CN114430106A - Sub-array assembly of phased array antenna and phased array antenna - Google Patents
Sub-array assembly of phased array antenna and phased array antenna Download PDFInfo
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- H—ELECTRICITY
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- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
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- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
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- H—ELECTRICITY
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- H01Q21/00—Antenna arrays or systems
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- H—ELECTRICITY
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- H01Q21/00—Antenna arrays or systems
- H01Q21/0006—Particular feeding systems
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- H—ELECTRICITY
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- H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
Abstract
The application provides a phased array antenna's subarray subassembly and phased array antenna. The sub-array component forms 2 or more than 2 independent beams; the subarray component comprises a transmitting-receiving common-caliber antenna layer, a control network layer, a power supply network layer, a multi-beam network layer and a multi-beam component chip layer; the transmitting-receiving common-caliber antenna layer, the control network layer, the power supply network layer, the multi-beam network layer and the multi-beam component chip layer are integrally laminated through a multi-layer Printed Circuit Board (PCB) process or a low temperature co-fired ceramic (LTCC) process. The sub-array component is applied to the phased array antenna, and an expandable tile type framework of the multi-beam transmitting-receiving common-caliber active phased array antenna is realized.
Description
Technical Field
The application relates to the technical field of antenna design, in particular to a sub-array component of a phased array antenna and the phased array antenna.
Background
With the rapid development of the satellite communication field, more complex and wider application scenes, such as the future satellite-wide seamless switching, the aggregate transmission and the like, can be generated in the future. Therefore, more complex technical requirements are placed on phased array antennas that can be used to communicate.
The traditional phased array antenna architecture is mainly divided into a brick type architecture and a tile type architecture. The tile-type phased array antenna framework has the characteristics of low section, easiness in conformal integration with a platform and the like due to the fact that the device circuit layout is parallel to the antenna surface, and has a wide research prospect. At present, a tile type architecture of a transmitting-receiving common-aperture phased array antenna exists, and a tile type architecture of a multi-beam phased array antenna also exists. However, there is no definite technical solution for the expandable tile-type architecture of the multi-beam transceiving common-aperture phased-array antenna.
Disclosure of Invention
The application provides a sub-array component of a phased array antenna and the phased array antenna, and aims to realize an expandable tile type framework of a multi-beam transmitting-receiving common-caliber active phased array antenna.
In a first aspect, the present application provides a sub-array assembly for a phased array antenna, the sub-array assembly forming 2 or more than 2 independent beams. The subarray component comprises a transmitting-receiving common-caliber antenna layer, a control network layer, a power supply network layer, a multi-beam network layer and a multi-beam component chip layer; the transmitting-receiving common-caliber antenna layer, the control network layer, the power supply network layer, the multi-beam network layer and the multi-beam component chip layer are integrally laminated through a multi-layer Printed Circuit Board (PCB) process or a low temperature co-fired ceramic (LTCC) process; the transmitting-receiving common-caliber antenna layer is electrically connected with an array element port of the multi-beam component chip layer; the control network layer is electrically connected with the chip control port of the multi-beam component chip layer; the power network layer is electrically connected with a chip power port of the multi-beam component chip layer; the multi-beam network layer is electrically connected with the chip synthesis port of the multi-beam component chip layer.
In some possible embodiments, the electrical connection between the transmitting and receiving common aperture antenna layer, the control network layer, the power network layer, the multi-beam network layer and the multi-beam component chip layer is realized by means of opening holes on the substrate of the sub-array component.
In some possible embodiments, the transceiving common aperture antenna layer comprises an antenna radiation unit layer, a transmitting unit antenna network layer and a receiving unit antenna network layer;
the antenna radiation unit layer is electrically connected with the transmitting unit antenna network layer; the antenna radiation unit layer is electrically connected with the receiving unit antenna network layer.
In some possible embodiments, the electrical connection among the antenna radiation unit layer, the transmitting unit antenna network layer and the receiving unit antenna network layer is realized by means of opening through holes on the substrate of the subarray component.
In some possible embodiments, the antenna radiation element layer includes a plurality of receiving antenna radiation elements in a microstrip structure and/or a stripline structure; the antenna radiation element layer comprises a plurality of transmitting antenna radiation elements adopting a microstrip structure and/or a strip line structure.
Wherein, the distribution of the receiving antenna radiation unit and the transmitting antenna radiation unit adopts a cross layout, a nested layout or a laminated layout.
In some possible embodiments, the receiving antenna radiation unit receives radio waves using single-polarized radiation and/or dual-polarized radiation; and the transmitting antenna radiation unit adopts single polarization radiation and/or dual polarization radiation to transmit radio waves.
In some possible embodiments, no grating lobes occur within the scanning range of the receiving antenna radiating element and/or the transmitting antenna radiating element.
In some possible embodiments, the spacing of the receiving antenna radiating elements and/or the spacing of the transmitting antenna radiating elements is determined by the following expression:
dx≤(1/sinα)(1/(1+sinθ))
dy≤(1/sinα)(1/(1+sinθ))
wherein dx is the transverse distance of the receiving antenna radiation unit and/or the transmitting antenna radiation unit in a two-dimensional plane; dy is the longitudinal spacing of the receiving antenna radiating elements and/or the transmitting antenna radiating elements in a two-dimensional plane; alpha is the triangular layout angle of the receiving antenna radiation unit and/or the transmitting antenna radiation unit, and theta is the scanning maximum angle range of the receiving antenna radiation unit and/or the transmitting antenna radiation unit.
