The data read network provides the data read back function for the multi-beam component chip interface communication. The data download network provides data download control for the multi-beam component chip interface communication. The chip select network provides chip enable for the multi-beam module chip interface communication.

In an embodiment of the present invention, preferably, the multi-beam assembly chip layer 34 is composed of multiple receiving multi-beam chips or multiple transmitting multi-beam chips. to the chip circuit layer PAD.

In an embodiment of the present invention, preferably, the receiving multi-beam chip and the transmitting multi-beam chip are soldered in the same circuit plane.

In this embodiment, the receiving multi-beam chip and the transmitting multi-beam chip are welded in the same circuit plane, which is beneficial to reduce the cross section of the antenna and reduce the volume and weight of the antenna.

In an embodiment of the present invention, preferably, the receiving multi-beam chip and the transmitting multi-beam chip are single-beam chips, and the channel of any receiving multi-beam chip is interconnected with the receiving antenna radiating element through the receiving feed vertical vias, and any one The channel of the transmit multi-beam chip is interconnected with the transmit antenna radiating element through the transmit feed vertical via hole.

In this embodiment, a low-cost soldering process, such as reflow soldering, can be used to solder to the pads of the circuit layer of the chip, which helps to achieve low-cost and mass production.

A multi-beam phased array antenna of the present invention comprises a tiled antenna spliced with multiple antenna sub-array components. The antenna layer is used for signal transmission and reception; the network component layer is used for integrating networks and chips; Between the antenna layer and the network component layer, it is used to connect the antenna layer and the network component layer, thereby improving the flexibility of the position of the feeding interface of the antenna layer. The network and chip are integrated in the network component layer, combined with the use of the switching matching layer, It can avoid the difficulty of reducing the section height and mass surface density caused by too many layers, reduce the thickness of the network component layer and the difficulty of processing technology, the vertical interconnection span between layers is large, and the integration degree is difficult to improve. It has the advantages of low profile, easy assembly and maintenance, etc. .

The above description is only one embodiment of the present invention, and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims (10)

1. A multi-beam phased array antenna, comprising a tiled antenna spliced by a plurality of antenna sub-array assemblies, wherein the antenna sub-array assembly comprises: Antenna layer, used for signal transmission and reception; The network component layer is used to integrate the network and the chip; The switching matching layer is arranged between the antenna layer and the network component layer, and is used for connecting the antenna layer and the network component layer. 2 . The multi-beam phased array antenna according to claim 1 , wherein the transition matching layer at least comprises a top pad, a bottom pad, and at least one layer between the top pad and the bottom pad. 3 . A transmit transition layer and at least one receive transition layer. 3. The multi-beam phased array antenna according to claim 1, wherein the network component layer comprises a multi-beam network layer, a control network layer, a power network layer, a multi-beam component chip layer, and a vertical interconnection via; The multi-beam network layer is composed of at least a receiving network layer or a transmitting network layer, and the number is not less than one layer; The control network layer includes a clock network, a data writing network, a data reading network, a data downloading network, and a chip selection network; The power supply network layer is connected to the chip power port of the multi-beam component chip layer through a vertical interconnection via hole, and the multi-beam network layer is connected to the chip synthesis port of the multi-beam component chip layer through the vertical interconnection via hole interconnected. 4 . The multi-beam phased array antenna according to claim 3 , wherein the radio frequency feed signal of the antenna layer is connected to the switching matching layer through a feeding interface, and the switching matching layer is fed through a feeder interface. 5 . The electrical interface is connected to the control network layer, and the control network layer is connected to the chip control port of the multi-beam assembly chip layer through vertical interconnection vias. 5 . The multi-beam phased array antenna according to claim 1 , wherein the switching matching layer and the antenna layer, the switching matching layer and the network component layer pass through BGA or LGA. 6 . The packaging process is integrally pressed. 6 . The multi-beam phased array antenna according to claim 1 , wherein the antenna layer, the switching matching layer and the network component layer are made by a multilayer microwave PCB lamination process or an LTCC process. 7 . the plate-like structure; The inner layers of the antenna layer, the switching matching layer and the network component layer of each plate-like structure are isolated by shielding ground. 7 . The multi-beam phased array antenna according to claim 3 , wherein the antenna layer comprises a receiving antenna radiating unit, a transmitting antenna radiating unit, a receiving antenna network layer, a transmitting antenna network layer, a receiving and feeding vertical filter. 8 . holes and vertical vias for transmitting and feeding, and the layout spacing between the receiving antenna radiating element and the transmitting antenna radiating element satisfies the following relationship: dx≤(1/sinα)(1/(1+sinθ)) dy≤(1/sinα)(1/(1+sinθ)) Among them, dx and dy are the cell spacings in the x and y directions, respectively, α is the base angle of the isosceles triangle in the triangular grid arrangement, and θ is the maximum scanning angle range. 8 . The multi-beam phased array antenna according to claim 7 , wherein the multi-beam component chip layer is composed of a plurality of receiving multi-beam chips or a plurality of transmitting multi-beam chips, and the receiving multi-beam chips and The transmitting multi-beam chip adopts BGA package and is flip-chip welded to the chip circuit layer PAD. 9 . The multi-beam phased array antenna according to claim 8 , wherein the receiving multi-beam chip and the transmitting multi-beam chip are welded in the same circuit plane. 10 . 10. The multi-beam phased array antenna according to claim 8, wherein the receiving multi-beam chip and the transmitting multi-beam chip are single-beam chips, and any channel of the receiving multi-beam chip passes through all the The receiving and feeding vertical via holes are interconnected with the receiving antenna radiating element, and any channel of the transmitting multi-beam chip is interconnected with the transmitting antenna radiating element through the transmitting and feeding vertical via holes.

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