In some possible embodiments, the control network layer includes a clock network layer for providing a clock signal for chip interface communications of the multi-beam component chip layer.
In some possible embodiments, the multi-beam network layer employs a stacked arrangement, comprising a receive beam network sublayer and a transmit beam network sublayer, wherein,
the number of layers of the receiving beam network sublayer is more than or equal to 1, and the number of layers of the transmitting beam network sublayer is more than or equal to 1; the number sum of the receiving beam network sublayer and the transmitting beam network sublayer is more than or equal to 2, and the upper layer and the lower layer are isolated through a shielding stratum.
In a second aspect, the present application provides a phased array antenna, which adopts a tile-type layered architecture, including: the subarray assembly, the beam control subunit, the main control unit, the combined navigation unit, the power supply module and the heat dissipation cold plate according to the first aspect; wherein, the first and the second end of the pipe are connected with each other,
the sub-array component is used for generating a multi-beam transmitting-receiving common-caliber active phased array;
the wave beam control subunit is used for reading the state of the subarray assembly, calculating and issuing a phase shift value and an attenuation value generated by the subarray assembly;
the main control unit is used for carrying out coordinate system change calculation according to the coordinate position, the attitude angle, the angular speed information and the target track information acquired in advance, calculating to obtain a beam pointing direction value and a beam deviation normal angle in the phased array coordinate system, and sending the calculation result to the beam control subunit;
the integrated navigation unit comprises a navigation receiver and an inertial sensor; a navigation receiver for providing coordinate location information; the inertial sensor is used for providing attitude angle and angular velocity information;
the power supply module is used for supplying power to the phased array antenna;
the heat dissipation cold plate is used for providing heat dissipation for the phased array antenna.
In some possible embodiments, the phased array antenna assembles the sub-array components in a manner that can be used alone or in combination;
wherein the combined use comprises: a plurality of subarray components are used in combination, and the subarray components are used in combination with other subarray components.
Compared with the prior art, the technical scheme provided by the application has the beneficial effects that:
1. the subarray component of the phased array antenna adopts a standardized subarray design, has tile-type extensible splicing capability, and is easy to meet the requirements of different application scenes on different calibers;
2. the subarray component of the phased array antenna realizes high-density integrated integration of a multi-beam complex network and a transmitting-receiving common caliber, reduces the size of an antenna aperture and improves the utilization rate of the antenna aperture;
3. the phased array antenna subarray assembly adopts a multilayer network integrated PCB pressing process, connector assembly interconnection is greatly saved, the production process is greatly simplified, the production cost is greatly reduced, and batch production and popularization and application are facilitated.
In addition, the present application provides a phased array antenna that has the above advantages simultaneously.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the scope of the application.
Drawings
FIG. 1 is a schematic diagram of a sub-array assembly according to an embodiment of the present application;
FIG. 2 is a schematic diagram of a subarray assembly according to an embodiment of the present application;
fig. 3 is a schematic perspective view of a phased array antenna according to an embodiment of the present application;
fig. 4 is a schematic plan view of a phased array antenna according to an embodiment of the present application;
fig. 5 is a schematic diagram of a phased array antenna according to an embodiment of the present application;
fig. 6 is a cross layout diagram of a receiving antenna radiating element and a transmitting antenna radiating element according to an embodiment of the present application;
fig. 7 is a cross-sectional layout diagram of another receiving antenna radiating element and a transmitting antenna radiating element according to an embodiment of the present application;
fig. 8 is a top view of an interleaved layout of receiving antenna radiating elements and transmitting antenna radiating elements according to an embodiment of the present application;
fig. 9 is a top view of a nested layout of receive antenna radiating elements and transmit antenna radiating elements according to an embodiment of the present application;
fig. 10 is a cross-sectional circuit diagram of a receiving antenna radiating element and a transmitting antenna radiating element according to an embodiment of the present application;
fig. 11 is a cross-sectional circuit diagram of another receiving antenna radiating element and a transmitting antenna radiating element according to an embodiment of the present application;
fig. 12 is a circuit layout diagram of a multi-beam network layer in a sub-array component according to an embodiment of the present application.
Detailed Description
In the following description, for purposes of explanation and not limitation, specific details are set forth, such as particular system structures, techniques, etc. in order to provide a thorough understanding of the embodiments of the invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.
In order to explain the technical solution described in the present application, the following description will be given by way of specific examples.
With the rapid development of the satellite communication field, more complex and wider application scenes, such as the future satellite-wide seamless switching, the aggregate transmission and the like, can be generated in the future. Therefore, more complex technical requirements are placed on phased array antennas that can be used to communicate.
The traditional phased array antenna architecture is mainly divided into a brick type architecture and a tile type architecture. The tile-type phased array antenna framework has the characteristics of low section, easiness in conformal integration with a platform and the like due to the fact that the device circuit layout is parallel to the antenna surface, and has a wide research prospect.
At present, there is a patent No. CN109193132A, which discloses a compact low-power consumption Ka band transmitting multi-beam phased array antenna, comprising: the system comprises an antenna array surface, a four-beam T module, a wave control extension set, a channel extension set and a power supply extension set. In the invention, a separated feed synthesis network, a multi-beam transmitting module and an antenna array are still adopted, and an antenna is connected with the transmitting module through a KK connector, so that the structure is a tile-type separated structure which is commonly used at present. But the defects are that the separate structure is not suitable for realizing the high-density interconnection of the receiving and transmitting common caliber, and simultaneously, the process is complex and the batch production cost is higher.
System and method according to one or more examples are provided for an expandable planar phased array antenna sub-array tile assembly, having patent grant No. CN 107046170B. The extendable phased array antenna sub-array assembly is implemented as a Printed Wiring Board (PWB) to which the antenna elements are coupled. The receiving and transmitting array is still separated, and the receiving and transmitting do not share the same aperture, so that the overall aperture size is larger.
There is patent No. CN111786133A, which discloses a transmitting-receiving common-caliber phased-array antenna, comprising a Printed Circuit Board (PCB) multilayer board, wherein the front surface of the PCB multilayer board is an antenna unit, the back surface is a feed network and a soldered multifunctional multi-channel chip, and the rest middle layers are radio-frequency signals, feed and control wires of the chip. The same-aperture transceiver can be realized, but the multi-beam technology is not involved, and the technical difficulty of how the multi-beam and the common-aperture are fused is not solved.
Therefore, no determined technical scheme exists at present how to realize the high-density integrated integration of the multi-beam complex network and the common caliber, and the expandability oriented to the product definition with different calibers is provided.
In order to solve the above problem, a first aspect of the embodiments of the present application provides a sub-array component of a phased array antenna, which can be applied to an antenna, such as a communication antenna, a television antenna, a radar antenna, and the like.
In one embodiment, the sub-array components may include a transceive common aperture antenna layer 300, a control network layer 315, a power network layer 310, a multi-beam network layer 314, and a multi-beam component chip layer 311. The transmitting-receiving common-caliber antenna layer 300, the control network layer 315, the power network layer 310, the multi-beam network layer 314 and the multi-beam component chip layer 311 can be integrally laminated through a plurality of layers of PCBs. The sub-array component adopts a standardized design, not only can realize the multi-beam transmitting and receiving common-caliber active phased array, but also has tile-type expandable splicing capability.
It should be understood that the sequence of the upper and lower layers of the subarray assembly can be adjusted according to actual needs, and the layers can be isolated from each other by the shielding stratum.
For example, fig. 1 is a schematic structural diagram of a subarray assembly in an embodiment of the present application, and an upper and lower stacked arrangement of the subarray assembly may adopt the structure shown in fig. 1.
In some possible embodiments, the sub-array assembly may be integrally laminated by a low temperature co-fired ceramic (LTCC) process.
In some possible embodiments, transceive common aperture antenna layer 300 may be electrically connected to an array element port of multi-beam element chip layer 311, control network layer 315 may be electrically connected to a chip control port of multi-beam element chip layer 311, power network layer 310 may be electrically connected to a chip power port of multi-beam element chip layer 311, and multi-beam network layer 314 may be electrically connected to a chip combining port of multi-beam element chip layer 311.
Illustratively, as shown in fig. 1, the transceiver common aperture antenna layer 300 is connected to the multi-beam component chip layer 311 through the via 317 and the via 321, and further connected to the array element port of the multi-beam component chip layer 311; control network layer 315 communicates with multi-beam assembly chip layer 311 via 319 and via 323, and further communicates with chip control ports of multi-beam assembly chip layer 311; the power network layer 310 is connected to the multi-beam component chip layer 311 through the via 326 and the via 327, and further connected to the chip power port of the multi-beam component chip layer 311; the multi-beam network layer 314 is connected to the multi-beam component chip layer 311 through the via 318 and the via 322, and further connected to the chip combining ports of the multi-beam component chip layer 311.
In some possible embodiments, the multi-beam component chip layer 311 may be composed of a plurality of receive multi-beam chips and a plurality of transmit multi-beam chips.
It should be understood that the receive multi-beam chip and the transmit multi-beam chip may be separate chips or may be a System On Chip (SOC).
In some possible embodiments, the receiving multi-beam chip and the transmitting multi-beam chip may be packaged using a Ball Grid Array (BGA) package, and may be soldered using a low cost soldering process, such as reflow soldering. In addition, the receiving multi-beam chip and the transmitting multi-beam chip can be welded in the same plane of the circuit layer.
Illustratively, as shown in fig. 1, the multi-beam component chip layer 311 includes a receive multi-beam chip 312 and a transmit multi-beam chip 313. Receive multi-beam chip 312 and transmit multi-beam chip 313 are bonded to bond pads 324 of the chip circuit layer using a bonding process.
It should be appreciated that the use of a low cost welding process for the receive 312 and transmit 313 multi-beam chips facilitates low cost and mass production of the sub-array assembly.
In some possible embodiments, the transceive common aperture antenna layer 300 may include an antenna radiation element layer, a transmit element antenna network layer, and a receive element antenna network layer. The antenna radiation unit layer is electrically connected with the transmitting unit antenna network layer; the antenna radiation unit layer is electrically connected with the receiving unit antenna network layer.
Illustratively, as shown in fig. 1, the antenna radiation unit layer and the transmission unit antenna network layer are interconnected through vertical via holes 316, and the antenna radiation unit layer and the reception unit antenna network layer are interconnected through vertical via holes 320.
In some possible embodiments, the antenna radiation element layer may include a plurality of receiving antenna radiation elements in a microstrip structure and/or a stripline structure, and the antenna radiation element layer may include a plurality of transmitting antenna radiation elements in a microstrip structure and/or a stripline structure. Wherein, the distribution of the receiving antenna radiation unit and the transmitting antenna radiation unit adopts a cross layout, a nested layout or a laminated layout.
It should be understood that the receiving antenna radiating element and the transmitting antenna radiating element may include a low frequency antenna radiating element, a high frequency antenna radiating element, and a high and low frequency antenna radiating element.
Fig. 6 is an exemplary cross layout diagram of a receiving antenna radiation unit and a transmitting antenna radiation unit according to an embodiment of the present application. Fig. 7 is a cross layout diagram of another receiving antenna radiation element and transmitting antenna radiation element according to the embodiment of the present application. Fig. 8 is a top view of an interleaved layout of receiving antenna radiating elements and transmitting antenna radiating elements according to an embodiment of the present application. In fig. 6, the high-frequency antenna radiation units 402 are in a 16 × 32 triangular arrangement, and the low-frequency antenna radiation units 401 are in a 16 × 16 rectangular arrangement; in fig. 7, the high-frequency antenna radiation units 402 are arranged in a 16 × 16 rectangular array, and the low-frequency antenna radiation units 401 are arranged in a 16 × 8 triangular array. Fig. 8 includes three antenna radiation units, namely, a high-frequency antenna radiation unit 402, a low-frequency antenna radiation unit 401, and a high-frequency and low-frequency antenna radiation unit 407, where in the array layout, the high-frequency antenna radiation unit 402 is in an 8 × 16 triangular layout, and the low-frequency antenna radiation unit 401 is in a 16 × 16 rectangular layout.
It should be understood that a single low frequency antenna radiating element or a single high and low frequency antenna radiating element may be a receiving antenna radiating element or a transmitting antenna radiating element. That is to say, in the case that the low frequency antenna radiation element, the high frequency antenna radiation element, and the high and low frequency antenna radiation element adopt the cross layout, the nested layout, or the stacked layout, the layout of the receiving antenna radiation element and the transmitting antenna radiation element can also be realized to adopt the cross layout, the nested layout, or the stacked layout.
Illustratively, fig. 9 is a top view of a nested layout of a receiving antenna radiating element and a transmitting antenna radiating element according to an embodiment of the present application. As shown in fig. 9, in the stacked layout, the high frequency antenna radiation element 402 and the low frequency antenna radiation element 401 are distributed on different microwave dielectric plate layers, and the receiving antenna radiation element and the transmitting antenna radiation element are more freely selected in the form of the elements and in the distance between the elements.
In some possible embodiments, the receiving antenna radiation unit and the transmitting radiation unit may or may not be on the same layer of circuit; the feeding mode of the receiving antenna radiation unit and the transmitting radiation unit can adopt direct feeding or coupling feeding.
It should be understood that the feeding modes of the receiving antenna radiation element and the transmitting radiation element can be selected according to the actual bandwidth matching requirement. When necessary, a layer of high-frequency microwave plate can be added on the antenna radiation unit layer to further improve the wide-angle scanning impedance matching performance of the phased array antenna.
Illustratively, fig. 10 is a cross-sectional circuit diagram of a receiving antenna radiating element and a transmitting antenna radiating element according to an embodiment of the present application. Fig. 11 is a circuit cross-sectional view of another receiving antenna radiating element and a transmitting antenna radiating element according to an embodiment of the present application. In fig. 10, the feeding manner of the receiving antenna radiation element 402 and the transmitting antenna radiation element 401 may be implemented by using a direct feeding structure. In fig. 11, the feeding modes of the receiving antenna radiation element 402 and the transmitting antenna radiation element 401 may be implemented by using a coupled feeding structure.
In some possible embodiments, the receiving antenna radiation unit receives radio waves using single-polarized radiation and/or dual-polarized radiation; and the transmitting antenna radiation unit adopts single polarization radiation and/or dual polarization radiation to transmit radio waves.
In some possible embodiments, no grating lobes occur within the scanning range of the receiving antenna radiating element and/or the transmitting antenna radiating element.
In some possible embodiments, the spacing of the receiving antenna radiating elements and/or the spacing of the transmitting antenna radiating elements is determined by the following expression:
dx≤(1/sinα)(1/(1+sinθ))
dy≤(1/sinα)(1/(1+sinθ))
wherein dx is a lateral spacing of the receiving antenna radiating element and/or the transmitting antenna radiating element in a two-dimensional plane; dy is the longitudinal spacing of the receiving antenna radiating element and/or the transmitting antenna radiating element in a two-dimensional plane; α is a triangular layout angle of the receiving antenna radiation unit and/or the transmitting antenna radiation unit, and θ is a maximum scanning angle range of the receiving antenna radiation unit and/or the transmitting antenna radiation unit.
In some possible embodiments, control network layer 315 includes a clock network layer for providing clock signals for chip interface communications of the multi-beam component chip layers.
Illustratively, as shown in fig. 1, clock network layer (denoted as CLK layer) communicates with receive multi-beam chip 312 via 323 and CLK layer communicates with transmit multi-beam chip 313 via 319.
In some possible embodiments, the control network layer 315 further includes a data write network layer, a data read network layer, a data download network layer, and a chip select network layer. The data writing network layer is used for providing data writing for chip interface communication of the multi-beam component chip layer; the data reading network layer is used for providing a data read-back function for chip interface communication of the multi-beam component chip layer; the data downloading network layer is used for providing data downloading control for chip interface communication of the multi-beam component chip layer; the chip select network layer is used for providing chip enabling for chip interface communication of the multi-beam component chip layer. The network layers may be isolated by shielding or not.
Illustratively, as shown in fig. 1, the DATA writing network layer (denoted as LD layer), the DATA reading network layer (denoted as DATA layer), and the DATA downloading network layer (denoted as CS layer) in the control network layer 315 are in communication with the receiving multi-beam chip 312 through the via 323, and the LD layer, the DATA layer, and the CS layer are in communication with the transmitting multi-beam chip 313 through the via 319.
In some possible embodiments, power network layer 310 may provide different kinds of voltage supplies for each multi-beam component chip.
In some possible embodiments, the multi-beam network layer 314 may adopt a stacked arrangement, including a receiving beam network sublayer and a transmitting beam network sublayer, wherein the number of the receiving beam network sublayers is greater than or equal to 1, and the number of the transmitting beam network sublayers is greater than or equal to 1; the number sum of the receiving beam network sublayer and the transmitting beam network sublayer is more than or equal to 3, and the upper layer and the lower layer are isolated through a shielding stratum.
Illustratively, as shown in fig. 1, the sub-layers of the receive beam network include four layers, i.e., a receive beam 1 network, a receive beam 2 network, a receive beam 3 network, and a receive beam 4 network. The four layers of receiving beam network sublayers are all isolated by a shielding ground (marked as GND), and the four layers of receiving beam network sublayers and the shielding ground GND jointly form a receiving synthesis network layer 303. The transmitting beam network sublayer comprises four layers which are respectively a transmitting beam 1 network, a transmitting beam 2 network, a transmitting beam 3 network and a transmitting beam 4 network. The four transmitting beam network sublayers are isolated by a shielding ground (marked as GND), and the four transmitting beam network sublayers and the shielding ground GND jointly form a transmitting synthesis network layer 304.
In some possible embodiments, the multi-beam network layer output port is connected to the main control unit of the phased array antenna through a radio frequency connection or further vertical interconnection.
In some possible embodiments, the receive beam network layer and the transmit beam network layer may also adopt a buried resistance process layout. The circuit layout of the receiving beam network layer and the transmitting beam network layer adopts multi-stage Wilkins bridge cascade connection.
It should be understood that the receiving beam network layer and the transmitting beam network layer adopt a wilkins bridge design, and different bandwidths can be realized through a multi-stage design.
Fig. 12 is a schematic circuit layout diagram of a multi-beam network layer in a subarray component according to an embodiment of the present application. The multi-beam network layer circuit can adopt a wilkins bridge design shown in fig. 12 to realize a power division network. The input port 501 of the multi-beam network layer inputs signals, the signals are divided into multiple paths of smaller power signals through a wilkins bridge, and the power signals are output from the output port 502 of the multi-beam network layer.
In some possible embodiments, the receive multi-beam chip is connected to two or more receive antenna radiating elements, outputting two or more synthesized beam ports; the transmitting multi-beam chip is connected with two or more transmitting antenna radiation units and inputs two or more synthesized beam ports.
The structure of a sub-array module in the embodiment of the present application will be fully described with reference to fig. 1.
In one embodiment, as shown in fig. 1, the sub-array assembly is formed by integrally laminating a plurality of layers of PCBs, wherein dielectric layers and metal layers are alternately arranged, the dielectric layers are electrically insulating layers, and the metal layers are electrically conductive layers. The transceiving common-caliber antenna layer 300, the control network layer 315, the power network layer 310, the multi-beam network layer 314 and the multi-beam component chip layer 311 are sequentially arranged on different metal layers from top to bottom. And different layers are interconnected through vertical via holes. The receive multi-beam chip 312 and the transmit multi-beam chip 313 are soldered to the metal layer of the multi-beam assembly chip layer 311 using a soldering process.
In the embodiment of the application, the subarray component comprises a transmitting-receiving common-aperture antenna layer, a control network layer, a power supply network layer, a multi-beam network layer and a multi-beam component chip layer, and the whole lamination is carried out through a multilayer Printed Circuit Board (PCB) process. Meanwhile, the transmitting-receiving common-caliber antenna layer is electrically connected with an array element port of the multi-beam component chip layer; the control network layer is electrically connected with the chip control port of the multi-beam component chip layer; the power network layer is electrically connected with a chip power port of the multi-beam component chip layer; the multi-beam network layer is electrically connected with the chip synthesis port of the multi-beam component chip layer. Therefore, the subarray component in the embodiment of the application adopts a standardized subarray design, has tile-type extensible splicing capability, and is easy to meet the requirements of different application scenes on different calibers. In addition, the multilayer network integrated PCB laminating process is adopted, so that the interconnection of connectors is greatly saved, the production process is greatly simplified, the production cost is greatly reduced, and the mass production and the popularization and the application are facilitated.
From the above analysis, one possible structural composition of the sub-array module is introduced, and the relevant principles of the sub-array module are described below.
In one embodiment, fig. 2 is a schematic diagram of a sub-array module according to an embodiment of the present disclosure. As shown in fig. 2, a receiving antenna radiation element sub-array 302 and a transmitting antenna radiation element sub-array 301 are formed in the antenna radiation element 303. The multi-beam component chip layer 311 may include a receive multi-beam chip 311 and a transmit multi-beam chip 313. The multi-beam network layer 314 forms a reception combining network 304 and a transmission distribution network 305, wherein the reception combining network 304 is composed of a reception combining network 1, a reception combining network 2, a reception combining network 3, and a reception combining network 4 generated by the reception beam network sublayer; the transmission allocation network 305 is composed of a transmission allocation network 1, a transmission allocation network 2, a transmission allocation network 3, and a transmission allocation network 4 generated by the transmission beam network sublayer. Power network layer 310 (denoted as power layer) is used to supply power to multi-beam component chip layer 311. Control network layer 315 is configured to input a control signal to multi-beam component chip layer 311; the control network layer 315 includes a CLK layer 306, an LD layer 307, a DATA layer 308, and a CS layer 309, and is configured to provide a clock signal for chip interface communication of the multi-beam module chip layer, provide DATA writing for chip interface communication of the multi-beam module chip layer, provide a DATA read-back function for chip interface communication of the multi-beam module chip layer, and provide DATA download control for chip interface communication of the multi-beam module chip layer, respectively.
Specifically, the working process of the subarray component at least comprises the following aspects:
on one hand, the receiving antenna radiation element sub-array 302 in the antenna radiation element sub-array 301 receives the electromagnetic field signal, generates an RF signal and transmits the RF signal to the multi-beam chip 312; the multi-beam chip 312 processes the received RF signal and transmits the processed RF signal to the receive combining network 304; the receive combining network 304 forms 4 receive beams that will be transmitted by the sub-array components to the other components of the phased array antenna.
On the other hand, the transmission beams generated by the phased array antenna are transmitted to the sub-array component, and the transmission distribution network 305 in the sub-array component distributes the transmission beams and converts the transmission beams into RF signals to be transmitted to the multi-beam transmission chip 313; the multi-beam transmitting chip 313 processes the RF signal and transmits the processed RF signal to the transmitting antenna radiating element sub-array 303 in the antenna radiating element sub-array 301; the transmit antenna radiating element sub-array 303 radiates the received processed RF signal out.
In the embodiment of the application, the sub-array component comprises a transmitting-receiving common-aperture antenna layer, a control network layer, a power supply network layer, a multi-beam network layer and a multi-beam component chip layer. The subarray component adopts a standardized design, realizes the high-density integrated integration of a multi-beam complex network and a transmitting-receiving common caliber, and solves the technical problem of the multi-beam and the transmitting-receiving common caliber.
Further, the application also provides a phased array antenna.
In one embodiment, the phased array antenna adopts a tile type layered architecture, and may include: the subarray assembly, the beam control subunit, the main control unit, the combined navigation unit, the power supply module and the heat dissipation cold plate according to the first aspect; the sub-array assembly can be used for generating a multi-beam transmitting-receiving common-caliber active phased array. And the beam control subunit can be used for reading the state of the subarray component, and calculating and issuing a phase shift value and an attenuation value generated by the subarray component. And the main control unit can be used for carrying out coordinate system change calculation according to the coordinate position, the attitude angle, the angular speed information and the target track information acquired in advance, calculating to obtain a beam pointing direction value and a beam deviation normal angle in the phased array coordinate system, and sending the calculation result to the beam control subunit. The combined navigation unit may include a navigation receiver and an inertial sensor. A navigation receiver operable to provide coordinate location information; an inertial sensor may be used to provide the attitude angle and angular velocity information. And the power supply module can be used for supplying power to the phased array antenna. The heat dissipation cold plate can be used for providing heat dissipation for the phased array antenna.
In some possible embodiments, the phased array antenna may be used alone or in combination to assemble the sub-array components; wherein the combined use may comprise: a plurality of subarray components are used in combination, and the subarray components are used in combination with other subarray components.
It should be understood that the sub-array components can be used individually and independently, or can be combined into a larger transmitting-receiving common-caliber multi-beam active phased array through splicing. Meanwhile, in practical engineering application, the number of the receiving antenna radiation units and the number of the transmitting radiation units are not necessarily completely matched, and the sub-array component can be spliced with an independent transmitting multi-beam active phased array antenna sub-array component or an independent receiving multi-beam active phased array antenna sub-array component as required to form a phased array product meeting different receiving and transmitting indexes.
In some possible embodiments, the beam control subunit may be designed as an integrated PCB with the subarray component, or may be interconnected with the subarray component by using a separate PCB structure.
In some possible embodiments, the beam control subunit 102 may be configured to calculate phase shift values and attenuation values of the receiving multi-beam chip 312 and the transmitting multi-beam chip 313 in the corresponding multi-beam component chip layer 311, and issue the phase shift values and the attenuation values to the receiving multi-beam chip 312 and the transmitting multi-beam chip 313 through a Serial Peripheral Interface (SPI) interface, and may also read statuses of the receiving multi-beam chip 312 and the transmitting multi-beam chip 313.
In some possible embodiments, the receiving multi-beam chip and the transmitting multi-beam chip of the subarray assembly are tightly attached to the heat dissipation cold plate, so that good heat conduction is realized.
In some possible embodiments, the phased array antenna may further include an antenna transparent cover and an antenna structure, wherein the antenna transparent cover may be made of a transparent material. Such as a wave-transparent material such as glass fiber reinforced plastic. The antenna structure provides installation fixing and structural support for the whole machine.
Next, a structure of a phased array antenna according to an embodiment of the present invention will be described with reference to fig. 3 and 4.
Fig. 3 is a schematic perspective view of a phased array antenna according to an embodiment of the present application, and fig. 4 is a schematic plan view of the phased array antenna according to the embodiment of the present application.
In an embodiment, as can be seen from fig. 3 and 4, the phased array antenna may include several sub-array components 101, a beam control sub-unit 102, a main control unit 103, a combined navigation unit 106, a power module 107, a heat dissipation cold plate 111, an antenna transparent cover 109, an antenna structure 110, and a circuit substrate 105. The antenna transparent cover 109 and the antenna structure 110 form a housing of the active phased array antenna, and other components are disposed inside the housing. The subarray assembly 101 is tightly attached to the heat dissipation cold plate 111, the circuit substrate 105 is arranged below the heat dissipation cold plate 111, and the beam control subunit 102, the main control unit 103, the combined navigation unit 106 and the power module 107 are welded on the circuit substrate 105 to achieve interconnection and intercommunication of all modules.
In an embodiment of the present application, a phased array antenna includes the sub-array component as described in the first aspect, and an expandable tile architecture of a multi-beam common-aperture active phased array antenna is implemented, which is easy to meet different application scenarios.
From the above analysis, one possible structural composition of the phased array antenna is introduced, and the relevant principles of the phased array antenna are introduced below.
In one embodiment, fig. 5 is a schematic diagram of a phased array antenna according to an embodiment of the present application. As shown in fig. 5, the sub-array element 101 is denoted as a sub-array element of a transmitting/receiving co-aperture multi-beam active phased array antenna in fig. 5 according to the function that it can implement, that is, the sub-array element 101 can implement receiving multi-beams and transmitting multi-beams. Each subarray element 101 is provided with a beam control subunit 102, which are functionally closely related, and the beam control subunit 102 may be configured to read the state of the subarray element and transmit a signal to the main control unit 103. The integrated navigation unit 106 may receive signals according to the navigation receiving antenna and transmit coordinate position information, attitude angle and angular velocity information to the main control unit 103. The main control unit 103 performs coordinate system change calculation according to the coordinate position, the attitude angle, the angular velocity information and the target track information acquired in advance received from the integrated navigation unit 106, calculates a beam pointing direction value and a beam deviation normal angle in the phased array coordinate system, and sends the calculation result to the beam control subunit 102. The beam control subunit 102 returns the signal processed by the main control unit 102 to the subarray component 101, and the subarray component 101 receives the signal sent by the subarray component 101, and performs a series of adjustments on related parameters (such as phase) according to the received signal. The power module 107 is used to power the various elements of the phased array antenna. A heat sink cold plate to provide heat dissipation for each unit of the phased array antenna.
In addition, the phased array antenna may further include a reception radio frequency synthesizing unit 104 and a transmission radio frequency distributing unit 105. The receiving rf synthesizing unit 104 is configured to perform power synthesis on a signal of each beam signal of the subarray component 101, the transmitting rf allocating unit 105 is configured to perform signal power allocation on a transmitting signal, and the allocated signal is transmitted to the subarray component 101.
In an embodiment of the present application, a phased array antenna comprises a sub-array assembly, a beam control sub-unit, a main control unit, a combined navigation unit, a power supply module, a heat sink, etc. as described in the first aspect. The phased array antenna has all the advantages of the sub-array component, and simultaneously realizes an expandable tile type framework of the multi-beam transmitting-receiving common-caliber active phased array antenna.
The above examples are only for illustrating the technical solutions of the present application, and are not limited thereto. Although the present application has been described in detail with reference to the foregoing embodiments, it will be understood by those skilled in the art that the technical solutions described in the foregoing embodiments may be modified or some technical features may be replaced. Such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present application and are intended to be included within the scope of the present application.
Claims (12)
1. A sub-array assembly for a phased array antenna, wherein the sub-array assembly forms 2 or more independent beams;
the subarray component comprises a transmitting-receiving common-caliber antenna layer, a control network layer, a power supply network layer, a multi-beam network layer and a multi-beam component chip layer; the transmitting-receiving common-caliber antenna layer, the control network layer, the power supply network layer, the multi-beam network layer and the multi-beam component chip layer are integrally laminated through a multi-layer Printed Circuit Board (PCB) process or a low temperature co-fired ceramic (LTCC) process;
the transmitting-receiving common-caliber antenna layer is electrically connected with an array element port of the multi-beam component chip layer; the control network layer is electrically connected with the chip control ports of the multi-beam component chip layer; the power network layer is electrically connected with the chip power port of the multi-beam component chip layer; the multi-beam network layer is electrically connected to the chip synthesis ports of the multi-beam component chip layer.
2. The subarray assembly of claim 1, wherein electrical connections between the transceive common aperture antenna layer, the control network layer, the power network layer, the multi-beam network layer, and the multi-beam assembly chip layer are made by vias formed in a substrate of the subarray assembly.
3. The subarray assembly of claim 1, wherein the transmit receive common aperture antenna layer comprises an antenna radiation element layer, a transmit element antenna network layer, and a receive element antenna network layer;
the antenna radiation unit layer is electrically connected with the transmitting unit antenna network layer; the antenna radiation unit layer is electrically connected with the receiving unit antenna network layer.
4. The subarray assembly of claim 3, wherein electrical connections between the antenna radiating element layer, the transmit element antenna network layer, and the receive element antenna network layer are made by vias formed in a substrate of the subarray assembly.
5. The subarray assembly of claim 3, wherein the antenna radiating element layer comprises a plurality of receiving antenna radiating elements in a microstrip and/or stripline structure; the antenna radiation unit layer comprises a plurality of transmitting antenna radiation units adopting a microstrip structure and/or a strip line structure;
wherein, the distribution of the receiving antenna radiation unit and the transmitting antenna radiation unit adopts a cross layout, a nested layout or a laminated layout.
6. The subarray assembly of claim 3, wherein the receive antenna radiating elements receive radio waves using single polarized radiation and/or dual polarized radiation; the transmitting antenna radiation unit adopts single polarization radiation and/or dual polarization radiation to transmit radio waves.
7. The subarray assembly of claim 3, wherein no grating lobes occur within a scanning range of the receive antenna radiating elements and/or the transmit antenna radiating elements.
8. The subarray assembly of claim 7, wherein the spacing of the receive antenna radiating elements and/or the spacing of the transmit antenna radiating elements is determined by the following expression:
dx≤(1/sinα)(1/(1+sinθ))
dy≤(1/sinα)(1/(1+sinθ))
wherein dx is a lateral spacing of the receiving antenna radiating element and/or the transmitting antenna radiating element in a two-dimensional plane; dy is the longitudinal spacing of the receiving antenna radiating element and/or the transmitting antenna radiating element in a two-dimensional plane; α is a triangular layout angle of the receiving antenna radiation unit and/or the transmitting antenna radiation unit, and θ is a maximum scanning angle range of the receiving antenna radiation unit and/or the transmitting antenna radiation unit.
9. The subarray assembly of claim 1, wherein the control network layer comprises a clock network layer for providing clock signals for chip interface communications of the multi-beam assembly chip layer.
10. The subarray assembly of claim 1, wherein the multi-beam network layer is in a stacked arrangement comprising a receive beam network sublayer and a transmit beam network sublayer, wherein,
the number of layers of the receiving beam network sublayer is more than or equal to 1, and the number of layers of the transmitting beam network sublayer is more than or equal to 1; the sum of the number of the receiving beam network sub-layers and the number of the transmitting beam network sub-layers is more than or equal to 2, and the upper layer and the lower layer are isolated through shielding stratums.
11. A phased array antenna, wherein the phased array antenna employs a tiled, layered architecture, comprising: the subarray assembly of claim 1, a beam steering subunit, a master control unit, a combined navigation unit, a power module, a heat sink cold plate; wherein the content of the first and second substances,
the subarray component is used for generating a multi-beam transmitting-receiving common-aperture active phased array;
the wave beam control subunit is used for reading the state of the subarray assembly, calculating and transmitting a phase shift value and an attenuation value generated by the subarray assembly;
the main control unit is used for carrying out coordinate system change calculation according to the coordinate position, the attitude angle and the angular speed information and target track information acquired in advance, calculating a beam pointing direction value and a beam deviation normal angle in a phased array coordinate system, and sending a calculation result to the beam control subunit;
the integrated navigation unit comprises a navigation receiver and an inertial sensor; the navigation receiver is used for providing coordinate position information; the inertial sensor is used for providing the attitude angle and the angular speed information;
the power supply module is used for supplying power to the phased array antenna;
the heat dissipation cold plate is used for providing heat dissipation for the phased array antenna.
12. The phased array antenna of claim 11, wherein the phased array antenna assembles the sub-array assemblies for use alone or in combination;
wherein the combined use comprises: a plurality of the subarray components are used in combination, and the subarray components are used in combination with other subarray components.
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